JP2002231532A - Laminated composite device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize the downsizing of a laminated composite device in which respective circuit element layers form one or a plurality of circuit element patterns on the surface of a base layer, and a plurality of circuit element patterns in a plurality of circuit element layers are connected with each other to constitute an electronic circuit for demonstrating a specific function. SOLUTION: In this laminated composite device, an earth electrode 40 is formed on the surface of one dielectric sheet 10 at an intermediate position excluding two dielectric sheets 10 and 10 on both ends, and all inductor patterns 29 are formed in circuit element substrates 1 above the earth electrode 40, and then all capacitor patterns 26 are formed in the circuit element substrates 1 under the earth electrode 40. Therefore, the inductor patterns 29 and the capacitor patterns 26 hardly interfere with each other, and the inductor pattern 29 is made smaller in length than heretofore, resulting in making the laminated composite device compact in size.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer composite device for forming various electronic circuits provided in electronic equipment such as a portable telephone.

[0002]

2. Description of the Related Art As shown in FIG. 4, a portable telephone is equipped with a front-end module (5) composed of a plurality of circuit elements such as inductors and capacitors. Accordingly, a plurality of circuit elements constituting the front-end module (5) are integrated into a one-chip laminated composite device (90) as shown in FIG. 5 and arranged on a main substrate. I have.

A multilayer composite device (90) is formed by laminating a plurality of circuit element substrates (1), and each circuit element substrate (1) has a dielectric sheet (10) made of ceramic. A plurality of circuit element patterns such as an inductor pattern (29) (hereinafter, referred to as an L pattern) constituting an inductor element formed on the surface and a capacitor pattern (26) (hereinafter, referred to as a C pattern) constituting a capacitor element are formed. (Patent No. 3048592, Patent No. 3067612, etc.). These circuit element patterns are connected to the same circuit element substrate (1) as shown in FIG.
Through a conductive path (hereinafter, referred to as a via hole) (30) formed by filling a conductive material such as silver into the through hole (35) of the dielectric sheet (10) or the conductive pattern (22) formed on the They are electrically connected to each other.

The L pattern (29) formed on the surface of the dielectric sheet (10) is spirally formed as shown in FIG. 6, and the L pattern (29) formed on the surface of a certain dielectric sheet (10). When one end (20a) of the pattern (29) is connected to, for example, an upper circuit element substrate (not shown) to supply a current to the L pattern (29), the upper circuit element substrate has the L pattern A via hole (not shown) that contacts one end (20a) of (29) is formed. Also, a via hole (30) is formed corresponding to the center of the spiral of the L pattern (29) of the circuit element substrate (1), and the L pattern (29) is lowered by the via hole (30). (Not shown). Thereby, an inductor element is formed. The C pattern (26) is formed from a flat electrode (21) as shown in FIG. 7, and a conductor pattern (22) extends from an edge of the flat electrode (21). As shown in FIG. 8, a capacitor element is constituted by a pair of C patterns (26) and (26) formed on the surfaces of two layers of dielectric sheets (10) and (10) overlapping each other. Is determined by the area of the opposing surfaces of the pair of planar electrodes.

Further, in the laminated composite device (90),
As shown in FIG. 5, electronic components (70) (71) (72), which are difficult to form a circuit element pattern such as a diode and a resistor, are mounted on the surface of the uppermost circuit element substrate (1). Also, appropriate hierarchy
A ground electrode (40) for grounding each circuit element pattern is formed on the circuit element substrate (1) (for example, the lowermost layer).

[0006] A multilayer composite device to constitute a front-end module is designed as follows. First,
An electronic circuit is designed to realize the functions required as a front-end module, and the shape (dimensions, pattern length, area, etc.) of multiple circuit elements such as inductors and capacitors that make up the electronic circuit are It is determined. Then, based on the shape, the number of stacked circuit element substrates to form the multilayer composite device and the size of the dielectric sheet are determined, and necessary circuit elements are arranged on the surface of the dielectric sheet. Subsequently, the characteristic value of the multilayer composite device is predicted, and the shape of each circuit element is modified so that a predetermined function can be obtained as a front-end module.

When the above-described design is completed, a multilayer composite device is manufactured through the following steps based on the design.
First, a required number of dielectric sheets made of ceramic containing a binder (hereinafter, referred to as green sheets) are produced, and for each green sheet, a through hole is formed based on the arrangement of each circuit element pattern determined by the above-described design. Is established. Next, a required circuit element pattern is printed on the surface of each green sheet using a conductive material such as silver, and the through holes are filled with a conductive material such as silver to form via holes. By laminating a plurality of green sheets produced in this way and performing press working, these green sheets are brought into close contact with each other. Next, by subjecting the laminated green sheets to a sintering process, the binder in the green sheets is removed to obtain an integrated substrate block. Thereafter, the substrate block is divided into chips, and necessary electronic components are mounted on the uppermost circuit element substrate of each chip. Finally, each chip is housed in a casing to complete a laminated composite device.

[0008]

By the way, with the recent demand for further miniaturization of portable telephones, the demand for improvement in the degree of integration and miniaturization of stacked composite devices has become more and more severe. Therefore, conventionally, measures such as arranging as many circuit element patterns as possible on one circuit element substrate have been taken, but there is a limit to narrowing the interval (lead pitch) between adjacent circuit element patterns. Therefore, miniaturization of the multilayer composite device has reached its limit. In such a situation, an object of the present invention is to further reduce the size of the multilayer composite device.

[0009]

In order to achieve the above object,
As a result of intensive studies, the present inventors have found that, for example, in the conventional laminated composite device (90) shown in FIG. 8, as shown by L1 and L2, L4 and L5, and L8 and L9 in FIG. An L pattern (29) and a C pattern (26) formed on a pair of circuit element substrates (1) and (1) overlapping each other may be arranged coaxially. In this case, the L pattern (29) It has been clarified that the C pattern (26) opposes, the opposing surface functions as a capacitor element, and the inductance of the L pattern (29) becomes relatively small. As a result, the L pattern (29) cannot exhibit the desired inductance.
It is necessary to form the circuit length of (29) longer than the design value,
As a result, the area occupied by the L pattern (29) increases,
This prevented the miniaturization of the stacked composite device (90).

Accordingly, the present invention provides a multilayer composite device in which each L pattern exhibits a desired inductance by eliminating mutual interference between the L pattern and the C pattern formed on a plurality of circuit element substrates. Thus, the size of the multilayer composite device is reduced.

The laminated composite device of the present invention is a laminated composite device constituted by laminating a plurality of circuit element layers, wherein each circuit element layer has one or more circuit element layers on a surface of a base layer. A pattern is formed, and a plurality of circuit element patterns formed on a plurality of circuit element layers are connected to each other to form an electronic circuit that should exhibit a predetermined function. Among a plurality of intermediate base layers excluding the two base layers at both ends, a ground electrode is formed on the surface of one base layer, and a plurality of ground electrodes are provided on both sides of the base layer on which the ground electrode is formed. A circuit element layer group consisting of circuit element layers is formed, all the L patterns included in the plurality of circuit element patterns are arranged in one circuit element layer group, and the plurality of circuit element patterns are arranged in the other circuit element layer group. Are arranged. Note that a dielectric layer can be used as the base layer.

In the multilayer composite device of the present invention, the L pattern arranged in the one circuit element layer group and the C pattern arranged in the other circuit element layer group face each other. Even if they are arranged, both patterns do not function as capacitor elements because the ground electrode is interposed between the two patterns. Therefore, L
The desired magnitude of inductance can be obtained in the pattern. As a result, the pattern length of the L pattern can be shorter than that of the conventional multilayer composite device in which the inductance is reduced due to the mutual interference between the L pattern and the C pattern.

[0013] In a specific configuration, the one circuit element layer group is mounted on the mounting board while being spaced apart from the mounting board, and the other circuit element layer group is positioned close to the mounting board. According to the specific configuration, the L pattern arranged in the one circuit element layer group is arranged at a position farthest from both the ground electrode formed on the mounting substrate and the ground electrode formed on the base layer. I can do it. Therefore, it is possible to suppress the function of the capacitor element due to the L pattern forming the surface facing the ground electrode.
The desired inductance can be obtained for the pattern.

[0014]

According to the multilayer composite device of the present invention, the pattern length of the L pattern is shorter than in the prior art, so that the area occupied by the L pattern on the circuit element substrate is reduced. It is possible to reduce the size.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a front-end module of a dual-band portable telephone will be specifically described with reference to the drawings. The dual-band mobile phone according to the present invention is capable of switching and receiving two different frequency bands (for example, a 900 MHz band and a 1900 MHz band) and includes a front end module (5) having a circuit configuration as shown in FIG. . That is, the antenna
The signal received by (51) is distributed to each frequency band through a diplexer (61), and is transmitted from a reception terminal (53) (56) to a subsequent circuit through a transmission / reception switch circuit (62) (64) for each frequency band. Output to Further, at the time of transmission, the transmission signal supplied to the transmission terminals (52) (55) for each frequency band is subjected to a low-pass filter (63) (65) for each frequency band, after which the harmonic components are removed, and then the transmission and reception are switched. The signal is transmitted from the antenna (51) via the switch circuits (62) (64) and the diplexer (61).
The switching of the transmission / reception changeover switch circuits (62) and (64) is controlled by control signals supplied to the control terminals (54) and (57).

As shown in FIG. 1, a multilayer composite device (9) of the present invention comprises a plurality of (for example, 15) circuit element substrates (1).
Each circuit element substrate (1) includes a ceramic dielectric sheet (10),
A plurality of circuit element patterns such as a C pattern (26) and an L pattern (29) formed by printing using silver are arranged on the surface of (10). The ground electrode (40) is provided on the surface of one intermediate dielectric sheet (10) among the plurality of dielectric sheets (10) except for the two dielectric sheets (10a) (10b) at both ends. Is formed. The plurality of circuit element patterns include a strip-shaped conductor pattern (not shown) formed on the same circuit element substrate and a via hole (30) formed by filling a through hole of a dielectric sheet (10) with silver. Are electrically connected to each other.

As shown in FIG. 2, all the L patterns (29) included in the plurality of circuit element patterns are separated from the L6th dielectric layer (10) on which the ground electrode (40) is formed. Are disposed on the upper circuit element substrate (1) of the L1th to L4th layers. In the C pattern (26), a pair facing each other forms an opposing surface to constitute a capacitor element.
The pattern (26) is formed from the L7th layer to the L10th layer below the L6th dielectric layer (10) where the ground electrode (40) is formed.
It is arranged on a layered circuit element substrate (1). Incidentally, the dielectric layer (10) on which the L pattern (29) is formed is used as the ground electrode (40).
When placed directly above the L pattern (29) and the ground electrode (40) form a pair of electrodes to function as a capacitor element, and the L pattern (29) obtains a desired inductance. I can't do that. Therefore, in this embodiment, as shown in FIG. 2, the dielectric layer (10) is placed between the upper dielectric layer (10c) closest to the ground electrode (40) and the ground electrode (40).
Buffer layer without circuit element pattern on the surface of
(11) is disposed to prevent the influence of the ground electrode (40).

Further, in the multilayer composite device (9), as shown in FIG. 1, the surface of the uppermost circuit element substrate (1) is
Electronic components (70), (71), (72) that are difficult to form as circuit element patterns such as diodes and resistors are mounted. Then, the multilayer composite device (9) is mounted on a mounting board (not shown) in the posture shown in FIG.

In the multilayer composite device of the present invention, the ground electrode (40) is arranged between all the L patterns (29) and all the C patterns (26). Since the patterns (26) face each other via the ground electrode (40), they do not function as capacitor elements, and the inductance of the L pattern (29) does not decrease. Therefore, the desired inductance can be obtained in the inductor element. Furthermore, L pattern (29) or C
Even when the design of the pattern (26) is changed, since the L pattern (29) and the C pattern (26) do not affect each other, the L pattern (29) and the C pattern ( L pattern (29) and C pattern other than 26)
Regarding (26), the inductance and the capacitance do not change. Therefore, it is easy to change the design of the circuit element. Also, the circuit element substrate above the ground electrode (40)
Since the L pattern (29) is arranged in (1), many L patterns are located at positions sufficiently separated from both the ground electrode on the mounting board and the ground electrode (40) in the multilayer composite device (9). Since the pattern (29) is arranged, the function as a capacitor element caused by the L pattern (29) forming a surface facing the ground electrode can be minimized.

Next, a method for designing a multilayer composite device of the present invention will be described with reference to the process chart shown in FIG. First, in the design specification concept P1, necessary functions are determined according to specifications required as a front-end module of a dual-band mobile phone. Subsequently, in the circuit design process P2 by a circuit simulator, the necessary functions are determined. Design a circuit to realize the function.
Next, in a circuit parameter optimizing step P3, after determining temporary characteristics of each circuit element and predicting characteristics of the entire circuit, the characteristics of the entire circuit based on the temporary characteristics of each circuit element and the necessary functions are determined. The circuit design process P2 is repeated until they match.

When the required functions are achieved, the shape (dimension, pattern length, area, etc.) of each circuit element is determined in a circuit element design process P4 using an electromagnetic field simulator. The required area of the dielectric sheet is calculated based on the shape of the circuit element. Then, L
In the layout design process P5 of the pattern and the C pattern, the arrangement of the L pattern and the C pattern is determined. At this time, all the L patterns are arranged on one of the plurality of dielectric sheets with the dielectric sheet on which the ground electrode is formed as a boundary. All the C patterns are arranged on the other plurality of dielectric sheets with the dielectric sheet on which the ground electrode is formed as a boundary.

Conventionally, in the layout design step P5 of the L pattern and the C pattern, the L pattern and the C pattern are arranged for each circuit block. Therefore, the L pattern and the C pattern are arranged so as to be coaxially overlapped. I was

Thereafter, in a step P6 of determining the number of layers and the substrate size, the number of layers and the substrate size are determined in consideration of the arrangement of the L pattern and the C pattern. Further, in the layout design process P7 for each layer, the layout for each layer is determined for circuit elements other than the L pattern and the C pattern whose layout is already determined. next,
Overall simulation process P by electromagnetic simulator
In step 8, the characteristics of the entire circuit are predicted in consideration of the influence of mutual interference between the circuit elements. Then, the layout design process P7 for each layer is repeated until the characteristics of the entire circuit match the functions. As a result, when the required functions are achieved and the design of the multilayer composite device according to the present invention is completed, the multilayer composite device is manufactured by the same manufacturing process as the conventional one based on the design result.

In the above-described method for designing a multilayer composite device according to the present invention, the L pattern and the C pattern may be completely separated from each other with respect to the dielectric layer on which the ground electrode is formed. If it is difficult, similar effects can be obtained by arranging as many L patterns and C patterns as possible.

In the above-described embodiment, the pair of plane electrodes (21) (21) constituting the capacitor element are formed of conductive patterns.
Although the configuration connected to another circuit element is shown by (22), the effect of the present invention can be obtained even if the configuration is connected to another circuit element by a via hole (30).

[Brief description of the drawings]

FIG. 1 is a sectional view of a multilayer composite device according to the present invention.

FIG. 2 is an exploded perspective view showing a laminated structure of the laminated composite device according to the present invention.

FIG. 3 is a process chart showing a method of designing a multilayer composite device according to the present invention.

FIG. 4 is a circuit diagram of a front end module of the dual band mobile phone.

FIG. 5 is a sectional view of a conventional multilayer composite device.

FIG. 6 is a partially cutaway perspective view of a circuit element substrate constituting the multilayer composite device.

FIG. 7 is a partially cutaway perspective view of another circuit element substrate constituting the multilayer composite device.

FIG. 8 is an exploded perspective view showing a laminated structure of a conventional laminated composite device.

[Explanation of symbols]

 (1) Circuit element board (10) Dielectric sheet (21) Flat electrode (22) Conductor pattern (26) Capacitor pattern (29) Inductor pattern (30) Via hole (40) Earth electrode (5) Front end module (70 ) Electronic components (9) Multilayer composite device (90) Multilayer composite device

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takayuki Mori 1-1, Sanyo-cho, Daito-shi, Osaka F-term (reference) in Sanyo Electronics Components Co., Ltd. 5E070 AA05 AB01 BA01 CB03 CB13 DA17 5E082 AA01 AB03 BC17 BC39 DD08 EE04 EE35 LL15

Claims (3)

[Claims] 1. A multilayer composite device configured by laminating a plurality of circuit element layers, wherein each circuit element layer has one or more circuit element patterns formed on a surface of a base layer, In a multilayer composite device in which a plurality of circuit element patterns formed on a plurality of circuit element layers are connected to each other to constitute an electronic circuit to perform a predetermined function,
Among a plurality of intermediate base layers excluding the two base layers at both ends, a ground electrode is formed on the surface of one base layer, and a plurality of circuits are provided on both sides of the base layer on which the ground electrode is formed. A circuit element layer group consisting of element layers is formed, all inductor patterns included in the plurality of circuit element patterns are arranged in one circuit element layer group, and the plurality of circuit elements are arranged in the other circuit element layer group. A multilayer composite device, wherein all capacitor patterns included in the pattern are arranged. 2. The semiconductor device according to claim 1, wherein the one circuit element layer group is separated from a mounting board, and the other circuit element layer group is mounted on the mounting board in a posture close to the mounting board.
3. The laminated composite device according to item 1. 3. A multilayer composite device configured by laminating a plurality of circuit element layers, wherein each circuit element layer has one or more circuit element patterns formed on a surface of a base layer, In a method of manufacturing a multilayer composite device in which a plurality of circuit element patterns formed on a plurality of circuit element layers are connected to each other to form an electronic circuit to perform a predetermined function, A ground electrode is disposed on the surface of at least one base layer among the plurality of intermediate base layers except for a plurality of circuit element layer groups including a plurality of circuit element layers located on both sides of the base layer on which the ground electrode is disposed. Of these, the design process involves arranging as many inductor patterns as possible in one circuit element layer group and arranging as many capacitor patterns as possible in the other circuit element layer group. Forming a necessary circuit element pattern on the surface of each base layer based on the arrangement of the circuit element patterns, and laminating and integrating these base layers. Manufacturing method.