JP2002222758A - Stage system and exposure apparatus using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stage system which can reduce the fluctuating amount of a gap that occurs when a mobile stage section moves in steps, and to provide an exposure apparatus which is provided with the stage system and can be improved in throughput and exposure accuracy. SOLUTION: The stage system has a mobile stage which can move while the stage is mounted with both an original plate and a substrate or the substrate, a static pressure pad 10 which guides the mobile stage while the pad 10 supports the stage against a stage pedestal and/or a yaw guide 6, and means (an attracting and pressurization magnet 11, a piezoelectric element 12, a gap sensor 13, etc.), which control at least either one of the attracting force and gap between the mobile stage and the stage pedestal and/or yaw guide 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a movable stage of a semiconductor exposure apparatus and a movable table of a machine tool.
The present invention relates to a stage device that requires high-speed and high-precision positioning.

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, an exposure apparatus for projecting and transferring an original pattern such as a reticle or a mask onto a substrate such as a wafer (silicon wafer) is used. In this exposure apparatus, when projecting and exposing a reticle pattern onto a silicon wafer, a wafer stage for sequentially moving the silicon wafer stepwise with respect to a projection exposure system is used. In a so-called scanning projection exposure apparatus (scanner), a reticle stage for scanning a reticle and a silicon wafer in synchronization with a projection exposure system is also used.

FIG. 19 is an overall perspective view of a conventional stage device. In the figure, reference numeral 51 denotes a wafer having a resist coated on the surface of a single-crystal silicon substrate for projecting and transferring a reticle pattern drawn on a reticle substrate through a reduction exposure system, and 52 denotes an optical axis direction of the reduction exposure system. And a fine movement stage for fine movement adjustment in the tilt direction and the rotation direction about the optical axis. An X guide 53 guides the fine movement stage 52 in the X-axis direction, an X linear motor 54 drives the fine movement stage 52 in the X direction, and a movement guide 55 moves the X guide 53 and the fine movement stage 52 in the Y direction. The Y slider 56 is a yaw guide for guiding the Y slider 55 in the Y direction. Reference numeral 57 denotes an YL linear motor for driving the Y slider 55 in the Y direction, reference numeral 58 denotes a YR linear motor for driving the Y slider 55 in the Y direction, and reference numeral 59 denotes a stage base. Fine movement stage 5
The 2 and Y sliders 55 are floated on the stage base 59 by static pressure pads provided on their lower surfaces facing the upper surface of the stage base 59, and are supported and guided by the stage base 59 in the vertical direction.

FIG. 20 is a plan view showing the configuration of the Y slider 55 and the yaw guide 56 of FIG. 19, and FIG.
FIG. 6 is a side view of a Y slider 55. 20 and 21, reference numeral 60 denotes a static pressure pad which is provided on a side surface of the Y slider 55 and generates a static pressure on the yaw guide 56 and serves as an air bearing. Reference numeral 61 denotes a yaw guide for the floating force of the static pressure pad 60. It is a suction pressurizing magnet for generating a magnetic attraction force for 56. As described above, by applying the suction pressure to the static pressure surface of the static pressure pad 60 by the suction pressure magnet 61, the air bearing gap amount is adjusted and the static pressure rigidity is increased.

FIG. 22 is a graph showing the relationship between the gap amount of the suction pressurizing magnet 61 and the yaw guide 56 versus pressurizing pressure. The gap amount is adjusted by adjusting the pressure of the static pressure pad 60 and the gap of the suction pressurizing magnet 61 such that the static pressure gap between the static pressure pad 60 and the yaw guide 56 is 5 [μm]. And the gap between the shaft and the yaw guide 56 are adjusted. When the gap between the suction pressurizing magnet 61 and the yaw guide 56 is adjusted to a position of about 50 [μm], the adjustment point is a point at which the pressurization is generated at about 50 [kgf] as a preload, that is, The suction pressurized magnet adjustment point shown in FIG. Thus, the suction pressurized magnet 61
When the gap between the yaw guide 56 and the yaw guide 56 is adjusted to a position of about 50 μm, the gap between the static pressure pad 60 and the yaw guide 56 is balanced with the floating force 50 kgf at 5 μm. The gap amount of the pad 60 is 5
[Μm].

With the above-described configuration, when the fine movement stage 52 is moved stepwise in the X direction, the reaction force in the X direction generated by the X linear motor 54 is transmitted to the Y slider 55, and is applied to the static pressure gap of the static pressure pad 60. A gap amount variation occurs due to a variation in the acceleration of the reaction force in the X direction.

FIG. 23 is a graph showing a gap amount fluctuation waveform at the time of stepping movement in the X direction in the stage device of FIG. In FIG. 23, the horizontal axis is time, the vertical axis is the gap amount, and the center of the gap amount is 5 [μm], which is the adjustment gap amount. Due to the step movement of the fine movement stage 52 in the −X direction, first, + X and then −X, a static pressure gap change due to a change in the reaction force acceleration in the X direction occurs with the waveform shown in the graph of FIG. In the graph of FIG. 23, the step time is Ta [sec] including the settling. Here, the gap amount variation occurs 5 ± 2 [μm].

[0008]

In the conventional example, the step time T of the fine movement stage 52 shown in the graph of FIG.
If the stepping acceleration in the X direction is further increased for the purpose of shortening a, the gap amount is completely consumed when the gap amount variation reaches 5 ± 5 [μm], and the acceleration cannot be increased any further. there were. In addition, up and down (Z axis)
The gap amount variation in the direction also has the same problem as the gap amount variation in the plane (XY plane) direction.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has been made in consideration of the above-mentioned problems, and has provided a stage device capable of reducing a gap fluctuation amount generated when a stage movable section (moving stage) is moved and shortening a settling time. An object of the present invention is to provide an exposure apparatus including the stage device and capable of improving throughput and exposure accuracy.

[0010]

In order to solve the above problems, a first stage device according to the present invention supports a moving stage and the moving stage with respect to a predetermined guide surface via a gap. In a stage apparatus having a static pressure pad and suction pressurizing means for suction pressurizing the moving stage with respect to the guide surface, a suction pressurizing control means for controlling a suction pressurizing force of the suction pressurizing means is provided. And

According to the present invention, since the suction pressurizing force of the suction pressurizing means is controlled, if the suction pressurizing pressure is controlled so as to cancel the fluctuation of the gap of the static pressure pad generated when the moving stage moves, the movement can be controlled. It is possible to shorten the settling time when the vehicle is stopped later or when the vehicle starts moving and the vehicle travels at a constant speed, thereby improving the positioning accuracy at the time of stopping.

The stage apparatus further includes a measuring means for measuring a gap amount between the static pressure pad and / or the suction pressurizing means and the guide surface, and the suction pressurizing control means includes a measuring means. It is preferable to perform feedback control of the suction applied pressure in response to a signal from the controller.
Further, when the moving stage has a plurality of movable portions that are portions facing the guide surface, the measuring unit is provided at a plurality of locations corresponding to the plurality of movable units, respectively, the suction applied pressure control unit, It is possible to selectively control a measurement timing and a measured value by the measuring means according to a moving direction and an operation state of the moving stage. Further, the suction pressure control means can control the suction pressure in synchronization with a movement operation of the moving stage and / or a drive signal.

In the stage apparatus, it is preferable that the suction pressure control means controls the suction pressure by feedforward control for predictive control based on a disturbance factor generated when the moving stage moves.

The suction pressure control means controls the suction pressure by, for example, controlling the displacement of the gap between the suction pressure means and the guide surface. As the suction pressurizing means, for example, a magnet or a vacuum pad is used. When the suction pressurizing means is a vacuum pad, the suction pressurizing control means can control the suction pressurizing force by variably controlling the vacuum pressure in the vacuum pad.

A second stage apparatus according to the present invention comprises a moving stage, a plurality of static pressure pads for supporting the moving stage on a predetermined guide surface via a gap, and driving means for driving the moving stage. And a gap control means for controlling a gap amount between the static pressure pad and the guide surface by variably controlling the pressure of the static pressure pad in synchronization with the movement of the moving stage. It is characterized by. Here, it is preferable that the gap control means variably control the pressures of the static pressure pads having the static pressure pad surfaces facing each other in opposite phases.

Further, in the stage device, the guide surface may be, for example, an upper surface of a stage base that vertically supports the moving stage or a guide surface of a guide that guides the moving stage in a predetermined direction.

The exposure apparatus of the present invention projects a pattern drawn on an original onto a substrate via a projection optical system, and positions the substrate or both the original and the substrate relative to the projection optical system using a stage device. And an exposure apparatus for repeatedly exposing the pattern of the original to the substrate by moving the substrate to at least one of the stage devices described above.

[0018]

Next, a preferred embodiment of the present invention will be described in detail with reference to the drawings. [First Embodiment] FIG. 1 is an overall perspective view of a stage device according to one embodiment of the present invention. This stage device is used as a wafer stage of a projection exposure apparatus.
In FIG. 1, reference numeral 1 denotes a wafer having a resist coated on the surface of a single-crystal silicon substrate for projecting and transferring a reticle pattern drawn on a reticle substrate through a reduction exposure system, and 2 denotes an optical axis direction of the reduction exposure system. Fine movement stage for fine movement adjustment in the tilt direction and the rotation direction about the optical axis, 3
Is an X guide for guiding the fine movement stage 2 in the X-axis direction. Reference numeral 4 denotes an X linear motor that drives the fine movement stage 2 in the X direction, 5 denotes a Y slider that guides the X guide 3 and the fine movement stage 2 in the Y direction, and 6 denotes a yaw guide that guides the Y slider in the Y direction. . And 7
Is an YL linear motor that drives the Y slider 5 in the Y direction, and 8 is a Y motor that also drives the Y slider 5 in the Y direction.
An R linear motor 9 is a stage base. Fine movement stage 2 and Y slider 5 are levitated by static pressure pads provided on the respective lower surfaces, and are vertically supported and guided relative to stage base 9.

FIG. 2 is a plan view of the main part of the stage device of FIG. 1, and FIG. 3 is a side view of the main part of the stage device of FIG. 2 and 3, reference numeral 10 denotes a static pressure pad which is provided on a side surface of the Y slider 5 and generates a static pressure on the yaw guide 6 and serves as an air bearing. 1
Reference numeral 1 denotes a suction pressurizing magnet that generates a magnetic attraction force (a force in the −X direction) with respect to the yaw guide 6 in response to the floating force (the force in the + X direction) of the static pressure pad 10. By applying to the static pressure surface, the air bearing gap amount is adjusted and the static pressure rigidity is increased. 1
Reference numeral 2 denotes a laminated piezo (piezoelectric element), which has a capability of driving the suction pressurizing magnet 11 to be displaced by about ± 50 [μm] from the built-in adjustment gap in the gap direction with the yaw guide 6. 13 is a gap sensor.

FIG. 4 is a view showing the structure of the static pressure pad 10, the suction pressurizing magnet 11, the gap sensor 13 and the like in FIG. 2, and FIG. 5 is a diagram showing the space between the suction pressurizing magnet 11 and the yaw guide 6 in FIG. 6 is a graph showing a gap amount versus a pressurizing characteristic by a suction pressurizing magnet. Here, the adjustment of the gap during assembly (assembly adjustment gap) is performed by adjusting the static pressure pad 1 as shown in FIGS.
0 and the static pressure gap of the yaw guide 6 is 5 [μm],
Gap 1 between suction pressurized magnet 11 and yaw guide 6
4 is a pressurized magnet adjustment gap point A shown in FIG.
Is adjusted to be 50 [μm]. This pressurized magnet adjustment gap point A is
When adjusted to a position of about [μm], this is the point at which the applied pressure is generated at about 50 [kgf]. As a result, during normal operation, this applied pressure 50 [k
gf] is balanced with the static pressure 50 [kgf] at the static pressure gap 5 [μm] between the static pressure pad 10 and the yaw guide 6, and the static pressure gap of the static pressure pad 10 is adjusted to 5 [μm].

With the above arrangement, in the state where the suction pressure control is not performed, when the fine movement stage 2 is moved stepwise in the X direction, the reaction force in the X direction generated in the X linear motor 4 is transmitted to the Y slider 5, and Variations in the gap amount due to variations in the acceleration of the reaction force occur in the static pressure gap of the pressure pad 10 as shown by the broken line waveform shown in FIG. In FIG. 6B, the horizontal axis represents time, the vertical axis represents the gap amount, and the center of the gap amount is the adjustment gap amount 5 [μm]. Due to the step movement of the fine movement stage 2 in the X direction, the static pressure gap fluctuation due to the change in the reaction force acceleration in the X direction is first shown in FIG.
In the waveform shown by the broken line in the graph of FIG. In the graph of FIG. 6B, the step time includes Ta [se
c] (see the broken line in the figure). Here, the gap amount variation occurs 5 ± 2 [μm].

In this embodiment, as shown in FIG. 4, a piezo (piezoelectric element) 12 capable of drivingly displacing the pressurized attracting magnet 11 by about ± 50 [μm] in the gap direction.
Is provided on the back of the pressurized suction magnet 11. Further, a gap sensor 13 for measuring a gap variation with the yaw guide 6 is provided on an end surface of the Y slider 5. The gap fluctuation signal detected by the gap sensor 13 is amplified by the gap sensor preamplifier 15, and the pressurized magnet gap control circuit 16 calculates an appropriate suction pressurizing pressure change from the gap fluctuation signal, and the piezo drive driver 17. To the piezo 12. The piezo 12 is driven and displaced by a drive voltage generated from a piezo drive driver 17 according to the drive command value. Also,
It is also possible to selectively control the measurement timing and the measured value by the gap sensor 13 or the like as the measuring means.

As shown in FIG. 5, the suction pressurized magnet 1
The suction pressurizing pressure is set to 50 ± by drivingly displacing the gap 14 between the pressurizing magnet adjustment gap point A and the pressurizing control maximum gap point B and the pressurizing control minimum gap point C at the time of assembling adjustment. 6 is variably controlled within a range of 10 [kgf], and FIG.
As shown in the waveform shown in (a), the suction applied pressure is controlled so as to synchronize with the gap fluctuation waveform during the step movement in the X direction. Here, FIG. 6A is a graph showing the time characteristic of the suction applied pressure control waveform at the time of the step movement in the X direction in the stage device of FIG. 1, in which the horizontal axis represents time and the vertical axis represents applied pressure. .

By controlling the suction pressure as described above, when the reaction force generated during the step movement in the X direction acts in the + direction, the suction pressure increases in the negative direction (60 [kg]).
f]), on the contrary, when the reaction force acts in the negative direction, the suction applied pressure decreases in the negative direction (40 [kgf]). By controlling the suction pressure in such a direction as to cancel the reaction force during the step movement in the X direction, the gap variation can be reduced to 5 ± 1 [μm] as shown by the solid line waveform in FIG. 6B. Can be.

Further, since the attenuation is improved together with the reduction of the gap fluctuation amount, the step time until the settling at the time of the step movement is set to Ta in the state without the suction pressure control.
[Sec] can be reduced to Tb [sec].

In this embodiment, there is provided means for measuring the amount of change in the gap of the static pressure pad, and the measurement signal from the measurement means is used to change the applied pressure of the suction pressurizing magnet, which is the suction pressurizing means of the static pressure pad, in the X direction. By variably controlling the gap fluctuation generated at the time of the step movement and changing the suction force in the opposite direction to the reaction force of the step movement in the X direction,
The stepping reaction force in the X direction can be reduced. As a result, it is possible to reduce the amount of gap variation between the yaw guide and the static pressure pad that occurs during the step movement in the X direction, and finally further increase the step movement acceleration in the X direction. At the same time, at the same acceleration, the gap fluctuation amount is reduced, so that the attenuation of the gap fluctuation amount of the static pressure pad during the step movement in the X direction can be improved, the stationary accuracy can be improved, and the gap can be used as a wafer stage of the exposure apparatus. An exposure apparatus capable of improving the total throughput and exposure accuracy of the exposure apparatus can be provided.

[Second Embodiment] FIG. 7 shows a second embodiment of the present invention.
FIG. 8 is a plan view of a main part of the stage device according to the embodiment, and FIG. 8 is a side view of a main part of the stage device excluding the yaw guide 6 in FIG. 7 and 8,
2 and 3 denote the same components as in FIGS. 2 and 3.

The stage apparatus shown in FIGS. 7 and 8 uses a suction pressurizing vacuum pad 18 instead of the suction pressurizing magnet 11 shown in FIGS. 2 and 3 as a suction pressurizing means. And suction.

FIG. 9 shows the static pressure pad 10, the suction pressurized vacuum pad 18 and the gap sensor 13 in FIG.
FIG. 10 is a graph showing a vacuum pressure-applied pressure characteristic between the suction pressurized vacuum pad 18 and the yaw guide 6 in FIG. As shown in FIG. 9, the suction pressurizing vacuum pad 18 changes the vacuum pressure so that the suction pressurizing pressure is 50 ± 10 [kg].
f]. Further, similarly to the first embodiment, a gap sensor 13 for measuring a gap variation between the Y slider 5 and the yaw guide 6 is provided on the end surface of the Y slider 5. The gap fluctuation amount signal detected by the gap sensor 13 is amplified by the gap sensor preamplifier 15,
The pressurizing pad control circuit 19 calculates an appropriate suction pressurizing change amount from the gap fluctuation amount signal, and gives a pressure command value to the vacuum pad pressure adjusting means 20. The suction pressure of the suction pad 18 is changed by a vacuum pressure signal generated by the vacuum pad pressure adjusting means 20 according to the pressure command value.

Here, as shown in FIG. 10, the suction pressurized vacuum pressure is changed from the suction pressurized vacuum pad adjustment pressure point A during assembly adjustment to the pressurized control maximum vacuum pressure point B and the pressurized control minimum vacuum pressure point. C to change the suction applied pressure to 50 ±
The pressure is variably controlled within the range of 10 [kgf], and the suction applied pressure is controlled in synchronization with the gap fluctuation waveform at the time of the step movement in the X direction as shown in the waveform of FIG.

As a result, by controlling the suction pressure,
When the reaction force generated during the step movement in the X direction acts in the + direction, the suction applied pressure is large in the − direction (60 [kg
f]), on the contrary, when the reaction force acts in the negative direction, the suction applied pressure decreases in the negative direction (40 [kgf]). By controlling the suction pressure in a direction that cancels the reaction force at the time of the step movement in the X direction, the gap fluctuation amount can be reduced to 5 ± 1 [μm] as shown by the solid line waveform shown in FIG.

Further, since the attenuation is improved together with the reduction of the gap fluctuation amount, the step time until settling at the time of the step movement is set to Ta [se without the suction pressure control.
c] to Tb [sec].

[Third Embodiment] In the above-described embodiment, the control of the pressurizing force of the static pressure pad between the Y slider and the Y guide has been described. However, in addition, the Y slider and the stage base, and the fine movement stage and the stage base are controlled. Regarding the gap fluctuation in the pitching and rolling directions generated between the static pressure pads in the vertical direction between the boards, it is possible to reduce the gap fluctuation amount by applying the pressurized pressure control by similarly providing the vertical gap detecting means.

[Fourth Embodiment] In the above-described embodiment, the pressurization control for the gap fluctuation in the X direction when the step movement in the X direction has been described. Gap fluctuations in the yawing direction (rotation mode around the Z-axis) that occur during diagonal step movement when step movement and step movement in the Y direction are performed at the same time are also detected as gap amount fluctuations by the gap sensor. By controlling the pressurizing force of the suction pressurizing means of the static pressure pad, it is possible to reduce the gap fluctuation in the yawing direction.

[Fifth Embodiment] In the above-described embodiment, an example is shown in which the suction pressure control means using the magnet and the piezo drive and the suction pressure control means using the vacuum pad and the pressure adjustment means are used. Suction vacuum pressure control means using a suction vacuum pad and piezo drive is also possible. In this case, the suction pressure of the vacuum pad is fixed or not controlled, and the suction pressure is controlled by changing the gap amount between the vacuum pad and the guide platen by piezo to reduce the gap fluctuation of the static pressure pad. It is possible. Of course, both the suction pressure of the vacuum pad and the gap amount due to piezo may be controlled.

Sixth Embodiment In the above-described embodiment, a piezo (piezoelectric element) is used as a driving displacement means of a suction pressurizing means such as a magnet or a vacuum pad. Drive control is also possible with an electromagnetic drive means such as a combination or a pneumatic drive means such as a diaphragm.

[Seventh Embodiment] FIG. 11 is a control block diagram showing a gap control method for a gap change of a stage device according to a seventh embodiment. The first mentioned above
In the sixth to sixth embodiments, feedback control for controlling the amount of piezo displacement by feeding back a signal from the gap measuring means of the static pressure pad is performed. In the present embodiment, however, the driving state of the stage and the static pressure pad are controlled in advance. The gap variation is measured in advance, and when the stage is in operation, the gap variation in each drive state is predicted. As shown in FIG. 11A, the gap variation is synchronized with the drive profile of the stage device. Is performed in advance by FF control (feedforward control) in which is added to the target position command as a disturbance factor to reduce the gap fluctuation amount. FIG.
(B) is a combination of the feedback control in the first to sixth embodiments and the feedforward described above. In this case, in addition to the gap control amount in synchronization with the predicted drive profile of the gap variation stage device, The gap variation is further reduced.

As described above, the pressurizing force of the suction pressurizing magnet, which is the suction pressurizing means of the static pressure pad, is variably controlled with respect to the gap fluctuation of each static pressure pad generated during the step movement in the X and Y directions. By doing so, the gap fluctuation between the yaw guide and the static pressure pad and the gap fluctuation between the Y slider and the stage base and between the fine movement stage and the stage base which occur during the step movement in the X and Y directions are reduced. The acceleration of the step movement in the Y direction can be further increased. At the same time, the attenuation of the gap fluctuation of the static pressure pad during the step movement in the X and Y directions can be improved by reducing the gap fluctuation amount at the same acceleration. In the exposure apparatus using the stage device according to the present invention, the stepper exposure apparatus can improve the stationary accuracy during exposure, and the scan exposure apparatus can improve the control accuracy during scanning.

[Eighth Embodiment] FIG. 12 is a diagram showing a configuration of a stage device according to an eighth embodiment.
In the figure, the same reference numerals as those in FIG. 1 indicate the same components as those in FIG. In the above embodiment, the suction pressure is variably controlled by a combination of the static pressure pad and the suction pressure means. However, the suction pressure is not provided, and the X guide 3 is sandwiched from both sides. With static pressure pad (A pad 31, B
When the pad 32) is provided, both the static pressure pads 31, 32
By controlling the static pressure by push-pull, the gap variation can be reduced.

FIG. 13 is a graph showing a time variation waveform of the gap pressure and the static pressure with respect to the reaction force F due to the step movement in the X direction in FIG. A pad gap variation waveform when push-pull control ON / OFF for T,
The B-pad gap fluctuation waveform when the push-pull control is ON / OFF with respect to time T, the control waveform of the A-pad static pressure with respect to time T, and the control waveform of the B-pad static pressure with respect to time T are shown, respectively. Here, the +/- direction of the reaction force F in FIG. 12 is the same as the direction in the graph of FIG.

12 and 13, it is possible to reduce the amount of gap variation between the A pad 31 and the B pad 32 due to the reaction force F due to the step movement of the fine movement stage by push-pull control. That is, assuming that a positive reaction force F is generated, the gap amount on the A pad 31 side decreases and the gap amount on the B pad side increases, so that the static pressure of the A pad 31 is increased (pushed), and
The static pressure of the pad 31 is reduced (pulled). As for the negative reaction force F, the static pressure of the B pad 32 and the static pressure of the A pad 31 are respectively increased and decreased in the negative direction. FIG. 13 shows the A pad 31 so that the static pressure is synchronized with the gap fluctuation waveform.
Push-pull control in the range of 4 ± 1 [kgf / cm ² ] (A pad 31 and B pad 3)
2 shows an example in which the static pressures are variably controlled in opposite phases.

[Ninth Embodiment] In the above-described embodiment, the stage apparatus according to the present invention is provided with a step-and-repeat type projection exposure apparatus (stepper) and a step-and-scan type projection exposure apparatus (scanner). Although an example of using the wafer as a stage has been described, the stage apparatus of the present invention uses a substrate and an original (reticle, etc.) during exposure.
Can be used as an original stage of a scanner that scans (scans) relative to the projection optical system.

[Embodiment of Semiconductor Production System]
Devices such as semiconductors using the above-described exposure apparatus (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCs)
D, a thin-film magnetic head, a micromachine, etc.). In this method, maintenance services such as troubleshooting and periodic maintenance of a manufacturing apparatus installed in a semiconductor manufacturing factory or provision of software are performed using a computer network outside the manufacturing factory.

FIG. 14 shows the whole system cut out from a certain angle. In the figure, reference numeral 101 denotes a vendor that supplies a semiconductor device manufacturing apparatus (apparatus supplier).
Is a business establishment. Examples of manufacturing equipment include semiconductor manufacturing equipment for various processes used in semiconductor manufacturing factories, for example, pre-processing equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film formation equipment, planarization). Equipment) and post-process equipment (assembly equipment, inspection equipment, etc.). A host management system 1 that provides a maintenance database for manufacturing equipment in the business office 101
08, a plurality of operation terminal computers 110, and a local area network (LAN) 109 connecting these to construct an intranet or the like. The host management system 108 has a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting external access.

On the other hand, reference numerals 102 to 104 denote semiconductor manufacturers (semiconductor device manufacturers) as users of the manufacturing apparatus.
Is a manufacturing factory. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 connecting them to construct an intranet or the like, and a host as a monitoring apparatus for monitoring the operation status of each manufacturing apparatus 106 are provided. A management system 107 is provided. The host management system 107 provided in each of the factories 102 to 104 includes a gateway for connecting the LAN 111 in each of the factories to the Internet 105 which is an external network of the factory. As a result, access from the LAN 111 of each factory to the host management system 108 on the vendor 101 side via the Internet 105 is possible, and only users limited by the security function of the host management system 108 are permitted to access. Specifically, via the Internet 105,
In addition to the status information indicating the operation status of each manufacturing apparatus 106 (for example, the symptom of the manufacturing apparatus in which the trouble has occurred) is notified from the factory side to the vendor side, the response information corresponding to the notification (for example, an instruction method for the trouble) is given. Information
Software and data for coping), the latest software, and maintenance information such as help information can be received from the vendor. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between each of the factories 102 to 104 and the vendor 101 and data communication with the LAN 111 in each of the factories. In addition,
Instead of using the Internet as an external network outside the factory, it is also possible to use a high-security dedicated line network (such as ISDN) without access from a third party. Further, the host management system is not limited to the one provided by the vendor, and a user may construct a database and place it on an external network, and permit access from a plurality of factories of the user to the database.

FIG. 15 is a conceptual diagram showing the entire system according to the present embodiment cut out from an angle different from that of FIG. In the above example, a plurality of user factories each having a manufacturing device and a management system of a vendor of the manufacturing device are connected via an external network, and the production management of each factory and at least one device are connected via the external network. Data communication of the information of the manufacturing apparatus. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors is connected to a management system of each of the plurality of manufacturing equipments via an external network outside the factory, and maintenance information of each manufacturing equipment is stored. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing factory of a manufacturing apparatus user (semiconductor device maker), and a manufacturing line for performing various processes, for example, an exposure apparatus 202, a resist processing apparatus 203, and a film forming apparatus 204 have been introduced. Although FIG. 15 shows only one manufacturing factory 201, a plurality of factories are actually networked in the same manner. Each device in the factory is connected by a LAN 206 to form an intranet or the like, and a host management system 205 manages the operation of the production line. On the other hand, each business establishment of a vendor (equipment supply maker) such as an exposure apparatus maker 210, a resist processing apparatus maker 220, and a film formation apparatus maker 230 has host management systems 211 and 221 for performing remote maintenance of the supplied equipment. , 231 which comprise a maintenance database and an external network gateway as described above. The host management system 205 that manages each device in the user's manufacturing factory and the management systems 211, 221, and 231 of the vendors of each device are connected by the external network 200 as the Internet or a dedicated line network. In this system, if a trouble occurs in any of a series of manufacturing equipment in the manufacturing line, the operation of the manufacturing line is stopped, but remote maintenance is performed from the vendor of the troubled equipment via the Internet 200. As a result, quick response is possible, and downtime of the production line can be minimized.

Each of the manufacturing apparatuses installed in the semiconductor manufacturing factory includes a display, a network interface, and a computer that executes network access software and apparatus operation software stored in a storage device. The storage device is a built-in memory, a hard disk, a network file server, or the like. The network access software includes a dedicated or general-purpose web browser, and provides, for example, a user interface having a screen as shown in FIG. 16 on a display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the manufacturing equipment model 401, the serial number 402, and the trouble subject 40.
3. Information such as date of occurrence 404, degree of urgency 405, symptom 406, coping method 407, progress 408, etc. is input to input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the resulting appropriate maintenance information is returned from the maintenance database and presented on the display. The user interface provided by the web browser further includes a hyperlink function 41 as shown in the figure.
0, 411, 412, allowing the operator to access more detailed information on each item, extract the latest version of software used for manufacturing equipment from the software library provided by the vendor, and provide information for factory operators. An operation guide (help information) can be pulled out. Here, the maintenance information provided by the maintenance database includes the information on the present invention described above, and the software library also provides the latest software for realizing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. FIG.
Shows the flow of the entire semiconductor device manufacturing process. In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and an assembly process (dicing, dicing,
Bonding), an assembly process such as a packaging process (chip encapsulation) and the like. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). The pre-process and the post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the above-described remote maintenance system. Also, between the pre-process factory and the post-process factory,
Information and the like for production management and device maintenance are communicated via the Internet or a dedicated line network.

FIG. 18 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist processing), a photosensitive agent is applied to the wafer.
Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented beforehand, and if troubles occur, quick recovery is possible. Productivity can be improved.

[0050]

As described above, according to the stage apparatus of the present invention, since the pressure applied by the suction pressurizing means to the static pressure pad is controlled, for example, each static pressure pad generated when the moving stage moves. By controlling the gap variation by the suction pressure control means, the gap variation generated when the moving stage moves can be reduced.
Further, the time required for settling when the moving stage is moved can be reduced as compared with the case where there is no suction applied pressure control means. Therefore, it is possible to further increase the acceleration in the step movement of the moving stage.

Further, the pressure of the static pressure pad is variably controlled in synchronization with the driving of the moving stage, and the gap amount between the static pressure pad and the guide surface is controlled. The amount of fluctuation can be reduced.

Further, the exposure apparatus of the present invention can reduce the amount of gap fluctuation and the like by including the above-described stage device, and can improve the gap fluctuation of the static pressure pad when the moving stage moves during step movement or the like. can do. Therefore, an exposure apparatus capable of improving the total throughput and exposure accuracy of the exposure apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of a stage device according to an embodiment of the present invention.

FIG. 2 is a plan view of a main part of the stage device of FIG.

FIG. 3 is a side view of a main part of the stage device excluding the yaw guide of FIG. 2;

FIG. 4 is a diagram showing a configuration of a static pressure pad, a suction pressurizing magnet, a gap sensor, and the like in FIG. 2;

5 is a graph showing a gap between a suction pressurizing magnet and a yaw guide in FIG. 4 versus a pressurizing characteristic by the suction pressurizing magnet.

6 is a graph showing a time characteristic of a suction applied pressure control waveform and a gap fluctuation waveform at the time of stepping movement in the X direction in the stage device of FIG. 1; (A) Time characteristics of a suction applied pressure control waveform. (B) Time characteristics of the gap fluctuation waveform when the suction pressure control is ON (solid line) / OFF (dashed line).

FIG. 7 is a plan view of a main part of a stage device according to a second embodiment.

FIG. 8 is a side view of a main part of the stage device excluding the yaw guide of FIG. 7;

9 is a diagram showing a configuration of a static pressure pad, a suction pressurized vacuum pad, a gap sensor and the like in FIG. 6;

FIG. 10 is a graph showing a vacuum pressure versus applied pressure characteristic between the suction pressurized vacuum pad and the yaw guide in FIG. 8;

FIG. 11 is a control block diagram illustrating a gap control method for a gap change of a stage device according to a seventh embodiment. (A) It is a control block diagram showing feedforward control concerning a 7th embodiment. FIG. 3B is a control block diagram illustrating feedback control.

FIG. 12 is a diagram illustrating a configuration of a stage device according to an eighth embodiment.

13 is a graph showing waveforms of a gap variation amount and a static pressure with respect to a reaction force F due to a step movement in the X direction in FIG.

FIG. 14 is a conceptual diagram illustrating a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention as viewed from a certain angle.

FIG. 15 is a conceptual diagram of a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention, as viewed from another angle.

FIG. 16 is a diagram showing a specific example of a user interface in a semiconductor device production system including an exposure apparatus according to an embodiment of the present invention.

FIG. 17 is a diagram illustrating a flow of a device manufacturing process by the exposure apparatus according to the embodiment of the present invention.

FIG. 18 is a diagram illustrating a wafer process by the exposure apparatus according to one embodiment of the present invention.

FIG. 19 is an overall perspective view of a stage device according to a conventional example.

FIG. 20 is a plan view of a stage device according to a conventional example.

FIG. 21 is a side view of a stage device according to a conventional example.

FIG. 22 is a graph showing a gap amount vs. applied pressure characteristic of a suction / pressurized magnet of a stage device according to a conventional example.

FIG. 23 is a graph showing a time characteristic of a gap fluctuation waveform during a step movement in the X direction according to the conventional example.

[Explanation of symbols]

1: wafer, 2: fine movement stage, 3: X guide, 4: X
Linear motor, 5: Y slider, 6: Yaw guide, 7:
YL linear motor, 8: YR linear motor, 9: stage base, 10: static pressure pad, 11: suction pressurized magnet, 12: piezo, 13: gap sensor, 14: gap, 15: gap sensor preamplifier, 16: Pressurized magnet gap control circuit, 17: piezo drive driver, 18: suction pressurized vacuum pad, 19: pressurized pad control circuit, 20: vacuum pad pressure adjusting means, 3
1: A pad, 32: B pad, 51: wafer, 52:
Fine movement stage, 53: X guide, 54: X linear motor, 55: Y slider, 56: yaw guide, 57: YL
Linear motor, 58: YR linear motor, 59: stage surface plate, 60: static pressure pad, 61: suction pressurized magnet, 101: vendor's office, 102, 103, 10
4: Manufacturing plant, 105: Internet, 106: Manufacturing equipment, 107: Factory host management system, 108: Vendor host management system, 109: Vendor local area network (LAN), 110: Operation terminal computer, 111 : Factory local area network (LAN), 200: external network, 201:
Manufacturing apparatus user's manufacturing factory, 202: exposure apparatus, 20
3: resist processing apparatus, 204: film formation processing apparatus, 20
5: Factory host management system, 206: Factory local area network (LAN), 210: Exposure equipment maker, 211: Host management system of the exposure equipment maker's office, 220: Resist processing equipment maker, 221: Resist processing equipment Host management system of the manufacturer's office,
230: film forming apparatus maker, 231: host management system of the office of the film forming apparatus maker, 401: model of manufacturing apparatus,
402: serial number, 403: trouble subject,
404: Date of occurrence, 405: Urgency, 406: Symptom, 40
7: coping method, 408: progress, 410, 411, 412:
Hyperlink function.

Claims (19)

[Claims] 1. A stage having a moving stage, a static pressure pad for supporting the moving stage with respect to a predetermined guide surface via a gap, and suction pressurizing means for suctioning and pressing the moving stage against the guide surface. A stage apparatus, comprising: a suction pressurizing control means for controlling a suction pressurizing force of the suction pressurizing means. 2. The apparatus according to claim 2, further comprising a measuring unit for measuring a gap amount between the guide surface and the static pressure pad and / or the suction pressurizing unit, wherein the suction pressurizing control unit receives a signal from the measuring unit. The stage apparatus according to claim 1, wherein the suction pressure is controlled in accordance with the suction pressure. 3. The moving stage has a plurality of movable portions facing the guide surface, and the measuring means is provided at a plurality of positions corresponding to the plurality of movable portions, respectively. 3. The stage apparatus according to claim 1, wherein the means selectively controls a measurement timing and a measurement value by the measuring means according to a moving direction and an operation state of the moving stage. 4. The suction pressure control unit controls the suction pressure in synchronization with a movement operation of the moving stage and / or a drive signal.
The stage device according to any one of the above. 5. The suction pressurizing means according to claim 1, wherein said suction pressurizing control means controls said suction pressurizing force by feedforward control for predictive control based on a disturbance factor generated when said moving stage moves. The stage device according to claim 1. 6. The suction pressurizing means according to claim 1, wherein the suction pressurizing control means controls the suction pressurizing force by controlling a displacement of a gap between the suction pressurizing means and the guide surface. The stage device according to any one of the above. 7. The stage apparatus according to claim 1, wherein the suction pressurizing means is a magnet or a vacuum pad. 8. The suction pressurizing means is a vacuum pad, and the suction pressurization control means controls the suction pressurization by variably controlling a vacuum pressure in the vacuum pad. Item 1
7. The stage device according to any one of 6. 9. A stage apparatus comprising: a moving stage; a plurality of static pressure pads for supporting the moving stage with respect to a predetermined guide surface via a gap; and driving means for driving the moving stage. A stage apparatus comprising a gap control unit that controls a gap amount between the static pressure pad and the guide surface by variably controlling a pressure of a pad in synchronization with movement of the moving stage. 10. The stage apparatus according to claim 9, wherein said gap control means variably controls the pressures of said static pressure pads having mutually opposite static pressure pad surfaces in opposite phases. 11. The guide surface according to claim 1, wherein the guide surface is an upper surface of a stage base that vertically supports the moving stage or a guide surface of a guide that guides the moving stage in a predetermined direction. The stage device according to any one of the above. 12. A pattern drawn on an original is projected onto a substrate via a projection optical system, and the substrate or both the original and the substrate are relatively moved by a stage device with respect to the projection optical system. An exposure apparatus for repeatedly exposing the pattern of the original to the substrate, wherein at least one of the stage apparatuses is the stage apparatus according to any one of claims 1 to 11. 13. The exposure apparatus according to claim 12, wherein: a display; a network interface;
An exposure apparatus, further comprising: a computer that executes network software, wherein the maintenance information of the exposure apparatus can be data-communicated via a computer network. 14. The network software,
Provide a user interface on the display for accessing a maintenance database provided by a vendor or a user of the exposure apparatus connected to an external network of a factory where the exposure apparatus is installed, and from the database via the external network. The exposure apparatus according to claim 13, wherein information can be obtained. 15. A step of installing a group of manufacturing apparatuses for various processes including the exposure apparatus according to claim 12 in a semiconductor manufacturing plant, and a step of manufacturing a semiconductor device by a plurality of processes using the group of manufacturing apparatuses. A semiconductor device manufacturing method, comprising: 16. A step of connecting the manufacturing equipment group by a local area network, and data communication between at least one of the manufacturing equipment group between the local area network and an external network outside the semiconductor manufacturing factory. 16. The method according to claim 15, further comprising the step of: 17. A semiconductor manufacturing factory different from the semiconductor manufacturing factory by accessing a database provided by a vendor or a user of the exposure apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication. 17. The production management is performed by performing data communication between the control unit and the external network.
3. The method for manufacturing a semiconductor device according to item 1. 18. A group of manufacturing apparatuses for various processes including the exposure apparatus according to claim 12, a local area network connecting the group of manufacturing apparatuses, and an external network outside the factory can be accessed from the local area network. A semiconductor manufacturing plant, comprising: a gateway that performs data communication of information on at least one of the manufacturing apparatus groups. 19. The semiconductor device according to claim 1, which is installed in a semiconductor manufacturing plant.
2. The maintenance method of an exposure apparatus according to 2, wherein a vendor or a user of the exposure apparatus provides a maintenance database connected to an external network of a semiconductor manufacturing plant; and A step of permitting access to the maintenance database via the external device, and a step of transmitting maintenance information stored in the maintenance database to the semiconductor manufacturing factory via the external network. Method.