JP2002208799A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reliable electronic component mounting device that can achieve mounting onto the board of electronic components in various shapes at low costs. SOLUTION: A tip section 28 comprises base 44 where a middle port 42 for communicating with a negative pressure supply port 24 is formed, and adaptors 46, 48, and 50 that are detachably and selectively fitted to the base 44. A suction port 26 consists of the adaptors 46, 48, and 50 so that the suction port 26 communicates with the middle port 42. At the same time, the adaptors 46, 48, and 50 have an electronic component suction nozzle 12 where the suction port 26 having a mutually different shape is formed in the electronic component mounting device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art Conventionally, an electronic component mounting apparatus has a tip for vacuum-suctioning electronic components in order to mount electronic components of various sizes supplied by an electronic component supply device such as a tape feeder at predetermined positions on a substrate. A plurality of types of electronic component suction nozzles having different shapes, a vertical Z-axis slide shaft that supports the electronic component suction nozzle, and a movable Z-axis direction of the slide shaft, and around a θ axis that is a central axis. A head unit rotatably supporting the head unit, an XY drive unit supporting the head unit so as to be movable in the XY axis directions, and an image recognition device.

[0003] The electronic component suction nozzle is driven by the head unit and descends in the Z-axis direction when the electronic component on the electronic component supply device is vacuum-sucked and when the electronic component is mounted on the substrate. The component is sandwiched between an electronic component supply device and a substrate, and is reliably vacuum-sucked or mounted on the substrate.

The image recognition device detects a suction error of the electronic component with respect to the electronic component suction nozzle between the electronic component supply device and the board (an error from a normal suction posture in design), and detects the detected suction error. After the correction, the electronic component is mounted at a predetermined position on the substrate.

As shown in FIG. 7, an electronic component suction nozzle 100 generally includes a nozzle slider 102 having a pipe-shaped shaft portion 102a and a tip portion 102b provided near the tip of the shaft portion 102a. Nozzle slider 1
Nozzle 104 for supporting Z02 slidably in the Z axis direction
, The pin 106 and the nozzle slider 102 with the tip 10
And a buffer spring 108 for urging in the direction of 2b.

The nozzle slider 102 is normally biased by the buffer spring 108 and held at the lower limit position, and when the electronic component is sandwiched between the electronic component supply device and the substrate, the nozzle slider 102 resists the biasing force of the buffer spring 108. By retracting, the electronic component is prevented from being damaged.

The nozzle slider 102 has a shaft 102a.
Has an elongate hole 102c in the Z-axis direction in the cylindrical wall thereof.
02c, which is loosely fitted to the nozzle holder 104 and is screwed to the nozzle holder 104.
6, the guide is guided in the Z-axis direction during retraction, and cannot be rotated relative to the nozzle holder 104.

In recent years, it has been required to mount electronic components with higher precision in order to make electronic components more precise. For example, the nozzle slider 102 has been used to detect an adsorption error by an image recognition device and to improve the accuracy of the correction. It is necessary to keep the play between the nozzle holder 104 and the pin 106 as small as possible.

On the other hand, in order to reliably prevent damage to the electronic components, the nozzle slider 102 must slide smoothly with respect to the nozzle holder 104.
A certain play must be ensured between the nozzle holder 02 and the nozzle holder 104 and the pin 106.

Therefore, the shaft portion 1 of the nozzle slider 102
The outer peripheral surface 02a, the long hole 102c, and the like are finished with high precision.

Further, the tip portion 102 of the nozzle slider 102
A suction port 102d that opens downward is formed in b.

As the suction port 102d is larger, the suction force for sucking the electronic component 110 is higher, but the suction port 102d is larger.
If the spills out from the upper surface of the electronic component 110, the negative pressure leaks and the suction force decreases.

Therefore, it is desirable to use an electronic component suction nozzle having a suction port that is slightly smaller than the upper surface of the electronic component to be vacuum-sucked. However, a different electronic component suction nozzle is selectively supported on a slide shaft to mount an electronic component.

When a new electronic component which cannot be vacuum-sucked by the existing electronic-component suction nozzle is mounted on a substrate, the electronic component has a new suction port shape corresponding to the electronic component. I was making a nozzle.

[0015]

However, the production cost of the electronic component suction nozzle is high because high precision finishing is required, and the production of a new electronic component suction nozzle increases the equipment cost of the electronic component mounting apparatus. I was letting it.

In particular, when a newly manufactured electronic component suction nozzle is used only for mounting a special electronic component and the number of substrates on which the electronic component is mounted is small, a great problem arises in terms of depreciation. I was

Even if only a nozzle slider having a suction port is newly manufactured and assembled to an existing electronic component suction nozzle, the nozzle slider itself requires high-precision finishing and the manufacturing cost is reduced. As a result, the equipment cost of the electronic component mounting apparatus cannot be sufficiently reduced.

On the other hand, if the finishing accuracy of the nozzle slider is reduced, the manufacturing cost of the electronic component suction nozzle can be reduced. And lowers the reliability of the electronic component mounting apparatus.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and can realize mounting electronic components of various shapes on a substrate at low cost and having high reliability. An object is to provide a mounting device.

[0020]

According to the present invention, a contact surface of a distal end portion of a cylindrical body having a suction port communicating with a negative pressure supply port on a base end side is formed. An electronic component mounting apparatus comprising: an electronic component suction nozzle capable of vacuum-sucking the electronic component by a negative pressure supplied from the negative pressure supply port while being in contact with the electronic component, and mounting the electronic component on a substrate. , The tip of the electronic component suction nozzle includes a base formed with an intermediate port communicating with the negative pressure supply port, and a plurality of adapters detachably attached to the base and selectively mounted. The suction port is formed by each of the adapters so as to communicate with the intermediate port,
The adapter achieves the above object by forming the suction ports having different shapes from each other.

In addition, a side wall protruding from the base end side toward the front end to the contact surface and capable of forming the suction port together with the adapter is provided at a base of the front end of the electronic component suction nozzle. Is also good.

Further, in the present invention, the contact surface of the distal end portion of the cylindrical body, which is formed with the suction port communicating with the negative pressure supply port on the base end side, contacts the electronic component. An electronic component suction nozzle capable of vacuum-sucking the electronic component by a negative pressure supplied from the negative pressure supply port, wherein the electronic component mounting apparatus mounts the electronic component on a substrate. Is formed by a plurality of fine holes communicating with the negative pressure supply port and opening to the contact surface, is removably mounted in the fine hole, and closes the fine hole to form the suction port. The above object is achieved by providing one or more closing members whose shape can be changed.

According to the present invention, electronic components having various shapes can be mounted on a substrate at low cost.

[0024]

Next, an embodiment of the present invention will be described in detail with reference to the drawings.

The electronic component mounting apparatus 10 according to the embodiment of the present invention is characterized by the structure of the electronic component suction nozzle 12 shown in FIGS.

An outline of the overall structure of the electronic component mounting apparatus 10 is as follows. The electronic component mounting apparatus 10 has a vertical cylindrical slide shaft 14 in the Z-axis direction, and the slide shaft 14 is movable in the Z-axis direction. , The central axis θ
The head unit 16 includes a head unit 16 that supports the head unit 16 so as to be rotatable around an axis, an XY drive unit 18 that supports the head unit 16 so as to be movable in the X and Y axes, and an image recognition device 20.

Hereinafter, the structure of the electronic component suction nozzle 12 will be described. Since the structure of the other parts of the electronic component mounting apparatus 10 is the same as that of the related art, the description is omitted.

The electronic component suction nozzle 12 is a cylindrical body.
The suction port 2 is detachably supported near the lower end of the slide shaft 14 and communicates with the negative pressure supply port 24 on the base end 22 side.
The contact surface 28a of the tip portion 28 on which the
The electronic component 30 can be vacuum-sucked by the negative pressure supplied from the negative pressure supply port 24 through the slide shaft 14 while being in contact with the upper surface of the electronic component supply device 32 and the electronic component supply device 32 and the substrate 34. It is free to move between.

The electronic component suction nozzle 12 includes a nozzle slider 36 including the tip 28, a nozzle holder 38, a pin 40, and a buffer spring 41.

The nozzle slider 36 comprises a pipe-shaped shaft portion 36a and the substantially disk-shaped tip portion 28 provided coaxially near the lower end of the shaft portion 36a.
An elongated hole 36b in the Z-axis direction is formed near the upper end of the cylindrical side wall of the shaft portion 36a.

The distal end portion 28 includes a base 44 having an intermediate port 42 formed in communication with the negative pressure supply port 24, and three sets (plurality) of three sets which are detachably and selectively attached to the base 44. The suction port 26 is formed by each of the adapters 46, 48 and 50 so as to communicate with the intermediate port 42.

The base portion 44 is formed integrally with a ring plate-like body portion 44a integrally formed at the lower end of the shaft portion 36a, and is further formed integrally with the outer peripheral portion of the ring plate-like body portion 44a. The contact surface 28 in the direction of the tip 28 from the side
a, a thin cylindrical side wall 44 capable of forming the suction port 26 together with the adapters 46, 48 and 50.
b.

The intermediate opening 42 is formed as a lower end of a center hole of the ring-shaped body portion 44a communicating with a center hole of the shaft portion 36a.

In the vicinity of the outer peripheral portion of the base portion 44, two screw holes 44c in the Z-axis direction are formed symmetrically with respect to the center axis.

The adapter 46 is a pair of half-moon key-shaped members smaller than a semicircle. The adapter 46 abuts on the inner peripheral surface of the side wall 44b of the base 44 at the cylindrical side surface 46a, and is equal to the length of the side wall 44b in the Z-axis direction. It has a thickness in the Z-axis direction.

The adapter 46 has a stepped hole 46b in the Z-axis direction in which the lower step hole is larger than the upper step hole, passes through the stepped hole 46b, and is screwed into the screw hole 44c of the base 44. The screw 52 is adapted to be detachable from the base 44.

The outer diameter of the head 52a and the outer diameter of the shaft 52b of the screw 52 are the lower hole of the stepped hole 46b of the adapter 46, respectively.
The head 52a is made slightly smaller than the inner diameter of the upper hole.
Is embedded in the lower hole of the stepped hole 46b, and is drawn in above the contact surface 28a.

The adapter 46 is attached to the base 44 at a distance from the intermediate port 42, and a pair of flat side surfaces 46c of the adapter 46 are opposed to each other below the intermediate port 42. .

The pair of flat side surfaces 46c and the base 44
The lower end of the inner peripheral surface of the side wall 44b forms the suction port 26, and the suction port 26 communicates with the intermediate port 42.

The adapter 48 is also a pair of half-moon key-shaped members having an arc having the same curvature as the adapter 46. 48a are arranged so as to be spaced apart from and opposed to the pair of flat side surfaces 46c of the adapter 46 so as to form the suction port 26 larger than the adapter 46.

The adapter 50 is a ring-shaped plate. The adapter 50 is loosely fitted to the inner peripheral surface of the side wall 44b of the base 44 at the outer peripheral portion 50a, and has a thickness in the Z-axis direction equal to the length of the side wall 44b in the Z-axis direction. The lower end of the center hole 50b is
Is formed.

That is, the adapters 46, 48 and 50 are formed so as to form suction ports 26 having different shapes.

Each of the adapters 48 and 50 also has a stepped hole 48 having the same shape as the stepped hole 46b of the adapter 46.
b and 50c, which are detachably attached to the base 44 by the screws 52 passing through the stepped holes 48b and 50c.

The nozzle holder 38 is a cylindrical body, which is loosely fitted to the shaft portion 36a of the nozzle slider 36 at the center hole 38a, and is detachably attached to the lower end of the slide shaft 14 at the nipple-shaped upper half outer peripheral portion 38b. ing.

The upper end of the nozzle holder 38 forms the base end 22 of the electronic component suction nozzle 12, and the center hole 38a
Constitutes the negative pressure supply port 24.

The nozzle holder 38 has a screw hole 38c at a substantially central position in the Z-axis direction, which penetrates horizontally from the outer peripheral portion to the center hole 38a. The pin 40 is screwed into the screw hole 38c. are doing.

The pin 40 has a shape in which a cylindrical projection 40b protrudes coaxially from one end in the axial direction of the male screw portion 40a.
6 are loosely fitted in the long holes 36b.

As a result, the nozzle slider 36 is slidable with respect to the nozzle holder 38 within a certain range in the Z-axis direction, and is not rotatable around the θ-axis.

The outer peripheral surface of the shaft portion 36a of the nozzle slider 36 has a long hole so that the nozzle slider 36 slides smoothly with respect to the nozzle holder 38 and no negative pressure leaks from the sliding portion. 36b, a central hole 38a of the nozzle holder 38 and a cylindrical projection 4 of the pin 40
0b is finished with high precision.

The cushioning spring 41 is a compression coil spring disposed so as to surround the shaft portion 36a of the nozzle slider 36. The compression spring 41 abuts on the lower end of the nozzle holder 38 at the upper end, and is connected to the upper end of the tip portion 28 at the lower end. Abut,
It is mounted more compressed than its natural length.

As a result, the nozzle slider 36 is urged downward, and is normally held at the lower limit position.

Next, the operation of the electronic component mounting apparatus 10 will be described.

When the electronic component is mounted on the substrate 34 by the electronic component mounting apparatus 10, the shape of the suction port 26 of the electronic component suction nozzle 12 is adjusted to a shape suitable for the electronic component to be mounted. Do it.

Adjustment of the shape of the suction port is performed by using the adapter 4
6, 48, and 50 are selectively attached to and detached from the base portion 44 of the distal end portion 28.

Here, the shape of the suction port suitable for the electronic component to be mounted is defined by the tip 28 of the electronic component suction nozzle 12.
When the contact surface 28a contacts the upper surface of the electronic component to be mounted, the contact hole 28a does not protrude from the upper surface of the electronic component and is as large as possible.

That is, even if the electronic component and the electronic component suction nozzle have a shape close to the shape of the upper surface of the electronic component to be mounted and the electronic component and the electronic component suction nozzle are slightly misaligned, the electronic component does not protrude outward from the upper surface of the electronic component. The shape of the suction port, which is slightly smaller than the top surface shape of the electronic component and does not leak negative pressure, is the shape of the suction port suitable for the electronic component to be mounted.

For example, when mounting an electronic component having a square top surface, the adapter 46 or 48 is mounted. When mounting an electronic component having a round top surface, the adapter 5 is mounted.
0 is the base 4 of the tip 28 of the electronic component suction nozzle 12.
4 to selectively mount electronic components.

If the shape of the suction port suitable for the electronic component to be mounted cannot be obtained with these adapters 46, 48 and 50, a new adapter is manufactured and the tip portion 28 of the electronic component suction nozzle 12 is formed. The electronic component is mounted by mounting the electronic component on the base 44.

As described above, the adapters 46, 48 and 5 which can be manufactured in a simple shape at a relatively low cost.
By selectively attaching and detaching 0 and the like to and from the base portion 44 of the distal end portion 28, the shape of the suction port 26 can be easily adjusted at low cost.

Accordingly, the electronic component mounting apparatus 10 has a lower equipment cost than the conventional electronic component mounting apparatus in which the manufacturing cost is high for the nozzle slider or the entire electronic component suction nozzle for each suction port shape. It is suppressed.

In particular, when a special electronic component suction nozzle having a new suction port shape is required to mount a special electronic component, and the production volume of the substrate on which the special electronic component is mounted is small, depreciation costs are reduced. The effect of keeping it low is great.

Further, since the side wall 44b is formed on the base portion 44 of the distal end portion 28, it is possible to easily form a suction port shape suitable for an electronic component having a square top surface.

That is, although square hole processing is more difficult than round hole processing, a suction port having a shape close to a quadrangle is formed by an adapter having a simple shape such as the adapters 46 and 48 and the side wall 44b. This is easier than, for example, forming a square hole in the adapter 50 instead of a round hole.

As described above, the electronic component suction nozzle 1 in which the suction port 26 having a shape suitable for the electronic component to be mounted is formed.
When a negative pressure is supplied from the negative pressure supply port 24 via the slide shaft 14 while the contact surface 28a of the second end portion 28 is in contact with the upper surface of the electronic component 30, the electronic component 30 has a large suction force. Vacuum suction makes the suction posture stable.

Further, as in the prior art, the nozzle slider 3
6 and the like are finished with high precision.
The play between the electronic component 30 and the nozzle holder 38 is very small.

Thus, the suction error (positional deviation between the normal suction posture and the actual suction posture) by the image recognition device 20 is measured, and the electronic component 30 is mounted on the substrate 34 with the suction error corrected. Is done exactly.

Also, as in the prior art, the nozzle slider 36
And the like are processed with high precision. When the electronic components are vacuum-sucked in the electronic component supply device 32 or when the electronic components are mounted on the board 34, the nozzle slider 36
Since the electronic component is sandwiched between the electronic component supply device 32 and the substrate 34 while being smoothly slid and retracted against the biasing force of 1, the electronic component is not damaged.

That is, the electronic component mounting apparatus 10 can mount electronic components of various shapes on a substrate at low cost, and mount electronic components with high reliability as in the related art. be able to.

In the embodiment of the present invention, the side wall 44b is formed at the base 44 of the tip 28 of the electronic component suction nozzle 12, but the present invention is not limited to this. For example, like the adapter 50,
When the suction port can be formed only with the adapter, the side wall 44b may not be provided, and the base may include only the ring plate-shaped body 44a.

In the embodiment of the present invention, the adapters 46, 48 and 50 are constituted by one or two members. However, the present invention is not limited to this. Adapter.

Further, in the example of the present embodiment, the outer circumferences of the base portion 44 and the adapters 46, 48, and 50 are circular or arc-shaped, but the present invention is not limited to this. The base and the adapter may have another outer peripheral shape.

Next, a second embodiment of the present invention will be described.

The electronic component mounting apparatus according to the second embodiment of the present embodiment is different from the electronic component mounting apparatus 10 according to the first embodiment of the present invention in that the distal end portion 28 of the electronic component suction nozzle 12 has They differ in structure.

Since the other structure is the same as that of the electronic component mounting apparatus 10, the same reference numerals as those in the first embodiment of the present embodiment denote the same parts, and a description thereof will not be repeated.

As shown in FIGS. 5 and 6, in the electronic component suction nozzle 60 according to the second example of the present embodiment, the suction port 64 of the distal end portion 62 is communicated with the negative pressure supply port 24 to be in contact with. A plurality of fine holes 66 are formed in the contact surface 62a and are removably mounted in the fine holes 66, and the shapes of the suction ports 64 can be changed by closing the fine holes 66. It is characterized in that a closing member 68 is provided.

The end portion 62 has a side wall 70 in which the inner peripheral surface is formed as a stepped hole with respect to the side wall 44b, and the inner diameter of the lower step hole 70a is larger than the inner diameter of the upper step hole 70b.

The lower hole 70a has a substantially disc-shaped porous plate 7
2 are fitted and fixed, and the lower end of the perforated plate 72 constitutes the contact surface 62a.

The fine holes 66 are screw holes penetrating the porous plate 72 in the Z-axis direction, and are formed in plural (21 in the second example of the present embodiment) on the entire surface of the porous plate 72, It communicates with the mouth 42.

The closing member 68 is adapted to close the fine hole 66 by being screwed into the fine hole 66 with a threaded member.

The suction port 64 is provided with a plurality of micro holes 66 communicating with the negative pressure supply port 24 through the intermediate port 42.
The closing member 68 is formed as a lower end of the micro hole 6.
6, the shape of the suction port 64 can be changed by closing the fine hole 66 appropriately.

As described above, also in the second example of the present embodiment, the closing member 68, which can be manufactured in a simple shape and at low cost, is attached to and detached from the fine hole 66.
The shape of the suction port 64 can be easily changed, and, similarly to the first example of the embodiment, mounting of electronic components having various shapes on a substrate can be realized at low cost.

In the second embodiment of the present invention, the fine hole 66 is a screw hole, and the closing member 68 is a threaded member. However, the present invention is not limited to this. For example, a pin hole, a pin fine hole, and a closing member which are detachably fitted to each other may be used.

In the second embodiment of the present invention, the perforated plate 72 is fixed to the side wall 44b. However, the present invention is not limited to this. It may be a perforated plate that is detachably mounted.

In this manner, for example, a plurality of perforated plates having different formation patterns of fine holes can be selectively mounted on the side wall 44b to form suction ports having various shapes.

On the other hand, for example, when the intermediate port 42 is larger than the suction port 64 and processing is easy, the perforated plate 72 may be formed integrally with the side wall 44b.

An electronic component mounting apparatus generally has a plurality of electronic component suction nozzles having different suction port shapes, and these electronic component suction nozzles are appropriately selected and mounted on the lower end of a slide shaft to mount electronic components. However, the present invention is applied to a case where all the electronic component suction nozzles can be changed in shape of the suction port as in the electronic component suction nozzles 12 and 60 according to the first and second examples of the embodiment. The present invention is not limited to this, and it is only necessary that at least one of the electronic component suction nozzles is capable of changing the shape of the suction port like the electronic component suction nozzles 12 and 60.

[0087]

As described above, according to the present invention,
There is an excellent effect that electronic components of various shapes can be mounted on a substrate at low cost.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main structure of an electronic component mounting apparatus according to a first example of an embodiment of the present invention.

FIG. 2 is a sectional view showing the structure of an electronic component suction nozzle in the electronic component mounting apparatus.

FIG. 3 is a perspective view showing a structure of a tip portion of the electronic component suction nozzle.

FIG. 4 is an enlarged sectional view showing the structure of the tip of the electronic component suction nozzle.

FIG. 5 is a perspective view showing a structure of a distal end portion of an electronic component suction nozzle according to a second example of the embodiment of the present invention.

FIG. 6 is an enlarged sectional view showing the structure of the tip of the electronic component suction nozzle.

FIG. 7 is an exploded perspective view showing the structure of a conventional electronic component suction nozzle.

FIG. 8 is a sectional view showing a structure of a nozzle slider of the electronic component suction nozzle.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus 12, 60, 100 ... Electronic component suction nozzle 22 ... Base end part 24 ... Negative pressure supply port 26, 64, 102d ... Suction port 28, 62, 102b ... Tip part 28a, 62a ... Contact surface 36, 102: Nozzle slider 42: Intermediate port 44: Base 44b, 70: Side wall 46, 48, 50: Adapter 66: Micro hole 68: Closure member

Claims (3)

[Claims] 1. A cylindrical body provided with a suction surface communicating with a negative pressure supply port on a base end side and having a contact surface at a distal end portion contacting with an electronic component while supplying from the negative pressure supply port. An electronic component mounting nozzle for mounting the electronic component on a substrate, the electronic component mounting nozzle being capable of vacuum-sucking the electronic component by a negative pressure applied to the electronic component. It is configured to include a base formed with an intermediate port communicating with the supply port, and a plurality of adapters detachably attached to the base and selectively mounted. The suction port communicates with the intermediate port. The electronic component mounting apparatus is formed by each of the adapters, and each of the adapters forms the suction port having a different shape. 2. The tip of the electronic component suction nozzle according to claim 1, wherein a side wall protruding from the base end side toward the tip end to the contact surface and forming the suction port together with the adapter is formed. An electronic component mounting device provided at a base of the electronic component. 3. A cylindrical body provided with a suction port communicating with a negative pressure supply port on a base end side, and a contact surface at a distal end formed with a suction port, the supply surface being supplied from the negative pressure supply port. An electronic component mounting device for mounting the electronic component on a substrate, wherein the suction port communicates with the negative pressure supply port. One or more closing members formed by a plurality of fine holes opened in the contact surface, removably mounted in the fine holes, and capable of changing the shape of the suction port by closing the fine holes. An electronic component mounting device, comprising: