JP2002216581A - Printed wiring board with metal dome - Google Patents

Printed wiring board with metal dome

Info

Publication number
JP2002216581A
JP2002216581A JP2001011164A JP2001011164A JP2002216581A JP 2002216581 A JP2002216581 A JP 2002216581A JP 2001011164 A JP2001011164 A JP 2001011164A JP 2001011164 A JP2001011164 A JP 2001011164A JP 2002216581 A JP2002216581 A JP 2002216581A
Authority
JP
Japan
Prior art keywords
electrode wiring
metal dome
film layer
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001011164A
Other languages
Japanese (ja)
Inventor
Tomoya Yokoyama
朝也 横山
Takayuki Imai
隆之 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP2001011164A priority Critical patent/JP2002216581A/en
Publication of JP2002216581A publication Critical patent/JP2002216581A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Contacts (AREA)
  • Push-Button Switches (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board having a switch mechanism utilized in an electronic device and superior in durability. SOLUTION: In the device, a first electrode wiring part 20 which is formed on a base board 10 and provided with an arc shaped part 20a on the top of which a spring metal dome 40 is mounted, a second electrode wiring 30 that is guided inside the arc shaped part 20a of the first electrode wiring 20 and an insulated film layer 50 by which the part under the metal dome 40 on the second electrode wiring part 30 is covered are provided. In this case, the covered range by the insulated film layer 50 is extended to the arc shaped part 20a of the first electrode wiring 20 in the printed wiring board with the metal dome and the superior durability is obtained by extending the covered range of the insulated film layer 50 since the stress of the metal dome against the insulated film layer 50 is greatly decreased.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子機器などで用
いられるスイッチ機構を備えたプリント配線板に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board provided with a switch mechanism used in electronic equipment and the like.

【0002】[0002]

【従来の技術】電子機器例えば携帯電話のキースイッチ
や電子レンジの操作スイッチなどにあっては、一対の電
極配線部を近接して対峙させ、その一方にバネ性のメタ
ルドームを載置し、このメタルドームを押圧操作した
際、メタルドームが潰れて他方の電極に当接して、スイ
ッチのオン、オフが行われるものがある。
2. Description of the Related Art In an electronic device such as a key switch of a mobile phone or an operation switch of a microwave oven, a pair of electrode wiring portions are brought into close proximity to each other, and a spring-like metal dome is placed on one of them. When the metal dome is pressed, the metal dome is crushed and comes into contact with the other electrode to turn on and off the switch.

【0003】このスイッチ機構を図示すると、図5〜図
6の如くで、ベースの基板1上に一対の電極配線部2,
3が近接して対峙させてある。そして、一方の電極配線
部2の円弧形状部2a部分には、他方の電極配線部3の
接点部3aを、円弧形状部2a部分の離れた離間部分2
bを通じて導くと共に、円弧形状部2a部分上には、バ
ネ性の金属成形品からなるメタルドーム4を載置させて
ある。さらに、絶縁のため、円弧形状部2内に導かれる
他方の電極配線部3上でメタルドーム4の跨がる部分に
は、絶縁皮膜層5が設けてある。
[0005] This switch mechanism is illustrated in FIGS. 5 to 6, in which a pair of electrode wiring portions 2, 2 are provided on a base substrate 1.
3 are close to each other. Then, the contact portion 3a of the other electrode wiring portion 3 is attached to the arc-shaped portion 2a of the one electrode wiring portion 2 with the separated portion 2a separated from the arc-shaped portion 2a.
b, and a metal dome 4 made of a spring-formed metal product is placed on the arc-shaped portion 2a. Further, for insulation, an insulating coating layer 5 is provided on a portion where the metal dome 4 is straddled on the other electrode wiring portion 3 guided into the arc-shaped portion 2.

【0004】この構造によって、メタルドーム4を押圧
(クリック)すれば、ドーム金属が潰れて電極配線部3
の接点部3aと接触するため、メタルドーム4の載置さ
れた電極配線部2と電気的に導通(オン)され、一方、
その押圧を開放すると、メタルドーム4がそのバネ性に
より復元するため、非導通(オフ)となる。この押圧操
作時、メタルドーム4のエッジ部分4aは、電極配線部
3側に近接するが、絶縁皮膜層5によって遮断させ、絶
縁状態が確保される。
With this structure, if the metal dome 4 is pressed (clicked), the dome metal is crushed and the electrode wiring portion 3 is crushed.
Is electrically connected (turned on) to the electrode wiring portion 2 on which the metal dome 4 is placed,
When the pressing is released, the metal dome 4 is restored by its spring property, and thus becomes non-conductive (off). At the time of this pressing operation, the edge portion 4a of the metal dome 4 is close to the electrode wiring portion 3 side, but is cut off by the insulating film layer 5, and the insulating state is ensured.

【0005】[0005]

【発明が解決しようとする課題】ところが、この構造で
は、メタルドーム4のエッジ部分4aより絶縁皮膜層5
の上面側が高いため、このエッジ部分4aがクリックの
都度絶縁皮膜層5側に乗り上げる形となり、次のような
問題があった。
In this structure, however, the insulating film layer 5 is formed from the edge portion 4a of the metal dome 4.
Because the upper surface side of the substrate is high, the edge portion 4a runs over the insulating film layer 5 every time the click is performed, and the following problem occurs.

【0006】(1)先ず、メタルドーム4のエッジ部分
4aの乗り上げにより、経時的にエッジ部分4aが通常
エポキシ樹脂などの材料からなる絶縁皮膜層5に喰い込
むようになり、その喰い込みが電極配線部3側に達する
ようになると、両電極配線部2,3の短絡するなどの接
点不良が生じるようになる。
(1) First, as the edge portion 4a of the metal dome 4 rides on, the edge portion 4a bites into the insulating film layer 5 usually made of a material such as epoxy resin with time, and the bite is caused by the electrode. When it reaches the wiring portion 3 side, a contact failure such as a short circuit between the electrode wiring portions 2 and 3 occurs.

【0007】(2)このエッジ部分4aの喰い込みを防
止するため、絶縁皮膜層5の厚さを厚くすると、絶縁皮
膜層5上面とメタルドーム4のエッジ部分4aとの段差
δ0が大きくなるため、メタルドーム4をクリックした
際、バネ性が失われてメタルドーム4がスムーズに戻ら
なくなるという現象、いわゆる座窟反転が生じる。
(2) If the thickness of the insulating film layer 5 is increased to prevent the biting of the edge portion 4a, the step δ 0 between the upper surface of the insulating film layer 5 and the edge portion 4a of the metal dome 4 increases. Therefore, when the metal dome 4 is clicked, a phenomenon that the spring property is lost and the metal dome 4 does not return smoothly, that is, a so-called cave inversion occurs.

【0008】(3)また、より不都合なことに、エッジ
部分4aによる喰い込みが接点不良に達する前でも、エ
ッジ部分4aの摩擦によって絶縁皮膜層5側に削れ屑が
発生するため、この削れ屑が電極配線部3側の接点部3
a付近に飛散したり、付着したりして、接触不良(クリ
ック時の導通不良)を起こす恐れがある。
(3) Even more disadvantageously, even before the biting by the edge portion 4a reaches the contact failure, shavings are generated on the insulating film layer 5 side by the friction of the edge portion 4a. Is the contact part 3 on the electrode wiring part 3 side
There is a possibility that a contact failure (poor conduction at the time of a click) may occur due to scattering or adhesion near a.

【0009】本発明は、このような従来の実情に鑑みて
なされたもので、基本的には、メタルドームのエッジ部
分による絶縁皮膜層側の損傷による問題を根本的に解消
するため、この絶縁皮膜層側の耐磨耗性を向上させた構
造として、メタルドームのエッジ部分による絶縁皮膜層
側の損傷を極力防止するようにしたものである。
The present invention has been made in view of such a conventional situation. Basically, in order to fundamentally solve the problem of damage to the insulating film layer side due to the edge portion of the metal dome, this insulating material is used. The structure in which the abrasion resistance of the coating layer side is improved is such that damage to the insulating coating layer side due to the edge portion of the metal dome is prevented as much as possible.

【0010】[0010]

【課題を解決するための手段】請求項1記載の本発明
は、ベース基板上に形成され、かつその上にバネ性のメ
タルドームが載置される円弧形状部を有する第1電極配
線部と、当該第1電極配線部の円弧形状部内に導かれた
第2電極配線部と、当該第2電極配線部上で前記メタル
ドームが跨がる部分に被覆された絶縁皮膜層とからな
り、前記絶縁皮膜層の被覆領域が前記第1電極配線部の
円弧形状部側まで拡げられてなることを特徴とするメタ
ルドーム付きプリント配線板にある。
According to a first aspect of the present invention, there is provided a first electrode wiring portion having an arc-shaped portion formed on a base substrate and having a springy metal dome mounted thereon. A second electrode wiring portion guided into the arc-shaped portion of the first electrode wiring portion, and an insulating film layer covering a portion where the metal dome straddles on the second electrode wiring portion, The printed wiring board with a metal dome is characterized in that a covering region of the insulating film layer is extended to an arc-shaped portion side of the first electrode wiring portion.

【0011】請求項2記載の本発明は、ベース基板上に
形成され、かつその上にバネ性のメタルドームが載置さ
れる円弧形状部を有する第1電極配線部と、当該第1電
極配線部の円弧形状部内に導かれた第2電極配線部と、
当該第2電極配線部上で前記メタルドームが跨がる部分
に被覆された絶縁皮膜層とからなり、前記絶縁皮膜層上
に耐磨耗層が形成されてなることを特徴とするメタルド
ーム付きプリント配線板にある。
According to a second aspect of the present invention, there is provided a first electrode wiring portion having an arc-shaped portion formed on a base substrate and having a resilient metal dome mounted thereon, and the first electrode wiring portion. A second electrode wiring portion guided into the arc-shaped portion of the portion,
A metal dome comprising an insulating film layer covering a portion where the metal dome straddles on the second electrode wiring portion, and a wear-resistant layer formed on the insulating film layer. It is on the printed wiring board.

【0012】請求項3記載の本発明は、前記耐磨耗層が
金属層であることを特徴とする請求項2記載のメタルド
ーム付きプリント配線板にある。
The present invention according to claim 3 is the printed wiring board with a metal dome according to claim 2, wherein the wear-resistant layer is a metal layer.

【0013】[0013]

【発明の実施の形態】図1〜図2は本発明に係るメタル
ドーム付きプリント配線板の一実施例を示し、その基本
構造は、上記図3〜図4に示した配線板とほぼ同様であ
るが、絶縁皮膜層50を、他方の電極配線部、即ち第2
電極配線部30はもちろんのこと、一方の電極配線部、
即ち第1電極配線部20の円弧形状部20a側まで拡げ
て被覆領域(面積)を拡大してある。なお、図中、10
はベース基板、20bは円弧形状部20aの離間部分、
30aは第2電極配線部30の接点部、40はバネ性の
メタルドーム、40aはそのエッジ部分である。
1 and 2 show an embodiment of a printed wiring board with a metal dome according to the present invention. The basic structure of the printed wiring board is substantially the same as that of the wiring board shown in FIGS. However, the insulating film layer 50 is connected to the other electrode wiring portion, that is, the second electrode wiring portion.
Not only the electrode wiring section 30 but also one of the electrode wiring sections,
That is, the first electrode wiring portion 20 is extended to the arc-shaped portion 20a side to enlarge the covering region (area). In the figure, 10
Is a base substrate, 20b is a separated portion of the arc-shaped portion 20a,
Reference numeral 30a denotes a contact portion of the second electrode wiring portion 30, reference numeral 40 denotes a springy metal dome, and reference numeral 40a denotes an edge portion thereof.

【0014】絶縁皮膜層50は、通常エポキシ樹脂など
からなるものの、上述したように、メタルドーム40の
クリックの都度エッジ部分40aによって押圧されるた
め、この際の摩擦や喰い込み、削れなどによって、遂に
は接点不良に至るわけであるが、本発明では、この絶縁
皮膜層50の被覆領域を、上述のように、第1電極配線
部20側まで大きく拡げてある。
Although the insulating film layer 50 is usually made of epoxy resin or the like, it is pressed by the edge portion 40a every time the metal dome 40 is clicked, as described above. In the present invention, the covering region of the insulating film layer 50 is greatly extended to the first electrode wiring portion 20 side as described above, although this eventually leads to a contact failure.

【0015】このため、絶縁皮膜層50側のメタルドー
ム40のエッジ部分40aに対する接触面積が大幅に増
える。つまり、エッジ部分40aによる絶縁皮膜層50
に対する単位面積に当たりのストレスが大幅に軽減され
る。この結果、絶縁皮膜層50の耐磨耗性が向上し、短
絡の発生までには長時間要するようになり、耐久性の大
幅な向上が得られる。もちろん、エッジ部分40aの喰
い込み作用などの低下により、絶縁皮膜層50側の削れ
屑の発生も大幅に抑制されるため、削れ屑に起因する第
2電極配線部30側との接触不良も低減させることがで
きる。
Therefore, the contact area of the metal dome 40 on the side of the insulating coating layer 50 with the edge portion 40a is greatly increased. That is, the insulating film layer 50 formed by the edge portion 40a
The stress per unit area is greatly reduced. As a result, the abrasion resistance of the insulating coating layer 50 is improved, and it takes a long time until a short circuit occurs, and a large improvement in durability can be obtained. Of course, the generation of shavings on the insulating film layer 50 side is greatly suppressed due to the reduction of the biting action of the edge portion 40a and the like, so that poor contact with the second electrode wiring portion 30 due to the shavings is also reduced. Can be done.

【0016】本発明では、単に絶縁皮膜層50の被覆領
域を拡げるだけでよいため、特別な工程は必要とされ
ず、従来方法と同様でよく、安価な提供が可能である。
また、絶縁皮膜層50は、被覆領域を拡げた分だけ、メ
タルドーム40のエッジ部分40aの喰い込み作用など
が弱まるため、その厚さを相対的に薄手にすることも可
能となる。この結果、絶縁皮膜層50の厚さを薄手にす
ると、第1電極配線部20(より正確には円弧形状部2
0a)との段差δ1 が小さくなるため、その分だけメタ
ルドーム40のエッジ部分40aからのストレスが低減
されるという良循環が得られる。
In the present invention, since only the area covered by the insulating coating layer 50 needs to be simply expanded, no special process is required, and it is possible to provide the same as the conventional method and to provide an inexpensive method.
In addition, the insulating film layer 50 can reduce the thickness of the metal dome 40 by reducing the biting action of the edge portion 40a, etc., by the extent that the covering area is expanded. As a result, when the thickness of the insulating film layer 50 is reduced, the first electrode wiring portion 20 (more precisely, the arc-shaped portion 2
Since the level difference [delta] 1 and 0a) is small, good circulation is obtained that stress from the edge portion 40a of the metal dome 40 is correspondingly reduced.

【0017】図3は本発明に係るメタルドーム付きプリ
ント配線板の他の実施例を示し、その基本構造は、上記
図3〜図4に示した配線板とほぼ同様であるが、絶縁皮
膜層50上に、さらに印刷法やメッキ法などによって金
属層などからなる耐磨耗層60を被覆してある。なお、
図中、10はベース基板、20は第1電極配線部、20
aは第1電極配線部20の円弧形状部、20bは円弧形
状部20aの離間部分、30は第2電極配線部、30a
は第2電極配線部30の接点部、40はバネ性のメタル
ドーム、40aはそのエッジ部分である。
FIG. 3 shows another embodiment of a printed wiring board with a metal dome according to the present invention. The basic structure of the printed wiring board is substantially the same as that of the wiring board shown in FIGS. An abrasion-resistant layer 60 made of a metal layer or the like is further coated on 50 by a printing method, a plating method, or the like. In addition,
In the figure, 10 is a base substrate, 20 is a first electrode wiring section, 20
a is an arc-shaped portion of the first electrode wiring portion 20, 20b is a separated portion of the arc-shaped portion 20a, 30 is a second electrode wiring portion, 30a
Denotes a contact portion of the second electrode wiring portion 30, 40 denotes a metal dome having a spring property, and 40a denotes an edge portion thereof.

【0018】耐磨耗層60は、例えば金属層部分からな
るため、メタルドーム40のエッジ部分40aに対して
高い耐磨耗性が得られる。つまり、耐磨耗層60により
絶縁皮膜層50が保護される。この結果、メタルドーム
40のエッジ部分40aによる摩擦や喰い込み、削れな
どによって、電極間が短絡するまでには、耐磨耗層60
が損傷された後、さらに、絶縁皮膜層50が損傷され
て、やっと短絡に至ることとなる。このため、短絡まで
にはより多くの長時間要が必要とされ、より優れた耐久
性が得られる。さらに、耐磨耗層60にあっては、金属
素材によって削れ屑の発生なども最小限に抑えられるた
め、削れ屑に起因する第2電極配線部30側との接触不
良も大幅に低減させることができる。
Since the abrasion-resistant layer 60 is made of, for example, a metal layer, high abrasion resistance is obtained for the edge portion 40a of the metal dome 40. That is, the insulating film layer 50 is protected by the wear-resistant layer 60. As a result, the abrasion-resistant layer 60 is formed before the electrodes are short-circuited due to friction, biting, shaving, or the like due to the edge portion 40a of the metal dome 40.
Is damaged, the insulating coating layer 50 is further damaged, and a short circuit occurs. For this reason, more time is required until a short circuit occurs, and more excellent durability can be obtained. Further, in the wear-resistant layer 60, since the generation of shavings and the like is minimized by the metal material, the poor contact with the second electrode wiring portion 30 side due to the shavings is significantly reduced. Can be.

【0019】また、耐磨耗層60を設ける構造において
も、この耐磨耗層60の存在によって、絶縁皮膜層50
の厚さを薄手にすることができる。このため、第1電極
配線部20との段差δ2 を小さくすることがで、その分
だけメタルドーム40のエッジ部分40aからのストレ
スが低減されるという良循環も得られる。
Also in the structure in which the wear-resistant layer 60 is provided, the presence of the wear-resistant layer 60 causes the insulating film layer 50 to be formed.
Can be made thinner. For this reason, the good circulation that the stress from the edge portion 40 a of the metal dome 40 is reduced by reducing the step δ 2 from the first electrode wiring portion 20 is also obtained.

【0020】図4は本発明に係るメタルドーム付きプリ
ント配線板の他の実施例を示し、その基本構造は、上記
図1〜図2に示した配線板とほぼ同様であって、被覆領
域を拡大した絶縁皮膜層50上にさらに金属層などから
なる耐磨耗層60を被覆してある。この構造によって、
絶縁皮膜層50と共に耐磨耗層60の被覆領域も拡大さ
れるため、より一層優れた耐久性が得られる。
FIG. 4 shows another embodiment of a printed wiring board with a metal dome according to the present invention. The basic structure of the printed wiring board is substantially the same as that of the wiring board shown in FIGS. An abrasion resistant layer 60 made of a metal layer or the like is further coated on the expanded insulating film layer 50. With this structure,
Since the coverage area of the wear-resistant layer 60 is expanded together with the insulating coating layer 50, more excellent durability can be obtained.

【0021】なお、この耐磨耗層60の拡大被覆によ
り、絶縁皮膜層50の厚さをより薄手にすることが可能
となる。このため、第1電極配線部20との段差δ1
より小さくすることがで、その分だけメタルドーム40
のエッジ部分40aからのストレスが低減されるという
良循環も得られる。
The thickness of the insulating coating layer 50 can be made thinner by the expanded coating of the wear-resistant layer 60. For this reason, the step δ 1 from the first electrode wiring portion 20 can be made smaller, and the metal dome 40
The good circulation that the stress from the edge portion 40a is reduced.

【0022】因みに、図1〜2に示す構造の本発明に係
るメタルドーム付きプリント配線板として、導体(C
u)厚さが35μmの第1電極配線部20と第2電極配
線部30とを形成した後、絶縁皮膜層50を第1電極配
線部20の円弧形状部20a側まで拡げて被覆し、メタ
ルドーム40を設置して、サンプルのプリント配線板を
10個製造した。このときの第1電極配線部20及び第
2電極配線部30の配線幅は0.3mm、第1電極配線
部20と第2電極配線部30との間隔(隙間)は0.9
mm、絶縁皮膜層50の被覆領域幅は1.2mm、絶縁
皮膜層50の厚さは10μmであった。各サンプルに対
して、メタルドーム40の繰り返しクリック(打鍵試
験)を行い、絶縁皮膜層50の損傷による接点不良が生
じるまでの平均の打鍵回数を求めたところ、その打鍵回
数は18万回以上であった。
Incidentally, as a printed wiring board with a metal dome according to the present invention having the structure shown in FIGS.
u) After forming the first electrode wiring portion 20 and the second electrode wiring portion 30 each having a thickness of 35 μm, the insulating film layer 50 is extended to the arc-shaped portion 20a side of the first electrode wiring portion 20 to cover the first electrode wiring portion 20. The dome 40 was set, and ten sample printed wiring boards were manufactured. At this time, the wiring width of the first electrode wiring section 20 and the second electrode wiring section 30 is 0.3 mm, and the interval (gap) between the first electrode wiring section 20 and the second electrode wiring section 30 is 0.9.
mm, the coating area width of the insulating coating layer 50 was 1.2 mm, and the thickness of the insulating coating layer 50 was 10 μm. Repeated clicks (keying test) of the metal dome 40 were performed on each sample, and the average number of keying operations before contact failure due to damage to the insulating coating layer 50 was determined. The number of keying operations was 180,000 or more. there were.

【0023】図4に示す構造の本発明に係るメタルドー
ム付きプリント配線板として、導体(Cu)厚さが35
μmの第1電極配線部20と第2電極配線部30とを形
成した後、絶縁皮膜層50を第1電極配線部20の円弧
形状部20a側まで拡げて被覆し、さらに、絶縁皮膜層
50上にメッキ法により金属層からなる耐磨耗層60を
被覆し、メタルドーム40を設置して、サンプルのプリ
ント配線板を10個製造した。このときの第1電極配線
部20及び第2電極配線部30の配線幅は0.3mm、
第1電極配線部20と第2電極配線部30との間隔(隙
間)は0.9mm、絶縁皮膜層50の被覆領域幅は1.
2mm、絶縁皮膜層50の厚さは10μm、耐磨耗層6
0の厚さは1.0μmであった。各サンプルに対して、
メタルドーム40の繰り返しクリック(打鍵試験)を行
い、絶縁皮膜層50の損傷による接点不良が生じるまで
の平均の打鍵回数を求めたところ、その打鍵回数は23
万回以上であった。
A printed wiring board with a metal dome according to the present invention having a structure shown in FIG. 4 has a conductor (Cu) thickness of 35.
After forming the first electrode wiring portion 20 and the second electrode wiring portion 30 of μm, the insulating film layer 50 is extended to the side of the arc-shaped portion 20a of the first electrode wiring portion 20 to cover the same. An abrasion-resistant layer 60 made of a metal layer was coated thereon by a plating method, and a metal dome 40 was provided to manufacture ten sample printed wiring boards. At this time, the wiring width of the first electrode wiring section 20 and the second electrode wiring section 30 is 0.3 mm,
The distance (gap) between the first electrode wiring section 20 and the second electrode wiring section 30 is 0.9 mm, and the width of the covering region of the insulating coating layer 50 is 1.
2 mm, the thickness of the insulating film layer 50 is 10 μm, and the wear-resistant layer 6
0 had a thickness of 1.0 μm. For each sample,
The metal dome 40 was repeatedly clicked (keying test), and the average number of keying operations before contact failure due to damage to the insulating coating layer 50 was determined.
It was more than ten thousand times.

【0024】一方、図5〜図6に示す従来構造のメタル
ドーム付きプリント配線板として、導体(Cu)厚さが
35μmの一方の電極配線部2と他方の電極配線部3と
を形成した後、他方の電極配線部3上に絶縁皮膜層5を
被覆し、メタルドーム40を設置して、サンプルのプリ
ント配線板を10個製造した。このときの一方の電極配
線部2及び他方の電極配線部3の配線幅は0.3mm、
一方の電極配線部2と他方の電極配線部3との間隔(隙
間)は0.9mm、絶縁皮膜層5の被覆領域幅は0.3
mm、絶縁皮膜層5の厚さは10μmであった。各サン
プルに対して、メタルドーム40の繰り返しクリック
(打鍵試験)を行い、絶縁皮膜層5の損傷による接点不
良が生じるまでの平均の打鍵回数を求めたところ、その
打鍵回数は10万回程度であった。
On the other hand, after forming one electrode wiring portion 2 and the other electrode wiring portion 3 having a conductor (Cu) thickness of 35 μm as a printed wiring board with a metal dome having a conventional structure shown in FIGS. Then, the insulating film layer 5 was coated on the other electrode wiring portion 3 and a metal dome 40 was provided, thereby manufacturing ten sample printed wiring boards. At this time, the wiring width of one electrode wiring part 2 and the other electrode wiring part 3 is 0.3 mm,
The distance (gap) between one electrode wiring portion 2 and the other electrode wiring portion 3 is 0.9 mm, and the width of the covering area of the insulating coating layer 5 is 0.3 mm.
mm, and the thickness of the insulating coating layer 5 was 10 μm. The metal dome 40 was repeatedly clicked (keying test) on each sample, and the average number of times of keying until a contact failure occurred due to damage to the insulating coating layer 5 was obtained. The number of times of keying was about 100,000. there were.

【0025】[0025]

【発明の効果】以上の説明から明らかなように、本発明
のメタルドーム付きプリント配線板によると、絶縁皮膜
層の被覆領域を拡大たり、この層上にさらに耐磨耗層を
設けて、絶縁皮膜層側の耐磨耗性を向上させた構造とし
てあるため、メタルドームを頻繁にクリックしても、そ
のエッジ部分による絶縁皮膜層側に対するストレスを大
幅に軽減することができ、耐久性の大幅な向上が得られ
る。また、メタルドームのエッジ部分と絶縁皮膜層側と
の摩擦による削れ屑の発生が効果的に抑えられるため、
接触不良の大幅な低減が可能となる。
As is apparent from the above description, according to the printed wiring board with the metal dome of the present invention, the area covered by the insulating film layer can be enlarged, or the abrasion-resistant layer can be further provided on this layer to provide an insulating layer. Even if the metal dome is clicked frequently, the stress on the insulating coating layer side can be greatly reduced even if the metal dome is clicked frequently, and the durability is greatly improved. Significant improvement is obtained. In addition, since the generation of shavings due to friction between the edge of the metal dome and the insulating coating layer side is effectively suppressed,
It is possible to significantly reduce poor contact.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明に係るメタルドーム付きプリント配線
板の一例になる縦断面図である。
FIG. 1 is a longitudinal sectional view showing an example of a printed wiring board with a metal dome according to the present invention.

【図2】 図1のメタルドーム付きプリント配線板の平
面図である。
FIG. 2 is a plan view of the printed wiring board with a metal dome of FIG. 1;

【図3】 本発明に係るメタルドーム付きプリント配線
板の他の例になる縦断面図である。
FIG. 3 is a longitudinal sectional view showing another example of a printed wiring board with a metal dome according to the present invention.

【図4】 本発明に係るメタルドーム付きプリント配線
板の他の例になる縦断面図である。
FIG. 4 is a longitudinal sectional view showing another example of a printed wiring board with a metal dome according to the present invention.

【図5】 従来構造のメタルドーム付きプリント配線板
を示した縦断面図である。
FIG. 5 is a longitudinal sectional view showing a printed wiring board with a metal dome having a conventional structure.

【図6】 図5のメタルドーム付きプリント配線板の平
面図である。
6 is a plan view of the printed wiring board with a metal dome of FIG. 5;

【符号の説明】[Explanation of symbols]

10 ベース基板 20 第1電極配線部 20a 円弧形状部 20b 離間部分 30 第2電極配線部 40 バネ性のメタルドーム 40a エッジ部分 50 絶縁皮膜層 60 耐磨耗層 DESCRIPTION OF SYMBOLS 10 Base board 20 1st electrode wiring part 20a Arc-shaped part 20b Separation part 30 2nd electrode wiring part 40 Spring metal dome 40a Edge part 50 Insulation film layer 60 Abrasion resistant layer

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 5E338 AA01 BB63 CD17 CD40 EE11 EE21 5G006 AA01 AB25 AZ01 BA01 BA02 BB03 FB04 5G051 AC20 AC30  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E338 AA01 BB63 CD17 CD40 EE11 EE21 5G006 AA01 AB25 AZ01 BA01 BA02 BB03 FB04 5G051 AC20 AC30

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 ベース基板上に形成され、かつその上に
バネ性のメタルドームが載置される円弧形状部を有する
第1電極配線部と、当該第1電極配線部の円弧形状部内
に導かれた第2電極配線部と、当該第2電極配線部上で
前記メタルドームが跨がる部分に被覆された絶縁皮膜層
とからなり、前記絶縁皮膜層の被覆領域が前記第1電極
配線部の円弧形状部側まで拡げられてなることを特徴と
するメタルドーム付きプリント配線板。
A first electrode wiring portion formed on a base substrate and having an arc-shaped portion on which a resilient metal dome is placed; and a first electrode wiring portion provided in the arc-shaped portion of the first electrode wiring portion. A second electrode wiring portion provided on the second electrode wiring portion, and an insulating film layer covering a portion where the metal dome straddles the second electrode wiring portion. A printed wiring board with a metal dome, which is extended to the arc-shaped portion side of the printed wiring board.
【請求項2】 ベース基板上に形成され、かつその上に
バネ性のメタルドームが載置される円弧形状部を有する
第1電極配線部と、当該第1電極配線部の円弧形状部内
に導かれた第2電極配線部と、当該第2電極配線部上で
前記メタルドームが跨がる部分に被覆された絶縁皮膜層
とからなり、前記絶縁皮膜層上に耐磨耗層が形成されて
なることを特徴とするメタルドーム付きプリント配線
板。
2. A first electrode wiring portion formed on a base substrate and having an arc-shaped portion on which a spring-like metal dome is mounted, and a first electrode wiring portion provided in the arc-shaped portion of the first electrode wiring portion. A second electrode wiring portion provided on the second electrode wiring portion, and an insulating film layer covering a portion where the metal dome straddles on the second electrode wiring portion. A wear-resistant layer is formed on the insulating film layer. A printed wiring board with a metal dome.
【請求項3】 前記耐磨耗層が金属層であることを特徴
とする請求項2記載のメタルドーム付きプリント配線
板。
3. The printed wiring board with a metal dome according to claim 2, wherein the wear-resistant layer is a metal layer.
JP2001011164A 2001-01-19 2001-01-19 Printed wiring board with metal dome Pending JP2002216581A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001011164A JP2002216581A (en) 2001-01-19 2001-01-19 Printed wiring board with metal dome

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001011164A JP2002216581A (en) 2001-01-19 2001-01-19 Printed wiring board with metal dome

Publications (1)

Publication Number Publication Date
JP2002216581A true JP2002216581A (en) 2002-08-02

Family

ID=18878329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001011164A Pending JP2002216581A (en) 2001-01-19 2001-01-19 Printed wiring board with metal dome

Country Status (1)

Country Link
JP (1) JP2002216581A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251178A (en) * 2007-03-29 2008-10-16 Fuji Denshi Kogyo Kk Switch

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251178A (en) * 2007-03-29 2008-10-16 Fuji Denshi Kogyo Kk Switch

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