JP2002241939A - Vacuum sealing structure and vacuum processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain cost reduction by improving the easiness of workpiece processing and enhancing the weight saving of the member and work efficiency. SOLUTION: The vacuum vessel of a vacuum processing apparatus is constituted by connecting a plurality of members with each other. In the connection end of one member 303a out of two members 303a and 303b which adjoin mutually among a plurality of members has a step formed in part of its inner peripheral surface to provide a projecting part 317 on its outer peripheral side, and a step is formed in part of the outer peripheral surface of the connection end of the other member 303b to provide a recessed part 318 on the outer peripheral side. One member 303a and the other member 303b are mutually connected when the projecting part 317 and the recessed part 318 are fitted. Furthermore, an O ring 316 which surrounds the recessed part 318 of the other member 303b over the entire perimeter is clamped between the projecting part 317 and the recessed part 318.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a semiconductor device,
The present invention relates to a vacuum seal structure and a vacuum processing apparatus used in a deposition film forming step and an etching step when forming an electrophotographic photosensitive member, an image input line sensor, an imaging device, a photovoltaic device, and the like.

[0002]

2. Description of the Related Art Conventionally, as vacuum processing methods used for semiconductor devices, electrophotographic photoreceptors, image input line sensors, imaging devices, photovoltaic devices, and other various electronic elements, there are vacuum deposition methods, sputtering methods, ionization methods, and the like. Plating method, thermal CVD method, optical CVD
There are many known methods, such as a plasma CVD method and the like, and an apparatus for the method has been put to practical use.

For example, an amorphous silicon film formed by using the above method and using silane gas (SiH ₄ ) as a film forming material gas has relatively few localized levels existing in the forbidden band of amorphous silicon, and is doped with impurities. This makes it possible to control valence electrons and obtain a photosensitive member having excellent characteristics as an amorphous silicon electrophotographic photoreceptor.

[0004] For example, in Japanese Patent Publication No. 60-35059,
An electrophotographic photosensitive member in which hydrogenated amorphous silicon is applied to a photoconductive portion is disclosed.

Further, with respect to the deposited film forming technique, there is a demand for a method of increasing the productivity by forming a deposited film on a large-area substrate at a high speed. Japanese Patent Application Laid-Open No. 9-310181 discloses that uniform and high-speed formation of a deposited film on a large-sized substrate is achieved by forming a part of a reaction vessel between an electrode and a substrate with a dielectric member. A plasma processing apparatus and method for enabling the above are disclosed.

[0006]

By the above-mentioned conventional method and apparatus, good deposited film formation, that is, vacuum processing is performed. However, when considering actual production, there is room for further contrivance.

In recent years, the demand for electrophotographic photoconductors used in miniaturized copiers and printers has been increasing, and electrophotographic photoconductors having a smaller diameter than before have been strongly demanded. The development of a manufacturing apparatus that can be manufactured at low cost is desired.

In a conventional vacuum processing apparatus, when sealing the vacuum processing space in a vacuum, as shown in FIG. 5, an O-ring 216 is installed in a groove 219 formed on the sealing surface of one member 203b. Was. However, when engraving a groove on the sealing surface, it is necessary to provide a certain amount of sealing surface on both sides in addition to the width of the groove for accommodating the O-ring. Become. As a result, the member becomes heavy, which may adversely affect workability. Furthermore, if the member does not have a sufficient width of the sealing surface, the O-ring will not be sufficiently isolated from the vacuum processing space. In some cases, the film was adversely affected.

Further, when a part of the reaction vessel constituting the vacuum processing space is made of a dielectric member, ceramics, which is one of the materials of the dielectric member, is generally vulnerable to impact and is easily damaged, so that it is difficult to process. It is necessary to pay attention, and the processing of engraving the groove on the sealing surface may involve a large processing cost depending on the width and depth of the groove. Further, as the thickness of the member increases, the cost increases particularly when a dielectric member is used. In addition, in the case of a reaction vessel capable of accommodating a large-area substrate, the weight increases due to an increase in the thickness of the dielectric member, and a large amount of repair and replacement is required when handling the dielectric member. In some cases, there is a problem that the cost is increased, which may be a factor of increasing the cost.

An object of the present invention is to solve the above problems. That is, an object of the present invention is to provide a vacuum seal structure and a vacuum processing apparatus capable of improving the workability of a member, and further reducing the cost by dramatically reducing the weight and workability of the member. It is in.

[0011]

In order to achieve the above object, a vacuum seal structure according to the present invention is a vacuum seal structure for holding a vacuum in a container formed by connecting a plurality of members to each other. Of the two members adjacent to each other, a step is formed on the inner peripheral side at the connection end of one of the members and a convex portion is provided on the outer peripheral side, and the connection end of the other member is A step is formed on the outer peripheral side and a concave part is provided on the outer peripheral side, and the one member and the other member are connected to each other by fitting the convex part and the concave part. And a seal member is sandwiched between the convex portion and the concave portion.

According to the vacuum sealing structure constructed as in the present invention, the inside of the container is sealed in a vacuum by the sealing member sandwiched between the convex portion and the concave portion provided on each member. Since the vacuum seal structure of the present invention can be configured by simply performing step processing on the connection end face of the member, the processing is easier than the conventional configuration in which an O-ring groove is formed on the connection end face of the member. It is. Further, since the vacuum seal structure of the present invention is configured such that the members are connected by fitting the convex portion and the concave portion formed by step processing, the vacuum seal structure passes through the gap between the connecting portions of the members. Thus, it is possible to make the distance of the path connecting the inside and outside of the container longer. As a result, the thickness of the member can be made thinner than before, so that the member can be reduced in weight, workability can be improved, and cost can be reduced.

Further, the seal member may be formed of an O-ring.

Further, since the seal member is attached to at least one of the convex portion and the concave portion, it is possible to prevent the members from being connected to each other without installing a seal member between the members. In addition, it is possible to ensure the vacuum seal between the members and to prevent the members from being damaged by an impact when the members are directly connected to each other.

Further, it is preferable that the seal member is made of a rubber member.

Further, the member may be composed of a dielectric member.

Further, the vacuum processing apparatus of the present invention is a vacuum processing apparatus comprising: a container in which a plurality of members are connected to each other; and plasma generating means for generating plasma in the container. Of the two members adjacent to each other, a step is formed on a part of the inner peripheral surface at the connection end of one of the members, and a convex portion is provided on the outer peripheral side, and the other of the members A step is formed on a part of the outer peripheral surface at the connection end of the first member, and a concave portion is provided on the outer peripheral side. The convex portion and the concave portion are fitted to the one member and the other member. It is configured to be connected to each other, and between the convex portion and the concave portion, a sealing member that surrounds the concave portion of the other member over the entire periphery is configured to be held. Features.

According to the vacuum processing apparatus constructed as described above, the inside of the container is sealed to a vacuum by the seal member sandwiched between the convex portion and the concave portion provided on each member. Since the vacuum processing apparatus of the present invention can be configured by simply performing step processing on the connection end face of the member, the processing is easier than the conventional configuration in which an O-ring groove is formed on the connection end face of the member. Further, since the members are connected to each other by fitting the convex portion and the concave portion formed by step processing, the inside and outside of the container pass through the gap between the connecting portions of the members. Can be made longer. As a result, the thickness of the member can be made thinner than before, and the weight and cost of the member can be reduced. Further, by increasing the distance of the path, the seal member can be sufficiently isolated from the space in the container, and the seal member is prevented from being exposed to plasma. And the components of the seal member are prevented from being mixed as impurities into the container space.

Further, the plasma generating means may include a power introducing means for generating a discharge in the container and a gas introducing means for supplying a gas into the container.

Further, the member may be constituted by a dielectric member.

Further, the seal member may be constituted by an O-ring.

Further, since the seal member is attached to at least one of the convex portion and the concave portion, the members are prevented from being connected to each other without installing a seal member between the members. In addition, it is possible to ensure the vacuum seal between the members and to prevent the members from being damaged by an impact when the members are directly connected to each other.

Further, it is preferable that the seal member is made of a rubber member.

[0024]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a view showing one embodiment of a vacuum processing apparatus according to the present invention, wherein FIG. 1 (a) is a transverse sectional view and FIG. 1 (b) is an axial sectional view.

As shown in FIG. 1, a vacuum processing apparatus 301 of the present embodiment includes a reaction vessel 303 containing a raw material gas supply pipe 305 and a plurality of cylindrical substrates 304 therein, and a wall member 303a of the reaction vessel 303. , 303b and vacuum processing device 3
And a plurality of electrodes 302 disposed between the outer frame member 01 and the outer frame member 01. Each cylindrical substrate 304 is held by a support having a heating element 306. Source gas supply pipe 305
Is arranged at the center of the reaction vessel 303, and the plurality of cylindrical substrates 304 are arranged on a circumference surrounding the source gas supply pipe 305. Each electrode 302 is a matching box 3
A high-frequency power supply 314 is connected via the power supply 15, and the high-frequency power output from the high-frequency power 314 is supplied from the electrode 302 into the deposition film formation space 308 via the matching box 315. Container 3 including high-frequency power supply 314, matching box 315, and electrode 302
Plasma generating means for generating plasma in the vessel 303 is formed by power introducing means for generating a discharge in the vessel 303 and a raw material gas supply pipe 305 serving as a gas introducing means for supplying a raw material gas into the vessel 303. It is configured.

Further, a reduction gear 311 is attached to a shaft 309 of each support for supporting the cylindrical substrate 304. Each of the substrates 304 is rotated by rotating the reduction gear 311 with a motor 310. It has become.

The number of the cylindrical substrates 304 provided in the deposition film forming space 308 is six, and a large number of photoconductors can be manufactured at the same time. Here, the number of the cylindrical substrates 304 is not particularly limited, but the productivity is better when a plurality of the cylindrical substrates 304 are provided. But,
Generally, as the number of cylindrical substrates 304 is increased, the size of the vacuum processing apparatus 301 is increased and the required high-frequency power supply capacity is increased. Therefore, the number of cylindrical substrates 304 is determined in consideration of these points. It is determined as appropriate.

When a plurality of cylindrical substrates 304 are provided, the arrangement of the cylindrical substrates 304 is not particularly limited.
The configuration provided on the same circumference as shown in (A) is a preferable example that can reduce variation in characteristics between the cylindrical substrates 304.

The reaction vessel 303 for forming the deposited film formation space 308 may have any shape. However, from the viewpoint of reducing the variation in characteristics between the cylindrical substrates 304, the reaction vessel 303 has a cylindrical shape. It is preferable that the shape is similar to the arrangement shape of the base 304.

[0031] As shown in FIG.
4 are provided on the same circumference, the wall 30 of the reaction vessel
It is preferable that the shapes of 3a and 303b are cylindrical, and these are arranged so as to be concentric with the circumference formed by the cylindrical base 304.

The shape of the vacuum processing apparatus 301 is not particularly limited, but a deposited film forming space 308 in which gas is dispersed.
And the shape of the deposited film formation space 308 may be different. However, electrode 3
From the viewpoint of improving the uniformity of the high-frequency power supply 314 emitted from the device 02, it is preferable that the shape is similar to the shape of the deposition film formation space 308. Further, from the viewpoint of ease of manufacture and the like, the shape of the vacuum processing apparatus 301 is generally a cylinder or the like. In addition, the material is preferably a metal such as aluminum or stainless steel from the viewpoint of shielding power reflection from the electrode 302 and obtaining mechanical strength.

FIG. 2 is a sectional view showing a reaction vessel in the vacuum processing apparatus shown in FIG.

As shown in FIG. 2, the reaction vessel 303 includes a wall member including an upper member 303a and a lower member 303b, a lid member 312, and a bottom member 3 having an exhaust portion 307.
13, and a deposition film forming space 308 that can be evacuated is formed therein.

A vacuum seal connection 320 between the lid member 312 and the upper member 303a, a vacuum seal connection 320 between the upper member 303a and the lower member 303b, and a vacuum between the lower member 303b and the bottom member 313. Each of the seal connection portions 320 is sealed with an O-ring 316. This makes it possible to keep the deposition film forming space 308 in the reaction vessel 303 at a vacuum.

FIG. 3 is a view for explaining the vacuum sealing structure of the reaction vessel in FIG.

As shown in FIG. 3, the upper member 303a is
Step processing is performed on the inner peripheral surface, and a convex portion 317 is formed on the outer peripheral side. On the other hand, the lower member 303b is stepped on the outer peripheral side to form a concave portion 318 on the outer peripheral side. The convex portion 317 of the upper member 303a and the concave portion 3 of the lower member 303b
18 can be engaged with each other, and in this engagement, the convex surface 3
17a and the concave surface 318a are in contact with each other.
That is, the convex surface 317a and the concave surface 318a function as sealing surfaces of the upper member 303a and the lower member 303b, respectively. Then, the concave portion 3 of the lower member 303b
A vacuum seal between the upper member 303a and the lower member 303b is performed by sandwiching an O-ring 316 as a seal member surrounding the entire periphery between the convex portion 317 and the concave portion 318. .

As described above, the reaction vessel 303 in the present embodiment is configured such that the members are connected by fitting the convex portion 317 and the concave portion 318 formed by step processing. It is possible to make the distance of the path for communicating the inside and the outside of the container 303 through the gap between the connecting portions 320 longer. As a result, the thickness of the member can be made thinner than before, and the weight and cost of the member can be reduced. Further, by making the distance of this path longer, the O-ring 316
Thus, the O-ring 316 can be prevented from being exposed to plasma. Therefore, the deterioration of the O-ring 316 is suppressed, and the components of the O-ring 316 are prevented from entering the space 308 as impurities.

When the wall members 303a and 303b of the reaction vessel are composed of a dielectric member, specific materials for the dielectric member include alumina, titanium dioxide, aluminum nitride, and the like.
Boron nitride, zircon, cordierite, zircon cordierite, silicon oxide, beryllium oxide mica-based ceramics and the like are used. Of these, alumina, aluminum nitride, and titanium dioxide are particularly preferred because they absorb less high-frequency power. Furthermore, the dielectric member using the ceramic material should be divided into a plurality of members and joined in multiple stages as in the present embodiment, due to problems due to deformation after sintering and workability due to handling. Is desirable.

O-ring 31 used as a sealing member
The material of No. 6 is preferably a fluoro rubber, a synthetic rubber, or the like, and for example, Viton (registered trademark) manufactured by DuPont is listed. When there is a concern that the vacuum sealability may be deteriorated due to thermal deformation or thermal deterioration, it is preferable to use an O-ring made of Kalrez (registered trademark) manufactured by DuPont, for example.

Further, as shown in FIG. 4, the vacuum seal connecting portion 320 attaches a seal member 416 to the seal surface 417 of the upper member 403a to realize a vacuum seal between the seal member 416 and the seal surface 418 of the lower member 403b. It is also preferable that the seal member 416 be made of a rubber material. Seal surface 4 of upper member 403a
As a method of bonding the sealing member 416 to the sealing member 17, the sealing member 416 may be bonded by an adhesive, but it is more preferable that the sealing member 416 is melted and fused using heat or ultrasonic waves. This prevents the members from being connected to each other without installing the seal member 416 between the members 403a and 403b, so that a vacuum seal between the members is ensured, and that when the members are directly connected to each other. Damage to the member due to impact can be prevented.

Next, an outline of a method of forming a deposited film using the above-described vacuum processing apparatus will be described.

First, on the bottom member 313 of the reaction vessel, 2
Wall member 30 made of divided dielectric member made of alumina
3a and 303b are stacked, and then the cylindrical substrate 304
Is placed in a reaction vessel and closed by a cover member 312 to form a deposited film formation space 308. At this time, the bottom member 313 of the reaction vessel, the wall members 303a and 303b,
Further, an O-ring 316 is provided at a connection portion between the lid members 312 to perform vacuum sealing. Then, the inside of the deposition film formation space 308 is exhausted through an exhaust pipe 307 by an exhaust device (not shown). Subsequently, the cylindrical body 30 is heated by the heating element 306.
4 is heated while being controlled to a predetermined temperature.

When the temperature of the cylindrical substrate 304 reaches a predetermined temperature, a raw material gas used for forming a deposited film is introduced into the deposited film forming space 308 through a gas supply pipe 305. After confirming that the flow rate of the raw material gas has reached the set flow rate and that the pressure in the deposition film formation space 308 has stabilized, the high-frequency power supply 314 supplies the electrode 30 via the matching box 315.
2 is supplied with a predetermined high frequency power. A glow discharge is generated in the deposited film formation space 308 by the supplied high frequency power, and the source gas is excited and dissociated to form a deposited film on the cylindrical substrate 304.

After the desired film thickness is formed, the supply of the high-frequency power is stopped, the supply of the source gas is stopped, and the formation of the deposited film is completed. When forming a multi-layered deposited film, the same operation is repeated a plurality of times. In this case, between the respective layers, once the formation of one layer is completed as described above, the discharge is completely stopped once, the flow rate and the pressure of the gas of the next layer are set, and the discharge is again generated to generate the next discharge. Layer formation may be performed, or after completion of formation of one layer, a plurality of layers may be formed by gradually changing gas flow rate, pressure, and high-frequency power to set values of the next layer over a certain period of time. May be formed continuously.

[0046]

The present invention will be described in more detail with reference to the following examples.

(Example 1) A 358 mm-long reactor vessel 303 of the vacuum processing apparatus 301 of the present invention shown in FIG.
Six Al-made cylindrical substrates 307 having an outer diameter of 80 mm and subjected to mirror finishing are placed on a circumference centered on the source gas supply pipe 305. Subsequently, electric power having an oscillation frequency of 100 MHz was introduced from the high-frequency power supply 314 into the deposition film formation space 308, and an amorphous silicon film was deposited on the cylindrical substrate 307, thereby producing an electrophotographic photosensitive member.

In this embodiment, the lower member 303b and the upper member 303, each of which is made of an alumina dielectric member divided into two parts, are formed.
a was stacked on the bottom member 313 and further closed by the lid member 312 to form a deposited film forming space 308. At this time, the dielectric members 303a and 303b made of alumina have a thickness of 15 mm and a weight of 20 k.
g, the connecting portion 3 between the upper and lower members 303a and 303b.
20 is provided with steps 317 and 318 that can be fitted together. Also, the bottom member 313 and the lower member 303 of the reaction vessel
b, the upper member 303a and the lid member 312
The connecting part 320 with the step is also provided with a step that can be fitted to each other. The O-ring 316 made of Viton (registered trademark) manufactured by DuPont is placed between the members of each connection part 320.
Was installed to perform vacuum sealing.

<Comparative Example 1> As shown in FIG. 5, an O-ring groove 219 is formed in the sealing surface of the member 203b in each of the connection portions, and a Viton (registered trademark) manufactured by DuPont is formed in the groove 219. A photoconductor for electrophotography was produced in the same manner as in Example 1, except that an O-ring 216 made of was provided and vacuum sealing was performed. At this time, the wall member made of the dielectric member made of alumina had a thickness of 15 mm and a weight of 20 kg.

The electrophotographic photosensitive members produced in Example 1 and Comparative Example 1 were evaluated by measuring the amount of impurities contained in the electrophotographic photosensitive member. Specifically, a secondary ion detection mass spectrometer (SIMS: SECONDARY ION MA
The spectrophotometer for electrophotography was evaluated by measuring the concentration of oxygen and the concentration of fluorine mixed into silicon in the photoconductor for electrophotography by SS SPECTORS COPY).

Table 1 shows the evaluation results. In Table 1, relative comparisons were made with the oxygen concentration and the fluorine concentration in the electrophotographic photoreceptor prepared in Example 1 as 100.

[0052]

[Table 1] As is clear from Table 1, it was confirmed that the use of the vacuum processing apparatus of the present invention shown in FIG. 1 provided good results in which the amount of impurities contained in the electrophotographic photosensitive member was small.

Here, as in Comparative Example 1, the member 20
3b, an O-ring groove 219 is engraved on the sealing surface.
In the configuration in which the O-ring 216 is installed in the inside of the housing 19 to perform vacuum sealing, in order to realize the same vacuum sealing as in the first embodiment, the wall thickness of the dielectric member needs to be 30 mm, The weight of the wall member at this time is 41 kg
Met.

As described above, according to the present invention, since the thickness of the member can be reduced, the weight of the member can be reduced, the workability can be improved, and the manufacturing cost can be reduced. It becomes possible.

(Embodiment 2) As shown in FIG. 4, a sealing surface 417 having a convex surface is formed at a seal connecting portion 320 between members constituting the vacuum vessel 303 of the vacuum processing apparatus 301 of the present invention as shown in FIG. A photoconductor for electrophotography was produced in the same manner as in Example 1, except that a rubber member 416 was welded to the substrate, and vacuum sealing was performed between the rubber member 416 and the sealing surface 418 having a concave surface via the rubber member 416.

By using the configuration of the second embodiment,
A vacuum seal capable of stably maintaining the deposition film formation space 308 in a reduced pressure state was realized. Further, the rubber member 4
Since the rubber member 416 is easy to handle because the member 16 is integral with the members of the vacuum container, the workability of assembling the vacuum container 303 can be further improved.

[0057]

As described above, according to the vacuum sealing structure and the vacuum processing apparatus of the present invention, a part of the inner peripheral surface is provided at the connection end of one of two members adjacent to each other constituting a container. A step is formed on the outer peripheral side, and a projection is provided on the outer peripheral side; a step is formed on a part of the outer peripheral surface at the connection end of the other member; a concave is provided on the outer peripheral side; The member is connected to each other by fitting the convex portion and the concave portion, and a seal member surrounding the concave portion of the other member over the entire periphery is narrow between the convex portion and the concave portion. Since it is configured to be held, the thickness of the member can be made thinner than before, and the member can be reduced in weight, workability can be improved, and cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of a vacuum processing apparatus of the present invention.

FIG. 2 is a sectional view showing a reaction vessel in the vacuum processing apparatus shown in FIG.

FIG. 3 is a view for explaining a vacuum sealing structure of the reaction vessel in FIG. 2;

FIG. 4 is a diagram showing another configuration of the vacuum sealing structure of the reaction vessel shown in FIG.

FIG. 5 is a view showing a configuration of a vacuum seal connecting portion of a reaction vessel in a conventional vacuum processing apparatus.

[Explanation of symbols]

 301 Vacuum processing apparatus 302 Electrode 303 Reaction vessel 303a, 403a Upper member 303b, 403b Lower member 304 Cylindrical substrate 305 Source gas supply pipe 306 Heating element 307 Exhaust section 308 Deposition film formation space 309 Axis 310 Motor 311 Reduction gear 312 Cover member 313 Bottom member 314 High frequency power supply 315 Matching box 316 O-ring 317 Convex portion 317a Convex surface 318 Concave portion 318a Concave surface 320 Vacuum seal connection portion 416 Seal member 417, 418 Seal surface

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // H05H 1/46 H05H 1/46 A (72) Inventor Jin Murayama 3-30 Shimomaruko, Ota-ku, Tokyo 2. Canon Inc. (72) Inventor Daisuke Tazawa 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Toshiyasu Shirasuna 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inside (72) Inventor Takashi Otsuka 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Kazutaka Akiyama 3-30-2, Shimomaruko, Ota-ku, Tokyo Canon Inc. F Term (reference) 2H068 DA23 EA25 EA30 3J040 AA02 AA11 BA02 EA16 FA05 HA02 4G075 AA24 AA42 AA62 BC06 BD26 CA47 EB12 EB41 EC01 EC06 EE02 FB02 FB04 FB13 FC06 FC07 4K030 AA06 BA 30 CA02 CA16 FA01 FA03 KA10 KA46 LA17

Claims (11)

[Claims] 1. A vacuum sealing structure for maintaining a vacuum in a container formed by connecting a plurality of members to each other, wherein a connection end portion of one of the two members adjacent to each other among the plurality of members. A step is formed on the inner peripheral side and a convex part is provided on the outer peripheral side; a step is formed on the outer peripheral side at a connection end of the other member, and a concave part is provided on the outer peripheral side; And the other member are connected to each other by fitting the convex portion and the concave portion, and a seal member is sandwiched between the convex portion and the concave portion. The vacuum seal structure characterized by being comprised as follows. 2. The vacuum seal structure according to claim 1, wherein said seal member comprises an O-ring. 3. The vacuum seal structure according to claim 1, wherein said seal member is attached to at least one of said convex portion and said concave portion. 4. The vacuum seal structure according to claim 3, wherein said seal member is made of a rubber member. 5. The vacuum seal structure according to claim 1, wherein said member is made of a dielectric member. 6. A vacuum processing apparatus comprising: a container in which a plurality of members are connected to each other; and plasma generating means for generating plasma in the container, wherein the container is adjacent to one of the plurality of members. 2
The connecting end of one of the members has a step formed on a part of the inner peripheral surface and a convex portion is provided on the outer peripheral side, and the connecting end of the other member has a part of the outer peripheral surface on the connecting end. A step is formed on the outer periphery side, and a concave portion is provided, and the one member and the other member are connected to each other by fitting the convex portion and the concave portion, A vacuum processing apparatus, wherein a seal member surrounding the concave portion of the other member over the entire circumference is sandwiched between the convex portion and the concave portion. 7. The vacuum according to claim 6, wherein said plasma generating means comprises power introducing means for generating a discharge in said container, and gas introducing means for supplying gas into said container. Processing equipment. 8. The vacuum processing apparatus according to claim 6, wherein said member is made of a dielectric member. 9. The vacuum processing apparatus according to claim 6, wherein said seal member is formed of an O-ring. 10. The seal member is attached to at least one of the projection and the recess.
9. The vacuum processing apparatus according to any one of claims 1 to 8. 11. The sealing member is made of a rubber member.
The vacuum processing apparatus according to claim 10.