JP2002184955A - Integrate circuit device - Google Patents

Integrate circuit device

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Publication number
JP2002184955A
JP2002184955A JP2000385647A JP2000385647A JP2002184955A JP 2002184955 A JP2002184955 A JP 2002184955A JP 2000385647 A JP2000385647 A JP 2000385647A JP 2000385647 A JP2000385647 A JP 2000385647A JP 2002184955 A JP2002184955 A JP 2002184955A
Authority
JP
Japan
Prior art keywords
terminal
integrated circuit
characteristic adjustment
circuit device
characteristic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000385647A
Other languages
Japanese (ja)
Other versions
JP4483080B2 (en
Inventor
Kiyoshi Otsuka
澄 大塚
Nobukazu Oba
伸和 大場
Makoto Hatanaka
誠 畑中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2000385647A priority Critical patent/JP4483080B2/en
Publication of JP2002184955A publication Critical patent/JP2002184955A/en
Application granted granted Critical
Publication of JP4483080B2 publication Critical patent/JP4483080B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Pressure Sensors (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve noise resistant strength in an integrated circuit device for cutting off a conduction between characteristic regulating terminal and an integrated circuit after the characteristics are regulated. SOLUTION: Since a noise charged to the characteristic regulating terminal 3 is guided to a ground terminal 14 via a Zener diode 15 when a high voltage is applied to the terminal 3 by providing the diode 15 between the terminal 3 and the terminal 14, the noise resistance strength of the terminal 3 is improved. Thus, since an element in the circuit body 12 such as an operational amplifier or the like disposed near the terminal 3 is not erroneously operated, an output change of a pressure sensor chip 5 can be suppressed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、特性調整用端子を
有する集積回路装置に関するもので、特にその特性調整
用端子におけるノイズの除去方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device having a characteristic adjusting terminal, and more particularly to a method for removing noise from the characteristic adjusting terminal.

【0002】[0002]

【従来技術】従来、圧力センサなどのブリッジ回路を有
するセンサチップに、ブリッジ回路からの信号を処理す
る信号処理回路を集積化した集積回路装置において、特
性調整用端子を設けて、集積回路装置の特性を調整した
ものがある。
2. Description of the Related Art Conventionally, in an integrated circuit device in which a signal processing circuit for processing a signal from the bridge circuit is integrated on a sensor chip having a bridge circuit such as a pressure sensor, a characteristic adjusting terminal is provided. There are those with adjusted characteristics.

【0003】ところが、特性調整用端子は、特性を調整
した後も集積回路装置に残存するため、集積回路装置の
外部から特性調整用端子を伝って、静電気などのノイズ
が集積回路に誘導され、それによって集積回路の内部に
設けられたブリッジ回路のバランスが崩れ、集積回路の
出力が変動してしまうという欠点があった。
However, since the characteristic adjustment terminal remains in the integrated circuit device even after the characteristic is adjusted, noise such as static electricity is guided to the integrated circuit through the characteristic adjustment terminal from outside the integrated circuit device. As a result, the balance of the bridge circuit provided inside the integrated circuit is lost, and the output of the integrated circuit fluctuates.

【0004】そこで、特開昭63−187669号に開
示されているように、特性調整後に、特性調整用端子と
集積回路とを接続している抵抗素子を、レーザなどによ
って切断して、特性調整用端子と集積回路との導通を遮
断することで、上記問題点を解決していた。
Therefore, as disclosed in Japanese Patent Application Laid-Open No. 63-187669, after the characteristic adjustment, the resistance element connecting the characteristic adjustment terminal and the integrated circuit is cut with a laser or the like to adjust the characteristic. The above problem has been solved by interrupting conduction between the terminal for use and the integrated circuit.

【0005】[0005]

【発明が解決しようとする課題】しかし、特性調整用端
子が電気的に浮いた状態になることによって、特性調整
用端子の放電ルートがなくなり、静電気などのノイズが
特性調整用端子に帯電してしまう。
However, when the characteristic adjustment terminal is in an electrically floating state, the discharge route of the characteristic adjustment terminal is eliminated, and noise such as static electricity is charged on the characteristic adjustment terminal. I will.

【0006】帯電したノイズが小さいと集積回路に影響
はないが、帯電したノイズが数十ボルト(例えば−30
ボルト)になると、特性調整用端子の配線と近接に配置
されたオペアンプなどの集積回路内部の素子の配線との
間に形成された寄生容量が無視できなくなり、それによ
ってオペアンプなどの集積回路内部の素子が誤作動を起
こし、集積回路の出力が変動するという問題がある。
[0006] If the charged noise is small, the integrated circuit is not affected, but the charged noise is several tens of volts (for example, -30 volts).
Volts), the parasitic capacitance formed between the wiring of the characteristic adjustment terminal and the wiring of elements inside the integrated circuit such as an operational amplifier placed in close proximity cannot be neglected. There is a problem that the device malfunctions and the output of the integrated circuit fluctuates.

【0007】そこで、本発明は、上記問題点に鑑み、特
性を調整後に、特性調整用端子と集積回路との導通を遮
断した集積回路装置において、耐ノイズ強度の向上を目
的とする。
SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to improve the noise resistance of an integrated circuit device in which conduction between the characteristic adjustment terminal and the integrated circuit is cut off after adjusting the characteristics.

【0008】[0008]

【課題を解決するための手段】請求項1に記載の集積回
路装置は、少なくとも出力端子と接地端子と特性調整用
端子とを有する集積回路装置において、集積回路装置と
特性調整用端子とを接続し、特性調整用端子を用いて集
積回路の特性を調整した後に、集積回路装置と特性調整
用端子との導通を遮断する接続部と、特性調整用端子と
接地端子との間に接続された電子素子とを備えたことを
特徴としている。
According to a first aspect of the present invention, there is provided an integrated circuit device having at least an output terminal, a ground terminal, and a characteristic adjusting terminal, wherein the integrated circuit device is connected to the characteristic adjusting terminal. Then, after adjusting the characteristics of the integrated circuit by using the characteristic adjustment terminal, the connection portion that interrupts conduction between the integrated circuit device and the characteristic adjustment terminal, and the connection portion that is connected between the characteristic adjustment terminal and the ground terminal. An electronic device is provided.

【0009】特性調整用端子と接地端子との間に電子素
子を接続したことにより、特性調整用端子と接地端子と
の間の導通がとれ、特性調整用端子に帯電したノイズ
が、電子素子を伝って接地端子に導かれるため、特性調
整用端子における耐ノイズ強度を向上させることができ
る。
Since the electronic element is connected between the characteristic adjustment terminal and the ground terminal, conduction between the characteristic adjustment terminal and the ground terminal is established, and noise charged on the characteristic adjustment terminal causes the electronic element to be damaged. Since it is guided to the ground terminal, the noise resistance of the characteristic adjustment terminal can be improved.

【0010】特性調整用端子における耐ノイズ強度が向
上することによって、特性調整用端子と近接に配置され
た、オペアンプなどの集積回路内部の素子が誤作動を起
こすことがなくなるため、集積回路の出力変動を抑制す
ることができる。
By improving the noise resistance of the characteristic adjustment terminal, elements inside the integrated circuit such as an operational amplifier, which are arranged close to the characteristic adjustment terminal, do not malfunction. Fluctuations can be suppressed.

【0011】請求項2に記載の集積回路装置は、特性調
整用端子と接地端子との間に接続された電子素子は、集
積回路装置内の集積化チップ内部に設けられたことを特
徴としている。
According to a second aspect of the present invention, in the integrated circuit device, the electronic element connected between the characteristic adjusting terminal and the ground terminal is provided inside an integrated chip in the integrated circuit device. .

【0012】集積回路装置内の集積化チップ外部に電子
素子を設けると、部品点数が増加してしまうのが、電子
素子を集積化チップ内部に設けたことにより、部品点数
の増加を防止できる。
When an electronic element is provided outside the integrated chip in the integrated circuit device, the number of components increases. However, by providing the electronic element inside the integrated chip, an increase in the number of components can be prevented.

【0013】請求項3に記載の集積回路装置は、電子素
子として、ツェナーダイオードを用いることを特徴とし
ている。
The integrated circuit device according to the third aspect is characterized in that a Zener diode is used as the electronic element.

【0014】電子素子として、ツェナーダイオードの他
に抵抗値の極めて高い高抵抗素子などを用いた場合であ
っても、特性調整用端子における耐ノイズ強度を向上さ
せることができるが、高抵抗素子はツェナーダイオード
に比べてサイズが大きいため、高抵抗素子を用いるとチ
ップサイズの増加に繋がる。
Even when a high resistance element having a very high resistance value is used as an electronic element in addition to the Zener diode, the noise resistance at the characteristic adjusting terminal can be improved. Since the size is larger than that of the Zener diode, the use of a high-resistance element leads to an increase in chip size.

【0015】よって、電子素子としては、ツェナーダイ
オードを用いるのが好ましい。
Therefore, it is preferable to use a Zener diode as the electronic element.

【0016】[0016]

【発明の実施の形態】以下、本発明を圧力センサに適用
した一実施形態を図面に従って説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment in which the present invention is applied to a pressure sensor will be described below with reference to the drawings.

【0017】尚、本実施形態の圧力センサは、例えば、
車輌用のエンジンにおけるオイル圧の検出に用いられ
る。
The pressure sensor according to the present embodiment is, for example,
It is used for detecting oil pressure in a vehicle engine.

【0018】図1には、本実施形態の圧力センサ16の
平面構造を示す。また、図2(a)には、図1における
要部拡大図を示し、図2(b)には、図1におけるA矢
視図を示す。
FIG. 1 shows a planar structure of the pressure sensor 16 of the present embodiment. 2A shows an enlarged view of a main part in FIG. 1, and FIG. 2B shows a view taken in the direction of arrow A in FIG.

【0019】まず、ケースプラグ1の内部には、コネク
タピン2と特性調整用端子3とが予め設けられるととも
に、ケースプラグ1の一方の面から、コネクタピン2及
び特性調整用端子3が外部に露出している。
First, a connector pin 2 and a characteristic adjusting terminal 3 are provided beforehand inside the case plug 1, and the connector pin 2 and the characteristic adjusting terminal 3 are externally provided from one surface of the case plug 1. It is exposed.

【0020】尚、コネクタピン2は電源端子、接地端
子、出力端子の3端子からなる(図1には1端子のみ図
示)。
The connector pin 2 has three terminals: a power terminal, a ground terminal, and an output terminal (only one terminal is shown in FIG. 1).

【0021】以下の説明において、接地端子を14とす
る。
In the following description, it is assumed that the ground terminal is 14.

【0022】さらに、ケースプラグ1とコネクタピン2
及び特性調整用端子3との気密性を保つために、シリコ
ン系樹脂からなるピンシール4によって、ケースプラグ
1とコネクタピン2及び特性調整用端子3とが接着され
ている。
Further, a case plug 1 and a connector pin 2
In addition, in order to maintain the airtightness with the characteristic adjustment terminal 3, the case plug 1, the connector pin 2, and the characteristic adjustment terminal 3 are adhered by a pin seal 4 made of a silicone resin.

【0023】また、ケースプラグ1の他方の面には、圧
力センサチップ5が接着剤により接着され、さらに、ア
ルミニウムよりなるボンディングワイヤ6により、圧力
センサチップ5とコネクタピン2及び特性調整用端子3
とが電気的に接続されている。
A pressure sensor chip 5 is adhered to the other surface of the case plug 1 with an adhesive, and the pressure sensor chip 5 is connected to the connector pins 2 and the characteristic adjustment terminals 3 by bonding wires 6 made of aluminum.
And are electrically connected.

【0024】そして、圧力センサチップ5内に設けられ
たブリッジ回路を平衡状態にするために、圧力センサチ
ップ5上に形成された薄膜抵抗をレーザートリミング
し、その時ブリッジ回路から出力される信号を、特性調
整用端子3を用いてモニタすることで、圧力センサチッ
プ5の特性を調整する。
Then, in order to equilibrate the bridge circuit provided in the pressure sensor chip 5, the thin film resistor formed on the pressure sensor chip 5 is laser-trimmed, and the signal output from the bridge circuit at that time is The characteristic of the pressure sensor chip 5 is adjusted by monitoring using the characteristic adjustment terminal 3.

【0025】尚、この特性調整は、圧力センサチップ5
から出力される出力値が規格値になるように調整され
る。また、その他には、温度特性やオフセット調整が行
われる。
This characteristic adjustment is performed by the pressure sensor chip 5.
Is adjusted so that the output value output from the device becomes a standard value. In addition, temperature characteristics and offset adjustment are performed.

【0026】その後、圧力センサチップ5の一部拡大図
である図2(a)に示されるように、圧力センサチップ
5の内部において、特性調整用端子3に接続されている
ボンディングワイヤ6aと圧力センサチップ5の回路本
体12とを接続しているトリミング抵抗13を、レーザ
ーにより切断し、特性調整用端子3と回路本体12との
導通を遮断する。
Then, as shown in FIG. 2A, which is a partially enlarged view of the pressure sensor chip 5, inside the pressure sensor chip 5, the bonding wire 6a connected to the characteristic adjusting terminal 3 and the pressure The trimming resistor 13 connecting the sensor chip 5 to the circuit main body 12 is cut by a laser, and the conduction between the characteristic adjustment terminal 3 and the circuit main body 12 is cut off.

【0027】最後に、メタルダイヤフラム7とリングウ
ェルド8とが溶接により固着されているハウジング9と
ケースプラグ1とを、Oリング10と封入オイル11と
によって接着することにより、本実施形態の圧力センサ
16は完成となる。
Finally, the housing 9 to which the metal diaphragm 7 and the ring weld 8 are fixed by welding and the case plug 1 are adhered by the O-ring 10 and the sealing oil 11, so that the pressure sensor of the present embodiment is provided. 16 is completed.

【0028】ところが、このとき特性調整用端子3は、
電気的に浮いた(フローティング)状態になるため、特
性調整用端子3の放電ルートがなくなり、静電気などの
ノイズが特性調整用端子3に帯電してしまう。
However, at this time, the characteristic adjustment terminal 3
Since the terminal is in an electrically floating state, the characteristic adjustment terminal 3 has no discharge route, and noise such as static electricity is charged on the characteristic adjustment terminal 3.

【0029】帯電したノイズが小さいと圧力センサチッ
プ5に影響はないが、帯電したノイズが数十ボルト(例
えば−30ボルト)になると、特性調整用端子3の配線
と近接に配置されたオペアンプなどの回路本体12内部
の素子の配線との間に形成された寄生容量が無視できな
くなり、それによってオペアンプなどの回路本体12内
部の素子が誤作動を起こし、圧力センサチップ5の出力
が変動するという問題がある。
If the charged noise is small, the pressure sensor chip 5 is not affected, but if the charged noise is several tens of volts (for example, -30 volts), an operational amplifier or the like arranged close to the wiring of the characteristic adjusting terminal 3 The parasitic capacitance formed between the wirings of the elements inside the circuit body 12 cannot be ignored, thereby causing the elements inside the circuit body 12 such as the operational amplifier to malfunction and the output of the pressure sensor chip 5 to fluctuate. There's a problem.

【0030】そこで、本実施形態では、図2(a)に示
されるように、特性調整用端子3と接地端子14との間
に、ツェナーダイオード15を設けている。
Therefore, in the present embodiment, as shown in FIG. 2A, a Zener diode 15 is provided between the characteristic adjusting terminal 3 and the ground terminal 14.

【0031】具体的には、圧力センサチップ5内におい
て、特性調整用端子3に接続されるボンディングワイヤ
6aと、接地端子14に接続されるボンディングワイヤ
6bとの間に、ツェナーダイオード15を設けている。
Specifically, a zener diode 15 is provided between the bonding wire 6a connected to the characteristic adjusting terminal 3 and the bonding wire 6b connected to the ground terminal 14 in the pressure sensor chip 5. I have.

【0032】特性調整用端子3と接地端子14との間に
ツェナーダイオード15を設けたことにより、特性調整
用端子3に高電圧が印加された際には、特性調整用端子
3と接地端子14との間の導通がとれ、特性調整用端子
3に帯電したノイズが、ツェナーダイオード15を伝っ
て接地端子14に導かれるため、特性調整端子3におけ
る耐ノイズ強度が向上する。
Since the zener diode 15 is provided between the characteristic adjustment terminal 3 and the ground terminal 14, when a high voltage is applied to the characteristic adjustment terminal 3, the characteristic adjustment terminal 3 and the ground terminal And the noise charged in the characteristic adjustment terminal 3 is guided to the ground terminal 14 via the Zener diode 15, so that the noise resistance at the characteristic adjustment terminal 3 is improved.

【0033】尚、圧力センサチップ5の特性調整は低電
圧で行っているため、ツェナーダイオード15はブレー
クダウンせず、特性調整用端子3と接地端子14とを電
気的に切り離す役目も果たす。
Since the characteristic adjustment of the pressure sensor chip 5 is performed at a low voltage, the Zener diode 15 does not break down and also serves to electrically disconnect the characteristic adjustment terminal 3 from the ground terminal 14.

【0034】特性調整端子3における耐ノイズ強度が向
上することによって、特性調整用端子3と近接に配置さ
れた、オペアンプなどの回路本体12内部の素子が誤作
動を起こすことがなくなるため、圧力センサチップ5の
出力変動を抑制することができる。
Since the noise resistance of the characteristic adjustment terminal 3 is improved, elements inside the circuit main body 12 such as an operational amplifier disposed close to the characteristic adjustment terminal 3 do not malfunction. Output fluctuation of the chip 5 can be suppressed.

【0035】尚、ノイズの電圧が正の場合には、ノイズ
の電圧がツェナーダイオード15の降伏電圧を超える
と、特性調整端子3と接地端子14との間が導通し、ノ
イズの電圧が負の場合には、ツェナーダイオード15に
対し順方向バイアスとなるため、PN接合の順方向電圧
以上で特性調整端子3と接地端子14との間が導通し、
特性調整端子3に回路本体12に影響を及ぼすほどのノ
イズが帯電してしまうことを防止できる。
When the noise voltage is positive and the noise voltage exceeds the breakdown voltage of the Zener diode 15, conduction between the characteristic adjustment terminal 3 and the ground terminal 14 occurs, and the noise voltage becomes negative. In this case, a forward bias is applied to the Zener diode 15, so that a continuity between the characteristic adjustment terminal 3 and the ground terminal 14 occurs at a forward voltage of the PN junction or higher,
It is possible to prevent the characteristic adjustment terminal 3 from being charged with noise that affects the circuit body 12.

【0036】尚、本発明は、上記実施形態に限られるも
のではなく、様々な態様に適用可能である。
The present invention is not limited to the above embodiment, but can be applied to various modes.

【0037】例えば、本実施形態では、ツェナーダイオ
ード15を圧力センサチップ5の内部に設けたが、図2
(b)に示されるように、圧力センサチップ5の外部に
ツェナーダイオード15を設けた構造であっても、本実
施形態と同様の効果が得られる。
For example, in the present embodiment, the Zener diode 15 is provided inside the pressure sensor chip 5;
As shown in (b), even with a structure in which the Zener diode 15 is provided outside the pressure sensor chip 5, the same effect as in the present embodiment can be obtained.

【0038】ただし、圧力センサチップ5の外部にツェ
ナーダイオード15を設けると、部品点数の増加という
問題に繋がる。
However, providing the zener diode 15 outside the pressure sensor chip 5 leads to a problem of an increase in the number of parts.

【0039】よって、ツェナーダイオード15は、圧力
センサチップ5の内部に設けた方が好ましい。
Therefore, it is preferable that the Zener diode 15 is provided inside the pressure sensor chip 5.

【0040】また、本実施形態では、耐ノイズ強度を向
上させるために、ツェナーダイオード15を設けたが、
このツェナーダイオード15の代わりに高抵抗素子を用
いた構造であっても、本実施形態と同様の効果が得られ
る。尚、高抵抗素子の抵抗値としては1MΩ程度が望ま
しい。
In this embodiment, the Zener diode 15 is provided to improve the noise resistance.
Even with a structure using a high-resistance element instead of the Zener diode 15, the same effect as in the present embodiment can be obtained. Incidentally, the resistance value of the high resistance element is desirably about 1 MΩ.

【0041】この高抵抗素子の抵抗値は、圧力センサチ
ップ5の特性調整時、特性調整用端子3を用いて、ブリ
ッジ回路から出力される信号をモニタする際に、影響が
出ないように高い値とする。
The resistance value of the high resistance element is so high that the signal output from the bridge circuit is monitored by using the characteristic adjustment terminal 3 when adjusting the characteristics of the pressure sensor chip 5 so as not to be affected. Value.

【0042】ただし、高抵抗素子はツェナーダイオード
15に比べてサイズが大きいため、高抵抗素子を用いる
とチップサイズの増加に繋がる。
However, since the size of the high resistance element is larger than that of the Zener diode 15, the use of the high resistance element leads to an increase in chip size.

【0043】よって、特性調整用端子3と接地端子14
との間に用いる電子素子としては、ツェナーダイオード
15を用いるのが好ましい。
Therefore, the characteristic adjustment terminal 3 and the ground terminal 14
It is preferable to use a Zener diode 15 as an electronic element used between the two.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本実施形態の圧力センサの平面構造を示す図で
ある。
FIG. 1 is a diagram illustrating a planar structure of a pressure sensor according to an embodiment.

【図2】(a)は、図1の要部拡大図であり、(b)
は、図1におけるA矢視図である。
2A is an enlarged view of a main part of FIG. 1, and FIG.
FIG. 2 is a view as viewed from the direction of the arrow A in FIG. 1.

【符号の簡単な説明】[Brief description of reference numerals]

1…ケースプラグ、 2…コネクタピン、 3…特性調整用端子、 4…ピンシール、 5…圧力センサチップ、 6…ボンディングワイヤ、 7…メタルダイヤフラム、 8…リングウェルド、 9…ハウジング、 10…Oリング、 11…封入オイル、 12…回路本体、 13…トリミング抵抗、 14…接地端子、 15…ツェナーダイオード、 16…圧力センサ DESCRIPTION OF SYMBOLS 1 ... Case plug, 2 ... Connector pin, 3 ... Characteristic adjustment terminal, 4 ... Pin seal, 5 ... Pressure sensor chip, 6 ... Bonding wire, 7 ... Metal diaphragm, 8 ... Ring weld, 9 ... Housing, 10 ... O-ring , 11 ... Enclosed oil, 12 ... Circuit body, 13 ... Trimming resistor, 14 ... Ground terminal, 15 ... Zener diode, 16 ... Pressure sensor

───────────────────────────────────────────────────── フロントページの続き (72)発明者 畑中 誠 愛知県刈谷市昭和町1丁目1番地 株式会 社デンソー内 Fターム(参考) 4M112 AA01 EA03 FA20 GA03 5F038 BH05 BH13 BH19 DF01 EZ20 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Makoto Hatanaka 1-1-1 Showa-cho, Kariya-shi, Aichi F-term in DENSO Corporation (reference) 4M112 AA01 EA03 FA20 GA03 5F038 BH05 BH13 BH19 DF01 EZ20

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも出力端子と接地端子と特性調
整用端子とを有する集積回路装置において、 前記集積回路装置と前記特性調整用端子とを接続し、前
記特性調整用端子を用いて前記集積回路装置の特性を調
整した後に、前記集積回路装置と前記特性調整用端子と
の導通を遮断する接続部と、 前記特性調整用端子と前記接地端子との間に接続された
電子素子とを備えることを特徴とする集積回路装置。
1. An integrated circuit device having at least an output terminal, a ground terminal, and a characteristic adjustment terminal, wherein the integrated circuit device is connected to the characteristic adjustment terminal, and the integrated circuit is used by using the characteristic adjustment terminal. After adjusting the characteristics of the device, a connection portion for interrupting conduction between the integrated circuit device and the characteristic adjustment terminal, and an electronic element connected between the characteristic adjustment terminal and the ground terminal are provided. An integrated circuit device characterized by the above-mentioned.
【請求項2】 前記電子素子は、前記集積回路装置内の
集積化チップ内部に設けられたことを特徴とする請求項
1に記載の集積回路装置。
2. The integrated circuit device according to claim 1, wherein the electronic element is provided inside an integrated chip in the integrated circuit device.
【請求項3】 前記電子素子として、ツェナーダイオー
ドを用いることを特徴とする請求項1または2に記載の
集積回路装置。
3. The integrated circuit device according to claim 1, wherein a Zener diode is used as the electronic element.
JP2000385647A 2000-12-19 2000-12-19 Integrated circuit device Expired - Fee Related JP4483080B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000385647A JP4483080B2 (en) 2000-12-19 2000-12-19 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000385647A JP4483080B2 (en) 2000-12-19 2000-12-19 Integrated circuit device

Publications (2)

Publication Number Publication Date
JP2002184955A true JP2002184955A (en) 2002-06-28
JP4483080B2 JP4483080B2 (en) 2010-06-16

Family

ID=18852875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000385647A Expired - Fee Related JP4483080B2 (en) 2000-12-19 2000-12-19 Integrated circuit device

Country Status (1)

Country Link
JP (1) JP4483080B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015206602A (en) * 2014-04-17 2015-11-19 株式会社不二工機 Pressure sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015206602A (en) * 2014-04-17 2015-11-19 株式会社不二工機 Pressure sensor

Also Published As

Publication number Publication date
JP4483080B2 (en) 2010-06-16

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