JP2002256245A - Composition for connecting circuit and heat seal connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a composition for connecting circuits capable of connecting the circuits having high reliability on stabilized connection resistance, forming a fine structure of the circuits and readily carrying out restoration of connecting parts, and to provide a heat seal connector. SOLUTION: This composition for connecting the circuits consists essentially of the following components (1) to (4) and has 0.1-15 vol.% content of pressure- deformable electroconductive particles based on the components (1), (2) and (4). (1) an epoxy reactive adhesive, (2) covered particles in which the surface of a curing agent for the reactive adhesive as a core is substantially covered with a film, (c) the pressure-deformable electroconductive particles obtained by covering the surface of the polymeric core material having a smaller average particle diameter than that of the covered particles with a metal thin layer and (4) a thermoplastic resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit connecting composition used for electrical connection between a display such as a liquid crystal display panel or a plasma display and a circuit board on which these drive system circuits are mounted. And heat seal connectors.

[0002]

2. Description of the Related Art As electronic components have become smaller and thinner, circuits used in them have become higher in density and higher in definition. Since connection between these fine circuits is difficult to handle with conventional solder or rubber connectors, recently, connection members such as anisotropic conductive adhesives, anisotropic conductive films, and heat seal connectors are frequently used. It has become. The method of using these connecting members is to provide a connecting member between circuits facing each other and to apply a pressurizing or heating pressurizing means to provide electrical connection between upper and lower circuits and simultaneously provide insulation between adjacent circuits. , And the circuits facing each other are bonded and fixed. As an adhesive component of these connection members, a thermosetting resin has been used for anisotropic conductive adhesives and anisotropic conductive films from the viewpoint of improving reliability (see Patent No. 2586154).

[0003] However, the application range of the connecting member has been expanded,
It has been required to respond to miniaturization of circuits, improve the curing reaction rate, and improve repair performance. In addition, for the heat seal connector, an adhesive made of a thermoplastic resin or a mixture of a thermoplastic resin and a thermosetting resin has been used as an anisotropic conductive adhesive on the upper part of the terminal portion,
It is inferior to thermosetting adhesives in reliability, and there has been a demand for improved reliability.

[0004]

In order to cope with miniaturization of a circuit, it is necessary to improve the connection stability by increasing the number of conductive particles. There are also problems such as an increase in number. In the circuit connecting step, the connection temperature may be increased to increase the curing reaction rate of the thermosetting adhesive.However, due to a decrease in the fluidity of the adhesive and the generation of bubbles inside the adhesive, the connection product is There has been a concern that the connection resistance between the upper and lower circuits varies greatly, and the reliability is reduced.

[0005] Further, as a problem of the thermosetting adhesive,
It is also difficult to regenerate the defective connection part, that is, the repair performance is low. This is because the adhesive is reticulated (cross-linked) in addition to the strong adhesion of the connection part, so that even if heated, the adhesive strength is less reduced and hardly soluble in solvents,
This is because it is extremely difficult to remove the defective part.
Therefore, in order to regenerate the defective connection part, it is necessary to adopt a forced peeling means such as immersing the defective connection part in a chemical solution such as a solvent, an acid, or an alkali, and swelling and peeling, or shaving off with a knife or the like. I couldn't get it. However, when these forcible peeling means are used, normal connection portions and wirings around the defective connection portion may be damaged, or some adhesive may remain on the removed surface. As a result, a highly reliable reconnection was not obtained, and reproduction and use were extremely difficult. Further, since a heat-sealing connector mainly uses a thermoplastic resin, it is not suitable for long-term reliability for heat-resistant applications, and is inferior to an adhesive using a thermosetting resin. For this reason, heat seal connectors have been used only for low-cost applications that do not require much heat resistance.

The present invention provides a circuit connection composition which enables connection of a highly reliable circuit with stable connection resistance, can respond to miniaturization of the circuit, and can easily regenerate the connection portion. , And a heat seal connector.

[0007]

That is, the present invention comprises the following (1) to (4) as essential components, and the content of the pressure-deformable conductive particles is reduced to the components (1) + (2) + (4). The present invention relates to a composition for circuit connection, which is 0.1 to 15% by volume, and a heat seal connector using the composition. (1) an epoxy-based reactive adhesive (2) a coating particle whose core is a curing agent of the reactive adhesive and whose surface is substantially covered with a film (3) an average particle size smaller than the coating particle Deformable conductive particles obtained by coating the surface of a high molecular core material with a thin metal layer (4) Thermoplastic resin

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing the state of a circuit connecting portion using the circuit connecting composition of the present invention, (a) to
(c) is a symbol indicating a process at the time of bonding. In FIG.
(a) between the upper circuit 4 and the lower circuit 5, a reactive adhesive 1, a coated particle 2 and a circuit connecting composition 7 composed of pressurized deformable conductive particles 3 having a smaller particle size than the coated particles 2. This shows the mounted state. (b) shows the reactive adhesive 1
Shows a state where the temperature rises to lower the viscosity, and the deformable conductive particles 3 are not deformed between the upper circuit 4 and the lower circuit 5.
At this time, the coating particles 2 have a larger particle size than the pressure-deformable conductive particles 3, so that they are broken by heating and pressure and dispersed in the adhesive, and as a result, the curing reaction proceeds rapidly. . (c) shows the heating and pressurizing state at the time of connection after a further lapse of time. The viscosity of the adhesive increases to increase the viscosity, and eventually the cured adhesive 6 is obtained. At this time, the press-deformable conductive particles 3 are deformed between the upper circuit 4 and the lower circuit 5 so as to make sufficient contact with both circuits, and can be fixed by the hardening adhesive 6. FIG.
3A and 3B are schematic cross-sectional views showing a state where the heat seal connector 8 of the present invention is used, wherein FIG. 3A shows a state before heating and pressurizing, and FIG. In FIG. 2, 9 is a flexible printed board, 10
Denotes a terminal portion, 11 denotes an electrode, and 12 denotes a substrate. The pressure-deformable conductive particles 3 are deformed by heating and pressing, and the terminal portion 10 and the electrode 11 are deformed.
Contact enough.

Examples of the reactive adhesive 1 include various synthetic resins such as epoxy, urea, melamine, guanamine, phenol, furan, diallyl phthalate, bismaleimide, triazine, polyester, polyurethane, polyvinyl butyral, polyamide, polyimide, and cyanoacrylate. And rubbers and elastomers containing a functional group such as a carboxyl group, a hydroxyl group, a vinyl group, an amino group, and an epoxy group, and these can be applied alone or as a mixture of two or more.

Among these reactive adhesives, epoxy-based reactive adhesives containing an epoxy resin alone or containing at least an epoxy resin in a component are known as quick-curing curable resins having various properties balanced. This is preferable because a product can be obtained. As these epoxy resins,
For example, a bisphenol-type epoxy resin derived from epichlorohydrin and bisphenol A or bisphenol F, and an epoxy novolak resin derived from epichlorohydrin and phenol novolak or cresol novolak are typical, and other glycidylamine, glycidyl ester, alicyclic, Various epoxy compounds having two or more oxirane groups in one molecule such as heterocyclic compounds can be applied. These can be used alone or in combination of two or more.

These epoxy resins have impurity ions (N
^{a +, K +, Cl -} , S0 4 2- , etc.) and hydrolyzable chlorine and the like each 300pp
It is preferable to use a so-called high-purity product reduced to m or less, in particular, a so-called ultra-high-purity product of 100 ppm or less in terms of preventing corrosion of the connection circuit. In addition, although the impurity ions may inhibit the curing reaction of the epoxy resin, use of a high-purity product provides quick curing properties, which is preferable in connection work. A curing accelerator or a curing catalyst may be added to the reactive adhesive 1, and a curing agent or a cross-linking agent may be added as long as the storage stability is not adversely affected. Further, general additives such as a solvent, a dispersion medium, a tackifier, a filler, an ultraviolet shrinking agent, an antioxidant, a polymerization inhibitor, and a coupling agent can be contained.

It is preferable to use a thermoplastic resin in combination, because it can impart film-forming properties, flexibility and repairability to the reactive adhesive. As these thermoplastic resins,
Polyester, polyurethane, polyvinyl butyral,
Polyarylate, acrylic rubber, phenoxy resin, polymethyl methacrylate, polystyrene, polyacetal, ABS, NBR, SBR, polyimide and silicone modified resin
(Acrylic silicone, epoxy silicone, polyimide silicone) and the like. One type of thermoplastic resin may be blended to satisfy film forming properties, repairability, and adhesive strength, but preferably a thermoplastic resin for film forming purposes and a thermoplastic resin for repairability purposes It is preferable to use at least two kinds of thermoplastic resins in combination. In addition, as the thermoplastic resin for the purpose of forming a film, a phenoxy resin or the like is preferable, and as the thermoplastic resin for the purpose of repairability, a phenoxy resin, polyester, or a silicone-modified resin that is easily soluble in a general-purpose solvent is preferable. And the like.

The coating particles 2 are composed of a hardener 13 as a core, a high molecular substance such as polyurethane, polystyrene, gelatin and polyisocyanate, an inorganic substance such as calcium silicate,
And a film 14 of a thin metal film such as nickel or copper. FIG. 3 shows an example of a schematic cross-sectional view of the coated particles 2. It is necessary that the average particle size of the coated particles 2 is larger than the average particle size of the pressure-deformable conductive particles 3 before deformation.
At the circuit connection part, when performing heating and pressing, the heating and pressing are given priority over the pressurized deformable conductive particles 3, and the coating of the coated particles 2 is deformed and destroyed, and the curing reaction is accelerated. is there. However, the average particle size of the coated particles 2 needs to be smaller than the thickness of the circuit connection composition 7 to prevent film destruction during storage. The shape of the particles is not particularly limited, but a smaller aspect ratio is preferable from the viewpoint of obtaining uniform reactivity.

As the curing agent 13 which is a core material of the coated particles 2, an appropriate amount of various known substances for the reactive adhesive 1 can be used. For example, when a curing agent in the case of an epoxy resin is exemplified, an aliphatic amine, an aromatic amine, a carboxylic acid inorganic substance, a thiol, an alcohol, a phenol,
Isocyanates, tertiary amines, boron complex salts, inorganic acids,
Various systems such as hydrazide and imidazole and modified products thereof can be employed. Of these, tertiary amines, boron complex salts, hydrazides, and imidazoles, which are fast-curing and excellent in connection workability, and which may act as a catalyst in ionic polymerization and have little consideration of chemical equivalents, are preferred. ,
These can be applied alone or as a mixture of two or more. The curing reaction using the coated particles 2 is preferably completed at the time of connection of the circuit, but it is sufficient that the reaction has progressed to a state where the deformation of the deformable conductive particles is maintained between the circuits,
In this state, post-curing can be further performed.

The coated particles 2 are of the heat activated type, that is, of the type in which the film is destroyed at a certain temperature, a more uniform reaction system can be obtained than that of the pressure activated type, so that the reliability of the minute connection is improved. Is preferred. The preferred thermal activation temperature of the circuit connecting composition 7 of the present invention is 40 to 250 ° C, more preferably 100 to 170 ° C. If the heat activation temperature is 40 ° C or lower, refrigerated storage is necessary because it is easily activated during storage, and 250 ° C
In the above, since it is necessary to make the temperature high at the time of connection, it is easy to cause thermal damage to the peripheral material of the connection portion. The thermal activation temperature used in the present invention is a differential scanning calorimeter (Differential Sca
nning Calorimetry, DSC) to obtain the composition 7 for circuit connection.
The peak temperature of the calorific value when the temperature is raised from room temperature at 10 ° C./min is shown.

The pressure-deformable conductive particles 3 are made of, for example, nickel, gold, silver, copper, solder, or the like on the surface of a polymer core material 15 such as polystyrene or acrylic resin.
The particles are covered with a conductive thin metal layer 16 having a size of not more than μm.
FIG. 4 shows an example of a schematic cross-sectional view of the pressure-deformable conductive particles 3. As described above, the pressure-deformable conductive particles 3 need to have a smaller average particle size than the coating particles 2. These pressure-deformable conductive particles 3 need to be deformed under heating and pressure at the time of circuit connection.
A temperature of 250 ° C. or less and a pressure of 100 kg / cm ² or less are generally used.

Examples of the polymer core material 15 include various plastics such as polystyrene, epoxy resin, acrylic resin and silicone resin, various rubbers such as styrene butadiene rubber and silicone rubber, and natural polymers such as cellulose, starch and squalene. Various additives such as a cross-linking agent, a curing agent, and an anti-aging agent can be used as the main components.

The thin metal layer 16 is made of various conductive metals, metal oxides, alloys and the like. The thin metal layer 16
It can be a single layer or a multilayer of two or more layers. Examples of the metal of the thin metal layer 16 include Zn, Al, Sb, Au, Ag, Sn,
There are Fe, Cu, Pb, Ni, Pb, Pt and the like, and these can be used alone or in combination (such as solder). further,
Other metals such as Mo, Mn, Cd, Si, Ta, and Cr, and compounds thereof can be added for special purposes, such as adjusting hardness and surface tension and improving adhesion. . Of these metals, from the viewpoint of conductivity and corrosion resistance, N
i, Ag, Au, Sn, Cu, Pb are preferably used.

As a method of forming the thin metal layer 16 on the polymer core material 15, a dry method such as a vapor deposition method, a sputtering method, an ion plating method, a thermal spraying method, a fluidized bed method, and an electroless plating method are applied. it can. Among these methods, an electroless plating method capable of obtaining a coating layer having a uniform thickness is preferable because of a wet dispersion system. The thickness of the thin metal layer 16 is usually 0.01 to 5 μm, preferably 0.05 to 1.0 μm.
The thickness of the thin metal layer 16 includes the metal base layer, if there is one. When the thickness of the thin metal layer 16 is in the above range, connection reliability is excellent in terms of conductivity and deformation of the polymer core material during circuit connection.

When the pressure-deformable conductive particles 3 are used for circuit connection, the polymer nucleus material is deformed by pressurization or heating and pressurization at the time of circuit connection, and the circuit surface or between the pressure-deformable conductive particles is interposed. Sufficient contact area can be obtained by appropriately deforming as if pressing, the rigidity and thermal expansion coefficient of the polymer core material are very close to the properties of the adhesive, and the thickness of the thin metal layer is, for example, 1 μm or less. Because it is thin and has deformability,
Since it has the followability to the expansion and contraction between the upper circuit 4 and the lower circuit 5, long-term connection reliability including temperature change is significantly improved.

The particle diameter of the pressure-deformable conductive particles 3 used in the present invention is 0.01 to 100 μm, preferably 1 to 50 μm, before deformation. When it is in the above range, it is excellent in the surface area of the pressure-deformable conductive particles and the insulating property in the plane direction. If the average particle size is within the above range, the shape of the pressure-deformable conductive particles 3 is not particularly limited, but in order to obtain good anisotropic conductivity, one having an aspect ratio as small as possible, for example, spherical, conical, etc. Are preferred. These pressure-deformable conductive particles may be used alone or in combination of two or more.

The content of the pressure-deformable conductive particles 3 is 0.1 to 15% by volume based on the adhesive component, that is, the reactive adhesive + the coating particles + the thermoplastic resin. When this value is in the range of 0.1 to 15% by volume, good anisotropic conductivity is exhibited.However, if it is less than 0.1% by volume, it is difficult to obtain conductivity in the thickness direction in connection of a fine circuit, and if it exceeds 15% by volume, an adjacent circuit is not obtained. The insulation between them cannot be obtained. For these reasons, in order to obtain highly reliable anisotropic conductivity, it is more preferable to set the value of the content of the pressure-deformable conductive particles in the range of 1 to 10% by volume.

As the base film of the flexible printed circuit board 9 used for the heat seal connector 8 of the present invention, a heat-resistant film such as polyester, polyimide, polyethylene sulfide, polyarylate, liquid crystal polymer or the like is used. The circuit part (terminal part 10) is printed with a conductive paste using a conductive material such as carbon, silver, copper, etc. A copper foil is laminated on a base film via an adhesive and a circuit is created by etching What did
After sputtering copper on the base film, the circuit was prepared by etching with copper plating, and on the base film, the circuit was prepared by etching a copper foil bonded to a film-forming varnish. After forming a thin film on the base film by sputtering or electroless plating of copper, forming a circuit and forming a copper plating on the circuit, one or more metals such as Ni, Au, Sn, etc. are plated to prevent corrosion Is used. In order to cope with miniaturization of the circuit, it is better that the thickness of the circuit is thin, and it is preferably 0.2 to 40 μm, particularly 2 to 20 μm.

In order to provide the composition 7 for circuit connection on the flexible printed circuit board 9, a screen printing method is effective. The screen printing method, for example, inject the composition for circuit connection into a closed print head (manufactured by Crossflow, trade name), install a metal mask on the terminal part of the flexible printed board, and arrange on the metal mask Printing is performed while extruding the composition for circuit connection using a sealed print head. By this method, the composition for circuit connection is provided only on the terminal portion. Then, by drying at low temperature,
The heat seal connector of the present invention in which the circuit connection composition is provided on the terminal portion of the flexible printed board is obtained.

[0025]

The present invention will be described in more detail with reference to the following examples. (Example 1) (1) Reactive adhesive Epicoat YL-983U (bisphenol-type epoxy resin, trade name, manufactured by Yuka Shell Epoxy Co., Ltd.) was used. (2) Coated particles Novacure HX-3941HP (dispersed in liquid epoxy resin, microencapsulated particles having an average particle size of 5 μm, whose core is a modified imidazole and whose surface is coated with cross-linked polyurethane, manufactured by Asahi Kasei Corporation) , Product name). (3) Pressure-deformable conductive particles AU-203 (manufactured by Sekisui Fine Chemical Co., Ltd.), which is a particle having an average particle size of 3 μm in which the surface of a crosslinked copolymer containing divinylbenzene as a main component is covered with a nickel layer and a gold layer. ,Product name)
It was used. (4) Thermoplastic resin YP50 (phenoxy resin, manufactured by Toto Kasei Co., Ltd., trade name) and U
E3300 (polyester resin, manufactured by Unitika, trade name) was used. (5) Silane coupling agent KBM403 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) was used.

The above (1) to (5) were dissolved in a solvent of toluene / MEK = 50/50 so as to have a ratio as shown in Table 1, and were blended so that the solid content became 35%. Then, the obtained solution is applied on a release-treated PET (polyethylene terephthalate) film 50 μm, dried at 60 ° C. for 15 minutes, and
A film-like connecting member having a thickness of μm was obtained. Considering the characteristics after long-term storage at room temperature,
All were evaluated after aging at 40 ° C. for 24 hours.

(Evaluation) Line width using the above connecting agent
Flexible printed circuit board with 300 copper circuits of 25μm, pitch 50μm, thickness 8μm, and a thin layer of indium oxide (ITO) on the whole surface (surface resistance 30Ω / port), thickness 1.1mm
Was connected at a connection width of 2 mm by heating and pressing at 190 ° C.-20 kg / cm ² -207 seconds. At this time, first, after bonding the bonding surface of the connecting member to indium oxide on the glass plate,
Temporary connection was performed at -5 kg / cm-3 seconds, and then the PET film of the separator was peeled off to connect to the flexible printed circuit board. Table 1 shows the evaluation results of the circuit connection products obtained as described above. The contents of each evaluation item shown in Table 1 are as follows. (Activation temperature) The peak temperature of DSC was measured when the temperature of the connection member was raised from 30 ° C. at a rate of 10 ° C./min. (Connection resistance) The resistance (Ω) of the adjacent circuit of the flexible printed circuit board including the connection part was measured with a multimeter and displayed as an average value and a maximum value (MAX). (Adhesive strength) The adhesive surface with the glass substrate was measured with a Tensilon universal testing machine (trade name, manufactured by A & D Company) (speed: 50 mm / min, work width: 10 mm, 90 ° peeling) . (Repairability) After curing, it was repaired with acetone and evaluated according to the following evaluation criteria. ○… Peel off, △… Peel off over time, ×… Partially remain

When the cross section of the connector of Example 1 was observed with a scanning electron microscope, the conductive particles were all greatly deformed in the pressing direction as shown in FIG. To the surface. In addition, good characteristics were obtained by aging at 40 ° C. for 24 hours in consideration of long-term storage, and good results were obtained with respect to acetone in terms of repairability.

Example 2 In Example 2, a thermoplastic polyimide silicone resin (X-22-8951, manufactured by Shin-Etsu Chemical Co., Ltd., trade name) was used in place of UE3300 used in Example 1. As a result of evaluation in the same manner as in Example 1, as shown in Table 1, good connection characteristics were obtained.

(Examples 3 to 5) In Examples 3 to 5, the amounts of the reactive adhesive, the coated particles and the thermoplastic resin were changed from those in Example 2, and all of them are shown in Table 1. Thus, good connection characteristics were obtained.

(Comparative Example 1) In Comparative Example 1, in place of AU-203 used in Example 2, a pressure-deformable conductive particle having a larger average particle diameter than a coated particle (crosslinked mainly containing divinylbenzene) AU-208 (trade name, manufactured by Sekisui Fine Chemical Co., Ltd.), which is a particle having an average particle size of 8 μm and whose surface is covered with a nickel layer and a gold layer, was used. Although the performance of both was almost the same, the adhesive strength was slightly lower than that of Example 2. Despite having the same composition, the difference in adhesive strength is that Comparative Example 1 was considered to have not yet completely cured, and used pressure-deformable conductive particles having an average particle size smaller than the coated particles. It can be seen that the curing speed is faster.

Comparative Example 2 In Comparative Example 2, X-22-8951 used in Example 3 was omitted. As a result, the adhesive strength was improved, but the repair performance was inferior to other formulations.

Example 6 A composition having the composition of Example 1 was injected into a closed print head (trade name, manufactured by Crossflow), and a copper circuit having a line width of 25 μm, a pitch of 50 μm, and a thickness of 8 μm was prepared.
A metal mask having a thickness of 50 μm was placed on a 300 flexible printed circuit board, and printing was performed while extruding a composition for circuit connection with a closed print head on the metal mask. Thereafter, the resultant was put into a hot-air dryer at 50 ° C. for 10 minutes to obtain a heat-seal connector having a terminal portion having an adhesive thickness of 17 μm. This was placed at 190 ° C. on indium oxide on a glass substrate in the same manner as in Example 1.
The connection was established by heating and pressing for -20 kg / cm ² -20 seconds. As a result, the connection resistance is 2-3Ω and there is no variation in connection resistance, and it can be connected to fine circuits.In addition, the pressure cooker test (PCT, 121 ° C, 100 hours) for this substrate
When the resistance value was measured, the connection resistance did not change, and a highly reliable heat seal connector was obtained.

(Comparative Example 3) As a heat seal connector, a thermoplastic resin type JC-DP (trade name, manufactured by Shin-Etsu Polymer Co., Ltd.) was used. Connect under the condition of 30 kg / cm ² -10 seconds,
When the resistance value was measured by performing a pressure cooker test (PCT, 121 ° C., 2 hours), an open occurred and the measurement became impossible. From this result, it can be seen that the reliability of Example 6 was improved compared to Comparative Example 3.

[0035]

[Table 1]

[0036]

According to the present invention, since the average particle size of the pressure-deformable conductive particles is smaller than the average particle size of the coating particles in the connecting member, the coating particles are added by heating and pressing the circuit connecting portion. Heat and pressure are preferentially received compared to the pressure-deformable conductive particles, and the coating of the coated particles deforms and breaks, and the curing reaction proceeds faster. In addition, the pressure-deformable conductive particles that deform later than the coated particles have a low viscosity due to the temperature rise of the reactive adhesive,
Because the adhesive is easily removed from the particle surface,
It can be deformed freely while in contact with the circuit, and
Due to the high temperature, the curing reaction proceeds rapidly. Therefore, the pressure-deformable particles can be fixed with the cured adhesive in a state where they are deformed between the circuits, so that contact with the circuits is sufficient, and there is no variation in connection resistance due to the pressure deformation, and a small area is obtained. A stable connection adaptable to the connection is obtained. Also, regarding the regeneration of the defective connection part, by blending a thermoplastic resin having repair performance, the adhesive after curing can be repaired because the thermoplastic resin is dissolved in a general-purpose solvent. Playback is also possible. Furthermore, the heat seal connector of the present invention using a thermosetting resin has improved heat resistance and improved reliability.
Therefore, the present invention is extremely advantageous for connection of electronic components such as wiring boards and semiconductors in which circuit miniaturization progresses.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a state of a circuit connecting portion using the circuit connecting composition of the present invention, and (a) to (c) are symbols showing steps at the time of bonding.

FIG. 2 is a schematic cross-sectional view showing a state in which a heat seal connector is used. FIG. 2 (a) shows a state before heating and pressurizing, and FIG.

FIG. 3 is a schematic sectional view showing an example of a coated particle.

FIG. 4 is a schematic cross-sectional view showing an example of a pressure-deformable conductive particle.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Reactive adhesive 9 ... Flexible printed circuit board 2 ... Coating particles 10 ... Terminal part 3 ... Pressure deformable conductive particles 11 ... Electrode 4 ... Upper circuit 12 ... Substrate 5 ... Lower circuit 13 ... Curing agent 6 ... Curing adhesive 14 ... Coating 7 ... Circuit connection composition 15 ... Polymer core material 8 ... Heat seal connector 16 ... Metal thin layer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/60 311 H01L 21/60 311R H01R 11/01 501 H01R 11/01 501E // H01B 5/16 H01B 5/16 F-term (reference) 4J040 BA012 BA102 CA062 DB022 DD072 DF002 DF052 DL042 EA012 EC061 EC071 EC091 EC121 EC281 ED002 EE062 EF002 EH032 EK032 HA066 HA076 HA136 HA316 JB02 KA03 KA16 KA32 LA03 DA04 DA03 5 AA02 AA07 HA02 HB03 HC01

Claims (3)

[Claims] (1) The following (1) to (4) are essential components, and the content of the pressure-deformable conductive particles is 0.1 to 15 volumes per component (1) + (2) + (4).
% For the circuit connection composition. (1) an epoxy-based reactive adhesive (2) a coating particle whose core is a curing agent of the reactive adhesive and whose surface is substantially covered with a film (3) an average particle size smaller than the coating particle Deformable conductive particles obtained by coating the surface of a high molecular core material with a thin metal layer (4) Thermoplastic resin 2. The composition according to claim 1, which has a thermal activation temperature (DSC peak temperature at a rate of temperature increase of 10 ° C./min) of 70-2.
A composition for circuit connection having a temperature of 00 ° C. 3. A heat seal connector having a structure in which the composition according to claim 1 is provided on a terminal portion of a flexible printed board.