JP2002222912A - 高周波マルチチップモジュール及び製造方法 - Google Patents

高周波マルチチップモジュール及び製造方法

Info

Publication number
JP2002222912A
JP2002222912A JP2001018194A JP2001018194A JP2002222912A JP 2002222912 A JP2002222912 A JP 2002222912A JP 2001018194 A JP2001018194 A JP 2001018194A JP 2001018194 A JP2001018194 A JP 2001018194A JP 2002222912 A JP2002222912 A JP 2002222912A
Authority
JP
Japan
Prior art keywords
substrate
chip
frequency multi
chip module
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001018194A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002222912A5 (https=
Inventor
Taku Fujita
卓 藤田
Kazuaki Takahashi
和晃 高橋
Hiroshi Ogura
洋 小倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001018194A priority Critical patent/JP2002222912A/ja
Publication of JP2002222912A publication Critical patent/JP2002222912A/ja
Publication of JP2002222912A5 publication Critical patent/JP2002222912A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Waveguides (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
JP2001018194A 2001-01-26 2001-01-26 高周波マルチチップモジュール及び製造方法 Withdrawn JP2002222912A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001018194A JP2002222912A (ja) 2001-01-26 2001-01-26 高周波マルチチップモジュール及び製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001018194A JP2002222912A (ja) 2001-01-26 2001-01-26 高周波マルチチップモジュール及び製造方法

Publications (2)

Publication Number Publication Date
JP2002222912A true JP2002222912A (ja) 2002-08-09
JP2002222912A5 JP2002222912A5 (https=) 2007-11-29

Family

ID=18884252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001018194A Withdrawn JP2002222912A (ja) 2001-01-26 2001-01-26 高周波マルチチップモジュール及び製造方法

Country Status (1)

Country Link
JP (1) JP2002222912A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8432316B2 (en) 2009-08-27 2013-04-30 Sony Corporation High frequency device
JP2013247495A (ja) * 2012-05-25 2013-12-09 Nippon Telegr & Teleph Corp <Ntt> ホーンアンテナ一体型ｍｍｉｃパッケージ
WO2021255963A1 (ja) 2020-06-17 2021-12-23 株式会社フジクラ 無線モジュール

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8432316B2 (en) 2009-08-27 2013-04-30 Sony Corporation High frequency device
JP2013247495A (ja) * 2012-05-25 2013-12-09 Nippon Telegr & Teleph Corp <Ntt> ホーンアンテナ一体型ｍｍｉｃパッケージ
WO2021255963A1 (ja) 2020-06-17 2021-12-23 株式会社フジクラ 無線モジュール
CN114158256A (zh) * 2020-06-17 2022-03-08 株式会社藤仓 无线模块
US11901317B2 (en) 2020-06-17 2024-02-13 Fujikura Ltd. Wireless module

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