JP2002254327A - Saw wire for wire saw and machining method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a saw wire for a wire saw that facilitates wire extraction from a workpiece even in machining with a wire saw using bonded abrasive grains, and a machining method using the saw wire. SOLUTION: The wire saw is of a type having abrasive grains fixed to the wire 1 and machining a workpiece with the bonded abrasive grains, and the wire 1 has grainless portions 1-2 with no abrasive grains 2 fixed in a part or a plurality of parts. After the wire saw is used to cut the workpiece, when the wire 1 is extracted from the workpiece, the grainless portion 1-2 of the wire 1 is moved into contact with the workpiece, and the wire 1 in the region of the grainless portion 1-2 thereof is extracted from the workpiece.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a saw wire of a type in which abrasive grains are fixed to a wire and a workpiece is processed by the fixed abrasive grains, and a processing method using the same.

[0002]

2. Description of the Related Art Conventionally, a wire saw for processing a workpiece with high accuracy and high productivity using a wire is, for example,
It is used to thinly slice silicon and quartz for semiconductors. Normally, in the processing using a wire saw, as shown in an example in FIG. 6, a wire 51 made of a piano wire or the like flows into and out of a wire 51 made of a grinding liquid and an abrasive 52 made of abrasive grains 52 such as GC. While work 53
This is done by pressing against and moving.

[0003] In the above-mentioned free abrasive processing with a wire saw, the processing speed is slow, the grinding oil scatters around, and cleaning after use is necessary. Abrasive wire has come to be used. In addition, from the environmental point of view, since free abrasive grains such as GC abrasive grains that become industrial waste are not used, processing by a wire saw using fixed abrasive grains has begun to attract attention.

FIG. 7 is a view for explaining an example of processing by a wire saw using fixed abrasive grains. As shown in FIG. 7, processing with a wire saw using fixed abrasives
This is performed by fixing abrasive grains 54 such as a diamond to the wire 51 by resin bonding, electrodeposition, or the like, and pressing and moving the wire 51 having the abrasive grains fixed to the work 53.

[0005]

As described above, in the processing by a wire saw using fixed abrasives, which has come to be used in recent years, since no free abrasives are used, industrial wastes are also environmentally friendly. There are many points that are more convenient than the processing by the wire saw using the free abrasive grains, such as less processing speed and high processing speed. However, with a wire saw,
As shown in the conceptual diagram of FIG. 8, one wire 51 stretched between the rollers 61 to 63 is pressed against the work 53 to be moved and cut. In order to cut by pulling out the wire 51, it is necessary to pull out the wire 51 upward through the cut portion of the work 53 after cutting.

At this time, as shown in FIG. 9 (a), in the case of a wire saw using loose abrasive grains, a clearance is formed between the wire 51 and the work 53 by the gap between the loose abrasive grains. Extraction of 51 is relatively easy. However, as shown in FIG. 9B, in the case of a wire saw using fixed abrasive grains, no clearance is generated between the wire 51 and the work 53, so that the wire 51 is caught and the wire is not easily pulled out. In addition, wire 5
Since the workpiece 1 itself has a cutting ability, the wire 51 cuts into the workpiece 53 depending on the undulation or distortion of the workpiece 53 after cutting, making it difficult to pull out the wire 51. This phenomenon was particularly remarkable when the workpiece was a soft material.

An object of the present invention is to solve the above-mentioned problems,
Even in processing with wire saw using fixed abrasive,
An object of the present invention is to provide a saw wire for a wire saw in which a wire is easily extracted from a work and a method for manufacturing the same.

[0008]

Means for Solving the Problems The wire for a wire saw of the present invention is a saw wire for a wire saw in which abrasive grains are fixed to the wire and a work is processed by the fixed abrasive grains. A plurality of portions are provided with non-abrasive grain portions that do not fix abrasive grains.

A method for processing a wire saw according to the present invention is a processing method using a saw wire as described above, wherein when a wire is extracted from a work after cutting the work, a non-abrasive portion of the wire is brought into contact with the work. And the wire is extracted from the work at the non-abrasive portion of the wire.

[0010] In the present invention, by providing a non-abrasive grain portion that does not fix abrasive grains on a part or a plurality of portions of the wire, when the wire is extracted from the work after cutting the work, the non-abrasive grain portion of the wire is removed from the work. The wire can be pulled out of the work at the non-abrasive portion of the wire. Therefore, when the wire is extracted from the work, the abrasive grains do not catch on the work, and the wire can be easily extracted from the work.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram showing a configuration of an example of a wire for a wire saw according to the present invention. In the example shown in FIG. 1, the wire 1 is, for example, the abrasive grains 2 abrasive portion 1-1 fixed by a resin bond or electrodeposition such diamond like wire body consisting of a piano wire, provided at both ends of the wire body A non-abrasive grain portion 1-2 that does not fix abrasive grains. In this example, the non-abrasive portions 1-
However, the present invention can also be achieved by using one of the ends and the other part as the non-abrasive part 1-2. The length of the non-abrasive portion 1-2 is not particularly limited. However, if the length is the same as the entire length of the portion that comes into contact with the workpiece in actual processing, the wire 1 can be easily and easily extracted at all cut portions. It is preferable because it is possible.

Next, a processing method using the saw wire for a wire saw of the present invention will be described. FIG. 2 (a),
(B), FIGS. 3 (a) and 3 (b) and FIGS. 4 (a) and 4 (b)
FIGS. 2A and 2B are conceptual diagrams showing a processing method using a saw wire according to the present invention in the order of steps, and FIGS. 2A and 2B show a state in which a workpiece is cut by a wire; FIGS.
4A and 4B show a state in which the cutting is completed, and FIGS. 4A and 4B show a state in which the wire is removed from the work after the completion of the cutting. 2 (b), 3 (b), and 4 (b) show views of the wire saw from above, but the work is omitted for convenience of explanation.

In each of the figures, the wire saw is
A wire bobbin 11-1 rotatably driving the wire 1 comprising the abrasive grain portion 1-1 and the non-abrasive grain portion 1-2 of the present invention;
11-2 and three main rollers 12-1 and 12
-2, 12-3 and two guide rollers 13-1, 13
, And is bridged as shown in FIG. At this time, as shown in FIG. 2B, the portions of the wire 1 facing the works 21-1 and 21-2 are separated from each other by an interval to be cut, and the three main rollers 12-1 and 12-2, 12
-3 is wound around the wire 1. Work 21
One end surfaces of -1 and 21-2 are adhesively fixed to dummy plates 22-1 and 22-2 made of glass, carbon, or the like, respectively. Then, the dummy plates 22-1, 22- 22, on which the works 21-1 and 21-2 are respectively adhered and fixed.
2 is further fixed to the base 23. Here, an example in which the two works 21-1 and 21-2 are cut at the same time has been described, but the number is not limited to two.
The present invention can be suitably applied to one or three or more. Also, here, an example is shown for a wire saw having three main rollers, but the number is not limited to three, and the present invention can be suitably applied to two or less or four or more. it can.

In processing, first, FIG.
As shown in (b), the position of the wire 1 is set so that all the parts that come into contact with the works 21-1 and 21-2 become the abrasive parts 1-1 of the wire 1. At that time, the non-abrasive portion 1-2 is wound around the reel bobbins 11-1 and 11-2. Then, as shown in FIGS. 2A and 2B, the wire saw is gradually moved in the double arrow direction while the wire 1 is alternately moved in the double arrow direction by driving the main roller. And the abrasive part 1-
The workpieces 21-1 and 21-2 are sliced with one diamond abrasive grain 2.

Then, as shown in FIGS. 3A and 3B, the slicing process is completed by cutting the wire 1 down to the glass plates 22-1 and 22-2. here,
Cutting the wire 1 down to the glass plates 22-1 and 22-2 and ending the slicing process is because the wire bends at the time of cutting, so there is a difference in the depth cut at both ends and the center of the work. It is.

Next, the wire 1 is connected to the workpieces 21-1 and 21-1.
Remove from -2. At the time of extraction, according to the present invention, FIG.
As shown in (a) and (b), workpieces 21-1 and 21-2
1-2, ie, workpieces 1-1 and 21-2
The position of the wire 1 is set, for example, by winding the wire 1 around one of the main rollers 11-2 so that the portion extracted through the cut portion of the wire 1 becomes the non-abrasive portion 1-2 of the wire 1. . In this state, the entire wire saw is gradually moved in the double arrow direction, so that the wire 1 is extracted from the works 21-1 and 21-2. At this time, only the portions of the wire 1 that may come into contact with the cut portions of the works 21-1 and 21-2 are abrasive-free portions 1-2.
The present invention can be achieved if, but since the position cannot always be specified, usually, for example, the entire fixed length from the end is the non-abrasive grain portion 1-2. When the non-abrasive portion 1-2 exists in a plurality of portions, the abrasive portion 1-
It is preferable to use the non-abrasive grain portion 1-2 of a portion close to 1 because the movement time of the wire 1 can be reduced.

As described above, when the wire 1 is extracted from the work 21-1 (21-2) after the work is cut, the non-abrasive grain portion 1-2 of the wire 1 is used.
As shown in FIG.
-1 (21-2), when passing through the cut portion 31, the wire 1 does not catch on the cut portion 31,
The wire 1 can be easily and easily connected to the work 21-1 (21-
2) can be extracted. In addition, the cut part 3
Even if the wire 1 comes into contact with the cut portion 31 due to undulation or distortion in the shape of the wire 1, the wire 1 is in the non-abrasive portion 1-2 and has no abrasive grains.
There is no need to cut into -2).

The feature of the present invention resides in that the configuration of the wire 1 is composed of the abrasive grain portion 1-1 and the non-abrasive grain portion 1-2, and the wire saw itself can be a conventionally known wire saw. it can.

[0019]

As is clear from the above description, according to the present invention, since a non-abrasive grain portion that does not fix abrasive grains is provided on a part or a plurality of portions of the wire, the workpiece is cut from the workpiece. When extracting the wire, the non-abrasive portion of the wire is moved to a portion in contact with the work, and the wire can be extracted from the work at the non-abrasive portion of the wire.
Therefore, when the wire is extracted from the work, the abrasive grains do not catch on the work, and the wire can be easily extracted from the work.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an example of a wire used in a wire saw of the present invention.

FIGS. 2A and 2B are conceptual diagrams showing one step of a processing method using a saw wire for a wire saw of the present invention.

FIGS. 3A and 3B are conceptual diagrams showing other steps of a processing method using a saw wire for a wire saw according to the present invention, respectively.

FIGS. 4A and 4B are conceptual views showing still another step of the processing method using the saw wire for a wire saw of the present invention.

FIG. 5 is a diagram showing a state when a wire is extracted from a work in the present invention.

FIG. 6 is a view for explaining an example of processing by a wire saw using loose abrasive grains.

FIG. 7 is a view for explaining an example of processing by a wire saw using fixed abrasive grains.

FIG. 8 is a conceptual diagram showing an example of processing by a wire saw.

9A is a view for explaining extraction of a wire from a work in processing by a wire saw using loose abrasive grains, and FIG. 9B is a diagram for explaining wire removal in processing by a wire saw using fixed abrasive grains. It is a figure for explaining extraction from a work.

FIG. 10 is a diagram showing an example of a slicing process using a wire saw.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Wire, 1-1 abrasive part, 1-2 non-abrasive part, 2 abrasive, 11-1, 11-2 reel bobbin, 1
2-1 to 12-3 Main roller, 13-1, 13-
2 Guide roller, 21-1, 21-2 Work, 2
2-1, 22-2 Dummy plate, 23 base, 31
Cutting part

Continued on the front page F term (reference) 3C058 AA05 AA09 BC03 CB04 DA03 3C063 AA08 AB09 BA16 BA24 BB02 BC02 BC03 BG01 EE31 3C069 AA01 BA06 BB01 BB02 BB03 CA02 CA04 EA01 EA05

Claims (3)

[Claims] 1. A saw wire for a wire saw in which a workpiece (hereinafter referred to as a work) is processed by a fixed abrasive wire in which abrasive grains are fixed to the wire. A saw wire provided with a non-abrasive portion that does not fix the abrasive. 2. The saw wire for a wire saw according to claim 1, wherein the length of the non-abrasive portion of the wire is the same as the length of a portion used for machining by contacting a workpiece. 3. A processing method using a saw wire for a wire saw according to claim 1 or 2, wherein when the work is cut off and the wire is removed from the work, a portion where the non-abrasive grain portion of the wire comes into contact with the work. And extracting the wire from the workpiece at the non-abrasive portion of the wire.