JP2002264024A - Grinding film for ultra-precision processing and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a grinding film for ultra-precision processing used for grinding electronic components and optical components and for general specular polishing, especially appropriately used for grinding end faces of an optical fiber connector, and its manufacturing method. SOLUTION: In this grinding film 1 for ultra-precision processing having a base material film 2 and a grinding layer 4 formed on the film 2, the layer 4 containing grinding material grains 5 with a primary grain average grain size of 1-100 nm formed by grain growing method inside a binder resin 6 is formed. The grains 5 are preferably metallic oxides or metal compound oxides formed by vapor phase epitaxy method, liquid deposition method or solid phase growing method. The grains 5 are dispersed in a binder resin liquid for preparing a coating liquid and the coating liquid is applied on the film 2 for forming the grinding layer 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing film for ultra-precision processing used for polishing electronic parts and optical parts and general mirror polishing, and a method for producing the same, and particularly suitable for polishing an end face of an optical fiber connector. The present invention relates to a polishing film for ultra-precision processing to be performed and a manufacturing method thereof.

[0002]

2. Description of the Related Art A polishing film for precision processing of electronic parts and optical parts and a polishing film for general mirror polishing include a base film and abrasive particles having a predetermined particle size on a binder resin. A polishing film having a polishing layer contained therein is widely known and used.

[0003] In a conventional polishing film, abrasive particles having a certain particle size are used in order to secure a high polishing rate. Such abrasive particles are generally used after being ground and classified. Further, fine abrasive particles (0.1 μm or less) have not been used much in polishing films because a polishing rate cannot be secured.

However, in recent years, more precise polishing is required, and abrasive particles having a small particle size are mainly selected for a polishing film used in a final finishing polishing step or a preceding step. In particular, in polishing the end face of an optical fiber connector, since the polishing form of the end face of the optical fiber directly affects connector performance such as return loss, selection of suitable abrasive particles having a small particle diameter is an important issue. .

[0005]

However, even if desired abrasive particles having a small particle diameter are to be obtained, there is a problem that classification is difficult by the conventional method. Also, even if the classification can be performed, the desired abrasive particles having a small particle diameter have a strong cohesive force. Therefore, such abrasive particles are likely to exist as large aggregates in the coating liquid or the polishing layer, so that precision processing is difficult. There was a current situation that it was not able to respond to requests sufficiently.

[0006] The present invention provides a polishing film for ultra-precision processing used for polishing electronic parts and optical parts and general mirror polishing.
Particularly, an object of the present invention is to provide a polishing film for ultraprecision processing suitably used for polishing an end face of an optical fiber connector, and a method for producing the polishing film.

[0007]

Means for Solving the Problems According to the present invention, there is provided a polishing film for ultra-precision processing having a base film and a polishing layer formed on the base film, wherein the polishing layer is It is characterized in that abrasive particles having an average primary particle diameter of 1 to 100 nm produced by a particle growth method are contained in a binder resin.

According to the present invention, since the abrasive layer having the average primary particle diameter of 1 to 100 nm produced by the particle growth method has the abrasive layer contained in the binder resin,
Fine polishing can be achieved. Since the abrasive particles are fine particles that cannot be sufficiently obtained by pulverization and classification, extremely precise fine polishing is enabled. Further, since the abrasive particles produced by the particle growth method are used, it is possible to control the size, shape, particle size distribution, modification of the particle surface, and the like of the particles. As a result, the dispersibility in the polishing layer can be controlled, and it is difficult to exist as an aggregate in the polishing layer, so that the influence of the aggregate that can generate a large scratch on the surface to be polished can be significantly reduced. it can. According to the polishing film for ultra-precision processing of the present invention, highly precise processing can be performed on a material to be polished such as an electronic component or an optical component.

According to a second aspect of the present invention, in the polishing film for ultraprecision processing according to the first aspect, the abrasive particles are grown by a vapor phase growth method, a liquid phase growth method, or a solid phase growth method. It is characterized in that it is a metal oxide or a metal composite oxide produced by a method.

According to the present invention, the abrasive particles are metal oxides or metal composite oxides produced by a particle growth method comprising a vapor phase growth method, a liquid phase growth method or a solid phase growth method. It is possible to control the size, shape, particle size distribution, modification of the particle surface, and the like. As a result, it is possible to form a polishing layer that can perform high precision processing on the material to be polished.

According to a third aspect of the present invention, in the polishing film for ultra-precision processing according to the first or second aspect,
It is characterized in that the abrasive particles are zirconia particles produced by a sol-gel method or cerium oxide produced by a gas phase reaction method.

According to the present invention, a metal oxide composed of zirconia particles produced by a sol-gel method or cerium oxide particles produced by a gas phase reaction method is preferably used as abrasive particles.

According to a fourth aspect of the present invention, in the polishing film for ultraprecision processing according to any one of the first to third aspects, the binder resin is a resin having a siloxane bond.

According to the present invention, since a resin having a siloxane bond is employed as a binder resin, a polishing layer in which abrasive particles are uniformly dispersed can be obtained.

A fifth aspect of the present invention is characterized in that the polishing film for ultra-precision processing according to any one of the first to fourth aspects is used for polishing an end face of an optical fiber connector.

According to the present invention, it can be preferably used for the polishing of the end face of an optical fiber connector which requires extremely high precision polishing, the polishing quality of the end face of the optical fiber connector is remarkably improved, and the connector such as the return loss is improved. Performance can be improved.

According to a sixth aspect of the present invention, there is provided a method for producing a polishing film for ultra-precision processing having a base film and a polishing layer formed on the base film, wherein the primary film produced by the particle growth method is used. The abrasive layer is prepared by dispersing abrasive particles having an average particle diameter in the range of 1 to 100 nm in a binder resin liquid to prepare a coating liquid, and applying and forming the coating liquid on the base film. Is formed.

According to the present invention, abrasive particles having an average primary particle diameter of 1 to 100 nm produced by a particle growth method are dispersed in a binder resin liquid to prepare a coating liquid.
Since the coating liquid is applied and formed on the base film to form the polishing layer, it is possible to manufacture a polishing film for ultra-precision processing capable of precision polishing in which the dispersibility of the abrasive particles in the polishing layer is controlled.

According to a seventh aspect of the present invention, in the method for producing a polishing film for ultra-precision processing according to the sixth aspect, the abrasive particles are made of zirconia particles produced by a sol-gel method or a gas phase reaction method. The produced cerium oxide particles are characterized in that the binder resin is a silicone resin or a silicone-based resin.

According to the present invention, the abrasive particles are zirconia particles produced by a sol-gel method or cerium oxide particles produced by a gas phase reaction method, and the binder resin is a silicone resin or a silicone resin. Therefore, the abrasive particles can be uniformly dispersed in the coating liquid. As a result, the abrasive particles can be dispersed in the polishing layer formed by applying the coating liquid in a uniform state and in a state in which the formation of aggregates is suppressed.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION A polishing film for ultra-precision processing and a method for producing the same according to the present invention will be described with reference to the drawings.

The polishing film 1 for ultra-precision processing (hereinafter, referred to as a polishing film 1) of the present invention is, as shown in FIG.
This is a polishing film having a base film 2 and a polishing layer 4 formed on the base film 2, and is formed by forming a primer layer 3 and other layers as necessary. In particular, the feature of the present invention resides in the configuration of the polishing layer 4, wherein the abrasive particles 5 having a primary particle average particle diameter in the range of 1 to 100 nm produced by the particle growth method are contained in the binder resin 6. In that the polishing layer 4 comprises

The polishing film 1 of the present invention having the above characteristics has an average primary particle diameter of 1 to 1 produced by a particle growth method.
Since it has the polishing layer 4 containing the abrasive particles 5 in the range of 100 nm, extremely precise fine polishing becomes possible. Furthermore, since the abrasive particles 5 produced by the particle growth method are used, it is possible to control the particle size, shape, particle size distribution, modification of the particle surface, and the like. Such abrasive particles 5 are applied to the polishing layer 4
Is excellent in the dispersibility of the abrasive layer 5 in the polishing layer 4 and the number of aggregates of the abrasive particles 5 in the abrasive layer 4 is reduced, so that the influence of the aggregates that can generate large scratches on the surface to be polished can be significantly reduced. Has the effect of

Hereinafter, the structure of the polishing film of the present invention and the method of manufacturing the same will be described in detail.

The polishing film 1 is applied to an optical fiber connector composed of an optical fiber and a ferrule, a semiconductor wafer, metal, ceramics, a color filter (for liquid crystal display, etc.), a plasma display, an optical lens, a magnetic disk. Alternatively, precision parts such as an optical disk substrate, a magnetic head, and an optical reading head can be cited, but the invention is not limited thereto and may be applied to general parts. The polishing film 1 of the present invention can be preferably used for polishing a surface or an end face of such a part or the like.

The polishing step in which the polishing film 1 is used includes:
It is arbitrarily selected according to the application target of the polishing film 1.
For example, either a final finish polishing step or an intermediate polishing step may be used, and it may be used in each of the stepwise intermediate polishing steps. This can be realized by changing the average particle size of the abrasive particles 5 contained in the polishing layer 4 of the polishing film 1 stepwise. That is, by gradually reducing the average particle size of the abrasive particles 5, the polishing film 1 used in the stepwise polishing step can be obtained. In addition, it is preferable to use the polishing film 1 of the present invention in the final finishing polishing step of an optical fiber connector which requires extremely high precision polishing. Further, if the polishing film 1 of the present invention is used in the intermediate polishing step of the optical fiber connector, the scratch on the end face of the optical fiber connector in the final finishing polishing step can be significantly reduced. As a result, the performance of the final optical fiber connector can be significantly improved.

The polishing film 1 may have any shape such as a long sheet having a wide width, a long band having a narrow width, a square shape, a circular shape, and the like. About the specific usage mode of such a polishing film 1, the shape can be appropriately specified and used according to an object to be applied and a polishing apparatus.

The base film 2 is required to have mechanical strength, dimensional stability, heat resistance and the like. As a material for the base film, synthetic paper or a plastic film is used.
For example, polyethylene terephthalate, stretched polypropylene, polycarbonate, acetyl cellulose diester, acetyl cellulose triester, stretched polyethylene, polybutylene terephthalate, and the like can be given. The thickness of the base film 2 is 10 to 150 μm
A degree is preferred.

The primer layer 3 is not an essential layer in the polishing film 1 of the present invention, but is provided as necessary mainly in consideration of the adhesiveness of the polishing layer 4. Such a primer layer 3 is provided on the base film 2 side as a layer adjacent to the polishing layer 4. By forming the primer layer 3, the polishing layer 4 can be prevented from peeling off when the material to be polished is polished. As the primer layer 3, a primer layer having a conventionally known configuration can be used, and examples thereof include an easily-adhesive primer layer, a surface modifier layer (surfactant layer) such as a silane coupling agent, and a vapor deposition layer. be able to. Examples of the deposition layer include a metal deposition layer of aluminum or the like, a metal oxide deposition layer of SiO ₂ , Al ₂ O ₃ , TiO _2, or the like, and a polymer thin film deposition layer of polyurea or the like.

Examples of the material for the primer layer that can be formed by coating, printing or vapor deposition include polyvinyl chloride resin, polyvinyl acetate resin, polyacrylic or polymethacrylic resin, polyvinyl alcohol resin, and ethylene copolymer. Polymer, polyvinyl acetal resin, rubber resin, polyester resin, polyamide resin, phenol resin, amino-plast resin, epoxy resin, polyurethane resin, silicone resin,
A monomer constituting a resin made of a cellulose resin or the like,
Examples of the composition include one or more of a prepolymer, an oligomer, and a polymer as a main component of the vehicle. The primer layer 3 can be formed by preparing a coating liquid, a printing ink, or the like made of such a primer layer material, and applying, printing, or vapor-depositing the base film 2 at a predetermined thickness. Further, a curing agent such as isocyanate may be added to improve the adhesiveness.

The polishing layer 4 has a binder resin 6 containing abrasive particles 5 having an average primary particle diameter of 1 to 100 nm produced by a particle growth method. The thickness of the polishing layer 4 is not particularly limited because it is set according to the type of the material to be polished and the polishing process to be applied.
Usually, it is 2 to 20 μm, preferably 3 to 10 μm.

As the abrasive particles 5, for example, ZrO
₂ , Al ₂ O ₃ , TiO ₂ , Fe ₂ O ₃ , ZnO, CeO
₂ , Y ₂ O ₃ , Mn ₂ O ₃ , Mn ₃ O ₄ , SiO ₂ , CuO,
Dy ₂ O ₃ , Er ₂ O ₃ , α-Fe ₂ O ₃ , Fe ₃ O ₄ , Ho ₂
O ₃ , In ₂ O ₃ , CoO, MgO, MoO ₃ , NiO,
SnO ₂ , Gd ₂ O ₃ , SrO, Yb ₂ O ₃ , Bi ₂ O ₃ , I
TO, ATO, Al ₂ O ₃ / SiO ₂ , Al ₂ O ₃ / Mg
O, ZnO / Bi ₂ O ₃ , ZnO / Pr ₂ O ₃ , ZnO / Y
₂ O ₃ , LiMn ₂ O ₄ , LiCoO ₂ , LiNiO ₂ , C
Examples thereof include metal oxides such as aCO ₃ and BaCO ₃ or metal composite oxides.

The abrasive particles 5 made of a metal oxide or a metal composite oxide are produced by a particle growth method such as a vapor phase growth method, a liquid phase growth method or a solid phase growth method. Abrasive particles produced by such a particle growth method can be made into fine particles that cannot be sufficiently obtained by pulverization and classification, so that extremely precise fine polishing can be performed, and the particle size, Shape, particle size distribution,
It is possible to control the modification of the particle surface and the like. As a result, the polishing layer 4 can be formed together with the binder resin 6 to form the polishing layer 4 that can be subjected to high precision processing.

Regarding the above-described particle growth method, the vapor phase growth method includes a gas phase reaction method in which fine particles are generated by a chemical reaction of a metal vapor or a compound in a gas phase, and a plasma CV method.
Examples include a plasma chemical vapor deposition method for generating fine particles by D, a chemical vapor deposition method (CVD method), and an evaporation method. Examples of the liquid phase growth method include a solution spraying method, a desolvation method, an aqueous solution reaction method, Emulsion method, suspension polymerization method, dispersion polymerization method,
Examples include alkoxide hydrolysis method (sol-gel method), hydrothermal reaction method, chemical reduction method, pulsed laser ablation method in liquid, and the like. Solid phase growth method is synthesized by thermal decomposition of ultrafine particles and ultrafine particles. Solid thermal decomposition method.

In the present invention, the abrasive particles 5
Zirconia (ZnO) produced by a sol-gel method
₂ ) Particles, cerium oxide (CeO ₂ ) particles produced by a gas phase reaction method, and titania (TiO ₂ ) particles produced by a hydrothermal reaction method can be preferably used.
The ZnO ₂ particles, CeO ₂ particles, and TiO ₂ particles are preferably used because they have good affinity and compatibility with a binder resin 6 represented by a silicone resin and a silicone resin described below.

The abrasive particles 5 have an average primary particle size of 1
It has a predetermined average particle size in the range of 100 to 100 nm, preferably 10 to 50 nm. The abrasive particles 5 having such a fine primary particle average particle diameter can be polished with extremely high precision on a material to be polished. The predetermined average particle diameter contained in the polishing layer 4 of the polishing film 1 is determined in consideration of whether the polishing film 1 is applied in the intermediate polishing step or the final finish polishing step. Selected.

The abrasive particles 5 act as fixed abrasive grains while fixed to the polishing layer 4 by the binder resin 6, and act as free abrasive grains after detaching from the polishing layer 4. Usually, the type and predetermined particle size of the abrasive particles 5 are set according to the type of the material to be polished and the polishing step to be applied. In the present invention, the average particle size of the abrasive particles 5 is represented as the average particle size of the primary particles.

The above-mentioned abrasive particles 5 can be contained in the binder resin 6 in a mixing ratio (weight% ratio) of abrasive particles: binder resin = 20: 80 to 95: 5. The mixing ratio of the abrasive particles 5 is not particularly limited. It is set arbitrarily according to.

The binder resin 6 is selected in consideration of the bonding property with the abrasive particles 5. The binder resin 6 holds the abrasive particles 5 in the polishing layer 4 to act as fixed abrasive particles, and And to function as detached abrasive grains.

As the binder resin 6 having such an action, a monomer, prepolymer, oligomer or polymer having a siloxane bond (Si—O bond) in its structure, such as a silicone resin or a silicone resin, is used. For example, polysiloxane or a derivative thereof, a modified product thereof, a blend thereof, and a monomer, prepolymer or oligomer thereof can be used. Specifically, for example,
Not only monomers, prepolymers or oligomers or polymers constituting polysiloxane, but also monomers, prepolymers or oligomers or polymers constituting the polysiloxane and, for example, polyester resins, polyvinyl chloride resins, polyvinyl acetate resins Resin, polyacrylic or polymethacrylic resin, polyvinyl alcohol resin, ethylene copolymer, polyvinyl acetal resin, rubber resin, polyamide resin,
A phenolic resin, an amino-plast resin, an epoxy resin, a polyurethane resin, a cellulosic resin, a blend of a monomer, a prepolymer, an oligomer or a polymer constituting another resin, or a reaction modified product. Can be used. Such resins include UV-curable resins and EB-curable resins.

In particular, in the present invention, polyester resins, polyvinyl chloride resins, polyvinyl acetate resins,
It is preferable to use a blend or a reaction modified product obtained by mixing a prepolymer or oligomer or polymer such as polyacrylic resin or polyurethane resin with a polysiloxane prepolymer or oligomer or polymer. More specifically, in the present invention, a polyester resin, a polyvinyl chloride resin, a polyvinyl acetate resin, a polyacryl resin,
A prepolymer, oligomer, or polymer such as a polyurethane resin is used as a main chain, and a polysiloxane prepolymer, oligomer, or polymer is reacted with a side chain thereof by, for example, graft polymerization to form an organic main chain portion. It is desirable to use an organic-inorganic composite polymer having a chain portion composed of an inorganic material comprising a siloxane bond, a prepolymer or an oligomer thereof, or the like.

In the present invention, by using the organic-inorganic composite polymer as described above, the abrasive particles 5 having an extremely fine particle diameter described above are agglomerated in the coating liquid or the polishing layer 4. In this case, the primary particles are maintained in a monodispersed state, and the polishing film 1 suitable for high-definition fine polishing can be manufactured. The reason why the abrasive particles 5 can maintain the state of the primary particles is not clear, but if the resin used as the binder resin 6 contains a siloxane bond (Si—O bond), the abrasive particles 5 For example, when colloidal silica particles are used, both have a functional group having a common Si atom. As a result, both have affinity, so that the above-mentioned abrasive particles 5
In either the coating liquid or the polishing layer 4, it is easy to maintain the state of the primary particles and becomes monodisperse, and the polishing film 1 having such a polishing layer 4 can exhibit an extremely high-definition polishing action. it can.

The coating liquid for the polishing layer usually contains a solvent, but the type and solid content thereof are not particularly limited, and may be arbitrarily selected and used. As the solvent, for example, isopropyl alcohol, methanol, ethanol, xylene / butanol, ethylene glycol, ethylene glycol monoisopropyl ether, dimethylacetamide, methyl isobutyl ketone and the like can be used.

The additives to be contained in the polishing layer coating liquid as required are not particularly limited, and a curing agent and a dispersant can be contained in an optional ratio. As the curing agent, binder resin 6 in polishing layer 4
And an organic metal solution such as a tin compound. As a dispersant,
This is for dispersing the abrasive particles 5 in the coating liquid, and examples thereof include nonionic surfactants.

According to the polishing film 1 of the present invention thus configured, the abrasive particles 5 in the polishing layer 4 are excellent in dispersibility, so that the abrasive particles 5 exist in the polishing layer 4 as aggregates. It becomes difficult. As a result, it is possible to significantly reduce the influence of aggregates that can generate large scratches on the surface to be polished. According to the polishing film 1 of the present invention, a material to be polished such as an electronic component or an optical component can be subjected to high precision processing.

When the polishing film 1 of the present invention is applied to the polishing of the end face of an optical fiber connector that requires extremely high-precision polishing, the polishing quality of the end face of the optical fiber connector can be remarkably improved. Therefore, the performance of the final optical fiber connector can be improved and the cost can be reduced.

Next, a method for producing the polishing film of the present invention will be described.

The method for producing a polishing film 1 of the present invention is a method for producing a polishing film having a base film 2 and a polishing layer 4 formed on the base film 2,
The feature is that abrasive particles 5 having an average primary particle diameter of 1 to 100 nm produced by a particle growth method are dispersed in a binder resin solution to prepare a coating solution, and the coating solution is prepared. On the base film 2 to form the polishing layer 4.

According to the method for producing a polishing film of the present invention having such characteristics, the polishing film 1 in which the dispersibility of the abrasive particles 5 in the polishing layer 4 is controlled can be produced.

As a specific method for producing the polishing film 1, first, a base film 2 having a predetermined thickness made of a polyester film, for example, biaxially stretched polyethylene terephthalate is prepared. Next, the primer layer 3 is formed on the base film 2 by coating or the like as necessary. Next, for example, zirconia particles, which are abrasive particles 5 having a predetermined primary particle average particle diameter, are mixed in a binder resin liquid containing a binder resin 6 and a binder resin solvent to prepare a coating liquid. At this time, the preferable mixing ratio of the abrasive particles 5 and the binder resin 6 is as described above. The coating liquid thus prepared is applied and formed on the base film 2 or on the primer layer 3 provided as needed. As a coating method at this time, various means such as a roll coating method, a gravure coating method, and a die coating method can be applied. Immediately after the application, at a predetermined temperature (for example, 110 ° C. to 120 ° C.) for a predetermined time (for example, 3 ° C.).
(Approximately 0 seconds), and the solvent in the coating layer is scattered into the atmosphere. Thus, the coating layer is dried, and the polishing layer 4 having a predetermined thickness (for example, 2 to 20 μm) is formed, and the polishing film 1 is manufactured.

[0051]

The polishing film of the present invention and the method for producing the same will be described below in more detail with reference to Examples and Comparative Examples. It goes without saying that the present invention is not limited to the following examples.

Example 1 200 parts by weight of zirconia particles having an average primary particle diameter of 20 nm (Osaka Sumitomo Cement Co., Ltd.) as abrasive particles 5, 50 parts by weight of an acrylic urethane resin solution as binder resin 6, and a silanol resin (Shin-Etsu) Chemical Industry Co., Ltd .: KR-251) 20 parts by weight, anionic dispersant 0.5 part by weight, isopropanol 20 as a solvent
After mixing 0 parts by weight, the mixture was stirred to prepare a coating liquid (a) for the polishing layer 4.

An easily adhesive polyethylene terephthalate film (T100E75, Mitsubishi Chemical Polyester Film Co., Ltd.) having a thickness of 75 μm was used as the base film 2, and the coating solution (a) for the polishing layer 4 was coated on one surface thereof. My
Abrasive layer 4 was formed by coating and drying at 5 g / m ² using abar to obtain a polishing film (A) which was an example of the present invention.

Using this polishing film (A), the end face of the optical fiber connector 11 having the optical fiber end face 14 was polished (see FIG. 2). The results are shown in Table 1. The end face after polishing had less scratches than before polishing, and connector characteristics such as return loss were also improved.

(Example 2) The optical fiber connector 11 polished in Example 1 was replaced with a commercially available final finish polishing film (Dainippon Printing Co., Ltd .: FOS-).
01). That is, in the second embodiment, the polishing in the first embodiment is the polishing before the final polishing, and the polishing in the second embodiment is the final polishing. The results are shown in Table 1. An optical fiber connector 1 which has no flaws on the end face after polishing and has excellent connector performance.
1 was obtained.

Example 3 200 parts by weight of cerium oxide particles having an average primary particle diameter of 12 nm (Cyan Kasei Co., Ltd., Nano Tek, gas phase reaction method) as abrasive particles 5, and an aqueous polyester resin (Toyo) as binder resin 6 Spinning Co., Ltd .: 100 parts by weight of Vironal MD1), 220 parts by weight of water, 60 parts by weight of n-butyl cellosolve as a solvent, and 20 parts by weight of aqueous isocyanate are well dispersed using a sand mill, and then a coating liquid for the polishing layer 4 (b) ) Was prepared.

As the base film 2, a 75 μm-thick polyethylene terephthalate film (IC I Japan Co., Ltd .: PET Meine with easy adhesion treatment)
x) was used to form a primer layer 3 for easy adhesion treatment for aqueous coating on one surface thereof. Next, the above-mentioned coating liquid (b) for a polishing layer, which was filtered with a filtration accuracy of 25 μm, was applied on the primer layer 3 by a roll coating method at 10 g / m ^2.
Coating and drying by heating were performed to form a polishing layer 4, thereby obtaining a polishing film (B) as an example of the present invention.

Using this polishing film (B), a semiconductor silicon wafer was polished. The surface of the polished silicon wafer was observed at a magnification of 1000 using a differential interference optical microscope (Olympus Optical Industries, Ltd .: BX-51).
No scratches or other scratches were found on the polished silicon wafer surface.

(Comparative Example 1) 200 parts by weight of zirconia powder 0.5 μm (manufactured by Showa Denko KK: Show Zirconia RZ) obtained by a pulverization method as abrasive particles, 50 parts by weight of an acrylic urethane resin liquid as a binder resin, and silanol After mixing 20 parts by weight of a resin (Shin-Etsu Chemical Co., Ltd .: KR-251), 0.5 parts by weight of an anionic dispersant, and 200 parts by weight of isopropanol as a solvent, the mixture is stirred and a coating liquid for the polishing layer 4 ( c) was prepared.

As the base film 2, an easily adhesive polyethylene terephthalate film having a thickness of 75 μm (Mitsubishi Chemical Polyester Film Co., Ltd .: T100E75) was used, and the coating solution (c) for the polishing layer 4 was coated on one surface. My
Abrasive layer 4 was formed by applying and drying to 5 g / m ² using abar to obtain a polishing film (C) as a comparative example product.

Using the polishing film (C), the end face of the optical fiber connector 11 having the optical fiber end face 14 was polished (see FIG. 2). The results are shown in Table 1. The polished optical fiber connector 11 has improved connector performance such as return loss, but has a high frequency of occurrence of end face scratches. Further, the performance (reflection attenuation and the like) of the optical connector which was subjected to the final finish polishing thereafter was not as good as the result obtained in Example 1.

[0062]

[Table 1]

The polishing characteristics of the optical fiber connector 11 are based on the optical fiber connector (MU type optical fiber connector:
Zirconia ferrule) is polished for 45 seconds using an optical fiber connector polishing machine (SFP-120 / 550, manufactured by Seiko Giken Co., Ltd.) equipped with each polishing film of the example product and the comparative example product. Microscope (× 800) and return loss measuring device (NTT-AT, AR-
In 301), the evaluation was made based on the result of inspection of the presence or absence of a flaw and the return loss of the optical fiber. The surface roughness of the fiber can be measured using a fiber end face three-dimensional shape system (NTT-AT Co., Ltd., A
CCIS NC3000-NT).

[0064]

As described above, according to the polishing film for ultra-precision processing of the present invention, a polishing layer having excellent polishing performance in which abrasive particles are well dispersed is provided, thereby enabling extremely fine and fine polishing. Let Also, since the abrasive particles are produced by the particle growth method, the size, shape, particle size distribution,
Modification of the particle surface and the like can be controlled, and the dispersibility of the abrasive particles in the polishing layer can be controlled, and the aggregates in the polishing layer can be reduced as much as possible. As a result, it is possible to significantly reduce the influence of aggregates that can generate large scratches on the surface to be polished.

The polishing film for ultra-precision processing of the present invention is an optical fiber connector comprising an optical fiber and a ferrule,
Finish polishing or intermediate polishing on the surface, end face, etc. of precision parts such as semiconductor wafers, metals, ceramics, color filters (for liquid crystal display, etc.), plasma displays, optical lenses, magnetic disks or optical disk substrates, magnetic heads, optical reading heads, etc. It can be suitably applied to a polishing film for general polishing. At this time, when used as a polishing film in the polishing step before the final finishing polishing step of the optical fiber connector, the polishing quality of the end face of the optical fiber connector in the final finishing polishing step can be significantly improved, and as a result, the final The performance of the optical fiber connector can be improved and the cost can be reduced.

According to the method for producing a polishing film for ultra-precision processing of the present invention, a polishing film for ultra-precision processing having the above-mentioned effect in which the dispersibility of abrasive particles in a polishing layer is controlled can be produced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of a layer configuration of a polishing film for ultra-precision processing of the present invention.

FIG. 2 is a cross-sectional view showing one mode of polishing an end face of an optical fiber connector using the polishing film for ultraprecision processing of the present invention.

[Description of Signs] 1 Polishing film for ultra-precision processing 2 Base film 3 Primer layer 4 Polishing layer 5 Abrasive particles 6 Binder resin 11 Optical fiber connector 12 Optical fiber 13 Ferrule 14 Optical fiber end face 15 Ferrule end face

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09K 3/14 550 C09K 3/14 550J G02B 6/00 335 G02B 6/00 335 // B24B 13/01 B24B 13/01 19/00 603 19/00 603A (72) Inventor Kiyoshi Oguchi 1-1-1 Ichigaya-Kaga-cho, Shinjuku-ku, Tokyo F-term in Dai Nippon Printing Co., Ltd. (reference) 2H038 CA22 3C049 AA07 AA09 AC04 CB01 CB03 3C063 AA03 BB01 BB07 BC03 BG08 CC01 CC11 EE01 FF23

Claims (7)

[Claims] 1. A polishing film having a base film and a polishing layer formed on the base film, wherein the polishing layer has a primary particle average particle diameter of 1 to 100 nm produced by a particle growth method. An abrasive film for ultra-precision processing, characterized in that abrasive particles within the range are contained in a binder resin. 2. The method according to claim 1, wherein the abrasive particles are a metal oxide or a metal composite oxide produced by a particle growth method including a vapor phase growth method, a liquid phase growth method, or a solid phase growth method. Item 7. The polishing film for ultra-precision processing according to Item 1. 3. The method according to claim 1, wherein the abrasive particles are zirconia particles produced by a sol-gel method or cerium oxide particles produced by a gas phase reaction method. Polishing film for ultra-precision processing. 4. The polishing film for ultra-precision processing according to claim 1, wherein said binder resin is a resin having a siloxane bond. 5. The polishing film for ultra-precision processing according to claim 1, wherein the polishing film is used for polishing an end face of an optical fiber connector. 6. A method for producing a polishing film having a substrate film and a polishing layer formed on the substrate film, wherein the primary particle average particle diameter produced by a particle growth method is 1 to 100 n.
The abrasive layer is formed by dispersing the abrasive particles in the range of m in a binder resin liquid to prepare a coating liquid, and applying and forming the coating liquid on the base film. Characteristic method for producing polishing film for ultra-precision processing. 7. The method according to claim 1, wherein the abrasive particles are zirconia particles produced by a sol-gel method or cerium oxide produced by a gas phase reaction method, and the binder resin is a silicone resin or a silicone resin. The method for producing a polishing film for ultra-precision processing according to claim 6.