JP2002283392A - Resin molded product and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To certainly perform the filling with a second component resin when the second component resin is integrally molded after a first component resin is molded. SOLUTION: In manufacturing the resin molded product 3 equipped with a first resin molded part 3a, which is obtained by molding the first component resin 1 containing a conductor and having conductivity, and a second resin molded part 2 which is obtained by molding the second component resin 2 different from the first component resin 1 in the gap 10e between the first resin molded part 3a and a mold 10, the second component resin 2 is cast in the gap in such a state that the first component resin 1 is heated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a resin of a first component having conductivity by mixing components such as an alloy and carbon black, and a resin of a second component comprising a general-purpose thermoplastic / thermosetting resin. And a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a so-called two-color molding method has been known as a molding method for integrally molding different kinds of resins. This two-color molding method is a method shown in FIGS. 11 (a) to 11 (e). In the state shown in FIG. 11 (a), as shown in FIG. 11 (b), a movable core (movable mold) 100a Mold 100 having
The resin 200a of the first component is poured into the
0a is brought into close contact with the first resin 200a in the first state.
Is molded into the resin molded portion 300a. Next, as shown in FIG. 3C, the movable core 100a is displaced, so that the gap 100 is located at the position where the movable core 100a was located.
b is formed. Next, as shown in FIG.
The second resin molded part 300b is formed by pouring the second component resin 200b into the second resin 00b, as shown in FIG.
First resin molded part 300a and second resin molded part 300
This is a method for molding a resin molded product 300 made of b. This resin molded product 300 is shown in FIG.

[0003]

In the above-mentioned conventional molding method, as shown in FIG.
The first component resin 200a
The first resin molded part 300a formed by
As shown in the figure, for example, a large number of strip-shaped flat plate portions 3 facing each other with a very narrow facing space of 0.5 mm or less.
00c, the second component resin 200b
When a narrow space is provided as a part of the gap 100b into which the resin is poured, the resin 200b of the second component
b, the resin 200b of the second component that has flowed in loses heat to the space between the flat portions 300c until it is filled in the space between the flat portions 300c, and is filled in the space between the flat portions 300c. Before the resin is molded, that is, before it is filled to the corners of the gap 100b, the resin molded product shown in FIG. 15 after molding may have a poor filling of the resin 200b as the second component.

In order to solve this problem, countermeasures are taken by adjusting the molding conditions to a higher mold temperature or resin temperature, or adjusting the molding conditions by changing the injection speed, injection pressure, etc. in the case of injection molding. However, the conditions are limited, and if the molding conditions are too severe, the resin 20
There is a possibility that the first resin molded portion 300a formed by molding the resin 0a may be cracked or deformed under the influence of excessive resin pressure or resin temperature. Therefore, it is necessary to design so as not to provide a narrow space, to change the gate position for injecting the second component resin 200b, or to use multiple points for the gate for injecting the second component resin 200b. In some cases, adjusting the molding conditions was not an appropriate solution.

[0005] The present invention has been made in view of the above points, and an object thereof is to form a second component resin integrally with a second component resin after molding the first component resin.
An object of the present invention is to provide a resin molded product capable of reliably filling components and a method for producing the same.

[0006]

According to a first aspect of the present invention, there is provided a method of manufacturing a resin molded product, comprising forming a resin of a first component having a conductivity and containing a conductor. A first resin molded portion, and a second resin molded portion formed by molding a second component resin different from the first component resin and integrated with the first resin molded portion. In the method for producing a resin molded product, the method comprises:
The resin of the second component is poured into the gap between the first resin molded part and the mold while the resin molded part is heated.

[0007] The method for producing a resin molded product according to claim 2 is
In the method for manufacturing a resin molded product according to claim 1, the first resin molded portion is energized to generate heat in the first resin molded portion.

[0008] The method for producing a resin molded product according to claim 3 is characterized in that:
In the method for producing a resin molded product according to any one of claims 1 and 2, the resin of the first component having an electric resistance having a positive temperature characteristic is molded.

The method for producing a resin molded product according to claim 4 is
4. The method of manufacturing a resin molded product according to claim 1, wherein the resin of the first component containing a magnetic material as the conductor is molded in a magnetic field to deflect the magnetic material to the surface. Like that.

[0010] According to a fifth aspect of the present invention, there is provided a resin molded article manufacturing method.
In the method for manufacturing a resin molded product according to any one of claims 1 to 4, a metal film is provided on a surface of the first resin molded part after the first resin molded part is molded.

[0011] A method for producing a resin molded product according to claim 6 is as follows.
In the method for manufacturing a resin molded product according to any one of claims 1 to 5, the first resin molded portion is arranged in a magnetic field so that the first resin molded portion generates heat.

[0012] The method for producing a resin molded product according to claim 7 comprises:
In the method of manufacturing a resin molded product according to any one of claims 1 to 6, the gap is depressurized to flow the resin of the second component into the gap.

[0013] The method for producing a resin molded product according to claim 8 comprises:
The method of manufacturing a resin molded product according to any one of claims 1 to 7, wherein the resin of the first component containing a lead-free alloy as the conductor is molded into a first resin molded portion. I have.

According to a ninth aspect of the present invention, in the resin molded product, a first resin molded portion formed by molding a first component resin having conductivity by containing a conductor is different from the first component resin. A second resin molded part formed by molding a resin of the second component and integrated with the first resin molded part, wherein the second resin molded part is the first resin molded part; The resin of the second component, which is poured into the gap between the first resin molding and the mold, is molded while the resin molding is heated.

According to a tenth aspect of the present invention, there is provided a resin molded product according to the ninth aspect.
In the resin molded product described in the above, the first resin molded part,
The resin of the first component having an electric resistance of a positive temperature characteristic is formed by molding.

The resin molded product according to the eleventh aspect is the ninth aspect.
Alternatively, in the resin molded product according to claim 10, the first resin molded portion is formed by molding a resin of the first component containing a lead-free alloy as the conductor.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for producing a resin molded product (molding method) according to a first embodiment of the present invention will be described below with reference to FIGS. Reference numeral 10 denotes a mold. A lower mold 10c having an upper mold 10a and a cavity (opposing space) 10b interposed therebetween, and a lower mold 10c disposed opposite to the upper mold 10a. It has a movable core (movable mold) 10d housed therein. FIG. 1 shows a method for manufacturing a resin molded product using the mold 10 to manufacture the resin molded product 3.
A detailed description will be given based on (a) to (f).

First, the movable core 10d is displaced from the state shown in FIG. 1A as shown by the arrow in FIG. 2A, and is moved into the cavity 10b as shown in FIG. With the core 10d partially protruding, the cavity 10b
The resin 1 of the first component is poured into the first resin molded portion 3.
a is molded. The resin 1 of the first component will be described later in detail.

Next, the movable core 10d is displaced, and the movable core 10d is moved to the upper mold 10a as shown by an arrow in FIG.
The gap 10e is formed between the movable core 10d and the first resin molded part 3a formed by molding the resin 1 of the first component by displacing the resin core d. Next, as shown by an arrow in FIG. 4D, the second component resin 2 is removed by applying external energy such as high frequency electromagnetic waves to generate heat in the first resin molded portion 3a. The resin 2 of the second component is poured into the gap 10e between the first resin molded portion 3a and the movable core 10d, and while the first resin molded portion 3a is generating heat, as shown in FIG. Is molded into the second resin molded part 3b. The resin 2 of the second component will be described later in detail.

FIG. 2F shows the resin molded product 3 released from the mold 10 after molding. As shown in FIG. 3 (f), the resin molded product 3 has a first resin molded portion 3a formed by molding the first component resin 1 and a second resin molded portion 3a formed by molding the second component resin 2. The resin molded part 3b is integrated.

Next, the resin 1 as the first component will be described. The resin 1 of the first component is obtained by dispersing a conductor and a dispersion auxiliary material in a thermoplastic resin. As the thermoplastic resin, for example, ABS resin, polypropylene resin, polybutylene terephthalate resin, polycarbonate resin, and polyamide resin are used.

The conductor is preferably carbon or a low-melting-point metal. In the case of a low-melting-point metal, the conductor preferably has a melting point of 350 ° C. or less so that the thermoplastic resin can be melted during plasticization. Examples of the simple metal that can be used as the conductor include zinc, tin, bismuth, aluminum, cadmium, indium, and lead. Examples of alloys that can be used as the conductor include Sn—Pb alloy and Sn
—Cu alloy, Sn—Zn alloy and Sn—Ag alloy. However, in consideration of environmental protection, an alloy containing no lead is preferable.

Further, dispersion auxiliary material, the conductive material be one which assists to finely dispersed in a thermoplastic resin, a mixture of metal powders, metal short fibers or metal powder and metal short fibers. Here, as the metal powder, copper, nickel,
Powders of aluminum, chromium and alloys of these can be mentioned, but copper powder is preferred. Specifically, dendritic powder having a total length of about 100 to 300 μm was used as the copper powder.

Next, the resin 2 as the second component will be described. The resin 2 of the second component may be either a thermoplastic resin or a thermosetting resin. As the thermoplastic resin, polypropylene resin, polybutylene terephthalate resin, polycarbonate resin, and polyamide resin are used. Examples of the thermosetting resin include a phenol resin, a melamine resin, an unsaturated polyester resin, an epoxy resin, a polyimide resin, and a polyurethane.

Next, a connector 31 using the resin molded product 3 manufactured by the method for manufacturing a resin molded product will be described with reference to FIG. This resin molded product 3 is disposed so as to protrude from the opening of a housing 31a made of a resin material provided with an opening on one side.
Together with the connector 31.

As shown in FIG. 3, the resin molded product 3
It has a first resin molded part 3a and a second resin molded part 3b. The first resin molded portion 3a is molded of the first component resin 1 and has a conductivity of a volume specific resistivity of 10 ⁻³ (Ω · cm). The first resin molded part 3a is provided with a plurality of strip-shaped flat plate parts 3c having a predetermined interval L1 of, for example, 0.5 mm or less between each other. When the predetermined interval L1 is 0.5 mm or less, the flat portion 3c has a longitudinal dimension L2 sufficiently longer than 0.5 mm, for example, 10 mm or more, and a thickness dimension L3 of 0.5 m or more.
m, for example, 2 mm or more.

As described above, in order to form the resin 1 of the first component and to provide a plurality of strip-shaped flat portions 3c having a predetermined interval therebetween, the movable core 10d has a comb-shaped cross section. The part is provided. Therefore, the movable core 10
The gap 1 between the first resin molded portion 3a formed by molding the resin 1 of the first component and the mold 10 by the displacement of d.
0e will have a very narrow space of 0.5 mm or less. The second resin molded part 3b is molded from the resin 2 of the second component with a comb-shaped section, and is filled between the flat plate parts 3c of the first resin molded part 3a.
The flat portions 3c are insulated from each other.

According to the method of manufacturing a resin molded product, the resin 1 of the first component is molded into the first resin molded portion 3a, and then the resin 2 of the second component is molded so as to be integrated. While the first resin molded part 3a is heated, the second component resin 2 is poured into the gap 10e between the first resin molded part 3a and the mold 10, so that the second component resin 2 is difficult to dissipate heat through the first resin molded portion 3a formed by molding the resin 1 of the first component.
Even if the gap 10e into which the resin is poured has a narrow space, the resin 2 of the second component is filled to every corner of the narrow space, so that the resin 2 of the second component is reliably filled. be able to.

Further, since the second resin 2 is poured into the gap 10e in a state where the first resin molded part 3a is heated, the first resin molded part 3a is made of the second resin. When the second resin molding portion 3a is melted by contact with the second resin molding portion 3, the adhesion at the boundary between the first resin molding portion 3a and the second resin molding portion 3b can be improved.

Next, a method for manufacturing a resin molded product according to a second embodiment of the present invention will be described below with reference to FIG. Note that the same members as those described in describing the method for manufacturing a resin molded product according to the first embodiment are denoted by the same reference numerals, and only the differences from the method for manufacturing a resin molded product according to the first embodiment will be described. In the method for manufacturing a resin molded product according to the first embodiment, external energy such as high frequency electromagnetic waves is applied as the external energy to cause the first resin molded portion 3a to generate heat. In the product manufacturing method, the first resin molded portion 3a is energized to generate heat by energizing the first resin molded portion 3a.

FIG. 4A shows a method of manufacturing this resin molded product.
This will be described in detail based on (d). In FIGS. 3A to 3D, reference numeral 20 denotes a power supply circuit, which is a power supply 20a for supplying power to the first resin molded portion 3a, and a first power supply circuit 20a.
A variable resistor 20b for controlling the amount of current supplied to the resin molding portion 3a, a switch 20c for controlling opening and closing of the current supplied to the first resin molded portion 3a, and a first resistor 20b for supplying electricity to the first resin molded portion 3a. Electrode 20 placed in contact with the resin molding portion 3a
d, a conductor 20e serving as an electric path for supplying electricity to the electrode 20d from the power supply 20a, and an insulator 20f for insulating the conductor 20e and the mold 10 from each other.

First, as shown in FIG.
The first resin molded portion 3a formed by molding the resin 1 of the first component is disposed in advance in the area 0. In the mold 10,
The resin 1 of the first component may be molded into the first resin molded part 3a. From this state, the switch 20c is operated to energize the first resin molded part 3a to cause the first resin molded part 3a to generate heat, as shown in FIG. In this state,
As shown in FIG. 3C, the resin 2 of the second component is poured between the first resin molded portion 3a and the mold 10, and the resin 2 of the second component is poured into the second resin molded portion 3b. Molding. And
After the resin 2 of the second component is formed into the second resin molded part 3b, the switch 20c is operated to stop the power supply to the first resin molded part 3a as shown in FIG. After the cooling time, the resin molded product 3 is released.

According to the method of manufacturing a resin molded product, in addition to the effects of the manufacturing method of the first embodiment, the first resin molded part 3a is energized to generate heat by energizing the first resin molded part 3a. Therefore, the entire energized portion of the first resin molded part 3a can be easily and uniformly heated, and unlike the case where external energy such as high-frequency electromagnetic waves is applied, the external energy is reduced to a mold or the like. Heating the narrow space in the gap 10e between the first resin molded part 3a and the mold 10 via the first resin molded part 3a that has generated heat because it is not absorbed by the molded product. Can be.

Next, a method for manufacturing a resin molded product according to a third embodiment of the present invention will be described below with reference to FIGS.
Note that the same members as those described in describing the method for manufacturing a resin molded product according to the second embodiment are denoted by the same reference numerals, and only the differences from the method for manufacturing a resin molded product according to the second embodiment will be described. The method for manufacturing a resin molded product according to the present embodiment includes:
Basically, it is the same as the method for manufacturing the resin molded product of the second embodiment, but as shown in FIG.
(Positive TemperatureCoef
volume characteristic resistance (electric resistance)
The resin 1 of the first component having the following is molded.
Therefore, as the temperature of the first resin molded part 3a rises, the resistance value of the first resin molded part 3a increases, and the amount of electricity decreases, so that heat generation is controlled.

The conductor containing the resin 1 as the first component for molding the first resin molded portion 3a includes iron, aluminum, copper, silver, carbon and the like. In addition,
It is not limited to these. The thermoplastic resin as a main component of the resin 1 of the first component includes polyethylene resin, polypropylene resin, polystyrene resin, ABS
Resin, methacrylic resin, polyamide resin, polycarbonate resin, polyacetal resin, PET resin, PBT resin, polyphenylene sulfide resin, polyimide resin,
Fluororesin, elastomer resin and the like can be mentioned. In addition,
The invention is not limited to these, and alloys of these resins may be used.

Next, a planar heater 32 using the resin molded product 3 molded by this molding method will be described with reference to FIG. The resin molded product 3 is connected to the first resin molded portion 3a by wiring so as to be able to conduct electricity, and forms a planar heater 32.

According to the method of manufacturing a resin molded product, in addition to the effect of the manufacturing method of the second embodiment, the resin 1 of the first component having the electrical resistance of the positive temperature characteristic is formed. As the heat is generated, the electric resistance value increases and the energizing current decreases, so that the heat generation can be controlled. In addition, by appropriately adjusting the mixing ratio of the resin 1 as the first component, heat generation can be controlled to a more desirable state.

The resin molded article 3 manufactured by the method for manufacturing a resin molded article is formed by molding the resin 1 of the first component having the electrical resistance of the positive temperature characteristic into the first resin molded part 3.
Therefore, for example, when used as a heater that generates heat when energized, as the heat is generated by energization, the electric resistance increases and the energized current decreases, so it is possible to control the heat generation. it can.

Next, a method of manufacturing a resin molded product according to a fourth embodiment of the present invention will be described below with reference to FIG. Note that the same members as those described in describing the method for manufacturing a resin molded product according to the third embodiment are denoted by the same reference numerals, and only differences from the method for manufacturing a resin molded product according to the third embodiment will be described. The method of manufacturing a resin molded product of the present embodiment is basically the same as the method of manufacturing a resin molded product of the third embodiment, except that a first component containing iron powder, which is a magnetic material, is used as a conductor. The resin 1 is molded into a first resin molded part 3a in a magnetic field,
The magnetic material is placed on the surface of the first resin molded part 3a,
The light is deflected to the surface on the 0e side.

The magnetic material is not limited to iron powder, but may be nickel powder, cobalt powder, or an alloy powder of these magnetic metals. In FIG. 7, reference numeral 30 denotes a coil as means for forming a magnetic field. The means for forming the magnetic field is not limited to the coil 30, but may be a permanent magnet.

In such a method for producing a resin molded product,
In addition to the effects of the manufacturing method of the third embodiment, the resin 1 of the first component containing a magnetic material as a conductor is molded in a magnetic field to deflect the magnetic material to the surface. When power is supplied to the section 3a, the first resin molded section 3a
A large amount of current flows along the surface of the device and heat can be generated efficiently.

Next, a method of manufacturing a resin molded product according to a fifth embodiment of the present invention will be described below with reference to FIG. Note that the same members as those described in describing the method for manufacturing a resin molded product according to the third embodiment are denoted by the same reference numerals, and only differences from the method for manufacturing a resin molded product according to the third embodiment will be described. The method of manufacturing the resin molded product of the present embodiment is basically the same as the method of manufacturing the resin molded product of the third embodiment, except that the resin 1 of the first component is molded into the first resin molded portion 3a. After that, a metal film is provided on the surface of the first resin molded portion 3a,
Thereafter, the second component resin 2 is molded into the second resin molded portion 3b.

The manufacturing method of this resin molded product is shown in FIG.
This will be described in detail based on (c). As shown in FIG. 1A, the first resin molded portion 3a is provided with a plurality of strip-shaped flat plate portions 3c having a predetermined interval of, for example, 0.5 mm or less between each other. As shown in FIG. 2B, when the resin film 1 is formed of the component resin 1, a metal film 3d is formed by plating on the surfaces of the plurality of strip-shaped flat plate portions 3c. Note that the metal film 3d may be formed by sputtering evaporation or vacuum evaporation. Thereafter, the power is supplied to the power supply circuit 20 shown in FIG. 3C to cause the first resin molded portion 3a to generate heat, and the second component resin 2 is poured into the first resin molded portion 3a. Of the resin molded portion 3b.

In such a method for producing a resin molded product,
In addition to the effects of the manufacturing method of the third embodiment, the metal film 3d is provided on the surface of the first resin molded part 3a after the molding of the first resin molded part 3a.
When a current is supplied to a, a large amount of current flows along the surface of the first resin molded portion 3a, and heat can be efficiently generated.

Next, a method for manufacturing a resin molded product according to a sixth embodiment of the present invention will be described below with reference to FIG. Note that the same members as those described in describing the method for manufacturing a resin molded product according to the third embodiment are denoted by the same reference numerals, and only differences from the method for manufacturing a resin molded product according to the third embodiment will be described. The method of manufacturing a resin molded product according to the present embodiment is basically the same as the method of manufacturing a resin molded product according to the third embodiment, except that the pressure of the gap 10 e is reduced and the resin 2 of the second component is moved to the gap 1.
0e.

The manufacturing method of this resin molded product is shown in FIG.
This will be described in detail based on (d). 3A to 3D, reference numeral 40 denotes a decompression means, which is a vacuum pump 40a for depressurizing a gap 10e between the first resin molded part 3a and the mold 10, and a gap 10e and a vacuum pump 40a. And a valve 40b for controlling the opening and closing between the two.

The resin 1 of the first component is applied to the first resin molded portion 3a.
After molding into the valve 40, as shown in FIG.
b, the interior of the mold 10, ie, the gap 10e, is depressurized by the vacuum pump 40a, and then the switch 20c is operated to operate the first resin molding portion 3a as shown in FIG. When the first resin molding portion 3a generates heat, the second component resin 2 flows into the gap 10e. Next, as shown in FIG. 4C, after closing the valve 40b, the resin 2 of the second component is molded into the second resin molded portion 3b. Then, the resin 2 of the second component is mixed with the second resin molded portion 3b.
After molding, the switch 20c is operated to stop the power supply to the first resin molded portion 3a as shown in FIG. 4D, and after a predetermined cooling time, the resin molded product 3 is released.

In the method of manufacturing such a resin molded product,
In addition to the effects of the manufacturing method of the third embodiment, the gap 10
Since e is reduced in pressure and the resin 2 of the second component is poured into the gap 10e, the gap 10e can be easily filled with the resin 2 of the second component.

Next, a method for manufacturing a resin molded product according to a seventh embodiment of the present invention will be described below with reference to FIG. In addition,
The same members as those described in describing the method for manufacturing a resin molded product of the first embodiment are denoted by the same reference numerals,
Only different points from the method for manufacturing the resin molded product of the first embodiment will be described. In the method for manufacturing a resin molded product according to the first embodiment, external energy such as high frequency electromagnetic waves is applied as the external energy to cause the first resin molded portion 3a to generate heat. In the method of manufacturing the product,
The first resin molded part 3a is arranged in an alternating magnetic field Φ so that the first resin molded part 3a generates heat.

The manufacturing method of this resin molded product is shown in FIG.
This will be described in detail based on (d). 1A to 1D, reference numeral 50 denotes an inductor which is installed in the mold 10 and generates an alternating magnetic field Φ.

The first resin molded part 3a formed by molding the resin 1 of the first component is, as shown in FIG.
0 is driven in the alternating magnetic field .PHI. Generated by driving, and an eddy current is generated on the surface, thereby generating heat due to current loss or hysteresis loss. In this state, the resin 2 of the second component is poured into the gap 10e. next,
As shown in FIG. 3C, the resin 2 of the second component is molded into a second resin molded part 3b. Then, after the resin 2 of the second component is molded into the second resin molded portion 3b, the drive of the inductor 50 is stopped, as shown in FIG. Release the mold.

In the method for producing such a resin molded product,
In addition to the effects of the manufacturing method of the first embodiment, the first resin molded part 3a is arranged in the alternating magnetic field Φ to generate heat in the first resin molded part 3a.
a can be easily heated.

Also, by appropriately adjusting the location where the inductor 50 is installed, the location where the alternating magnetic field Φ is generated, or the frequency of the alternating magnetic field Φ is appropriately set, so that the first resin molding is performed. Part of the portion 3a can be selectively heated, and the heat can be generated very efficiently. For example, when the first resin molded part 3a is molded with the resin 1 of the first component so as to provide a plurality of strip-shaped flat parts 3c having a predetermined interval between each other, the flat part 3c is formed. To heat the first resin molded part 3
The flat plate portion 3c of FIG.

The method of manufacturing a resin molded product according to the sixth embodiment is the same as the method of manufacturing a resin molded product described above, in which the first resin molded portion 3a is energized by generating heat when the first resin molded portion 3a is heated. The gap 10e between the resin molding portion 3a and the mold 10 is reduced in pressure so that the resin 2 of the second component flows into the gap 10e. As in the method for manufacturing a resin molded product in which the first resin molded portion 3a generates heat by applying external energy such as high frequency electromagnetic waves as energy, or the method for manufacturing a resin molded product in the seventh embodiment, The present invention can be applied to a method of manufacturing a resin molded product in which the molded portion 3a is arranged in a magnetic field and the first resin molded portion 3a generates heat.
Can be easily filled with the resin 2 as the second component.

[0055]

According to the method for manufacturing a resin molded product according to the first aspect, after the resin 1 of the first component is molded into the first resin molded portion, the resin of the second component is molded so as to be integrated. In this case, the resin of the second component is poured into the gap between the first resin molded portion and the mold while the first resin molded portion is heated, so that the resin of the second component is It is difficult to dissipate heat through the first resin molded portion formed by molding the first component resin, and even if the gap into which the second component resin is poured has a narrow space, the narrow space To every corner of the second
Since the resin of the component is filled, the resin of the second component can be reliably filled.

According to the method for manufacturing a resin molded product according to the second aspect, in addition to the effect of the method for manufacturing a resin molded product according to the first aspect, the first resin molded portion is energized to perform the first resin molding. Since the portion generates heat, the first resin molded portion can easily generate heat.

According to the method for producing a resin molded product according to the third aspect, in addition to the effect of the method for producing a resin molded product according to the third aspect, the resin of the first component having an electrical resistance of a positive temperature characteristic is used. Since molding is performed, as heat is generated by energization, the electric resistance value increases and the energizing current decreases, so that heat generation can be controlled.

According to the method for manufacturing a resin molded product according to the fourth aspect, in addition to the effect of the method for manufacturing a resin molded product according to the third aspect, the resin of the first component containing a magnetic material as a conductor is subjected to a magnetic field. Since the magnetic material is deflected to the surface by being molded in the middle, a large amount of current flows along the surface of the first resin molded portion when the first resin molded portion is energized, thereby efficiently generating heat. be able to.

According to the method of manufacturing a resin molded product according to the fifth aspect, the metal film is provided on the surface of the first resin molded portion after the first resin molded portion is molded. When power is supplied to the first resin molded portion, a large amount of current flows along the surface of the first resin molded portion, and heat can be efficiently generated.

According to the method for manufacturing a resin molded product according to the sixth aspect, in addition to the effect of the method for manufacturing a resin molded product according to the first aspect, the first resin molded portion is arranged in a magnetic field to provide the first resin molded portion. Since the first resin molded portion generates heat, the first resin molded portion can easily generate heat.

According to the method of manufacturing a resin molded product according to the seventh aspect, in addition to the effect of the method of manufacturing a resin molded product according to any one of the first to sixth aspects, the gap is reduced to reduce the second pressure. Since the resin of the component is poured into the gap, it is easy to fill the gap with the resin of the second component.

According to the method of manufacturing a resin molded product according to claim 8, in addition to the effect of the method of manufacturing a resin molded product according to any one of claims 1 to 7, a lead-free alloy is used as a conductor. Since the contained first component resin is molded into the first resin molded portion, the environment becomes favorable.

According to a ninth aspect of the present invention, in the resin molded product, the second component resin poured into the gap between the first resin molded portion and the mold while the first resin molded portion generates heat is used. Since the resin of the second component is molded into the second resin molded portion, the resin of the second component hardly dissipates heat through the first resin molded portion formed by molding the resin of the first component, and the resin of the second component is poured. Even if the gap has a narrow space, the resin of the second component is filled into every corner of the narrow space, so that the resin of the second component can be reliably filled.

The resin molded product according to the tenth aspect is the ninth aspect.
In addition to the effects of the resin molded product described above, the first component resin having the electrical resistance of the positive temperature characteristic is molded to form the first resin molded portion. When used as a heater, as heat is generated by energization, the electric resistance value increases and the energizing current decreases, so that heat generation can be controlled.

The resin molded product according to the eleventh aspect is the ninth aspect.
Alternatively, in addition to the effect of the resin molded product according to claim 10, the first resin molded part is formed by molding a first component resin containing a lead-free alloy as a conductor, so that it is environmentally friendly. It becomes good for it.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is a perspective view of a connector using a resin molded product molded as described above.

FIG. 3 is a partial perspective view of a resin molded product molded as described above.

FIG. 4 is a sectional view showing a second embodiment of the present invention.

FIG. 5 is a sectional view showing a third embodiment of the present invention.

FIG. 6 is a perspective view of a heater using a resin molded product molded as described above.

FIG. 7 is an explanatory diagram showing characteristics of electric resistance of a resin of a first component used in a fourth embodiment of the present invention.

FIG. 8 is a sectional view showing a fifth embodiment of the present invention.

FIG. 9 is a sectional view showing a sixth embodiment of the present invention.

FIG. 10 is a sectional view showing a seventh embodiment of the present invention.

FIG. 11 is a cross-sectional view showing a conventional manufacturing method.

FIG. 12 is a perspective view of a resin molded product formed by the above-described manufacturing method.

FIG. 13 is a cross-sectional view illustrating a conventional manufacturing method using a movable core having a comb-shaped section.

FIG. 14 is a perspective view of a first resin molded portion manufactured by the above manufacturing method.

FIG. 15 is a perspective view of a resin molded product manufactured by the above manufacturing method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 first component resin 2 second component resin 3 resin molded product 3a first resin molded portion 3b second resin molded portion 3d metal film 10 mold 10e gap Φ alternating magnetic field

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Takahiro Harada 1048 Kazuma Kadoma, Kadoma-shi, Osaka F-term in Matsushita Electric Works, Ltd. (reference) 4F202 AB13 AG03 AR06 AR16 CA11 CB01 CB28 CK52 CN01 CN17 CN25 CP06 4F206 AB13 AG03 AR06 AR16 JA07 JB28 JF02 JL02 JM04 JQ81

Claims (11)

[Claims] 1. A first resin molded portion formed by molding a first component resin having conductivity by containing an electric conductor, and a second component resin different from the first component resin is molded. A method of manufacturing a resin molded product including a first resin molded portion and a second resin molded portion integrated with the first resin molded portion, wherein the first resin molded portion is heated. A method of manufacturing a resin molded product, wherein the resin of the second component is poured into a gap between the first resin molded part and a mold. 2. The method for manufacturing a resin molded product according to claim 1, wherein the first resin molded portion is energized to generate heat by energizing the first resin molded portion. 3. The first device having an electric resistance having a positive temperature characteristic.
The method for producing a resin molded product according to claim 2, wherein the resin as a component is molded. 4. The method according to claim 2, wherein the resin of the first component containing a magnetic material as the conductor is molded in a magnetic field to deflect the magnetic material to the surface. 5. The method according to claim 2, wherein a metal film is provided on a surface of the first resin molded part after the first resin molded part is molded. 6. The method for manufacturing a resin molded product according to claim 1, wherein the first resin molded portion is arranged in a magnetic field to generate heat in the first resin molded portion. 7. The method for producing a resin molded product according to claim 1, wherein the gap is depressurized to flow the resin of the second component into the gap. 8. The method for manufacturing a resin molded product according to claim 1, wherein the resin of the first component containing a lead-free alloy as the conductor is molded into a first resin molded part. . 9. A first resin molded portion formed by molding a first component resin having conductivity by containing a conductor, and a second component resin different from the first component resin is molded. And a second resin molded part integrated with the first resin molded part, wherein the second resin molded part is in a state where the first resin molded part generates heat. A resin molded product obtained by molding the resin of the second component poured into a gap between the first resin molded portion and a mold. 10. The resin molded product according to claim 9, wherein the first resin molded part is formed by molding the resin of the first component having an electric resistance having a positive temperature characteristic. 11. The resin molding according to claim 9, wherein the first resin molded part is formed by molding a resin of the first component containing a lead-free alloy as the conductor. Goods.