JP2002185175A - Cooling fin device and instrument thereof - Google Patents
Cooling fin device and instrument thereofInfo
- Publication number
- JP2002185175A JP2002185175A JP2000385780A JP2000385780A JP2002185175A JP 2002185175 A JP2002185175 A JP 2002185175A JP 2000385780 A JP2000385780 A JP 2000385780A JP 2000385780 A JP2000385780 A JP 2000385780A JP 2002185175 A JP2002185175 A JP 2002185175A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- fins
- cooling fin
- fin
- fin device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/02—Streamline-shaped elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は冷却フィン装置及び
機器、特に冷却効率の向上に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling fin device and equipment, and more particularly to an improvement in cooling efficiency.
【０００２】[0002]
【従来の技術】従来より、電子機器等を冷却するために
ヒートシンク冷却フィンが用いられている。例えば、特
開平５−２８３８７８号公報には、底板上に直立した複
数の平行平板型フィン又はピン型フィンを有するヒート
シンク冷却フィンが開示されている。2. Description of the Related Art Conventionally, heat sink cooling fins have been used to cool electronic devices and the like. For example, Japanese Patent Application Laid-Open No. 5-283878 discloses a heat sink cooling fin having a plurality of parallel plate fins or pin fins standing upright on a bottom plate.
【０００３】[0003]
【発明が解決しようとする課題】このように、従来より
平行平板型フィン又はピン型フィンを用いて熱を放散し
ているが、近年の電子機器の高性能化や高集積化、小型
化に伴って発熱量がさらに増大しており、したがって一
層の冷却効率の向上が望まれている。As described above, heat is conventionally dissipated by using a parallel plate type fin or a pin type fin. However, in recent years, high performance, high integration, and miniaturization of electronic devices have been realized. As a result, the amount of heat generated has further increased, and thus it is desired to further improve the cooling efficiency.
【０００４】本発明は、上記従来技術の有する課題に鑑
みなされたものであり、その目的は、電子機器などをよ
り効率的に冷却し、これにより機器の性能向上を図るこ
とができる冷却フィン装置及びこのような冷却フィン装
置を備える機器を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the related art, and has as its object to provide a cooling fin device capable of more efficiently cooling electronic devices and the like and thereby improving the performance of the devices. And a device provided with such a cooling fin device.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、離散的に形成されたフィンを有する冷却
フィン装置であって、前記離散的に形成されたフィンは
それぞれ冷却液の流れ方向に対して流線形状を有するこ
とを特徴とする。離散的に形成することで、従来のピン
型フィンのように放熱面積を向上させることができると
ともに、流線形状とすることで通水抵抗も低減すること
ができ、放熱面積の向上と通水抵抗の低減により従来以
上に冷却効率を上げることができる。According to the present invention, there is provided a cooling fin apparatus having discretely formed fins, wherein each of the discretely formed fins is provided with a cooling liquid. It has a streamline shape with respect to the flow direction. By forming discretely, the heat radiation area can be improved as in the case of the conventional pin-type fins, and the streamlined shape can reduce the water flow resistance, thereby improving the heat radiation area and water flow. By reducing the resistance, the cooling efficiency can be increased more than before.
【０００６】ここで、前記フィンの中心軸は、前記流れ
方向に対して所定角度の傾きを有することができる。Here, the center axis of the fin may be inclined at a predetermined angle with respect to the flow direction.
【０００７】また、前記フィンは前記流れ方向に沿って
複数列から構成することができる。複数列から構成した
場合、互いに隣接する列内の前記フィンは、前記流れ方
向と垂直な方向において異なる直線上に配置することが
できる。[0007] The fins may be composed of a plurality of rows along the flow direction. In the case where the fins are formed from a plurality of rows, the fins in rows adjacent to each other can be arranged on different straight lines in a direction perpendicular to the flow direction.
【０００８】また、本発明は、上記した冷却ファン装置
を有する電機機器を提供する。電機機器は、内部に熱源
となり得る素子あるいは回路基板を有する機器であり、
例えばインバータ装置等である。Further, the present invention provides an electric machine having the above-described cooling fan device. Electrical equipment is equipment having an element or circuit board that can be a heat source inside,
An example is an inverter device.
【０００９】[0009]
【発明の実施の形態】以下、図面に基づき本発明の実施
形態につき、自動車用のインバータ装置を例にとり説明
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings, taking an inverter device for a vehicle as an example.
【００１０】図１には、冷却フィンを有する電気自動車
用インバータ装置の概略構成が示されている。インバー
タ装置１０は、主回路のＩＧＢＴ（Insulated Gate Bip
olarTransistor：絶縁ゲート型バイポーラトランジス
タ）１２、制御基板１４、コンデンサ１６、ＩＧＢＴ１
２にＤＣを入力すると共にＩＧＢＴ１２からのＡＣをモ
ータに出力する接続材などを有する。ＩＧＢＴ１２はヒ
ートシンク１８の表面側に接合して取り付けられ、ヒー
トシンク１８の裏面側に冷却フィンが取り付けられて冷
却フィンを冷却水等で水冷する構成である。FIG. 1 shows a schematic configuration of an inverter device for an electric vehicle having cooling fins. The inverter device 10 includes an IGBT (Insulated Gate Bip) of a main circuit.
olarTransistor: insulated gate bipolar transistor) 12, control board 14, capacitor 16, IGBT1
2 has a connecting member for inputting DC and outputting AC from the IGBT 12 to the motor. The IGBT 12 is attached to the front side of the heat sink 18 and attached thereto, and a cooling fin is attached to the rear side of the heat sink 18 to cool the cooling fins with cooling water or the like.
【００１１】図２には、図１におけるＩＧＢＴ１２及び
ヒートシンク１８の詳細構成が示されている。ＩＧＢＴ
１２は、樹脂ケース内のベース（放熱板）１２ａ上に絶
縁基板１２ｂを半田１２ｅで接合し、この絶縁基板１２
ｂ上にダイオード１２ｃやＩＧＢＴチップ１２ｄなどを
半田１２ｅで接合して構成される。樹脂ケース内はゲル
材が充填され、また、樹脂ケースはシリコングリース２
０によりヒートシンク１８に接合される。FIG. 2 shows a detailed configuration of the IGBT 12 and the heat sink 18 in FIG. IGBT
Reference numeral 12 denotes an insulating substrate 12b joined to a base (heat radiating plate) 12a in a resin case by solder 12e.
A diode 12c, an IGBT chip 12d, and the like are joined on the b by solder 12e. The resin case is filled with a gel material, and the resin case is made of silicone grease 2
0 to the heat sink 18.
【００１２】ヒートシンク１８は、既述したようにその
裏面側、すなわちＩＧＢＴ１２とは反対側に冷却フィン
１８ａが形成されており、この冷却フィン１８ａの間を
冷却水が通過することでＩＧＢＴ１２を冷却する。図２
において、冷却水は冷却フィン１８ａの間を紙面垂直方
向に流れる。冷却フィン１８ａは、例えばアルミ材で形
成することができる。As described above, the heat sink 18 has the cooling fins 18a formed on the back side thereof, that is, on the side opposite to the IGBT 12, and the cooling water passes between the cooling fins 18a to cool the IGBT 12. . FIG.
, The cooling water flows between the cooling fins 18a in a direction perpendicular to the plane of the drawing. The cooling fins 18a can be formed of, for example, an aluminum material.
【００１３】図３には、図１あるいは図２におけるヒー
トシンク１８を裏面側から見た場合の冷却フィン１８ａ
の構成が示されている。図において、（ａ）は裏面側か
ら見た平面図であり、（ｂ）は（ａ）におけるＡ−Ａ断
面である。（ａ）において、冷却水は紙面に平行に図中
下方から上方に向かって冷却フィン１８ａの間を流れ
る。（ａ）に示されるように、冷却フィン１８ａは紙面
に対して垂直方向にヒートシンク１８の底板から離散的
に、すなわち平板状ではなくピン状に複数突出し、かつ
外観形状が冷却水の流れ方向に対して流線形状を有して
いる。また、冷却フィン１８ａは、冷却水の流れ方向に
対して直線上に複数列配置されており、隣接する列内の
冷却フィン１８ａに着目すると、それぞれの冷却フィン
１８ａは冷却水の流れ方向と垂直な方向（図中ｘ方向）
において異なる直線上に配置されている。すなわち、隣
接する２つの列をａ、ｂとすると、ａ列内の２つの冷却
フィンの間にｂ列内の冷却フィンが位置するように配置
される。FIG. 3 shows a cooling fin 18a when the heat sink 18 in FIG. 1 or 2 is viewed from the back side.
Is shown. In the figure, (a) is a plan view seen from the back surface side, and (b) is an AA cross section in (a). In (a), the cooling water flows between the cooling fins 18a from below to above in FIG. As shown in (a), the cooling fins 18a protrude discretely from the bottom plate of the heat sink 18 in a direction perpendicular to the plane of the paper, that is, a plurality of pins instead of a flat plate, and the external shape is in the direction of flow of the cooling water. On the other hand, it has a streamline shape. Further, the cooling fins 18a are arranged in a plurality of rows in a straight line with respect to the flow direction of the cooling water, and when focusing on the cooling fins 18a in the adjacent rows, each cooling fin 18a is perpendicular to the flow direction of the cooling water. Direction (x direction in the figure)
Are arranged on different straight lines. That is, assuming that two adjacent rows are a and b, the cooling fins in row b are arranged between the two cooling fins in row a.
【００１４】このように、冷却フィン１８ａをピン型フ
ィンのように離散的に複数個形成することで、冷却水と
接触する面積、すなわち放熱面積を増大させ、平行平板
型フィンに比べてより効率的に冷却することができる。
また、ピン型フィンと異なり、冷却フィン１８ａは冷却
水の流れ方向に対して流線形状を有しているため、従来
のピン型フィンに比べて通水抵抗を低減することがで
き、これにより効率的に熱を奪って冷却効率を向上させ
ることができる。As described above, by forming a plurality of cooling fins 18a discretely like pin-type fins, the area in contact with the cooling water, that is, the heat radiation area is increased, and the efficiency is improved as compared with the parallel plate type fin. Cooling.
Also, unlike the pin-type fins, the cooling fins 18a have a streamline shape in the flow direction of the cooling water, so that the water-flow resistance can be reduced as compared with the conventional pin-type fins. The heat can be efficiently removed to improve the cooling efficiency.
【００１５】なお、図３においては各冷却フィン１８ａ
の中心軸、すなわち流線形状を略楕円形状とした場合の
長軸に相当する軸は冷却水の流れ方向に対して平行に配
置されているが、図４に示されるように冷却フィン１８
ａの中心軸を冷却水の流れ方向に対して所定角度傾けて
配置することも可能である。図４においては、冷却フィ
ン１８ａの中心軸を流れ方向に対して所定角度（例えば
２５度）傾けるとともに、隣接する列において互いに異
なる方向に傾けて配置している（以下、これを便宜上く
さび配置と称し、図３の配置をストレート配置と称す
る）。この場合、通水抵抗としては図３に示された配置
よりも若干増大すると考えられるが、従来のピン型フィ
ンよりも通水抵抗を低減させることができる。In FIG. 3, each cooling fin 18a
Are arranged in parallel with the flow direction of the cooling water, that is, the axis corresponding to the long axis when the streamline shape is substantially elliptical, but as shown in FIG.
It is also possible to arrange the central axis of a at a predetermined angle with respect to the flow direction of the cooling water. In FIG. 4, the center axis of the cooling fins 18a is inclined at a predetermined angle (for example, 25 degrees) with respect to the flow direction, and is arranged so as to be inclined in different directions in adjacent rows (hereinafter referred to as a wedge arrangement for convenience). 3 is referred to as a straight arrangement). In this case, although it is considered that the water flow resistance is slightly increased as compared with the arrangement shown in FIG. 3, the water flow resistance can be reduced as compared with the conventional pin type fin.
【００１６】図５には、図３及び図４に示された本実施
形態における冷却フィン構造の通水抵抗が示されてい
る。図において、横軸は流量（Ｌ／ｍｉｎ）であり、縦
軸は通水抵抗（ｋＰａ）であり、１００が図３に示され
たストレート配置、１０２が図４に示されたくさび配置
である。なお、参考のため従来の平行平板型フィン及び
ピン型フィンの通水抵抗もそれぞれ１０４、１０６とし
て示されている。平行平板型フィンは、図６に示される
ように冷却水の流れ方向に沿って複数の平板形状のフィ
ンを配列したものであり、ピン型フィンは図７に示され
るように断面形状略円形のピン型フィンを離散的に配置
したものである。FIG. 5 shows the water flow resistance of the cooling fin structure according to the embodiment shown in FIGS. 3 and 4. In the figure, the horizontal axis is the flow rate (L / min), the vertical axis is the water flow resistance (kPa), 100 is the straight arrangement shown in FIG. 3, and 102 is the wedge arrangement shown in FIG. . For reference, the water flow resistances of the conventional parallel plate fin and pin fin are also shown as 104 and 106, respectively. The parallel plate type fins are formed by arranging a plurality of plate-shaped fins along the flow direction of the cooling water as shown in FIG. 6, and the pin type fins have a substantially circular cross section as shown in FIG. This is one in which pin-type fins are discretely arranged.
【００１７】図５から分かるように、通水抵抗はピン型
フィン（図７）＞くさび配置（図４）＞ストレート配置
（図３）＞平行平板型フィン（図６）であり、ピン型フ
ィンに比べて本実施形態における流線形状の冷却フィン
１８ａはいずれの流量においても通水抵抗が低くなって
いることがわかる。As can be seen from FIG. 5, the water flow resistance is the pin type fin (FIG. 7)> wedge arrangement (FIG. 4)> straight arrangement (FIG. 3)> parallel plate type fin (FIG. 6). It can be seen that the streamlined cooling fins 18a according to the present embodiment have a lower water flow resistance at any flow rate.
【００１８】また、図３あるいは図４に示された流線形
状の冷却フィン１８ａを有するＩＧＢＴ１２を実際に冷
却水で冷却（冷却ポンプの流量を固定）し、定常状態と
なったときに放熱板１２ａの温度を測定したところ、以
下のような結果を得ることができた。Further, the IGBT 12 having the streamlined cooling fins 18a shown in FIG. 3 or FIG. 4 is actually cooled with cooling water (the flow rate of the cooling pump is fixed). When the temperature of 12a was measured, the following results could be obtained.
【００１９】平行平板型フィン：９４．５℃ ピン型フィン：９５℃ ストレート配置（図３）：９３．５℃ なお、くさび配置（図４）もストレート配置とほぼ同程
度の温度であった。これらの結果より、従来構造の冷却
フィンに比べて冷却性能が向上していることがわかる。Parallel plate type fins: 94.5 ° C. Pin type fins: 95 ° C. Straight arrangement (FIG. 3): 93.5 ° C. The wedge arrangement (FIG. 4) was at substantially the same temperature as the straight arrangement. From these results, it is understood that the cooling performance is improved as compared with the cooling fin having the conventional structure.
【００２０】このように、本実施形態においてはピン型
フィンのように冷却水の通路上に離散的にフィンを形成
することで放熱面積を増大させ、かつフィンの形状を冷
却水の流れ方向に対して流線形状とすることで通水抵抗
を減少させることにより、冷却効率を従来以上に向上さ
せることができる。As described above, in the present embodiment, the radiating area is increased by discretely forming the fins on the passage of the cooling water like the pin type fins, and the shape of the fins is changed in the flow direction of the cooling water. On the other hand, by adopting a streamline shape, the water flow resistance is reduced, so that the cooling efficiency can be improved more than before.
【００２１】なお、本実施形態では、くさび配置とする
場合の傾き角を２５度としたが、他の角度でもよいこと
は言うまでもない。但し、一般的には０度と４５度の間
に設定することが好適である。In the present embodiment, the inclination angle in the case of the wedge arrangement is set to 25 degrees, but it goes without saying that another angle may be used. However, it is generally preferable to set the angle between 0 degree and 45 degrees.
【００２２】また、本実施形態では、電気自動車用のイ
ンバータ装置を例にとり説明したが、本発明はこれに限
定されるものではなく、任意の電機機器に適用すること
ができる。Further, in the present embodiment, an inverter device for an electric vehicle has been described as an example, but the present invention is not limited to this, and can be applied to any electric equipment.
【００２３】また、本実施形態では冷却液として水を用
いたが、他の液体を用いることもできる。Although water is used as the cooling liquid in the present embodiment, other liquids can be used.
【００２４】さらに、本実施形態の冷却フィンにおい
て、その表面に凹凸を形成し、放熱面積を向上させるこ
とも可能である。但し、この場合には通水抵抗が増大す
ることになるので、放熱面積と通水抵抗のトレードオフ
を考慮し、最適となる形状を選択することが望ましい。Further, in the cooling fin of the present embodiment, it is possible to form irregularities on the surface to improve the heat radiation area. However, in this case, the water flow resistance increases, so it is desirable to select an optimal shape in consideration of the trade-off between the heat radiation area and the water flow resistance.
【００２５】[0025]
【発明の効果】以上説明したように、本発明によれば、
従来以上に冷却効率を上げることができ、これにより電
気自動車用のインバータ装置などの電子機器の性能向上
を図ることができる。As described above, according to the present invention,
The cooling efficiency can be increased more than before, and thereby the performance of electronic devices such as an inverter device for an electric vehicle can be improved.
【図１】 本発明の実施形態におけるインバータ装置構
成図である。FIG. 1 is a configuration diagram of an inverter device according to an embodiment of the present invention.
【図２】 図１における一部拡大図である。FIG. 2 is a partially enlarged view of FIG.
【図３】 ヒートシンクの裏面側に形成された冷却フィ
ンの構成図である。FIG. 3 is a configuration diagram of cooling fins formed on the back side of the heat sink.
【図４】 ヒートシンクの裏面側に形成された冷却フィ
ンの他の構成図である。FIG. 4 is another configuration diagram of the cooling fin formed on the back surface side of the heat sink.
【図５】 流量と通水抵抗との関係を示すグラフ図であ
る。FIG. 5 is a graph showing a relationship between a flow rate and water flow resistance.
【図６】 従来の平行平板型フィンの構成図である。FIG. 6 is a configuration diagram of a conventional parallel plate fin.
【図７】 従来のピン型フィンの構成図である。FIG. 7 is a configuration diagram of a conventional pin fin.
【符号の説明】 １０ インバータ装置、１２ ＩＧＢＴ、１８ ヒート
シンク、１８ａ 冷却フィン。[Description of Signs] 10 inverter device, 12 IGBT, 18 heat sink, 18a cooling fin.
フロントページの続き (72)発明者 星 潤 愛知県豊田市トヨタ町１番地 トヨタ自動 車株式会社内 (72)発明者 大木島 純 愛知県豊田市トヨタ町１番地 トヨタ自動 車株式会社内 (72)発明者 岡口 茂樹 愛知県豊田市トヨタ町１番地 トヨタ自動 車株式会社内 (72)発明者 岡本 好司 愛知県刈谷市豊田町２丁目１番地 株式会 社豊田自動織機製作所内 Ｆターム(参考） 5E322 AA01 AA05 FA01 5F036 AA01 BA10 BA24 BB41 Continued on the front page (72) Inventor Jun Hoshi 1 Toyota Town, Toyota City, Aichi Prefecture Inside Toyota Motor Corporation (72) Inventor Jun Okishima 1 Toyota Town, Toyota City, Aichi Prefecture Inside Toyota Motor Corporation (72) Inventor Shigeki Okaguchi 1 Toyota Town, Toyota City, Aichi Prefecture Inside Toyota Automobile Co., Ltd. (72) Inventor Yoshiji Okamoto 2-1-1 Toyota Town, Kariya City, Aichi Prefecture F-term in Toyota Industries Corporation (Reference) 5E322 AA01 AA05 FA01 5F036 AA01 BA10 BA24 BB41
Claims (6)
フィン装置であって、 前記離散的に形成されたフィンはそれぞれ冷却液の流れ
方向に対して流線形状を有することを特徴とする冷却フ
ィン装置。1. A cooling fin device having discretely formed fins, wherein each of the discretely formed fins has a streamline shape with respect to a flow direction of a cooling liquid. Fin device.
の傾きを有することを特徴とする冷却フィン装置。2. The cooling fin device according to claim 1, wherein a center axis of the fin has a predetermined angle with respect to the flow direction.
おいて、 前記フィンは前記流れ方向に沿って複数列から構成され
ることを特徴とする冷却フィン装置。3. The cooling fin device according to claim 1, wherein the fins are formed in a plurality of rows along the flow direction.
直な方向において異なる直線上に配置されることを特徴
とする冷却フィン装置。4. The cooling fin device according to claim 3, wherein the fins in rows adjacent to each other are arranged on different straight lines in a direction perpendicular to the flow direction.
ィン装置を有する電機機器。5. An electric machine having the cooling fin device according to claim 1.
ィン装置を有するインバータ装置。6. An inverter device comprising the cooling fin device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000385780A JP2002185175A (en) | 2000-12-19 | 2000-12-19 | Cooling fin device and instrument thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000385780A JP2002185175A (en) | 2000-12-19 | 2000-12-19 | Cooling fin device and instrument thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002185175A true JP2002185175A (en) | 2002-06-28 |
Family
ID=18852988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000385780A Pending JP2002185175A (en) | 2000-12-19 | 2000-12-19 | Cooling fin device and instrument thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002185175A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004025808A1 (en) * | 2002-09-13 | 2004-03-25 | Aisin Aw Co., Ltd. | Drive device |
| WO2007089011A1 (en) * | 2006-01-31 | 2007-08-09 | Toyota Jidosha Kabushiki Kaisha | Cooling structure of power semiconductor element and inverter |
| WO2011087028A1 (en) * | 2010-01-12 | 2011-07-21 | 日本軽金属株式会社 | Substrate with integrated fins and method of manufacturing substrate with integrated fins |
| WO2012143770A2 (en) | 2011-04-20 | 2012-10-26 | Toyota Jidosha Kabushiki Kaisha | Cooling fin structure |
| JP2014075385A (en) * | 2012-10-02 | 2014-04-24 | Toyota Industries Corp | Cooling device and semiconductor device |
| JP2018147997A (en) * | 2017-03-03 | 2018-09-20 | 地方独立行政法人大阪産業技術研究所 | Heat sink and manufacturing method thereof |
-
2000
- 2000-12-19 JP JP2000385780A patent/JP2002185175A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004025808A1 (en) * | 2002-09-13 | 2004-03-25 | Aisin Aw Co., Ltd. | Drive device |
| US7102260B2 (en) | 2002-09-13 | 2006-09-05 | Aisin Aw Co., Ltd. | Drive device |
| CN100334792C (en) * | 2002-09-13 | 2007-08-29 | 爱信艾达株式会社 | Drive device |
| WO2007089011A1 (en) * | 2006-01-31 | 2007-08-09 | Toyota Jidosha Kabushiki Kaisha | Cooling structure of power semiconductor element and inverter |
| JP2007207917A (en) * | 2006-01-31 | 2007-08-16 | Toyota Motor Corp | Cooling structure and inverter of power semiconductor element |
| US7876563B2 (en) | 2006-01-31 | 2011-01-25 | Toyota Jidosha Kabushiki Kaisha | Cooling structure of power semiconductor device and inverter |
| WO2011087028A1 (en) * | 2010-01-12 | 2011-07-21 | 日本軽金属株式会社 | Substrate with integrated fins and method of manufacturing substrate with integrated fins |
| JP2011166122A (en) * | 2010-01-12 | 2011-08-25 | Nippon Light Metal Co Ltd | Substrate integrated with fin, and method of manufacturing the same |
| US8927873B2 (en) | 2010-01-12 | 2015-01-06 | Dowa Metaltech Co., Ltd | Fin-integrated substrate and manufacturing method of fin-integrated substrate |
| WO2012143770A2 (en) | 2011-04-20 | 2012-10-26 | Toyota Jidosha Kabushiki Kaisha | Cooling fin structure |
| CN103503591A (en) * | 2011-04-20 | 2014-01-08 | 丰田自动车株式会社 | Cooling fin structure |
| US9523541B2 (en) | 2011-04-20 | 2016-12-20 | Toyota Jidosha Kabushiki Kaisha | Cooling fin structure |
| JP2014075385A (en) * | 2012-10-02 | 2014-04-24 | Toyota Industries Corp | Cooling device and semiconductor device |
| JP2018147997A (en) * | 2017-03-03 | 2018-09-20 | 地方独立行政法人大阪産業技術研究所 | Heat sink and manufacturing method thereof |
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