JP2002245608A - Slider processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a slider processing method capable of accurately processing a shape without forming any step differences in the air flow-in end of an air lubricating surface, which cause variance in floating amounts, and without exposing the cut surfaces of cut wafers arranged adjacently to each other, when a wafer having a plurality of head elements formed on its surface is cut, and an air lubricating surface is formed on the cut surface by photolithography, thereby providing a slider. SOLUTION: In a wafer process, on the front or rear surface of a magnetic head wafer, a plurality of projections 22 are provided, which are brought into contact with adjacent surfaces to form a gap between both surfaces when the magnetic head wafer is cut, and arranged as rows (cut wafer) 11. Thus, in the photolithography process of the air lubricating surface carried out in the arranged state of the rows 11, the projection 22 is operated as a spacer between rows 11 and, when one side of the pattern of a photomask is aligned with the rows 11 of each row with the specified part of a thin-film magnetic head 2 set as a position reference, the other side of the pattern is positioned on a gap G by the projection 22.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a slider processing method for manufacturing a slider on which a head element is mounted.
More specifically, the present invention relates to a slider processing method for cutting a wafer on which a large number of head elements are formed one by one into a slider.

[0002]

2. Description of the Related Art In recent years, efforts to increase the recording density of recording media in magnetic disk devices and the like have been strengthened, and GMR heads having excellent high-density recording / reproducing characteristics have been adopted, and recording tracks on the disk surface have been narrowed. Trucking is increasing.

On the other hand, the flying height of the slider on which the head element is mounted from the disk surface has been minimized to about 20 nm, and further reduction is required. That is, the slider is required to have a very low flying height and a stable flying characteristic in which the flying height does not change due to the peripheral speed of the disk. In order to satisfy the demand, it is necessary to have a technique for forming a fine, complicated and geometric air-lubricated surface with high precision, and at the same time, it is necessary to maintain the positional relationship with the head element with high precision.

As a technique for forming an air lubrication surface, US Pat.
P46224048 and JP-A-2-010515 disclose a method using a photolithography technique, that is, a method in which a photomask corresponding to an air lubricated surface is formed and dry etching such as ion beam etching is performed.

[0005] A conventional slider having an air lubrication surface will be specifically described. As shown in FIG. 7, in the slider 1 having a substantially rectangular parallelepiped shape, the surface on which the thin-film magnetic head element 2 is formed on the surface layer and on the edge portion has a trailing surface 3 (air outflow end side).
A surface parallel to the trailing surface 3 is a leading surface 4 (air inflow end side), and a surface where the thin-film magnetic head element 2 is located is an air lubricating surface 6 having an uneven shape by the rail pattern 5. A conductive pattern 7 for connection terminals for connecting the magnetic head element 2 to a head amplifier (not shown) is formed on the trailing surface 3. As shown in FIG. 8, the thin-film magnetic head element 2 is formed on a substrate 8, and the upper magnetic pole 9 is located on the trailing surface 3 side and at the center of the trailing surface 3 in the longitudinal direction. .

When manufacturing the slider 1, first, FIG.
As shown in (a), Altic (Al ₂ O ₃ —TiC)
A plurality of thin-film magnetic head elements 2, 2,... Are formed in a plurality of rows in a vertical axis direction and a horizontal axis direction by a wafer process on the surface of a ceramic substrate 8 made of the same. Further, a conductive pattern 7 (see FIG. 7) is formed in the vicinity of each thin-film magnetic head element 2 by the same wafer process as that of the thin-film magnetic head element 2.

Next, as shown in FIG. 9B, the unnecessary portion of the substrate 8 at the peripheral edge is cut off to form a rectangular magnetic head wafer 10.
Further, as shown in FIG. 9C, the magnetic head wafer 10 is placed in a strip-shaped row 1 corresponding to a row of elements arranged side by side.
Cut into 1, 11, ... Thereafter, the stress remaining on each row 11 by the throat height processing is removed by polishing.

In each row 11, a surface facing the thin-film magnetic head element 2 is a trailing surface forming surface (hereinafter referred to as a trailing surface) 11a, and a surface opposite thereto is a leading surface forming surface (the same leading surface) 11b. One surface in the longitudinal direction that intersects the trailing surface 11a and the leading surface 11b is an air lubrication surface forming surface (the air lubrication surface) 11c.

Next, as shown in FIG. 10, a plurality of rows 11 are placed on a suction fixing jig 13 having a large number of suction holes 12.
The trailing surface 11a and the leading surface 11b are in pressure contact with each other, and the air lubrication surface 11c is
Are arranged in parallel so as to close the holes, and the arranged rows 11 are vacuum-sucked on the suction fixing jig 13 by a vacuum pump (not shown). Then, the air lubricating surface 11 of the vacuum 11 which has been vacuum-adsorbed
The row fixing jig 15 coated with the sheet adhesive 14 is brought into contact with the surface opposite to c.

In this state, that is, in a state as shown in a cross section in FIG. 11A, the row fixing jig 15 is heated to 110 ° C., and then cooled to 20 ° C. to cure the adhesive 14. . After the adhesive 14 is cured, the vacuum suction is released, and the suction fixing jig 13 is removed, thereby obtaining FIG.
As shown in (b), a plurality of rows 11 are obtained on the row fixing jig 15 in a state where their warpage, bending, and steps of the air lubrication surface 11c between the rows 11 are corrected.

Next, as shown in FIG. 12 (a), the air lubrication surface 11 of the rows 11, 11,...
A photosensitive resin film 16 such as a resist or a dry film is adhered to c, 11c,. After that, a photomask 18 on which a rail pattern 17 of a predetermined shape is formed is arranged above the rows 11, 11,.
The thin-film magnetic head element 2 located at the center of the
The photomask 18 is aligned using the upper magnetic pole 9 (see FIG. 8) as a marker, and the photosensitive resin film 16 is exposed by irradiating light such as ultraviolet rays.

After the exposure of all the rows 11, the rows 11, 11,... Together with the row fixing jig 15 are immersed in a developing solution to dissolve the unexposed portions of the photosensitive resin film 16 in the developing solution. As a result, as shown in FIG. 12B, a predetermined mask pattern 19 is formed on the air lubrication surface 11c.
The rows 11, 11,... In which 19,.

Next, the rows 11, 11,... Are etched using an ion beam etching apparatus or the like to remove the air-lubricated surface 11c in a portion where the mask patterns 19, 19,. I do. After that, row 11, 1
The mask pattern 19, 1 is cleaned by cleaning
By removing the rows 9 and the rails 20 having a predetermined shape corresponding to the mask patterns 19, 19,... On the air lubrication surface 11c, as shown in FIG. Get independently.

Finally, each row 11 is cut for each thin-film magnetic head element 2 so that the stepped air lubrication surface 6 is formed by the rail pattern 5 as described above with reference to FIG.
Is obtained. In order to form the air lubrication surface 6 having a plurality of steps, the steps of FIGS. 12A and 12B are repeated.

[0015]

However, when the air lubricating surface 6 is formed as in the above-described conventional slider processing method, the upper magnetic pole 9 of the thin-film magnetic head element 2 is used as a position reference, and this position reference is used. When the shape processing is performed so that the distance of the slider becomes the set value, the groove portion 21 may be formed at the air inflow end due to variation in the slider length (wafer thickness). However, it is desirable that the air lubrication surface 6 has a shape having no step at the air inflow end so that the slider 1 maintains a constant pitch angle in the range from the inner circumference to the outer circumference of the disk. When the groove width varies, the amount of air flowing into the air lubrication surface 6 is changed, and the flying height of the slider 1 varies.

In order to suppress the variation in the flying height due to the variation in the length of the groove, the groove 21 is not provided at the air inflow end. It is conceivable that the mask 18 is formed, but in this case, if the slider length is short, there is a problem that the vicinity of the air outflow end of the adjacent row 11 is exposed, developed, and etched.

To prevent this, adjacent rows 11
At present, spacers or dummy bars are placed between each other. In addition to this, it takes time and effort. In addition, when inserting a dummy bar, only half the rows 11 should be inserted compared to the case where there is no dummy bar. Not be able to
Processing capacity is halved. Even if a spacer is inserted, to process a rigid spacer with high precision,
The spacer itself requires a thickness of several hundreds of μm, and the processing capacity falls. Further, since the spacer itself is also etched, it cannot be used many times, and the cost for the spacer increases.

The present invention solves the above-mentioned problem, and cuts a wafer having a plurality of head elements formed on its surface, and forms an air-lubricated surface on the cut surface by photolithography to form a slider. It is an object of the present invention to provide a slider processing method capable of performing high-precision shape processing without causing a step at an air inflow end and exposing a cut surface of a cut wafer arranged adjacently.

[0019]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method of manufacturing a slider on which a head element is mounted, wherein the head element is arranged on a surface in a plurality of rows along a vertical axis and a horizontal axis. The formed wafer is cut in a direction in which the elements are separated from each other, and the cut wafer is arranged so that the surface on which the head elements are formed and the back surface opposite thereto are adjacent to each other, and the cut surface is exposed on one of the cut surfaces. A slider processing method for forming a concavo-convex air-lubricated surface for each element for guiding an air flow for stably maintaining the floating from a recording medium by a photolithography technique of masking and exposing each element row in a row, and cutting the wafer; Before you do,
It is characterized in that a plurality of projections are provided on the front surface or the rear surface of the projection to form a gap between the two surfaces in contact with an adjacent surface at the time of arrangement.

According to this configuration, even if the wafer thickness (therefore, the width of the cut surface) varies, one side of the photomask pattern is positioned with respect to the cut wafer in each row with the predetermined portion of the head element as a position reference. When the alignment is performed, the other side of the pattern can be positioned in the gap formed by the protrusions. Therefore, it is possible to prevent unnecessary grooves from being formed at the air inflow end remote from the head element, and to prevent exposure to the cut wafers arranged adjacent to each other, thereby enabling accurate shape processing. Therefore, it is possible to suppress variations in the flying height of the slider due to processing errors.

According to the present invention, in the above slider processing method, the wafer in which a plurality of rows of head elements are formed on the surface along the vertical axis and the horizontal axis is cut for each element row in a row, and the cut wafers are arranged. Then, after forming an air lubricated surface on the cut surface, cutting is performed for each element.

According to this configuration, it is sufficient to arrange long cut wafers corresponding to the horizontally arranged element rows, so that it is possible to suppress the positional deviation at the time of arrangement as compared with arranging wafers cut for each element. In addition, the arrangement work is easy.

Further, according to the present invention, in any one of the above-described slider processing methods, the protrusion is formed at a position where the protrusion is not cut, whereby the cross section of the protrusion is the same as the air lubrication surface. And it is possible to prevent the air flow from being affected when the slider is used.

The protruding portion is arranged, for example, on the wafer surface above the head element. This makes it possible to form by a wafer process, compared to the formation on the lower surface,
Easy to form.

As the protruding portions, pads for connection terminals for connecting the head element and the head to the head amplifier are used. Thus, the connection terminal pad can also serve to form a gap.

Preferably, the protrusion is formed with a protrusion height larger than the thickness tolerance of the wafer. Also preferably,
The projection is formed with a projection height that absorbs a positioning error of the photomask.

[0027]

Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) FIG. 1 is a perspective view of a slider manufactured in Embodiment 1 of the present invention, FIG. 2 is a partially enlarged sectional view of a thin film magnetic head of a magnetic head wafer used for manufacturing the slider, and FIG. FIG. 3 is an explanatory view showing a photolithography step of forming a slider from a magnetic head wafer.

Referring to FIG. 1, a slider 1 having a substantially rectangular parallelepiped shape has substantially the same structure as that of the conventional slider described above with reference to FIG. 7, and a thin-film magnetic head element 2 is formed on a surface layer and on an edge. Surface is trailing surface 3 (air outflow end side)
A surface parallel to the trailing surface 3 is a leading surface 4 (air inflow end side), and a surface where the thin-film magnetic head element 2 is located in the vicinity is an air lubricating surface 6 having an irregular shape by the rail pattern 5. A plurality of gold pads 7 as a conductive pattern connected to the head amplifier on the trailing surface 3
a is formed. And furthermore, trailing surface 3
Is formed at the center between the plurality of gold pads 7a.

The rail pattern 5 encloses a rectangular area surrounding the thin-film magnetic head element 2 and the rectangular area at intervals so that the slider 1 maintains a constant pitch angle from the inner circumference to the outer circumference of the disk. Is designed so that the substantially U-shaped region disposed at the end on the leading surface 4 side protrudes.

As partially shown in FIG. 2, the magnetic head wafer 10 is constructed in the same manner as the conventional one, and has a ceramic substrate 8 made of AlTiC (Al ₂ O ₃ —TiC) or the like.
Are formed in a plurality of rows along the vertical axis and the horizontal axis in the same direction by a wafer process on the surface of the thin film magnetic head element 2. In addition, the above-mentioned gold pad 7a is formed by the same wafer process as that of the thin-film magnetic head element 2. Above the upper magnetic pole 9 of each thin-film magnetic head element 2, a projection 22 mainly composed of Al ₂ O ₃ is formed by film formation.

More specifically, an insulating layer 23 made of Al ₂ O ₃ or the like is formed on the upper surface of the substrate 1, and a lower shield layer made of a soft magnetic material such as permalloy is formed on the upper surface of the insulating layer 23. 24 are formed.

A read head element portion 25 is disposed above the lower shield layer 24 with a space therebetween, and a vertical bias layer 26 is formed on both sides of the read head element portion 25. An electrode lead is formed on the upper surface of the vertical bias layer 26. A layer 27 is formed, and a common shield layer 28 made of the same soft magnetic material as the lower shield layer 3 is formed above the read head element section 25 and the electrode lead layer 27 at intervals. It is configured.

An upper magnetic pole 9 made of a soft magnetic material is provided above the common shield layer 28 at intervals, and a winding coil (not shown) is provided so as to surround the upper magnetic pole 9. Thus, a recording head unit is configured.

The layers above the insulating layer 23, the element portion, and the periphery of the magnetic pole are filled with a nonmagnetic insulating material such as Al ₂ O ₃ , and the lower shield layer 24, the read head element portion 25, and the vertical bias layer 26 are formed. Between the lower gap insulating portion 29, the reproducing head element portion 25, the electrode lead layer 27 and the common shield layer 2.
8, the upper gap insulating portion 30, the common shield layer 2
A gap between the upper magnetic pole 8 and the upper magnetic pole 9 is a recording gap layer 31.

The plurality of gold pads 7a and the protrusions 22 are formed on the upper surface of the insulating layer 32 made of the non-magnetic insulating material. The above-described electrode lead layer 26 and a winding coil (not shown) are connected to the gold pad 7a.

Here, the substrate 8 has a thickness L1 = 1200 μm
+/− 5 μm, and the height of the protrusion 22 is L2 = 20 μm
It is. The height L2 of the protrusion 22 is equal to the thickness L of the substrate 8.
10 μm from the viewpoint that it is desirable that the tolerance is higher than 1.
The above is determined in consideration of misalignment of the photomask. The distance L3 from the upper magnetic pole 9 to the leading surface is set to 1210 +/− 5 μm.

To process the slider 1 from such a magnetic head wafer 10, a conventional processing method (FIGS. 9 to 12) is used.
), The rectangular magnetic head wafer 10 is cut into strip-shaped rows 11, 11,.
The trailing surface 11a and the leading surface 11b are arranged in a press-contact state so as to be adjacent to each other. A row fixing jig 15 provided with a sheet-like adhesive 14 on a surface opposite to the air lubricating surface 11c of the rows 11, 11,...
Are arranged from above and the row fixing jig 15 is turned upside down after the adhesive 14 is cured, so that a plurality of rows 11, 11,. Obtained in a state where the step of the surface 11c is corrected.

As shown in FIGS. 3 (a) and 3 (b) from above and from the side, the plurality of rows 11 sliced and arranged from the magnetic head wafer 10 as described above and subjected to the photolithography process are One row 1 next to you
The plurality of projections 22 of one trailing surface 11a are in pressure contact with the leading surface 11b of the other row 11, and the projections 22 correct the warpage and bending of each row 11, and the gap between each row 11. Height L2 of protrusion 22
A gap G having a width L4 corresponding to the above is formed.

For this reason, a photomask (not shown) prepared by setting the distance from the upper magnetic pole 9 to the leading surface 11b to 1215 μm is used.
When the position of one end of the pattern of the photomask is adjusted using the upper magnetic pole 9 as a position reference, each row 11
L3 from the upper magnetic pole 9 to the leading surface 11b
Is 1210 +/− 5 μm (1205 μm
１２1215 μm), the other end of the pattern coincides with the air inflow end (leading surface 11b) or is located in the gap G.

Therefore, the exposure, the development, and the etching do not form a groove at the air inflow end or etch the air lubricating surface 11c of the adjacent row 11 unlike the related art.

Thus, by cutting each row 11 after etching for each thin-film magnetic head element 2, the slider 1 having the air lubricating surface 6 with no step at the air inflow end as shown in FIG. can get.

As described above, the protrusion 2 having a substrate thickness (substantially equal to the wafer thickness) on the magnetic head wafer 10 that is higher than the tolerance
In the photolithography process of the air-lubricated surface 6, the air-lubricated surface 11c of the adjacent row 11 is exposed and developed in the photolithography process of the air-lubricated surface 6 without forming a groove at the air inflow end. Thus, the shape can be processed without etching, and the variation in the flying height of the slider 1 due to the variation in the slider length (wafer thickness) can be suppressed.

The projection height L2 of the projection 22 can be reduced by using the substrate 8 having a small thickness variation. However, in consideration of the alignment accuracy of the photomask, the projection height L2 is not less than 5 μm. It is desirable to ensure that
More preferably, the protrusion height is 10 μm or more, and further preferably, the protrusion height is 15 μm or more.

The projections 22 are preferably formed at positions where they will not be cut in the row 11 slicing step.
2 is prevented from being flush with the air-lubricated surface 6,
The use of the slider 1 can be prevented from affecting the air flow.

Although the main component of the projection 22 is Al ₂ O _{3 in the} first embodiment, the main component is not limited to Al ₂ O ₃ as long as a desired projection height can be ensured. Further, in the first embodiment, the protruding portion 22 is formed using the film forming technique. However, it is sufficient that the protruding portion 22 can be formed.
Needless to say, it may be formed by other methods such as bonding.

Further, in the first embodiment, the projection 22 is formed on the surface of the substrate on which the thin-film magnetic head 2 is formed. However, the projection is formed on the surface of the substrate opposite to the thin-film magnetic head 2. Needless to say, this may be done. (Embodiment 2) FIG. 4 is a perspective view of a slider manufactured in Embodiment 2 of the present invention, FIG. 5 is a partially enlarged sectional view of a thin film magnetic head 16 of a magnetic head wafer 50 used for manufacturing the slider, and FIG. FIG. 4 is an explanatory view showing a photolithography step of forming a slider from the magnetic head wafer 50.

As shown in FIGS. 4 and 5, the slider 1 and the magnetic head wafer 10 according to the second embodiment have the same configuration as that of the first embodiment. 22 are not formed and the height L5 of the gold pad 17a is
Is formed at a height of 20 μm.

The height L5 of the gold pad 17a is
Is set to 10 μm or more from the viewpoint that it is desirable to be higher than the tolerance of the thickness L1, and 15 μm or more is determined in consideration of the alignment of the photomask.

A plurality of rows 11 sliced and arranged from the magnetic head wafer 10 and subjected to the photolithography process are arranged adjacent to each other as shown in FIG. 6A and FIG. The plurality of gold pads 17a on the trailing surface 11a of the row 11 are pressed against the leading surface 11b of the other row 11, and the gold pads 17a
Thereby, the warp and bending of each row 11 are corrected, and a gap G having a width L6 corresponding to the height L5 of the gold pad 17a is formed between each row 11.

For this reason, when one row of the photomask pattern is aligned with each row 11 using the upper magnetic pole 9 as a position reference using the same photomask as in the first embodiment, the other end of the pattern is obtained. Corresponds to the air inflow end (leading surface 11b) or is located in the gap G.

Therefore, the conventional groove portion is not formed at the air inflow end portion by the exposure, development, and etching, and the air lubrication surface 11c of the adjacent row 11 is not etched.

Thus, by cutting each row 11 after etching for each thin-film magnetic head element 2, the slider 1 having the air lubricating surface 6 with no step at the air inflow end as shown in FIG. can get.

As described above, by forming the gold pad 17a on the magnetic head wafer 10 higher than the substrate thickness (substantially equal to the wafer thickness) tolerance, the air inflow end in the photolithography process of the air lubrication surface 6 is improved. It is possible to shape the air lubricating surface 11c of the adjacent row 11 without exposing, developing, and etching without forming a groove in the portion, and the slider 1 caused by a variation in slider length (wafer thickness). Can be suppressed.

The height L5 of the gold pad 17 can be reduced by using the substrate 8 having a small thickness variation.
It is desirable to secure a height of at least μm. More preferably, the protrusion height is 10 μm or more, and still more preferably, it is 1 μm.
The protrusion height is 5 μm or more.

In the first and second embodiments described above, the air lubricating surface 6 of the slider 1 having the thin-film magnetic head element 2 is formed by dry etching. Magnetic head elements,
The present invention is not limited to the photolithography technique using dry etching, but is useful for all slider processing in which the air lubrication surface facing the recording medium is processed by the photolithography technique. For example, the head is an optical head,
The etching may be wet etching, and the resist may be a liquid resist.

[0056]

As described above, according to the present invention, an air lubricating surface is formed by slicing and arranging wafers as rows by forming projections higher than the wafer thickness tolerance on the wafer surface in the wafer process. In the photolithography process, the projections act as spacers, and each row does not generate an unnecessary step at the air inflow end, and does not expose, develop, and etch adjacent rows.
Shape processing can be performed accurately. Therefore, for a plurality of sliders obtained by cutting each row for each head element, it is possible to suppress variations in flying height due to variations in slider length (wafer thickness).

[Brief description of the drawings]

FIG. 1 is a perspective view of a slider formed by a method according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged cross-sectional view of a thin-film magnetic head element portion of a magnetic head wafer used for forming the slider of FIG.

FIG. 3 is an explanatory view showing a photolithography process for forming the slider of FIG. 1 from the magnetic head wafer of FIG. 2;

FIG. 4 is a perspective view of a slider formed by a method according to a second embodiment of the present invention.

5 is a partially enlarged sectional view of a thin-film magnetic head element portion of a magnetic head wafer used for forming the slider of FIG. 4;

FIG. 6 is an explanatory view showing a photolithography step of forming the slider of FIG. 4 from the magnetic head wafer of FIG. 5;

FIG. 7 is a perspective view of a conventional slider.

8 is a partially enlarged cross-sectional view showing a thin film magnetic head element portion of the slider of FIG. 7;

FIG. 9 is an explanatory view showing a low-slicing step of forming the slider of FIG. 7 from a magnetic head wafer.

FIG. 10 is an explanatory view showing a low alignment step of forming the slider of FIG. 7 from a magnetic head wafer.

FIG. 11 is an explanatory view showing a row bonding step of forming the slider of FIG. 7 from a magnetic head wafer.

FIG. 12 is an explanatory view showing a photolithography step of forming the slider of FIG. 7 from a magnetic head wafer.

[Explanation of symbols]

 Reference Signs List 1 slider 2 thin-film magnetic head element 4 air lubrication surface 7a gold pad (connection terminal pad) 8 substrate 10 magnetic head wafer 11 row (cut wafer) 11c air lubrication surface forming surface (cut surface) 18 photomask 22 protrusion G gap L1 Slider length (substrate thickness) L2 Height of protrusion L4 Width of gap L5 Height of gold pad L6 Width of gap

Claims (7)

[Claims] When manufacturing a slider on which a head element is mounted, a wafer having the head element formed on a surface thereof in a plurality of rows along a vertical axis direction and a horizontal axis direction is cut in a direction for separating the elements, The cut wafer is arranged so that the surface on which the head element is formed and the back surface opposite thereto are adjacent to each other, and on one cut surface exposed thereby,
In a slider processing method for forming an uneven air-lubricated surface for each element for guiding an air flow for stably maintaining the floating from a recording medium by a photolithography technique of masking and exposing each element row in a row, the wafer is cut. Prior to step (a), a plurality of projections are provided on the front surface or the back surface of the projection to form a gap between the two surfaces in contact with the adjacent surface at the time of arrangement. 2. A wafer in which a plurality of rows of head elements are formed on a surface along a vertical axis and a horizontal axis, are cut for each element row in a row, the cut wafers are arranged, and an air lubricated surface is provided on a cut surface. 2. The method according to claim 1, wherein after forming, the slider is cut for each element. 3. The slider processing method according to claim 1, wherein the protrusion is formed at a position where the protrusion is not cut. 4. The slider processing method according to claim 1, wherein the protrusion is disposed on a surface of the wafer above the head element. 5. The slider processing method according to claim 1, wherein the protrusion is a connection terminal pad for connecting the head element and the head to the head amplifier. 6. The slider processing method according to claim 1, wherein the projection is formed with a projection height larger than a thickness tolerance of the wafer. 7. The slider processing method according to claim 1, wherein the projection is formed at a projection height that absorbs a positioning error of the photomask.