JP2002171088A - Method for coating with shielding material - Google Patents
Method for coating with shielding materialInfo
- Publication number
- JP2002171088A JP2002171088A JP2000403739A JP2000403739A JP2002171088A JP 2002171088 A JP2002171088 A JP 2002171088A JP 2000403739 A JP2000403739 A JP 2000403739A JP 2000403739 A JP2000403739 A JP 2000403739A JP 2002171088 A JP2002171088 A JP 2002171088A
- Authority
- JP
- Japan
- Prior art keywords
- shielding material
- electromagnetic wave
- wave shielding
- frame
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Building Environments (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、筐体もしくは基板の縁
端接続部より電磁波漏出を防止するための電磁波遮蔽材
を塗着する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for applying an electromagnetic wave shielding material for preventing leakage of electromagnetic waves from an edge connection portion of a housing or a substrate.
【0002】[0002]
【従来の技術】従来、筐体もしくは基板の縁端接続部よ
り電磁波漏出を防止する方法の一例として、図4で示す
ように縁端部上面に電磁波遮蔽材をディスペンシングす
る方法がある。この方法は図4で示すように筐体1の縁
端部上面に、注入器13のシリンジ13aよりノズル1
3bを経て電磁波遮蔽材10を塗着するものであり、電
磁波遮蔽材10としては樹脂やゴムを有機溶剤に溶かし
銀コート銅微粉末を分散させたものなどが使用されてい
る。2. Description of the Related Art Conventionally, as an example of a method of preventing an electromagnetic wave from leaking from an edge connection portion of a housing or a substrate, there is a method of dispensing an electromagnetic wave shielding material on an upper surface of an edge as shown in FIG. This method uses a syringe 13a of an injector 13 to place a nozzle 1
The electromagnetic wave shielding material 10 is applied through 3b. As the electromagnetic wave shielding material 10, a material obtained by dissolving resin or rubber in an organic solvent and dispersing silver-coated copper fine powder is used.
【0003】また、この方法における組立て作業を簡略
にするため、前記電磁波遮蔽材10に代えて導電性接着
剤を塗着する方法が提案されている(特開平7−221
482号)。Further, in order to simplify the assembling work in this method, a method of applying a conductive adhesive instead of the electromagnetic wave shielding material 10 has been proposed (Japanese Patent Laid-Open No. 7-221).
482).
【0004】[0004]
【発明が解決しようとする課題】前記した電磁波遮蔽材
を塗布する方法は、ロボットにより精度よく位置決めし
て塗布されるものの、電磁波遮蔽材の粘度と注入圧力な
どにより塗布量に過不足を生じないようにするため、ま
た高精度、高密度実装に対する細密塗布に対しては多分
に人手を要することがあり、さらに任意の断面仕上形状
が得られないとともに高密度実装に対応するのが難しい
という問題点があった。本発明は前記した従来の技術に
有する課題を解決すべくシールド材の塗着方法を提供す
るものである。In the above-described method of applying the electromagnetic wave shielding material, although the application is performed by accurately positioning the robot, the amount of application does not become excessive or insufficient due to the viscosity of the electromagnetic wave shielding material and the injection pressure. In order to achieve high precision and high-density mounting, it may take a lot of labor to perform fine coating, and it is difficult to respond to high-density mounting because it is not possible to obtain an arbitrary cross-sectional finish shape. There was a point. SUMMARY OF THE INVENTION The present invention provides a method for applying a shield material in order to solve the above-mentioned problems of the conventional technology.
【0005】[0005]
【問題を解決するための手段】前記目的を達成するため
本発明は次のごとく構成する。すなわち、導電性を有す
る筐体もしくは基板における周壁部又は仕切部の縁端部
に電磁波遮蔽材を塗着する方法において、前記筐体もし
くは基板の縁端部に、任意形状の溝部を有する枠体の同
溝部を向けて当接し、筐体もしくは基板と枠体との間に
形成する空間に電磁波遮蔽材を注入し成型することを特
徴とするものである。(請求項1)To achieve the above object, the present invention is configured as follows. That is, in a method of applying an electromagnetic wave shielding material to an edge of a peripheral wall or a partition in a case or substrate having conductivity, a frame having an arbitrary-shaped groove at an edge of the case or substrate. The electromagnetic wave shielding material is injected and molded into a space formed between the housing or the substrate and the frame body. (Claim 1)
【0006】また、前記電磁波遮蔽材を塗着するに際
し、枠体の一方端より電磁波遮蔽材を注入するものであ
る(請求項2)。In applying the electromagnetic shielding material, the electromagnetic shielding material is injected from one end of the frame.
【0007】そして、前記電磁波遮蔽材を塗着するに際
し、枠体の上方に配した開孔部より電磁波遮蔽材を注入
するものである(請求項3)When the electromagnetic wave shielding material is applied, the electromagnetic wave shielding material is injected from an opening provided above the frame.
【0008】さらに、前記電磁波遮蔽材を塗着するに際
し、枠体の上方に配した開溝部に沿って移動しながら電
磁波遮蔽材を注入するものである(請求項4)。Further, when applying the electromagnetic wave shielding material, the electromagnetic wave shielding material is injected while moving along a groove provided above the frame.
【0009】[0009]
【作用】前記のごとく構成することにより、筐体もしく
は基板の周壁部又は仕切部の通常上面に位置する縁端部
に、任意形状に形成させた電磁波遮蔽材を沿着させるこ
とができ、蓋体等との間の密閉性を高めて電磁波遮蔽を
確実なものとする。また、高精度、高密度実装に対する
細密塗布が可能になる。According to the above construction, the electromagnetic wave shielding material formed in an arbitrary shape can be made to adhere to the peripheral wall portion of the housing or the substrate or the edge located on the normal upper surface of the partition portion. Enhance the airtightness between the body and the like to ensure electromagnetic shielding. In addition, it is possible to perform fine coating on high-precision, high-density mounting.
【0010】[0010]
【実施例】次に本発明の好ましい実施例を図1、図2に
基づき説明する。電子製品等を組み込んだ筐体もしくは
基板1の周壁部又は仕切部の通常上面に位置する縁端部
に枠体2を当接する。枠体2は、その長手方向一面に沿
って溝部2aを有し、同溝部より他面に連通する開孔2
b又は開溝2cをそなえている。そして前記筐体もしく
は基板1の周壁部又は仕切部の縁端部に、枠体2の溝部
2aを有する一面を向けて当接する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a preferred embodiment of the present invention will be described with reference to FIGS. The frame body 2 is brought into contact with the peripheral edge of the housing or the partition 1 where the electronic product or the like is incorporated, which is located on the normal upper surface of the partition. The frame 2 has a groove 2a along one surface in the longitudinal direction, and an opening 2 communicating with the other surface from the groove.
b or an open groove 2c. Then, the frame or the substrate 1 is brought into contact with the peripheral wall portion or the edge portion of the partition portion with the one surface having the groove portion 2a of the frame body 2 facing.
【0011】このとき枠体2の開孔2b又は開溝2cが
上向きに配置されており、その中へディスペンサー(図
示省略)より接続され供給される電磁波遮蔽材を、シリ
ンジ3aを経てノズル3b先端より、ロボット操作で設
定された指示に基づき注入する。電磁波遮蔽材は、有機
溶剤に溶かしたシリコンゴム等に銀コート銅粉を混合し
た一般のものを使用することができる。枠体2の開孔2
b又は開溝2cより注入された電磁波遮蔽材は溝部2a
に沿って充填される。At this time, the opening 2b or the opening 2c of the frame 2 is arranged upward, and an electromagnetic wave shielding material connected and supplied from a dispenser (not shown) is supplied into the opening 2b or the groove 3c via the syringe 3a. The injection is performed based on the instruction set by the robot operation. As the electromagnetic wave shielding material, a general material obtained by mixing silver-coated copper powder with silicon rubber or the like dissolved in an organic solvent can be used. Opening 2 of frame 2
b or the electromagnetic wave shielding material injected from the groove 2c is the groove 2a.
Is filled along.
【0012】図1は開孔2bより定位置からを注入する
ものであり、図2は開溝2cより移動しながら電磁波遮
蔽材を注入するものである。また図3は溝部2aの形状
を変更した一例であり、このうち(a)(b)は図1の
開孔2bより、(c)は図2の開溝2cより、それぞれ
電磁波遮蔽材を注入するものである。これらは作業性等
を考慮して適宜注入方法を選択すればよい。そして注入
された電磁波遮蔽材の有機溶剤が蒸発し乾燥した後、枠
体2を取り外す。FIG. 1 shows an injection from a fixed position through an opening 2b, and FIG. 2 shows an injection of an electromagnetic shielding material while moving from an opening 2c. FIG. 3 shows an example in which the shape of the groove 2a is changed. Among them, (a) and (b) show the case where the electromagnetic wave shielding material is injected from the opening 2b of FIG. 1 and (c) respectively from the opening 2c of FIG. Is what you do. The injection method may be appropriately selected in consideration of workability and the like. After the injected organic solvent of the electromagnetic wave shielding material evaporates and dries, the frame 2 is removed.
【0013】[0013]
【効果】以上の構成によって、本発明は筐体もしくは基
板の周壁部又は仕切部の通常上面に位置する縁端部に、
任意形状に形成させた電磁波遮蔽材を沿着させることが
でき、高精度、高密度実装に対する細密塗布を可能にす
ることができる。According to the above configuration, the present invention provides a peripheral wall portion of a housing or a board or an edge portion which is usually located on an upper surface of a partition portion.
An electromagnetic wave shielding material formed in an arbitrary shape can be adhered, and a high-precision, high-density packaging can be performed with high precision.
【図1】 本発明に係るシールド剤の塗着方法の一例
で、上面に開孔を設けて注入する方法を示す図。FIG. 1 is a view showing an example of a method for applying a shielding agent according to the present invention, in which an opening is provided on an upper surface and injection is performed.
【図2】 本発明に係るシールド剤の塗着方法の一例
で、上面に開溝を設けて移動しながら注入する方法を示
す図。FIG. 2 is a view showing an example of a method of applying a shielding agent according to the present invention, in which a groove is provided on an upper surface and a method of injecting the same while moving.
【図3】 (a)(b)(c) 溝部形状を示す態様
の例。FIGS. 3A, 3B, and 3C are examples of embodiments showing a groove shape; FIGS.
【図4】 従来技術に係るシールド剤の塗着方法を示
す図。FIG. 4 is a view showing a method of applying a shielding agent according to a conventional technique.
1 筐体 2 枠体 2a 溝部 2b 開孔 2c 開溝 3 注入
装置 3a シリンジ 3c ノズル 10 電磁
波遮蔽材 11 筐体 13 注入装置 13a シ
リンジ 13b ノズルReference Signs List 1 housing 2 frame 2a groove 2b opening 2c opening 3 injection device 3a syringe 3c nozzle 10 electromagnetic wave shielding material 11 housing 13 injection device 13a syringe 13b nozzle
Claims (4)
周壁部又は仕切部の縁端部に電磁波遮蔽材を塗着する方
法において、前記筐体もしくは基板の縁端部に、任意形
状の溝部を有する枠体の同溝部を向けて当接し、筐体も
しくは基板と枠体との間に形成する空間に電磁波遮蔽材
を注入し成型することを特徴とするシールド材塗着方
法。1. A method for applying an electromagnetic wave shielding material to an edge of a peripheral wall or a partition in a case or substrate having conductivity, wherein a groove having an arbitrary shape is formed in the edge of the case or substrate. A method for applying a shield material, comprising: abutting the groove portion of a frame body facing the same, injecting an electromagnetic wave shielding material into a space formed between the housing or the substrate and the frame body, and molding.
の一方端より電磁波遮蔽材を注入するものである請求項
1に記載のシールド材塗着方法。Wherein upon which the coating wearing the electromagnetic wave shielding material, shielding material the coating method according to claim 1 is intended to inject an electromagnetic wave shielding material from one end of the frame.
の上方に配した開孔部より電磁波遮蔽材を注入するもの
である請求項1に記載のシールド材塗着方法。3. The method according to claim 1, wherein the step of applying the electromagnetic wave shielding material comprises injecting the electromagnetic wave shielding material from an opening disposed above the frame.
の上方に配した開溝部に沿って移動しながら電磁波遮蔽
材を注入するものである請求項1に記載のシールド材塗
着方法。4. The shield material coating according to claim 1, wherein the electromagnetic wave shielding material is applied while moving along an open groove disposed above the frame when applying the electromagnetic wave shielding material. Method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000403739A JP2002171088A (en) | 2000-11-29 | 2000-11-29 | Method for coating with shielding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000403739A JP2002171088A (en) | 2000-11-29 | 2000-11-29 | Method for coating with shielding material |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002171088A true JP2002171088A (en) | 2002-06-14 |
Family
ID=18867807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000403739A Pending JP2002171088A (en) | 2000-11-29 | 2000-11-29 | Method for coating with shielding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002171088A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021250963A1 (en) * | 2020-06-10 | 2021-12-16 |
-
2000
- 2000-11-29 JP JP2000403739A patent/JP2002171088A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2021250963A1 (en) * | 2020-06-10 | 2021-12-16 | ||
JP7328453B2 (en) | 2020-06-10 | 2023-08-16 | タツタ電線株式会社 | Method for manufacturing electromagnetic wave shielding package using conductive composition |
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