JP2002170863A5 - - Google Patents
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- Publication number
- JP2002170863A5 JP2002170863A5 JP2000364357A JP2000364357A JP2002170863A5 JP 2002170863 A5 JP2002170863 A5 JP 2002170863A5 JP 2000364357 A JP2000364357 A JP 2000364357A JP 2000364357 A JP2000364357 A JP 2000364357A JP 2002170863 A5 JP2002170863 A5 JP 2002170863A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000364357A JP4444486B2 (ja) | 2000-11-30 | 2000-11-30 | 半導体ウェハの周縁微小領域におけるマーク読取方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000364357A JP4444486B2 (ja) | 2000-11-30 | 2000-11-30 | 半導体ウェハの周縁微小領域におけるマーク読取方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002170863A JP2002170863A (ja) | 2002-06-14 |
| JP2002170863A5 true JP2002170863A5 (OSRAM) | 2007-11-08 |
| JP4444486B2 JP4444486B2 (ja) | 2010-03-31 |
Family
ID=18835318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000364357A Expired - Fee Related JP4444486B2 (ja) | 2000-11-30 | 2000-11-30 | 半導体ウェハの周縁微小領域におけるマーク読取方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4444486B2 (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7479764B2 (ja) * | 2020-08-07 | 2024-05-09 | 株式会社ディスコ | 切削装置 |
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2000
- 2000-11-30 JP JP2000364357A patent/JP4444486B2/ja not_active Expired - Fee Related