JP2002164452A - Electronic part package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve soldered seal strength of a cover and a recess-like container in a small-sized container. SOLUTION: In an electronic part package comprising the recess-like container having an opening part on the upper face and the cover closing the opening part of the container, a soldering layer is formed on the upper face of the opening part of the container, at least one main face of the cover is joined, and the soldering layer is formed up to the container inner wall of the opening part of the vessel.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component package, and more particularly to an electronic component package formed by solder sealing.

[0002]

2. Description of the Related Art In recent years, mobile communication devices have been reduced in size and cost, and electronic components such as piezoelectric vibrators and SAW filters used in the mobile communication devices have also been reduced in size and reduced in cost. I'm advancing. For electronic component packages using such a piezoelectric material, the hermeticity of the inside is important in order to obtain stable characteristics, and in order to obtain this hermeticity, a metal lid is generally formed using a seam welding method. The container is hermetically sealed.

[0003] A common sealing method in seam welding is, for example, a method in which a seam ring brazed to a ceramic package and a metal lid are pressed against each other by applying a roller from the lid side toward the ceramic package in a press-contact manner to apply high temperature and pressure. In this method, the seam ring is melted by irradiating EB (electron beam) instead of the roller, and the ceramic package and the lid are joined and hermetically sealed.

[0004] However, seam welding has a problem that the cost of packaging electronic components is high due to the use of expensive Kovarring, and the external dimensions of recent electronic components tend to be reduced. There is also a problem that seam welding sealing cannot be performed due to restrictions (mechanism and arrangement of sealing rollers).

[0005] Seam welding sealing provides high precision and high quality for realizing an airtight container environment, but also has the possibility of causing stress and distortion in the package due to sealing involving high temperature and high pressure. Recently, a sealing method using solder sealing has been developed.

[0006]

Various techniques have been devised for the sealing of a package by soldering. For example, JP-A-10-13183 and JP-A-1
In Japanese Patent Application Publication No. 0-303324, solder is applied to the entire lid portion and the side surface (outer peripheral surface) of the lid portion in order to secure the bonding strength between the lid portion to be solder-sealed and the opening (solder sealing surface) of the container. There is such technology.

[0007] However, these methods are effective because the area of the joint (solder sealing surface between the lid and the opening) of the container is ensured. Because of the tendency to decrease, there is a problem that the effect of the technique disclosed in the above publication cannot be obtained because the solder sealing surface is thin and small particularly when the wall thickness of the opening of the concave container is reduced.

[0008]

According to the present invention, there is provided an electronic component package comprising a concave container having an opening on an upper surface and a lid for sealing the opening of the container. A package for an electronic component, wherein a metal film is applied to an upper surface of an opening, at least one main surface of the lid is joined, and an inner wall metal film is applied to an inner wall of the container at an opening of the container. . In this case, the inner wall metal film applied to the inner wall of the container at the opening is also provided on the entire inner wall of the container within a range of not more than 1/4 from the opening at the height of the inner wall of the container. .

In short, according to the present invention, even in a case where the sealing strength of the conventional solder sealing is secured and the container is further downsized (when the wall thickness of the container opening is small and the area of the sealing surface cannot be secured). In order to maintain the sealing strength of solder sealing, by applying a solder layer, for example, as an inner wall metal film to the inner wall of the container at the opening of the container and increasing the number of seal paths, at the time of solder sealing that is not easily affected by the sealing surface area Is to ensure the sealing strength.

[0010]

Embodiments of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same reference numeral indicates the same object. FIG. 1 shows an embodiment of the present invention. FIG. 1 shows the structure of an electronic component package 3 according to an embodiment of the present invention. FIG. 1A is a perspective view showing a form in which a lid 2 and a concave container 1 are separated from each other.
Is a metal plate or a ceramic material on which an outer peripheral portion is provided with metallization and a metal film (for example, a solder film). FIG. 1B is a partially enlarged view of the inner wall of the concave container 1, and shows a solder layer 4 applied to the opening 6 of the container 1 according to the present invention.
FIG. 3 is a partially enlarged view showing a state in which an inner wall solder layer 5 is applied to the inner wall of the container 1.

The concave container 1 shown in FIG. 1 is formed of a ceramic material, a metal material, a resin material or the like, and has a lid 2 (ceramic material, metal material or , Resin material, etc.) to realize a sealed structure. This sealing (joining)
Is formed by soldering, and a terminal portion 7 for conducting from the container 1 to the mounting substrate is formed on the side surface of the concave container 1.

As shown in the state of the inner wall of the container 1 in FIG. 1B, the inner wall solder layer 5 is 1/1/1 of the height of the inner wall of the container 1 (the depth of the container 1) of the opening 6 of the container. As shown in the sectional view of the container 1 after sealing shown in FIG. 2 (A-A in FIG. 1A), the cover 2
As for the sealing between the container 1 and the opening 6, it is understood that not only the joint between the lid 2 and the opening 6 but also the solder from the inner wall of the container 1 to the lid 2 is surely joined by the solder applied to the inner wall of the container 1.

The “inner wall solder layer 5 described in the present specification is a container inner wall in a range within 1/4 of the height of the inner wall of the container 1 (depth of the container 1) of the container opening 6”. As a basis, recent container dimensions tend to be reduced in size, and in particular, there is a demand for a bottom height in the height (thickness) direction. Based on this, the internal dimensions of the container that secures a sufficient volume for accommodating the piezoelectric vibrator and the surface acoustic wave element are set to 0.1 mm for the piezoelectric vibrator.
It is about 35 mm, and about 0.6 mm for the surface acoustic wave surface element. On the other hand, the thickness of the piezoelectric vibrator element plate is about 0.1 mm and the thickness of the surface acoustic wave element is about 0.3 mm. The dimensions are set so that the solder layer 5 can be formed without being affected by the mounting of the elementary plate or the surface acoustic wave element.

Therefore, in the present invention, the airtightness of the container can be improved since the influence of the wall thickness of the container 1 is reduced and the solder sealing is reliably improved. In the cross-sectional view of FIG. 2, electronic components such as a piezoelectric vibrator and a surface acoustic wave element are housed inside the container 1, but are not shown.

[0015]

As described above, the present invention is to improve the solder strength when the small concave container and the lid are joined by solder sealing, and it is possible to improve the solder sealing quality as compared with the prior art. it can.

[Brief description of the drawings]

FIG.

FIG. 2

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Concave container 2 Lid 3 Package for electronic components 4 Metal film 5 Inner wall solder layer

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] November 30, 2000 (200.11.
30)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0005

[Correction method] Change

[Correction contents]

[0005] Seam welding sealing provides high precision and high quality for realizing an airtight container environment, but also has the possibility of causing stress and distortion in the package due to sealing involving high temperature and high pressure. Recently, a sealing method using a soft brazing material such as solder has been developed. ────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] December 6, 2000 (200.12.
6)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of the drawings]

FIG. 1 shows an electronic component package according to an embodiment of the present invention .
FIG. 3 is a diagram showing a structure.

FIG. 2 is a diagram showing a state of a closed container.

[Description of Signs] 1 Recessed container 2 Lid 3 Electronic component package 4 Metal film 5 Inner wall solder layer

[Procedure amendment 2]

[Document name to be amended] Drawing

[Correction target item name] Fig. 1

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 3]

[Document name to be amended] Drawing

[Correction target item name] Figure 2

[Correction method] Change

[Correction contents]

FIG. 2

Claims (2)

[Claims] 1. An electronic component package comprising: a concave container having an opening on an upper surface; and a lid for sealing the opening of the container, wherein a metal film is applied to an upper surface of the opening of the container, and at least one of the lids is provided. An electronic component package, wherein a main surface is joined and an inner wall metal film is applied to an inner wall of the container at an opening of the container. 2. The inner wall metal film applied to the inner wall of the container at the opening of the container according to claim 1 is applied to the entire inner wall of the container within a range of not more than 1/4 of the height of the inner wall of the container. A package for electronic components, characterized in that: