JP2002181885A - Probe for measuring characteristic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance working efficiency when a probe is changed, reduce a cost required for evaluation of an electric characteristic, reduce a storage space, and allow a changed probe core to be easily set in a proper condition, in the characteristic measuring probe for measuring an electric characteristic of a semiconductor chip. SOLUTION: This characteristic measuring probe 1 is constituted of a probe board 10 provided with guide columns 11a-11d, and the probe core 20 having a frame 21 provided with opening parts 21a-21d and the probe 23 supported by the frame 21, and the probe core 20 is attched to the probe board 10 by magnetic force, while inserting the guide columns 11a-11d into the opening parts 21a-21d.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a characteristic measuring probe for measuring characteristics of a semiconductor chip, and more particularly, to measuring characteristics of the semiconductor chip by pressing a probe formed in a protruding shape against the semiconductor chip. The present invention relates to a probe for measuring characteristics.

[0002]

2. Description of the Related Art One of the methods for measuring the electrical characteristics of a semiconductor chip is to use a part of the semiconductor chip to be subjected to a sampling inspection.
There is a method of forming a characteristic measurement pattern called a so-called TEG (Test Element Group) and measuring the electric characteristics of the semiconductor chip using the TEG. The measurement of the electrical characteristics in such a method is performed by pressing a probe suitable for the formed TEG pattern arrangement on the TEG, and acquiring an output signal from the TEG via the probe.

[0003]

However, such T
Since the EG pattern is different for each type of semiconductor chip to be manufactured, the arrangement of the probe for pressing the TEG is also different for each type of semiconductor chip to be manufactured. For this reason, such a probe needs to be replaced for each type of semiconductor chip to be measured.
Since the probe was integrally formed with a characteristic measuring probe having a wiring pattern for transmitting a signal detected by the probe, such a probe must be replaced together with the characteristic measuring probe. There is a problem that the work efficiency at the time of replacement is poor.

Further, since a probe for measuring characteristics is required for each type of semiconductor chip to be manufactured, there is also a problem that the cost is high. Furthermore, since a characteristic measuring probe is required for each type of semiconductor chip to be manufactured, there is a problem that a large storage space is required for storing the probe.

Further, a method has been proposed in which only the probe core having a probe can be replaced from the characteristic measuring probe. In this method, the characteristic measuring probe is fixed to the probe core by a four-point screwing method. In this case, there is a problem that work efficiency at the time of replacing the probe core is poor.

Further, in this method, the probe core is
Since the probe for characteristic measurement is fixed to the probe board by the point screwing method, the flatness and distortion of the probe core fluctuate due to the tightening and tightening of the screws, making it difficult to install the probe core in an appropriate state There is also a problem that it is.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a characteristic measuring probe having a high working efficiency at the time of exchanging a probe. Another object of the present invention is to provide a characteristic measuring probe capable of evaluating electric characteristics of a plurality of types of semiconductor chips having different TEG patterns at low cost.

Another object of the present invention is to provide a characteristic measuring probe capable of reducing a storage space. Another object of the present invention is to provide a probe for measuring characteristics that allows a probe core to be replaced to be easily installed in an appropriate state.

[0009]

According to the present invention, there is provided a probe for measuring characteristics of a semiconductor chip, comprising: a probe board provided with a guide post; A frame attached to the probe board by magnetic force while inserting the guide pillar into the opening; and a probe supported by the frame and detecting a characteristic of the semiconductor chip by contacting the semiconductor chip. And a probe core.

Here, the probe board guides the frame to an appropriate position by the guide post, and the frame is guided to an appropriate position on the probe board by inserting the opening into the guide post, and the probe board is guided by the magnetic force. The probe is pressed against the semiconductor chip while being supported by the frame, and detects the electrical characteristics of the semiconductor chip.

In the characteristic measuring probe according to the present invention, preferably, the probe board has a magnetized probe board magnetized portion, and the frame is attached to the probe board by a magnetic force of the probe board magnetized portion. .

In the characteristic measuring probe according to the present invention, preferably, the probe board further has a probe board magnetic force adjusting mechanism for adjusting a magnetic force of the probe board magnetized portion with respect to the frame.

In the characteristic measuring probe of the present invention, the probe core is preferably detached from the probe board by weakening the magnetic force of the magnetized portion of the probe board with respect to the frame by the probe board magnetic force adjusting mechanism.

In the characteristic measuring probe according to the present invention, preferably, the frame has a magnetized frame magnetized portion, and the frame is attached to the probe board by:
This is performed by the magnetic force of the frame magnetized part.

In the characteristic measuring probe according to the present invention, preferably, the frame further includes a frame magnetic force adjusting mechanism for adjusting a magnetic force of the frame magnetized portion with respect to the probe board.

In the characteristic measuring probe of the present invention, the probe core is preferably detached from the probe board by weakening the magnetic force of the frame magnetized portion on the probe board by a frame magnetic force adjusting mechanism.

In the characteristic measuring probe of the present invention, preferably, the probe is formed in a protruding shape. Also,
In the characteristic measuring probe of the present invention, preferably, the guide pillars are provided at four positions so as to form four vertices of a substantially square shape, the frame is formed in a substantially square shape, and the opening is formed in a substantially square shape. Are formed one by one at each of the four apexes of the frame formed at the end.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. First, a first embodiment of the present invention will be described.

FIG. 1 is a perspective view showing a configuration of a characteristic measuring probe 1 according to the present embodiment. The characteristic measuring probe 1 mainly includes a probe board 10 as a base and a probe core 20 having a probe 23, and the probe core 20 is attached to the probe board 10 by magnetic force.

The probe board 10 includes the probe board 1
The bottom plate 13 provided on the bottom surface of the bottom plate 0, and the cylindrical guide columns 11 a to 11 provided at four places on the lower surface side of the bottom plate 13 so as to form four substantially square vertices perpendicular to the bottom plate 13.
11d, a magnet which is a magnetized probe board magnetized portion shown later, and a frame 21 of the probe board magnetized portion
A probe board lever 12, which is a probe board magnetic force adjusting mechanism for adjusting the magnetic force of the probe.

The probe core 20 has openings 21a-21
d is provided, and guide pillars 11a are provided in the openings 21a to 21d.
Probe board 1 by magnetic force while inserting
And a probe 23 that is supported by the frame 21 and detects the characteristics of the semiconductor chip by contacting the semiconductor chip.
Here, the frame 21 is formed in a substantially square shape, and the openings 21a to 21d are formed in the substantially square frame 21.
Are formed one at each of the four apexes. Also, probe 2
Reference numeral 3 is provided at the center of the frame 21 and is pressed against the semiconductor chip to detect the electrical characteristics of the semiconductor chip. Further, as a material of the frame 21, iron or the like can be used without particular limitation as long as the material generates an attractive force with respect to the magnetic force of the magnet of the probe board 10.

FIG. 2 is an enlarged perspective view of the probe 23. FIG.
As shown in (1), the probe 23 is a plurality of conductors formed in a projecting shape, and the arrangement thereof is determined according to the TEG pattern of the semiconductor chip to be measured.

FIGS. 3 and 4 show the probe board lever 1.
FIG. 7 is a diagram showing an operation of the probe board 10 when the user operates the probe board 2; Here, FIG. 3A and FIG.
3A is a perspective view of the probe board 10, and FIGS. 3B and 4B are cross-sectional views taken along line AA in FIG. 3A or FIG. 4A. I have.

As shown in FIGS. 3B and 4B, a middle plate 14 is provided inside the bottom plate 13 inside the probe board 10, and further inside the probe board lever. A magnet 15, which is a magnetized probe board magnetized portion that moves in a direction substantially perpendicular to the middle plate 14 by the operation of 12, is provided.

As shown in FIG. 3, when the probe board lever 12 is located on the right side of the probe board 10,
When the probe board lever 12 is moved in the direction B (left direction) shown in FIG. 3A, the magnet 15 is disposed in contact with the inner portion of the middle plate 14. It moves in the direction C (upward) shown in b). Then, as shown in FIG. 4, when the probe board lever 12 reaches the left side of the probe board 10, this magnet 15 is arranged at a certain distance from the middle plate 14. By moving the magnet 15 by operating the probe board lever 12 in this manner, the probe core 20 is moved.
15 at the time of attachment to the probe board 10
Can adjust the magnetic force on the frame 21.

Next, the operation of attaching the probe core 20 to the probe board 10 will be described. FIG. 5 is a perspective view showing a state where the probe core 20 is attached to the probe board 10. Here, FIG. 5A is a perspective view showing a state when the probe core 20 is attached to the probe board 10, and FIG. 5B is a perspective view showing a state after the attachment. It is. In FIG. 5, the probe board 10 shows only the peripheral portions of the guide columns 11a to 11d.

First, the operation of attaching the probe core 20 to the probe board 10 will be described. As shown in FIG. 3, the probe core 20 is attached to the probe board 10 with the probe board lever 12 disposed on the right side and the magnet 15 in contact with the middle plate 14.

As shown in FIG. 5A, the probe core 20 is attached to the probe board 10 such that the surface of the probe core 20 on which the probe 23 is provided is opposite to the probe board 10 side. And the guide pillar 11a is inserted into the opening 21a, the guide pillar 11b is inserted into the opening 21b, the guide pillar 11c is inserted into the opening 21c, and the guide pillar 11d is inserted into the opening 21d. Done in state.

As described above, the probe core 20 in which the guide columns 11a to 11d are inserted into the openings 21a to 21d,
The frame 21 is attracted to the probe board 10 by the magnetic force of the magnet 15, so that the probe board 10
Is attached to the lower surface of the bottom plate 13.

FIG. 5B is a perspective view showing the manner in which the probe core 20 is attached to the probe board 10 as described above. As shown in FIG. 5B, the probe core 20 attached to the probe board 10 has the probe 23 facing outward by inserting the guide columns 11a to 11d into the openings 21a to 21d. With bottom plate 1
3 and is fixed to the lower surface of the bottom plate 13 by the magnetic force of the magnet 15.

Next, an operation of removing the probe core 20 from the probe board 10 will be described. Removal of the probe core 20 from the probe board 10 is performed by operating the probe board lever 12 to weaken the magnetic force of the magnet 15 on the frame 21. Specifically, the probe board lever 12 is moved to the left side of the probe board 10 as shown in FIG.
(B), the magnet 15 is separated from the upper surface of the intermediate plate 14 by a predetermined distance, and the relative distance of the magnet 15 to the frame 21 of the probe core 20 attached to the probe board 10 is increased. 2
The probe core 20 is removed by weakening the magnetic force on the probe core 20.

As described above, in the present embodiment, since the probe core 20 having the probe 23 is configured separately from the probe board 10, the replacement of the probe
This can be performed in units of 0, and the work efficiency at the time of probe replacement can be improved.

Further, since the probe core 20 is formed separately from the probe board 10, the probe corresponding to the type of each semiconductor chip to be manufactured is replaced not in the unit of the probe for characteristic measurement but in the unit of the probe core 20. This makes it possible to reduce the cost of the apparatus required for measuring the characteristics of the semiconductor chip as a whole.

Further, since the probe core 20 is formed separately from the probe board 10, the probe cores 2 corresponding to the types of the respective semiconductor chips to be manufactured are provided.
Only 0 should be retained, compared to the case where storage must be performed for each characteristic measurement probe.
The storage space can be reduced.

The guide columns 1 are provided in the openings 21a to 21d.
1a to 11d are inserted, and the probe core 20 is attached to the probe board 10 by the magnetic force of the magnet 15, so that the attachment and detachment of the probe core 20 become easy, and the work efficiency at the time of replacing the probe core 20 can be improved. It becomes possible.

Further, since the probe core 20 is attached to the probe board 10 by the magnetic force of the magnet 15, the flatness and the degree of distortion of the attached probe board 10 can be kept constant, and the probe core can be easily attached. It can be installed in an appropriate state.

Next, a second embodiment of the present invention will be described. This embodiment is a modification of the first embodiment, and differs from the first embodiment mainly in that a magnet and a mechanism for adjusting its magnetic force are provided on the probe core 20 side. In the following, description will be made focusing on differences from the first embodiment, and description of items common to the first embodiment will be omitted.

FIG. 6 is a perspective view showing the configuration of the characteristic measuring probe 30 in the present embodiment. Similarly to the first embodiment, the characteristic measuring probe 30 of the present embodiment also includes a probe board 40 and a probe core 50, and the probe core 50 is attached to the probe board 40 by magnetic force.

The probe board 40 has a bottom plate 43 and guide pillars 41a to 41d as in the first embodiment.
However, a magnet and a mechanism for adjusting its magnetic force may not be provided. However, for the bottom plate 43, it is necessary to use a material that generates an attractive force with respect to the magnetic force of the magnet of the probe board 10, and there is no particular limitation on iron or the like as long as the material has such properties.

The probe core 50 includes an upper surface plate 51 provided on a surface on which the frame 51 and the probe 53 are not provided.
f, a magnet which is a magnetized frame magnetized portion, which will be described later, and a probe core lever 51e which is a frame magnetic force adjusting mechanism for adjusting a magnetic force of the frame magnetized portion with respect to the probe board 40.

FIGS. 7 and 8 show the probe core lever 51.
FIG. 9 is a diagram showing the operation of the probe core 50 when the user operates the e. Here, (a) of FIG. 7 and (a) of FIG.
7A is a perspective view of the probe core 50, and FIGS. 7B and 8B are cross-sectional views taken along line DD in FIG. 7A or FIG. 8A. I have.

As shown in FIGS. 7 (b) and 8 (b), inside the probe core 50, the upper portion of the upper surface plate 51f (inside) is substantially the same as the upper surface plate 51f by operating the probe core lever 51e. A magnet 54, which is a magnetized frame magnetized part that moves in the vertical direction, is provided.

As shown in FIG. 7A, when the probe core lever 51e is located on the right side of the frame 51, the magnet 54 is disposed in contact with the inner portion of the upper plate 51f, and the probe core lever 51e Is moved in the E direction (left direction) shown in FIG.
It moves in the direction F (upward) shown in FIG. When the probe core lever 51e reaches the left side of the probe core 50 as shown in FIG.
4 is arranged at a certain distance from the upper surface plate 51f. By moving the magnet 54 by operating the probe core lever 51e in this manner, it is possible to adjust the magnetic force of the magnet 54 on the probe board 40 when the probe core 50 is attached to the probe board 40.

Next, the operation of attaching the probe core 50 to the probe board 40 will be described. The only difference between the mounting operation of the probe core 50 of the present embodiment and the first embodiment is the difference in the source of magnetic force during the mounting. That is, in the first embodiment, the probe core 20 is attached to the probe board 10 by the magnetic force of the magnet 15 of the probe board 10, but in the present embodiment, the magnetic force of the magnet 54 of the probe core 50 is Probe core 50 to probe board 40
Attach to Other points are the same as those in the first embodiment.

Next, an operation of removing the probe core 50 from the probe board 40 will be described. The difference of the operation of removing the probe core 50 of the present embodiment from the first embodiment is mainly the method of adjusting the magnetic force when the probe core 50 is removed. That is, in the first embodiment, the magnetic force of the magnet 15 of the probe board 10 with respect to the frame 21 is reduced by operating the probe board lever 12, and the probe core 20 is detached. By operating the core lever 51e, the magnetic force of the magnet 54 of the probe core 50 on the probe board 40 is reduced, and the probe core 5
0 is removed. Specifically, as shown in FIG. 8A, the probe core lever 51e is moved to the probe core 50.
To the left of the magnet 54 as shown in FIG.
Is separated from the upper surface plate 51f by a predetermined distance, and the magnets 54 for the probe board 40 disposed outside the upper surface plate 51f.
Is increased, the magnetic force of the magnet 54 on the probe board 40 is weakened, and the probe core 50 is removed.

As described above, in the present embodiment, since the probe core 50 having the probe 53 is formed separately from the probe board 40, the replacement of the probe 53
This can be performed in units of 0, and the operation efficiency at the time of probe replacement can be improved.

Further, since the probe core 50 is formed separately from the probe board 40, the probe corresponding to the type of each semiconductor chip to be manufactured is replaced not in the unit of the characteristic measuring probe but in the unit of the probe core 50. This makes it possible to reduce the cost of the apparatus required for measuring the characteristics of the semiconductor chip as a whole.

Further, since the probe core 50 is formed separately from the probe board 40, the probe cores 5 corresponding to the types of the respective semiconductor chips to be manufactured are provided.
Only 0 should be retained, compared to the case where storage must be performed for each characteristic measurement probe.
The storage space can be reduced.

Although the description is omitted in this embodiment because it is the same as that of the first embodiment, the guide pillars 41a to 41d are inserted into the openings 51a to 51d in this embodiment, too.
In order to attach the probe core 50 to the probe board 40 by the magnetic force of the magnet 54, the probe core 5
0 can be easily attached and detached, and the probe core 5
It is possible to improve the work efficiency at the time of replacement.

Further, since the probe core 50 is attached to the probe board 40 by the magnetic force of the magnet 54, the flatness and the degree of distortion of the attached probe board 40 can be kept constant, and the probe core can be easily attached. It can be installed in an appropriate state.

The present invention is not limited to the above embodiment. For example, in the first and second embodiments, the magnetic force between the probe boards 10, 40 and the probe cores 20, 50 is adjusted by changing the positions of the magnets 15, 54. However, a configuration may be adopted in which this magnet is used as an electromagnet, and the magnetic force between the probe board and the probe core is adjusted by changing the magnetic force of the magnet itself by an electric operation such as a voltage operation applied to them.

In the first and second embodiments, the magnets 15 and 54 are provided on one of the probe boards 10 and 40 or the probe cores 20 and 50.
By changing the position of the magnet, the magnetic force between the probe boards 10, 40 and the probe cores 20, 50 was adjusted. However, magnets were provided on both the probe board and the probe core, By changing the position, the magnetic force between the probe board and the probe core may be adjusted.

[0053]

As described above, in the present invention, since the probe core having the probe is formed separately from the probe board, the work efficiency at the time of replacing the probe can be improved.

Further, since the probe core is formed separately from the probe board, it is possible to reduce the cost of the apparatus required for measuring the characteristics of the semiconductor chip as a whole.

Further, since the probe core is formed separately from the probe board, it is possible to reduce the storage space for the characteristic measuring probe. Further, since the guide pillar is inserted into the opening and the probe core is attached to the probe board by the magnetic force of the magnet, the work efficiency at the time of replacing the probe core can be improved.

Further, since the probe core is attached to the probe board by the magnetic force of the magnet, it is possible to easily install the probe core in an appropriate state.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a characteristic measuring probe.

FIG. 2 is an enlarged perspective view of a probe.

FIG. 3 is a diagram illustrating an operation of the probe board when a probe board lever is operated. Here, (a)
Shows a perspective view of the probe board, and (b)
FIG. 2A is a cross-sectional view taken along line AA.

FIG. 4 is a view showing the operation of the probe board when the probe board lever is operated. Here, (a)
Shows a perspective view of the probe board, and (b)
FIG. 2A is a cross-sectional view taken along line AA.

FIG. 5 is a perspective view showing a manner in which a probe core is attached to a probe board. Here, (a) is a perspective view showing a state when the probe core is attached to the probe board, and (b) is a perspective view showing a state after the attachment.

FIG. 6 is a perspective view showing a configuration of a characteristic measuring probe.

FIG. 7 is a view showing the operation of the probe core when the probe core lever is operated. Here, (a) is
FIG. 2 shows a perspective view of a probe core, and FIG.
2 shows a cross-sectional view taken along line DD in FIG.

FIG. 8 is a view showing the operation of the probe core when the probe core lever is operated. Here, (a) is
FIG. 2 shows a perspective view of a probe core, and FIG.
FIG.

[Explanation of symbols]

1, 30: Probe for characteristic measurement, 10, 40: Probe board, 11a to 11d, 41a to 41d: Guide pillar,
12: probe board lever, 13, 43: bottom plate, 1
4: Middle plate, 15, 54: Magnet, 20, 50: Probe core, 21, 51: Frame, 21a to 21d, 51a to
51d: Opening, 23, 53: Probe, 51e: Probe core lever

Claims (9)

[Claims] 1. A probe for measuring characteristics of a semiconductor chip, wherein a probe board provided with a guide column, an opening is provided, and said probe is inserted by magnetic force while inserting said guide column into said opening. A probe core comprising: a frame attached to a board; and a probe supported by the frame and detecting a characteristic of the semiconductor chip by contacting the semiconductor chip. . 2. The probe board according to claim 1, wherein the probe board has a magnetized probe board magnetized portion, and the mounting of the frame to the probe board is performed by a magnetic force of the probe board magnetized portion. A probe for measuring characteristics as described. 3. The probe according to claim 2, wherein the probe board further includes a probe board magnetic force adjusting mechanism for adjusting a magnetic force of the probe board magnetized portion on the frame. 4. The probe board according to claim 3, wherein the probe core is detached from the probe board by weakening a magnetic force of the probe board magnetized portion on the frame by the probe board magnetic force adjusting mechanism. Probe for measuring characteristics. 5. The characteristic according to claim 1, wherein the frame has a magnetized frame magnetized portion, and the attachment of the frame to the probe board is performed by a magnetic force of the frame magnetized portion. Measurement probe. 6. The probe according to claim 5, wherein the frame further comprises a frame magnetic force adjusting mechanism for adjusting a magnetic force of the frame magnetized portion on the probe board. 7. The characteristic according to claim 6, wherein the probe core is detached from the probe board by weakening a magnetic force of the frame magnetized portion on the probe board by the frame magnetic force adjusting mechanism. Measurement probe. 8. The characteristic measuring probe according to claim 1, wherein the probe is formed in a projecting shape. 9. The guide post is provided at four locations to form four vertices of a substantially square shape, the frame is formed in a substantially square shape, and the opening is formed in a substantially square shape. 2. The characteristic measuring probe according to claim 1, wherein one is formed at each of four apexes of the frame.