JP2002198383A - Method and equipment for fabricating electronics component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and equipment for fabricating an electronics component, in which the electronic component is fabricated without leaving bubbles or voids in a liquid resin and with high reliability even in the case a small size electronic component is fabricated. SOLUTION: The method comprises an encapsulation process S10 for encapsulating the electronics component mounted on a substrate, a pressurization process S12 for making the substrate mounted with the electronic component encapsulated with the liquid resin into a pressurized state, a heating pressurization process S13 for extinguishing remaining voids in the liquid resin by making the substrate into a heated pressurized state by heating the substrate under a pressurized state, and a hardening process S16 to harden the liquid resin by making the substrate into a heated state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing an electronic component, and more particularly, to a mobile phone, a wristwatch, an IC (Integer).
The present invention relates to a method and an apparatus for manufacturing an electronic component used for applications requiring small size, light weight and robustness, such as a card, an electronic desk calculator, and a digital camera.

[0002]

2. Description of the Related Art In recent years, the importance of portability of various information terminal devices such as mobile phones has been emphasized, and miniaturization and weight reduction have been achieved. Cards such as bank credit cards and commuter passes that are generally used at present generally record information magnetically. However, from the perspective of preventing leakage or tampering of personal information, theft or tampering of information will be attempted in the future. It is considered that IC cards, which are difficult to use, are widely used. Various types of semiconductor elements are built in these information terminal devices and IC cards. However, since the external shape of the information terminal devices and IC cards is limited, the external dimensions of the built-in semiconductor elements are small and light. Weight is reduced. Further, the information terminal device and the IC card carried by the user are required to be not only compact and weighing but also robust. Furthermore, semiconductor devices in general are required to have high reliability with little change over time.

As a technique for realizing high reliability of a semiconductor element, for example, a technique disclosed in Japanese Patent Application Laid-Open No. Hei 1-207935 has been devised. In this publication, a semiconductor element is mounted on a substrate, an electrode formed on the semiconductor element and an electrode formed on the substrate are connected by bonding, and sealed with a liquid resin made of an epoxy resin having a chlorine content of 500 ppm or less. After that, a technique is disclosed in which a semiconductor chip is sealed by curing a resin while applying pressure to about 0.1 to 5.0 kg / cm ³ . Through these steps, it is possible to suppress the generation of microscopic bubbles generated before or during the curing of the resin, and to improve the adhesion between the resin and the filler, thereby preventing corrosion of aluminum wiring of the semiconductor chip due to intrusion of moisture. The reliability is improved by preventing the insulation from lowering.

[0004]

By the way, there are various methods for sealing a semiconductor chip with a liquid resin, and a stencil in which holes are formed in accordance with the position of the semiconductor chip mounted on the substrate, A printing sealing method using a squeegee sliding on a stencil has been devised by the applicant and the like. In this method, the squeegee is slid while the liquid resin is dropped on the stencil, thereby filling the holes formed in the stencil with the liquid resin and printing the liquid resin on the substrate. Since the stencil holes are formed according to the position of the semiconductor chip,
The semiconductor chip is sealed by printing.

[0005] When the printing and sealing method is performed under atmospheric pressure, it is inevitable that air is entrained in the liquid resin when the squeegee moves to fill the holes with the liquid resin. Therefore, bubbles remain in the liquid resin filled in the holes. Therefore, when the printing sealing method is used under atmospheric pressure, after printing the liquid resin on the substrate, a step of removing the air bubbles remaining in the liquid resin by arranging the substrate in a vacuum container and reducing the pressure. Needed.

In order to solve the above problems, the applicant has devised a technique for printing a liquid resin under a vacuum atmosphere (under reduced pressure). Even if the squeegee is moved under reduced pressure, air does not get caught in the liquid resin, so it is considered that the problem when printing under atmospheric pressure can be solved. By the way, when printing is performed under reduced pressure, voids may be generated in the liquid resin. Here, the void is a hollow portion in the liquid resin. When voids remain when the liquid resin is cured, there is a possibility that the reliability of the semiconductor element may be reduced as in the case of the bubbles. Here, as one of the methods for eliminating the voids, there is a method using a difference between the air pressure during printing and the air pressure after printing. That is, even if voids remain in the liquid resin printed under reduced pressure, the pressure is applied to the printed liquid resin by applying atmospheric pressure after printing to eliminate the voids.

[0007] However, in recent semiconductor chips that require high density, wires are connected at high density at a narrow pitch, and even in the case of flip chips, the gap between electrodes is narrow, so that voids are formed. It has been found to survive. Such narrow-pitch wires and voids remaining in narrow gaps are supposed to reduce their volume due to the pressure difference, but they cannot be reduced due to the wet resistance of the liquid resin to the plate or chip due to the viscosity of the liquid resin. Guessed. Moreover, at the moment when the pressure is returned from the reduced pressure to the atmospheric pressure, the pressure in the void is in a low state, but approaches the normal pressure with time without a volume change due to the above-mentioned resistance. Therefore, even when voids remain in the liquid resin, there is a problem that the reliability of the semiconductor element is reduced as in the case where the air bubbles remain.

The present invention has been made in view of the above circumstances, and has high reliability without bubbles or voids remaining in a liquid resin even when a small electronic component is manufactured. An object of the present invention is to provide a method and an apparatus for manufacturing an electronic component capable of manufacturing an electronic component.

[0009]

In order to solve the above-mentioned problems, a method of manufacturing an electronic component according to the present invention includes a sealing step of sealing an electronic component element mounted on a substrate with a liquid resin, A pressurizing step of pressurizing the substrate on which the electronic component element sealed in is mounted, and heating and pressurizing the substrate in the pressurized state to heat and pressurize the substrate; The method is characterized by comprising a heating and pressurizing step of eliminating residual voids and a curing step of curing the liquid resin while the substrate is in a heated state. Further, in the method for manufacturing an electronic component according to the present invention, the curing step includes curing the liquid resin in a heating and pressing state in which the substrate is in the heating state and in a pressing state. Here, in the electronic component manufacturing method of the present invention, it is preferable that a heating temperature of the substrate in the curing step is set to be equal to or higher than a heating temperature of the substrate in the heating and pressing step. Furthermore, the heating temperature of the substrate in the heating and pressurizing step is set to a primary set temperature that reduces the viscosity of the liquid resin, and the heating temperature of the substrate in the curing step is a temperature at which the liquid resin gels. It is preferable to set the above secondary set temperature. In the method for manufacturing an electronic component according to the present invention, the sealing step includes sealing the electronic component element using a stencil having holes formed in accordance with the position of the electronic component element mounted on the substrate. It is characterized by. In the method for manufacturing an electronic component according to the present invention, in the sealing step, the electronic component element is sealed under reduced pressure. In order to solve the above problems, an electronic component manufacturing apparatus of the present invention includes at least a stencil having holes formed in accordance with the position of an electronic component element mounted on a substrate, and a squeegee sliding on the stencil. A sealing chamber for sealing the electronic component element with a liquid resin, and a substrate in which the electronic component element is sealed in the sealing chamber is in a heating and pressing state,
While eliminating the voids remaining in the liquid resin,
A heating and pressurizing chamber for curing the liquid resin. Here, the heating temperature of the substrate in the heating and pressurizing chamber is set to a primary set temperature that reduces the viscosity of the liquid resin when the voids are eliminated, and when the liquid resin is cured, the liquid temperature is set. It is characterized in that it is set at a secondary set temperature higher than the temperature at which the resin gels. Further, the method is characterized in that the sealing chamber is set in a reduced pressure state when sealing the substrate.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method and an apparatus for manufacturing an electronic component according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a flowchart illustrating a method for manufacturing an electronic component according to an embodiment of the present invention. As shown in FIG. 1, the method for manufacturing an electronic component according to one embodiment of the present invention includes a sealing step S10, a pressing step S12, a heating and pressing step S14, and a curing step S16.

In a sealing step S10, an electronic component element such as a semiconductor chip mounted on a substrate is sealed with a liquid resin. In this step, the method of sealing the liquid resin is not particularly limited. For example, it is preferable to seal the electronic component element using a stencil having holes formed in accordance with the position of the electronic component element mounted on the substrate. . At this time, it is preferable to seal by printing using a squeegee that slides on the stencil in order to improve manufacturing efficiency. When the sealing is performed, the sealing may be performed under a vacuum atmosphere (under reduced pressure) or under an atmospheric pressure, but is preferably performed under vacuum from the viewpoint of avoiding mixing of bubbles into the liquid resin. .

When the sealing step S10 is completed, a pressure step S12 is performed next. In the pressurizing step S12, the substrate on which the sealed electronic component elements are mounted is set in a pressurized state. Here, the pressurized state after the electronic component element is sealed is that, among the bubbles remaining in the liquid resin, bubbles near the surface are removed from the liquid resin surface by pressing the liquid resin. To do that. In addition, voids near the surface of the liquid resin can be similarly removed.

Next, a heating and pressing step S14 is performed. In the heating and pressurizing step S14, the substrate is heated in a pressurized state to bring the substrate into a heated and pressurized state, thereby eliminating the remaining voids in the liquid resin. In the above-described pressurizing step S12, bubbles or voids near the surface of the liquid resin were removed by pressurizing the liquid resin. In the heating and pressurizing step S14, the temperature was increased while maintaining the pressurized state. By reducing the viscosity of the liquid resin, the volume is reduced irrespective of the position of the bubbles or voids in the liquid resin, and is virtually eliminated.

Here, considering only removal of bubbles or voids remaining in the liquid resin, it is considered that the heating and pressing step S14 should be performed immediately after the sealing step S10 is completed. In other words, in order to remove bubbles or voids remaining in the liquid resin, the liquid resin is heated to reduce the viscosity, and when the viscosity of the liquid resin is minimized, the pressure is reduced to efficiently reduce the volume of the void. It is considered that air bubbles can be efficiently removed. However, when the heating temperature of the liquid resin is gradually increased, as shown in FIG. 2, after the viscosity of the liquid resin reaches a minimum at a certain temperature, a curing reaction accompanied by a sharp rise in viscosity occurs. FIG. 2 is a diagram showing the relationship between the heating time and the change in viscosity of the liquid resin. In FIG. 2, curves denoted by reference symbols T1 to T6 indicate that the set temperatures are 40 ° C., 60 ° C., and 80 ° C., respectively.
It shows the relationship between the heating time and the change in viscosity of the liquid resin when the temperature is set to 100C, 100C, 120C, and 150C. Referring to FIG. 2, it can be seen that the viscosity increases in a short time as the heating temperature increases.

Therefore, if the temperature is increased and pressure is applied at the timing when the viscosity of the liquid resin becomes minimum, the liquid resin may be thickened and gelled in a state where a depression is formed on the surface. . In other words, when the liquid resin is heated, the viscosity decreases, and when the liquid resin is further pressurized, the volume of bubbles that escaped near the surface of the liquid resin, or the volume remaining after the voids remaining in the liquid resin are crushed and crushed are reduced. Will be suddenly depressed. This dent is naturally leveled and flattened over time, but because of the heating, the liquid resin thickens and gels before leveling, and remains dent. Further, when the viscosity of the liquid resin is reduced by increasing the temperature under the atmospheric pressure, the liquid resin easily flows and spreads on the substrate, and there is a problem that the sealing shape cannot be maintained. Therefore, in the present embodiment, the pressing step S
After a lapse of 12, the heating and pressurizing step S14 is performed. Furthermore, depending on the constituent components of the liquid resin, there may be those having a boiling point at the primary set temperature (for example, a diluent for viscosity adjustment, a low-molecular coupling agent, or an acid anhydride curing agent). In such a case, when heated under the atmospheric pressure, a state of boiling occurs, and in such a state, there is a possibility that viscosity increases and gelation occurs.

Therefore, in the heating and pressurizing step S14, pressure is applied from an initial state at the start of the step, and the temperature is raised to the primary set temperature. This primary set temperature is in the range of 60 to 120 ° C., and is a temperature at which the reaction proceeds slowly without causing a rapid reaction of the liquid resin. When the liquid resin is heated at this primary set temperature, the state in which the viscosity of the liquid resin decreases for a relatively long time continues. Here, if the primary set temperature is lower than 60 ° C., the liquid resin does not cause a reaction or has a long time until gelation, which is not preferable. Conversely, if the primary set temperature is higher than 120 ° C., the liquid resin may react rapidly, and foam due to the heat generated by the curing accompanying the reaction.
It is not preferable because the viscosity increases before the viscosity sufficiently decreases. The rate of heating up to the primary set temperature is not critical,
About 20 ° C./min. If the rate is lower than 2 ° C./min, the efficiency is poor in time. If the rate is 20 ° C./min or more, the temperature is more than the primary set temperature and the control becomes difficult. The applied pressure is 9.8 kPa (0.1 kg / c
m ² ) to 980 kPa (10 kg / cm ² ), preferably 49 kPa to 490 kPa. If the applied force is 9.8 kPa or less, no effect such as disappearance of voids is found, and if it is 980 kPa or more, the facility cost is increased and the effect is unnecessary. After the liquid resin has gelled at the primary set temperature, the voids have disappeared, or the liquid resin has been crushed and solidified with air bubbles removed, so that the pressure may be returned to the atmospheric pressure. By applying pressure in the heating and pressurizing step S14, the boiling point of the liquid resin increases, and the voids can be eliminated without boiling at the primary set temperature and without adversely affecting the surface state.

As described above, in the present embodiment, the pressing step S1
In 2, by applying pressure to the liquid resin from the initial stage before heating, bubbles near the surface of the liquid resin can be removed, and the dent after the removal can be leveled. Also,
Enclose the voids or bubbles remaining in the liquid resin,
By heating the liquid resin in the heating and pressurizing step S14 to lower the viscosity of the liquid resin, the volume of voids or bubbles can be reduced and eliminated. Furthermore, in the present embodiment, the depression on the liquid resin surface due to the disappearance of voids remaining in the liquid resin or the reduction in volume due to the removal of air bubbles does not occur suddenly as in the case of pressing after heating, It can be sufficiently leveled. Further, since pressure is uniformly applied to the entire liquid resin, even if the viscosity of the liquid resin decreases, the expansion of the sealing shape can be suppressed.

After the completion of the heating and pressing step S14, a curing step S14 is performed. This curing step is a step performed to bring out the designed characteristics of the cured liquid resin.
In the curing step S14, the gelled liquid sealing resin is cured by heating to a second set temperature. This secondary set temperature is 1
20-200 ° C. When the two-hour set temperature in the curing step S14 is 120 ° C. or lower, the functional groups cannot fully react and the properties of the cured product are not sufficient. It is not preferable because decomposition by heat may occur. Also, set the secondary temperature to 200 ° C.
The above may adversely affect the substrate and the semiconductor chip. This curing step S16 may be performed at atmospheric pressure, or may be performed in a state where the substrate and the gelled liquid resin are pressed after the above-mentioned heating and pressing step S14.

Next, an apparatus for manufacturing an electronic component according to an embodiment of the present invention for performing the method for manufacturing an electronic component according to the above-described embodiment of the present invention will be described. FIG. 3 is a diagram showing a configuration of an electronic component manufacturing apparatus according to one embodiment of the present invention. The electronic component manufacturing apparatus shown in FIG. 3 is an example of an electronic component manufacturing apparatus suitable for use in manufacturing an electronic component by converting it into a line. Does not necessarily need to completely include the electronic component manufacturing apparatus shown in FIG.

As shown in FIG. 3, the apparatus for manufacturing an electronic component according to one embodiment of the present invention includes a loading chamber 10 for loading the substrate 1 and a printing chamber 20 as a sealing chamber for printing the substrate 2.
And an unloading chamber 30 for unloading the printed substrate 3, and a pressure curing furnace 7 for eliminating voids remaining in the liquid resin printed on the sealed substrate 4, removing bubbles, and curing the liquid resin.
0 and an unloading chamber 80 for unloading the substrate 5 out of the apparatus. In FIG. 2, the substrates are distinguished from each other by reference numerals 1 to 5, but the same number of semiconductor chips are formed at the same positions.

The loading chamber 10 has a transport port 11 for loading a substrate from the outside and a transport port 12 for transporting the loaded substrate 1 to the printing room. The inside of the carry-in room 10 and the inside of the printing room 20 pass through the carrying port 12. In addition, this loading room 10
Is also used as a drying chamber for performing vacuum drying of the substrate 1 before sealing. The unloading chamber 30 is provided with a transfer port 31 for loading the substrate 2 from the printing chamber 20 and the sealed substrate 3 into a pressure curing furnace 70.
And a carry-out port 32 for carrying out. The inside of the carry-out room 30 and the inside of the printing room 20 penetrate through the carrying port 31.

An opening / closing door 13 for shutting off (separating) or opening the outside and the loading room 10 is provided at the transport opening 11.
The transport opening 12 is provided with an opening / closing door 14 for shutting off (separating) or opening the carry-in room 10 and the printing room 20. Further, an opening / closing door 33 for shutting off (separating) or opening the printing room 20 and the unloading chamber 30 is provided at the transport opening 31, and the unloading 30 and the pressure curing furnace 70 are shut off at the transport opening 32. An opening / closing door 34 for (separation) or opening is provided. An opening / closing door 35 is provided between the pressure curing furnace 70 and the unloading chamber 80.
The opening / closing door 36 is provided in the carry-out room 80.
The opening / closing doors 13, 14, 33, 34, 35, 36 have a structure that can withstand a pressure difference between the inside and the outside. For example, sealing that can maintain airtightness is provided. Door 13,
When 14, 33, 34, 35, and 36 are in the closed state, the carry-in room 10, the printing room 20, the carry-out room 30, the pressure curing furnace 70,
And the carry-out room 80 is sealed and can maintain airtightness. In the present embodiment, as described above, the loading chamber 10 is also used as a vacuum drying chamber, and since this loading chamber is used for removing moisture and remaining volatile substances of the substrate 1, 0.1 torr is used.
It is preferable to have a pressure-resistant structure that can withstand a degree of vacuum of about r.

The loading room 10, the printing room 20, and the unloading room 3
0, a belt conveyer 40, 4 for transporting substrates in the pressure curing furnace 70, the unloading chamber 80, and outside the apparatus.
1, 42, 43, 44, 45, and 46 are arranged in a straight line, and transport the substrates 1, 2, 3, 4, and 5. Note that the substrates 1, 2, 3, 4, and 5 are not the substrates themselves, but may be, for example, a jig plate on which the substrates are placed. Further, the belt conveyors 40, 41, 42, 43, 44, 45, 46 may be, for example, a feeding device provided with a roller rotating mechanism.
The substrate includes a substrate having a hole filled with a liquid resin, a substrate on which a semiconductor sealed with the liquid resin is mounted, an electronic component sealed with the liquid resin, and the like.

The above-described carry-in room 10, printing room 20, carry-out room 30, and carry-out room 80 have an intake pipe 5 provided with a valve 53.
0, an intake pipe 51 with a valve 54, an intake pipe 52 with a valve 55, and an intake pipe 81 with a valve 82, respectively. Loading room 10, printing room 20, loading room 3
0, and when the discharge chamber 80 is in a vacuum state, the valve 5
By opening 3, 54, 55, and 82, the loading room 1
0, the pressure inside the printing room 20, the unloading room 30, and the unloading room 80 can be set to the atmospheric pressure. Also, valves 57, 58, and 5 are provided in the carry-in room 10, the printing room 20, and the carry-out room 30.
9 is provided, and a pipe 56 connected to the vacuum pump 60 is connected. Therefore, when the vacuum pump 60 is in the operating state, by opening the valves 57, 58, and 59, each of the loading chamber 10, the printing chamber 20, and the unloading chamber 30 can be in a vacuum state. Therefore, valves 53 and 5
The degree of vacuum in the carry-in room 10, the print room 20, and the carry-out room 30 can be arbitrarily set by adjusting the opening degrees of 4, 55, 57, 58, and 59.

In particular, since the loading chamber 10 is also used for vacuum drying, it is preferable that the degree of vacuum of the loading chamber 10 can be arbitrarily set. In FIG. 3, the vacuum pump 60 is directly connected to the loading chamber 1 via the valves 57, 58, 59.
0, connected to the printing room 20, and the unloading room 30,
Loading room 10, printing room 20, and unloading room 30 as required
A tank may be provided between the pump and the vacuum pump 60 to reduce the time required to reach a predetermined degree of vacuum. Further, valves 55 and 92 are provided in the discharge chamber 30 and the pressure curing furnace 70, and pipes 52 and 91 connected to the compressor 90 are provided.
Are connected respectively. Note that a nitrogen cylinder filled with nitrogen gas may be provided instead of the compressor 90. By opening the valves 55 and 92, the pressure in the discharge chamber 30 and the pressure in the pressure curing furnace 70 can be adjusted to atmospheric pressure or higher. In the pressure curing furnace 70, partitions 77 are provided at predetermined intervals along the moving direction of the substrate 4. The partition 77 is provided mainly for alleviating a rapid temperature change in the pressure curing furnace 70 due to the opening and closing of the doors 34 and 35. Further, a heater block 72 is provided in the pressure curing furnace 70. This heater block 7
2, upper, lower, left, right, up, down, left, right,
Or it is provided around. Note that a heat source may be attached to a pipe leading from the compressor 90 to the pressure drying furnace 70, and a gas heated to a predetermined temperature may be introduced into the pressure drying furnace 70. Further, the heater block 72 may be divided into blocks, and control may be performed such that each block has a predetermined temperature. As described above, in this embodiment, the pressure applied to the substrate 4 in the pressure curing furnace 70 is adjusted by opening and closing the valve 92, and the temperature is adjusted by temperature control by the heater block 72.

Next, the inside of the printing room 20 will be described in detail. In FIG. 3, reference numeral 21 denotes a table 22 described later.
It is a table elevating device that moves up and down and stands still, and may have a function of being able to stand still at an elevating speed and an arbitrary position for an arbitrary time if necessary. Also, the table elevating device 21
It is also possible to use a device for raising and lowering the printing stencil instead of. In this case, the above mechanism can be provided. Reference numeral 22 denotes a table of the printing press, which is not particularly necessary when the substrate 2 is mounted on a jig plate or when the substrate itself is transported. Further, a heater (not shown) may be built in so that the substrate 2 can be heated as needed, or a heater may be provided on the upper surface of the table. Reference numeral 23 denotes a stencil plate for printing, and a number of holes having a size and a shape corresponding to the supply size are provided at positions corresponding to the resin supply portion of the substrate 2 in a number corresponding to the supply portion. In FIG.
a, 23b and 23c are provided. Reference numeral 24 denotes a squeegee moving device, which is configured to be able to reciprocate in a direction indicated by reference numeral H1 or a direction indicated by reference numeral H2 along a moving rail 25 installed horizontally in the printing room 20. 26a and 26b are reciprocated in the direction indicated by reference numeral H1 or in the direction indicated by reference numeral H2. In addition, the squeegee moving device 24 designates the squeegees 26a and 26b with a code V1.
The vertical position of the squeegees 16a and 26b is adjusted by reciprocating the squeegees 16a and 26b, and the adjustment of the distance between the squeegees 26a and 26b and the stencil 23 and the adjustment of the contact pressure are performed. Is what you do.

Next, the squeegees 26a and 26b and the stencil 23
Will be described. The contact angle θ between the squeegees 26a and 26b and the stencil 23 is preferably set to an angle smaller than 90 ° in order to press and fill the hole of the substrate with the liquid resin. That is, when the tips of the squeegees 26a, 26b are not acute angles but close to 90 °, the squeegees 26a, 26b
It is necessary to make the contact angle θ 90 ° or less by tilting itself. When the tips of the squeegees 26a and 26b are acute angles, the contact angle θ is 90 ° or less even if the squeegees 26a and 26b are vertically arranged. In the present embodiment, printing is performed in both the case where the squeegee moving device 24 moves in the direction indicated by reference numeral H1 and the case where the squeegee moving device 24 moves in the direction indicated by reference numeral H2. Squeegees 26a and 26b are provided to face each other.

Reference numeral 27 denotes a resin supply device for appropriately supplying a liquid resin onto the stencil 23 in the printing room 20. The resin supply device is supplied outside the printing room 20 to the resin supply device. This device may be equipped with a heating device (not shown) so that the liquid resin can be heated as necessary.
Further, the resin supply device 27 is provided outside the printing room 20, but it is necessary to supply the liquid resin to the stencil inside the printing room due to its structure. Therefore, it is necessary to supply a resin that is replenished outside the printing room and sent into the printing room 20. Reference numeral 28 denotes a resin supply nozzle connected to the resin supply device 27, which is a portion for discharging the liquid resin from the resin supply device 27 onto the stencil 23, and has a configuration capable of heating the liquid resin as necessary. You may.

Incidentally, the resin supply nozzle 28 is
A plurality may be provided between the squeegee 26a and the squeegee 26b. Further, the resin supply nozzle 28 may be configured to be movable. In this case, before the squeegees 26a and 26b move in the direction indicated by reference numeral H1 in FIG. 3 and return to their original positions, the resin supply nozzles 28 become squeegees 26a and 26b.
After moving from outside the moving range of the squeegee and discharging the liquid resin onto the stencil 23 located in front of the squeegee, the squeegee 26
a, 26b is returned to the original position outside the moving range. In FIG. 3, reference numeral 29 denotes a liquid resin discharged from the resin supply nozzle 28 onto the stencil 23. The discharge position is on the stencil 23 located in front of the squeegees 26a and 6b that are moving forward.

Next, the operation of the electronic component manufacturing apparatus according to one embodiment of the present invention will be described. First, the loading room 10
, The open / close door 14 is closed, the open / close door 13 is open, the open / close door 34 is closed with respect to the carry-out room 30, and the open / close door 33 is open. Further, the open / close doors 35 and 36 of the pressure curing furnace 70 and the carry-out chamber 80 are closed. Further, the vacuum pump 60 is operated, and the valves 53, 58, 59
Is open, and the valves 54, 55, 57 are closed. By doing so, the pressure in the loading chamber 10 is set to the atmospheric pressure, and the printing chamber 20 and the unloading chamber 30 are adjusted to a predetermined degree of vacuum. The valve 82 is closed and the valve 92 is open.

In this state, the belt conveyors 40 and 41 are operated, and the substrate 1 is carried into the carry-in room 10 through the carrying port 11. Next, the door 13 is closed, and the valve 53 is closed.
Is closed and the valve 57 is opened to operate the vacuum pump 60 to make the internal pressure of the carry-in chamber 10 equal to the internal pressure of the printing chamber 20. Since the vacuum chamber 10 is used as a vacuum drying chamber, the degree of vacuum may be set higher than that of the printing chamber 20 from the viewpoint of shortening the drying time.

After the internal pressure of the loading chamber 10 becomes equal to the internal pressure of the printing chamber 20, the opening and closing door 14 is opened, and the belt conveyors 41 and 42 are driven to transport the substrate 1 into the printing chamber 20. . When the substrate 1 is moved by the belt conveyor 42 and reaches a predetermined position on the table elevating device 21, the table elevating device 21 raises the table 22 to move the substrate 1 to a predetermined position, that is, the upper surface of the substrate 2
Up to the position where it contacts the back surface of When the substrate 2 rises to the above-mentioned predetermined position, the resin supply position 27 becomes the stencil 23
The liquid resin 29 is discharged in front of the upper squeegee 26b, that is, in the direction indicated by reference numeral H1 with respect to the squeegee 26b.
When the liquid resin 29 is discharged, the squeegee moving device 24
Lowers the squeegee 26b until it comes into contact with the stencil 23, and after the squeegee 26b comes into contact with the stencil 23, moves in the direction indicated by reference numeral H1 in the figure, and starts printing. As the squeegee 26b moves, the liquid resin 29 fills the holes 23a to 23c formed in the stencil 23.

Forward printing (the squeegee 26b is denoted by reference numeral H1 in the drawing).
In the printing room 20 after the end of the return pass printing (printing in the case where the squeegee 26a is moved in the direction indicated by the symbol H2 in the figure) after the end of the printing when the printing is performed in the direction marked with. The vacuum degree is 30 torr higher than the vacuum degree during forward printing.
At least r, the pressure is lowered to a predetermined degree of vacuum. In addition, 10to
When printing with a degree of vacuum higher than about rr or a degree of vacuum less than 10 torr, bubbles in the liquid resin may not be completely removed. For example, the liquid resin unfilled portion may be in a hole, an element periphery, a coil line, or the like. Remaining, these bubbles and unfilled parts are 10
the remaining portion of air having a vacuum less than torr,
Even after the vacuum is released (after the pressure is returned to normal pressure), a gap in which air of about several millimeters remains remains. In this sense, preferably 5 torr
r, and it is particularly preferable to increase the degree of vacuum to about 1 torr. Thereafter, the degree of vacuum in the printing room 20 is adjusted to a predetermined degree of vacuum that does not exceed the degree of vacuum during forward printing,
Hold. This is adjusted by opening and closing the valve 54. While adjusting the degree of vacuum, the squeegee 26b
Is raised and the squeegee 26a is lowered.

Subsequently, the backward printing is performed using the squeegee 26a. Thus, the sealing step S10 shown in FIG. 1 is performed. After the return printing, the table 22 is moved down by the table elevating device 21 to release the substrate 2 from the stencil 23. At this time, the lowering speed of the table 22 or the resting time at an arbitrary position is adjusted in order to prevent a shape defect due to a break in the liquid resin. Next, the door 3
3 is opened. Then, when the table 22 is lowered and the substrate 2 is placed on the belt conveyor 42, the belt conveyors 42 and 43 are driven, and the substrate 1 is carried from the printing room 20 to the carry-out room 30. When the loading into the unloading chamber 30 is completed, the opening and closing door 33 is closed, the valve 59 is closed, and the valve 55 is opened so that the pressure in the unloading chamber 30 is the same as the pressure in the pressure curing furnace 70. Press to about. After the pressure in the unloading chamber 30 becomes approximately the same as the pressure curing furnace 70,
The opening and closing door 34 is opened, and the belt conveyors 43 and 44 are driven to carry the substrate 3 into the pressure curing furnace 70. Therefore, when the inside of the unloading chamber 30 is pressurized to the same degree as the pressure hardening furnace 70, the pressurizing step S12 shown in FIG. 1 is performed.

When the substrate 3 is carried into the pressure drying furnace 70, the substrate 4 is heated and pressed by heating the heater block 72. The pressure in the pressure drying oven 70 is controlled by opening and closing a valve 92 provided on a pipe 91 from the compressor 90. While the substrate 4 is placed in the pressure drying oven 70, the temperature in the pressure drying oven 70 is set to a primary set temperature, the viscosity of the printed liquid resin is reduced, and the remaining voids are eliminated. Alternatively, after the bubbles are removed and the liquid resin gelates, the temperature in the pressure drying oven 70 is set to the secondary set temperature while maintaining the pressurized state, and the gel liquid resin is cured. In this way,
Heating step S1 shown in FIG.
4 and a curing step S16 are sequentially performed. In the pressure drying oven 70, a temperature distribution is formed in which the temperature gradually increases along the transport direction of the substrate 4, and the belt conveyor 4
By the speed control of No. 4, the thermalizing step S14 and the curing step S
It is preferable to perform Step 16 in order from the viewpoint of increasing the manufacturing efficiency.
After curing the liquid resin, the opening / closing door 35 is opened,
The substrate 4 is carried out to the carry-out room 80, the valve 82 is opened, and the inside of the carry-out room 80 is returned to the atmospheric pressure. Then, the open / close door 36 is opened, and the substrate 5 is carried out by the belt conveyor 46 to the outside. When processing a plurality of substrates, the above steps are repeatedly performed.

[0036]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present applicant manufactured various types of electronic components by using the above-described electronic component manufacturing method. FIG. 4 is a top view and a cross-sectional view showing the form of an actually manufactured electronic component. FIGS. 4A and 4B show COB (chip-on-chip).
4 (c) is an electronic component in the form of a WBGA (window ball grid array), and FIG. 4 (d) is an electronic component in the form of a BGA (ball grid array).
FIG. 4E shows an electronic component in the form of a flip chip. In addition, FIG.
In FIG. 4E, a member denoted by reference numeral 100 is a substrate, and a member denoted by reference numeral 101 is a semiconductor chip.
4 (a) to 4 (d), a member denoted by reference numeral 102 is a wire for electrically connecting the substrate 100 and the semiconductor chip 102, and a member denoted by reference numeral 103 in FIG. 4 (e). The completed member is the substrate 100 and the semiconductor chip 1
02 are electrically connected to the bumps.

The details of the form of each electronic component are as follows. The substrate 100 is made of FR-4 (trade name: CS-335).
5, manufactured by Risho Kogyo Co., Ltd.). (A) COB (chip-on-board) wire (φ25 μm gold wire) Number of wires: 4 Wire pitch: 2 mm (b) COB (chip-on-board) wire (φ25 μm gold wire) Number of wires: 256 Wire pitch: 62 μm Chip size: 5 × 5 mm Chip thickness: 600 μm (c) WBGA (Window ball grid array) Wire (φ25 μm gold wire) Number of wires: 60 Wire pitch: 130 μm Chip size: 6 × 12 mm chip Thickness: 400 μm (d) BGA (ball grid array) wire (φ25 μm gold wire) Number of wires: 504 Wire pitch: 60 μm Chip size: 10 × 10 mm Chip thickness: 400 μm (e) Flip chip Number of bumps: 256 wires Number: 504 pieces Flop Height: 25 [mu] m chip size: 10 × 10 mm chip thickness: 600 .mu.m

In the stencil used for printing the liquid resin, holes were formed at the positions of the semiconductor chips mounted on the substrate, and the diameter was set according to the external dimensions of the semiconductor chips. Further, a SUS plate having a thickness corresponding to the sealing thickness was used. As the liquid resin, NPR-700 (trade name, manufactured by Nippon Rec Co., Ltd.) was used. The electronic component of the above embodiment was manufactured under the following conditions. The following Comparative Examples 1 to 3 are examples performed to compare the effects of the case of using the present embodiment and the case of not using the present embodiment, and include a pressing step S12 and a heating / pressing step S14 shown in FIG. Not in order. Comparative Example 1 to Comparative Example 3
The details of the steps of Examples 1 to 4 are as follows.

(Comparative Example 1) Printing and sealing were carried out at normal pressure, and they were cured by heating and heating as they were at 100 ° C for 1 hour + 150 ° C for 3 hours. (Comparative Example 2) Print sealing was performed under vacuum (0.13 kPa), and after returning to normal pressure, 100 ° C / 1 hour + 150 ° C /
It was cured by heating for 3 hours. (Comparative Example 3) Print sealing was performed under vacuum (0.13 kPa), and after returning to normal pressure, 100 ° C / 1 hour + 150 ° C /
It was cured by heating for 3 hours.

Example 1 Printing and sealing were carried out at normal pressure, and cured by heating at 100 ° C./1 hour + 150 ° C./3 hours under a pressure of 490 kPa with a pressure dryer. (Example 2) Print sealing was carried out at normal pressure, and after defoaming for 3 minutes at a vacuum of 0.4 kPa in a vacuum chamber, 100 ° C./1 hour under a pressure drier of 490 kPa under pressure. +1
The composition was cured by heating at 50 ° C. for 3 hours. (Example 3) Printing and sealing were performed under vacuum (0.13 kPa), and after returning to normal pressure, 100 ° C. under a pressure drier of 490 kPa under pressure.
/ 1 hour + 150 ° C./3 hours to cure. (Example 4) Print sealing was performed under vacuum (0.13 kPa), and it was immediately heated and cured in a connected pressure drying furnace under pressure of 490 kPa at 100 ° C./1 hour + 150 ° C./3 hours. .

The appearance and shape of the electronic component manufactured through the above manufacturing process, and the voids in the sealed resin are determined by SAT.
(Ultrasonic flaw detector: manufactured by Hitachi Construction Machinery Finetech Co., Ltd.) The number or the degree of those having a size of 10 μm or more was observed. The results are summarized in the chart shown in FIG.
FIG. 5 is a table showing manufacturing results of the example of the present invention and the comparative example. From the results shown in FIG. 5, it can be seen that the number of wires used for an IC card, a clock, a calculator, and the like is small and the pitch thereof is not narrow.
Defoaming after printing is sufficient.

In the case where the number of wires is large and the pitch is narrow even in the same COB as in the case of (b), voids remain under the wires even when printing and sealing under vacuum. On the other hand, it can be seen that large pressure bubbles are removed by vacuum defoaming after normal-pressure printing sealing is performed, and then pressure curing is performed to improve the situation. In the case where the cross section of the substrate exists outside the sealing area as in the form of (c), even if the wire pitch is not so narrow, the void remains unless cured by pressure under normal pressure. It is conceivable that air bubbles are generated in the substrate from the cross section of the substrate during the operation. As described above, the generation of air bubbles from the inside of the substrate due to the heat at the time of curing has an effect of being suppressed by pressure curing.

Further, when the cross section of the substrate exists outside the sealing area and the number of wires is large and the pitch is narrow as in the form of (d), printing under pressure and curing under pressure are performed. The combination method is best. Also,
In the case of the flip chip of (e), since the shape is disturbed by defoaming, it is best to combine printing under vacuum with pressure curing.

[0044]

As described above, according to the present invention,
Since the pressurizing step is performed on the sealed liquid resin, air bubbles near the surface of the liquid resin can be removed, and the recess after the removal can be leveled. In the heating and pressurizing step, the volume of voids or bubbles can be reduced and eliminated by applying pressure while reducing the viscosity of the resin by heating. At this time, since the heating and pressurizing step is performed after the pressurizing step, the liquid resin can be sufficiently leveled without abrupt volume reduction due to disappearance of voids or removal of bubbles, and Since pressure is uniformly applied to the entire resin, the spread of the sealing shape can be suppressed even if the viscosity of the liquid resin decreases. Therefore, there is an effect that an electronic component having high reliability can be manufactured without leaving bubbles and voids in the liquid resin.

[Brief description of the drawings]

FIG. 1 is a flowchart illustrating a method for manufacturing an electronic component according to an embodiment of the present invention.

FIG. 2 is a diagram showing a relationship between a heating time and a change in viscosity of a liquid resin.

FIG. 3 is a diagram illustrating a configuration of an electronic component manufacturing apparatus according to an embodiment of the present invention.

4A and 4B are a top view and a cross-sectional view illustrating a form of an actually manufactured electronic component.

FIG. 5 is a table showing manufacturing results of examples of the present invention and comparative examples.

[Explanation of symbols]

1, 2, 3, 4, 5, 100 substrate 20 printing room (sealing room) 23 stencils 23a to 23c holes 26a, 26b squeegee 29 liquid resin 70 pressure curing furnace (heating and pressing room) 101 semiconductor chip (electronic component) element)

Claims (9)

[Claims] 1. A sealing step of sealing an electronic component element mounted on a substrate with a liquid resin, and a pressing step of pressing the substrate on which the electronic component element sealed with the liquid resin is mounted. Heating and pressurizing the substrate in the pressurized state to heat and pressurize the substrate to eliminate residual voids in the liquid resin; and curing the liquid resin while the substrate is in a heated state. And a curing step of causing the electronic component to be manufactured. 2. The method for manufacturing an electronic component according to claim 1, wherein in the curing step, the liquid resin is cured in a heating and pressing state in which the substrate is in the heating state and in a pressing state. . 3. The heating temperature of the substrate in the curing step is set to be equal to or higher than the heating temperature of the substrate in the heating and pressurizing step.
A method for producing the electronic component described in the above. 4. The heating temperature of the substrate in the heating and pressurizing step is set to a primary set temperature for decreasing the viscosity of the liquid resin, and the heating temperature of the substrate in the curing step is such that the liquid resin is gelled. 4. The method of manufacturing an electronic component according to claim 1, wherein the secondary temperature is set to a temperature equal to or higher than a predetermined temperature. 5. 5. The electronic component device according to claim 1, wherein in the sealing step, the electronic component device is sealed using a stencil having holes formed in accordance with the position of the electronic component device mounted on the substrate. The method for manufacturing an electronic component according to any one of claims 1 to 4. 6. The method for manufacturing an electronic component according to claim 1, wherein in the sealing step, the electronic component element is sealed under reduced pressure. 7. A stencil having holes formed in accordance with the position of an electronic component element mounted on a substrate, and a squeegee sliding on the stencil, and sealing the electronic component element with a liquid resin. A sealing chamber, and a heating and pressurizing chamber for heating and pressurizing the substrate in which the electronic component element is sealed in the sealing chamber, eliminating voids remaining in the liquid resin, and curing the liquid resin. A method for manufacturing an electronic component, comprising: 8. The heating temperature of the substrate in the heating and pressurizing chamber is set to a primary set temperature at which the viscosity of the liquid resin is reduced when the voids are eliminated, and when the liquid resin is cured. 8. The apparatus for manufacturing an electronic component according to claim 7, wherein the secondary resin is set at a secondary temperature equal to or higher than a temperature at which the liquid resin gels. 9. The apparatus according to claim 7, wherein the sealing chamber is set in a reduced pressure state when the substrate is sealed.