JP2002176071A - Bonder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonder which stabilizes the bonding quality enough to speed up the bonding operation by making constant the work touch detection time after the top end of a capillary touches a work irrespectively of the search speed. SOLUTION: The bonder has a means for detecting a command value sent from a control means to a drive means and a means for setting a reference value and judges the work tough to be detected when a detection value of the command value detecting means exceeds the reference value of the reference value setting means during lowering of a capillary at a search speed. It varies the sensitivity of the command value detecting means or the reference value of the reference value setting means according to the search speed of the capillary.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a work as a part to be bonded, that is, a semiconductor part (IC chip).
The present invention relates to a wire bonding apparatus for performing a bonding connection by laying a wire between a wire and a lead formed on a lead frame or the like, and particularly to detecting a work touch of a capillary to a work which is a part to be bonded in wire bonding.

[0002]

2. Description of the Related Art Conventionally, in order to perform bonding connection between a pad of an IC chip and a lead using a wire bonding apparatus of this kind, a wire is held by a capillary as a bonding tool provided at the tip of a bonding arm. Then, the ball formed at the tip of the capillary is brought into contact with the surface of the target pad or lead, and then the ball is crushed using the capillary, and the ball is welded by thermocompression. At this time, ultrasonic vibration may be simultaneously applied to the tip of the wire.

As an example of this wire bonding apparatus, for example, the one shown in FIG. 6 is known. FIG.
Is a front view including a partial cross section of the bonding head main body 1 on which the capillary 23 is mounted. The bonding head main body 1 shown in FIG. 6 is mounted on an XY table that can be moved in a two-dimensional direction (not shown), and the rear end of the bonding head main body 1 is connected to a rear end of the bonding head main body 1 through a connector (not shown) as shown in FIG. Are connected to the motor driver 29 and the Z-axis controller 27 shown in FIG.

[0006] As shown in FIG. 6, the bonding arm 20 is configured to be rotatable about the rotary shaft 2, and the bonding arm 20 is provided at one end about the rotary shaft 2 as a bonding tool. Capillary 2
The horn 21 is provided with a horn 21 and an ultrasonic vibrator (not shown) for applying ultrasonic vibration to the capillary 23 via the horn 21. Further, a linear motor 24 is provided as a swinging means for swinging the bonding arm 20 about the rotation shaft 2.
The linear motor 24 includes a flat coil 25 and a magnetic circuit 26 including a permanent magnet and a yoke. The flat coil 25 is attached to a rear end of the bonding arm 20. Reference numeral 26 is attached to the bonding head body 1. As shown in FIG. 6, the cut clamp mounting arm 9 is mounted on the upper part of the bonding arm 20. A cut clamp 12 for holding and releasing the wire is attached to the tip of the cut clamp mounting arm 9.

An encoder 35 as a position detecting means for detecting the position of the capillary 23 by detecting the swinging position of the bonding arm 20 is provided in the bonding head main body 1 shown in FIG. FIG. 7 is a diagram showing a partially enlarged view of the encoder 35. As shown in FIG. 7, the encoder 35 is supported by the rotation shaft 2 of the bonding arm 20 and swings in accordance with the swing, and a light emitting unit 35b attached to a side surface of the bonding head main body 1. And a light receiving unit 35c. The encoder 35 is optically detected, and the light emitting section 35b is configured such that a light emitting body such as a light emitting diode is disposed on a substrate, and light emitted from the light emitting body is formed of glass or the like. By passing through the slit or the like of the slit plate 35a, the optical change is converted into a pulse signal by the light receiving unit 35c to perform position detection.

Next, the operation of contacting the ball formed at the tip of the capillary 23 with the surface of the target pad and crushing and welding the ball will be described.

First, a capillary 23 having a ball formed at its tip is moved at high speed to a work surface (surface of an electrode of a semiconductor chip).
When the capillary 23 reaches the search operation start point, the speed is reduced to a low speed and lowered at a constant speed (search speed). The reason why the capillary 23 is lowered at the search speed from the search operation start point is to reduce the impact when the capillary touches the workpiece.

Next, the work touch detecting means detects that the ball comes into contact with the bonding surface (the pad surface of the IC chip) and the capillary 23 lands on the bonding surface, and the descending operation of the capillary 23 is stopped. A pressing command signal is output, and a driving current corresponding to the bonding load is output from the motor driver 29. Capillary 23
In this method, the ball is pressed against the electrode of the semiconductor chip with a predetermined bonding load by the torque generated by the linear motor 24, and at the same time, the ultrasonic vibration is applied to the tip of the wire from the horn 21 to join the ball. Then, after applying a bonding load and ultrasonic vibration for a predetermined time, the capillary 23 is raised at a high speed while feeding out the wire.

The work touch detecting means will be described below with reference to FIGS. 8 and 9.

FIG. 8A shows the position of the capillary 23 with respect to time in the descending operation, and FIG. 8B shows the position of the capillary 2.
8 shows the change in the signal after the command signal of the D / A converter 28 shown in FIG. 9 has been amplified by the amplifier 30a and passed through the LPF (low-pass filter) 31 in the descending operation of FIG.
FIG. 7 is a diagram illustrating output timings of a work touch detection signal in a lowering operation of the capillary 23. FIG. 9 is a block diagram showing a circuit configuration of a conventional work touch detection.

As shown in FIG. 8A, the capillary 23 attached to the tip of the bonding arm 20 has a height from the preset tool height Th to the height of the search operation start point Sh, that is, FIG. 8) at a high speed, and the search operation start point is switched from the point a to a low speed, and the capillary 23 descends at the search speed and touches the workpiece, that is, the point b shown in FIG. And the lowering of the capillary 23 stops. This capillary 2
The descending position of 3 is calculated by counting the number of pulses output from the encoder 35 shown in FIG. The Z-axis controller 27 raises the command value of the command signal and outputs it to the D / A converter 28 in order to further lower the capillary 23. The command value of the command signal of the Z-axis controller 27 increases in proportion to the difference (deviation) between the target position and the current position of the capillary 23. As shown in FIG. 8B, when the capillary 23 touches the work (FIG.
From ta) shown in (b), the command value of the command signal increases.

As shown in FIG. 9, the command signal from the D / A converter 28 is amplified by an amplifier 30a, and the signal amplified by the amplifier 30a is compared with a signal whose high-frequency component is cut off by an LPF (low-pass filter) 31. Input to the device 32. Also,
The reference value for work touch detection (Vt shown in FIG. 8B) from the detection level circuit 34a is input to the comparator 32.
The comparator 32 compares the signal from the LPF 31 with a reference value for work touch detection, and when the signal from the LPF 31 becomes equal to or more than the reference value (Vt) for work touch detection (FIG. 8B )), The comparator 32 is shown in FIG.
The work touch detection signal shown in (c) is output to the Z-axis control unit 27, and the Z-axis control unit 27 detects that the capillary 23 has touched the work.

[0013]

However, in the conventional work touch detection in the bonding apparatus, if the magnitude of the search speed is changed, the time of the command signal after the tip of the capillary 23 touches the part to be bonded is changed. The rate of change (slope) changes as shown in FIG. For this reason, the time of the work touch detection may change depending on the difference in the search speed.
FIG. 5A is a diagram showing the position of the capillary 23 with respect to time when the magnitude of the search speed is changed. FIG. 5B is a diagram showing the position of the capillary 23 when the magnitude of the search speed is changed. 10 is a diagram showing a change in the command value of the command signal input to the comparator 32 shown in FIG. S1, S2, and S3 shown in FIG. 5A indicate the magnitude of the search speed, and the search speeds S1, S2, and S3 satisfy S1>S2> S3, where S1 is the search speed and S2 is the search speed. Medium, S
No. 3 has a low search speed.

As shown in FIG. 5A, when the search speed is S
The time until the capillary 23 touches the workpiece from the search operation start point Sh at time 2 is t2, and the capillary 2
The change in the command value of the command signal after the touch of No. 3 on the work is shown as v2 in FIG.

For example, assuming that the search speed is S1, FIG.
As shown in (a), the time from the search operation start point Sh until the capillary 23 touches the work becomes shorter (t1 shown in FIG. 5A), and the command after the capillary 23 touches the work. The change rate (slope) of the signal command value (v1 shown in FIG. 5B) with respect to time increases. Next, assuming that the search speed is S3, as shown in FIG.
Increases the time it takes to touch the workpiece (Fig. 5
(T3 shown in FIG. 5A), and a command value of a command signal after the capillary 23 touches the work (v shown in FIG. 5B).
The rate of change (slope) with respect to time in 3) becomes smaller.

For this reason, the time required to reach the reference value (Vt) for detecting the work touch becomes shorter as the search speed is increased (S1 in FIG. 5A) (T shown in FIG. 5).
1) If the search speed is reduced (S3 in FIG. 5A), the search speed is increased (T3 in FIG. 5). As a result, the time of work touch detection may change depending on the difference in the search speed.

If the time of the work touch detection changes, the time from when the ball at the tip of the capillary 23 touches the work to when the ultrasonic vibration and the load are applied changes, so that stable bonding cannot be obtained. There is.

Further, when the search speed is reduced, the time from touching the work to the detection of the work touch is lengthened, so that the time required for bonding is increased and the production number of semiconductor components may be reduced.

Accordingly, the present invention has been made in view of the problem of the conventional work touch detection, and the work touch detection time after the tip of the capillary touches the work is fixed regardless of the search speed. By doing
An object of the present invention is to provide a wire bonding apparatus capable of stabilizing bonding quality and further increasing the speed of bonding operation.

[0020]

A bonding apparatus according to the present invention comprises a bonding arm having a capillary at one end and a swinging means at the other end for swinging the capillary up and down; Driving means for driving, position detecting means for detecting the position of the capillary by detecting the swinging position of the bonding arm, and control means for issuing a command to the driving means based on data from the position detecting means A command value detecting means for detecting a command value to the driving means from the control means, and a reference value setting means for setting a reference value, while the capillary is descending at a search speed,
When the detected value of the command value detecting means is equal to or more than the reference value of the reference value setting means, the bonding apparatus determines that the work touch is detected, according to the magnitude of the search speed of the capillary, the command value detecting means The sensitivity or the reference value of the reference value setting means is made variable.

Further, the bonding apparatus of the present invention has a capillary at one end, a bonding arm comprising a swinging means for swinging the capillary up and down at the other end, and a drive for driving the swinging means. Means, position detecting means for detecting the position of the capillary by detecting the swinging position of the bonding arm, control means for instructing the driving means based on data from the position detecting means, and the capillary Storage means for storing a reference value according to the search speed of, while the capillary is moving down at the search speed, a command value output by the control means to the drive means,
When a command value to the driving means is equal to or greater than the reference value, it is determined that a work touch has been detected by comparing a reference value corresponding to the search speed read from the storage means.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a bonding apparatus according to the present invention will be described below with reference to the drawings. Parts having the same configuration and function as those of the conventional bonding apparatus shown in FIGS. 6, 7 and 9 will be described using the same reference numerals.

FIG. 1 is a block diagram showing a circuit configuration for detecting a work touch of a bonding apparatus according to the present invention.

As shown in FIG. 1, the work touch detection of the bonding apparatus according to the present invention is performed by using a capillary 23 at one end.
And a bonding arm 20 constituted by a linear motor 24 at the other end as a swinging means for swinging the capillary 23 up and down, and detecting the swinging position of the bonding arm 20 to detect the position of the capillary 23. An encoder 35 serving as a position detecting unit, a Z-axis control unit 27 serving as a control unit for issuing a command to the linear motor 24 serving as a swing unit based on data from the encoder 35 serving as a position detecting unit, and A D / A converter 28 for converting a digital command signal from the Z-axis control unit 27 into an analog signal, and a driving unit for driving a linear motor 24 as a swinging unit in accordance with the command signal from the D / A converter 28 And a command value detecting means including a plurality of amplifiers 30a for amplifying the command signal from the D / A converter 28. An amplifier 30, the first selection circuit 38 for selecting the output signal of the particular amplifier 30a of the amplifier unit 30
An LPF 31 that outputs only a low-frequency signal of the signal selected by the first selection circuit 38, and a plurality of detection level circuits 34
a detection level setting unit 3 as a reference value setting means consisting of a
4, a second selection circuit 39 for selecting a specific detection level of the detection level setting unit 34, and a detection signal of the LPF 31
A comparator 32 that compares the output signal from the selection circuit 39 and outputs a signal, and a signal from the comparator 32 and the Z-axis control unit 2
And an AND circuit 33 that performs an AND operation with the signal from the controller 7 and outputs the operation result to the Z-axis controller 27.

The Z-axis control unit 27 as a control means includes a pulse counter (counting device) for counting pulse signals output from the encoder 35, an arithmetic and control unit composed of a microcomputer, and storage means for storing data and programs. , And an input / output device for inputting and outputting data and control signals.

The D / A converter 28 converts a command signal output as a digital value from the Z-axis controller 27 into an analog signal. The analog signal output from the D / A converter 28 is a command signal for controlling a current value applied to the linear motor 24 from the motor driver 29.

The motor driver 29 as a driving means is composed of a power amplifier or the like, and the motor driver 29 is configured to supply a current corresponding to the magnitude of a command signal output from the D / A converter 28 to the linear motor 24. Have been.

The amplifying section 30 for amplifying the command signal from the D / A converter 28 includes a plurality of amplifiers 30a, and the amplifiers 30a have different amplification degrees. That is, the amplification degree of each amplifier 30a of the amplification unit 30 is set according to the magnitude of the search speed.

Each of the amplifiers 30a of the amplifying unit 30 is individually set to an amplification degree determined by the following procedure according to the magnitude of the search speed. FIG. 2 shows the D / A converter 2 after the work touch with respect to the magnitude of the search speed.
LPF after amplifying the signal output from 8 with a fixed amplification factor
FIG. 7 is a diagram illustrating a change in a signal input to the LPF 31 and output from the LPF 31.

As apparent from FIG. 2, the search speed is S
1 and S2, the magnitude of the output voltage of the LPF 31 at time t1 after the work touch at time t0 is V
1, V2. As a result, the search speed S1 and the time t
1 to make the output signal V1 equal to the magnitude V2 of the output signal at the search speed S2, the output signal V1 is set to (V2 ÷ V
1) It is necessary to multiply. Output signal V1 is (V2 ÷ V1)
To do so, the amplification degree of the amplifier 30a corresponding to the search speed S1 may be set to (V2 ÷ V1). Hereinafter, the amplification degree of the amplifier 30a is set for each search speed, using the search speed S2 as a standard search speed.

The detection level setting section 34 as reference value setting means is composed of a plurality of detection level circuits 34a, and the reference value as the detection level of each detection level circuit 34a is different. I have. That is, in each detection level circuit 34a of the detection level setting unit 34, the reference value is set according to the magnitude of the search speed.
Each detection level circuit 34a of the detection level setting unit 34
The following reference values are set according to the search speed. As shown in FIG.
1 when the output voltage of the LPF 31 reaches V1
Assuming that the output voltage of the search speed S2 at 1 is V2,
The reference values of the detection level circuit 34a for the search speed S1 and the search speed S2 are set to V1 and V2, respectively.
Hereinafter, the search speed S2 is defined as a standard search speed.
The reference value of the detection level circuit 34a is set according to the magnitude of the search speed.

As shown in FIG. 1, the first selection circuit 38
An output signal of a specific amplifier 30a of the amplifier 30 is selected by a selection signal from the Z-axis controller 27. The selection signal from the Z-axis control unit 27 is configured to select an output signal of a specific amplifier 30a in the amplification unit 30 according to the search speed. The signal selected by the first selection circuit 38 is output to the LPF 31, and only the low-frequency signal component is output from the LPF 31 to the comparator 32 as a detection signal.

The second selection circuit 39 selects a reference value of a specific detection level circuit 34a of the detection level setting section 34 according to a selection signal from the Z axis control section 27. The selection signal from the Z axis control section 27 Is configured to select a reference value of a specific detection level circuit 34a of the detection level setting unit 34 according to the magnitude of the search speed.

The comparator 32 compares the detection signal of the LPF 31 with a reference value from the second selection circuit 39, and
Is higher than the reference value from the second selection circuit 39, a signal is output.

The AND circuit 33 calculates the logical product of the signal from the comparator 32 and the work touch detection permission signal from the Z-axis control unit 27, and outputs the calculation result to the Z-axis control unit 27. .

Next, work touch detection of the wire bonding apparatus according to the present invention will be described.

The Z-axis control unit 27 includes the bonding arm 2
A command signal is output so that the capillary 23 located at the leading end of 0 is quickly lowered from the preset tool height to the height of the search operation start point. Then, the Z-axis control unit 27 confirms that the capillary 23 is located at the search operation point by a pulse counter that counts the pulse signal of the encoder 35, and then switches from the search operation start point to a low speed to search the capillary 23. Try to descend at speed. The lower position of the capillary 23 is the encoder 3
5 is output to the pulse counter of the Z-axis controller 27 based on the pulse output from 5, and the pulse counter of the Z-axis controller 27 counts the number of pulses from the encoder 35 to calculate the position of the capillary 23.

The Z-axis control unit 27 outputs a selection signal to the first selection circuit 38 according to the magnitude of the search speed so that the output of the specific amplifier 30a of the amplification unit 30 is input to the LPF 31. . In addition, the second selection circuit 39 selects a specific detection level circuit 34a so as to be a fixed reference value regardless of the magnitude of the search speed.

The Z-axis control unit 27 while the capillary 23 is moving down
As for the relationship between the target position and the current position by the pulse counter, the capillary 23 follows the command from the Z-axis controller 27 and moves downward until the capillary 23 touches the workpiece. And the current position are small. However, after the capillary 23 touches the workpiece, the capillary 23 stops at the position on the workpiece surface even though a downward command is issued from the Z-axis controller 27. Cannot be used. Therefore, in this state, a difference occurs between the target position and the current position. The Z-axis controller 27 outputs a command signal to the D / A converter 28 to increase the drive current of the linear motor 24 in order to reduce the difference between the target position and the current position.

At this time, the signal output from the Z-axis controller 27 as the drive current for the linear motor 24 is a signal proportional to the difference (deviation) between the target position and the current position obtained from the pulse signal of the encoder 35. It is. Further, after the capillary 23 contacts at the position on the work surface, the difference between the target position and the current position obtained from the pulse signal of the encoder 35 increases with time.

The output signal of the D / A converter 28 is obtained by converting the signal of the amplifier 30a selected by the first selection circuit 38 into the LPF 31.
To the comparison circuit from the LPF 31 as a detection signal. The comparison circuit detects the detection signal from the LPF 31 and the detection level circuit 34a selected by the second selection circuit 39.
When the detection signal from the LPF 31 is larger than the reference value of the detection level circuit 34a, the signal is output to the AND circuit 33. The AND circuit 33 performs an AND operation on the output signal from the comparator 32 and the touch detection permission signal from the Z-axis control unit 27, and outputs the result to the Z-axis control unit 27.

The Z-axis control unit 27 determines that a work touch has been detected based on a signal from the AND circuit 33, and
To stop the lowering operation.

FIG. 3B shows a change in the detection signal output from the LPF 31 and input to the comparator 32 when the magnitude of the search speed by the work touch detection is changed. FIG. 3A shows the capillary 23 with respect to time at the search speeds S1, S2, and S3 shown in FIG.
FIG.

As shown in FIG. 3B, the search speed S
The command signal is detected by changing the amplification degree (sensitivity) of the amplifier 30a by the first selection circuit 38 corresponding to 1, S2, and S3 (the detection signal is changed to v1, v2, v in FIG. 3B).
Since the inclination of each detection signal is substantially the same and the work touch detection time (T1, T2, T3 in FIG. 3B) after the capillary 23 touches the work is the same, the search speed is large. Irrespective of this, the work touch detection time can be fixed.

In the work touch detection described above, the first selection circuit 38 selects an amplification circuit in accordance with the search speed, and the second selection circuit 39 sets a fixed reference value. The detection time after the touch is made constant.

On the other hand, the reference value of the detection level circuit 34a of the detection level setting section 34 is selected by the second selection circuit 39 according to the magnitude of the search speed, and the first selection circuit 38 selects the magnitude of the search speed. Irrespective of this, it is also possible to make the detection time after the work touch constant by setting the specific amplifier 30a so as to have a fixed amplification degree.

The work touch of the wire bonding apparatus according to the present invention can be detected by a process based on a control program of a microcomputer built in the Z-axis control section 27.

FIG. 4 shows a work touch detection operation based on a microcomputer control program.
This will be described with reference to the flowchart of FIG.

First, a reference value corresponding to the search speed is stored in advance in a storage device as storage means of the Z-axis control unit 27. The reference value for work touch detection corresponding to the search speed is measured in advance by outputting data output from the Z-axis control unit 27 to the D / A converter 28 at each search speed after the time t1 after the work touch. And is set based on the measured data. First, the microcomputer of the Z-axis control unit 27 outputs a command signal to lower the capillary 23 located at the tip of the bonding arm 20 from the tool height to the height of the search operation start point at a high speed (step in FIG. 4). S1). Then, the Z-axis control unit 27
Reads the current position from the data of the pulse counter for counting the pulse signals of the encoder 35 (step S
2) It is checked whether the capillary 23 is located at the search operation point (step S3). If the capillary 23 is not located at the search operation point, the operation from step S2 is repeated. When the capillary 23 is located at the search operation point, a command signal is output to the D / A converter 28 so as to lower the capillary 23 at a predetermined search speed (step S4). Further, data of a reference value for work touch detection corresponding to the search speed is read from the storage device (step S5). In response to a command signal from the Z-axis controller 27, the capillary 23 is switched from the search operation start point to the search speed and descends at a constant speed. The microcomputer of the Z-axis control unit 27 reads out the data of the pulse counter for counting the pulse signals of the encoder 35 (Step S).
6) The current position of the capillary 23 is temporarily stored.

Next, a deviation between the target position of the capillary 23 and the current position is calculated (step S7). Capillary 2
3 is output to the D / A converter 28 as a command signal in proportion to the deviation between the target position and the current position.
8 to the motor driver 29 (step S8).

While the capillary 23 is descending at the search speed, the target position and the current position are almost the same, but the capillary 2
When 3 touches the work, the current position becomes constant and the difference from the target value increases. Therefore, the Z-axis control unit 27 increases the command value so as to reduce the difference between the target position and the current position.

The microcomputer of the Z-axis control unit 27 determines whether the command value output in step S8 is equal to or greater than the reference value data read from the storage device (step S9). When the command value is equal to or smaller than the reference value, the operation from step 6 is repeated. When the command value is equal to or greater than the reference value, it is determined that the capillary 23 has touched the work, and the lowering operation of the capillary 23 is stopped.

In the work touch detection described above, the reference value set in advance according to the magnitude of the search speed is read from the storage device by the Z-axis control unit 27, and the command value of the command signal is equal to or larger than the preset reference value. In this case, it is determined that the capillary 23 has touched the work. Thus, the work touch detection time after the work touch can be made constant regardless of the search speed.

[0054]

As described above, in the bonding apparatus according to the present invention, the bonding quality can be improved by making the time of work touch detection after the tip of the capillary touches the work constant regardless of the search speed. The bonding operation can be stabilized and the speed of the bonding operation can be increased.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a circuit configuration for detecting a work touch of a bonding apparatus according to the present invention.

FIG. 2 is a diagram illustrating a change in a signal output from an LPF with respect to a search speed;

FIG. 3A is a diagram showing a position of a capillary 23 with respect to time when the magnitude of a search speed is changed, and FIG. 3B is a diagram showing a search by a work touch detection of a bonding apparatus according to the present invention; It is a figure which shows the change of the detection signal with respect to time when the magnitude | size of a speed is changed.

FIG. 4 is a flowchart of a work touch detection operation based on a control program of a microcomputer.

FIG. 5A is a diagram showing a position of a capillary with respect to time when a magnitude of a search speed is changed;
(B) is a diagram illustrating a change in the command value of the command signal input to the comparator with respect to time when the magnitude of the search speed is changed.

FIG. 6 is a front view including a partial cross section of a bonding head body to which a capillary 23 is mounted.

FIG. 7 is a partially enlarged view of an encoder.

8A is a diagram showing a position with respect to time in a capillary descent operation, and FIG. 8B is a diagram showing a command signal of a D / A converter 28 passing through a LPF (low-pass filter) 31 in a descent operation of the capillary 23. FIG. 8C is a diagram illustrating a change in the signal after the operation, and FIG. 9C is a diagram illustrating an output timing of the work touch detection signal in the lowering operation of the capillary.

FIG. 9 is a block diagram showing a circuit configuration of a conventional work touch detection.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Bonding head main body 2 Rotating axis 9 Cut clamp mounting arm 12 Cut clamp 20 Bonding arm 21 Horn 23 Capillary 24 Linear motor 25 Flat coil 26 Magnetic circuit 27 Z-axis control unit 28 D / A converter 29 Motor driver 30 Amplifying unit 30a Amplifier 31 LPF (low-pass filter) 32 Comparator 33 AND circuit 34 Detection level setting unit 34a Detection level circuit 35 Encoder 35a Slit plate 35b Light emitting unit 35c Light receiving unit 38 First selection circuit 39 Second selection circuit

Claims (2)

[Claims] 1. A bonding arm having a capillary at one end and swinging means at the other end for swinging the capillary up and down, a driving means for driving the swinging means, and A position detecting means for detecting a swing position to detect a position of the capillary, a control means for giving a command to the driving means based on data from the position detecting means, and a driving means from the control means. Command value detecting means for detecting a command value of the reference value, and a reference value setting means for setting a reference value, while the capillary is descending at a search speed, the detection value of the command value detecting means is a value of the reference value setting means A bonding device that determines that a workpiece touch has been detected when the value is equal to or greater than a reference value, wherein the sensitivity of the command value detection means or the reference value setting means is determined according to the magnitude of the capillary search speed Characterized in that the reference value is varied. 2. A bonding arm having a capillary at one end and a swinging means at the other end for swinging the capillary up and down; a driving means for driving the swinging means; Position detecting means for detecting a swing position to detect the position of the capillary, control means for issuing a command to the driving means based on data from the position detecting means, and a reference corresponding to a search speed of the capillary Storage means for storing a value, while the capillary is descending at a search speed, a command value output by the control means to the drive means, and a reference value according to the search speed read from the storage means In comparison, when the command value to the driving means is equal to or more than the reference value, the determination of work touch detection is made.