JP2002201457A - Easily removable curable adhesive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive excellent in high adhesion properties (imparting high adhesion to an adherend when used for a laminated product), easy removability (permitting ready removal of the adherend from the laminated product after treated without adhering to the adherend removed to easily submit the adherend to recycle (reuse)) and other characteristics. SOLUTION: The easily removable curable adhesive comprises as an effective ingredient a crosslinkable polymer having a viscosity at 25 deg.C before cure of 15-100,000 mPa.s and a glass transition temperature after cure more than 30 deg.C lower than the removal temperature.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an easily peelable curable adhesive which can be peeled off by heating. Specifically, it is excellent in applicability to an adherend before curing, and excellent in adhesiveness after curing, and is easy to use a light and / or thermosetting resin as an active ingredient. The present invention relates to a peelable curable adhesive.

[0002]

2. Description of the Related Art Laminates formed by laminating an adhesive on an adherend are widely used in automobile articles, office supplies, home electric appliances, building materials, electronic products and the like. Recently, in order to recycle (reuse) the adherend, an adhesive capable of separating the adherend from the laminate has been required.
In JP-A-119169, an adhesive made of a thermoplastic resin such as methacrylic resin is proposed, and a laminate using the adhesive is heated or irradiated with electromagnetic waves to reduce the adhesive force of the adhesive. It is reported that one can be recovered on the adherend

[0003]

However, when the present inventors tried to peel off the adherend by heating the laminate composed of an adhesive containing a thermoplastic resin as an active ingredient, the adherend was easily removed. However, the adhesive became viscous and remained on the adherend, and the problem that the adhesive was not sufficiently peeled off to reuse the adherend became clear. An object of the present invention is to provide a high adherence to an adherend when using a laminate (high adhesiveness), to allow the adherend to be easily separated from the laminate after treatment, An object of the present invention is to provide an adhesive excellent in properties such as being easily recyclable (reusable) without hardly attaching the adhesive to a body (easily peelable).

[0004]

Means for Solving the Problems In order to solve the above problems, the present inventors have conducted intensive studies on an adhesive containing a resin as an active ingredient. As a result, the adhesive has a specific viscosity before curing and has a specific viscosity after curing. The present inventors have found that a crosslinkable polymer having a specific glass transition temperature is an adhesive excellent in high adhesiveness and easy peelability, and completed the present invention. That is, the present invention
The viscosity at 25 ° C before curing is 15-100,000 mPa
s, which is an easily peelable curable adhesive characterized in that a crosslinkable polymer whose glass transition temperature after curing is lower than the peeling temperature by 30 ° C. or less is used as an active ingredient.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. The crosslinkable polymer of the present invention is a polymer that is a melt that can be applied before bonding, and that becomes a three-dimensional polymer after bonding and intramolecular crosslinking. The viscosity of the crosslinkable polymer at 25 ° C. before curing is 15 to 100,000 m
It is a polymer having a Pa · s and a glass transition temperature after curing of 30 ° C. or less lower than the heating temperature at the time of peeling. Among them, the viscosity at 25 ° C. before curing is 1
A crosslinkable polymer of from 00 to 80,000 mPa · s is preferred.
If the viscosity is out of the range of 15 to 100,000 mPa · s, it is not preferable because the workability during coating and the smoothness of the obtained adhesive tend to decrease.

The glass transition temperature of the crosslinkable polymer after curing is 30 ° C. or lower than the peeling temperature. Here, the peeling temperature is a temperature at which the easily peelable adhesive reaches when the adherend is peeled to be reused from the laminate composed of the easily peelable adhesive of the present invention and the adherend. is there. Since the peeling temperature is usually about 70 to 200 ° C., the glass transition temperature after curing of the crosslinkable polymer is usually 4
About 0 to 170 ° C., preferably 60 to 120 ° C.
It is about. When a plurality of easily peelable adhesives are laminated and used, the glass transition temperature is the glass transition temperature of the lowest easily peelable adhesive, and a plurality of easily peelable adhesives are mixed and used. If so, the glass transition temperature is the glass transition temperature of the mixed easily peelable adhesive. Unless the glass transition temperature is lower than 30 ° C. or lower than the heating temperature at the time of peeling, the adherend tends to be difficult to peel easily by heating, which is not preferable.

The preferred glass transition temperature of the crosslinkable polymer after curing depends on the heat-resistant temperature of the adherend to be reused. Specifically, the adherend to be reused is made of a metal such as aluminum or iron or glass. In the case of a material having a high heat resistance such as, for example, the glass transition temperature after curing of the crosslinkable polymer is preferably about 120 to 170 ° C., and the adherend to be reused is a plastic such as polycarbonate resin or vinyl chloride. If it is a material with low heat resistance such as wood or wood,
About 70 to 100 ° C is preferable.

Further, the toluene-insoluble content of the crosslinked polymer after curing is usually about 80% or more. Here, as a method for measuring the toluene insoluble content, for example, the insoluble content obtained by immersing the cured crosslinkable polymer in 500 ml of toluene for 48 hours and then filtering and collecting the insoluble content through a 200 mesh wire net can be obtained. Examples of such a crosslinkable polymer include a photocurable resin and a thermosetting resin.

Here, the photo-curable resin usually includes a photo-curable oligomer and / or monomer;
It is a resin containing a photopolymerization initiator. Examples of the oligomer and / or monomer having photocurability include an oligomer and / or monomer having at least one unsaturated carbon-carbon bond capable of photoradical polymerization, and a molecular terminal capable of photo Michael addition polymerization. Examples include a combination of an oligomer having a double bond and a polythiol, and an alicyclic epoxy compound capable of photocationically polymerizing. Among them, it is preferable to use an oligomer and / or a monomer having at least one unsaturated carbon-carbon bond.

As the oligomer having an unsaturated carbon-carbon bond, an oligomer having at least one kind of unsaturated group selected from an acryloyl group, a methacryloyl group, a vinyl group and the like is usually used. Specifically, urethane acrylates, urethane acrylates such as urethane methacrylate, epoxy acrylates, epoxy acrylates such as epoxy methacrylate, polyester acrylates, polyester acrylates such as polyester methacrylate, melamine acrylate, melamine acrylates such as melamine methacrylate, Acrylic resin acrylates, unsaturated polyesters and polyenes are exemplified.

As the urethane acrylates, for example, those obtained by reacting an organic polyisocyanate, a polyol and a hydroxy acrylate compound, etc., are obtained by reacting an organic polyisocyanate and a hydroxy acrylate compound. It may be something. Examples of epoxy acrylates include those obtained by reacting acrylic resin and / or methacrylic acid with an epoxy resin such as a bisphenol A epoxy resin and a novolak type epoxy resin. As polyester acrylates, for example,
Examples thereof include those obtained by reacting acrylic acid and / or methacrylic acid with a polyester polyol synthesized from a polyhydric alcohol and a polycarboxylic acid.
As melamine acrylates, for example, melamine,
Examples thereof include those obtained by subjecting melamine resin obtained by condensation polymerization of urea, benzogamine or the like with formalin or the like to a dealcoholation reaction with β-hydroxyethyl acrylate or the like. As acrylic resin acrylates, for example, carboxylic acid groups, hydroxyl groups, contained in acrylic resin,
Examples thereof include those obtained by reacting acrylic acid and / or methacrylic acid with a functional group such as a glycidyl group. Examples of unsaturated polyesters include those obtained by reacting a polyol with an α, β-unsaturated dicarboxylic acid such as fumaric acid and maleic anhydride. Examples of the polyenes include those obtained by reacting an organic polyisocyanate with allyl alcohol and / or vinyl alcohol.

On the other hand, the monomer having an unsaturated carbon-carbon bond is usually at least one kind of unsaturated group-containing monomer selected from monofunctional acrylic monomers, polyfunctional acrylic monomers, vinyl group-containing monomers and the like. Monomers and the like are used.

As the monofunctional acrylic monomers, compounds containing one acrylate group or methacrylate group in the molecule are usually used, and specific examples thereof include isobornyl acrylate, isobornyl methacrylate, and dicycloalkyl methacrylate. Monomers having a ring structure such as pentenyl acrylate, dicyclopentenyl methacrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, phenyl acrylate, phenyl methacrylate, benzyl acrylate and benzyl methacrylate, and 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate , 3-hydroxypropyl acrylate, 3-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate,
-Hydroxybutyl methacrylate, 2-hydroxy-
Examples include monomers having a hydroxyl group such as 3-phenoxypropyl acrylate and 2-hydroxy-3-phenoxypropyl methacrylate. Further, monofunctional acrylic monomers in which the raw material alcohol or phenol in the above-mentioned monomers having a ring structure is modified with an alkylene oxide in advance can also be used.
Particularly, a modified product of alkylene oxide having 2 to 3 carbon atoms is preferable, and examples thereof include dicyclopentenyloxyethyl acrylate, dicyclopentenyloxyethyl methacrylate, phenyloxyethyl acrylate, and phenyloxyethyl acrylate.

As the polyfunctional acrylic monomers, compounds containing two or more acrylate groups or methacrylate groups in the molecule are usually used.
Examples of the acrylate group-containing compound include polyethylene glycol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, neopentyl glycol hydroxypivalic acid diacrylate, caprolactone-modified neopentyl glycol hydroxypivalic acid diacrylate, and trimethylol. Examples include propane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, caprolactone-modified dipentaerythritol hexaacrylate, and tris [acryloxyethyl] isocyanate.

Examples of the vinyl group-containing monomers include vinyl esters such as vinyl acetate, vinyl propionate and branched fatty acid vinyl; aromatic vinyls such as styrene, chlorostyrene, alkylstyrene and divinylbenzene;
Nitrogen-containing vinyls such as N-vinylpyrrolidone and N-vinylcaprolactam.

The oligomer and / or monomer having photocurability include, for example, one or more monomers,
One or more kinds of oligomers, a mixture of one or more kinds of monomers and one or more kinds of oligomers, and the like may be mentioned.
It is preferred to use a mixture of more than one oligomer and one or more monomers.

The photopolymerization initiator contained in the photocurable resin includes, for example, carbonyl compounds, sulfur compounds, azo compounds, peroxides and the like. Among them, carbonyl compounds are preferred, and specifically, benzophenone, benzyl, Michler's ketone, 2-chlorothioxanthone,
2,4-diethylthioxanthone, benzoin ethyl ether, diethoxyacetophenone, benzyldimethyl ketal, 2-hydroxy-2-methylpropiophenone, 1-hydroxycyclohexyl phenyl ketone,
2,2-dimethoxy-1,2-diphenylethane-1-
On, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, and 2,
Carbonyl compounds that absorb ultraviolet light, such as 4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine; camphorquinone;
And carbonyl compounds that absorb visible light, such as ketocoumarin.

As the photopolymerization initiator, two or more photopolymerization initiators may be used. In addition, the photocurable resin, if necessary, N, N-dimethylaminoacetophenone, pN,
A photopolymerization initiation aid such as ethyl N-dimethylbenzoate or a photosensitizer may be contained. The amount of the photopolymerization initiator used in the photocurable resin is based on 100 parts by weight of the photocurable oligomer and / or monomer.
Usually, it is about 0.5 to 20 parts by weight.

As the photocurable resin, for example, “Sumiflash XR-235, XR-98” (photocurable resin manufactured by Sumitomo Chemical Co., Ltd.), “DAICURE SD170”
A commercially available photocurable resin such as “0” (photocurable resin manufactured by Dainippon Ink and Chemicals, Inc.) may be used.

Examples of the thermosetting resin used as the crosslinkable polymer of the present invention include novolak resin, resol resin, urea resin, melamine resin, alkyd resin, imide resin, urethane resin, epoxy resin, Modified silicone resins, such as silyl group-terminated polyethers into which silyl groups have been introduced, unsaturated polyester resins, and the like, among which epoxy resins are preferred.

Here, the epoxy resin will be described in detail. The epoxy resin contains a main agent containing an epoxy group and a curing agent, and is usually not cured when the main agent and the curing agent are mixed. It has a viscosity that allows it to be applied to an adherend even if it is partially cured, and includes a resin cured after bonding. Examples of the main agent include glycidyl ether epoxy resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, and brominated epoxy resin; butadiene, pentadiene, vinylcyclohexene, An alicyclic epoxy resin in which a double bond such as cyclopentyl ether is epoxidized; a polyglycidyl compound obtained by reacting a polyol, a hydroxyl group-containing silicon resin or the like with epihalohydrin; N, N-diglycidylaniline, tetraglycidyldiaminodiphenylmethane; Triglycidyl-p-
Glycidylamine resins such as aminophenol; glycidylester resins such as diglycidyl phthalate, diglycidyl tetrahydrophthalate, diglycidyl hexahexaphthalate, and diglycidyl-p-oxybenzoic acid. It should be noted that two or more types of main agents may be used as the main agent. As the main agent,
Among them, glycidyl ether-based epoxy resins and glycidylamine-based resins are preferred, and bisphenol A-type epoxy resins are particularly preferred.

The curing agent contained in the epoxy resin includes, for example, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenediamine, diethylaminopropylamine, piperidine, N-
Aliphatic polyamines such as aminoethylpiperazine, mensendiamine, m-xylenediamine; 2- (dimethylaminomethyl) phenol, bis (dimethylaminoethyl)
Dimethylaminoalkylphenols such as phenol and 2,4,6-tris (dimethylaminomethyl) phenol; aromatic amines such as methanephenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, trimetic anhydride, ethylene glycol bis (anhydrotrimethylene) Acid anhydrides such as glycerol tris (anhydrotrimellitate), pyromellitic anhydride, maleic anhydride, and tetrahydrophthalic anhydride; polyaminopolyamide which reacts polyamine with dimer acid; 2-methylimidazole, 2-ethyl Imidazoles such as -4-methylimidazole and 2-undecylimidazole; boron trifluoride-amine complexes; dicyandiamide; aromatic diazonium salts; and polysulfides. Incidentally, two or more kinds of curing agents may be used as the curing agent. As the curing agent, dimethylaminoalkylphenols and polyaminopolyamide are particularly preferable.

As the epoxy resin, for example, "Araldite Rapid" (epoxy resin manufactured by Ciba Specialty Chemicals), "ER-10" (epoxy resin manufactured by NSC), and "Bond Quick 5" (epoxy resin manufactured by Konishi) A commercially available epoxy resin for an adhesive such as "EP-330" (epoxy resin manufactured by Cemedine) may be used.

The crosslinkable polymer of the present invention may contain another resin as long as the adhesiveness and the easy releasability are not impaired. Examples of these resins include polymerizable double bond-containing monomers such as unsaturated polyesters and prepolymers thereof; polybutadiene, maleated butadiene, epoxidized butadiene, maleated butadiene, butadiene-acrylonitrile copolymer and its carboxyl group-containing copolymer. Resin, polychloroprene, maleated butadiene, butadiene-acrylonitrile copolymer and its carboxyl group-containing resin, polychloroprene, butadiene-styrene copolymer, polyisoprene, butyl rubber,
Low molecular weight liquid to high molecular weight elastomers such as fluororubber and natural rubber; polyethylene, polypropylene, polybutene, poly-4-methylpentene, polystyrene, AS resin, MBS resin, ABS resin, polyethylene-propylene copolymer, tetrafluoroethylene- Hexafluoropropylene copolymers; polycarbonate, polyphenylene ether, polysulfone, polyester, polyimide,
Examples thereof include high molecular weight polymers such as polyphenylene sulfide and low molecular weight prepolymers or oligomers thereof; polyurethane; polyfunctional maleimides; and polyvinyl alcohol having gas barrier properties.

In addition, inorganic and organic fillers, dyes, pigments, thickeners, defoamers, dispersants, flame retardants, brighteners, thixotropic agents, adhesion promoters, water absorbing agents, and A surface conditioner such as an activator, an ultraviolet absorber, an antioxidant, an additive such as an antioxidant and an antistatic agent, and a solvent such as toluene and methanol may be blended. Further, a thermosetting resin and a photocurable resin may be mixed and used as the crosslinkable polymer.

The easily peelable curable adhesive of the present invention includes:
For example, a photo-curable resin alone, a thermo-curable resin alone, a photo-curable resin and a thermo-curable resin laminated, or a photo-curable resin / thermo-curable resin / photo-curable resin laminated sequentially. And the like. Among them, thermosetting resin alone,
What is obtained by laminating a photocurable resin and a thermosetting resin,
And a layer obtained by sequentially laminating a photocurable resin / a thermosetting resin / a photocurable resin, and in particular, a laminate in which a photocurable resin is in contact with an adherend to be reused is preferable.

The easily peelable curable adhesive of the present invention may contain, if necessary, an organic solvent, a viscosity modifier such as a thickener, a film forming aid, a surfactant, a defoaming agent, a plasticizer, and an ultraviolet ray. A compounding agent such as an absorbent, a penetrant, a crosslinking agent, an antistatic agent, a polymerization inhibitor, an adhesion promoter, a surface conditioner, an antioxidant, and a silane coupling agent may be contained. The viscosity of the photocurable resin and / or the thermosetting resin before curing is a value measured after adding an organic solvent and a viscosity modifier.

The laminate of the present invention is obtained by laminating the easily peelable curable adhesive thus obtained and an adherend. As the material of the adherend, for example, iron, steel, gold,
Metals and alloys such as silver, copper, zinc, tin, and aluminum; inorganic substances such as glass, gypsum, porcelain, and ceramic; plastics such as polyolefin, polycarbonate, polystyrene, polyester, polyacetal, ABS, and rubber;
Cotton, hemp, viscose rayon, cellulose acetate, wood,
Examples include cellulose products such as paper, and polyamino acids such as leather, silk, and wool. Among them, metal, glass, and plastic are preferable. Examples of the shape of the adherend include molded articles such as films, sheets, and structures; and woven products such as synthetic fibers, natural fibers, and cloth. The adherend to be reused used in the present invention usually has higher heat resistance than the heating temperature at the time of peeling.

The laminate of the present invention includes, for example, a reusable adherend / an easily peelable hardening type adhesive / a reusable adherend, a reusable adherend / an easily peelable hardening type Adhesives / adherends that are not reused. Further, an adhesive such as an easily peelable curable adhesive and an adherend may be further laminated on the surface of the adherend in the laminate of the present invention.

The method for producing a laminate of the present invention is exemplified by a laminate in which an easily peelable curable adhesive is formed by sequentially laminating a photocurable resin, a thermosetting resin, and an adherend on an adherend. Then, after applying to the adherend by a method using an applicator such as a roll coater coating, a spray coating, a blade coater coating, a screen coating, or a method using a spin coater, ultraviolet light, visible light, radiation, etc. A method of irradiating with a light beam to cure, followed by applying a thermosetting resin by a similar method, laminating the other adherend, and heating and curing as necessary, may be mentioned. Above all, as a light beam used for curing the photocurable resin, an ultraviolet ray is preferable, and as a light source, for example, a low-pressure or high-pressure mercury lamp, a metal halide lamp, a xenon lamp, or the like is used.

As a method for peeling and recovering the adherend from the laminate in the present invention, for example, the laminate is heated to a temperature 30 ° C. or more higher than the glass transition temperature of the adhesive used, and And the like. Specifically, a method of heating and then peeling using a flame such as a burner; a method of heating using an oven, a heating furnace, etc., and then peeling immediately in or out of the furnace; using a hot press Method of peeling after heating with steam; method of peeling after heating using steam;
After immersing the laminate in a heating solvent such as hot water and heating,
A method in which the laminate is taken out while it is immersed, or the laminate is taken out, and the like is used.

As the method of reuse in the present invention, for example, a method of reusing the adhered material that has been peeled off and recovered, or when the adherend is metal, glass, plastic, or the like, use by melting and molding. And the like. Above all, it is preferable to reuse the adhered material that has been separated and recovered.

[0033]

EXAMPLES The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the invention is limited thereto. Parts and percentages in the examples are on a weight basis unless otherwise specified.

<Adherend> The following test pieces were used as the adherend. A: Cold rolled steel plate 25 mm x 100 mm, thickness 0.8 mm (JIS G 3141 bright finish) B: Polycarbonate (PC) plate 25 mm x 100 mm, thickness 2 mm (Takiron 1600, manufactured by Takiron Co.) C: Aluminum (AL) plate 25mm x 100mm, thickness 1mm (A1050P HB mirror finished product manufactured by Sumitomo Light Metal Co., Ltd.) D: PVC tile (Tajima “Seiden tile No. 1”)

<Easily peelable lower adhesive> Photocurable resin "Sumiflash XR-98" / Tg: about 6
0 ° C., viscosity: 58 mPa · s (trade name; manufactured by Sumitomo Chemical Co., Ltd.)
(Hereinafter referred to as “XR98”) Epoxy thermosetting resin “ER-10” / Tg: about 50
° C, viscosity: 57,000 mPa · s Liquid A (epoxy resin) 73200 mPa · s, liquid B (curing agent)
Is 45000 mPa · s, the viscosity of ER-10 is
It was determined from the logarithmic average of solution A and solution B. (Product name: Japan NS
C, hereinafter referred to as "ER10")

<Adhesion test> Each end of the adherend was
Contact with a contact area of 25 mm × 20 mm (= 500 mm ² )
The adhesive strength between the adherends before heating (before the peeling treatment) was measured by a tensile test according to IS K 6849.

Example 1 A cold-rolled steel sheet (A) was used as an adherend to be reused, and one side thereof was subjected to a degreasing treatment in accordance with JIS K6848.
98 "was applied by a spray coat to a thickness of about 30 μm, and was cured by UV irradiation at an irradiation amount of 400 mJ. Further, after applying "ER10" to one side of the PC board (B) by a bar coat so as to have a thickness of about 50 μm, immediately apply the adhesive between (A) and (B) to each other. Were stacked and bonded, sandwiched between clips, and allowed to stand at 40 ° C. for 48 hours to complete a laminate. When the laminate was subjected to an adhesion test of 1 N / mm ² , the adherend did not peel at all.
After heating the obtained laminate in an oven at 90 ° C. for 5 minutes, the laminate was easily peelable by hand. The adherend to be reused (A) has no adhesion of the adhesive, and all (B)
Adhered to the surface.

Example 2 An AL plate (C) was used as an adherend to be reused, and one surface thereof was subjected to a degreasing treatment according to JIS K 6848. Next, "ER10" is placed on one side of the PC board (B).
Is coated with a bar coat so as to have a thickness of about 50 μm, and then the surface degreased (C) and the surface coated with the adhesive (B) are immediately superimposed on each other and bonded together with a clip. The laminate was left standing at 40 ° C. for 48 hours to complete the laminate. When the laminate was subjected to an adhesion test of 1 N / mm ² , the adherend did not peel at all. After heating the obtained laminate in an oven at 150 ° C. for 5 minutes, the laminate was easily peelable by hand. The adherend (C) to be reused had no adhesive attached at all, and all adhered to the surface of (B).

(Example 3) A laminate was completed in the same manner as in Example 2 except that a PVC tile plate (D) was used instead of the PC plate (B) in Example 2. 1 N / m
adherend be carried out adhesion test of m ² was not at all peeled off. After heating the obtained laminate in an oven at 150 ° C. for 5 minutes, the laminate was easily peelable by hand. The adherend (C) to be reused has no adhesion of the adhesive at all,
It adhered to the surface of (D).

(Comparative Example 1) Even if the laminated laminate prepared in the same manner as in Example 2 was subjected to a heat treatment in a 70 ° C. oven for 5 minutes and then subjected to an adhesion test of 1 N / mm ^2. The adherend did not peel at all.

Comparative Example 2 An AL plate (C) was used as an adherend to be reused, and one surface thereof was subjected to a degreasing treatment according to JIS K 6848. Next, "ER10" was applied to one side of a PVC tile plate (D) by a bar coat so as to have a thickness of about 50 μm, and immediately the degreased surface of (C) and the adhesive of (D) were applied. The coated surface was overlaid and bonded, sandwiched between clips, and allowed to stand at 40 ° C. for 48 hours to complete a laminate. When the laminate was subjected to an adhesion test of 1 N / mm ² , the adherend did not peel at all. After heating the obtained laminate in an oven at 70 ° C. for 5 minutes, the adherend did not peel off at all even when an adhesion test of 1 N / mm ² was performed.

[0042]

According to the present invention, since the laminate has high adhesiveness and the adherend can be easily recovered from the laminate after heating, the adhesive of the present invention Articles requiring reuse of adherends, such as refrigerators, washing machines,
Home appliances such as air conditioners, microwave ovens, vacuum cleaners, TVs,
Used to bond electronic parts such as cabinets such as desks, cabinets, personal computers, printers, copiers, telephones, automobile parts such as bumpers, furniture and other structures, liquid crystal panels, semiconductors, printed wiring boards and integrated circuits. obtain.

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 4F100 AA01C AB01C AB03 AJ04C AK01A AK01B AK01C AK35C AK53A BA02 BA03 BA10A BA10C EH462 JA05A JB13A JB13B JB14A JL14A JL14B 4J040 EB032 EB112E EB112B EB112E EB112B

Claims (11)

[Claims] (1) a viscosity at 25 ° C. before curing is 15 to 100,
000 mPa · s, and the glass transition temperature after curing is
An easily peelable curable adhesive comprising a crosslinkable polymer having a temperature lower than the peeling temperature by 30 ° C. or less as an active ingredient. 2. A peeling temperature of 70 to 200 ° C. and a glass transition temperature of the crosslinkable polymer after curing of 40 to 170 ° C.
The easily peelable curable adhesive according to claim 1, wherein: 3. A photocurable resin and / or a crosslinkable polymer,
3. The easily peelable curable adhesive according to claim 1, which is a thermosetting resin. 4. 4. The easily peelable curable adhesive according to claim 1, wherein the crosslinkable polymer is an epoxy resin. 5. The easily peelable curable adhesive according to claim 1, wherein the crosslinkable polymer is an adhesive obtained by sequentially laminating a photocurable resin and a thermosetting resin. Agent. 6. A laminate obtained by laminating an easily peelable curable adhesive according to claim 1 and an adherend. 7. The laminate according to claim 6, wherein the material of the adherend is at least one selected from inorganic materials, plastics, cellulose products, and polyamino acids. 8. The laminate according to claim 6, wherein the easily peelable curable adhesive in contact with the adherend is a photocurable resin. 9. The laminate according to claim 6, wherein the laminate is a laminate obtained by sequentially laminating an adherend, a photocurable resin, and a thermosetting resin. . 10. A method for bonding an adherend, comprising using the easily peelable curable adhesive according to claim 1. 11. A method according to claim 6, wherein the laminate is heated to a temperature of 30 ° C. or higher than the lowest glass transition temperature of the easily peelable adhesive contained in the laminate. How to remove the body.