JP2002184805A5 - - Google Patents
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- Publication number
- JP2002184805A5 JP2002184805A5 JP2000382222A JP2000382222A JP2002184805A5 JP 2002184805 A5 JP2002184805 A5 JP 2002184805A5 JP 2000382222 A JP2000382222 A JP 2000382222A JP 2000382222 A JP2000382222 A JP 2000382222A JP 2002184805 A5 JP2002184805 A5 JP 2002184805A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000382222A JP4034932B2 (en) | 2000-12-15 | 2000-12-15 | Semiconductor device, LED print head, and wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000382222A JP4034932B2 (en) | 2000-12-15 | 2000-12-15 | Semiconductor device, LED print head, and wire bonding method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002184805A JP2002184805A (en) | 2002-06-28 |
| JP2002184805A5 true JP2002184805A5 (en) | 2006-10-12 |
| JP4034932B2 JP4034932B2 (en) | 2008-01-16 |
Family
ID=18850087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000382222A Expired - Fee Related JP4034932B2 (en) | 2000-12-15 | 2000-12-15 | Semiconductor device, LED print head, and wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4034932B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7249302B2 (en) | 2020-03-19 | 2023-03-30 | 株式会社東芝 | semiconductor equipment |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4522079B2 (en) * | 2003-11-20 | 2010-08-11 | イビデン株式会社 | IC chip mounting substrate |
| KR101475314B1 (en) * | 2009-03-30 | 2014-12-23 | 엘지디스플레이 주식회사 | Light emitting diode backlight unit and liquid crystal display device module using the same |
| JP6196092B2 (en) | 2013-07-30 | 2017-09-13 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| US20230113637A1 (en) * | 2020-03-19 | 2023-04-13 | Kyocera Corporation | Light-emitting element array, optical printer head including light-emitting element array, and image forming apparatus |
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2000
- 2000-12-15 JP JP2000382222A patent/JP4034932B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7249302B2 (en) | 2020-03-19 | 2023-03-30 | 株式会社東芝 | semiconductor equipment |