JP2002171099A5 - - Google Patents
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- JP2002171099A5 JP2002171099A5 JP2000369036A JP2000369036A JP2002171099A5 JP 2002171099 A5 JP2002171099 A5 JP 2002171099A5 JP 2000369036 A JP2000369036 A JP 2000369036A JP 2000369036 A JP2000369036 A JP 2000369036A JP 2002171099 A5 JP2002171099 A5 JP 2002171099A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- mounting
- list
- displaying
- change
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Description
【0052】
なお、チェック結果出力部9から出力される実装品質チェック結果は、図11に示したデータリスト形式以外に、2次元や3次元の基板レイアウトイメージで表示させてもよい。基板レイアウトイメージで表示させる場合には、品質エラーが生じた部品を、色を変えて表示させたり、点滅で表示させたりすることができる。また、イメージ上の部品を選択することにより、その部品の情報(品番、コスト、不良率等)を示したリストがポップアップメニューのように表示されるようにしてもよい。
特に、3次元の基板レイアウトイメージで表示させると、次のようなことが視覚的に判断可能となる。例えば、図12に示すように、部品121と共に装着ノズル122を表示させることで、部品121の周辺にある部品123と装着ノズル122との干渉を判断することができる。また、図13に示すように、クリーム半田131の印刷状態や接着剤132の塗布状態を表示させることで、半田や接着剤の量を判断することができる。また、図14に示すように、部品と共に基板検査に使用されるレーザ光の照射平面141を表示させることで、検査されない部品142の存在を判断することができる。また、図15に示すように、部品と共に半田付け時の温度分布151を表示させることで、部品の温度衝撃による負担を判断することができる。また、図16に示すように、部品と共に半田ごて161の形状を表示させることで、半田ごての部品への影響を判断することができる。さらに、図17に示すように、設計変更を行った場合に変更前の部品171と変更後の部品172とを同時に表示させることで、迅速かつ確実に設計変更を行うことが可能となる。[0052]
The mounting quality check result output from the check result output unit 9 may be displayed as a two-dimensional or three-dimensional board layout image other than the data list format shown in FIG. In the case of displaying in a board layout image, it is possible to change the color of the part in which the quality error has occurred or to display it in a blinking manner. Further, by selecting a part on the image, a list indicating information (part number, cost, defect rate, etc.) of the part may be displayed like a pop-up menu.
In particular, when displayed as a three-dimensional substrate layout image, the following can be visually judged. For example, as shown in FIG. 12, by displaying the mounting nozzle 122 together with the component 121, it is possible to determine the interference between the component 123 located around the component 121 and the mounting nozzle 122. Further, as shown in FIG. 13, the amount of the solder or the adhesive can be determined by displaying the printing state of the cream solder 131 or the application state of the adhesive 132 . Further, as shown in FIG. 14, by displaying the irradiation plane 141 of the laser beam used for the substrate inspection together with the component, the presence of the component 142 not to be inspected can be determined. Further, as shown in FIG. 15, by displaying the temperature distribution 151 at the time of soldering together with the component, it is possible to determine the load of the component due to the temperature shock. Further, as shown in FIG. 16, by displaying the shape of the soldering iron 161 together with the parts, it is possible to judge the influence on the parts of the soldering iron. Furthermore, as shown in FIG. 17, when the design change is performed, the part 171 before the change and the part 172 after the change are simultaneously displayed, so that the design change can be performed quickly and reliably.
【符号の説明】
1…CADデータ入力部
2…部品・基板検索部
3…回路基板情報記憶部
4…部品情報記憶部
5…使用実装条件入力部
6…実装工法制約条件記憶部
7…実装装置制約条件記憶部
8…設計内容解析部
9…チェック結果出力部
31〜34…CADデータのリスト
41〜43…基板情報のリスト
51〜53…部品情報のリスト
61〜63…実装工法に関するリスト
71〜73,181…実装装置に関するリスト
81…制約条件適用分類リスト
91,92,121,123,142,171,172…部品
122…装着ノズル
131…クリーム半田
132…接着剤
141…レーザ光照射平面
151…温度分布
161…半田ごて[Description of the code]
DESCRIPTION OF SYMBOLS 1 ... CAD data input part 2 ... Component and board search part 3 ... Circuit board information storage part 4 ... Component information storage part 5 ... Usage mounting condition input part 6 ... Mounting method restriction condition storage part 7 ... Mounting apparatus restriction condition storage part
8 ... Design content analysis unit
9 ... Check result output unit 31-34 ... CAD data list 41-43 ... Board information list 51-53 ... Component information list 61-63 ... Mounting method list 71-73, 181 ... Mounting device list 81 ... Constraint condition applied classification list 91, 92, 121, 123, 142, 171, 172 ... component 122 ... mounting nozzle 131 ... cream solder 132 ... adhesive 141 ... laser light irradiation plane 151 ... temperature distribution 161 ... soldering iron
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000369036A JP2002171099A (en) | 2000-12-04 | 2000-12-04 | Method and apparatus for checking mounting quality of circuit board |
US09/995,635 US6665854B2 (en) | 2000-12-04 | 2001-11-29 | Method and apparatus of checking mount quality of circuit board |
CNB011381760A CN1222208C (en) | 2000-12-04 | 2001-12-04 | Method and equipment of inspecting installation quality of circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000369036A JP2002171099A (en) | 2000-12-04 | 2000-12-04 | Method and apparatus for checking mounting quality of circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002171099A JP2002171099A (en) | 2002-06-14 |
JP2002171099A5 true JP2002171099A5 (en) | 2004-11-25 |
Family
ID=18839137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000369036A Pending JP2002171099A (en) | 2000-12-04 | 2000-12-04 | Method and apparatus for checking mounting quality of circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002171099A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007242987A (en) * | 2006-03-10 | 2007-09-20 | Aisin Seiki Co Ltd | Plotter of printed wiring board, plotting method and computer program |
JP6382941B2 (en) * | 2014-03-05 | 2018-08-29 | 株式会社Fuji | Control device according to component mounting line and control device according to component mounting device |
WO2017168590A1 (en) * | 2016-03-29 | 2017-10-05 | 富士機械製造株式会社 | Operation checking device of electronic component mounting machine |
CN112602385B (en) * | 2018-08-28 | 2022-08-30 | 株式会社富士 | Control program inspection device |
CN113340202A (en) * | 2021-06-30 | 2021-09-03 | 珠海格力智能装备有限公司 | Detection device and detection method |
WO2023171412A1 (en) * | 2022-03-08 | 2023-09-14 | 三菱電機株式会社 | Design assistance device and learning device |
-
2000
- 2000-12-04 JP JP2000369036A patent/JP2002171099A/en active Pending
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