JP2002236895A - Ic carrier with plate-like frame body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC carrier with a plate-like frame body for preventing the IC carrier from being carelessly removed from the plate-like frame body by applying bending stress and torsional stress, and removable by simple operation when removing the IC carrier from the plate-like frame body. SOLUTION: This IC carrier with the plate-like frame body connects the plate-like frame body and the IC carrier having an IC module formed inside the plate-like frame body by a connecting part. The connecting part is formed on one side edge of the IC carrier. The connecting part is formed narrower than a width dimension of the IC carrier. A slit part is formed on the other peripheral edge forming no connecting part of the IC carrier.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC carrier with a plate-like frame provided with a small-sized IC carrier on which an IC module is mounted and a plate-like frame.

[0002]

2. Description of the Related Art Conventionally, for example, a subscriber identification tag SIM (SUBSCRIBER IDENTITY M
As an IC carrier used for ODULE, etc., an IC carrier in which a CPU, a memory, an electrode, and the like are integrated on a small-sized base material (about 15 × 25 mm) is used. If the user of the mobile phone obtains a subscriber identification tag corresponding to the telephone subscription right, the user can use the mobile phone of the common specification by mounting the IC carrier, which is the subscriber identification tag.

However, since the IC carrier is not widely used and its use is limited, constructing a dedicated factory for mass production leads to an increase in cost. In addition, when used as the above-mentioned subscriber identification tag, it may be mailed in an envelope, which makes it difficult to enclose and seal the product. And there is a problem that it may be damaged or lost.

For this purpose, as shown in FIG. 7, an IC card 20 having an IC module 21 using a conventional facility is used.
It is proposed that a slit 23 is formed in the plate-shaped frame 22 of the IC card 20 while leaving a plurality of bridges 24, and only the IC carrier 25 is removed. In this way, not only card manufacturing and inspection equipment, but also the
The shipping system can be used as is.

However, in the conventional case, when the IC card 20 is carried around and a bending stress or a torsional stress is applied to the card base, the bridge portion 24 is broken, and the plate frame 2 is broken.
The IC carrier 25 is inadvertently removed from 2
There is a risk of losing the carrier 25, which is a problem.

[0006]

SUMMARY OF THE INVENTION According to the present invention, an IC carrier is not accidentally removed from a plate-shaped frame by applying a bending stress or a torsion stress, and the IC carrier is removed from the plate-shaped frame. In this case, the present invention provides an IC carrier with a plate-shaped frame which can be taken by a simple operation.

[0007]

According to the present invention, there is provided an I with a plate-like frame according to the present invention.
The C carrier is an IC carrier with a plate-shaped frame in which a plate-shaped frame and an IC carrier having an IC module formed inside the plate-shaped frame are connected by a connecting portion. A slit is formed on one side edge of the IC carrier, and the connecting portion is formed narrower than a width dimension of the IC carrier, and a slit is formed on another peripheral edge of the IC carrier where the connecting portion is not formed. Is formed. Further, a cutting sewing machine or a half cut is formed at the connection portion.

Further, the connecting portion is formed so as to be cuttable from one side by half-cutting, the half-cut has a width of 0.05 mm to 0.5 mm, and a depth of 0.20 mm to 0.5 mm from the one side. It is characterized by being formed with 0.50 mm.

The connection portion is formed so as to be cuttable by half-cutting from both sides, the width of the half-cut is set to 0.05 mm to 0.5 mm, and the depth is set to 0.10 mm from both sides. ０．２0.25 mm.

[0010] A notch is formed at one corner of the IC carrier.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an IC with a plate-shaped frame according to the present invention will be described.
An embodiment of a carrier will be described in detail with reference to the drawings.
FIG. 1 shows a first embodiment of an IC carrier with a plate-shaped frame according to the present invention.
FIG. 2 is a cross-sectional view taken along line AA of FIG.
FIG. 3 is a cross-sectional view showing a state where the IC carrier is removed from the plate-like frame in the state shown in FIG. 2, and FIG. 4 is a view showing that the IC carrier is removed from the plate-like frame according to the first embodiment of the present invention. FIG. 5 is a plan view showing the state, and FIG.
FIG. 6 is a plan view of the carrier according to the second embodiment, and FIG.
7 is a plan view showing a conventional IC carrier with a plate-shaped frame, and FIG. 8 is a plan view showing an IC with a conventional plate-shaped frame.
FIG. 9 is a plan view showing a state after the IC carrier has been removed from the carrier. FIG.

First, a first embodiment of an IC carrier with a plate-shaped frame according to the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 and 2, a first embodiment of an IC carrier 1 with a plate-shaped frame according to the present invention includes a core sheet 2 and oversheets 3 and 4 provided on both sides of the core sheet 2. The laminated card base member 5 is used to form a plate-shaped frame member 6 which is an outer frame member of the card base member 5 and a plate-shaped frame member 6 provided inside the plate-shaped frame member 6 as necessary. And an IC carrier 8 having an IC module 7 formed so as to be separable therefrom. The core sheet 2 and the oversheets 3 and 4 are made of a resin sheet such as a vinyl chloride resin or PET-G.

The IC carrier 8 has a substantially rectangular shape, and is formed such that one of its corners is cut off in an inclined manner. In FIG. 1, the IC carrier 8 has an inclined cutout 13 at the lower right corner. Further, a connection portion 12 connected to the plate-shaped frame at one side edge on the lower side of the IC carrier 8 is provided. This connection 12
Is formed narrower than the width dimension of the IC carrier 8, and a slit portion 9 is formed on the other periphery of the IC carrier 8 where the connection portion 12 is not formed.

At the connecting portion 12 between the IC carrier 8 and the plate-like frame 6, a sewing machine 10 for cutting is formed. An inclined notch 13 is formed at one corner of the lower right portion of the IC carrier 8 so that the IC carrier 8 can be accurately mounted when the IC carrier 8 is set on a mobile phone.

When the IC carrier 8 is to be removed from the plate frame 6, as shown in FIGS. 3 and 4, the IC carrier 8 and the plate frame are pressed by strongly pressing the IC carrier 8 with a finger. It is cut out from the cutting sewing machine 10 formed at the connection portion with the body 6, and only the IC carrier 8 can be taken out.

IC carrier 8 separated from plate-like frame 6
Has a vertical dimension Y1 of about 15.0, as shown in FIG.
0 mm, the horizontal dimension X1 is about 25.00 mm, and the vertical dimension Y2 is about 10.6 mm to 11.8 m.
m, and an IC module 7 having a lateral dimension X2 of about 12.0 mm to about 13.0 mm is mounted. In the lower right portion of the IC carrier 8, a notch 13 is formed for positioning when the IC carrier 8 is mounted on a target device, and the length Z of the notch 13 is about 3.00 mm.

Next, the material of the card base will be described. The plate frame 6 and the core sheet 2 of the IC carrier 8 are not limited to vinyl chloride, but may be PET-G, PBT, acryl, polymethyl methacrylate, polycarbonate, acrylonitrile-butadiene-styrene copolymer (ABS) resin or Various hard resins such as a polymer alloy resin obtained by combining these resins can be used.

The material and thickness of the oversheets 3 and 4 are preferably 80% or more as measured by total light transmittance. Those having a high light transmittance are transparent and can be seen without impairing the color tone and aesthetic appearance of the printed pattern.
In such an over sheet, polyvinyl chloride, PET-G,
Polycarbonate, polymethyl methacrylate, polyethylene terephthalate, polybutylene terephthalate, cellulose acetate, nylon, saponified ethylene / vinyl acetate copolymer, polypropylene, polyvinyl butyral, acrylonitrile-butadiene-styrene copolymer resin,
Methyl methacrylate-butadiene-styrene copolymer resin or a polymer alloy resin thereof can be used.

Next, a second embodiment of the IC carrier with a plate-shaped frame according to the present invention will be described with reference to FIGS.
The second embodiment of the present invention is different from the first embodiment in that a half-cut 11a, a half-cut 11a, is used instead of the cut-off sewing machine 10 formed in the connection portion 12 between the IC carrier 8 and the plate-shaped frame 6. 11b is formed. This half cut may be formed from one side or both sides of the IC carrier with a plate-shaped frame.

FIG. 6 shows a case where the half cuts 11a and 11b are formed from both sides of the IC carrier 1 with the plate-shaped frame.
The width of b is 0.05 mm to 0.5 mm, and the depth of the half cuts 11a and 11b is 0.10 mm to
It is preferably 0.25 mm. When the half cut is formed only on one side of the IC carrier 8 with the plate-shaped frame, the width of the half cut is 0.05 mm to 0.5 mm.
5 mm, the depth is 0.20 mm to 0.50 mm
It is preferable that

By forming the half-cut depth in the above-mentioned range, the IC carrier 1 with the plate-shaped frame can be formed.
The IC carrier 8 can be appropriately cut off from the plate-shaped frame 6 of the above, and even if the whole of the IC carrier 1 with the plate-shaped frame is bent or twisted, cracks or breaks occur in the half-cut portion. As a result, the risk of the IC carrier 8 dropping from the plate-like frame 6 carelessly is reduced.

As an embodiment, an IC with a plate-shaped frame according to the present invention will be described.
Regarding the IC carrier as the carrier 1 having a connection portion formed on one side edge thereof and the IC carrier as a comparative example having a conventional specification having six bridges (connection portions) on four sides, In order to compare bending strength and torsional strength, a test was performed under the following conditions.

1: A bending test (bending) shown in ISO 7816-1 ANNEX was performed under the condition that the bending amount was increased by +4 mm. 2: In the torsion test (torsion) shown in ISO 7816-1 ANNEX, the test was performed under the condition that the amount of twist was increased by + 10 °. Number of test pieces: 25 each Judgment criteria: The test was conducted and cracks, breaks, IC
It is assumed that there is no loss of the carrier.

As a result of the test, the results shown in Table 1 were obtained.

[Table 1]

As shown in Table 1 above, all of the IC carriers 1 having a plate-shaped frame according to the present invention, in which a connection portion is formed on one side edge of the IC carrier, have cracks, It was confirmed that there was no breakage and no dropout of the IC carrier.

Next, in order to confirm the suitability of the above-mentioned half-cut forming conditions, tests on the breaking strength, bending strength and torsional strength with respect to the cutting depth of the half-cut were performed under the following conditions. The breaking strength test was performed as shown in FIG.
As shown in the figure, the upper and lower portions of the card base, which is the IC carrier 1 with the plate-shaped frame, are fixed, and pressure is applied from the front side of the IC carrier, and at this time, the angle between the plate-shaped frame surface and the IC carrier surface Was set as the indentation angle θ, and the occurrence of the deformation of the connection portion with respect to the indentation angle θ was confirmed. The card dimensions of the IC carrier 1 with a plate-shaped frame are based on ISO
In accordance with 7810, the material was evaluated by PVC and PET-G.

Table 2 shows the results of the test.

[Table 2]

From the test results shown in Table 2 above, when a half cut is formed on one side of the connection portion, the depth is formed to be 0.20 mm to 0.50 mm, and the half cut is formed on both sides. In the case where is formed, it can be confirmed that it is appropriate to form the depth from 0.10 mm to 0.25 mm from the front and back sides when it is evaluated from the breaking strength, the bending strength and the torsional strength. Was.

[0029]

As described above, in the IC carrier with the plate-shaped frame of the present invention, as compared with the conventional specification, the connection portion can be formed even if the plate-shaped frame is subjected to bending stress or torsion that causes plastic deformation. There is an effect that there is little risk that the IC carrier is cut off immediately and the IC carrier is separated from the plate-shaped frame. Furthermore, by forming a sewing machine or a half-cut for cutting of a predetermined specification at the connection part, in comparison with the conventional specification, the IC carrier is applied from the plate-shaped frame body by applying an appropriate pressure to the IC carrier when necessary. There is an effect that the IC carrier can be taken out and the IC carrier is not carelessly cut from the plate-shaped frame. Further, since the notch is formed at one corner of the IC carrier, the IC carrier can be accurately set when the IC carrier is set on a mobile phone or the like.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of an IC carrier with a plate-shaped frame according to the present invention.
It is a top view of an embodiment.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a cross-sectional view showing a state where an IC carrier is removed from the plate-shaped frame in the state shown in FIG. 2;

FIG. 4 is a cross-sectional view of the plate-like frame according to the first embodiment of the present invention.
It is a top view showing the state where C carrier was removed.

FIG. 5 shows a second embodiment of the IC carrier with a plate-shaped frame according to the present invention.
It is a top view of an embodiment.

FIG. 6 is a sectional view taken along line BB of FIG. 5;

FIG. 7 is a plan view showing a conventional IC carrier with a plate-shaped frame.

FIG. 8 is a plan view showing a state after an IC carrier is removed from a conventional IC carrier with a plate-shaped frame.

FIG. 9 is a diagram for explaining a pushing angle in a breaking strength test in Table 2.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC carrier with plate-shaped frame of this invention 2 Core sheet 3, 4 Oversheet 5 Card base material 6 Plate-shaped frame 7 IC module 8 IC carrier 9 Slit part 10 Cutting machine 11a, 11b Half cut 12 Connection part 13 Notch 20 IC Card 21 IC Module 22 Plate Frame 23 Slit 24 Bridge 25 IC Carrier

Claims (5)

[Claims] 1. An IC carrier with a plate-shaped frame, wherein a plate-shaped frame and an IC carrier having an IC module formed inside the plate-shaped frame are connected by a connection portion, Is formed on one side edge of the IC carrier, the connection portion is formed narrower than a width dimension of the IC carrier, and a slit portion is formed on another peripheral edge of the IC carrier where the connection portion is not formed. An IC carrier with a plate-shaped frame, characterized in that: 2. The IC carrier with a plate-like frame according to claim 1, wherein a cutout sewing machine or a half cut is formed in the connection portion. 3. The connecting portion is formed so as to be cuttable from one side by half-cutting, the half-cut has a width of 0.05 mm to 0.5 mm, and a depth of 0.20 mm to 0.5 mm from the one side. 2. The IC carrier with a plate-shaped frame according to claim 1, wherein the IC carrier is formed to have a thickness of 0.50 mm. 4. The connecting portion is formed so as to be cuttable by half-cutting from both sides, the width of the half-cut is 0.05 mm to 0.5 mm, and the depth is 0.10 mm from each of the both sides. The IC carrier with a plate-like frame according to claim 1, wherein the IC carrier is formed to have a thickness of 0.25 mm. 5. The IC carrier with a plate-shaped frame according to claim 1, wherein a notch is formed at one corner of the IC carrier.