JP2002234529A - Paper container with ic chip, ic chip installing method, and ic chip installing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a paper container having an IC chip installed therein, a method for installing the IC chip to the paper container and an apparatus for installing the IC chip to the paper container. SOLUTION: There is provided a paper container having an IC chip in which it has a joint panel, the joint panel is overlapped on another panel through an adhesive agent and an IC chip is fixed between the joint panel and another panel through the adhesive agent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paper container having an IC chip mounted thereon, a method of mounting an IC chip on a paper container,
And an apparatus.

[0002]

2. Description of the Related Art Bar codes such as ITF and JAN codes printed on cardboard boxes such as paper containers and cardboard boxes have been adopted in almost all boxes in recent years. This barcode is directly attached to a case or a label in a printing process such as flexographic printing, offset printing, or gravure printing, and is attached off-line. In the outer box, two ITFs
There are four barcodes in one box, such as two JAN codes. These codes are yellow on a white background,
There are restrictions on the colors used, as the purple color cannot be read on the tea ground. Further, in corrugated cardboard printing, printing is performed by applying a printing pressure with a rubber relief printing plate on a corrugated cardboard sheet having irregularities of about 100 μm, so that the thickness of the bar greatly depends on the printing pressure. However, the corrugated cardboard sheet has a difference in printing pressure between the top and the bottom, and there is a problem that the thickness of the bar differs from bar to bar and even to one bar at the left and right edges. Therefore, only large barcodes can be entered. Even in the case of gravure printing, in the case of a corrugated cardboard liner having a rough surface, it is necessary to correct the thickness of the bar at the stage of the film master. In recent years, barcode readers have become high-speed readers due to advances in visible light semiconductor laser devices. Since it is a leader and not a verifier, it is a management standard and does not become a guaranteed reading value. Some cardboard printing cannot read JAN codes.

[0003] In the packing operation, it takes time and effort to perform a bar code, such as checking whether a single carton is inserted into the master carton or a wrong packing of various individual packages into the master carton. The reader must read the information one by one close to the barcode position of the product regardless of the warehouse or store. Product information cannot be recorded collectively. If you are doing business, the distribution revolution of the Internet information society wants to know which traders have the inventory of the products you want. If a large number of vendors have stock of the product, it is convenient to know quickly which vendor will deliver the cheapest or earliest. There is no standard for integrating these information services.
That is, it is convenient if many stocks of a store, a wholesaler, or a maker can be instantly read by a reader and displayed on a web database such as an article name, stock amount, delivery date, and unit price.
In the IT software world, related companies are developing platforms, but this is an urgent issue in commercial distribution. As described above, some barcodes at present cannot be read depending on the accuracy and quality of barcode printing. Due to the optical reading method, the bar code itself must be exposed on the surface, the design side of the paper container must be sacrificed, and high quality printing is required because line clarity is required. There is a need. Further, with respect to the environment, it is necessary to maintain an environment that is susceptible to dirt and dust during manufacture, distribution, storage, and sale, and that can always be read. On the information side and the function side, there are problems that the number of digits is small, information cannot be added or changed, there is no security, and a large amount of batch processing cannot be performed by single reading.

As an alternative to a bar code, there is an IC chip storing various kinds of information. However, the IC chip itself is relatively expensive, and the IC chip can be efficiently attached to a paper container or the like. Since there is no device and the cost of mounting it is further added, it has not been widely used. Some IC chips have been reduced in size by reducing the size of the IC chip itself. However, the reduction in size makes the mounting of the IC chip more difficult, and the cost becomes even more expensive. Was something.

[0005]

Therefore, according to the present invention, by mounting an IC chip on a joint portion of a paper container, a conventional adhesive bonding apparatus can be used, the IC chip can be loaded well at a high speed, and the adhesive is also used. A paper container with an IC chip built therein can be manufactured economically and efficiently without using it.
In addition, since it is not a secondary-processed label-like non-contact IC chip tag, it can be mounted at lower cost. In addition, non-contact IC
The tip is hidden in place in the joint and cannot be seen visually. Since the mounting position is not known, it is effective to determine the forgery of brand products. The paper container does not rub against each other during distribution, and the non-contact IC chip does not detach. Further, when it is necessary to collect the IC chip, the position of the IC chip can be printed on the front panel to which the joint is pasted, and cut and collected.

[0006]

According to a first aspect of the present invention, there is provided a paper container having a joint panel, wherein the joint panel is overlapped with another panel and bonded with an adhesive. A paper container with an IC chip, wherein the IC chip is fixed via the adhesive therebetween.

According to a second aspect of the present invention, there is provided a step of applying an adhesive 6 to one of a joint panel and another panel constituting a joint portion of a blank of a paper container, and providing one IC chip on the adhesive 6. Loading and bonding, folding the joint panel and the other panel, bonding the joint panel and the other panel with an adhesive, and fixing the IC chip between the joint panel and the other panel. This is an IC chip mounting method.

According to a third aspect of the present invention, there is provided an IC chip mounting apparatus for mounting an IC chip on a blank adhesive of a paper container in which an adhesive 6 is applied to one of a joint panel and another panel constituting a joint portion. A mechanism for detecting the position of the adhesive layer of the blank, a mechanism for removing one IC chip from the IC chip portion according to the detection mechanism, and a mechanism for mounting the IC chip on the adhesive. An IC chip mounting device characterized by the above-mentioned.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A paper container according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of a paper container 1 of the present invention,
The body panel is made of corrugated cardboard, and four body panels 2, and a lid panel 3 and a bottom panel 4 are respectively connected to upper and lower portions of each body panel through broken lines. The blank is formed by assembling a blank in which the joint panel 5 is connected to one side of the body panel. In the assembly, an adhesive 6 is applied to the inner surface of the joint panel, and the inner surface of the joint panel is overlapped and adhered to the surface of the open side of the other body panel to form a joint portion 11 to form a cylindrical body. I do. Thereafter, the bottom panel and the lid panel are appropriately bent and adhered or fixed using a fastener (adhesive tape, metal fittings, or the like). And
Adhesive panel 5 at joint 11 of paper container 1
An IC chip 10 is fixed between the body panel 2 and the body panel 2 using an adhesive 6. This state is described in the enlarged sectional view of FIG.

Here, the paper container of the present invention is a cardboard box,
A structure in which an adhesive panel is provided, and the adhesive panel is stacked on another panel and bonded with an adhesive, thereby forming each part such as a body, a lid, a bottom, and a handle, for paper containers and the like in general. Box. Another example of the paper container according to the present invention and the mounting position of the IC chip are as follows.
Attach the IC chip to the joint of the box. Attach it to the joint between the adhesive panel on the trunk of the sack box and the trunk panel. An IC chip is mounted on a joint portion of a bottom forming panel of an automatic lock bottom type paper container.
Attach the IC chip to the joint of the wraparound case. Etc. can be given.

The information stored in the IC chip of the present invention is not particularly limited, but may include merchandise information (commercial name, manufacturer, seller's name, address, telephone number, number of pieces, price, manufacture, etc.). Location, country of manufacture, etc.), production information (model number, production lot, date, machine, person in charge, etc.), date of manufacture, expiration date, information from manufacturers and sellers (new product information,
Campaign information), information from stores, raw material producer information (place of origin, name, etc.), container material information (material, composition, MSDS, recycling separation information, separation collection code, life cycle inventory or assessment information, number of recyclings, etc. ), Solid information (ID number,
In-product information such as expiration date), logistics information (destination, manufacturing country, handling precautions, etc.), handling precaution information, internal product information such as brand forgery prevention, etc. It is also possible to combine only other information. The IC chip may be a single unit, a tagged unit, a built-in antenna, or a unit provided with an antenna separately.

In this embodiment, since the non-contact IC chip chip with the antenna is sandwiched between the joints, the information in the IC chip chip can be read at any time by a wireless communication signal from a reader / writer in a non-contact state from outside the paper container. Can read and write. In addition, reading of information stored in the IC chip can be performed at any time by a wireless communication signal from a reader / writer in a non-contact state from outside the paper container. With such a function, the paper container of the present invention can collectively read the paper container containing the products stacked on the pallet by the reader. You can check the number of paper containers (individual packaging) in the exterior and mistakes in the packaging from outside. A great deal of information such as recycling information can be input. Etc. can be used. Although the use of the IC chip in the IC chip mounting body is not particularly limited, the IC chip can be used for prevention of theft of goods, prevention of forgery, tracking of distribution routes, product identification, sorting tags for delivery, and the like. As another example of the use method of the paper container of the present invention, information stored in the non-contact IC chip of the paper container is read by a reader, and shipped, received, inspected, and managed in a factory, warehouse, distribution center, store, or the like. , Inventory, journals, tracking, reconciliation,
Destination management can also be performed. In addition, vendors who are developing into a real-time inventory management system as an Internet inventory management system can easily purchase items that they want to access, comparing delivery times and cheapness.
Further, the information of the IC chip can be read from the reader and taken in the personal computer web database.

Next, a method of manufacturing the paper container will be described. An adhesive 6 is applied to one of a joint panel and another panel constituting a joint portion of a blank of a paper container (cardboard box, paper container). After applying adhesive 6, remove IC chip 1
Is loaded on the adhesive 6. Thereafter, the blank is made into a box, the joint panel and the other panel are folded, and the joint panel and the other panel are bonded with the adhesive 6, and the IC chip is fixed between the joint panel and the other panel.

Next, an apparatus used in the above-described mounting method will be described. A mounting apparatus 100 according to the present invention shown in FIG. 3 is a post-adhesive coating apparatus 200 (regardless of the top coat or under coat of an adhesive such as a gluer, flexo folder gluer, and bottom lock luer), and is provided with a box making device (not shown). ) Is installed in the previous process. As shown in FIGS. 3 and 4, the present apparatus 100 includes an input roller 11 having an IC chip supply magazine 101 for stacking and storing IC chips 10 and a claw 111 for adsorbing the IC chips 10 by air grooves 140.
0, the positive pressure of the chip suction air switching valve 113 on the roller rotating shaft connected to the stepping motor 112 by a gear,
Dog 120 and sensor 121 that take the timing of negative pressure
And a sensor 122 for instructing the chip mounting position.

Next, referring to FIG. 5, a procedure for changing the air by the air switching valve 113 using the dog 120 and the sensor 121 in the IC chip mounting step for explaining the operation of the apparatus 100 will be described. The IC chip input roller 110 rotates clockwise to pick up the IC chip 10. At this time, air is not working due to the positional relationship between the dog 120 and the sensor 121. The IC chip input roller claw 111 hooks and takes out only one IC chip 10 (shown in FIG. 6).
At this time, the dog 120 shields the sensor 121 and a negative pressure is applied to attract the IC chip 10 to the input roller 110. The charging roller 110 rotates clockwise while adsorbing the IC chip 10, stops at a lower position, and waits. Since the motor 112 is a stepping motor, it is rotated and stopped at a required angle. When the paper container blank 300 to which the adhesive has been applied is conveyed by the folding belt and reaches the sensor 122, the IC chip input roller 110
Is switched to the positive pressure. The positive pressure is applied for a very short time by a timer. The IC chip is sprayed and adhered to the adhesive layer 6 of the blank with a positive pressure. By changing the distance between the chip feeding roller 110 and the sensor 122, the mounting position of the chip with respect to the blank can be set. The blank 300 on which the IC chip 10 is mounted passes as it is and enters a folding section where the box is folded. On the other hand, the input roller 110 rotates clockwise to pick up the next IC chip 10 and does not operate the air until the claw 111 reaches the chip. In this way, the IC chips are accurately attracted one by one to the claws 111 of the chip feeding roller 110 one by one, and are mounted at predetermined joint positions of the blank of the paper container. After that, the blank 300 is converted into an IC by a box making machine.
A joint flap provided with a chip and an adhesive is folded on another flap and bonded by an adhesive. This device takes out IC chips one by one and sprays them one by one, and can help to easily deform and incorporate into various parts, packages and the like in cooperation with an adhesive application device.

The width of the IC chip is 2 mm to 10 mm.
In the case of a large coin type or the like, the input roller 110 with a push rod 130 that can insert and fix the input roller 110 of the chip input section more stably can be selected. The device and operation in that case will be described with reference to FIGS. The inside of the roller 110 with the tip insertion claw 111 is changed to an air groove 140 in which a cam 131 fixed to a shaft and a push rod 130 with a spring 132 that is protruded when the cam 131 is pushed. The IC chip 10 is hooked by the claw 111 of the
Take out one sheet. At this time, the push rod 130 is retracted, and a negative pressure is applied to attract the chip to the input roller 110. The chip input roller 110 rotates clockwise 45 degrees while adsorbing the IC chip 10, and waits in the horizontal direction. Since the motor 112 is a stepping motor, it is rotated and stopped at a required angle. When the paper container blank 300 with the adhesive 6 attached to the joint flap is conveyed and reaches the sensor 122, the sensor 122 commands the stepping motor to rotate. When the push rod 130 comes down, it is protruded by the fixed cam 131, and at the same time, the air path is closed by the rod, and the IC chip is pressed against the adhesive 6. When the IC chip is crimped, the push rod 130 is immediately retracted slightly by the action of the cam 131 and the spring 132 so as not to drag the IC chip 10. When the tip feeding roller 110 further rotates, the push rod 130 retracts, and at this time, the air of the negative pressure is still stopped by the cam. Negative pressure only works when the tip feed roller goes to the top and is hooked with a claw to suck the tip. In this way, chips can be mounted one by one at the position of the nail. Air control is performed to remove chips one by one from the tip magazine according to the shape of the cam.

[0017]

According to the present invention, the insertion of the IC chip into the joint portion of the paper container allows the conventional box-making machine to be mounted without major changes. Since the IC chip is hidden at a predetermined position in the joint, the IC chip cannot be seen externally. Since the mounting position is unknown, it is effective to determine the forgery of brand products. Paper containers are non-contact ICs that rub against each other during distribution
No chips fall off. When it is necessary to collect the IC chip, the position of the IC chip can be printed on the front panel to which the joint is attached and cut out and collected. Also,
The information stored in the non-contact IC chip of the paper container is read by a reader, and shipped, received, inspected, inventory managed, inventory, journalized, tracked, etc. at factories, warehouses, distribution centers, stores, etc.
If the IC chip has a function of adding or changing information when performing collation, destination management, or the like, information can be added or changed, and security information can be added. Since it is radio wave reading, the IC chip does not need to be exposed on the surface. Resistant to dirt and dust, and resistant to adverse environments. Broader directivity for readers than barcodes. The trouble of arranging the barcode with respect to the target is eliminated. Multiple simultaneous reading (anti-collision,
It can also handle products with multi-lead function.

The method and apparatus of the present invention are economical because they can be manufactured at a high speed because the IC chips are loaded in a box-forming in-line in which a joint to which the IC chips are mounted is bonded at the same time as the adhesive is applied. Furthermore, since it is not a secondary processed label-like non-contact IC tag, it can be mounted at lower cost. The device of the present invention can insert a chip into a desired position by sliding the sensor 1 and changing the interval between the sensor 1 and the roller.
Further, since the device of the present invention is attached after the adhesive application device (such as an adhesive attaching portion of a gluer), the device is not affected by the adhesive application device, and even if the paper container uses a hot melt, the cold glue can be used. Can be used without any problem.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a paper container with an IC chip of the present invention.

FIG. 2 is an enlarged cross-sectional view taken along line AA of FIG.

FIG. 3 is a front view showing an apparatus used for the IC chip mounting method of the present invention.

FIG. 4 is a side view showing the IC chip mounting device of the present invention.

FIG. 5 is an explanatory view showing the operation of the IC chip mounting device of the present invention.

FIG. 6 is a partially enlarged view of the IC chip mounting device of the present invention.

FIG. 7 is a front view showing the operation of the second embodiment of the IC chip mounting device of the present invention.

FIG. 8 is a side view showing a second embodiment of the IC chip mounting device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Paper container 5 ... Joint panel 6 ... Adhesive 10 ... IC chip 11 ... Joint part 100 IC chip mounting device 110 IC Tip feeding roller 111: Claw 140: Air groove 200: Adhesive coating device 300: Blank for paper container

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G06K 19/00 G06K 19/00 Q

Claims (3)

[Claims] 1. A paper container having a joint panel, wherein the joint panel is overlapped with another panel and bonded via an adhesive, and an IC chip is provided between the joint panel and the other panel via the adhesive. I characterized by being fixed
Paper container with C chip. 2. A step of applying an adhesive 6 to one of a joint panel and another panel constituting a joint portion of a blank of a paper container, and a step of loading and bonding one IC chip on the adhesive 6; Folding the joint panel and the other panel, bonding the joint panel and the other panel with an adhesive, and fixing the IC chip between the joint panel and the other panel. 3. An IC chip mounting apparatus for mounting an IC chip on an adhesive of a blank of a paper container in which an adhesive 6 is applied to one of a joint panel and another panel forming a joint portion, wherein the bonding of the blank is performed. An IC comprising: a mechanism for detecting a position of an agent layer; a mechanism for removing one IC chip from an IC chip portion according to the detection mechanism; and a mechanism for mounting an IC chip on the adhesive.
Chip mounting device.