JP2002212695A - Damping device and method of cooling the damping device - Google Patents
Damping device and method of cooling the damping deviceInfo
- Publication number
- JP2002212695A JP2002212695A JP2001007043A JP2001007043A JP2002212695A JP 2002212695 A JP2002212695 A JP 2002212695A JP 2001007043 A JP2001007043 A JP 2001007043A JP 2001007043 A JP2001007043 A JP 2001007043A JP 2002212695 A JP2002212695 A JP 2002212695A
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- Japan
- Prior art keywords
- damping device
- vibration damping
- position detector
- cooling
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、走行する板状の鋼
板の位置を検出して、鋼板の振動や湾曲を低減する制振
装置および制振装置の冷却方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vibration damping device for detecting the position of a running plate-shaped steel plate to reduce vibration and bending of the steel plate, and a method of cooling the vibration damping device.
【０００２】[0002]
【従来の技術】製鉄設備において、圧延ラインで生成さ
れた帯板状の鋼板にメッキなどの表面処理を施す表面処
理ライン等には、走行する板状の鋼板の位置を検出し
て、鋼板の振動や湾曲を低減するために、制振装置が設
けられている。制振装置は、図９に示すように、センサ
１と電磁石２とにより、又は図１０に示すように、２つ
の電磁石からなり、電磁石およびセンサは、板を挟んで
対向に配置され、また幅方向には複数配置するように略
構成されている。この制振装置によれば、センサ１によ
り検出される鋼板３の位置ずれ量に応じて、電磁石２の
励磁力による鋼板３に対する吸引力を制御し、鋼板３の
振動および湾曲を低減する。2. Description of the Related Art In a steelmaking facility, the position of a running plate-shaped steel sheet is detected on a surface treatment line or the like for performing a surface treatment such as plating on a strip-shaped steel sheet generated in a rolling line. In order to reduce vibration and bending, a vibration damping device is provided. The damping device is composed of a sensor 1 and an electromagnet 2 as shown in FIG. 9 or two electromagnets as shown in FIG. 10, and the electromagnet and the sensor are arranged opposite to each other with a plate interposed therebetween, and have a width. It is configured to be arranged in a plurality of directions. According to this vibration damping device, the attractive force to the steel plate 3 by the exciting force of the electromagnet 2 is controlled in accordance with the amount of displacement of the steel plate 3 detected by the sensor 1, and the vibration and bending of the steel plate 3 are reduced.
【０００３】[0003]
【発明が解決しようとする課題】ところで、上述した従
来技術による制振装置は、表面処理を施すメッキ槽の近
傍に設置されるため、鋼板３の輻射熱により電磁石２お
よびセンサ１が高温雰囲気に曝される。そこで、通常、
図９に示すように、電磁石２およびセンサ１をケース
（断熱板など）４で覆うような耐熱策を施すが、鋼板３
に近い部分では高温状態のままである。Since the above-described vibration damping device according to the prior art is installed near a plating tank to be subjected to surface treatment, the electromagnet 2 and the sensor 1 are exposed to a high-temperature atmosphere by radiant heat of the steel plate 3. Is done. So, usually,
As shown in FIG. 9, heat treatment is performed so that the electromagnet 2 and the sensor 1 are covered with a case (insulating plate or the like) 4.
In the portion close to, the high temperature state is maintained.
【０００４】特に、センサ１については、比較的耐熱温
度が低いため、センサ１を破損しやすい。高温雰囲気に
も耐えるセンサを使用すればよいが、非常にコストがか
かり現実的でない。このため、耐熱温度の低いセンサを
冷却して使用するのが一般的である。冷却方法として
は、安全性、コストの面から空冷式が使われている。セ
ンサヘッド１ａは、性能面から、できるだけ鋼板３に近
づける必要があるため、センサヘッド１ａと前面断熱板
４ａとの距離が狭くなる。このため、センサヘッド１ａ
の前面にエアーが行き渡らず、冷却が不十分になり、セ
ンサ１を破損することがあるという問題がある。In particular, since the sensor 1 has a relatively low heat-resistant temperature, the sensor 1 is easily damaged. It is sufficient to use a sensor that can withstand a high-temperature atmosphere, but it is very costly and impractical. For this reason, it is common to cool and use a sensor having a low heat-resistant temperature. As a cooling method, an air-cooling method is used in terms of safety and cost. Since the sensor head 1a needs to be as close as possible to the steel plate 3 from the viewpoint of performance, the distance between the sensor head 1a and the front heat insulating plate 4a is reduced. For this reason, the sensor head 1a
There is a problem that the air does not spread to the front surface of the sensor, the cooling is insufficient, and the sensor 1 may be damaged.
【０００５】この発明は上述した事情に鑑みてなされた
もので、センサ全体を効率よく冷却することができる制
振装置、および制振装置の冷却方法を提供することを目
的とする。The present invention has been made in view of the above circumstances, and has as its object to provide a vibration damping device capable of efficiently cooling the entire sensor and a method of cooling the vibration damping device.
【０００６】[0006]
【課題を解決するための手段】上述した問題点を解決す
るために、請求項１記載の発明では、走行する鋼板の走
路面に対して所定の間隔を空けて配置される電磁石と、
非接触式で前記鋼板までの距離を検出する位置検出器と
を具備し、前記位置検出器の略中心に冷却用空気を通す
第１の貫通孔が形成されていることを特徴とする。According to the first aspect of the present invention, there is provided an electromagnet arranged at a predetermined distance from a running surface of a running steel plate.
A position detector for detecting a distance to the steel plate in a non-contact manner, wherein a first through hole through which cooling air passes is formed substantially at the center of the position detector.
【０００７】また、請求項２記載の発明では、請求項１
記載の制振装置において、前記電磁石と前記位置検出器
との間に配置された断熱板を具備することを特徴とす
る。また、請求項３記載の発明では、請求項２記載の制
振装置において、前記位置検出器と前記断熱板との間に
前記冷却用空気を噴出させる第２の貫通孔が形成されて
いることを特徴とする。また、請求項４記載の発明で
は、請求項２または３記載の制振装置において、前記電
磁石と前記断熱板との間に前記冷却用空気を噴出させる
第３の貫通孔が形成されていることを特徴とする。[0007] According to the second aspect of the present invention, the first aspect is provided.
The vibration damping device according to any one of the preceding claims, further comprising a heat insulating plate disposed between the electromagnet and the position detector. According to a third aspect of the present invention, in the vibration damping device according to the second aspect, a second through-hole for ejecting the cooling air is formed between the position detector and the heat insulating plate. It is characterized by. According to a fourth aspect of the present invention, in the vibration damping device according to the second or third aspect, a third through hole for ejecting the cooling air is formed between the electromagnet and the heat insulating plate. It is characterized by.
【０００８】上述した問題点を解決するために、請求項
５記載の発明では、走行する鋼板の走路面に対して所定
の間隔を空けて配置される電磁石と、非接触式で前記鋼
板までの距離を検出する位置検出器とを具備する制振装
置を冷却用空気により冷却する制振装置の冷却方法にお
いて、前記位置検出器の略中心に形成された第１の貫通
孔に前記冷却用空気を通し、前記位置検出器の前面部の
開口部より噴出させることを特徴とする。[0008] In order to solve the above-mentioned problems, in the invention according to claim 5, an electromagnet arranged at a predetermined distance from a running surface of a running steel sheet is provided with a non-contact type electromagnet. In a method for cooling a vibration damping device having a position detector for detecting a distance, the cooling air is supplied to a first through hole formed substantially at the center of the position detector. And is ejected from an opening in the front part of the position detector.
【０００９】また、請求項６記載の発明では、請求項５
記載の制振装置の冷却方法において、前記電磁石と前記
位置検出器との間に断熱板を配置することを特徴とす
る。また、請求項７記載の発明では、請求項６記載の制
振装置の冷却方法において、前記位置検出器と前記断熱
板との間に開口部が位置するように形成された第２の貫
通孔に前記冷却用空気を通し、前記位置検出器と前記断
熱板との間に噴出させることを特徴とする。Further, according to the invention described in claim 6, according to claim 5,
The method for cooling a vibration damping device according to the above aspect, further comprising disposing a heat insulating plate between the electromagnet and the position detector. According to a seventh aspect of the present invention, in the method for cooling the vibration damping device according to the sixth aspect, the second through hole is formed such that an opening is located between the position detector and the heat insulating plate. The cooling air is passed through the nozzle and is ejected between the position detector and the heat insulating plate.
【００１０】また、請求項８記載の発明では、請求項６
または７記載の制振装置の冷却方法において、前記電磁
石と前記断熱板との間に開口部が位置するように形成さ
れた第３の貫通孔に前記冷却用空気を通し、前記電磁石
と前記断熱板との間に噴出させることを特徴とする。ま
た、請求項９記載の発明では、請求項１ないし４の何れ
かに記載の制振装置において、前記電磁石を鋼板を挟ん
で対向するように配置することを特徴とする。また、請
求項１０記載の発明では、請求項５ないし８の何れかに
記載の制振装置の冷却方法において、前記電磁石を鋼板
を挟んで対向するように配置することを特徴とする。According to the invention described in claim 8, according to claim 6,
Or the cooling method of the vibration damping device according to 7, wherein the cooling air is passed through a third through hole formed so that an opening is located between the electromagnet and the heat insulating plate, and the electromagnet and the heat insulating plate are passed through the third through hole. It is characterized in that it is ejected between the plate and the plate. According to a ninth aspect of the present invention, in the vibration damping device according to any one of the first to fourth aspects, the electromagnets are arranged so as to face each other with a steel plate interposed therebetween. According to a tenth aspect of the present invention, in the cooling method of the vibration damping device according to any one of the fifth to eighth aspects, the electromagnets are arranged so as to face each other with a steel plate interposed therebetween.
【００１１】この発明では、非接触式で前記鋼板までの
距離を検出する位置検出器の略中心に冷却用空気を通す
第１の貫通孔を形成し、該第１の貫通孔に前記冷却用空
気を通し、前記位置検出器の前面部の開口部より噴出さ
せて、位置検出器の前面にも冷却用空気を行き渡らせ、
位置検出器全体を冷却する。したがって、センサ全体を
効率よく冷却することが可能となる。According to the present invention, a first through-hole through which cooling air passes is formed substantially at the center of a position detector for detecting the distance to the steel plate in a non-contact manner, and the first through-hole is formed in the first through-hole. Air is passed through and ejected from the opening in the front part of the position detector to spread cooling air also to the front of the position detector,
Cool the entire position detector. Therefore, the entire sensor can be efficiently cooled.
【００１２】[0012]
【発明の実施の形態】以下、図面を用いて本発明の実施
の形態を説明する。 Ａ．第１の実施形態の構成 図１は、本発明の第１の実施形態による制振装置の内部
構造を示す上面図である。また、図２および図３は、本
第１の実施形態による制振装置の内部構造を示す側面図
である。図において、制振装置には、センサ１２，１３
と電磁石１４，１５とが並列に組み込まれている。各セ
ンサ１２，１３の略中央部には、センサ取付台１２ａ，
１３ａおよびセンサヘッド１２ｂ，１３ｂを貫通するエ
アー噴出し孔１６，１７が形成されている。センサアン
プは、センサ取付台から数メートル離れた場所に設置さ
れている。Embodiments of the present invention will be described below with reference to the drawings. A. Configuration of First Embodiment FIG. 1 is a top view showing an internal structure of a vibration damping device according to a first embodiment of the present invention. FIGS. 2 and 3 are side views showing the internal structure of the vibration damping device according to the first embodiment. In the figure, sensors 12 and 13 are provided in the vibration damping device.
And the electromagnets 14 and 15 are incorporated in parallel. At a substantially central portion of each of the sensors 12 and 13, a sensor mounting base 12a,
Air ejection holes 16 and 17 penetrating the sensor head 13a and the sensor heads 12b and 13b are formed. The sensor amplifier is installed at a position several meters away from the sensor mounting base.
【００１３】センサヘッド１２ｂ，１３ｂは、図４に示
すような構造になっており、センサ用コイル１２ｃ，１
３ｃは周囲に配設されているので、中心にエアー噴出し
孔１６，１７が空いていることによる問題はない。エア
ー噴出し孔１６，１７の後部側には、外部から冷却用の
エアーを導入するためのエアー配管１８が設けられてい
る。冷却用のエアーは、上記エアー配管１８により導入
され、エアー噴出し孔１６，１７を通ってセンサヘッド
１２ｂ，１３ｂの開口部から噴出するようになってい
る。The sensor heads 12b and 13b have a structure as shown in FIG.
Since 3c is disposed around, there is no problem due to the air ejection holes 16 and 17 being open at the center. An air pipe 18 for introducing cooling air from the outside is provided on the rear side of the air ejection holes 16 and 17. Cooling air is introduced through the air pipe 18 and is blown out from the openings of the sensor heads 12b and 13b through the air blowing holes 16 and 17.
【００１４】上述した第１の実施形態では、冷却用のエ
アーは、上記エアー配管１８により導入され、エアー噴
出し孔１６，１７を通ってセンサヘッド１２ｂ，１３ｂ
の開口部から噴出し、前面の断熱板２０に遮られ、四方
八方に分散される。このため、最も高温になるセンサ表
面にもエアーが行き渡り、センサ全体が効率よく冷却さ
れる。In the first embodiment described above, cooling air is introduced through the air pipe 18 and passes through the air ejection holes 16 and 17 to form the sensor heads 12b and 13b.
And is blocked by the heat insulating plate 20 on the front side and dispersed in all directions. For this reason, air also spreads over the sensor surface where the temperature becomes the highest, and the entire sensor is efficiently cooled.
【００１５】Ｂ．第２の実施形態 次に、本発明の第２の実施形態について説明する。図５
は、本発明の第２の実施形態による制振装置の内部構造
を示す上面図である。また、図６および図７は、本第２
の実施形態による制振装置の内部構造を示す側面図であ
る。なお、図１ないし図３に対応する部分には同一の符
号を付けて説明を省略する。図において、センサヘッド
１２ｂ，１３ｂの周りには、電磁石１４，１５からの発
熱を遮断するための断熱板３０，３１が設けられてい
る。B. Second Embodiment Next, a second embodiment of the present invention will be described. FIG.
FIG. 5 is a top view illustrating an internal structure of a vibration damping device according to a second embodiment of the present invention. 6 and 7 show the second embodiment.
It is a side view which shows the internal structure of the vibration damping device by embodiment. 1 to 3 are denoted by the same reference numerals, and description thereof is omitted. In the figure, heat insulating plates 30 and 31 for blocking heat generation from the electromagnets 14 and 15 are provided around the sensor heads 12b and 13b.
【００１６】上述した第２の実施形態では、センサヘッ
ド１２ｂ，１３ｂの周りに設けた断熱板３０，３１によ
って電磁石１４，１５からの発熱を遮断した状態で、エ
アー噴出し孔１６，１７を通ったエアーを、センサヘッ
ド１２ｂ，１３ｂの開口部から噴出させ、センサ全体を
冷却する。これにより、より効率的にセンサ全体が冷却
される。In the second embodiment described above, the heat from the electromagnets 14 and 15 is cut off by the heat insulating plates 30 and 31 provided around the sensor heads 12b and 13b, and the air passes through the air ejection holes 16 and 17. The blown air is blown out from the openings of the sensor heads 12b and 13b to cool the entire sensor. Thereby, the whole sensor is cooled more efficiently.
【００１７】Ｃ．第３の実施形態 次に、本発明の第３の実施形態について説明する。図８
は、本発明の第３の実施形態による制振装置の内部構造
を示す側面図である。なお、図８においては、一方のセ
ンサヘッド１２側の構造のみを示しているが、センサヘ
ッド１３側の構造も同様である。また、図５ないし図７
に対応する部分には同一の符号を付けて説明を省略す
る。図において、センサ本体には、センサヘッド１２ｂ
の外側面にも冷却用のエアーを噴出させるべく、センサ
ヘッド１２ｂの外側面に達するエアー噴出し孔４０ａ，
４０ｂが形成されている。また、センサヘッド１２ｂと
電磁石１４との間にも冷却用のエアーを噴出させるべ
く、センサ１２と電磁石１４との間に達するエアー噴出
し孔４１ａ，４１ｂが形成されている。C. Third Embodiment Next, a third embodiment of the present invention will be described. FIG.
FIG. 7 is a side view showing an internal structure of a vibration damping device according to a third embodiment of the present invention. Although FIG. 8 shows only the structure on one sensor head 12 side, the same applies to the structure on the sensor head 13 side. 5 to FIG.
The same reference numerals are given to the portions corresponding to and description thereof is omitted. In the figure, a sensor body has a sensor head 12b.
The air ejection holes 40a, 40a, which reach the outer surface of the sensor head 12b, in order to eject cooling air also to the outer surface of the sensor head 12b.
40b are formed. Air ejection holes 41a and 41b are formed between the sensor 12 and the electromagnet 14 so as to eject air for cooling also between the sensor head 12b and the electromagnet 14.
【００１８】本第３の実施形態では、センサヘッド１２
ｂの開口部からエアーを噴出させてセンサヘッド１２ｂ
の表面および断熱板２０の冷却に加えて、センサヘッド
１２ｂの外側面にエアーを噴出させ、センサヘッド１２
ｂの外側面を冷却するとともに、センサ１２と電磁石１
４との間にエアーを噴出させ、電磁石１４からの発熱を
冷却する。これにより、より効率的にセンサ全体が冷却
される。In the third embodiment, the sensor head 12
b to blow out air from the opening of the sensor head 12b.
In addition to cooling the surface of the sensor head 12 and the heat insulating plate 20, air is blown to the outer surface of the sensor head 12b,
b, the sensor 12 and the electromagnet 1
Air is ejected between the electromagnets 14 to cool the heat generated from the electromagnets 14. Thereby, the whole sensor is cooled more efficiently.
【００１９】上述した第１ないし第３の実施形態によれ
ば、センサヘッドの中心に孔を設け、該孔にエアーを通
すことによって、エアーが滞りやすいセンサ前面部にも
エアーが行き渡り、センサヘッド全体を冷却することが
できる。このため、耐熱温度の低いセンサでも高温雰囲
気中で使用することができる。又、第１ないし第３の実
施形態は、片側だけ電磁石を設けた場合を説明したが、
鋼板を挟んで対向して複数配置する場合にも適用され
る。According to the above-described first to third embodiments, the hole is provided at the center of the sensor head, and the air is passed through the hole, so that the air also spreads to the front surface of the sensor where air tends to stagnate. The whole can be cooled. Therefore, even a sensor having a low heat-resistant temperature can be used in a high-temperature atmosphere. In the first to third embodiments, the case where the electromagnet is provided on only one side has been described.
The present invention is also applied to a case where a plurality of steel plates are arranged to face each other with a steel plate interposed therebetween.
【００２０】[0020]
【発明の効果】以上説明したように、本発明によれば、
非接触式で前記鋼板までの距離を検出する位置検出器の
略中心に冷却用空気を通す第１の貫通孔を形成し、該第
１の貫通孔に前記冷却用空気を通し、前記位置検出器の
前面部の開口部より噴出させて、位置検出器の前面にも
冷却用空気を行き渡らせ、位置検出器全体を冷却するよ
うにしたので、センサ全体を効率よく冷却することがで
きるという利点が得られる。As described above, according to the present invention,
A first through-hole through which cooling air passes is formed substantially at the center of a position detector for detecting the distance to the steel plate in a non-contact manner, and the cooling air is passed through the first through-hole to detect the position. Since the cooling air is distributed to the front of the position detector by squirting it from the opening in the front part of the detector, and the entire position detector is cooled, the whole sensor can be cooled efficiently. Is obtained.
【図１】 本発明の第１の実施形態による制振装置の内
部構造を示す上面図である。FIG. 1 is a top view showing an internal structure of a vibration damping device according to a first embodiment of the present invention.
【図２】 本第１の実施形態による制振装置の内部構造
を示す側面図である。FIG. 2 is a side view showing the internal structure of the vibration damping device according to the first embodiment.
【図３】 本第１の実施形態による制振装置の内部構造
を示す側面図である。FIG. 3 is a side view showing the internal structure of the vibration damping device according to the first embodiment.
【図４】 センサヘッドの略構造を示す側面図である。FIG. 4 is a side view showing a schematic structure of a sensor head.
【図５】 本発明の第２の実施形態による制振装置の内
部構造を示す上面図である。FIG. 5 is a top view showing an internal structure of a vibration damping device according to a second embodiment of the present invention.
【図６】 本第２の実施形態による制振装置の内部構造
を示す側面図である。FIG. 6 is a side view showing the internal structure of the vibration damping device according to the second embodiment.
【図７】 本第２の実施形態による制振装置の内部構造
を示す側面図である。FIG. 7 is a side view showing the internal structure of the vibration damping device according to the second embodiment.
【図８】 本発明の第３の実施形態による制振装置の内
部構造を示す側面図である。FIG. 8 is a side view showing an internal structure of a vibration damping device according to a third embodiment of the present invention.
【図９】 従来技術による制振装置の構造を示す側面図
である。FIG. 9 is a side view showing a structure of a vibration damping device according to a conventional technique.
【図１０】 従来技術による電磁石およびセンサを対向
配置した構成例を示す図である。FIG. 10 is a diagram showing a configuration example in which an electromagnet and a sensor according to the related art are arranged to face each other.
１２，１３ センサ（位置検出器） １２ａ，１３ａ センサ取付台 １２ｂ，１３ｂ センサヘッド １４，１５ 電磁石 １６，１７ エアー噴出し孔（第１の貫通孔） １８ エアー配管 ２０ 断熱板 ３０，３１ 断熱板 ４０ａ，４０ｂ エアー噴出し孔（第２の貫通孔） ４１ａ，４１ｂ エアー噴出し孔（第３の貫通孔） 12, 13 Sensor (position detector) 12a, 13a Sensor mounting base 12b, 13b Sensor head 14, 15 Electromagnet 16, 17 Air ejection hole (first through hole) 18 Air pipe 20 Insulation plate 30, 31 Insulation plate 40a , 40b Air ejection hole (second through hole) 41a, 41b Air ejection hole (third through hole)
Claims (10)
隔を空けて配置される電磁石と、 非接触式で前記鋼板までの距離を検出する位置検出器と
を具備し、 前記位置検出器の略中心に冷却用空気を通す第１の貫通
孔が形成されていることを特徴とする制振装置。1. An electromagnet arranged at a predetermined distance from a running surface of a running steel plate, and a position detector for detecting a distance to the steel plate in a non-contact manner, wherein the position detector A first through hole through which cooling air passes is formed substantially at the center of the vibration damping device.
置された断熱板を具備することを特徴とする請求項１記
載の制振装置。2. The vibration damping device according to claim 1, further comprising a heat insulating plate disposed between said electromagnet and said position detector.
記冷却用空気を噴出させる第２の貫通孔が形成されてい
ることを特徴とする請求項２記載の制振装置。3. The vibration damping device according to claim 2, wherein a second through hole for ejecting the cooling air is formed between the position detector and the heat insulating plate.
却用空気を噴出させる第３の貫通孔が形成されているこ
とを特徴とする請求項２または３記載の制振装置。4. The vibration damping device according to claim 2, wherein a third through-hole for ejecting the cooling air is formed between the electromagnet and the heat insulating plate.
隔を空けて配置される電磁石と、非接触式で前記鋼板ま
での距離を検出する位置検出器とを具備する制振装置を
冷却用空気により冷却する制振装置の冷却方法におい
て、 前記位置検出器の略中心に形成された第１の貫通孔に前
記冷却用空気を通し、前記位置検出器の前面部の開口部
より噴出させることを特徴とする制振装置の冷却方法。5. A vibration damping device comprising an electromagnet arranged at a predetermined distance from a running surface of a running steel plate and a position detector for detecting a distance to the steel plate in a non-contact manner. In the method for cooling a vibration damper that cools with a cooling air, the cooling air is passed through a first through hole formed substantially at the center of the position detector, and is ejected from an opening in a front portion of the position detector. A method for cooling a vibration damping device, comprising:
熱板を配置することを特徴とする請求項５記載の制振装
置の冷却方法。6. The method according to claim 5, wherein a heat insulating plate is disposed between the electromagnet and the position detector.
口部が位置するように形成された第２の貫通孔に前記冷
却用空気を通し、前記位置検出器と前記断熱板との間に
噴出させることを特徴とする請求項６記載の制振装置の
冷却方法。7. The cooling air is passed through a second through hole formed such that an opening is located between the position detector and the heat insulating plate, and the second through hole is formed between the position detector and the heat insulating plate. The method for cooling a vibration damping device according to claim 6, wherein the fuel is ejected in between.
が位置するように形成された第３の貫通孔に前記冷却用
空気を通し、前記電磁石と前記断熱板との間に噴出させ
ることを特徴とする請求項６または７記載の制振装置の
冷却方法。8. The cooling air is passed through a third through hole formed so that an opening is located between the electromagnet and the heat insulating plate, and is ejected between the electromagnet and the heat insulating plate. The method for cooling a vibration damping device according to claim 6 or 7, wherein:
に配置することを特徴とする請求項１ないし４の何れか
に記載の制振装置。9. The vibration damping device according to claim 1, wherein the electromagnets are arranged so as to face each other with a steel plate interposed therebetween.
うに配置することを特徴とする請求項５ないし８の何れ
かに記載の制振装置の冷却方法。10. The method for cooling a vibration damping device according to claim 5, wherein the electromagnets are arranged to face each other with a steel plate interposed therebetween.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001007043A JP4665313B2 (en) | 2001-01-15 | 2001-01-15 | Damping device and cooling method for damping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001007043A JP4665313B2 (en) | 2001-01-15 | 2001-01-15 | Damping device and cooling method for damping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002212695A true JP2002212695A (en) | 2002-07-31 |
| JP4665313B2 JP4665313B2 (en) | 2011-04-06 |
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|---|---|---|---|
| JP2001007043A Expired - Fee Related JP4665313B2 (en) | 2001-01-15 | 2001-01-15 | Damping device and cooling method for damping device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012001795A (en) * | 2010-06-21 | 2012-01-05 | Mitsubishi-Hitachi Metals Machinery Inc | Electromagnetic damping device for hot dip metal plating equipment |
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| JPH01319662A (en) * | 1988-06-20 | 1989-12-25 | Hitachi Ltd | Method and apparatus for continuous hot dipping |
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| JP2012001795A (en) * | 2010-06-21 | 2012-01-05 | Mitsubishi-Hitachi Metals Machinery Inc | Electromagnetic damping device for hot dip metal plating equipment |
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| Publication number | Publication date |
|---|---|
| JP4665313B2 (en) | 2011-04-06 |
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