JP2002185254A5 - - Google Patents

Claims (7)

A first electronic component having a ceramic package with a metal lid for shielding on the upper surface; a flexible wiring board having lower rigidity than the ceramic package; and a second electronic component mounted on the upper surface of the flexible wiring board. The ceramic package has a smooth bottom surface, surface mounting terminals on the bottom surface, columnar terminals around the flexible wiring board, and the second electronic An electronic component configured to reinforce the flexible substrate by mounting the first electronic component so as to cover an upper surface of the component, and fixing the surface mounting terminal and the terminal portion. A first electronic component having a ceramic package with a metal lid for shielding on the upper surface; a flexible wiring board having lower rigidity than the ceramic package; and a second electronic component mounted on the upper surface of the flexible wiring board. The ceramic package has a smooth bottom surface, surface mounting terminals on the bottom surface, columnar terminals mounted around the flexible wiring board, and the second electronic An electronic component configured to reinforce the flexible substrate by mounting the first electronic component so as to cover an upper surface of the component, and fixing the surface mounting terminal and the terminal portion. A first electronic component having a ceramic package with a metal lid for shielding on the upper surface; a flexible wiring board having lower rigidity than the ceramic package; and a second electronic component mounted on the upper surface of the flexible wiring board. An electronic component, a columnar surface mounting terminal on the lower surface of the ceramic package, a land pattern around the flexible wiring board, and the upper surface of the second electronic component so as to cover the upper surface of the second electronic component. An electronic component comprising: an electronic component mounted thereon, and the flexible substrate is reinforced by fixing the surface mount terminal and the land pattern. 4. The electronic component according to claim 1, wherein a thickness of the flexible wiring board is thinner than a thickness of the ceramic package. 3. The electronic component according to claim 2, wherein the columnar terminal is a metal ball. An adhesive is interposed between the lower surface of the ceramic package and the flexible wiring substrate so as to fix the lower surface of the ceramic package and the flexible wiring substrate so that the flatness of the flexible substrate is increased. 6. The electronic component according to claim 1, wherein the electronic component is maintained. The electronic component according to any one of claims 1 to 6 is a piezoelectric oscillator in which the first electronic component is a piezoelectric vibrator.