|
JP2006142335A
(en)
*
|
2004-11-19 |
2006-06-08 |
National Institute Of Advanced Industrial & Technology |
Laser beam machining device
|
|
JP4630971B2
(en)
*
|
2004-12-21 |
2011-02-09 |
並木精密宝石株式会社 |
Microstructure formation method using pulsed laser
|
|
JP2006303360A
(en)
*
|
2005-04-25 |
2006-11-02 |
Fujikura Ltd |
Through-wire board, composite board, and electronic apparatus
|
|
US8307672B2
(en)
|
2005-11-22 |
2012-11-13 |
Olympus Corporation |
Glass substrate processing method and glass component
|
|
JP4402708B2
(en)
*
|
2007-08-03 |
2010-01-20 |
浜松ホトニクス株式会社 |
Laser processing method, laser processing apparatus and manufacturing method thereof
|
|
JP5478009B2
(en)
|
2007-11-09 |
2014-04-23 |
株式会社フジクラ |
Manufacturing method of semiconductor package
|
|
CN103025474B
(en)
|
2010-07-26 |
2015-04-01 |
浜松光子学株式会社 |
Laser processing method
|
|
JP5693074B2
(en)
|
2010-07-26 |
2015-04-01 |
浜松ホトニクス株式会社 |
Laser processing method
|
|
WO2012014723A1
(en)
|
2010-07-26 |
2012-02-02 |
浜松ホトニクス株式会社 |
Method for manufacturing light-absorbing substrate and method for manufacturing die for manufacturing light-absorbing substrate
|
|
JP5509332B2
(en)
|
2010-07-26 |
2014-06-04 |
浜松ホトニクス株式会社 |
Manufacturing method of interposer
|
|
WO2012014724A1
(en)
|
2010-07-26 |
2012-02-02 |
浜松ホトニクス株式会社 |
Substrate processing method
|
|
JP5574866B2
(en)
|
2010-07-26 |
2014-08-20 |
浜松ホトニクス株式会社 |
Laser processing method
|
|
US8591753B2
(en)
|
2010-07-26 |
2013-11-26 |
Hamamatsu Photonics K.K. |
Laser processing method
|
|
JP5653110B2
(en)
|
2010-07-26 |
2015-01-14 |
浜松ホトニクス株式会社 |
Chip manufacturing method
|
|
KR102000031B1
(en)
|
2010-07-26 |
2019-07-15 |
하마마츠 포토닉스 가부시키가이샤 |
Laser processing method
|
|
JP5702556B2
(en)
|
2010-07-26 |
2015-04-15 |
浜松ホトニクス株式会社 |
Laser processing method
|
|
US8828873B2
(en)
|
2010-07-26 |
2014-09-09 |
Hamamatsu Photonics K.K. |
Method for manufacturing semiconductor device
|
|
EP2599582B1
(en)
|
2010-07-26 |
2020-03-25 |
Hamamatsu Photonics K.K. |
Substrate processing method
|
|
JP2011066449A
(en)
*
|
2010-12-20 |
2011-03-31 |
Fujikura Ltd |
Method for manufacturing passing wiring substrate, method for manufacturing complex substrate, and method for manufacturing electronic device using passing wiring substrate and complex substrate formed by those manufacturing methods
|
|
JPWO2012160880A1
(en)
*
|
2011-05-23 |
2014-07-31 |
並木精密宝石株式会社 |
LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE
|
|
CN103212822B
(en)
*
|
2012-01-19 |
2016-07-06 |
昆山思拓机器有限公司 |
The cutting of full-automatic SMT template and detection integral system cut and detection method
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
EP2754524B1
(en)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line
|
|
CN103111762B
(en)
*
|
2013-01-29 |
2015-12-09 |
无锡鼎晶光电科技有限公司 |
A kind of method laser boring being applied to sapphire sheet punching
|
|
EP2781296B1
(en)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Device and method for cutting out contours from flat substrates using a laser
|
|
JP6157245B2
(en)
*
|
2013-07-01 |
2017-07-05 |
三菱電機株式会社 |
Laser processing apparatus and laser optical axis adjustment method
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US9517963B2
(en)
*
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
JP2015150609A
(en)
|
2014-02-18 |
2015-08-24 |
アイシン精機株式会社 |
laser processing method
|
|
WO2016007572A1
(en)
|
2014-07-08 |
2016-01-14 |
Corning Incorporated |
Methods and apparatuses for laser processing materials
|
|
CN208586209U
(en)
|
2014-07-14 |
2019-03-08 |
康宁股份有限公司 |
A kind of system for forming multiple defects of restriction profile in workpiece
|
|
CN107073641B
(en)
|
2014-07-14 |
2020-11-10 |
康宁股份有限公司 |
An interface block; system and method for cutting substrates transparent in the wavelength range using such an interface block
|
|
LT3169477T
(en)
|
2014-07-14 |
2020-05-25 |
Corning Incorporated |
System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
|
|
EP3169479B1
(en)
|
2014-07-14 |
2019-10-02 |
Corning Incorporated |
Method of and system for arresting incident crack propagation in a transparent material
|
|
MY196621A
(en)
|
2014-09-16 |
2023-04-23 |
Lpkf Laser & Electronics Ag |
Method for Introducing at Least One Cutout or Aperture Into a Sheetlike Workpiece
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
EP3708548A1
(en)
|
2015-01-12 |
2020-09-16 |
Corning Incorporated |
Laser cutting of thermally tempered substrates using the multiphoton absorption method
|
|
WO2016154284A1
(en)
|
2015-03-24 |
2016-09-29 |
Corning Incorporated |
Laser cutting and processing of display glass compositions
|
|
WO2016160391A1
(en)
|
2015-03-27 |
2016-10-06 |
Corning Incorporated |
Gas permeable window and method of fabricating the same
|
|
US11186060B2
(en)
|
2015-07-10 |
2021-11-30 |
Corning Incorporated |
Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
|
|
CN109311725B
(en)
|
2016-05-06 |
2022-04-26 |
康宁股份有限公司 |
Laser cutting and removing profile shapes from transparent substrates
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
EP3490945B1
(en)
|
2016-07-29 |
2020-10-14 |
Corning Incorporated |
Methods for laser processing
|
|
US10522963B2
(en)
|
2016-08-30 |
2019-12-31 |
Corning Incorporated |
Laser cutting of materials with intensity mapping optical system
|
|
WO2018064409A1
(en)
*
|
2016-09-30 |
2018-04-05 |
Corning Incorporated |
Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
|
|
NL2017998B1
(en)
*
|
2016-12-14 |
2018-06-26 |
Corning Inc |
Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
|
|
EP3311947B1
(en)
*
|
2016-09-30 |
2019-11-20 |
Corning Incorporated |
Methods for laser processing transparent workpieces using non-axisymmetric beam spots
|
|
EP3848333A1
(en)
|
2016-10-24 |
2021-07-14 |
Corning Incorporated |
Substrate processing station for laser-based machining of sheet-like glass substrates
|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US11078112B2
(en)
*
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
|
JP7230650B2
(en)
|
2019-04-05 |
2023-03-01 |
Tdk株式会社 |
Inorganic material substrate processing method, device, and device manufacturing method
|