JP2002270126A - Electron beam device, data processing device for electron beam device, and method of producing stereo scopic data of electron beam device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electron beam device capable of appropriately processing stereo scopic detection data obtained from an electron microscope, three-dimensionally observing an image of a sample correctly and highly precisely, and measuring the three dimensional shape of the sample based on the observation. SOLUTION: The electron beam device comprises an electron beam source 1 for radiating an electron beam 7, an electronic optical system 2 for applying the electron beam 7 to a sample 9, a sample holder 3 for holding the sample 9, a sample inclining part for relatively inclining the sample holder 3 and the irradiated electron beam 7, an electron beam detecting part 4 for detecting the electron beam 7, coming out of the sample 9, and a data modifying part 31 for modifying the stereoscopic detection data at the time when the sample holder 3 and the irradiated electron beam 7 are relatively inclined to be in a prescribed relation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electron beam apparatus, a data processing apparatus for an electron beam apparatus, an electron beam apparatus, and the like, which convert an image obtained by an electron microscope into an image which can be stereo-observed, and determine the shape of a sample. It relates to a method for creating stereo data.

[0002]

2. Description of the Related Art In the case of a transmission electron microscope (TEM), a sample is tilted, transmission images at different tilt angles are obtained, and stereo observation is performed using these images as left and right images. In the case of a scanning electron microscope (SEM), a sample is tilted or an electron beam is tilted to obtain reflected images at different tilt angles, and stereo observation is performed using these as left and right images. (Medical and biological electron microscopy)
278-299, see 1982). As in the case of stereoscopic observation with the naked eye, a sufficient image is obtained for the purpose of observing the general uneven shape of the sample.

[0003]

On the other hand, when the right and left images are obtained from images at different inclination angles and stereo observation is performed to measure the accurate three-dimensional shape of the sample, the electron lens system of the electron microscope is required. Influence of aberration, sample tilt angle,
Alternatively, it is necessary to control the tilt angle of the electron beam at a very accurate angle of about several seconds. However, there is a problem that the conventional tilt angle is only controlled in a general manner of about several degrees or several minutes, and it is insufficient to accurately measure a three-dimensional shape from a stereoscopic view of the left and right images. Was.

The present invention has been made to solve the above-mentioned problems, and appropriately processes stereo detection data obtained from an electron microscope so that a sample image can be three-dimensionally observed with high accuracy and accuracy. An object of the present invention is to provide an electron beam device, a data processing device for the electron beam device, and a method for creating stereo data of the electron beam device, which can perform original shape measurement.

[0005]

According to the present invention, an electron beam source for emitting an electron beam 7 is provided as shown in FIGS. 3, 15 and 16. An electron optical system 2 for irradiating the sample 9 with the sample 7, a sample holder 3 for holding the sample 9, a sample inclined portion for relatively tilting the sample holder 3 and the irradiation electron beam 7, and electrons emitted from the sample 9 An electron beam detection unit 4 for detecting the line 7d, and a data correction unit 31 for correcting the stereo detection data when the sample holder 3 and the irradiation electron beam 7 are relatively inclined, in a predetermined relationship.
And

Here, the sample tilting section may be constituted by using a holder tilt control section 5b for controlling the tilt angle of the sample holder 3 and tilting the sample 9 with respect to the irradiation electron beam 7. Alternatively, the sample tilting unit may be configured using a beam tilt control unit 5a that controls the electron optical system 2 so as to irradiate the sample 9 with the irradiation electron beam 7 at a tilt.
Further, it is preferable that the electron beam detector 4 be configured to detect secondary electrons emitted from the sample 9 as a scanning electron microscope.

In addition, the stereo detection data means that, when the sample holder 3 and the irradiation electron beam 7 make the first and second relative inclination angles, the electron beam detector 4 detects the first and second positions of the sample 9. 2 means detecting the detection data. When the sample holder 3 and the irradiation electron beam 7 form the first and second relative tilt angles, as shown in FIG. 3, when the beam tilt control unit 5a is used, the first relative tilt angle is not satisfied. The irradiation electron beam 7R becomes the irradiation electron beam 7L at the second relative inclination angle. In addition, as shown in FIGS. 15 and 16, when the holder tilt control unit 5b is used, the tilt angle R of the sample holder 3 becomes the first relative tilt angle, and the second relative tilt angle becomes the second relative tilt angle.
Is the inclination angle L of the sample holder 3.

"Correcting data to a predetermined relationship" by the data correcting unit 31 means that two images are oriented as stereo detected data so as to be in a state where deviation can be corrected. The deviation correction refers to correcting the distortion of the image data that is detected while being tilted, and making the scale constant. The orientation of the image means that two pieces of image data are back-projected in the same projection state as when the sample 9 is irradiated with the irradiation electron beam 7 so as to be able to be viewed stereoscopically, and in accordance with the data processing method of aerial triangulation. And a state in which the three-dimensional shape of the sample 9 can be measured and a three-dimensional image can be formed.

Preferably, the electron beam apparatus according to the present invention further comprises a shape measuring unit 32 for measuring the shape of the sample 9 based on the correction data corrected by the data correction unit 31, or a correction data corrected by the data correction unit 31. Based on
It is preferable to include at least one of the three-dimensional image observation unit 33 that forms a three-dimensional image of the sample 9.

[0010] Preferably, the sample 9 has a reference mark as a reference position, and the data correcting section 31 corrects the stereo detection data into deviation correction data using the reference mark. It is possible to easily correct the stereo detection data to the deviation correction data by using the reference mark provided in the reference numeral 9. The reference mark is formed by irradiating the sample 9 with the electron beam 7 or using a feature point such as a pattern already existing on the sample 9.

Preferably, the data correction unit 31 uses a reference mark of a reference template to obtain a deviation correction parameter at a relative inclination angle between the sample holder 3 and the irradiation electron beam 7. And the image data deviation correcting means 31b for correcting the stereo detection data of the sample 9 to the deviation correction data using the acquired deviation correction parameters, the deviation correction can be easily performed using the reference template. Can be done. The image data deviation correcting unit 31b corrects the stereo detection data of the sample 9 to the deviation correction data using the deviation correction parameter acquired by the deviation correction parameter acquiring unit 31a, and thus creates a reference mark on the sample 9. Measurement efficiency is increased. The deviation correction parameter acquired by the deviation correction parameter acquisition unit 31a is a relative value between the sample holder 3 and the irradiation electron beam 7 where the stereoscopic detection data of the sample 9 whose deviation is corrected by the image data deviation correction unit 31b is detected. Obtaining at a tilt angle is desirable for calibration.

As shown in FIGS. 3, 15 and 16, a data processing apparatus for an electron beam apparatus according to the present invention which achieves the above object is a data processing apparatus 2 connected to an electron beam apparatus 10.
0, which is provided with a data correction unit 31 which receives stereo detection data when the sample holder 3 and the irradiation electron beam 7 are relatively inclined and corrects the data in a predetermined relationship. Here, the electron beam device 10 includes an electron beam source 1 that emits an electron beam 7 and an electron optical system 2 that irradiates the sample 9 with the electron beam 7.
A sample holder 3 for holding the sample 9, a sample tilting section for relatively tilting the sample holder 3 and the irradiation electron beam 7, and an electron beam detecting section 4 for detecting an electron beam 7 d emitted from the sample 9. Having.

Preferably, the data processing apparatus for an electron beam apparatus according to the present invention further comprises a shape measuring section 32 for measuring the shape of the sample 9 based on the correction data corrected by the data correcting section 31, or a correction by the data correcting section 31. A configuration including at least one of the three-dimensional image observation unit 33 that forms a three-dimensional image of the sample 9 based on the corrected data thus obtained may be provided.

According to the method for creating stereo data of the electron beam apparatus of the present invention for achieving the above object, as shown in FIG. 11, a reference mark serving as a reference position is created on a sample 9 (S
311, S314), in a state where the sample holder 3 and the irradiation electron beam 7 form a first relative inclination angle, first detection data is detected by the electron beam detector 4 (S316), and the sample holder 3 and the irradiation are irradiated. In a state where the electron beam 7 forms the second relative inclination angle, the electron beam detection unit 4 detects the second detection data (S316), and uses the reference mark to perform the first detection data.
And the second detection data is corrected to the deviation correction data (S
322, S326).

The method for creating stereo data of the electron beam apparatus according to the present invention, which achieves the above object, uses a sample 9 as shown in FIG.
Instead, the reference template 40 in which the reference mark serving as the reference position is created is inserted into the sample holder 3 (S20).
4) In the state where the sample holder 3 and the irradiation electron beam 7 form the first and second relative inclination angles, the electron beam detection unit 4 detects the first and second detection data for the reference template 40 ( S206), using the fiducial mark, obtain a deviation correction parameter at a relative inclination angle between the sample holder 3 and the irradiation electron beam 7 (S208, S210).

Subsequently, as shown in FIG. 10, the sample 9 is inserted into the sample holder 3 (S252), and the sample holder 3 and the irradiation electron beam 7 are in the state of the first and second relative inclination angles. The electron beam detector 4 detects the first and second detection data of the sample 9 (S254), and deviates the first and second detection data of the sample 9 using the acquired deviation correction parameter. Correction to correction data (S258, S2
60).

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [Principle of Three-Dimensional Shape Measurement Using Stereo Images] First, before describing the electron beam apparatus of the present invention, an image with different inclination angles is corrected to a stereoscopically viewable image. Then, the measurement principle of performing three-dimensional measurement at the same time as performing three-dimensional observation will be described. FIG. 1 is an explanatory diagram of a stereo image taken at a predetermined inclination angle with respect to a subject in which three linear patterns having the same length exist at equal intervals. FIG. 1A shows 0 degrees (parallel), FIG. 1B shows a case where the inclination is 10 degrees. In the case of parallel, as shown in FIG. 1 (A), when a straight line pattern of the same length 1 is shown at equal intervals d,
In the image inclined at 10 degrees, as shown in FIG. 1B, at different intervals d ₁₂ , d ₂₃ , different lengths l ₁ , l ₂ ,
a l _3.

When trying to view the images of FIGS. 1A and 1B stereoscopically with a stereometer (parallax measuring canister), not only stereoscopic vision is not possible, but also the accuracy of the relative height based on the parallax measurement is accurate. There is a problem that measurement cannot be performed. Further, there is a problem that even if an attempt is made to perform stereo matching by image correlation processing for three-dimensional measurement, the inclination angles of the left and right images are different, which does not work.

FIG. 2 is an explanatory diagram of a stereo image obtained by correcting the tilt images of FIGS. 1A and 1B into a deviation corrected image.
(A) and (B) show the case where the deflection is corrected to be parallel. As a result of the displacement correction, the tilted images of FIGS. 1A and 1B taken in an inclined manner are parallel to the object, have the same scale, and eliminate the vertical parallax.
(A) and (B) enable stereoscopic viewing.
For a stereoscopically viewable stereo image, accurate three-dimensional coordinates can be obtained by obtaining corresponding points of the left and right images on the same epipolar line. In order to create a deviation corrected image, at least three or more known reference point coordinates on two images are required on the image.

From these reference points, it is possible to calculate the inclination, the position (these are called external orientation elements) of the two images, and the like. If these external orientation elements are known from the beginning, deviation correction processing can be performed. In the present invention, a reference template having a reference mark serving as a reference point is created in advance to create a deviation corrected image, or a reference mark serving as a reference point is created on a sample while capturing an electron beam on the sample surface. , An external orientation element is obtained by correcting the data by an image deviation correcting process. The stereo image after the deviation correction processing is in a state where stereoscopic viewing is possible and three-dimensional measurement is possible at the same time.

[First Embodiment] An embodiment of the present invention will be described below with reference to the drawings. FIG. 3 is a block diagram illustrating the configuration of the first embodiment of the present invention, in which a stereoscopic image is obtained by deflecting an electron beam of a scanning microscope. In the figure, an electron beam device 10 as a scanning microscope is shown.
Represents an electron beam source 1 that emits an electron beam 7,
An electron optical system 2 for irradiating the sample, a sample holder 3 for holding the sample 9 in a tiltable manner, a magnification changing unit 6 for changing the magnification of the electron optical system 2, a scanning power supply 6a for supplying power to the magnification changing unit 6, and an electron beam 7. A detector 4 for detection, a beam tilt controller 5 a as a tilt controller 5 for tilt control of the electron beam 7, a secondary electron conversion for attenuating the energy of secondary electrons emitted from the sample 9 and reflecting the energy to the detector 4 A target 8 is provided. The holder tilt controller 5b as the tilt controller 5 that controls the tilt of the sample holder 3 is not used in the first embodiment, but is used in a second embodiment described later.

The electron optical system 2 controls a condenser lens 2a for changing an electron flow density, an opening angle, an irradiation area, and the like of the electron beam 7 emitted from the electron beam source 1, and controls an incident angle of the electron beam 7 on a sample surface. Deflection lens 2b, scanning lens 2 for deflecting electron beam 7 narrowed down and scanning two-dimensionally on the sample surface
c, an objective lens 2d for focusing the incident probe on the sample surface together with the function of the final stage reduction lens. In accordance with a magnification change command from the magnification changing unit 6, an area on the sample surface where the electron beam 7 is scanned by the scanning lens 2c is determined. The beam tilt controller 5a sends a tilt control signal to the deflecting lens 2b, and the sample holder 3 and the irradiation electron beam 7 form an electron beam 7R forming a first relative tilt angle and an electron beam forming a second relative tilt angle. Switching is performed with the line 7L. The relative tilt angle of the sample holder 3 and the irradiation electron beam 7 by the beam tilt control unit 5a is not limited to two, and may be set in multiple stages, but a minimum of two is required to obtain stereo detection data. is there.

The sample 9 is a semiconductor chip such as a silicon semiconductor or a gallium arsenide semiconductor, but may be an electronic component such as a power transistor, a diode or a thyristor, or a liquid crystal panel or an organic EL panel. A display device component using glass may be used. Under typical scanning microscope observation conditions, the electron beam source 1 is applied at -3 kV, and the sample 9 is applied at -2.4 kV. The secondary electrons emitted from the sample 9 collide with the secondary electron conversion target 8, are weakened in energy, and detected by the detector 4. When the sample 9 is set to a Mars potential, the secondary electrons behave like mist and have weak energy, and can be directly detected by the detector 4, and the secondary electron conversion target 8 is unnecessary.

The data processing device 20 includes an image creation processing unit 2
1, display device 22, reference mark pattern generator 23, measurement condition determination unit 25, data correction unit 31, shape measurement unit 3
2, stereoscopic image observation unit 33 and stereo image storage unit 3
Four. The image creation processing unit 21 includes the scanning lens 2
When the electron beam 7 scans an area on the sample surface by c, an image on the sample surface is created using the secondary electron beam detected by the detector 4. The display device 22 displays the image created by the image creation processing unit 21 so that the operator can observe the image. For example, a CRT or a liquid crystal panel is used. The display device 22 may be a normal one-screen monitor, a monitor capable of stereo display, or both.

The reference mark pattern generator 23 controls the electron beam 7 to create a reference mark on the sample 9. Preferably, the reference mark pattern generator 23 extracts feature points from the pattern shape, the etching pattern, and the like from the surface of the sample 9 in advance, and positions and the number of reference marks to be created when the existing feature points are insufficient. It is also good to have a function to determine Even when a reference mark is created in the reference template, the reference mark pattern generator 23 may store the number and location of reference marks created.

The measurement condition determination section 25 determines measurement conditions using information on the type of the electron beam apparatus 10 and the magnification of the electron optical system 2. Examples of the type of the electron beam device 10 include a transmission electron microscope and a scanning electron microscope. As the magnification of the electron optical system 2, there is a distinction between a low magnification and a high magnification.
For example, as a calculation mode for correcting the detection data at a plurality of inclination angles in the data correction unit 31, the correction mode is used as an element for selecting either central projection or parallel projection.

The data correction section 31 is composed of the image creation processing section 21
The image created in step 3 is corrected to a deflection corrected image to be a stereoscopically viewable stereo image. When the corrected image is corrected in real time to a deflection corrected image, measurement conditions for the electron microscope 10 directly from the image creation processing unit 21 are used. Have received. The measurement conditions in the electron microscope 10 are temporarily stored in the stereo image storage unit 3.
4 stores an image in the measurement condition determination unit 25.
Or the measurement conditions of the electron microscope 10 stored together with the image in the stereo image storage unit 34. The shape measuring unit 32 measures the three-dimensional shape of the sample 9 based on the stereo image corrected by the data correcting unit 31. The stereoscopic image observation unit 33 forms a stereoscopic image of the sample 9 based on the stereo image corrected by the data correction unit 31. The stereo image storage unit 34 stores the image created by the image creation processing unit 21 and also stores the stereo image modified by the data modification unit 31. For example, a magnetic hard disk, a CR-ROM, a floppy (registered trademark) Image data is stored in an information storage medium such as a disk or a magneto-optical disk. In the case where the stereo image storage unit 34 stores the image that has not been subjected to the deviation correction created by the image creation processing unit 21, the electron microscope 1
It is better to store the measurement condition at 0.

The data correction unit 31 corrects data directly using the sample 9 having a reference mark as a reference position, and corrects data of the sample 9 using a reference template having a reference mark. We are dealing. When the sample 9 has a reference mark serving as a reference position, the data correction unit 31 corrects the stereo detection data into deviation correction data using the reference mark.

In preparation for data correction of the sample 9 using a reference template having a reference mark, the data correction unit 31 has a deviation correction parameter acquisition unit 31a and an image data deviation correction unit 31b. . The deviation correction parameter acquiring unit 31a uses the reference mark of the reference template to obtain the stereo detection data of the sample holder 3.
A deviation correction parameter at a relative inclination angle between the beam and the irradiation electron beam 7 is acquired. Here, the stereo detection data means that the electron beam detector 4 detects the first and second positions of the sample 9 in the state where the sample holder 3 and the irradiation electron beam 7 form the first and second relative inclination angles. It refers to detecting detection data. The image data deviation correcting unit 31b corrects the stereo detection data of the sample 9 into deviation correction data using the acquired deviation correction parameters.

FIGS. 4A and 4B are explanatory views of fiducial marks formed on a sample or a fiducial template substrate. FIG. 4A is a plan view having fiducial marks at four corners, FIG. () Is a sectional view of a reference template for correcting lens distortion. In the case of the sample 9, if the reference marks 9 a are formed at the four corners, it is easy to perform the displacement correction by the data correction unit 31. It is easy to use the reference mark 9a if three or more reference marks 9a are formed in a wide range of the sample 9. The reference mark 9a is a reference point whose three-dimensional position is known. Even in the case of the reference template 40, reference marks may be formed at four corners. The reference template 40 has a flat surface serving as a reference surface for forming a stereo image. Preferably, the reference template 40 has the same composition as the material constituting the sample 9 and has no unevenness. The reference template substrate 40b is a substrate on which a reference mark is created and used as the reference template 40.

In the case of the reference template 40, since the reference mark 40a can be formed at an arbitrary position on the reference template substrate 40b, the reference marks are formed, for example, in a lattice shape. When the reference marks are provided in a lattice shape, they can be used for correcting lens distortion of an electron beam in addition to external orientation elements. When correcting the lens distortion of the electron beam, it is necessary to photograph from a plurality of directions in the case of a flat reference template. If a step is formed on the reference template as shown in FIG. 4 (C) and a reference mark is provided in a grid shape on the edge in the direction of the step, since the reference mark contains a height component, the lens distortion of the electron beam can be accurately corrected. Can be corrected. Note that lens distortion includes spherical aberration, coma, curvature, astigmatism, distortion, and the like, which are Seidel aberrations, and chromatic aberration includes axial aberration, lateral chromatic aberration, and rotational chromatic aberration.

[Method of Creating Reference Marks on Sample or Reference Template Substrate] Next, a method of creating reference marks on the sample or reference template substrate will be described. In the case of the sample 9 or the reference template substrate 40b, the reference mark pattern generator 23 is used to position and irradiate the electron beam 7, thereby forming contamination, defects, and the like on the surface of the sample 9 as reference marks. be able to. By using the electron beam 7, the reference mark can be formed with very precise positioning accuracy on the sample 9 or the reference template substrate 40b.
Formed.

Contamination is a phenomenon in which hydrocarbon molecules on a sample are burned by electron beam irradiation, and the size depends on the probe diameter of the electron beam. The larger the electron beam density and irradiation time, the smaller the amount of contamination. It grows and grows in a conical shape with almost a foot. Thus, when the probe is scanned slowly, the contamination will follow the shape of the scan. In order to make the contamination have an arbitrary shape or an arbitrary distribution, the electron beam probe is scanned according to the shape and held for a certain period of time. When creating a contamination, the electron beam density and the irradiation time are controlled by the beam diameter, the current value, and the like. In order to facilitate the image processing, the reference mark is desirably 10 pixels or more on the image, and the irradiation beam diameter is set to pixels or more. Preferably, an optimum value of the electron beam irradiation control is set in the reference mark pattern generator 23.

When contamination is likely to occur, a beam blanking for cutting the electron beam 7 is provided in a part of the irradiation system, so that the electron beam 7 does not hit the sample 9 during the movement accompanying the scanning of the electron beam. Good to do. Further, the level of the secondary electron signal obtained from the detector 4 is fed back to the reference mark pattern generator 23, and the amount of contamination can be controlled by adjusting the irradiation time of the electron beam 7.

FIG. 5 is a flowchart showing a procedure for forming a reference mark on a sample or a reference template substrate. First, the sample 9 or the reference template substrate 40b for creating a reference mark is accommodated in the sample holder 3, and the reference mark pattern generator 23 is caused to read the position where the reference mark is to be created (S100). Then, from the electron beam source 1 to the electron beam 7
While irradiating the sample 9 with the electron beam 7 by the scanning lens 2c.
Alternatively, scanning is performed on the surface of the reference template substrate 40b (S102). Next, it is checked whether the irradiation position of the electron beam 7 is a position where a reference mark created in advance is created (S104). If the position is the position where the reference mark is created, the electron beam 7 is stopped at that position (S106), and the electron beam 7 is irradiated (S108). Here, it is determined whether the signal obtained by the detector 4 is equal to or greater than a preset threshold value, and irradiation is continued at the reference mark creation position until the signal exceeds the threshold value (S11).
0). If the number is equal to or larger than the threshold, it is checked whether a predetermined number of reference marks have been created (S112). If the predetermined number has not been reached, the process returns to S102, where the electron beam 7 is again scanned, and the process is terminated if the predetermined number of reference marks have been created (S11).
4).

In the case where the reference template substrate 40b has a stepped shape as shown in FIG. 4C and the contamination is applied on the stepped portion, the following is performed. First, the step of the reference template substrate 40b can be formed in any shape by repeating exposure and etching of the resist. Since the electron microscope has a high depth of focus, it is possible to make a reference mark of contamination at a position where the electron beam probe stops by holding the electron beam probe at an arbitrary position on a step.

The processing procedure for obtaining the deviation correction parameters using the reference template created in this way will be described. FIG. 6 is a flowchart of the process of acquiring the deviation correction parameter using the reference template. First, the magnification of the electron microscope is determined (S202). This determines whether the projection is center projection or parallel projection. The central projection and the parallel projection will be described later. Next, the reference template 40 having the reference mark is set on the sample holder 3 (S
204). When correcting the external orientation elements, the reference template 40 having three or more reference marks is used. When performing correction up to lens distortion, the reference template 40 in which many reference marks are created is used. However, even with only the external orientation elements, a reference template 40 in which a large number of reference marks are created can be used. In order to accurately correct the lens distortion, the reference template 40 having a step is desirable.

In a state where the sample holder 3 and the irradiation electron beam 7 form the first and second relative inclination angles, the electron beam detector 4 detects the first and second detection data for the reference template 40 ( S206). In the case of correction of the external orientation element, the first and second relative inclination angles are equal to those of the sample 9.
Is taken at the same angle as that of the measurement, and the photographing is performed at an inclination angle of at least two directions. When performing lens distortion correction, imaging is performed from a third inclination angle (for example, plus three directions) in addition to the same two inclination angles as when the sample 9 is measured. Next, a fiducial mark is extracted from the photographed image by using image correlation processing or the like and measured (S208).

FIG. 7 is an explanatory diagram of the image correlation processing. In the figure, a search image T is a small rectangular diagram having a vertical N1 and a horizontal N1 and an upper left coordinate of (a, b). The target image I is a large rectangular figure having a vertical M and a horizontal M. As the image correlation processing, any of a normalized correlation method, a residual sequential test method (SSDA method), and the like may be used. The processing can be speeded up by using the residual sequential test method. The following equation is used for the residual sequential test method.

(Equation 1) Here, T (m1, n1) is the search image, I (a, b) (m1, n1) is a partial image of the target image, (a, b) is the upper left coordinate of the search image, and R (a, b)
Is the residual. The point at which the residual R (a, b) is the minimum is the position of the image to be obtained. Equation (1) is used to speed up the processing.
When the value of R (a, b) exceeds the minimum value of the residual in the past, the addition is terminated, and a calculation process is performed to move to the next R (a, b).

Referring back to FIG. 6, the sample holder 3 and the irradiation electron beam 7 for obtaining stereo detection data using the fiducial marks.
The deviation correction parameter at the relative inclination angle with respect to is calculated (S210). From the measured image coordinates of the reference mark and the actual coordinates, in the case of center projection, the following equation (2) is used.
偏 (4) is used to calculate a deviation correction parameter. In the case of parallel projection, a deviation correction parameter is calculated using equations (5) and (6). When the lens distortion correction is performed, the deviation correction parameter is calculated using the equation (7). Then, the reference template 40 is taken out from the sample holder 3, and the acquisition of the deviation correction parameter is completed (S21).
2).

[Parallel Projection and Center Projection] The electron microscope has a wide range of magnification from low magnification to high magnification (ex. Several times to several million times). Then it can be regarded as parallel projection. The magnification for switching between the central projection and the parallel projection is preferably determined based on the calculation accuracy of the deviation correction parameter, and is appropriately selected from, for example, 1000 to 10,000 times. FIG. 8 is an explanatory diagram of center projection. In the case of center projection, the target coordinate system 50 on which the sample 9 is placed and the image coordinate system 52 on which the detector 4 is placed have a positional relationship as shown in FIG. 8 with reference to the projection center point Oc. The coordinates of an object such as a reference mark in the object coordinate system 50 are represented by (X, Y,
Z), and the coordinates of the projection center point Oc are (Xo, Yo, Zo). The coordinates in the image coordinate system 52 are (x, y), and the screen distance from the projection center point Oc to the image coordinate system 52 is C. At this time, the following equation is established as the central projection equation.

[0042]

(Equation 2) Here, k is a coefficient, and ai, j: (i = 1, 2, 3; j = 1, 2, 3) is an element of the rotation matrix. When the equation (2) is solved for the coordinates (x, y) of the image coordinate system 52, the following equation is established.

(Equation 3) Further, the elements ai, j of the rotation matrix are the inclinations ω of the image coordinate system 52 with respect to the three axes X, Y, Z constituting the target coordinate system 50,
It can be expressed as follows using φ and κ.

(Equation 4)

FIG. 9 is an illustration of parallel projection. In the case of parallel projection, there is no point corresponding to the projection center point Oc of the central projection. Therefore, a coordinate system (X _R , Y _R , Z _R ) considering rotation is used as the target coordinate system 54, and K ₁ ,
The following equation holds when selecting the K _2.

(Equation 5) Then, the origin (Xo, Yo,
Using Zo) and the orientation matrix A, it can be expressed as follows.

(Equation 6) Here, a relationship corresponding to equation (4) holds for the elements ai, j of the orientation matrix A.

In calculating the deviation correction parameters, six external orientation elements ω, φ, κ, Xo, Yo, and Zo included in equations (2) to (4) or equations (5) and (6) are obtained. .
That is, in S210, these equations are used to form an observation equation using three or more reference marks, and these six external orientation elements are calculated by successive approximation. Specifically, an approximate value of an unknown variable is given, a Taylor expansion is performed around the approximate value to linearize, an approximate value is corrected by obtaining a correction amount by the least square method, and the same operation is repeated to obtain a convergence solution. These six external orientation elements can be obtained by the approximate solution method. In addition, instead of formulas (2) to (4) or formulas (5) and (6), appropriate ones among various arithmetic expressions used as external orientations in single photo orientation, mutual orientation, and other aerial triangulations. It is advisable to adopt and perform the calculation.

[Lens Distortion Correction] In order to obtain the distortion of the electron lens constituting the electron optical system 2, a plurality of reference marks are prepared, and images are obtained from a plurality of directions. ) Can be corrected. That is, if the x and y coordinates obtained by further correcting the lens distortion in Equations (2) to (4) or Equations (5) and (6) are x 'and y', the following equation is established. x ′ = x + Δx (7) y ′ = y + Δy Here, assuming that k1 and k2 are radial lens distortion coefficients, Δx and Δy are represented by the following equations.

(Equation 7)

The distortion of the electronic lens is calculated by measuring the image coordinates and the target coordinates, and by applying the above equation to the successive approximation solution. The lens distortion coefficient is
In Equation (8), the lens distortion in the radial direction is set. However, tangential lens distortion, spiral lens distortion,
If a lens distortion coefficient is obtained by adding other factors necessary for correcting the distortion of the electronic lens to the equation (8), the calibration of the lens becomes possible.

Next, a description will be given of a processing procedure for processing a stereo image of a sample after obtaining the deviation correction parameters. FIG. 10 is a flowchart of a procedure for processing a stereo image of a sample using the deviation correction parameters. First, the sample 9 to be observed and measured is set in the sample holder 3 (S2).
52). Subsequently, the beam tilt controller 5a sets the tilt angle of the electron beam 7 with respect to the sample holder 3 to two or more, and the electron beam detector 4 detects the first and second detection data for the sample 9 to perform stereo imaging. To capture the image (S
254). The two or more inclination angles are the same as the first and second relative inclination angles between the sample holder 3 and the irradiation electron beam 7 used for acquiring the deviation correction parameter in S206.

Next, it is determined whether the photographing of the sample 9 is center projection or parallel projection based on the magnification set by the magnification changing unit 6 (S25).
6). In the case of central projection, the image coordinates corresponding to the target coordinates are calculated by using the six external orientation elements ω, φ, κ, Xo, Yo, and Zo as deviation correction parameters, using equations (2) to (5).
By substituting it into (4) and converting it to the coordinate system of the stereoscopic image observation unit 33 that wants to display in stereo, and rearranging it,
An eccentricity correction image of a stereo image detected by the detector 4 can be created by the data correction unit 31 (S25).
8). In the case of parallel projection, six external orientation elements ω,
By using φ, κ, Xo, Yo, and Zo, the image coordinates corresponding to the target coordinates are obtained by substituting into the expressions (5) and (6), and converted into the coordinate system of the stereoscopic image observation unit 33 that wants to display in stereo. Then, if the rearrangement is performed, a deviation correction image of the stereo image detected by the detector 4 can be created by the data correction unit 31 (S260).

The stereo image corrected for deviation by the deviation correction parameter is temporarily stored in the stereo image storage unit 34.
And stereoscopically displayed by the stereoscopic image observation unit 33 (S262). When there is no stereoscopic monitor such as the stereoscopic image observation unit 33, one of the display units 22 is used as an alternative.
When two images are displayed on the screen, stereoscopic viewing becomes possible by the operator.

Next, based on the stereo image corrected by the data correcting unit 31, the shape measuring unit 32 measures a portion of the sample 9 where three-dimensional measurement is desired (S264). The three-dimensional measurement is calculated based on the principle of triangulation by measuring left and right images displayed stereoscopically (obtaining lateral parallax). The measurement of the left and right images can be performed manually or using image correlation processing or the like.

Then, it is determined whether the measurement is completed (S26).
6) If the measurement is to be continued, it is determined whether the deviation correction parameter already obtained can be used (S267). When there is reproducibility of the magnification of the electron microscope even when measuring another sample at the same magnification and when measuring at a different magnification, the deviation correction parameter already obtained is used to calculate S
Returning to step 252, the measurement is repeated. If the electron microscope has no magnification reproducibility or has a change with time, the deviation correction parameter already obtained cannot be used, so the flow returns to S202 in FIG. The calculated deviation correction parameter is calculated. When the measurement is completed, the sample 9 is removed from the sample holder 3 and the process ends (S268).

FIG. 11 is a flowchart of a procedure for observing a stereo image using a reference mark present on a sample. First, the sample 9 is inserted into the sample holder 3 (S302). Subsequently, a magnification for observing or measuring the sample 9 is set by the magnification changing unit 6 (S304). Then, the surface of the sample 9 is pre-scanned with the electron beam 7 at the set magnification (S3).
06). The detector 4 detects secondary electrons by pre-scanning, and an image is created by the image creation processing unit 21. In the reference mark pattern generator 23, the image creation processing unit 21
Feature points are extracted from the image created by the process (S30).
8). Here, the feature point is a clearly recognizable mark existing at a position suitable for calculating the deviation correction parameter, such as a reference mark.

[Feature Point Extraction Process] Here, the feature point extraction process performed by the reference mark pattern generator 23 will be described. Assuming that the input image is f (i, j) and the Laplacian of the input image is ∇ ² f (i, j), the image is sharpened. g (i, j) = f (i, j) −∇ ² f (i, j) (9) Here, g (i, j) is a sharpened image. Regarding the Laplacian ∇ ² f (i, j) of the input image, there are various types of differential operators such as a Laplacian operator and a line detection operator.

FIGS. 12A and 12B show a differential operator of the image sharpening process for 3 × 3 pixels. FIG. 12A shows a Laplacian operator and FIG. 12B shows a line detection operator. Sharpening processing is performed by giving a heavy weight to the center pixel and a light weight to the adjacent pixels. Note that the differential operator for the image sharpening process may be obtained by modifying the 3 × 3 pixel differential operator of FIG. 12 by weighting using a Gaussian curve.

After the image sharpening process, an edge extraction process is performed. The edge extraction processing can be performed by setting a zero crossing point of the density value of the sharpened image as an edge. That is, the image is formed by imaging only the points at which the value becomes zero, or by setting the plus region to white and the minus region to black at the boundary of zero.

Further, instead of the digital image processing using the equation (9), it may be obtained by a calculation processing as shown in the following equation.

(Equation 8) Equation (10) incorporates a measure to mitigate the sudden change in shading by a Gaussian curve in the calculation processing.

Returning to FIG. 11, the reference mark pattern generator 23 determines whether the positions and the number of feature points are sufficient (S31).
0), if sufficient, treat the feature points as reference marks (S
311). If not, the existing feature points are treated as fiducial marks, and the positions of fiducial marks to be additionally formed are determined (S312), and the fiducial mark pattern generator 23 is determined.
To create a fiducial mark (S314). In order to determine whether the positions and the number of feature points are sufficient, the image creation processing unit 2
The determination may be made after the image created in step 1 is divided into blocks.

FIG. 13 is an explanatory diagram of the case where the image created by the image creation processing unit is divided into blocks after the feature point extraction processing. The image created by the image creation processing unit 21 is divided into, for example, four blocks A, B, C, and D. Preferably, the block division of the image is one for each block.
It is preferable to determine that there are one or two feature points, and to make the area and shape of each block equal. If there is no feature point in a certain block, the reference mark creation position is determined.

FIG. 14 is a plan view showing an example of a sample surface on which fiducial marks are formed. The sample 9 is a semiconductor substrate having a predetermined pattern 9b. Reference marks 9a are formed at four corners of the image of the sample 9. Such a reference mark 9a is obtained by matching a sample surface with a search image T having a standard reference mark as a target image I,
It can be easily detected.

Returning to FIG. 11, the beam tilt control unit 5a controls the tilt angle of the electron beam 7 to switch between the electron beams 7R and 7L, and captures the required number of images into the image creation processing unit 21 (S
316). Based on the magnification set by the magnification change unit 6, the data correction unit 31 selects whether to calculate the deviation correction parameter by central projection or to calculate the deviation correction parameter by parallel projection (S318). Subsequently, the coordinates of the reference mark in the image are detected (S320, S324). As shown in FIG. 13, since it is previously known in which block the reference mark is located, as shown in FIGS. 7 and 14, the area is searched and detected by image correlation processing.

The data correction unit 31 calculates the deviation correction parameters from the coordinates of the detected reference mark image coordinates using the above-described equations (2) to (4) in the case of center projection. Then, using the six external orientation elements ω, φ, κ, Xo, Yo, and Zo as deviation correction parameters, the image coordinates corresponding to the target coordinates are substituted into the equations (2) to (4) to obtain: If the data is converted into the coordinate system of the stereoscopic image observation unit 33 desired to be displayed in stereo and rearranged, the data correction unit 31 can create a deviation corrected image of the stereo image detected by the detector 4 (S322). ).

In the case of parallel projection, the above equation (5)
The deviation correction parameter is calculated using (6). When the lens distortion correction is performed, the deviation correction parameter is calculated using the equation (7). And six external orientation elements ω,
By using φ, κ, Xo, Yo, and Zo, the image coordinates corresponding to the target coordinates are obtained by substituting into the expressions (5) and (6), and converted into the coordinate system of the stereoscopic image observation unit 33 that wants to display in stereo. Then, if the rearrangement is performed, a deviation correction image of the stereo image detected by the detector 4 can be created by the data correction unit 31 (S326).

Subsequently, the deviation corrected image of the stereo image is displayed on the stereoscopic image observation unit 33 to enable stereoscopic observation (S
328). Next, the shape measuring unit 32 measures a portion of the sample 9 where three-dimensional measurement is desired based on the stereo image corrected by the data correcting unit 31 (S330). And
It is determined whether the measurement has been completed (S332), and when another sample is measured at the same magnification or when the magnification is changed, the process returns to S304 and the measurement is repeated. When the measurement is completed, the sample 9 is removed from the sample holder 3 and the process ends (S33).
4). Here, when the same sample 9 is measured by changing the magnification, since the fiducial mark has already been created, whether it can be used as a feature point is determined by the feature extraction process in S308 and can be used. If used. If not, a new reference mark is created (S312, S314).

Although the processing shown in FIG. 11 has been described in an embodiment in which the processing is automatically performed via the image creation processing unit 21, the processing may be performed manually by the operator while displaying the pre-scanned image on the display device 22. Good.

[Second Embodiment] FIG. 15 is a structural block diagram for explaining a second embodiment of the present invention, and shows a case where a stereoscopic image of a scanning microscope is obtained by changing the inclination angle of a sample holder. ing. In the second embodiment, the holder tilt controller 5b is used as the tilt controller 5 that controls the tilt of the sample holder 3, and the beam tilt controller 5a is not operated. Here, the case where the relative inclination angle between the sample holder 3 and the irradiation electron beam 7 by the holder inclination control unit 5b is set by switching between two directions, that is, upward R to the right and upward L to the left, is illustrated. However, at least two stages are required to obtain stereo detection data. Taking the sample 9 at a predetermined angle (± θ) and photographing it with the detector 4 is equivalent to fixing the sample 9 and irradiating the electron beam 7 at a predetermined angle (± θ) and imaging with the detector 4. Becomes

In the apparatus configured as described above, similarly to the first embodiment, the detected raw image is corrected into a deviation corrected image so that stereoscopic viewing is possible. As a mode of correcting to the rectified image, a rectified parameter is acquired using the reference template as shown in FIGS. 6 and 10, and then a stereo image of the sample is processed, and as shown in FIG. There is one that directly processes a stereo image using a fiducial mark of a sample.

[Third Embodiment] FIG. 16 is a block diagram showing the configuration of a third embodiment of the present invention, in which a stereoscopic image of a transmission microscope is obtained by changing the inclination angle of a sample holder. ing. Since the electron beam apparatus 10 is a transmission microscope, the electron beam detectors 4 a and 4 b are located on the opposite side of the electron beam source 1 with the sample holder 3 interposed therebetween. The electron optical system 2 includes a first electron optical system that irradiates the sample 9 with the electron beam 7 and a second electron optical system that guides the electron beam 7 transmitted through the sample 9 to a detector 4a such as a CCD (Charge-coupled devices). System. As a first electron optical system, there is provided a condenser lens 2a for changing an electron flow density, an opening angle, an irradiation area, and the like of the electron beam 7 emitted from the electron beam source 1. As the second electron optical system, an intermediate lens 2e for enlarging and projecting an objective lens 2g at the first stage of the imaging lens system, an image formed on the image plane of the objective lens 2g, or a diffraction image formed on the back focal plane. A lens 2f is provided.

The detection signal of the detector 4a is transmitted to the CCD controller 4b.
Is sent to the image creation processing unit 21 via the. Magnification change unit 6
Is for changing the magnification of the electron optical system 2. Here, a magnification control signal is sent to the objective lens 2g, the intermediate lens 2e, and the projection lens 2f. A holder tilt controller 5b is used as the tilt controller 5 that controls the tilt of the sample holder 3. Note that, even in a transmission microscope, a component corresponding to a beam tilt controller may be used as the tilt controller 5 that controls the tilt of the sample holder 3.

In the apparatus configured as described above, similarly to the first embodiment, the detected raw image is corrected into a deviation corrected image so that stereoscopic viewing is possible. As a mode of correcting to the rectified image, a rectified parameter is acquired using the reference template as shown in FIGS. 6 and 10, and then a stereo image of the sample is processed, and as shown in FIG. There is one that directly processes a stereo image using a fiducial mark of a sample.

In the above-described embodiment, the electron microscope deflects the electron beam by the beam tilt control unit to obtain a stereo image, and the holder tilt control unit tilts the sample to obtain a stereo image. Although both configurations can be adopted, the present invention is not limited to this, and may be an electron microscope including one of the beam tilt control unit and the holder tilt control unit.

[0071]

As described above, according to the electron beam apparatus of the present invention, an electron beam source for emitting an electron beam, an electron optical system for irradiating a sample with an electron beam, and a sample holder for holding the sample. When the sample holder and the irradiation electron beam are relatively inclined, the sample holder and the irradiation electron beam are relatively inclined, the electron beam detector that detects the electron beam emitted from the sample, and the sample holder and the irradiation electron beam are relatively inclined. And a data correction unit that corrects the stereo detection data in a predetermined relationship. Therefore, the data correction unit can correct the deviation of the two pieces of image data as the detection data of the stereo to enable the orientation of the image, and conform to the data processing method of aerial triangulation to obtain the three-dimensional data of the sample. Shape measurement and three-dimensional images can be formed.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of an image photographed at a predetermined inclination angle with respect to a subject in which three linear patterns having the same length exist at equal intervals.

FIG. 2 is an explanatory diagram of a stereo image in which the tilt images in FIGS. 1A and 1B have been corrected to a deviation correction image.

FIG. 3 is a block diagram illustrating the configuration of the first embodiment of the present invention, in which a stereoscopic image is obtained by deflecting an electron beam of a scanning microscope.

FIG. 4 is an explanatory diagram of a reference mark formed on a sample or a reference template substrate.

FIG. 5 is a flowchart showing a procedure for creating a reference mark on a sample or a reference template substrate.

FIG. 6 is a flowchart of a process of acquiring a deviation correction parameter using a reference template.

FIG. 7 is an explanatory diagram of an image correlation process.

FIG. 8 is an explanatory diagram of center projection.

FIG. 9 is an explanatory diagram of parallel projection.

FIG. 10 is a flowchart of a procedure for processing a stereo image of a sample using the deviation correction parameters.

FIG. 11 is a flowchart of a procedure for observing a stereo image using a reference mark present on a sample.

FIG. 12 is a differential operator of an image sharpening process for 3 × 3 pixels.

FIG. 13 is an explanatory diagram of a case where an image created by an image creation processing unit is divided into blocks after feature point extraction processing.

FIG. 14 is a plan view illustrating an example of a sample surface on which a reference mark is formed.

FIG. 15 is a configuration block diagram illustrating a second embodiment of the present invention, and illustrates a case where a stereoscopic image of a scanning microscope is obtained by changing a tilt angle of a sample holder.

FIG. 16 is a configuration block diagram illustrating a third embodiment of the present invention, and illustrates a case where a stereoscopic image of a transmission microscope is obtained by changing a tilt angle of a sample holder.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electron beam source 2 electron optical system 3 sample holder 4 electron beam detection unit 5 data correction unit 5a beam tilt control unit 5b holder tilt control unit 6 magnification change unit 7 electron beam 9 sample 10 electron beam device 20 data processing device 21 image creation Processing unit 22 Display device 23 Reference mark pattern generator 25 Measurement condition determination unit 31 Data correction unit 31a Deviation correction parameter acquisition unit 31b Image data deviation correction unit 32 Shape measurement unit 33 Stereoscopic image observation unit 34 Stereo image storage unit

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G21K 5/00 G21K 5/00 A 5/04 5/04 M H01J 37/22 501 H01J 37/22 501A 502 502H 37/26 37/26 H01L 21/66 H01L 21/66 J F term (reference) 2F067 AA53 HH06 HH13 JJ05 KK04 LL16 2G001 AA03 BA07 BA11 CA03 DA01 DA09 FA06 FA08 GA06 GA09 GA13 HA13 JA07 LA11 PA15 4M106 AA02 BA02 CA38 DB DB12 DB18 DB30 DJ02 DJ15 DJ19 DJ20 DJ21 DJ24 5C033 SS02 SS04 SS10 UU01 UU03 UU05 UU06

Claims (11)

[Claims] An electron beam source for emitting an electron beam; an electron optical system for irradiating the sample with the electron beam; a sample holder for holding the sample; A sample tilting section for tilting; an electron beam detecting section for detecting an electron beam emitted from the sample; stereo detection data when the sample holder and the irradiation electron beam are tilted relatively to each other in a predetermined manner. An electron beam device comprising: a data correction unit that corrects data in relation. 2. The method according to claim 1, further comprising: a shape measurement unit configured to measure a shape of the sample based on the correction data corrected by the data correction unit, or a three-dimensional shape of the sample based on the correction data corrected by the data correction unit. The electron beam apparatus according to claim 1, further comprising at least one of a stereoscopic image observation unit that forms an image. 3. The electron beam apparatus according to claim 1, wherein the sample inclining section is configured to incline the sample with respect to the irradiation electron beam. 4. The apparatus according to claim 1, wherein the sample tilting section is configured to control the electron optical system so as to irradiate the sample with the irradiation electron beam obliquely. An electron beam apparatus according to claim 1. 5. The electron beam detecting section is configured to detect secondary electrons emitted from the sample;
The electron beam device according to claim 4. 6. The sample has a reference mark serving as a reference position; the data correction unit uses the reference mark to
The electron beam apparatus according to claim 1, wherein the stereo detection data is corrected to deviation correction data. 7. A deviation correction parameter acquisition unit that acquires a deviation correction parameter at a relative inclination angle between the sample holder and the irradiation electron beam using a reference mark of a reference template; The electron beam according to any one of claims 1 to 5, further comprising image data deviation correcting means for correcting the stereo detection data of the sample into deviation correction data using the acquired deviation correction parameters. apparatus. 8. An electron beam source that emits an electron beam, an electron optical system that irradiates the sample with the electron beam, a sample holder that holds the sample, and a sample that relatively tilts the sample holder and the irradiation electron beam. A data processing device for an electron beam device connected to an electron beam device having an inclined portion and an electron beam detection portion for detecting an electron beam emitted from the sample; the sample holder and the irradiation electron beam being relatively positioned; A data processing unit for an electron beam apparatus, comprising: a data correction unit for receiving detection data of stereo when tilted to a predetermined angle, and correcting the stereo detection data in a predetermined relationship. 9. A three-dimensional shape of the sample based on the correction data corrected by the data correction unit or a shape measurement unit that measures the shape of the sample based on the correction data corrected by the data correction unit. The data processing device for an electron beam device according to claim 8, further comprising: at least one of a stereoscopic image observation unit that forms an image. 10. An electron beam source for emitting an electron beam, an electron optical system for irradiating the sample with the electron beam, a sample holder for holding the sample, and a sample for relatively tilting the sample holder and the irradiation electron beam. An electron beam for measuring the shape of the sample or forming a three-dimensional image of the sample by using an electron beam device having an inclined portion and an electron beam detector for detecting an electron beam emitted from the sample. A method for creating stereo data of the apparatus; wherein a reference mark serving as a reference position is formed on the sample; and wherein the sample holder and the irradiation electron beam form the first relative inclination angle, and the electron beam is formed. Detecting first detection data by a line detection unit; detecting second detection data by the electron beam detection unit in a state where the sample holder and the irradiation electron beam form a second relative tilt angle; The fiducial mark And correcting the first and second detection data into deviation correction data using the method; 11. An electron beam source that emits an electron beam, an electron optical system that irradiates the sample with the electron beam, a sample holder that holds the sample, and a sample that relatively tilts the sample holder and the irradiation electron beam. An electron beam for measuring the shape of the sample or forming a three-dimensional image of the sample by using an electron beam device having an inclined portion and an electron beam detector for detecting an electron beam emitted from the sample. A stereo data creating method of the apparatus, wherein a reference template in which a reference mark serving as a reference position is created is inserted into the sample holder instead of the sample; the sample holder and the irradiation electron beam are first and second. In a state where the relative inclination angle is 2, the electron beam detector detects first and second detection data for the reference template; Obtaining a displacement correction parameter at a relative tilt angle with respect to the electron beam; inserting the sample into the sample holder; forming a first and a second relative tilt angle between the sample holder and the irradiation electron beam; In the state, the first and second detection data for the sample are detected by the electron beam detection unit; and the first and second detection data of the sample are corrected for deviation using the obtained deviation correction parameter. Correction to data; a method of creating stereo data for an electron beam device.