JP2002202807A - Producing method for article, and method and program for quality control - Google Patents

Abstract

PROBLEM TO BE SOLVED: To speedily improve a defect. SOLUTION: This producing method for an article has a process for setting management items for managing the quality of the article, a process for setting specific management standards prescribing the states of the management items, one by one, a process for setting importance by the management items according to the degree of influence on quality, a process for checking the management items according to the management standards set for the management items and inputting the check results while relating them to the management items, a process for producing the article, a process for displaying the importance and check results of the management items, and a process for improving the quality of the article according to the displayed contents.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a product, a quality control method, and a quality control program for supporting improvement of a defect occurring when a product is manufactured.

[0002]

2. Description of the Related Art When a defect occurs when a product is manufactured, it is necessary to predict the cause of the defect and take appropriate measures. At this time, if the cause of the failure is incorrectly predicted, the failure will not be improved even if an appropriate measure is taken. Eventually, it is necessary to repeatedly predict the cause of the failure and remedy the failure until the failure is improved, which lowers the production efficiency of the product. Therefore, it is desired to accurately predict the cause of the failure.

Conventionally, such failure causes have been predicted based on the knowledge of a skilled person and past successful cases. However, when the manufacturing process is complicated, it is difficult to accurately predict the cause of the failure.

In order to solve such a problem, Japanese Unexamined Patent Application Publication No. 11-250135 describes a failure cause analysis method that makes it possible to easily predict the cause of a failure. According to this method, a plurality of manufacturing conditions and the like that are related to the cause of the defect and the degree of the effect of the defect are stored in a database in advance, and when an operator inputs the name of the defect, the defect and the manufacturing A fishbone diagram is displayed so that the degree of influence with conditions and the like can be understood at a glance. Therefore, the operator can easily grasp which manufacturing conditions and the like have a high degree of correlation with respect to the defect, and can accurately predict the cause of the defect.

[0005]

However, manufacturing conditions having a high degree of influence do not always cause a defect. That is, since manufacturing conditions that have a high degree of influence on defects are usually strictly checked at the time of production, it is not always possible to say that there is a high possibility of causing defects, and it takes time to improve. Would.

[0006] Although there are various possibilities for the cause of the defect, the cause of the defect actually occurring is limited. Therefore, unless a factor in accordance with the actually occurring failure phenomenon is selected, it takes time to improve the failure.

In addition, when a system in which a defect phenomenon is associated with a factor is used, the association between the defect phenomenon and the factor is uniquely performed. In some cases, it took time to identify the cause of the failure.

The present invention has been made in order to solve such problems, and an object of the present invention is to provide a product production method, a quality control method, and a quality control program that enable quick defect improvement. And

[0009]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has a step of setting a management item for managing the quality of an article, and a step of setting a management item for managing the quality. Setting a predetermined management criterion that defines the state of the management item for each item, setting an importance level for each management item based on the degree of influence on quality, and setting a management criterion for the management item Checking the management items based on the management items, inputting the check results in association with the management items, producing the product, displaying the management items, importance, and the check results; And a step of improving the quality of the product based on the method.

According to the present invention, there is provided a step of setting a management item for managing the quality of an article, a step of setting a predetermined management standard for defining a state of the management item for each management item for managing the quality, The process of setting the importance for each control item based on the degree of impact on quality, and checking the control items based on the control standards set for the control items,
The quality control method includes a step of inputting the check result in association with a management item, and a step of displaying the management item, the importance, and the check result.

The present invention is characterized in that, in the above-described quality control method of the present invention, the management items include factors that occur in a product planning stage, a design stage, and a production stage.

[0012] The present invention is set for each management item for managing the quality of an article. The step of checking the management item based on a management criterion that defines the state of the management item, and the step of checking the result of the check. A step of inputting in association with a management item; and a step of displaying importance set relatively for each management item based on the degree of influence on quality together with the result of the management item and check. Quality control method.

According to the present invention, there is provided a detecting step of detecting a state of a management item for managing the quality of a product by using a sensor provided in a product manufacturing apparatus, and a management item for managing the quality of the product. A check step of checking a management item detected by a sensor based on a management standard that defines a state of the management item, a step of inputting a result of the check in association with the management item, Displaying a degree of importance that is relatively set for each management item based on the degree of influence on the quality together with the item and the result of the check.

According to the present invention, there is provided a process for producing an article, a step for summing up defect information on an article having a defect among the articles by a predetermined method, and a step of summing up the result of the aggregation and an evaluation standard corresponding to the predetermined method. And the step of displaying the management item corresponding to the defect and the importance thereof when a countermeasure is required. In addition to the importance database that stores the degree of importance in association with the degree of importance, reference is made to the degree of relevance set in accordance with the predetermined method used for aggregation, and the degree of relevance is prioritized over the degree of importance. It is a production method.

According to the present invention, at least a step of recording information of a product having a defect and a name of a defect occurring in the product, and a step of totalizing a relationship between the recorded defect name and information of a plurality of products. And the results of these tabulations are compared with each of the criteria set in advance for each of the tabulation results. If the criteria are satisfied, a defect is generated among a plurality of management items for managing product quality. Recording a degree of relevance indicating the degree of influence on the occurrence of defects for the management item to be caused, and simultaneously displaying a management item associated with the defect and a management standard and relevance of the management item. It is a quality control method characterized by the following.

According to the present invention, at least a step of inputting a defect name which affects the quality of an article, a step of extracting a management item associated with the input defect name, and the details of the extracted management item are described. A step of displaying, and a step of adding or subtracting learning points to the management item displayed in detail, and changing the relative importance of the management item with respect to other management items according to the number of learning points. It is a quality control method characterized by having:

According to the present invention, a first process for inputting at least a defect name which affects the quality of an article, a second process for extracting a management item associated with the input defective name, A third process of displaying the details of the management item, and adding or subtracting learning points to the management item displayed in detail, and performing the management item with respect to other management items according to the number of learning points. And a fourth process for changing the relative importance.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (1) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

In order to manufacture a product with a high yield, a predetermined standard is set for a factor that may cause a defect,
It is useful to perform production so as to satisfy these criteria. Factors that can cause defects include materials (Materi
al), a device (Machine), a person (Man), and a method (Method). As an example, a description will be given of factors that may cause a defect in a case where a circuit board is manufactured by mounting an electronic component on a printed wiring board.

"Material" of the circuit board
"" Means parts and materials such as printed wiring boards, electronic parts, and solder paste. Failure to meet the conditions required for these materials can cause failure. For example, if the viscosity of the solder paste is too low, the solder paste will cause print sagging, bleeding, bridging, and
There is a high possibility that a defect of a bridge contacting the pad will occur. Therefore, “solder paste viscosity” is selected as a factor that may cause a defect. Similarly, for a component floating or open defect, “warpage of the printed wiring board” or the like is selected as a factor that can cause the defect.

[0021] Further, "apparatus (Machine)"
Shows a manufacturing device such as a mounter and a reflow device. Therefore, regarding the apparatus, for example, “positioning accuracy of the mounter” is a factor that can cause a failure.

The term "man" refers to a person engaged in manufacturing, such as a site supervisor or an operator of the apparatus. Therefore, for a person, for example, "the operation ability of the operator of the reflow device" is a factor that can cause a defect.

The "method" indicates a method itself such as a solder paste printing method or a reflow method, and operating conditions of the apparatus set according to the method. Therefore, regarding the method, “mask tension at the time of printing the solder paste” is a factor that can cause a defect.

As described above, the factors that can cause a defect are selected from the viewpoint of 4M, and the factors are managed so as to satisfy a predetermined standard. Become.

In the present embodiment, factors that may cause these failures are set as management items, and a desired standard that should be satisfied by the management items is set as a management standard in order to suppress the occurrence of defects. A case in which a circuit board is manufactured while checking whether or not the management standard is satisfied will be described.

FIG. 1 is a process diagram showing a circuit board according to an embodiment of the present invention. The stages that go before the circuit board is manufactured are the planning stage where the specifications of the circuit board are determined, and the design stage where the electronic components to be mounted on the printed wiring board are selected and the mounting design is performed so as to satisfy the determined use. There are four stages: a prototype stage for trial production of a designed circuit board, and a production stage for mass production of circuit boards. At each of these stages,
For each of the predetermined management items set based on 4M, it is checked whether the management criteria are satisfied. When a defect occurs, quality control is performed by displaying a management item related to the defect and a result of the check to inform the user of a management item that needs to be improved.

The hardware configuration for performing such quality management includes a server 10, a check terminal 12, a research terminal 14, and a LAN 16 (Local Area Network) for connecting these to each other so that data can be exchanged.
k). Hereinafter, each component will be described.

The server 10 comprises a reading device, a CPU, an input device, a display device, a main storage device, and an auxiliary storage device. The reading device is an optical disk drive device for reading a check result input program and a failure cause investigation program (hereinafter, both of which are collectively referred to as “application”) according to the present invention stored in the optical disk. The application read by the reading device is stored in the main storage device. The CPU performs an operation by executing an application stored in the main storage device. The input device is a keyboard, and the display device is a display device. The main storage device is used as an auxiliary storage device for the main work of the CPU, and temporarily stores data under processing and the like. The auxiliary storage device is
A hard disk device in which applications and databases are recorded.

The check terminal 12 and the investigation terminal 14 have the same hardware configuration as the server 10, and are connected to the database stored in the server 10 via the LAN 16 so as to be recordable. The same application as that recorded in the server 10 is recorded in the memory.

The database recorded in the auxiliary storage device of the server 10 is composed of five databases: a management reference database 32, an importance database 34, a check result database 36, a stage database 37, and a failure database 38. Hereinafter, these databases will be sequentially described.

FIG. 2A shows the contents of the management reference database 32. In the management standard database 32, management items and management standards respectively set corresponding to the management items are recorded.

The management item is a factor that can cause a defect. This management item is set to a total of 300 or more from the viewpoint of 4M. The management criterion is a criterion that is desired to satisfy a management item in order to suppress the occurrence of defects.

The control items and control standards are determined based on manufacturing experience, theory, and facts. It is preferable that the management standard is set quantitatively so that a person who performs the check can uniquely determine whether or not the management standard is satisfied. Hereinafter, specific examples of the management items and the management criteria will be described.

A circuit board for mass production is manufactured by mounting an IC chip, a capacitor, a resistor, and other components on a printed wiring board.

"Materials" used for manufacturing this circuit board include printed wiring boards, IC chips, electronic components such as capacitors, fluxes, solder pastes, and the like.
Therefore, as the control items and the control criteria for the materials, the control criteria “150 Pa · s to 250 Pa · s” for the control item “viscosity of solder paste”,
The management criterion "1" for the management item "Capacitor X capacity"
500 μF or more ”, or the management item“ warpage of Xmm or more ”for the management item“ warpage of the printed wiring board ”.

"Apparatus" used for manufacturing this circuit board
Is a printing machine, a mounter, a reflow device, and the like. Therefore, as the control items and control criteria for the apparatus, the control criteria "below X μm" for the control item "positioning accuracy of the mounter" and the control criteria "maximum for the reflow wind speed of the reflow device" Ym
/ S or more. "

Further, "people" involved in the manufacture of circuit boards
Are operators of the apparatus and other workers. Therefore, the management item relating to a person is “operability of the worker of the reflow device”, and the management criterion is set to “have a qualification of X”.

The "method" includes a method of printing a solder paste, a method of mounting components, a reflow method, and the like. Therefore, the control items and control criteria for the method include:
For the management item “Metal mask tension at the time of printing”, the management criterion “Must be Ykg · Weight to Zkg · Weight” and for the management item “Component moving speed at the time of mounting a component”, the management criterion “Wm / s ~ Um / s ".

As described above, the management item and the management standard (set corresponding to the management item) are recorded in the management standard database 32 in association with each other.

FIG. 2B shows the contents of the importance database 34. The importance database 34 includes management items,
The name of the defect and the degree of importance are recorded.

The names of the defects are "crack" and "bridge".
This is a defect such as "open" which occurs during the manufacture of a circuit board, and is approximately 30 types.

The degree of importance indicates a relative degree of influence on a defect when the management item does not satisfy the management standard. This importance is set for each defect. Specifically, numerical values in four stages of “5, 3, 1, 0” are shown in descending order of the degree of influence.

For example, since the management item "reflow temperature" has a great effect on the defect "solder paste undissolved" in which the solder paste remains in a powder state even after reflow, the importance is set to "5". Is done. However, since the management item “warpage of the printed wiring board” does not significantly affect “solder paste not melted”, the importance is set to “1”. In addition, when it is considered that there is no influence, "0" is set.

On the other hand, regarding the defect that adjacent land pads are short-circuited due to excessive solder paste called “bridge”, it is important to consider that the management item called “reflow temperature” is not very relevant. The degree is set as "1". When the management item “warpage of the printed wiring board” is not considered to have much influence, the importance is set to “1”. As described above, the degree of influence of each management item is recorded as the degree of importance in the degree of importance database 34 for each type of defect.

FIG. 2C shows a check result database 3
6 is shown. In the check result database 36,
The management item, the check result of the management standard associated with the management item, and the name of the checked product are recorded in association with each other.

The check result indicates the degree to which the management item satisfies the management criterion. For example, if the management criterion is satisfied, the result is OK, and if the management item is not satisfied or the check is not performed, the result is NG. Be recorded. Therefore, NG is recorded in the initial state before checking. The check result database 36 is recorded for each type of circuit board to be manufactured.

FIG. 2D shows the contents of the stage database. In the stage database, management items and stages for checking the management items are recorded in association with each other.

That is, a total of 300 or more management items are checked in any one of the planning stage, the design stage, the prototype stage, and the manufacturing stage. Is recorded. By recording the stage at which the check is performed in this way, the person who performs the check can easily find the management item to be checked, which is convenient.

For example, whether or not the management criteria for the management item “reflow temperature” is satisfied is checked at the stage of trial production for setting the manufacturing conditions. Therefore,
The stage “prototype” is recorded in association with the management item “reflow temperature”. In addition, since the management item “printed wiring board” is checked when the purchased printed wiring board is supplied to the manufacturing line, the stage “manufacturing” is recorded in association therewith.

FIG. 2E shows the contents recorded in the failure database 38. In the defect database 38, the name of the defect and image information expressing the defect are recorded in association with each other. Even inexperienced workers can easily determine the type of defect by comparing the actual defective product with the defective case. The number of defects reaches 30 types.

Next, a procedure for checking the cause of a defect in the present embodiment will be described. First, the input procedure of the check result will be described. FIG. 3 is a flowchart showing an input procedure of the check result input program.

As shown in FIG. 1, the input of the check result is input using the check terminal 12 at each of the planning stage, the design stage, the trial production stage, and the manufacturing stage.

For example, in the production stage, when mass-producing circuit boards, the person who performs the check activates a check result input program from the check terminal 12 arranged at the production site, and selects items to be checked in the production stage. Enter the check result for the management standard.

First, a person who inputs a check result (hereinafter referred to as a "checker") instructs the check terminal 12 to execute a check result input program (S1). When the checker, the stage of performing the check and the type of the circuit board to be manufactured are input (S2), the management reference database 3 stored in the server 10 by the check result input program.
2. With reference to the stage database 37 and the check result database 36, the management items and management criteria for the inputted stage, the type of the input circuit board and the check result for the stage are extracted, and the check terminal 1 is extracted.
A list is displayed on the second display device (S3). The checker,
The user inputs a check result for the management item checked by himself (S4). "OK" is input if the management criteria are satisfied, and "NG" is input if the management is not satisfied or unconfirmed. When the check result is input from the input device, the check result input program records the check result in the check result database 36 (S5). The same check is performed at the design stage and the prototype stage, and the check result database 3
The check result is recorded in 6.

FIG. 4 is a flowchart showing the procedure for investigating the cause of a defect in this embodiment. FIG. 5 shows the contents displayed by the failure cause investigation program during the investigation procedure. The manufactured circuit board undergoes an appearance inspection, an electrical inspection, and a visual inspection. A circuit board that passes this inspection is treated as having no defect. However, a circuit board that does not pass the inspection because it does not satisfy the specifications is treated as a defective product, and the cause of the defect is investigated in the following procedure.

First, the type of the defect is specified. A person who investigates the cause of the defect (hereinafter, referred to as “investigator”) instructs to execute the defect cause investigation program (S10). Based on this instruction, the defect cause investigation program reads out the name of the defect from the defect database 38 stored in the server 10 and an image expressing the defect and displays the image on the display device (S11).

FIG. 5A shows the display contents in step S11. The investigator compares the defect generated on the circuit board with the displayed image of the defect and specifies the defect. The investigator uses the input device to input the name of the defect corresponding to the specified defect and the type of the circuit board (S12).

When this input is made, the failure cause investigation program sends the management result, the management standard, the check result on the type of the input circuit board from the management standard database 32, the check result database 36, and the importance database 34, and the input. The importance of the performed defect is extracted, and the type of the circuit board, the management item, the management standard, the check result, and the importance are displayed in a list on the display device (S13).

Here, the extracted and displayed information is that the importance is "0" in the importance database 34 for the input defect name.
The management criteria, management items, and the like having the above values.

FIG. 5B shows the display contents in step S13.

The investigator can preferentially re-check the management item having a check result of NG and having a high degree of importance as an item having a high probability of causing a defect. However, when a large number of management items are displayed, it is troublesome to determine a management item having a high probability of causing a defect from the list display. Therefore, it is desirable to further narrow down the management items by displaying by importance or by checking result. That is, it is preferable to display in descending order from the management items having the higher importance. When the importance is “0”, it may not be displayed.

FIG. 5 (c) shows the display contents when the images are displayed in descending order based on the importance. Although the management item whose display content is OK is displayed in FIG. 5C, it is also possible to display only the management item whose check result is NG. Alternatively, only management items having a high importance and a check result of NG may be displayed.
FIG. 5D shows the display contents at this time.

As described above, by displaying the management items in accordance with the magnitude of the influence on the defect and the result of checking whether the defect is in accordance with the standard, it is possible to efficiently improve the defect.

As described above, since the check result of the management standard is displayed for each management item relating to the defect to be investigated, it is possible to specify the management item whose management standard is not satisfied. By rechecking the specified management item, the defect can be quickly improved. In addition, since the degree of the influence of each management item on the defect is assigned with importance, it is easy to determine a management item having a high improvement property to be improved. By performing a corresponding action on the management item, the defect can be improved more quickly. In this way, among the control items that can cause product failure, the control items that are not satisfied with the control standards set for each control item are specified, and the investigator can take appropriate measures for these control items. As well as possible, it is possible to quickly improve the defect.

Further, the application program may be provided with a check function so that the management items are checked without human intervention. The specific configuration will be described below using an example of manufacturing the circuit board according to the present embodiment.

In the manufacture of the circuit board, various devices such as a printing machine, a mounter, and a reflow device are used. These devices are usually provided with sensors, which detect various states and control the devices based on the detection results. Have been done. For example, in the case of a printing machine, a total of ten or more state quantities, such as the number of times of paste printing, the time interval of paste printing, the squeegee pressing pressure, and the temperature of the paste stored in the printing machine, are detected by sensors, and feedback control and the like are performed based on the results. Is controlled. Actually, it is possible to manage up to sensing, but it is premised that one or two items can be performed up to feedback control.

For example, when the number of times of paste printing reaches a predetermined number of times, a warning sound is issued to prompt squeegee replacement, or when the squeegee pressing pressure exceeds a predetermined threshold value, control for reducing the pressure is performed. Is reduced. In this modification, the outputs from these sensors are taken into a check terminal, and the management items are checked as described below.

First, the output from the sensor is taken in by the check terminal. Since the output from the sensor is usually an analog signal, the A /
It is converted to a digital signal by the D board.

Next, the application program of the check terminal associates the sensor data output from the sensor with the management items. For example, the sensor data output from the pressure sensor that detects the squeegee pressing pressure is subjected to a process of adding identification data indicating the management item “squeegee pressing pressure” to the sensor data. Similarly, a process of adding identification data indicating a management item corresponding to the sensor data to the various sensor data is performed, and the sensor data is associated with the management item. These associations are made based on input ports that take in outputs from the sensors. Since the identification data indicating the management item is added in this manner, the identification between the sensor data becomes possible, so that the investigation terminal that has captured the sensor data extracts the management standard corresponding to the sensor data, Checks can be made.

The sensor data thus added with the identification data is output to the cause investigation terminal via the LAN. The application program stored in the cause investigating terminal fetches the sensor data and causes the management standard corresponding to the identification data added to the sensor data to be extracted from the management standard database. Then, the application program checks the management standard and the sensor data. The result of this comparison is output to the check result database 36 as a check result. The subsequent procedure for investigating the cause is performed in the same manner as in the above embodiment. According to such a configuration, since the check is performed by directly taking in the output from the sensor, the check is automated, and as a result, there is a remarkable effect that the cause of the failure is more quickly identified.

As a further modification, it is possible to adopt a configuration in which the information transmitted via the LAN is a check result. In other words, the configuration is such that the application of the check result terminal extracts a management standard corresponding to the acquired sensor data from the management standard database, performs a check, and inputs the result to the check result database. With such a configuration, the sensor data does not need to be transmitted via the LAN, and the LA
The stability of the information environment including N is increased. In the case of the above example, digital conversion is performed in the terminal, but if the sensor has a digital conversion function, it is of course possible to directly take in a digital signal. In this case, A / D
There is no need to incorporate a conversion board. In addition, as a result of reducing noise and increasing objectivity, quick defect identification becomes possible. Further, in the case of the above example, the sensor data is output to the cause investigation terminal via the check result terminal. Of course, it is also possible to output to a terminal. In this case, the load on the check result terminal is reduced, so that the stability of the information environment is improved. Alternatively, a barcode may be attached to a circuit board to input a check result for each circuit board. That is, a sensor for reading a bar code is provided, and data indicating a serial number is output to a cause investigation terminal together with various sensor data. The cause investigation terminal can manage each circuit board by storing the check result in the check result database for each serial number.

It should be noted that the management items are not necessarily set for each product type, and for example, management items common to a plurality of types of products may be set. Similarly, the input of the check result need not be performed for each type of product, but may be performed for each lot or each manufacturing date. According to such a configuration, it is possible to refer to the check result for each lot or each day.

As the definition of the management criterion in the present invention, “a criterion that is satisfied because the management item (factor) does not cause a defect” means that the possibility that the management item causes the defect is substantially zero. It is not necessary that the probability is completely zero.

The computer according to the present invention executes each processing in the present embodiment based on a program stored in a storage medium, and is constituted by one device such as a personal computer or a plurality of devices such as a network device. Any configuration such as a system described above may be used.
Further, the computer in the present invention is not limited to a personal computer, but also includes an arithmetic processing unit, a microcomputer, and the like included in an information processing device, and is a general term for devices and devices capable of realizing the functions of the present invention by a program. .

The storage medium (main storage device, auxiliary storage device) according to the present invention includes a magnetic disk, a floppy (registered trademark) disk, a hard disk, an optical disk (CD-ROM, CD-R, DVD, etc.), a magneto-optical disk. Any storage medium, such as a disk (MO or the like) or a semiconductor memory, which can store a program and can be read by a computer, may have any storage format. An OS (Operating System) running on the computer, database management software, MW (Middleware) such as a network, and the like based on the support of the program installed in the computer from the storage medium realize the present embodiment. May be partially executed. Further, the storage medium in the present invention is not limited to a medium independent of a computer, but also includes a storage medium in which a program transmitted via the LAN 16 or the Internet is downloaded and stored or temporarily stored. The number of storage media is not limited to one, and the case where the processing in the present embodiment is executed from a plurality of media is also included in the storage medium of the present invention, and any media configuration may be used.

(2) Next, a second embodiment of the present invention will be described with reference to the drawings. The same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 6 is a process chart showing a circuit board according to an embodiment of the present invention.

The manufacturing process of the circuit board is roughly divided into three processes. The first step is a solder paste printing step of supplying a paste solder (solder paste) onto a circuit board.

The next step is a component mounting step of mounting the component such that the electrode of the electronic component comes into contact with the location where the solder paste has been supplied.

The last step is a reflow soldering step of heating the entire circuit board on which the electronic component is mounted to melt the solder and electrically and mechanically joining the electronic component and the circuit board with the solder. .

Thereafter, there is an inspection step for inspecting the state of the manufactured circuit board.

In this inspection process, the inspection result is generally written by a worker in writing a name of a defect that has occurred on a sheet of a predetermined format and circuit board information, or data relating to the occurrence of a defect is output from an inspection device. Inspection result database 40
And then used for analysis.

The defects that occur during the manufacture of the circuit board include a bridge that causes a short circuit between the electrodes, and an open or wetting defect that indicates a case where soldering between the circuit board and the electronic component is insufficient.

These defects are generally detected in an inspection process performed at the end of the process of manufacturing a circuit board. The inspection here is roughly classified into two types, an appearance inspection and an electrical continuity inspection.

The quality control apparatus has the inspection result database 40 added to the apparatus shown in FIG.
Further, the server 10 is provided with functions of a recording unit 41, an analyzing unit 42, and a display unit 43.

FIG. 7 is a schematic diagram of the recorded contents of the inspection result database 40. The inspection result database 40 records data such as a board number, a board name, a defect name, a location name, a component type, a date, and an inspection location.

The board number indicates a number for identifying the type of the inspected circuit board, for example, “001”.
It is a serial number such as "002".

The board name is the name of the circuit board, for example, a symbol or number for identifying the circuit board such as “TPC100”.

The defect name is a name of a defect, for example, a name representing a defect phenomenon such as "bridge", "wetting defect", "chip standing" or the like.

The location name is a name indicating a location where a component on a circuit board is located, for example, “IC110”.
Symbols such as "R50" and "C305".

The component type is a name indicating the form of the component, such as "QFP", "BGA", or "chip component".

The inspection place is a step where the inspection is performed, and is, for example, a name such as “visual inspection” or “ICT”.

Nothing is recorded in the inspection result database 40 for a circuit board having a board number having no defect. For example, in FIG. 7, nothing is recorded in the defect name, the location name, and the component type for the circuit board with the board number “002”.

The recording means 41 has a function of recording in the inspection result database 40 at least information of the product in which a defect has occurred and the name of the defect which has occurred in the product.

The analysis means 42 checks the inspection result database 4
It analyzes the relationship between the information of the product recorded in No. 0 and the defect name, and has a function of analyzing the relationship between the information of each product and the defect name using a graph or a table.

The display means 43 has a function of simultaneously displaying the analysis result by the analysis means 42 and the management criteria of the factor associated with the defect and the factor read from the management standard database 32.

Further, the program memory 44 of the server 10 has a first process for recording at least information of a product in which a defect has occurred and a defect name of the product. A quality management program is stored which has a second process for analyzing the association, and a third process for simultaneously displaying the analysis result, the management item associated with the defect, and the management standard of the management item.

Next, the operation of the apparatus configured as described above will be described with reference to the quality control flowchart of circuit board manufacturing shown in FIG.

In the circuit board manufacturing process, paste solder (solder paste) is supplied onto the circuit board in the first solder paste printing process (step #).
1).

Next, in the component mounting step, the component is mounted such that the electrode of the electronic component comes into contact with the location where the solder paste has been supplied (step # 2).

Next, in the last reflow soldering step, the solder is melted by heating the entire circuit board on which the electronic component is mounted, and the electronic component and the circuit board are electrically and mechanically joined with the solder. (Step # 3).

Thereafter, the state of the manufactured circuit board is inspected in the inspection step of step # 4. In this inspection process, a visual inspection, an electrical inspection, and a visual inspection are performed on the manufactured circuit board. The result of this inspection is Step # 5
Is recorded in the inspection result database 40.

First, the type of the defect is specified. When the investigator instructs execution of the defect cause investigation program, the server 10 reads out the name of the defect from the defect database 38 and an image representing the defect, and reads the above-described FIG.
It is displayed on the monitor 50 as shown in FIG.

The investigator compares the defect occurring on the circuit board under inspection with the image of the defect displayed on the monitor 50, specifies the defect name, and uses the input device to specify the defect name in the inspection result database 40. Make a record.

Thus, the inspection result database 40
For example, as shown in FIG. 7, a board number “001”, a board name “TPC10”, a defect name “bridge”, a location name “IC110”, a component type “QFP”, and a date “2001”
/ 9/27 ", inspection location" after reflow "is recorded.

Next, the analysis of the inspection result is performed in step # 6. Here, a plurality of graphs and table formats that can be created based on the data recorded in the inspection result database 40 are prepared, and the researcher creates graphs and tables using this format. ,
Analyze the inspection results.

The displayed bar graphs, tables, and the like are displayed so that the investigator can understand the tendency of the overall failure of the circuit board having the same board name recorded in the inspection result database 40.

For example, as shown in FIG. 9, the researcher can select a desired analysis item from among the analysis items 51a to 51c displayed on the monitor 50 provided in the server 10, for example, the "relation between location and defect". When the button 51 is selected by clicking or the like, the analysis means 42 of the server 10 analyzes the relation between the information of each product and the defect name, here the relation between the location and the defect, using a graph or a table in step # 7. Then, the result is displayed on the monitor 50.

In FIG. 9, each location (for example, IC10
0, IC 120, R50), a bar graph representing the relationship between the type of defect (for example, bridge, wet defect, chip standing) and the number thereof is automatically created and displayed on the monitor 50. As a result, it is possible to grasp the overall tendency of what location of the circuit board (for example, the TPC 10) to be analyzed has a defect.

Next, by selecting the defect name (step # 8) and selecting the keyword (step # 9), the display means 43 displays the management item from the importance database 34 shown in FIG. And the importance of the management item “5, 3, 1, 0” are read, and a plurality of management items associated with the defect are displayed on the monitor 50 (step #)
10). At this time, the selected inspection result is also displayed on the same screen on the monitor 50.

When the investigator looks at the contents displayed on the monitor 50, it can be inferred from the bar graphs and tables shown in FIG. When the cause is selected (step # 11), the display means 43 reads the management reference stored in the reference management database 32 shown in FIG. 2 (a) and manages it on the screen of the monitor 50 in step # 12. Item management criteria are also displayed.

As a result, by comparing the management standard of the management item with the actual state of the management item, it is possible to take an appropriate countermeasure against the defect (step # 1).
3), the defect can be improved.

As described above, according to the second embodiment, at least information on the circuit board on which a defect has occurred and the name of the defect on the circuit board are recorded, and the information on the circuit board and the defect name are recorded. The results of the analysis and the management item associated with the defect and the management standard for this management item are displayed simultaneously, so that the management standard for the management item that caused the failure that occurred on the circuit board is displayed. Can be compared with the actual state of the management item, and the cause of the failure can be quickly and accurately reached, and appropriate measures can be taken against the failure to improve the failure.

(3) Next, a third embodiment of the present invention will be described with reference to the drawings. The same parts as those in FIG. 6 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 10 is a configuration diagram of a quality control device applied to the manufacture of a circuit board. This quality control device server 10
Has functions of a recording unit 41, a tallying / analyzing unit 60, a relevance recording unit 61, and a display unit 62 added to the apparatus shown in FIG. A data analysis result database 63 is added to the database.

The counting / analyzing means 60 counts the relationship between the defect name recorded in the inspection result database 40 and the information on a plurality of circuit boards, and displays the counting result using, for example, a graph or a table. have.

Specifically, as shown in FIG. 11, the totalizing / analyzing means 60 includes, as a first step, a defect specifying means 64 for calculating the ratio of the defects occurring on the circuit board, the breakdown of the defect names for the defects and the ratio, When the ratio of the defects obtained by the defect specifying means 64 is equal to or more than a predetermined reference value as two steps, the function has a function of a defect tendency analyzing means 65 for analyzing the tendency of the defect name.

More specifically, the first stage defect specifying means 64
It has a function of calculating a total failure rate represented by the following equation as a percentage of failures occurring on the circuit board.

The total failure rate = the number of defective parts / the number of inspected boards / the number of parts per board × 10 ⁶ ppm (1) Further, the failure specifying means 64 breaks down the breakdown of the failure names for all the failures for the specific board name and the The ratio is obtained, and the result is shown in FIG.
Has a function of displaying on the monitor 50 using a pie chart as shown in FIG. In this pie chart, the breakdown of the defect names with respect to
%, Tip standings are 20%, and others are 20%.

In this first stage, it is possible to clarify how much failure has occurred on the circuit board having the name of the board to be inspected, and what kind of failure has occurred. Here, if the defect has occurred more than the preset reference value,
The process proceeds to the next second stage failure tendency analysis means 65.

The defect tendency analysis means 65 has five graph and table formats which can be created based on the data recorded in the inspection result database 40, and is created according to these formats. The trend of the defect name is analyzed using graphs and tables.

The first function is a function that represents the relationship between a defect and the type of components constituting a circuit board by, for example, a pie chart shown in FIG. In this pie chart, for example, 80% of QFP and 1 of SOP
5%.

The second function is a function for expressing the relationship between the defect and the location name of the circuit board where the defect has occurred by, for example, a pie chart shown in FIG. In this pie chart, for example, 70% of IC100, 15% of IC100, and 10% of IC51 indicate the location where a defect has occurred.

The third function is a function for expressing the relationship between the defect and the number of the circuit board by, for example, a line graph shown in FIG. This line graph shows the number of defective cases with respect to the board number.

The fourth function is a function for expressing the relationship between the position on the component where the defect has occurred and the defect by, for example, a bar graph shown in FIG. This bar graph shows the number of defective cases with respect to the position.

The fifth function is a function for expressing the relationship between the defect and the direction in which the defect occurs, for example, by a pie chart shown in FIG. In this pie chart, the right direction is 90% and the left direction is 10%.
%.

The relevance recording means 61 is a means for counting and analyzing 6
Each tally result of 0 is compared with each criterion set in advance for each tally result. If the criterion is satisfied,
It has a function of recording, in the data analysis result database 63, a degree of association indicating a degree of association between the factor and the defect name with respect to a predetermined factor affecting the quality of a plurality of circuit boards. The relevance is equivalent to the relevance in the relevance database 34, but when the relevance is designated, the relevance has priority.

The display means 62 has a function of simultaneously displaying on the monitor 50 the management item associated with the defect and the management standard and the degree of association of this management item.

The program memory 44 of the server 10 has a first process for recording at least information on the circuit board on which a defect has occurred and the name of the defect on the circuit board. A second process for summing up the relationship with the information of the plurality of circuit boards is compared with the summation result and each of the criteria set in advance for each of the summation results. A third process for recording the degree of association indicating the degree of association between the management item and the defect name for the management items of factors affecting the quality of the plurality of circuit boards; Monitor 5 items and management criteria and relevance of this management item
A quality management program having a fourth process for displaying the same at 0 at the same time is stored.

Next, the operation of the apparatus configured as described above will be described with reference to the quality control flowchart of circuit board manufacturing shown in FIG.

In the circuit board manufacturing process, similarly to the first embodiment, in the first solder paste printing step, paste-like solder (solder paste) is supplied onto the circuit board (step # 20). In the next component mounting step, the components are mounted such that the electrodes of the electronic components come into contact with the locations where the solder paste has been supplied (step # 2).
1) In the last reflow soldering process, the solder is melted by heating the entire circuit board on which the electronic component is mounted, and the electronic component and the circuit board are electrically and mechanically joined with the solder (step). # 22).

Thereafter, the appearance of the manufactured circuit board is inspected, the electrical inspection, and the visual inspection are performed on the manufactured circuit board in the inspection process of step # 23, and the inspection result is obtained in step # 24. It is recorded in the inspection result database 40.

First, the type of the defect is specified. When the investigator instructs the execution of the investigation program, the server 10 reads out the name of the defect and an image representing the defect from the defect database 38, and compares the name and the image of the defect with the data in FIG. It is displayed on the monitor 50 as shown in a). After comparing the image of the defect generated on the circuit board with the image of the defect, the investigator uses the input device to determine the type of the generated defect and the type of the circuit board using, for example, the board number “001” as shown in FIG. The board name "TPC10", the defect name "bridge", the location name "IC110", the component type "QFP", the date "2001/9/27", and the inspection place "after reflow" are input.

Next, the tallying / analyzing means 60 executes step #
In step 25, as shown in FIG. 11, the inspection results are totaled in two stages of a failure specifying process and a tendency analysis process.

In the first stage, the failure specifying means 64 of the tallying / analyzing means 60 performs tallying on each of the circuit boards manufactured to the same specifications, the ratio of the generated defects, the breakdown of the defect names for the defects, and the ratio thereof. Ask for. That is, the overall failure rate shown in the above equation (1) is calculated as the percentage of failures occurring on the circuit board.

The defect specifying means 64 obtains the breakdown of the defect name and the ratio of the defect to all the defects, and compares the result with, for example, FIG.
2 is displayed on the monitor 50 using a pie chart representing, for example, that the bridge is 60%, the chip standing is 20%, and the others are 20%.

By this first stage, it is clear how much failure has occurred in a specific set of circuit boards and what kind of failure has occurred. If the total failure rate exceeds a certain standard, an analysis result database 63 to be used as data for analyzing the cause of the failure.
In order to construct the following, the second-stage failure tendency analysis means 65
Proceed to.

The failure tendency analysis means 65 is used to analyze the failure name tendency based on the data recorded in the inspection result database 40 in order to analyze the failure name tendency. An analysis function for displaying each graph or table on the monitor 50 as shown in FIG.

That is, as a first function, the failure tendency analysis means 65 is a function indicating the relationship between the failure and the type of the component constituting the circuit board. For example, when a specific failure name is input as shown in FIG. A pie chart is displayed which indicates that the defective component type is 80% QFP and 15% SOP.

As a second function, the failure tendency analyzing means 65
Is a function indicating the relationship between the defect and the location of the circuit board where the defect has occurred. For example, when a specific defect name is input as shown in FIG. 14, the location on the circuit board where the defect has occurred 70% of IC110, IC10
A pie chart indicating that 0 is 15% and IC51 is 10% is displayed.

As a third function, the failure tendency analyzing means 65
Is a function that indicates the relationship between the defect and the number of the circuit board,
For example, when a specific defect name is input as shown in FIG.
A line graph showing the number of failures with respect to the board number where the failure has occurred is displayed.

As a fourth function, the failure tendency analyzing means 65
Is a function indicating the relationship between the position on the component where the defect has occurred and the defect. For example, when a specific defect name and a specific component type on the component are input as shown in FIG. 16, the defect has occurred. Displays a bar graph showing the number of defective items with respect to the position.

As a fifth function, the failure tendency analyzing means 65
Is a function that indicates the relationship between the defect and the direction in which the defect occurs.
For example, as shown in FIG. 17, when a specific defect name and a defect generation direction are input, the right direction in which the defect has occurred is 90%,
A pie chart showing 10% in the left direction is displayed. The fifth function is applied to a defect which is difficult to be specified in a part on a component like the fourth function, such as a chip standing defect.

Next, the relevance recording means 61 executes step #
In step 26, the totaling result of the totaling / analyzing unit 60 in step # 25, that is, the analysis result of the failure tendency analyzing unit 65 (FIGS. 13 to 17) is set in advance for each analysis function in the judgment criterion database shown in FIG. The respective judgment criteria are compared.

The criterion database is a database in which the analysis function of the failure tendency analysis means 65, the name of the defect, the criterion, and the action when preferably satisfying these three items are recorded in association with each other. In the case where the analysis function indicates “1” in FIG.
5 corresponds to the first function of 5. When this criterion is satisfied, that is, when the defect rate or the number of defective cases in the specified relationship exceeds a predetermined value,
The association degree recording unit 61 proceeds to step # 27 and analyzes the association degree indicating the strength of association between the predetermined factor and the defect name for the factors affecting the quality of the plurality of circuit boards. Record in the database 63.

This analysis result database 63 includes
As shown by 0, each data analysis result database 63 is classified by defect (for example, bridge, wet defect, chip standing, etc.).
a, 63b and 63c are formed, and these databases 6
Serial numbers, management items, and relevance are recorded in association with 3a, 63b, and 63c. The degree of association is input according to the item of “treatment” in the criterion database. "treatment"
If there is no item, or a management item that is not specified in the item of “treatment”, the item is inputted with reference to the importance database 34.

Here, the determination of the analysis result will be described with reference to the analysis result determination flowchart shown in FIG. 21 taking a case where a bridge failure has occurred in the circuit board as an example.

The overall failure rate is calculated by the failure identification means 64 in the first stage, and it is determined that the occurrence of a bridge failure on the circuit board is not negligible (step # 40). Failure tendency analysis means 6
5, a pie chart representing the relationship between the bridge failure and the component types constituting the circuit board is displayed as shown in FIG.

In this pie chart, when a bridge failure occurs, the component type is 80% QFP and 15% SOP.
% And PJ were 5%. The figure shows basic data for creating a pie chart, and the basic data shows the number of QFPs, SOPs, and PJs and their ratios (%).

Next, the relevance recording means 61 executes step #
At 42, for example, a predetermined determination criterion shown in FIG. 19, for example, a failure name is a bridge and a total result is In the case of the pie chart showing the relationship between the defect and the component type constituting the circuit board as shown in FIG. 22, it is determined whether or not "when there is a component type occupying 60% or more".

As a result of this determination, the component type QFP is 80
%, Which is equal to or greater than the determination criterion of 60%, the association degree recording unit 61 determines that the component type QFP has a correlation with the component type and the bridge.

Then, the association degree recording means 61
According to the procedure shown in FIG. 9, the relevance “5” is input to the management items corresponding to the numbers 1, 3,... In the bridge data analysis result database 63a, and the relevance “5” is input to the management items corresponding to the numbers 10, 32,. Enter "3". Here, for example, number 1 is the solder paste viscosity, and number 3 is the temperature profile.

Subsequently, for the management items for which the relevance was not input, that is, for the management items for which the relevance was not specified in the treatment item of the evaluation criterion database, the analysis result database 63 is referred to by referring to the importance database 34. Enter the importance. That is, when assigning the importance to the management item, first, the importance, which is specifically designated based on the criterion according to the aggregation result, that is, the relevance is assigned. After that, the importance is assigned to the management item for which the relevance is not specified by referring to the importance database 34 whose standard importance is facilitated. Thereby, the analysis result database 63 is constructed. As a result, it is possible to customize according to the characteristics of the product / factory to be manufactured simply by operating the treatment items in the evaluation criterion database while maintaining the importance database 34 with the standard specifications. Deployment to various sites is facilitated.

Thereafter, a defect name is selected (step # 28).
Then, when a keyword serving as a condition relating to the display mode such as sorting or non-display is selected (step # 29), the analysis result database 63 corresponding to the specified defect name is read out, and the display corresponding to the keyword is displayed on the monitor 50. This is performed (step # 30). At this time, the selected inspection result is also displayed on the same screen on the monitor 50.

When the investigator looks at the contents displayed on the monitor 50 and selects a management item that is a cause from the management items associated with the plurality of displayed defects (step #). 31), the display means 63 reads the management criteria stored in the reference management database 32 shown in FIG. 2A, and displays the management items associated with the defect on the screen of the monitor 50 and the management in step # 32. The item management criteria and relevance are displayed simultaneously.

FIG. 23 is a diagram showing an example of a display screen of the cause of failure displayed on the screen of the monitor 50. The display screen of the cause of the failure is the case of the bridge as the cause of the failure, and displays buttons for the management item, the degree of relevance, and the details. The detailed button is a GUI. For example, when clicked and instructed, the display unit 62 reads the management standard from the management standard database 32 and displays it on the monitor 50.

As a result, by comparing the management standard of the management item with the actual state of the management item, it is possible to take an appropriate countermeasure against the defect (step # 3).
3), the defect can be improved.

As described above, according to the third embodiment, at least information on the circuit board on which a defect has occurred and the name of the defect occurring on the circuit board are recorded, and the recorded defect name and a plurality of The relationship with the information of the circuit board is tabulated, and the tabulated result is compared with each of the criteria set in advance for each tabulated result. If the criteria are satisfied, the quality of a plurality of predetermined circuit boards is determined. For the management items that affect the status, record the relevance indicating the strength of the relationship between this management item and the defect name, and monitor the management item associated with the defect and the management criteria and relevance of this management item. Since the information is displayed at the same time on the display screen 50, the investigator looks at this display screen, and from the management items associated with the plurality of displayed defects, the analysis result of the phenomenon of the defect actually occurring. From bad source It is possible to selectively display the management items that are presumed to be defective, so that even inexperienced persons can quickly and accurately find the cause of the defect according to the actual condition of the defect without depending on the knowledge of the expert. In addition, it is possible to take measures against defects.

(4) Next, a fourth embodiment of the present invention will be described with reference to the drawings. The same parts as those in FIG. 6 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 24 is a configuration diagram of a quality control device applied to the manufacture of a circuit board. This quality control device is
In addition to the third embodiment, the functions of an extracting unit 70, a displaying unit 71, and an importance updating unit 72 are added to the server 10 of the quality management apparatus.

The database includes a factor selection history database 73 and a 4M database 74 which store the relationship between the defect name and the importance of the defect factor.

Here, the importance stored in the factor selection history database 73 indicates the degree of the effect of the factor on the failure phenomenon, and the frequency is taken into consideration. For example, there are four levels of “0, 1, 3, 5” including those that cannot be items.

The 4M database 74 includes materials (Material), devices (Machine), people (Man), and methods (Metho) as factors that may cause defects.
The management items are broadly classified from the viewpoint 4M of d).

The extracting means 70 checks the name of the defect occurring on the circuit board inputted from the input means such as the keyboard of the server 10 and the cause of the defect corresponding to its importance by checking the management reference database 32, the importance database 34 and the check. It has a function of reading out and extracting from the result database 35.

The display means 71 has a function of reading the details of the failure factor extracted by the extraction means 70 from the management reference database 32 and displaying the same on the monitor 50.

The significance updating means 72 updates the relationship between the failure name and the significance stored in the factor selection history database 73 for the failure factor whose details are displayed by the display means 71, that is, the detail display. Points are added to the cause of the failure that has been performed, and the degree of importance is changed according to the number of points added.

More specifically, the importance updating means 72 uses a direct addition method in which the points of the points are directly added to the importance, or an indirect addition method in which the points are added separately from the importance.

The importance updating means 72 has a function of adding points to the management items for which detailed display has been performed, and deducting points for factors other than the management items for which the addition has been performed. I have.

In the program memory 44, at least the name of a defect that affects the quality of the circuit board and the degree of importance that causes the name of the defect are input, and management items corresponding to the input defect name and the degree of importance are extracted. A quality management program for displaying the details of the extracted management item and updating the relationship between the defect name and the importance for the management item for which the detailed display is performed is stored.

Next, the operation of the apparatus configured as described above will be described with reference to the quality control flowchart of circuit board manufacturing shown in FIG.

First, in step # 50, a defect name "bridge" is selected as a search condition.

Next, in step # 51, importance is selected as a search condition, for example, an importance that may cause a bridge failure in a process in which a bridge has occurred, such as after a printing process, after mounting components, or after reflow. Here, for example, the importance levels “3” and “5” are selected.

Next, in step # 52, as a search condition, a process name such as after the printing process, after mounting components, after reflow, etc., is selected by the process name. For example, here, “after reflow” is selected.

Next, in step # 53, a check result is selected. The selection of the check result is for selecting whether or not a measure has been taken so as not to cause a defect. For example, it is selected for each applicable model. This check result is stored in the check result database 3
6 is recorded. The selection of the check result may be arbitrary, and is not selected here.

The items recorded in the check result database 36 are known from the check result database selection in step # 54.

In the selection of the factor selection history in step # 55, the past factor selection history is known. This factor selection history is
Stored in the factor selection history database 73, the strength of the relationship between the failure phenomenon and the management item can be determined.

The selection of the defect name in step # 50 and
The process name selection in step # 52 has been described above in the case where they are selected separately, but they may be selected from a combination of these selections. Thus, in the above example, “bridge generated after reflow” may be selected.

Next, when it is confirmed in step # 56 that a defect name has been input, the next step # 57
In, a 4M factor is selected as a search condition.

In step # 58, a list of failure factors corresponding to the importance levels "3" and "5" is displayed on the monitor 50 with respect to the bridge failure occurring after the reflow from the selected 4M.

By selecting this 4M, it is possible to reduce the specific time of the management item. It is also possible not to specify the 4M factor (select all).

It is also possible to input a check result from this list display, and the result is displayed in the check result database 36.
Will be recorded.

Here, “Material” and “Method” were selected as 4M.

Next, in step # 59, it is determined whether there are any items to be changed with respect to the search conditions, that is, the defect name, the process name, the weight of the factor, and 4M, and if it is desired to change, the steps # 50 to # 54 are again performed. To change the defect name, item, factor weight, and 4M.

If there is no change in the search condition, the management reference database 32 is selected in the next step # 60.

The management criteria database 32 stores criteria to be managed for each management item, as shown in FIG. 2 above.
It differs depending on the target product and the corresponding department. Therefore, as the management reference database 32, a database corresponding to the manufacture of the circuit board is selected.

As a result, the monitor 50 displays a list of the management items corresponding to the weights “3” and “5” of the factors relating to the material and the method with respect to the bridge failure occurring after the reflow.

Next, at step # 61, the monitor 5
A management item considered to be a management item is selected from a list of management items corresponding to the weights “3” and “5” of the management item of the bridge failure generated after reflow of the material and method indicated by “0”. .

When an item considered as a management item is selected from the list of management items, the display means 71 displays
In step # 63, details of the selected management item,
That is, the management reference stored in the management reference database 32 is read out and displayed on the monitor 50.

In this detailed display, in addition to the management criteria, a description of a failure phenomenon resulting from the management item is read from the management criteria database 32 and displayed on the monitor 50.

Here, for example, a method is selected from 4M which is a large classification, solder paste printing is selected from a middle classification, and a mask opening size is selected therefrom. Is displayed on the monitor 50.

Here, the importance updating means 72 adds points to the management items displayed in detail by the display means 71 in step # 62, and stores the added points in the factor selection history database 73. The importance is changed according to the added score.

This point can take an arbitrary value such as 0.1 point, 1 point, 10 points, etc. Here, 1 point is added.

If the opening size of the mask satisfies the management standard, it is considered that the opening size of the mask does not cause a bridge.
At 64, other management items are displayed.

If the opening size of the mask satisfies the criterion, the process proceeds to step # 65, where the result of checking the opening size of the mask is input and stored in the check result database 36.

On the other hand, if the opening size of the mask deviates from the reference, it is considered that this is the cause of the occurrence of the bridge.

As a result of taking this measure, if the bridge failure is reduced, it can be specified that one of the management items for the bridge failure is the size of the mask opening.

The operation of the importance updating means 72 will be described in detail. The importance updating means 72 adds a point to a point directly in the direct addition method or adds a point to a point separately from the importance. The indirect point addition method is used.

In the direct addition method, importance is added to a preset importance, and the importance is increased, for example, from four levels. In the list display of the management items for the failure phenomena, for example, by displaying the management items in order of importance, it is possible to increase the probability that the failure factor can be quickly reached for the corresponding failure phenomena.

Next, one point to be added and the importance “0, 1,
The relationship of "3, 5" can be set arbitrarily. For example, take the sub-point system, and the additional points
If the importance is increased when the score becomes a point, the learning point is added by one point by performing a detailed display for the management item "A" having the current importance of "3", for example.
When it totals 10 points, the management item "A"
Importance database 34 so that the importance of "4" becomes "4".
To update.

Next, the point system will be described. The above description is only about the point addition, but this only increases the importance. For example, if a permanent measure is taken for the management item, the failure phenomenon caused by the management item will be significantly reduced, but even in this case, the importance added in the past will not change. Become.

In terms of the system, the weight can be changed by an artificial review, but it is difficult to say that the relationship between the failure phenomenon and the degree of importance is changed in a timely manner, and a delay in the arrival time of the management item occurs. There is.

From such a fact, the importance updating means 72
Points are added to the management items for which detailed display has been performed, and points are deducted for management items other than the management items for which the addition has been performed.

The relationship between the additional points and the deduction points may be arbitrarily set. Here, an example will be described in which the number of points is smaller in the deduction points than in the additional points. For example, when the detailed display is performed, one point is added to the management item that has been described in detail, and for the other management items, for example, a deduction of 0.01 point is performed. In this case, when the detailed display is performed, for example, 100 times, the learning point is reduced by one point for the management item for which the detailed display has never been performed. This total is, for example, -10
When a point is reached, the importance is updated.

In the indirect point addition method, for example, as shown in FIG. 26, importance levels “0, 1, 3, 5” are stored in an initial point database 80, and added information is stored in a learning point database 81. .

In this indirect point addition method, the original importance (initial point) does not automatically change, but the learning point changes. By combining with the initial points, it becomes possible to reach the management item faster.

Further, there are four levels of initial points (importances initially set) of "0, 1, 3, 5", and the number of learning points is increased. , C, d, e..., The display order of the factor list is, for example, 5-e, 3-e, 1-e, 5-d, 3-
d, 1-d, 5-c,..., 5-e, 5-
.., 3-e, 3-d,..., etc., can be reached more quickly by customizing the sorting by sorting based on learning points. In some cases, it is advantageous.

As described above, according to the fourth embodiment, at least the name of a defect that affects the quality of a circuit board and the degree of importance that causes the name of the defect are input, and the entered defect name and importance are entered. The corresponding management item is extracted, and when the details of the extracted management item are displayed, the relationship between the defect name and the importance for the management item is updated using the direct addition method or the indirect addition method. Therefore, in the factor selection history database 73, the strength of the relationship between the failure phenomenon and the factor, that is, the degree of importance is constantly updated and stored. By selecting the factor selection history at the initial stage of displaying the management item, It is possible to shorten the time to reach a management item for which measures need to be taken.

In the method of counting the points added or subtracted from the learning points at the time of performing the detailed display, the factor selection history database 73 stores learning points indicating "what factors the user is interested in". Since the higher the number of learning points, the higher the number of learning points, the higher the user's interest or the fact that it is a management item for which countermeasures are taken. Is ". Further, since the database is updated so that a factor having a high learning point number can be selected and used for a search, it is possible to reach a factor having a high possibility of a defect cause more quickly.

(5) Next, a fifth embodiment of the present invention will be described with reference to the drawings. The same parts as those in FIG. 24 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 27 is a configuration diagram of a quality control device applied to the manufacture of a circuit board. This quality control device is
In this embodiment, an instruction issuing means 90 is added.

The instruction sheet issuing means 90 has a function of issuing an improvement instruction sheet for the cause of the defect for performing the detailed display when performing the detailed display. This instruction for improvement includes a report of an example of a defect improvement to a person concerned, a change of rules, and a thorough instruction.

The importance updating means 72 has a function of updating the relationship between the defect name and the importance when the instruction issuing means 90 issues an improvement instruction.

In the program memory 44, when detail display is performed, a process of issuing an improvement instruction for the cause of the failure for which the detailed display is performed, and the relationship between the defect name and the importance when the improvement instruction is issued is stored. A quality management program having a process of updating is added.

Next, the operation of the apparatus configured as described above will be described with reference to the quality control flowchart of circuit board manufacturing shown in FIG. In this quality control flowchart, since steps # 1 to # 63 are the same as the quality control flowchart shown in FIG. 25, detailed description thereof will be omitted.

The display of the details of the selected management item is displayed on the monitor 5.
When the display is output to 0, the instruction issuing unit 90 issues an instruction for improvement for the cause of the failure to be displayed in detail in step # 70.

Next, the importance updating means 72 executes step #
In 71, when an instruction for improvement is issued by the instruction issuing means 90, points are added using the direct addition method or the indirect addition method for the management item for which the detailed display is performed, and this additional point is used as a factor selection. History database 73
And the degree of importance is changed according to the added score.

As described above, according to the fifth embodiment, when the detailed display is performed, an improvement instruction for the management item for which the detailed display is performed is issued, and when the improvement instruction is issued, the management item is assigned to the management item. On the other hand, the relationship between the defect name and the importance is updated using the direct point addition method or the indirect point addition method. Reliability can be improved. Further, by making these operation rules, thorough management can be achieved.

The present invention is not limited to the above-described first to fifth embodiments, and various modifications can be made in the implementation stage without departing from the scope of the invention.

Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if some components are deleted from all the components shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the problem described in the column of the effect of the invention can be solved. In the case where a certain effect can be obtained, a configuration from which this configuration requirement is deleted can be extracted as an invention.

[0220]

As described above in detail, according to the present invention, it is possible to provide a product production method, a quality control method, and a quality control program capable of promptly improving defects.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a first embodiment in which a quality control device according to the present invention is applied to a case where electronic components are mounted on a printed wiring board to manufacture a circuit board.

FIG. 2 is a diagram showing recorded contents of various databases in the first embodiment of the quality management device according to the present invention.

FIG. 3 is a flowchart showing an input procedure of a check result input program in the first embodiment of the quality management device according to the present invention.

FIG. 4 is a flowchart showing a procedure for investigating a cause of a defect in the first embodiment of the quality management device according to the present invention.

FIG. 5 is a diagram showing contents displayed by a survey program in the first embodiment of the quality management device according to the present invention.

FIG. 6 is a configuration diagram showing a second embodiment of the quality management device according to the present invention.

FIG. 7 is a schematic view of the recorded contents of an inspection result database in a second embodiment of the quality management device according to the present invention.

FIG. 8 is a quality management flowchart according to the second embodiment of the quality management device according to the present invention.

FIG. 9 is a diagram showing a bar graph representing an inspection result in the second embodiment of the quality control device according to the present invention.

FIG. 10 is a configuration diagram showing a third embodiment of the quality management device according to the present invention.

FIG. 11 is a diagram showing a specific function of a tallying / analyzing unit in a third embodiment of the quality management device according to the present invention.

FIG. 12 is a diagram showing a display result of a defect specifying unit in the third embodiment of the quality management device according to the present invention.

FIG. 13 is a diagram showing a relationship between a failure in a failure tendency analysis means and a component type constituting a circuit board in a third embodiment of the quality management device according to the present invention.

FIG. 14 is a diagram showing a relationship between a failure in a failure tendency analysis unit and a location of a circuit board in which the failure has occurred in a third embodiment of the quality management device according to the present invention.

FIG. 15 is a diagram showing a relationship between a failure and a circuit board number in a failure tendency analysis means in the third embodiment of the quality control device according to the present invention.

FIG. 16 is a diagram showing a relationship between a position on a part where a defect has occurred and a defect in a defect trend analysis unit in a third embodiment of the quality management apparatus according to the present invention.

FIG. 17 is a diagram showing a relationship between a defect and a direction in which the defect is generated by a defect tendency analysis unit in the third embodiment of the quality management device according to the present invention.

FIG. 18 is a quality control flowchart for manufacturing a circuit board in a third embodiment of the quality control device according to the present invention.

FIG. 19 is a diagram showing each judgment criterion preset for each tabulation result in the third embodiment of the quality management device according to the present invention.

FIG. 20 is a schematic diagram of an analysis result database in the third embodiment of the quality management device according to the present invention.

FIG. 21 is a flowchart for determining an analysis result in the third embodiment of the quality management device according to the present invention.

FIG. 22 is a diagram showing an analysis result of a failure tendency analysis unit when a bridge failure has occurred in a circuit board in the third embodiment of the quality control device according to the present invention.

FIG. 23 is a view showing an example of a display screen of a cause of a defect in the quality management device according to the third embodiment of the present invention.

FIG. 24 is a configuration diagram showing a fourth embodiment of the quality management device according to the present invention.

FIG. 25 is a quality management flowchart according to a fourth embodiment of the quality management device according to the present invention.

FIG. 26 is a diagram for explaining an indirect point-adding method in a fourth embodiment of the quality management device according to the present invention.

FIG. 27 is a configuration diagram showing a fifth embodiment of the quality management device according to the present invention.

FIG. 28 is a quality management flowchart according to a fifth embodiment of the quality management device according to the present invention.

[Explanation of symbols]

 10: Server 12: Checking terminal 14: Investigation terminal 16: LAN 32: Management reference database 34: Importance database 36: Check result database 37: Stage database 38: Failure database 40: Inspection result database 41: Recording means 42: Analysis means 43: Display means 44: Program memory 50: Monitor 52: Button 60: Totaling / analysis means 61: Relevance recording means 62: Display means 63: Analysis result database 64: Failure identification means 65: Failure trend analysis means 70: Extracting means 71: Display means 72: Importance updating means 73: Factor selection history database 74: 4M database 80: Initial point database 81: Learning point database 90: Instruction book issuing means

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Nobuyuki Nakajima 8 Shinsugita-cho, Isogo-ku, Yokohama-shi, Kanagawa Prefecture Inside Toshiba Electronic Engineering Co., Ltd. (72) Tadao Otani 33-33 Shinisogo-cho, Isogo-ku, Yokohama-shi, Kanagawa Inside the Toshiba Production Technology Center (72) Inventor Yoichiro Maehara 33, Shinisogo-cho, Isogo-ku, Yokohama-shi, Kanagawa Prefecture F-term (reference) 3C100 AA70 BB12 BB13 BB27 BB33 CC01 CC08 CC11 EE07

Claims (9)

[Claims] 1. A step of setting a management item for managing the quality of an article; and a step of setting a predetermined management criterion that defines a state of the management item for each of the management items in order to manage the quality. Setting a degree of importance for each of the management items based on the degree of influence on the quality; and checking the management items based on the management criteria set for the management items, and checking the check result. A step of inputting in association with the management item; a step of producing the product; a step of displaying the management item, the importance and the check result; and a quality of the product based on the displayed content. A method for producing a product, comprising: a step of improving; 2. A step of setting a management item for managing the quality of the article; and a step of setting a predetermined management criterion for defining a state of the management item for each of the management items in order to manage the quality. Setting a degree of importance for each of the management items based on the degree of influence on the quality, and checking the management items based on the management criteria set for the management items, and checking the check result. A quality management method comprising: a step of inputting in association with the management item; and a step of displaying the management item, the importance, and the check result. 3. The quality management method according to claim 2, wherein the management items include factors that occur in a product planning stage, a design stage, and a production stage. 4. A step of performing a check of the management item based on a management criterion that is set for each management item for managing the quality of the article and that defines a state of the management item; and a result of the check. Inputting the management item in association with the management item; anddisplaying the importance level relatively set for each management item based on the degree of influence on the quality together with the management item and the result of the check. A quality control method comprising: 5. A detecting step of detecting a state of a management item for managing the quality of the product by using a sensor provided in a product manufacturing apparatus, and the management for managing the quality of the product. A checking step of setting the management item, which is set for each item, and checking the management item detected by the sensor based on a management standard that defines the state of the management item, and associating the check result with the management item. Inputting, and displaying, with the management item and the result of the check, a degree of importance that is relatively set for each of the management items based on the degree of influence on the quality. Quality control method. 6. A step of producing an article, a step of summing up the information of the defect with respect to an article having a defect among the articles by a predetermined method, and a result of the counting and an evaluation standard corresponding to the predetermined method. Judging the necessity of a measure based on, and, when the measure is required, comprising a step of displaying a management item corresponding to the defect and its importance, wherein the importance to be displayed is the management item In addition to the importance database that stores the management item in association with the importance of the defect, the relevance set in accordance with the predetermined method used for the aggregation is referred to, and the relevance is determined by the importance. Product production method characterized by giving priority to the degree. 7. A step of recording at least information of a product in which a defect has occurred and a name of a defect occurring in the product, and a step of totalizing a relationship between the recorded defect name and information of a plurality of the products. And comparing the result of these aggregations with each of the judgment criteria set in advance for each of the aggregation results. Recording the degree of relevance representing the degree of influence on the failure occurrence for the management item that causes the failure; and simultaneously managing the management item associated with the failure and the management criteria of the management item and the degree of relevance. Displaying, and
A quality control method comprising: 8. A step of inputting at least a defect name affecting the quality of the article, a step of extracting a management item associated with the input defect name, and displaying details of the extracted management item. And adding and subtracting learning points to the management items displayed in detail, and changing the relative importance of the management items to other management items according to the points of the learning points. And a quality control method comprising: 9. A first process for inputting at least a defect name affecting the quality of an article, a second process for extracting a management item associated with the input defective name, and A third process of displaying the details of the management item; and adding or subtracting learning points to the management item displayed in detail, and performing other management items of the management item according to the number of learning points. And a fourth process for changing the relative importance of the quality control program.