JP2002246782A - Evaporation cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To use an evaporation cooling device for cooling a heat-generating electronic component, such as a rectifier diode which is used at an arbitrary angle ranging from vertical state and the horizontal state. SOLUTION: In the device, in which a heat-receiving section 11 is connected to a heat-dissipating section 13 via a connection section 15, a first tank member 23 is arranged in the section 13 so as to be arranged with a prescribed interval parallel to the heat-receiving face 17b of the section 11, and the section 11 is connected to the member 23 via the section 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a boiling cooling device for cooling an electronic component that generates heat, such as a rectifier diode.

[0002]

2. Description of the Related Art Conventionally, as a boiling cooling device for cooling an electronic component that generates heat, such as a rectifier diode, for example, a cooling device disclosed in Japanese Patent Application Laid-Open No. 2000-21380 is known. FIG. 19 shows a boiling cooling device of this type. In this boiling cooling device, a heat receiving section 1 and a heat radiating section 2 are connected via a connecting section 3.

[0003] The heat receiving section 1 and the heat radiating section 2 are located on the same plane. In such a boiling cooling device, heat from the electronic components 4 arranged in the heat receiving unit 1 is transmitted to the refrigerant in the heat receiving unit 1, and the boiling refrigerant is guided to the heat radiating unit 2 via the connection unit 3. . Then, the refrigerant boiling in the heat radiating section 2 is cooled and condensed, and is returned to the heat receiving section 1.

[0004]

However, in such a conventional boiling cooling device, as shown in FIG.
When the boiling cooling device is tilted from the vertical state, the cooling performance decreases relatively slowly until the angle θ is about 30 degrees, but when the angle θ exceeds 45 degrees, the cooling performance deteriorates remarkably. I do.

[0005] Therefore, in the conventional boiling cooling device, the boiling cooling device cannot be used at a large inclination, for example, in a horizontal state. For example, when the boiling cooling device is mounted on a vehicle such as an automobile, the layout of the device is very low. There was a problem that would be difficult. The present invention has been made to solve such a conventional problem, and has as its object to provide a boiling cooling device that can be used at an arbitrary inclination angle from a vertical state to a horizontal state.

[0006]

According to a first aspect of the present invention, there is provided a boiling cooling apparatus comprising a heat receiving section and a heat radiating section connected to each other via a connecting section, wherein a first tank member is disposed at the heat radiating section. And the first tank member is arranged at an interval parallel to the heat receiving surface of the heat receiving unit, and the heat receiving unit and the first tank member are connected via the connection unit. Features.

According to a second aspect of the present invention, there is provided the boiling cooling apparatus according to the first aspect, wherein the heat radiating section includes a plurality of tubes disposed between the first tank member and the second tank member. And the first tank member is partitioned by a partition member to form a refrigerant inflow portion and a refrigerant outflow portion, and a refrigerant outflow portion formed in the heat receiving portion is formed by the refrigerant inflow portion of the first tank member. And a refrigerant inflow portion formed in the heat receiving portion is connected to the refrigerant outflow portion of the first tank member through the connection portion.

According to a third aspect of the present invention, there is provided the boiling cooling device according to the first or second aspect, wherein a third tank member is arranged on the connection portion side of the heat receiving portion. . According to a fourth aspect of the present invention, in the boiling cooling apparatus according to the third aspect, the first tank member and the third tank member are integrally formed via a connecting portion. I do.

According to a fifth aspect of the present invention, in the boiling cooling device according to any one of the first to fourth aspects, a cooling fan is arranged at a step formed by the connecting portion. Features.

(Operation) In the boiling cooling device of the first aspect, the first tank member is disposed and used so as to be above the heat receiving portion.

[0011] For example, when the heat receiving portion is arranged horizontally, a step portion is formed in a vertical direction by a connecting portion connecting the first tank member and the heat receiving portion. Therefore, even when the heat receiving section is arranged horizontally, the refrigerant present in the liquid state in the heat receiving section does not flow into the heat radiating section side, and there is always sufficient refrigerant in the heat receiving section.

Further, since the liquid state refrigerant present on the heat radiating portion side is stored in the first tank member, the cooling performance of the heat radiating portion is reliably maintained. In the boiling cooling device according to the second aspect, the refrigerant in the heat receiving unit evaporates due to the amount of heat generated from a heating element such as an electronic component mounted on the heat receiving unit, and the evaporated refrigerant passes through the connecting portion from the refrigerant outlet of the heat receiving unit. The refrigerant flows into the refrigerant inflow portion of the first tank member.

[0013] The refrigerant flowing into the refrigerant inflow portion of the first tank member flows through the tube into the second tank member, and flows from the second tank member through the tube into the refrigerant outflow portion of the first tank member. I do. Then, the evaporated refrigerant is cooled and condensed while passing through the tube. The condensed refrigerant is
From the refrigerant outflow part of the first tank member, the refrigerant flows into the heat reception part from the refrigerant inflow part of the heat reception part through the connection part, and is recirculated to the heat reception part.

According to the third aspect of the present invention, the third tank member is arranged on the connection portion side of the heat receiving portion, and the third tank member accommodates the refrigerant in a liquid state. In the boiling cooling device according to the fourth aspect, the first tank member and the third tank member are integrally formed via the connection portion. In the boiling cooling device according to the fifth aspect, the cooling fan is disposed at the step formed by the connecting portion.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. (First Embodiment) FIGS. 1 and 2 show a first embodiment of a boiling cooling apparatus according to the present invention. This boiling cooling device is configured by connecting a heat receiving unit 11 and a heat radiating unit 13 via a connecting unit 15.

The heat receiving section 11 is formed by a multi-hole tube 17. The multi-hole tube 17 is made of aluminum having good heat conductivity. As shown in FIG. 3, the multi-hole tube 17 has a large number of holes 17a serving as refrigerant passages formed in parallel.

The end of the multi-well tube 17 is sealed by a patch end 19. Multi-hole tube 1
7 are heat receiving surfaces 17b, on which electronic components 21 are mounted. The heat radiating section 13 is configured by forming a core 27 between the first tank member 23 and the second tank member 25.

The first tank member 23 and the second tank member 25 are formed of aluminum. The core portion 27 is configured by arranging corrugated fins 31 between a number of tubes 29. The tube 29 and the corrugated fin 31 are formed of aluminum.

The connecting portion 15 is connected to the first tank member 23. The connecting portion 15 is formed by bending the multi-hole tube 17. In this embodiment, the first tank member 23 is connected to the heat receiving surface 17 of the heat receiving portion 11.
It is arranged at an interval parallel to b.

The first tank member 23 is disposed so as to be perpendicular to the direction of the hole 17a of the multi-well tube 17. Therefore, a step portion 33 having a predetermined length is formed between the first tank member 23 and the heat receiving portion 11. Further, a cooling fan 35 is disposed in the step portion 33 as shown in FIG.

The cooling fan 35 includes the fan 37 and the motor 3
9 and a bracket 41 on the back of the heat radiating section 13.
Has been fixed through. In the boiling cooling device described above,
The refrigerant in the heat receiving unit 11 evaporates due to the amount of heat generated from the electronic components 21 mounted on the heat receiving unit 11, and the evaporated refrigerant flows into the first tank member 23 through the connection unit 15.

The refrigerant flowing into the first tank member 23 is
It flows into the second tank member 25 through the tube 29, and flows into the first tank member 23 from the second tank member 25 through the tube 29. Then, the evaporated refrigerant is cooled and condensed while passing through the tube 29. The condensed refrigerant is recirculated from the first tank member 23 through the connection part 15 to the heat receiving part 11.

In the above-mentioned boiling cooling device, as shown in FIG. 4, the device can be used at an arbitrary inclination angle from a vertical state to a horizontal state. That is, FIG. 4A shows a state in which the boiling cooling device is used in a vertical state. In this vertical state, the heat receiving section 11 and the heat radiating section 13 are arranged vertically, and the connecting section 15 is arranged horizontally.

The heat radiating section 13 is located above the heat receiving section 11. FIG. 4B shows a state in which the boiling cooling device is used at a predetermined angle θ, for example, 45 degrees from the vertical state. In this state, the heat receiving section 11 and the heat radiating section 13 are arranged at an angle θ from the vertical, and the connecting section 15 is also arranged at an angle θ from the horizontal.

The heat radiating section 13 is located above the heat receiving section 11. FIG. 4C shows a state in which the boiling cooling device is used in a horizontal state. In this horizontal state,
The heat receiving section 11 and the heat radiating section 13 are arranged horizontally, and the connecting section 15 is arranged vertically. The heat radiating unit 13 is located above the heat receiving unit 11.

In this horizontal state, the first tank member 23
The step portion 33 is formed in the up-down direction by the connecting portion 15 connecting the heat receiving portion 11 and the heat receiving portion 11, so that the refrigerant existing in the liquid state in the heat receiving portion 11 does not flow into the heat radiating portion 13 side, and Will always have sufficient refrigerant. In addition, since the liquid refrigerant present on the heat radiating portion 13 side is stored in the first tank member 23, the cooling performance of the heat radiating portion 13 is reliably maintained.

FIG. 5 is a thermal resistance diagram of the above-described boiling cooling apparatus, in which the vertical axis represents the thermal resistance and the horizontal axis represents the inclination angle θ of the apparatus. From this figure, the inclination angle θ of the device is 0
From 90 degrees to 90 degrees, the thermal resistance did not increase significantly, indicating that the device had sufficient cooling performance from the vertical state to the horizontal state.

FIG. 6 is a thermal resistance diagram of the conventional boiling cooling device shown in FIG. 18, where the vertical axis represents the thermal resistance and the horizontal axis represents the inclination angle θ of the device. From this figure, it can be seen that in the conventional apparatus, when the inclination angle θ exceeds 30 degrees, the thermal resistance greatly increases, and when the inclination angle θ exceeds 45 degrees, the cooling performance deteriorates extremely.

(Second Embodiment) FIGS. 7 and 8 show a second embodiment of the boiling cooling device of the present invention. In this embodiment, the heat radiating section 13 includes the first tank member 23.
Between the second tank member 25 and the plurality of tubes 29
Are arranged. The corrugated fins 31 are arranged between the tubes 29.

The first tank member 23 is partitioned by a partition member 43, and a refrigerant inflow portion 23a and a refrigerant outflow portion 23b are formed. Then, a third tank member 45 is disposed on the connection part 15 side of the heat receiving part 11. The third tank member 45 is partitioned by a partition member 47, and a refrigerant outflow portion 45a and a refrigerant inflow portion 45b are formed.

The refrigerant outflow portion 45a of the third tank member 45
Is connected to the refrigerant inflow portion 23 a of the first tank member 23 via a refrigerant introduction pipe 49. The refrigerant inflow portion 45b of the third tank member 45 is connected to the first tank member 23.
Is connected via a refrigerant return pipe 51 to the refrigerant outflow portion 23b. The heat receiving section 11 includes the third tank member 4.
A circulation path 53 for guiding the refrigerant from the fifth refrigerant inflow portion 45b to the refrigerant outflow portion 45a of the third tank member 45 is formed.

In this embodiment, the heat receiving section 11 is formed by a multi-hole tube 17. The multi-hole tube 17 is made of aluminum having good heat conductivity. As shown in FIG. 9, the multi-hole tube 17 has a large number of holes 17a serving as refrigerant passages formed in parallel.

The patch end 19 is mounted on the multi-well tube 17 on the side opposite to the third tank member 45. A passage portion 17b is formed between the patch end 19 and the end surface of the multi-well tube 17. In this embodiment, the electronic component 21 is biased toward the refrigerant outflow portion 45a of the third tank member 45 in the multi-hole tube 17.
Is installed.

In this embodiment, the same members as those in the first embodiment are denoted by the same reference numerals, and the detailed description is omitted. In the boiling cooling device of this embodiment, the heat receiving unit 1
The refrigerant in the heat receiving unit 11 evaporates due to the amount of heat generated from a heating element such as the electronic component 21 mounted on the first component 1, and the evaporated refrigerant passes through the refrigerant introduction pipe 49 from the refrigerant outflow part 45 a of the third tank member 45 and passes through the refrigerant introduction pipe 49. Refrigerant inflow portion 23a of the first tank member 23
Flows into.

The refrigerant inflow portion 23a of the first tank member 23
Flows into the second tank member 25 through the tube 29, and flows from the second tank member 25 into the tube 2.
9, the refrigerant flows into the refrigerant outflow portion 23b of the first tank member 23. Then, the evaporated refrigerant is cooled and condensed while passing through the tube 29. The condensed refrigerant flows from the refrigerant outflow portion 23b of the first tank member 23, passes through the refrigerant return pipe 51, flows from the refrigerant inflow portion 45b of the third tank member 45 into the hole portion 17a of the multi-well tube 17, and passes through the passage. It is recirculated through the portion 17b to the position of the electronic component 21.

In this embodiment, the same effects as in the first embodiment can be obtained. And in the boiling cooling device of this embodiment, since the refrigerant circulation cycle is formed between the heat receiving part 11 and the heat radiating part 13, the flow of the refrigerant is smooth and the cooling performance can be improved. Further, in the boiling cooling device of this embodiment, since the third tank member 45 is disposed on the connection portion 15 side of the heat receiving portion 11, the refrigerant in the liquid state is accommodated in the third tank member 45 to receive the heat. The refrigerant can be reliably supplied to the section 11.

(Third Embodiment) FIG. 10 shows a third embodiment of the boiling cooling device of the present invention. In this embodiment, the heat radiating section 13 is housed in the housing 55, and the electronic component 21 is protected. Then, the first tank member 23
The third tank member 45 and the third tank member 45 are integrally formed via the connection portion 15.

The opening 55a formed in the upper part of the housing 55 is hermetically sealed by the integral molding 57. FIGS. 11 to 13 show details of the boiling cooling device according to this embodiment. The first tank member 23, the third tank member 45, the refrigerant introduction pipe 49, and the refrigerant return pipe 51 are shown in FIGS.
However, the two plate members 59 and 61 are joined and integrally formed.

The two plate members 59 and 61 are made of aluminum and brazed to each other. On one plate member 59, a half 59a of the first tank member 23, a half 59b of the third tank member 45, a half 59c of the refrigerant introduction pipe 49, and a half 59d of the refrigerant return pipe 51 are provided, for example. The protrusion is formed by press working. The other plate 6
1 includes a half 61a of the first tank member 23, a half 61b of the third tank member 45, and a half 61 of the refrigerant introduction pipe 49.
c and a half 61 d of the refrigerant return pipe 51 are formed to protrude, for example, by press working.

Accordingly, by joining the two plate members 59 and 61, the first tank member 23, the third tank member 45, the refrigerant introduction pipe 49 and the refrigerant return pipe 51 are formed. A plurality of bolt holes 59 are provided in the two plate members 59 and 61.
e, 61e are formed. And two plate members 5
As shown in FIG.
5a is fixed by bolts 63.

In this embodiment, the same members as those in the second embodiment are denoted by the same reference numerals, and detailed description is omitted. In this embodiment, the same effect as in the first embodiment can be obtained.

In the boiling cooling device of this embodiment, the first tank member 23 and the third tank member 45 are integrally formed by the two plate members 59 and 61 via the connecting portion 15, so that Since it is not necessary to separately process and assemble the first tank member 23, the third tank member 45, the refrigerant introduction pipe 49, and the refrigerant return pipe 51, workability and assemblability can be improved.

Further, in the boiling cooling device of this embodiment,
The opening 55a of the housing 55 can be easily and reliably sealed. That is, FIG. 14 shows the first tank member 23,
The mounting structure of the boiling cooling device to the housing 55, in which the third tank member 45, the refrigerant introduction pipe 49, and the refrigerant return pipe 51 are formed as separate members, is shown.

In this mounting structure, the first tank member 23
The brackets 65 and 67 are fixed to the third tank member 45 and the brackets 65 and 67 are attached to the lid member 6.
9 is fixed by bolts 71. Then, the lid member 69 is fixed to the opening 55 a of the housing 55 by a bolt 73.

A hole 69 a into which the end of the heat receiving portion 11 is inserted is formed in the lid member 69, and a sealant 75 is filled between the hole 69 a and the heat receiving portion 11. That is, in the boiling cooling device of this embodiment, the bracket 6
5, 67 and the lid member 69 become unnecessary, and since the hole 69a of the lid member 69 does not need to be sealed with the sealing agent 75, the opening 55a of the housing 55 can be easily and reliably sealed. become.

In FIG. 14, the same members as those of the second embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. (Fourth Embodiment) FIG. 15 shows a fourth embodiment of the boiling cooling device of the present invention.

In this embodiment, the heat receiving section 11 is formed by a flat plate member 77 and a tube sheet 79. The flat plate member 77 and the tube sheet 79 are made of aluminum and brazed to each other. Tube sheet 79
As shown in FIG. 16, the device has a wavy portion 79a on which wavy irregularities are formed, and a flat portion 79b on which no wavy irregularities are formed.

The protruding portion of the corrugated portion 79a toward the flat plate member 77 is joined to the flat plate member 77. The flat part 79b
It is formed so as to protrude toward the opposite side to the flat plate member 77, thereby forming a passage portion for the refrigerant. A joining portion 79c joined to the flat plate member 77 is formed along the outer periphery of the tube sheet 79.

In this embodiment, the electronic component 21 is fixed to the heat receiving section 11 by bolts 81.
A screw hole 83 into which the bolt 81 is screwed is formed in the heat receiving portion 11. The pitch of the wavy irregularities of the tube sheet 79 is increased at the position where the screw hole 83 is formed, and is set as the screw hole portion 79d.

In the boiling cooling device of this embodiment, the pitch of the corrugated irregularities of the tube sheet 79 is increased at the position where the screw holes 83 are formed, and the screw holes 79d are formed in the tube sheet 79. Can be reliably formed without breaking through. Since the processing of the tube sheet 79 is performed by, for example, press working, the position of the screw hole 79d can be changed relatively easily by changing the shape of the mold.

FIG. 17 shows that the heat receiving part 11 is a multi-hole tube 1
7 shows an example in which the hole 1 is formed.
The pitch of 7a is increased at the position of the screw hole 17e. However, such a multi-well tube 1
7 is generally mass-produced by extrusion of aluminum, and a multi-hole tube tube 17 having a different pitch of the hole portion 17a becomes a special order and becomes very expensive.

That is, in this embodiment, the heat receiving section 11
Is formed by the flat plate member 77 and the tube sheet 79, so that the heat receiving portion 11 can be manufactured at a lower cost than when the multi-hole tube 17 is used. Further, the patch end 19 can be made unnecessary. In the above-described embodiment, an example in which the first tank member 23, the second tank member 25, and the third tank member 45 are formed in a cylindrical shape has been described. However, the present invention is not limited to such an embodiment. Instead, for example, it may be formed in a rectangular cylindrical shape.

In the above-described embodiment, the heat receiving portion may be formed by joining two plate members 85 as shown in FIG. That is, the two plate members 85 are each formed with a circular protruding portion 85a, and the tip surfaces of these protruding portions 85a are joined to each other. A passage is formed between the protruding portions 85a.

[0054]

As described above, in the boiling cooling device according to the first aspect, for example, when the heat receiving portion is arranged horizontally,
Since the connecting portion connecting the first tank member and the heat receiving portion forms a step portion in the vertical direction, the device can be used at any inclination angle from the vertical state to the horizontal state.

According to the second aspect of the present invention, since the refrigerant circulation cycle is formed between the heat receiving portion and the heat radiating portion, the flow of the refrigerant is smooth and the cooling performance can be improved. In the boiling cooling device according to the third aspect, since the third tank member is disposed on the connection portion side of the heat receiving portion, the refrigerant in the liquid state is accommodated in the third tank member, so that the refrigerant is reliably sent to the heat receiving portion. Can be supplied.

According to the fourth aspect of the present invention, since the first tank member and the third tank member are integrally formed via the connecting portion, workability and assemblability can be improved. In the boiling cooling device according to the fifth aspect, since the cooling fan is disposed at the step formed by the connecting portion, the device can be made compact.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of a boiling cooling device of the present invention.

FIG. 2 is a side view showing the boiling cooling device of FIG. 1;

FIG. 3 is an exploded perspective view showing the heat receiving unit of FIG.

FIG. 4 is an explanatory diagram showing a use state of the boiling cooling device of FIG. 1;

FIG. 5 is an explanatory diagram showing a relationship between an inclination angle and a thermal resistance of the boiling cooling device of FIG.

FIG. 6 is an explanatory diagram showing a relationship between a tilt angle and a thermal resistance of a conventional boiling cooling device.

FIG. 7 is a perspective view showing a second embodiment of the boiling cooling device of the present invention.

FIG. 8 is a side view showing the boiling cooling device of FIG. 7;

FIG. 9 is a top view showing the heat receiving unit of FIG. 7;

FIG. 10 is an explanatory view showing a third embodiment of the boiling cooling device of the present invention.

FIG. 11 is a side view showing the boiling cooling device of FIG. 10;

FIG. 12 is a front view showing the boiling cooling device of FIG. 10;

FIG. 13 is a top view showing the boiling cooling device of FIG. 10;

14 is a side view showing a structure for attaching the boiling cooling device of FIG. 7 to a housing.

FIG. 15 is an explanatory diagram showing a fourth embodiment of the boiling cooling device of the present invention.

FIG. 16 is a top view showing the tube sheet of FIG.

FIG. 17 is an explanatory view showing a heat receiving unit using a multi-hole tube.

FIG. 18 is an explanatory diagram showing a heat receiving unit using two plate members.

FIG. 19 is an explanatory view showing a conventional boiling cooling device.

[Explanation of symbols]

 Reference Signs List 11 heat receiving portion 13 heat radiating portion 15 connecting portion 17b heat receiving surface 21 electronic component 23 first tank member 23a refrigerant inflow portion 23b refrigerant outflow portion 25 second tank member 29 tube 33 step portion 35 cooling fan 43 partitioning member 45 third Tank member 45a Refrigerant outflow part 45b Refrigerant inflow part 47 Partition member 49 Refrigerant introduction pipe 51 Refrigerant return pipe

Claims (5)

[Claims] 1. A boiling cooling device comprising a heat receiving part (11) and a heat radiating part (13) connected via a connecting part (15), wherein the heat radiating part (13) has a first tank member (23). And the first tank member (23) is arranged at an interval in parallel with the heat receiving surface (17b) of the heat receiving portion (11), and the heat receiving portion (11) and the first tank member are arranged. (23) is connected via said connection part (15). 2. The boiling cooling device according to claim 1, wherein the heat radiating section (13) is connected to the first tank member (23).
A plurality of tubes (29) are arranged between the first tank member (25) and the second tank member (25), and the first tank member (23) is partitioned by a partition member (43), and a refrigerant inflow portion ( 23a) and a refrigerant outflow portion (23b), and the refrigerant outflow portion (45a) formed in the heat receiving portion (11) is connected to the refrigerant inflow portion (23) of the first tank member (23).
a) through the connection part (15), and connects the refrigerant inflow part (45b) formed in the heat receiving part (11) to the first part.
The cooling device is connected to the refrigerant outlet portion (23b) of the tank member (23) through the connection portion (15). 3. The boiling cooling device according to claim 1, wherein a third tank member (45) is arranged on the connection part (15) side of the heat receiving part (11). And a boiling cooling device. 4. The boiling cooling device according to claim 3, wherein the first tank member (23) and the third tank member are integrally formed via a connection portion (15). Characterized boiling cooling device. 5. The boiling cooling device according to claim 1, wherein a cooling fan (35) is arranged in a step (33) formed by the connecting part (15). A boiling cooling device, characterized in that: