JP2002228705A - Contact mechanism and inspection method for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact mechanism capable of providing a uniform load and to provide an inspection device for a semiconductor device capable of improving inspection workability and allowing correct measurement. SOLUTION: This mechanism is provided with a pusher 3, a ball 1 abutting on the pusher, a spring member 2 abutting on the ball, and a pressing means 5 for pressing the spring member, and transmits the spring load to the pusher 3 through the ball 1 by the pressing means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact mechanism and a method for inspecting a semiconductor device, and more particularly, to a contact mechanism and a method for inspecting a semiconductor device in a manufacturing apparatus used in a process of inspecting electrical characteristics in a semiconductor device manufacturing process. About.

[0002]

2. Description of the Related Art Conventionally, various contact mechanisms have been used for a characteristic inspection apparatus, a strength test apparatus, and the like of a semiconductor device (IC).

For example, Japanese Patent Application Laid-Open No. 64-15674 discloses an IC inspection contactor using a contact mechanism as shown in FIG.

In FIG. 1, an IC inspection contactor includes a conductor pattern 26 corresponding to a lead of an IC 22 to be measured.
, A support 23 that supports the support 23 movably up and down, and a support base 25 that supports the support 23 in a vertically movable manner.
3 provided along the column 23 between the support 25 and the support 25
1 and a pusher 32 that presses the measurement substrate 29 in the pressing direction 33 with the IC 22 interposed therebetween. Further, the conductor patterns 26 on the upper surface of the measurement substrate are respectively drawn out to the measurement electrodes 27 on the lower surface, and the measurement wires 28 are usually connected to the respective measurement electrodes 27 to be electrically connected to the measuring instrument.

[0005] As described above, the contactor for IC inspection shown in FIG.
Pattern 26 for taking out an electric signal from the measurement electrode 2
7 can be freely inclined with respect to the measurement substrate 29 having the pusher 32.

Japanese Patent Application Laid-Open No. 5-264424 discloses that
A jig for bending strength test as shown in FIG. 5 is disclosed.

In the drawing, a jig for bending strength test is formed by forming concave portions 41a, 41b on the upper surface of a test piece receiving base 41 on a base 40, providing push pins 42, 43 thereon, and placing a ceramic plate thereon. Is placed. A concave portion 44c is formed on the upper surface of the upper load jig 44 formed on the lower surface with load application fulcrums 44a and 44b abutting on the upper surface of the test piece 49, and formed on the lower surface of the load application rod 46 that presses in the pressing direction 50. Recessed portion 46a and recessed portion 44 of upper load jig 44
c, and a ball 45 is provided between the
6, an upper load jig 44 and a ball 45 are attached to an elastic body 47;
Locked by 48.

[0008] As described above, the jig for bending strength test shown in FIG. 5 uses the upper load jig 4 so that the ball 45 is applied so that a uniform load is applied to the load application fulcrums 44 a and 44 b on the test piece 49.
4. Since it is configured to be installed between the load acting rods 46 and held by the elastic bodies 47 and 48, when the upper load jig 44 is tilted about the ball 45 as a fulcrum according to the inclination of the test piece 49, the elastic body 47 is used. , 48 will contract on one side and extend on the other.

[0009]

In the prior art shown in FIG. 4, however, the measurement wiring 28 for transmitting an electric signal to an external measuring instrument is moved in accordance with the inclination of the measurement board 29, and is broken. There was a problem.

[0010] Furthermore, since the contactor itself is inclined, the shape and configuration are restricted, and there is a drawback that it is not possible to cope with an electrical characteristic test using a general contactor.

On the other hand, in the prior art shown in FIG.
A difference is generated in the elastic forces of 7, 48, and a force is generated with the ball 45 as a fulcrum to tilt the upper load jig 44 so that the elastic force becomes uniform.
A and 44b have the disadvantage that an even load is not applied.

Accordingly, an object of the present invention is to provide a contact mechanism which can be applied to a general-purpose contactor and can obtain a uniform load.

Another object of the present invention is to improve the inspection workability by applying to various shapes and configurations, and to provide a method of inspecting a semiconductor device capable of obtaining accurate load by obtaining a uniform load. It is to provide.

[0014]

According to a feature of the present invention, there is provided a pusher, a ball in contact with the pusher, a spring member in contact with the ball, and pressurizing means for pressing the spring member. The contact mechanism transmits a spring load to the pusher via the ball by a pressure means.

Here, it is preferable that the ball and the spring member are located at a central portion of the pusher and a central portion of the pusher in a planar shape. further,
Preferably, the ball is a steel ball.

Further, a load can be applied to the surface of the package of the semiconductor device on the electric measurement substrate by the pusher. Alternatively, a load can be applied to the leads of the semiconductor device on the electric measurement substrate by the pusher.

Another feature of the present invention is that an electrode provided on one surface of a package of a semiconductor device is brought into contact with a contactor of a measurement substrate, and a load is applied to the other surface of the package to inspect the electrical characteristics of the semiconductor device. The method comprises: a pusher, a ball abutting on the pusher, a spring member abutting on the ball, and pressurizing means for pressing the spring member, and the pusher presses the pusher through the ball. And a contact mechanism for transmitting a spring load to the pusher, and applying the spring load applied to the pusher to the other surface of the package.

Alternatively, another feature of the present invention is a method of inspecting electrical characteristics of the semiconductor device by applying a load to the conductor pattern of a measurement substrate by bringing a lead derived from a package of the semiconductor device into contact with a conductor pattern of the measurement substrate. , A pusher, a ball that abuts the pusher, a spring member that abuts the ball, and a pressing unit that presses the spring member, wherein the pressing unit applies a spring to the pusher via the ball. A method for inspecting a semiconductor device in which a contact mechanism for transmitting a load is prepared, and the spring load applied to the pusher is applied to the lead.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a contact mechanism according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing an embodiment of a semiconductor device inspection method in which the contact mechanism of FIG. 1 is applied to a contactor. FIG. 7 is a cross-sectional view showing another embodiment of a method for inspecting a semiconductor device in which the contact mechanism of FIG. 1 is applied to a measurement substrate.

Referring first to FIG. 1, a pusher 3 made of a rigid material is suspended from a plate 5 by suspension bolts 4. The contact surface of the suspension bolt 4 with the pusher 3 is tapered, receives the load of the spring 2 via the spring receiver 8 and the steel ball 1, and the mounting position of the pusher 3 on the plate 5 is determined. .

The diameter of the hole through which the suspension bolt 4 of the pusher 3 penetrates is set to be larger than the diameter of the suspension bolt 4 by about 0.5 mm.

The contact portion between the steel ball 1 and the spring receiver 8 and the pusher 3 is concave, and the position of the steel ball 1 determined by the concave shape is located at the center of the spring receiver 8 and the pusher 3. To That is, the steel ball 1 and the spring member 2 are positioned at the center (central portion) of the spring receiver 2 and the pusher 3 in the planar shape of the pusher 3 (shape as viewed from above in FIG. 1).

At the center of the distal end of the pusher 3, a suction pad 10 for vacuum-suctioning and transporting the semiconductor device is attached, and the semiconductor device is sucked by evacuating the suction pad 10.

Next, referring to FIG. 2, the operation of the semiconductor device inspection method in which the contact mechanism of FIG. 1 is applied to a contactor will be described.

FIG. 2 is a diagram illustrating the features of the present invention.
Here, when the plate 5 is used as a reference, the case where the measurement substrate 7, the contactor 9, and the semiconductor device 6 are inclined to the upper right in the figure with respect to the plate 5 is shown.

In this electrical characteristic inspection step, the suction pad 1
The protruding electrode 6a formed on one surface (lower surface in the figure) of the package of the semiconductor device 6 sucked and transported by the semiconductor device 6
Are brought into contact with the electrode pads of the contactor 9, respectively, and an electric signal is transmitted to a measuring instrument connected to the outside via the measuring board 7.

Therefore, in order to perform a stable electrical characteristic test, it is important that the unit area load for pressing and contacting the semiconductor device 6 against the contactor 9 is made uniform and highly accurate. Is generally made of a glass epoxy material, and cannot be installed in a semiconductor manufacturing apparatus in equilibrium from the viewpoint of processing accuracy and strength, and it is difficult to apply a uniform unit area load with the conventional technology. .

However, according to the present invention, a uniform unit area load can be applied as will be described below.

That is, when the plate 5 is pressed down by the load in the pressing direction 12, the pusher 3 comes into contact with the other surface (the upper surface in the figure) of the semiconductor device 6. When the pusher 3 is further pushed down by about 2 mm, the contact surface between the suspension bolt 4 and the pusher 3 is separated, and the load of the spring 2 is applied to the pusher 3 via the spring receiver 8 and the steel ball 1, thereby pressing the semiconductor device 6 against the contactor 9.

At this time, the pusher 3 tilts with the steel ball 1 as a fulcrum, and the contact surfaces of the semiconductor device 6 and the pusher 3 come into equilibrium contact, but the spring 2 contracts uniformly in the perpendicular direction and uniformly applies the load. It can be added to the semiconductor device 6.

The spring member 2 generates a load equivalent to the rated load of the contactor 9 and has a spring multiplier of 100.
g / mm, the general semiconductor device 6
0.2 mm, which is the variation in the outer dimensions of the contactor 9
Even if the pressing position of the pusher 3 changes to
The load change can be suppressed to about g.

The amount of load change of 20 g is the number of external terminals 1
In the case of a semiconductor device of 00 Pin, the amount of load change per Pin is as small as 0.2 g, and a sufficiently high-precision load can be obtained with respect to a contact load of 30 to 40 g on a contactor of a general semiconductor device.

As described above, the contact mechanism of the present invention arranges the steel ball 1 at the center of the contact surface between the semiconductor device 6 and the pusher 3 and applies the load of the spring 2 so that the pusher 3 This makes it possible to make equilibrium contact with the fulcrum against the semiconductor device 6, thereby enabling stable electrical characteristic inspection of the contactor and the measurement substrate.

Next, with reference to FIG. 3, an operation of a semiconductor device inspection method in which the contact mechanism of FIG. 1 is applied to a measurement substrate having a conductive pattern will be described.

In the example shown in FIG. 2, the present invention is applied to one semiconductor device. However, the present invention can be easily applied to semiconductor devices having different shapes and measurement substrates. Fig. 3 shows the configuration.
Shown in Note that, in FIG. 3, the same or similar portions as those in FIGS. 1 and 2 are denoted by the same reference numerals, and thus the duplicate description will be omitted.

On the upper surface of the measurement substrate 7 shown in FIG.
The conductor pattern 16 corresponding to the lead extending from the side surface of the package of C6 is formed, and the conductor pattern 16 on the upper surface of the measurement board is drawn out to the measurement electrode 17 on the lower surface, and the measurement wiring 18 is connected to each measurement electrode 17. Is connected and electrically connected to the measuring instrument.

In such a case, it is possible to cope with a semiconductor device 6 having a different shape only by changing the shape of the tip of the pusher 3, and by using the contact mechanism of the present invention as described in the operation of FIG. Even in the case where there is no such a contactor and the sample comes into direct contact with the measurement substrate, it is possible to uniformly apply a load to the balance.

[0038]

As described above, the first effect of the present invention is that the semiconductor device can be brought into equilibrium and uniform contact with a contactor or a measurement substrate directly by using the contact mechanism of the present invention. is there.

The second effect is that the load accuracy when contacting the contactor can be improved. The reason is that a steel ball is used as a fulcrum to provide a pusher that tilts in equilibrium to the contactor and a spring that applies a stable contact load by a spring.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a contact mechanism according to an embodiment of the present invention.

FIG. 2 is a sectional view showing an embodiment of the present invention of a method for inspecting a semiconductor device in which the contact mechanism of FIG. 1 is applied to a contactor;

FIG. 3 is a sectional view showing another embodiment of the present invention of a method for inspecting a semiconductor device in which the contact mechanism of FIG. 1 is applied to a measurement substrate.

FIG. 4 is a diagram showing a conventional technique.

FIG. 5 is a diagram showing another conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Steel ball 2 Spring member 3 Pusher 4 Hanging bolt 5 Plate 6 Semiconductor device 6a Protrusion electrode of semiconductor device 7 Measurement board 8 Spring receiver 9 Contactor 10 Suction pad 11 Vacuum evacuation 12 Pressure direction 16 Conductor pattern 17 Measurement electrode 18 Measurement wiring 21 Supporting part 22 IC 23 Supporting column 24 Supporting point with spherical tip 25 Supporting base 26 Conductor pattern 27 Measurement electrode 28 Measurement wiring 29 Measurement board 31 Spring 32 Pusher 33 Pressing direction 40 Base 41 Test specimen receiving base 41a, 41b Test specimen receiving Table recesses 42, 43 Push pin 44 Upper load jig 44a, 44b Weight support fulcrum of upper load jig 44c Recess of upper load jig 45 Ball 46 Load acting rod 46a Recess of load acting rod 47, 48 Elastic body 49 Test Piece 50 Pressing direction

Claims (7)

[Claims] 1. A pusher, a ball in contact with the pusher, a spring member in contact with the ball, and pressurizing means for pressing the spring member, the pressurizing means interposing the ball through the ball A contact mechanism that transmits the spring load to the pusher. 2. The contact mechanism according to claim 1, wherein said ball and said spring member are located at a central portion of said pusher. 3. The contact mechanism according to claim 1, wherein said ball is a steel ball. 4. The contact mechanism according to claim 1, wherein a load is applied to the surface of the package of the semiconductor device on the electric measurement substrate by the pusher. 5. The contact mechanism according to claim 1, wherein a load is applied to a lead of the semiconductor device on the electric measurement board by the pusher. 6. A method of testing an electrical characteristic of a semiconductor device by contacting an electrode provided on one surface of a package of a semiconductor device with a contactor of a measurement substrate and applying a load to the other surface of the package. A contact that includes a ball that contacts the pusher, a spring member that contacts the ball, and a pressing unit that presses the spring member, and that transmits a spring load to the pusher via the ball by the pressing unit. A method for testing a semiconductor device, comprising preparing a mechanism and applying the spring load applied to the pusher to the other surface of the package. 7. A method for inspecting electrical characteristics of a semiconductor device by applying a lead to a lead of a package of a semiconductor device to a conductor pattern of a measurement substrate and applying a load to the package. A contact mechanism for transmitting a spring load to the pusher via the ball by the pressing means, comprising: a ball that abuts the ball; a spring member that abuts the ball; and a pressing unit that presses the spring member. And applying the spring load applied to the pusher to the lead.