JP2002225565A - Backdoor module and its production method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a backdoor module, which can be produced with a low cost, and the wiring structure for the backdoor module. SOLUTION: On a backdoor module 10, each kind of equipment, units and the like are mounted on an inner panel 21 mounted on an outer panel 22, and a wiring member 30 is formed, the wiring member having a wiring circuit 31 for electrically connecting the equipment with the units. The pattern of the wiring circuit 31 is directly formed on the inner panel 21 by press working, so that the backdoor module 10 can be produced with a low cost.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a back door module to be mounted on a back door of an automobile and a method of manufacturing the same, and more particularly, to a back door module which can be manufactured at a low cost and has a high expandability and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, various electric devices, sensors and switches mounted on a vehicle (these devices are collectively referred to as "equipment"), a control device for controlling these devices and a driving device for driving ( A so-called wire harness in which a plurality of electric wires are bundled together is used to electrically connect these devices to each other. It is assembled to the vehicle body on a production line such as a vehicle assembly line. Conventionally, wire harnesses have also been used for equipment and device units mounted on automobile doors.For example, an electric side mirror, a power window, a door lock device, a lock release lever, and the like are incorporated in an automobile door, and the electric harness is used. In order to connect the equipment and the equipment unit to the inner panel and outer panel of the automobile door on the production line, and after attaching the wire harness, it is provided in advance to the wiring of these equipment and the equipment unit. And a connector provided beforehand at the terminal of the wire harness.

However, in order to manufacture a door for an automobile in such a process, a predetermined number of man-hours such as connection work for each equipment and device unit are required, and the number of parts is increased. In such a production line, such assembling work and wiring work of the wire harness, etc. are performed manually by the operator according to a manual specified in advance, so that the number of man-hours increases and the assembling workability is not good. there were.

Therefore, in an automobile production line, in order to improve assembly workability by reducing the number of assembly steps and the number of parts, and to reduce assembly costs and parts costs, for example, an instrument panel, a roof, a door and a back are used. 2. Description of the Related Art Each component of an automobile such as a door is modularized in advance for each part. Here, the module is
It is an integrated combination of existing parts such as various equipment and equipment units and automotive components. In this modularization, for example, for each part such as an instrument panel, necessary parts are assembled in advance by a part maker or the like to make a module (subassembly), and then each module is assembled to a vehicle body in a production line of an automobile maker. Since the work is performed, it is possible to reduce the number of assembly steps and the number of parts, improve the assembling workability, and reduce the assembly cost and the parts cost. In addition, modularization not only reduces such costs, but also contributes to reducing the weight of automobiles by reducing the weight of components as a whole that are assembled into automobiles as part of environmental protection measures. FIG. 6 is a developed view of such a modularized automobile back door. According to this, for example, a component such as a wiper motor 202, an actuator 203, and a wire harness 204 connecting the wiper motor 202, the actuator 203, and the like is previously attached to an inner panel 201 attached to an automobile back door 200, and modularized as a back door module 205. .

As a further development of the sub-assembly module as described above, there is a function integration type module. As a further development of this function integration type module, a function fusion type module is considered.
A function-integrated module is a module that integrates the functions between various equipment and equipment units and is integrated with the components, and a function-integrated module is a combination of various equipment and equipment units and these equipment. And wirings such as a wire harness that connects between device units, and is integrally connected to components of an automobile.

Prior to such modularization,
For example, a flexible printed circuit (Flexible printed circuit) is used instead of a conventional wire harness in an automobile manufacturing line.
Printed Circuits (FPC) Even if you want to use a harness, if you want to assemble the FPC harness to the car body, it is necessary to design a structure that allows the FPC harness to be successfully assembled on the car body side, and to use the FP used for ordinary electronic components.
Since a large FPC harness was required as an FPC harness to be attached to a vehicle body rather than a C harness, it was difficult to employ an FPC harness instead of a wire harness.

[0007] However, with the progress of modularization,
For example, it is possible to design a structure that allows the FPC to be assembled successfully on the component parts side (module side) such as the instrument panel, and it is also possible to divide the FPC harness into parts (by module) and to assemble it. Compared to the case where the FPC harness is directly assembled, a small FPC harness can sufficiently cope with the situation, and the FPC harness can be adopted. In addition, by adopting the FPC harness, for example, it is possible to make the module thinner and lighter and to mount components.
In particular, so-called component-mounted FPC harnesses, in which circuit components such as various equipment and device units are mounted on the FPC harness, are capable of higher-density wiring than wire harnesses using electric wires, and also have excellent expandability. ,
It is receiving much attention as wiring for function-integrated modules.

[0008]

As shown in FIG. 7, an FPC harness 100 has an adhesive 102 on an insulating film 101 made of, for example, polyethylene terephthalate (PET) or polyethylene naphthalate (PEN). A wiring 103 made of a conductive pattern is formed by laminating a copper foil through the interposer, and the insulating film 101 and the wiring 103 are formed in order to protect a circuit made of the formed wiring. It is common to adopt a structure in which a coverlay film made of a synthetic resin or the like having electrical insulation properties is covered thereon as the upper cover 104, or a structure in which a cover is formed by resist printing instead of the coverlay film. . In particular, when an FPC harness is applied to the module or the like, the cover is often covered with a cover lay film to improve the damage resistance.

[0009] However, the FPC harness has a high cost and a high cost of the copper clad laminate (CCL) itself, which is a material for covering a coverlay film, and has a high number of manufacturing steps, which is complicated and high. Low yield, etc., the mere use of FPC harnesses instead of wire harnesses has increased the cost of parts for modules such as instrument panels, despite lowering assembly costs in the production line of angle-cut automobiles. And
As a result, the entire manufacturing cost increases, and there has been a problem that it is difficult to actively introduce the FPC harness as a wiring member of the module.

[0010] The present invention has been made in view of the above problems, and has as its object to provide a back door module which can be manufactured at low cost and a method of manufacturing the same.

[0011]

A method of manufacturing a back door module according to the present invention is configured by combining an inner panel disposed on the vehicle interior side with an outer panel disposed on the vehicle exterior side. A method of manufacturing a back door module that integrates an equipment and a device unit attached to an automobile back door and a wiring circuit that electrically connects the equipment and the device unit, wherein the inner member made of a resin member The method is characterized in that a foil-like conductive material is pressed on a panel by press working, and the wiring circuit is directly patterned on the inner panel.

According to the method of manufacturing a back door module of the present invention, an inner panel made of a resin member of a back door for an automobile constituted by combining an inner panel and an outer panel is formed by press working such as die stamping. , A copper foil or the like is pressed to directly pattern a wiring circuit. Therefore, the manufacturing process is simple, and the remaining copper foil other than the copper foil on which the wiring circuit is formed can be reused by press working, so that the yield is good. As a result, the back door module itself can be manufactured at a lower cost than when a wiring member such as an FPC harness is attached.

The wiring circuit is formed by a hot stamping method such as a die stamping method using a conductive material having at least one surface subjected to a surface roughening treatment or a conductive material coated with a thermosetting or thermoplastic adhesive. It is good to be formed by processing. This is because a wiring circuit can be formed on the inner panel with high adhesion. Also, it is considered that an electrolytic copper foil or a rolled copper foil is suitable as the conductive material. Electrolytic copper foil or rolled copper foil,
This is because they are relatively inexpensive, easy to process and the like, and most commonly used.

The back door module according to the present invention comprises:
Equipment and device units attached to a back door for a vehicle configured by combining an inner panel disposed on the vehicle interior side and an outer panel disposed on the vehicle exterior, and between the equipment and device units. A wiring circuit for electrically connecting the inner circuit, wherein the wiring circuit is formed by pressing a foil-shaped conductive material on the inner panel made of a resin member by pressing. It is characterized by being directly patterned on the panel.

[0015]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a side perspective view showing an automotive back door equipped with a back door module according to one embodiment of the present invention, and a front view showing an inner panel.

As shown in FIG. 1A, the back door module 10 includes an outer panel 2 disposed outside the automobile (not shown) constituting the automobile back door 20.
2 (b) on the inner panel 21 attached to
As shown in FIG.
And the driving of electrical equipment such as an electric wiper (not shown) attached to the back door 20 for automobiles.
A device unit (not shown) for performing control and the like is mounted, and a wiring member 30 including a wiring circuit 31 for electrically connecting these electrical equipment, equipment and the device unit is formed. The connection between the wiring member 30 and a device unit or the like (including electrical equipment and equipment) is performed by, for example, the wiring member 30.
And a connector section 32 provided in advance and connected to the wiring circuit 31 of the terminal section and a connector section 29 prepared in advance on the terminal section of the wiring 28 of the device unit or the like. Can be. The inner panel 21 of the back door module 10 is made of a resin member such as a synthetic resin, for example. The wiring member 30 is a so-called flat wire, and the wiring circuit 31 is
The copper foil or the like is directly formed on the inner panel 21 by patterning.

The inner panel 21 of the automobile back door 20 is provided with the above-mentioned electrical equipment.
There are provided a plurality of working openings 27 each having a working hole used for connecting to the above-mentioned equipment and apparatus unit attached to the device 1. The worker who assembles the back door 20 for the automobile can use the back door module 10
By using the work opening 27, the electrical equipment such as the electric wiper attached to the outer panel 22 side, and the equipment and the equipment unit, for example, are attached to the outer panel 22 via the wiring circuit 31 of the wiring member 30. By simply connecting the inner panel 21 constituting the back door module 10 to the outer panel 22 which is electrically connected, the assembling work in which the wiring and connection work of the back door 20 for the vehicle is integrated can be performed. Thereby, the back door 2 for the automobile
Since the number of assembling work steps in the manufacturing line of No. 0 can be reduced, the manufacturing cost can be reduced.

FIG. 2 is a flowchart showing a manufacturing process of the back door module 10 mounted on the back door 20 for a vehicle.

First, an inner panel 21 of an automobile back door 20 is formed by molding a resin member such as a synthetic resin or the like (step S1). After the inner panel 21 is formed, a copper foil such as a rolled copper foil or an electrolytic copper foil, which has been subjected to a surface roughening treatment using, for example, a polishing solution or an abrasive, or a thermosetting resin or a thermoplastic resin. A conductive material such as a copper foil to which an adhesive has been applied is placed at a wiring circuit forming position on the inner panel 21 (step S2). For example, when a copper foil is used as the conductive material, when the copper foil is subjected to a surface roughening treatment,
As shown in FIG. 3, fine particles of copper are precipitated on the surface of the copper foil as compared with the case where the surface roughening treatment is not performed, so that the adhesive strength with the inner panel 21 at the time of thermocompression bonding is higher than usual. Can also be increased. Next, in step S2, a pressing process such as a die stamping method is performed on the conductive material such as a copper foil placed on the inner panel 21.
The wiring circuit 31 is directly patterned on the inner panel 21 (step S3).

Here, FIG. 4 and FIG.
FIG. 9 is a diagram for explaining a method of forming the wiring circuit 31 by die stamping method used in the step 3; for example, the processing circuit 33 of the die stamp die 37 has the wiring circuit 3;
1 is formed in a pattern, and a circuit forming portion 34 formed of a convex portion or a ridge for thermocompression bonding to the inner panel 21 is formed. After the die stamping die 37 is heated in advance, it is pressed against the conductive material 35 placed on the inner panel 21, so that the conductive material 35 where the circuit forming portion 34 is in contact is thermocompression-bonded to the inner panel 21. Then, the wiring circuit 31 is formed directly on the inner panel 21 by removing the conductive material 35 of the other portion from the inner panel 21 with a recycle roll (not shown) or the like. As shown in FIG. 5, die stamping may be performed between the inner panel 21 and the conductive material 35 via a thermosetting or thermoplastic adhesive 38. This is because the bonding reliability between the inner panel 21 and the conductive material 35 can be improved in this way.

After the wiring circuit 31 is formed on the inner panel 21 in step S3, the insulating protection layer 36 made of a synthetic resin or the like for protecting the wiring circuit 31 is covered with the wiring circuit 31.
The wiring member 30 such as a flat wire is formed on a predetermined area of the inner panel 21 including the first and second wires by a method such as thermocompression bonding (step S4). Finally, the inner panel 2 on which the wiring members 30 are formed,
1 (step S5), and the back door module 1
0 is completed. Thus, the backdoor module 10
By forming the wiring circuit 31 directly on the inner panel 21 and forming the wiring member 30, for example,
As compared with the case where a wiring member such as a C harness is attached, material costs, work costs, and the like can be reduced, so that the back door module 10 can be manufactured at low cost.

[0022]

As described above, according to the present invention,
For example, a copper foil or the like is pressed on an inner panel made of a resin material of an automobile back door configured by combining an inner panel and an outer panel by press working such as a die stamping method to directly form a wiring circuit. Therefore, the manufacturing process is simple, and the remaining copper foil other than the copper foil on which the wiring circuit is formed can be reused by press working, so that the yield is good. As a result, FPC
As compared with the case where a wiring member such as a harness is attached, an effect is obtained that the back door module itself can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a side perspective view showing an automobile back door equipped with a back door module according to one embodiment of the present invention, and a front view showing an inner panel.

FIG. 2 is a flowchart showing a manufacturing process of the back door module.

FIG. 3 is an enlarged view showing a state of a copper foil surface.

FIG. 4 is a diagram for explaining a method of forming a wiring circuit by a die stamping method.

FIG. 5 is a diagram for explaining a method of forming a wiring circuit by a die stamping method.

FIG. 6 is an exploded perspective view of a conventional modularized automobile back door.

FIG. 7 is a sectional view showing a structure of an FPC harness.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Back door module, 20 ... Car back door, 21 ... Inner panel, 22 ... Outer panel, 2
3 Wiper motor, 24 Actuator, 27 Work opening, 28 Wiring, 29, 32 Connector, 30
... wiring member, 31 ... wiring circuit, 33 ... processing surface, 34 ... circuit forming part, 35 ... conductive material, 36 ... insulating protective layer, 37 ... die stamping die, 38 ... adhesive.

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor, Takehisa Ide, 1440, Mukurosaki, Sakura City, Chiba Prefecture Inside Fujikura Sakura Office (72) Inventor, Seiji Ohba 1440, Musaki, Sakura City, Chiba Prefecture Inside Fujikura Sakura Office Terms (reference) 3D114 AA05 BA13 CA03 CA07

Claims (6)

[Claims] 1. An equipment and a device unit to be mounted on a back door for a vehicle configured by combining an inner panel disposed on the vehicle interior side with an outer panel disposed on the outside of the vehicle, and these devices A method for manufacturing a back door module that integrates a wiring circuit for electrically connecting devices and device units, wherein a foil-like conductive material is pressed by press working on the inner panel made of a resin member, A method of manufacturing a back door module, wherein the wiring circuit is directly patterned on the inner panel. 2. The wiring circuit according to claim 1, wherein the wiring circuit is formed using a conductive material having at least one surface subjected to a surface roughening process, and the pressing is a hot pressing by a die stamping method. Item 7. A method for manufacturing a back door module according to Item 1. 3. The wiring circuit is formed using a conductive material having at least one surface coated with a thermosetting adhesive, and the press working is a hot press working by a die stamping method. The method for manufacturing a back door module according to claim 1. 4. The wiring circuit is formed using a conductive material having at least one surface coated with a thermoplastic adhesive, and the pressing is a hot pressing by a die stamping method. A method for manufacturing a back door module according to claim 1. 5. The method according to claim 1, wherein the conductive material is an electrolytic copper foil or a rolled copper foil. 6. A device and a device unit to be mounted on a back door for a vehicle configured by combining an inner panel disposed inside a vehicle and an outer panel disposed outside the vehicle, and these devices. A back door module in which a wiring circuit for electrically connecting equipment and device units is integrated, wherein the wiring circuit is formed by pressing a foil-shaped conductive material on the inner panel made of a resin member by pressing. And a back door module directly patterned on the inner panel.