JP2002261136A5 - - Google Patents

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Publication number
JP2002261136A5
JP2002261136A5 JP2001054671A JP2001054671A JP2002261136A5 JP 2002261136 A5 JP2002261136 A5 JP 2002261136A5 JP 2001054671 A JP2001054671 A JP 2001054671A JP 2001054671 A JP2001054671 A JP 2001054671A JP 2002261136 A5 JP2002261136 A5 JP 2002261136A5
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JP
Japan
Prior art keywords
pattern
foreign matter
secondary electron
charged particle
foreign
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001054671A
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English (en)
Japanese (ja)
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JP2002261136A (ja
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Publication date
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Priority to JP2001054671A priority Critical patent/JP2002261136A/ja
Priority claimed from JP2001054671A external-priority patent/JP2002261136A/ja
Publication of JP2002261136A publication Critical patent/JP2002261136A/ja
Publication of JP2002261136A5 publication Critical patent/JP2002261136A5/ja
Pending legal-status Critical Current

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JP2001054671A 2001-02-28 2001-02-28 異物検査方法 Pending JP2002261136A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001054671A JP2002261136A (ja) 2001-02-28 2001-02-28 異物検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001054671A JP2002261136A (ja) 2001-02-28 2001-02-28 異物検査方法

Publications (2)

Publication Number Publication Date
JP2002261136A JP2002261136A (ja) 2002-09-13
JP2002261136A5 true JP2002261136A5 (https=) 2005-01-20

Family

ID=18914969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001054671A Pending JP2002261136A (ja) 2001-02-28 2001-02-28 異物検査方法

Country Status (1)

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JP (1) JP2002261136A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100543467B1 (ko) * 2003-12-11 2006-01-20 삼성전자주식회사 미세 패턴 선폭 측정 방법 및 그 시스템
JP4857095B2 (ja) * 2005-12-07 2012-01-18 株式会社日立ハイテクノロジーズ 欠陥レビュー方法及びその装置
US7570800B2 (en) * 2005-12-14 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for binning defects detected on a specimen
JP4885590B2 (ja) * 2006-03-30 2012-02-29 東レエンジニアリング株式会社 半導体ウエーハ検査方法およびその装置

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