JP2002160468A - Lithographic printing original plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable easy mounting of a plate material even in an automatic plate supply printing system capable of surely preventing stretching and a positional deviation of a lithographic printing plate on a plate cylinder of a printer, being applied to printing of multicolor many prints with a material except a metal used as a support and satisfying a printing performance and durability under severe using conditions. SOLUTION: A lithographic printing original plate comprises at least an image acceptive layer on a water resistant support. The original plate further comprises an adhesive layer having a static frictional coefficient of 0.2 or more, an adhesive force of 2 to 150 kgf/cm2 and a release force of less than 40 fg/cm and provided on a rear surface thereof. In this plate, the adhesive layer is closely contacted with the plate cylinder of a lithographic printer at a printing time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lithographic printing plate precursor capable of preventing a lithographic printing plate from being displaced on a plate cylinder of a printing press.

[0002]

2. Description of the Related Art Generally, in a lithographic printing press,
The lithographic printing plate is wound around the plate cylinder and mechanically fixed, and printing is performed. Conventionally, as a support for a lithographic printing plate, a support made of a material such as a metal, a plastic film, and paper has been used. A lithographic printing plate using a material other than metal as a support,
Compared with a lithographic printing plate using a metal as a support, it is excellent in handling suitability, but lacks dimensional stability. In lithographic printing, the peripheral speed of the plate cylinder and the blanket cylinder are generally different, and a force for stretching the plate is continuously applied during printing. for that reason,
In the case of a lithographic printing plate using a material other than metal as a support, the plate is stretched or misaligned during printing, and it has been difficult to perform full-color printing which requires a precise positioning system.

[0003] As a solution, there is a method of fixing a plate on a plate cylinder using spray paste (Japanese Patent Laid-Open No. 56-1125).
No. 8) and a method of fixing using an adhesive (Japanese Patent Publication No. 7-42)
No. 5, Japanese Patent Application Laid-Open No. 61-104853) has been proposed, but once it is fixed to the plate cylinder, it becomes difficult to finely adjust the alignment required later. Not valid.

Further, in a lithographic printing plate using a support other than metal as a support, there is a problem that it is difficult to position the plate at the tip of the plate cylinder and fix the grip because the support is soft. As a solution to this, a positioning method provided with multi-point pins to facilitate the positioning (Japanese Patent Laid-Open No. Hei 10-24555)
No.) has been proposed, but it cannot deal essentially with the problem caused by the soft plate.

[0005] By using a sheet material having an initial elastic modulus of 300 kgf / mm ² or less, the positional accuracy and dimensional accuracy during high-speed printing are improved, and surface treatment is performed chemically or physically. By providing a fine uneven surface (matte surface) fixed to the surface, the frictional resistance between the plate cylinder and the printing plate is reduced to ensure free sliding of the printing plate and to facilitate the registration adjustment. Hanging method (JP-A-11-2
0130) has been proposed. However, it has been found that even if this technique makes it possible to align and fix the grip, it is not possible to sufficiently suppress plate elongation and displacement.

On the other hand, an underlaying sheet having an uneven surface in which specific fine projections are formed and distributed on the surface of a sheet-like substrate (JP-A-11-59012) has been proposed. The underlay sheet cuts into the back of the lithographic printing plate to suppress the plate elongation of the lithographic printing plate, and furthermore, the effect of surface irregularities enables fine positioning, but this underlay sheet is However, when printing is performed at a high printing pressure, the unevenness on the surface of the underlay sheet is easily broken, and there is a problem in durability under severe use conditions.

An underlay sheet further provided with an adhesive layer (Japanese Unexamined Patent Publication No.
No. 0-324076) has been proposed. This is to maintain the dimensional stability of the printing plate during printing due to the bonding effect between the pressure-sensitive adhesive layer on the flexible substrate and the back surface of the printing plate. However, the underlay sheet needs to be installed between the plate material and the plate cylinder of the printing press. In addition, in recent lithographic printing methods, as a means to increase the efficiency of the printing process, plate materials are automatically supplied for plate drawing on the plate in response to the recent improvement of digital image technology and the demand for more efficient processes. Computer-to-plate (CTP) or DDPP (Digi
There is a system that uses a technology called tal direct printing plate) on a printing press, and a system using an inexpensive and compact drawing device has been tried. Especially in such a system, an underlay sheet is attached simultaneously with a plate material. It is difficult to do or replace the underlay sheet.

[0008]

As described above, when performing full-color printing on a lithographic printing plate using a material other than metal as a support, prevention of plate growth, alignment of the plate, durability in repeated use, etc. are all required. There is no satisfactory technology, and there has been a problem that full-color printing on such a lithographic printing plate is limited to extremely few copies.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to reliably prevent the lithographic printing plate from elongating and being displaced on the plate cylinder of the printing press, whereby, for example, a lithographic printing plate using a material other than metal as a support. For lithographic printing, which can be applied to multi-color, multi-sheet printing, satisfies printing performance and durability under severe use conditions, and can easily mount plate materials even in an automatic plate feeding printing system. To provide the original.

[0010]

The object of the present invention is to provide a lithographic printing plate comprising at least an image-receiving layer provided on a water-resistant support, wherein the lithographic printing plate has a static friction coefficient of 0.2 or more on the back surface. For lithographic printing, an adhesive layer having an adhesive force of ² to 150 kgf / cm ² and a 180 ° peeling force of less than 40 gf / cm is provided, and the adhesive layer is in close contact with a plate cylinder of a lithographic printing machine during printing. It has been found to be achieved by the master.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The lithographic printing plate fixing method of the present invention will be described below in detail. The pressure-sensitive adhesive layer used for fixing a lithographic printing plate preferably has a static friction coefficient of 0.2 or more, more preferably 0.5 or more. The coefficient of static friction has no particular upper limit, but is usually about 5 or less, preferably 3 or less. Further, the adhesive strength of the adhesive layer is 1 to 15
It is preferably 0 kgf / cm ² . In this range, the effect of suppressing the distortion generated during printing due to the frictional resistance between the adhesive layer and the printing plate can be sufficiently exhibited.

Further, the 180 ° peeling force of the adhesive layer is preferably less than 40 gf / cm, more preferably 25 gf / cm.
Is less than. This 180 ° peeling force depends on the above-mentioned values of the coefficient of static friction and the adhesive force, but the smaller, the better. Within this range, good workability can be maintained, such as easy peeling of the plate cylinder and printing plate. Further, even when the plate materials are stacked, it is possible to prevent the image receiving layer and the adhesive layer from coming into close contact with each other and preventing them from peeling off.

Here, the physical properties are measured as follows. The static friction coefficient was measured according to the friction coefficient test method of JIS K7125. As used herein, the static friction coefficient refers to an adhesive material of the present invention as a test piece, ELP-IIX (manufactured by Fuji Photo Film Co., Ltd.) as a mating material, and a sliding piece having a square of 60 mm on a side and a load of 1 kg. And the results of a test performed at a sliding speed of 300 mm / min.

The 180 ° peel strength is based on JIS K 6854.
In accordance with the 180 ° peel strength test method. The specimen is
After using a 50 μm polyethylene terephthalate (manufactured by Fuji Photo Film Co., Ltd.) as the adhesive material and the flexible material of the present invention, the adhesive material and the flexible material are laminated, and then a press machine (manufactured by Marukyo Giken Co., Ltd.) is used. After applying a load of 25 kgf, the size was set to 20 mm in width, and the peeling speed was 100 mm / m.
Measured immediately at room temperature in.

The adhesive strength was measured in accordance with the JIS K6850 test method for tensile shear adhesion of an adhesive. The test piece was a pressure-sensitive adhesive material of the present invention, and a 150 μm polyethylene terephthalate (manufactured by Fuji Photo Film Co., Ltd.) was used as a mating material. After applying a load of 5kgf,
Measurements were taken immediately at room temperature.

The pressure-sensitive adhesive layer of the present invention can use a conventional rubber-based pressure-sensitive adhesive or resin-based pressure-sensitive adhesive, and any material can be used as long as it satisfies the above physical properties. Further, the pressure-sensitive adhesive preferably has a weight average molecular weight of 1 × 10 ^{3 to} 5 × 1.
0 ⁶ , more preferably 5 × 10 ³ to 1 × 10 ⁶ .

Specifically, Masataka Ono, "Adhesion and Adhesives," Japanese Standards Association (published in 1989), The Adhesion Society of Japan, "Adhesive Data Book," Nihon Kogyo Shimbun (published in 1990),
Compounds described in Keiji Fukuzawa, “Adhesion Technology”, Polymer Publishing Association (published in 1978), Soichi Muroi, “Polymer Latex Adhesive”, published in Polymer Publishing Association (1984), and the like can be used. As typical ones, all of natural, semi-synthetic and synthetic resins such as commonly used organic resins (lipophilic resins, water-soluble resins, etc.), organic resin emulsions, organic-inorganic hybrid resins, etc. can be used. It can be used after curing.

Examples of the lipophilic organic resin include acrylic resins (polymethyl methacrylate, polymethyl methacrylate, polyethyl methacrylate, various alkyl, aralkyl or aryl acrylate copolymers, various alkyl, aralkyl or aryl methacrylate copolymers, etc.). ), Alkyd resin (melamine resin, phenol resin, etc.), polystyrene resin, polyvinyl acetate resin, epoxy resin,
Polyalkylene resins (polyethylene, polypropylene, etc.), polyester resins, polyurethane resins and the like can be mentioned.

Examples of the water-soluble organic resin include cellulose, cellulose derivatives (cellulose esters; cellulose nitrate, cellulose sulfate, cellulose acetate, cellulose propionate, cellulose succinate, cellulose butyrate, cellulose acetate succinate, cellulose acetate butyrate, phthalate acetate). Cellulose ethers such as acid cellulose; methyl cellulose, ethyl cellulose, cyanoethyl cellulose, carboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, ethyl hydroxyethyl cellulose, hydroxypropyl methyl cellulose, carboxymethyl hydroxyethyl cellulose, etc.), starch, starch derivatives (oxidized starch, esterification) Starches; nitric acid, sulfuric acid, phosphoric acid, acetic acid, propionic acid, butyric acid, amberjack And etherified starches; methylated, ethylated, cyanoethylated, hydroxyalkylated, carboxymethylated, etc.), alginic acid, pectin, carrageenan, tamarind gum, natural gums (gum arabic, Guar gum, locust bean gum, tragacanth gum, xanthan gum, etc.), pullulan, dextran, casein, gelatin, chitin, chitosan, polyvinyl alcohol, polyalkylene glycol [polyethylene glycol, polypropylene glycol, (ethylene / propylene glycol) copolymer, etc.], allyl Alcohol copolymer, acrylic acid copolymer, methacrylic acid copolymer, polyamino acid,
Polyamide (Polymer or copolymer of N-substituted acrylamide or methacrylamide [eg, methyl, ethyl, propyl, isopropyl,
Butyl, phenyl, monomethylol, 2-hydroxyethyl, 3-hydroxypropyl, 1,1-bis (hydroxymethyl) ethyl, 2,3,4,5,6-pentahydroxypentyl group, etc.), polyamine (polyethylene) Imine, polyallylamine, polyvinylamine and the like), polyurea (urea resin and the like) and the like.

Examples of the organic resin emulsion include acrylic resins (polymethyl methacrylate, polymethyl acrylate, polyethyl methacrylate, various alkyl, aralkyl or aryl acrylate copolymers, various alkyl, aralkyl or aryl methacrylate copolymers, etc.). Emulsions, alkyd resin (melamine resins, phenol resins, etc.) emulsions, styrene resin emulsions, vinyl acetate resin emulsions, epoxy resin emulsions, alkylene resin (polyethylene, polypropylene, etc.) emulsions, ester resin emulsions, urethane resin emulsions and the like can be mentioned.

The organic-inorganic hybrid resin includes a resin having a bond in which a metal atom is connected via an oxygen atom or a nitrogen atom (hereinafter also referred to as a metal-containing resin), and a group capable of forming a hydrogen bond with the resin. And a complex with an organic polymer. The composite of the metal-containing resin and the organic polymer is used to include a sol-like substance and a gel-like substance.

The metal-containing resin is referred to as “oxygen atom (nitrogen atom)
-A metal atom-oxygen atom (nitrogen atom).

Among the metal-containing resins, the resin having an oxygen atom-metal atom-oxygen atom bond is preferably a polymer obtained by hydrolytic polycondensation of a metal compound represented by the following general formula (I). . Here, the hydrolysis polycondensation is a reaction in which a reactive group repeatedly undergoes hydrolysis and condensation under acidic or basic conditions to polymerize.

General formula (I) (R ⁰ ) _n M (Y) _xn [In the general formula (I), R ⁰ represents a hydrogen atom, a hydrocarbon group or a heterocyclic group, Y represents a reactive group, M represents a trivalent to hexavalent metal, x represents a valence of the metal M, and n represents 0, 1,
Represents 2, 3 or 4. However, xn is 2 or more. ]

The metal compound represented by formula (I) will be described in detail. R ⁰ in the general formula (I) is preferably a linear or branched alkyl group having 1 to 12 carbon atoms which may be substituted, for example, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group Group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, dodecyl group and the like; groups which can be substituted by these groups include halogen atom (chlorine atom, fluorine atom, bromine atom), hydroxy group, thiol group , Carboxy group, sulfo group, cyano group,
Epoxy group, -OR 'group (R' is a hydrocarbon group, for example,
Methyl, ethyl, propyl, butyl, hexyl, heptyl, octyl, decyl, propenyl, butenyl, hexenyl, octenyl, 2-hydroxyethyl, 3-chloropropyl, 2- Cyanoethyl group, N, N-dimethylaminoethyl group, 2-bromoethyl group, 2- (2-methoxyethyl) oxyethyl group, 2-methoxycarbonylethyl group, 3-carboxypropyl group, benzyl group, etc.), -OCOR ′ Group,
-COOR 'group, -COR' group, -N (R ") (R")
(R ″ represents a hydrogen atom or the same content as R ′,
Each may be the same or different), -NHCONHR '
Group, -NHCOOR 'group, -Si (R') ₃ group, -CO
NHR ″ group, —NHCOR ′ group and the like. These substituents may be substituted plurally in the alkyl group.

A linear or branched alkenyl group having 2 to 12 carbon atoms which may be substituted (for example, vinyl, propenyl, butenyl, pentenyl, hexenyl, octenyl, decenyl, dodecenyl, etc.) Examples of the group that can be substituted with these groups include those having the same contents as the groups that can be substituted with the alkyl group, and may be substituted with a plurality of groups. Good aralkyl groups (eg, benzyl, phenethyl, 3
-Phenylpropyl group, naphthylmethyl group, 2-naphthylethyl group and the like;
Examples thereof include those having the same contents as the groups which can be substituted with the alkyl group, and may be substituted plurally.)
Alicyclic groups which may be substituted with 0 (for example, cyclopentyl group, cyclohexyl group, 2-cyclohexylethyl group, 2-cyclopentylethyl group, norbornyl group, adamantyl group, etc .;
The same substituents as those of the alkyl group may be mentioned, and a plurality of the substituents may be substituted. An optionally substituted aryl group having 6 to 12 carbon atoms (for example, a phenyl group, a naphthyl group, Is the same as the group which can be substituted with the alkyl group, and may be substituted plurally),

Alternatively, a condensed heterocyclic group having at least one atom selected from a nitrogen atom, an oxygen atom and a sulfur atom (for example, a heterocyclic ring includes a pyran ring, a furan ring, a thiophene ring, a morpholine Ring, pyrrole ring, thiazole ring, oxazole ring, pyridine ring, piperidine ring, pyrrolidone ring, benzothiazole ring, benzoxazole ring, quinoline ring, tetrahydrofuran ring, etc., which may contain a substituent. The same contents as the substituents in the alkyl group are mentioned, and plural substituents may be used).

The reactive group Y is preferably a hydroxy group, a halogen atom (representing a fluorine atom, a chlorine atom, a bromine atom or an iodine atom), a —OR ¹ group, a —OCOR ² group,
CH (COR ³ ) (COR ⁴ ) group, —CH (COR ³ )
Represents a (COOR ⁴ ) group or a —N (R ⁵ ) (R ⁶ ) group.

In the —OR ¹ group, R ¹ has 1 to 10 carbon atoms.
Which may be substituted (for example, methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, propenyl, butenyl, heptenyl) Hexenyl, octenyl, decenyl, 2-hydroxyethyl, 2-hydroxypropyl, 2-methoxyethyl, 2- (methoxyethyloxy) ethyl, 2-
(N, N-diethylamino) ethyl group, 2-methoxypropyl group, 2-cyanoethyl group, 3-methyloxypropyl group, 2-chloroethyl group, cyclohexyl group, cyclopentyl group, cyclooctyl group, chlorocyclohexyl group, methoxycyclohexyl group Benzyl, phenethyl, dimethoxybenzyl, methylbenzyl, bromobenzyl, etc.).

In the —OCOR ² group, R ² is the same aliphatic group as R ¹ or an optionally substituted aromatic group having 6 to 12 carbon atoms (the aromatic group is the aryl group in R ⁰ described above). And the same as exemplified above.).

A —CH (COR ³ ) (COR ⁴ ) group and a —C
In the H (COR ³ ) (COOR ⁴ ) group, R ³ is an alkyl group having 1 to 4 carbon atoms (eg, a methyl group, an ethyl group, a propyl group, a butyl group, etc.) or an aryl group (eg, a phenyl group, a tolyl group) , A xylyl group, etc.), and R ⁴ is an alkyl group having 1 to 6 carbon atoms (eg, a methyl group, an ethyl group,
Propyl, butyl, pentyl, hexyl, etc.),
An aralkyl group having 7 to 12 carbon atoms (for example, a benzyl group,
A phenethyl group, a phenylpropyl group, a methylbenzyl group, a methoxybenzyl group, a carboxybenzyl group, a chlorobenzyl group or the like; or an aryl group (for example, phenyl, tolyl, xylyl, mesityl, methoxyphenyl, chlorophenyl, carboxy) Phenyl group, diethoxyphenyl group, etc.).

In the —N (R ⁵ ) (R ⁶ ) group, R ⁵
And R ⁶ may be the same or different from each other, and each is preferably a hydrogen atom or an aliphatic group having 1 to 10 carbon atoms which may be substituted (for example, the same content as R ^{1 in the} above-mentioned OR ¹ group) ). More preferably, R ⁵
And the total number of carbon atoms of R ⁶ is 12 or less.

The metal M is preferably a transition metal, a rare earth metal, or a metal belonging to Groups III to V of the periodic table. More preferably, Al, Si, Sn, Ge, Ti, Zr, etc. are mentioned, and Al, Si, Ti, Zr, etc. are more preferably mentioned. Particularly, Si is preferable.

Specific examples of the metal compound represented by the general formula (I) include, but are not limited to, the following.

Methyltrichlorosilane, methyltribromosilane, methyltrimethoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, methyltri-t-butoxysilane, ethyltrichlorosilane, ethyltribromosilane, ethyltrimethoxysilane, ethyltrimethoxysilane Ethoxysilane, ethyltriisopropoxysilane, ethyltri-t-butoxysilane, n-propyltrichlorosilane, n-propyltribromosilane, n-
Propyltrimethoxysilane, n-propyltriethoxysilane, n-propyltriisopropoxysilane, n
-Propyltri-t-butoxysilane, n-hexyltrichlorosilane, n-hexyltribromosilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, n-hexyltriisopropoxysilane, n-
Hexyltri-t-butoxysilane, n-decyltrichlorosilane, n-decyltribromosilane, n-decyltrimethoxysilane, n-decyltriethoxysilane, n
-Decyltriisopropoxysilane, n-decyltri-t
-Butoxysilane, n-octadecyltrichlorosilane, n-octadecyltribromosilane, n-octadecyltrimethoxysilane, n-octadecyltriethoxysilane, n-octadecyltriisopropoxysilane, n-octadecyltri-t-butoxysilane, phenyltrichlor Silane, phenyltribromosilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltriisopropoxysilane, phenyltri-t-butoxysilane,

Tetrachlorosilane, tetrabromosilane, tetramethoxysilane, tetraethoxysilane, tetraisopropoxysilane, tetrabutoxysilane, dimethoxydiethoxysilane, dimethyldichlorosilane,
Dimethyldibromosilane, dimethyldimethoxysilane,
Dimethyldiethoxysilane, diphenyldichlorosilane, diphenyldibromosilane, diphenyldimethoxysilane, diphenyldiethoxysilane, phenylmethyldichlorosilane, phenylmethyldibromosilane, phenylmethyldimethoxysilane, phenylmethyldiethoxysilane, triethoxyhydrosilane , Tribromohydrosilane, trimethoxyhydrosilane, isopropoxyhydrosilane, tri-t-butoxyhydrosilane, vinyltrichlorosilane, vinyltribromosilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriisopropoxysilane, vinyltri-t-butoxysilane, Trifluoropropyltrichlorosilane, trifluoropropyltribromosilane, trifluoropropyltrimethoxysila , Trifluoropropyl triethoxysilane, trifluoropropyl triisopropoxysilane, trifluoropropyl tri t- butoxysilane,

Γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ
Glycidoxypropyltriisopropoxysilane, γ
-Glycidoxypropyltri-t-butoxysilane, γ-
Methacryloxypropylmethyldimethoxysilane, γ
-Methacryloxypropylmethyldiethoxysilane,
γ-methacryloxypropyltrimethoxysilane, γ
-Methacryloxypropyltriisopropoxysilane, γ-methacryloxypropyltri-t-butoxysilane, γ-aminopropylmethyldimethoxysilane, γ
-Aminopropylmethyldiethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltriisopropoxysilane, γ-aminopropyltri-t-butoxysilane, γ-mercaptopropylmethyldimethoxysilane ,
γ-mercaptopropylmethyldiethoxysilane, γ-
Mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropyltriisopropoxysilane, γ-mercaptopropyltri-t-butoxin lan, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, β- ( 3,4
-Epoxycyclohexyl) ethyltriethoxysilane,

Ti (OR) ₄ (R represents an alkyl group (eg, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, etc.); the same applies hereinafter), TiCl ₄ ,
Zn (OR) ₂ , Zn (CH ₃ COCHCOCH ₃ ) ₂ , Sn
(OR) ₄ , Sn (CH ₃ COCHCOCH ₃ ) ₄ , Sn (O
COR) ₄ , SnCl ₄ , Zr (OR) ₄ , Zr (CH ₃ CO
CHCOCH ₃ ) ₄ , Al (OR) ₃ . The metal compound is
Used alone or in combination for the production of metal-containing resins.

Examples of the metal-containing resin having a nitrogen atom-metal atom-nitrogen atom bond include polysilazane.

The organic polymer contains a group capable of forming a hydrogen bond with a metal-containing resin (hereinafter, also referred to as a specific bonding group). The specific bonding group preferably includes at least one bond selected from an amide bond (including a carboxylic acid amide bond and a sulfonamide bond), a urethane bond, and a ureido bond, and a hydroxyl group.

The organic polymer includes, as a repeating unit component, a polymer containing a specific bonding group in a main chain and / or a side chain of the polymer. Preferably, as a repeating unit ^{component, -N (R 11) CO -} , - N (R 11) SO
₂ -, - -NHCONH- and -NHCOO- is at least one bond selected from the components present in the main chain and / or side chain of the polymer, and / or components and the like which contain -OH groups. R ¹¹ in the amide bond represents a hydrogen atom or an organic residue, and examples of the organic residue include those having the same contents as the hydrocarbon group and the heterocyclic group in R ⁰ in Formula (I). .

The polymer main chain contains the specific bonding group of the present invention.
The polymer having -N (R ¹¹) CO-bond or
Is -N (R¹¹) SO_TwoAmide resin having a bond, -N
Ureido resin having HCONH-bond, -NHCOO
-Urethane resins containing bonds.

Examples of the diamines and dicarboxylic acids or disulfonic acids used in the production of the amide resin, the diisocyanates used in the ureide resin, and the diols used in the urethane resin include, for example, "Polymer Data Handbook-"Basics-"Chapter I (published by Baifukan) (1
986), Shinzo Yamashita, Tosuke Kaneko, "Crosslinking Agent Handbook", Taiseisha, 1981, and the like.

Examples of other polymers having an amide bond include a polymer containing a repeating unit represented by the following general formula (II), an N-acylated polyalkyleneimine, and polyvinylpyrrolidone and derivatives thereof.

[0045]

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In the formula (II), Z ¹ represents —CO—, —SO ₂ — or —CS—. R ²⁰ has the same content as R ⁰ in formula (I). r ¹ represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms (eg, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, etc.). r ¹ may be the same or different. p represents an integer of 2 or 3.

Among the polymers containing a repeating unit represented by the general formula (II), the polymer in which Z ¹ represents a —CO— bond and p represents 2 is obtained by catalyzing oxazoline optionally having a substituent. By ring-opening polymerization in the presence of Examples of the catalyst include sulfates and sulfonates such as dimethyl sulfate and alkyl p-toluenesulfonate; alkyl halides such as alkyl iodide (eg, methyl iodide); metal fluorides among Friedel-Crafts catalysts; Acids such as sulfuric acid, hydrogen iodide and p-toluenesulfonic acid, and oxazolinium salts which are salts of these acids with oxazoline can be used. This polymer may be a homopolymer or a copolymer. Further, a copolymer in which this polymer is grafted to another polymer may be used.

Specific examples of oxazolines include, for example,
2-oxazoline, 2-methyl-2-oxazoline, 2
-Ethyl-2-oxazoline, 2-propyl-2-oxazoline, 2-isopropyl-2-oxazoline, 2-
Butyl-2-oxazoline, 2-dichloromethyl-2-
Oxazoline, 2-trichloromethyl-2-oxazoline, 2-pentafluoroethyl-2-oxazoline, 2
-Phenyl-2-oxazoline, 2-methoxycarbonylethyl-2-oxazoline, 2- (4-methylphenyl) -2-oxazoline, 2- (4-chlorophenyl)
-2-oxazoline and the like. Preferred oxazolines include 2-oxazoline, 2-methyl-2-oxazoline, 2-ethyl-2-oxazoline, and the like. One or two or more of such oxazoline polymers can be used.

For other polymers having a repeating unit represented by the general formula (II), thiazoline, 4,5-dihydro-1,3-oxazine or 4,5-dihydro-1,3-thiazine is used instead of oxazoline. Can be obtained similarly.

Examples of the N-acylated polyalkyleneimine include a carboxylic acid amide containing -N (CO-R ²⁰ )-obtained by a polymer reaction with a carboxylic acid halide, or an N-acylated product of a sulfonyl halide. -N obtained by molecular reaction
(SO ₂ —R ²⁰ ) —- containing sulfonamide compound (where,
R ²⁰ has the same meaning as R ²⁰ in formula (II)) can be mentioned.

Examples of the polymer containing a specific bonding group in the side chain of the polymer include those containing, as a main component, a component containing at least one type of bonding group selected from the specific bonding group. Can be Examples of such components include acrylamide, methacrylamide, crotonamide, vinylacetamide, and the following compounds. However, it is not limited to these.

[0052]

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[0053]

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On the other hand, the hydroxyl group-containing organic polymer may be any of a natural water-soluble polymer, a semi-synthetic water-soluble polymer, and a synthetic polymer. Polymer Compound I "published by Asakura Shoten (196
0), Business Development Center Publishing Division, "Water-soluble Polymer / Water-dispersible Resin Comprehensive Technical Data Book", Business Development Center Publishing Division (1981), Nagatomo Shinji, "Applications and Markets of New Water-Soluble Polymers" ( Published by CMC Corporation (1988), "Development of Functional Cellulose" Published by CMC Corporation (1985)
Year)).

For example, natural and semi-synthetic polymers include cellulose, cellulose derivatives (cellulose esters; cellulose nitrate, cellulose sulfate, cellulose acetate, cellulose propionate, cellulose succinate, cellulose butyrate, cellulose acetate succinate, acetate acetate). Cellulose ethers such as cellulose butyrate and cellulose acetate phthalate; methyl cellulose, ethyl cellulose, cyanoethyl cellulose, carboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, ethyl hydroxyethyl cellulose, hydroxypropyl methyl cellulose, carboxymethyl hydroxyethyl cellulose, etc.), starch, starch derivatives ( Oxidized starch, esterified starches; nitric acid, sulfuric acid, phosphoric acid, acetic acid, propion , Butyric acid, esterified products such as succinic acid, etherified starches; derivatives such as methylated, ethylated, cyanoethylated, hydroxyalkylated, carboxymethylated), alginic acid, pectin, carrageenan, tamarind gum, natural gums ( Gum arabic, guar gum, locust bean gum, tragacanth gum, xanthan gum, etc.), pullulan, dextran, casein, gelatin, chitin, chitosan and the like.

Examples of the synthetic polymer include polyvinyl alcohol, polyalkylene glycol (polyethylene glycol, polypropylene glycol, (ethylene glycol / propylene glycol) copolymer, etc.), allyl alcohol copolymer, and acryl containing at least one hydroxyl group. Polymers or copolymers of acid esters or methacrylic esters (for example, 2
-Hydroxyethyl group, 3-hydroxypropyl group,
2,3-dihydroxypropyl group, 3-hydroxy-2
-Hydroxymethyl-2-methylpropyl group, 3-hydroxy-2,2-di (hydroxymethyl) propyl group,
Polyoxyethylene group, polyoxypropylene group,
Etc.), a polymer or copolymer of an N-substituted acrylamide or methacrylamide containing at least one hydroxyl group (as the N-substituent, for example, a monomethylol group,
2-hydroxyethyl group, 3-hydroxypropyl group,
1,1-bis (hydroxymethyl) ethyl group, 2,3
4,5,6-pentahydroxypentyl group, etc.). However, the synthetic polymer is not particularly limited as long as it has at least one hydroxyl group in the side chain substituent of the repeating unit.

The weight average molecular weight of the organic polymer used in the present invention is preferably 10 ³ to 10 ⁶ , more preferably 5 to 10 ⁶ .
× 10 ³ to 4 × 10 ⁵ .

In the composite of the metal-containing resin and the organic polymer according to the present invention, the ratio of the metal-containing resin to the organic polymer can be selected in a wide range, but the mass ratio of the metal-containing resin / organic polymer is from 10/90 to 90/90. 10, more preferably 2
0/80 to 80/20.

The adhesive containing the above-mentioned composite is, for example,
In the case of a metal-containing resin produced by hydrolysis polycondensation of the metal compound, its hydroxyl group and the specific bonding group in the organic polymer form a uniform organic or inorganic hybrid by a hydrogen bonding action and undergo phase separation. Microscopically homogeneous without any. When a hydrocarbon group is present in the metal-containing resin, it is presumed that the affinity with the organic polymer is further improved due to the hydrocarbon group. Also,
This composite is excellent in film formability.

The composite of the metal-containing resin and the organic polymer is produced by hydrolytic polycondensation of the above-mentioned metal compound and mixing with the organic polymer, or in the presence of the organic polymer, It is produced by condensation. Preferably, in the presence of an organic polymer,
An organic-inorganic polymer composite can be obtained by hydrolytic polycondensation of the metal compound by a sol-gel method. In the formed organic-inorganic polymer composite, the organic polymer is uniformly dispersed in a matrix of a gel (ie, a three-dimensional fine network structure of an inorganic metal oxide) formed by hydrolytic polycondensation of a metal compound.

The sol-gel method as a preferred method can be carried out using a conventionally known sol-gel method. Specifically, "Thin-film coating technology by sol-gel method" (Technical Information Association) (published) (1995), Saio Sakuhana "Science of sol-gel method" (Agne Shofusha) (published) (1988), Takashi Hirashima, "Technology for preparing functional thin films by the latest sol-gel method," General Technology Center (published) (19)
1992) according to a method described in detail in a written document.

The coating liquid for the pressure-sensitive adhesive layer is preferably an aqueous solvent, and more preferably a water-soluble solvent is used in combination for uniform liquefaction by suppressing precipitation during preparation of the coating liquid. Examples of the water-soluble solvent include alcohols (methanol, ethanol, propyl alcohol, ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monoethyl ether, etc.) and ethers (tetrahydrofuran , Ethylene glycol dimethyl ether, propylene glycol dimethyl ether, tetrahydropyran,
And the like, ketones (acetone, methyl ethyl ketone, acetylacetone, etc.), esters (methyl acetate, ethylene glycol monoacetate, etc.), amides (formamide, N-methylformamide, pyrrolidone, N-methylpyrrolidone, etc.). One or two solvents
More than one species may be used in combination.

When the above composite is used, it is preferable to use an acidic catalyst or a basic catalyst in combination to promote the hydrolysis and polycondensation reaction of the metal compound represented by the general formula (I). . As the catalyst, an acid or basic compound used as it is or in a state of being dissolved in a solvent such as water or alcohol (hereinafter referred to as an acidic catalyst or a basic catalyst, respectively) is used. The concentration at that time is not particularly limited, but when the concentration is high, the rate of hydrolysis and polycondensation tends to increase. However, if a highly concentrated basic catalyst is used, a precipitate may be formed in the sol solution. Therefore, the concentration of the basic catalyst is desirably 1 N (mol / L) (concentration conversion in an aqueous solution) or less.

The type of the acidic catalyst or the basic catalyst is not particularly limited, but when it is necessary to use a catalyst having a high concentration, a catalyst composed of an element which hardly remains in the catalyst crystal grains after sintering is used. Good. Specifically, examples of the acidic catalyst include hydrogen halides such as hydrochloric acid, nitric acid, sulfuric acid,
Sulfurous acid, hydrogen sulfide, perchloric acid, hydrogen peroxide, carbonic acid, carboxylic acids such as formic acid and acetic acid, substituted carboxylic acids obtained by substituting R of the structural formula RCOOH with other elements or substituents, sulfonic acids such as benzenesulfonic acid, Examples of the basic catalyst include ammoniacal bases such as aqueous ammonia, and amines such as ethylamine and aniline.

Further, a crosslinking agent may be added in order to further improve the film strength. Examples of the crosslinking agent include compounds that are usually used as a crosslinking agent. Specifically, it is described in Shinzo Yamashita, Tosuke Kaneko, "Crosslinking Agent Handbook" Taiseisha (1981), edited by The Society of Polymer Science, "Polymer Data Handbook, Basic Edition", Baifukan (1986). Can be used.

For example, ammonium chloride, metal ions,
Organic peroxides, polyisocyanate compounds (for example, toluylene diisocyanate, diphenylmethane diisocyanate, triphenylmethane triisocyanate, polymethylenephenyl isocyanate, hexamethylene diisocyanate, isophorone diisocyanate, polymer polyisocyanate And polyol compounds (eg, 1,4-butanediol, polyoxypropylene glycol, polyoxyethylene glycol, 1,1,1
-Trimethylolpropane, etc.), polyamine-based compounds (e.g., ethylenediamine, γ-hydroxypropylated ethylenediamine, phenylenediamine, hexamethylenediamine, N-aminoethylpiperazine, modified aliphatic polyamines, etc.), polyepoxy group-containing compounds and epoxy Resins (eg, “New Epoxy Resin” edited by Hiroshi Kakiuchi, published by Shokodo 1985), “Epoxy Resins” edited by Kuniyuki Hashimoto, compounds described in Nikkan Kogyo Shimbun (1969), etc., and melamine resins (eg, Ichiro Miwa) , Edited by Hideo Matsunaga, "Uria Melamine Resin", compounds described in Nikkan Kogyo Shimbun (1969), etc., poly (meth) acrylate compounds (for example, "Oligomers" edited by Shin Okawara, Takeo Saegusa, Toshinobu Higashimura) Kodansha (1976), Eizo Omori "Functional acrylic resin" Techno System (1985)
And the like)).

In order to further adjust the physical properties of the film, fine particles may be added to the film as another component of the adhesive resin material.
The preferred average particle size of the fine particles is 0.01 μm to 30 μm.
m, more preferably 0.02 μm to 20 μm. The fine particles are particles made of an inorganic material, an organic material, an organic-inorganic composite material, or the like.

Examples of the inorganic particles include metal powders, metal oxides, metal nitrides, metal hydroxides, metal sulfides, metal carbides, and composite metal compounds thereof, preferably glass, SiO ₂ , TiO ₂ , ZnO, Fe ₂ O ₃ ,
Oxides such as ZrO ₂ and SnO ₂ and sulfides such as ZnS and CuS.

As the organic particles, for example, synthetic resin particles,
Natural polymer particles and the like, preferably acrylic resin, polyethylene, polypropylene, polyethylene oxide, polypropylene oxide, polyethylene imine, polystyrene, polyurethane, polyurea, polyester, polyamide, polyimide, carboxymethyl cellulose, gelatin, starch, chitin, chitosan, etc. And more preferably synthetic resin particles such as acrylic resin, polyethylene, polypropylene, and polystyrene.

As the organic-inorganic composite particles, for example,
At least 2 of materials forming inorganic particles and organic particles of
Or more composites, preferably glass, S
iO _Two, TiO_Two, ZnO, Fe_TwoO_Three, ZrO_Two, SnO_Two
Oxides and / or sulfides such as ZnS and CuS
Lil resin, polyethylene, polypropylene, polyethylene
Oxide, polypropylene oxide, polyethylene
Nimine, polystyrene, polyurethane, polyurea,
Polyester, polyamide, polyimide, carboxime
Chill cellulose, gelatin, starch, chitin, chitosa
And more preferably a compound such as SiO2._Two, T
iO_Two, ZnO, Fe_TwoO_Three, ZrO_Two, SnO_TwoOxidation of etc.
Resin and polyether having a hydrogen bonding functional group
Tylene oxide, polypropylene oxide, polyether
Tylene imine, polyurethane, polyurea, polyester
, Polyamide, polyimide, carboxymethyl cellulose
Complex of glucose, gelatin, starch, chitin, chitosan, etc.
Things.

Next, the plate material (printing plate) used in the present invention will be described. As a printing original plate, water-resistant paper, plastic film,
A plate material provided with an image receiving layer on a water-resistant support such as paper laminated with plastic can be used. Other examples include metal plates such as aluminum and chrome-plated steel plates. The thickness of this plate material is suitably in the range of 100 to 300 μm, and the thickness of the image receiving layer provided therein is 5 to 3 μm.
A range of 0 μm is appropriate.

As the image receiving layer, a hydrophilic layer comprising an inorganic pigment and a binder or a layer which can be made hydrophilic by a desensitizing treatment can be used. As the inorganic pigment used in the hydrophilic image receiving layer, clay, silica, calcium carbonate, zinc oxide, aluminum oxide, barium sulfate, and the like can be used. Alternatively, hydrophilic binders such as polyvinyl alcohol, starch, carboxymethylcellulose, hydroxyethylcellulose, casein, gelatin, polyacrylate, polyvinylpyrrolidone, and polymethylether-maleic anhydride copolymer can be used as the binder. If necessary, a melamine formalin resin, a urea formalin resin, or another crosslinking agent for imparting water resistance may be added.

On the other hand, examples of the image receiving layer used after the desensitizing treatment include a layer using zinc oxide and a hydrophobic binder. Examples of the zinc oxide used in the present invention include zinc oxide, zinc white, and wet zinc as described in, for example, "Primary Handbook of New Edition", p. 319, edited by The Japan Facial Technology Association, Seibundo Co., Ltd. (1968). It may be any of those commercially available as flower or activated zinc flower. That is, zinc oxide includes, as a dry method, a French method (indirect method), an American method (direct method) and a wet method, depending on the starting materials and the production method. For example, Shodo Chemical Co., Ltd., Sakai Chemical ( stock),
Examples include those commercially available from companies such as Hakusui Chemical Co., Ltd., Honjo Chemical Co., Ltd., Toho Zinc Co., Ltd., and Mitsui Kinzoku Kogyo Co., Ltd.

Examples of the resin used as the binder include vinyl chloride-vinyl acetate copolymer and styrene-
Butadiene copolymer, styrene-methacrylate copolymer, methacrylate copolymer, acrylate copolymer,
Examples include vinyl acetate copolymer, polyvinyl butyral, alkyd resin, epoxy resin, epoxy ester resin, polyester resin, and polyurethane resin. These resins may be used alone or in combination of two or more.

The content of the resin in the image receiving layer is preferably from 9/91 to 20/80 in terms of the weight ratio of resin / zinc oxide.

Desensitization of zinc oxide has been conventionally performed by using a desensitizing solution of this type, a treating solution containing a cyanide compound containing ferrocyanate and ferricyanate as main components, an ammine cobalt complex, phytic acid and derivatives thereof. There are known a cyan-free treatment liquid containing a guanidine derivative as a main component, a treatment liquid containing an inorganic acid or an organic acid that forms a chelate with zinc ions as a main component, and a treatment liquid containing a water-soluble polymer. For example, as a cyanide-containing treatment solution, JP-B-44-9045 and JP-B-46-39403.
And JP-A-52-76101 and 57-107889.
And Nos. 54-117201.

As a method of applying the above-mentioned pressure-sensitive adhesive to the back side of the plate material, an adjusted coating solution is applied and dried by any one of conventionally known coating methods to form a film. As a coating method, coater coating (air doctor, blade, rod,
Squeeze, gravure, etc.), spray application (air spray, electrostatic spray, etc.), ink jet application, gravure printing method and the like.

The thickness of the formed adhesive layer is 0.2 to 60 μm.
m is preferred, and more preferably 0.5 μm to 25 μm. In this range, a film having a uniform thickness is formed, and the film has sufficient strength. Furthermore, the area of the formed adhesive layer is at least 20% or more, more preferably 30%, of the plate cylinder area.
Above, more preferably 50% or more, it is preferable that the coating is uniform. The formation of the adhesive layer on the plate material may be performed at any stage before printing.

At the time of printing by the lithographic printing press, each lithographic printing plate is mounted on the plate cylinder of each printing unit. According to the present invention, at this time, the adhesive layer is brought into close contact with the plate cylinder, thereby effectively preventing displacement of the lithographic printing plate on the plate cylinder due to pressurization.

[0080]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

Example 1 Nippol SX of latex containing NBR resin as a main component
ELP-IIX, a paper having a support laminated with polyethylene as a lithographic printing plate, after adding water to -1503 (manufactured by Zeon Corporation) so that the solid content is 40 wt%.
(Manufactured by Fuji Photo Film Co., Ltd.) was applied to the back surface of a desensitized product by making a plate with an ELP415VX plate making machine so as to be 1 g / m ² by spraying.
(0 ° C.) for 3 minutes to form a target adhesive layer. Next, the above-mentioned plate material was used for the planographic printing press Oliver 52 (manufactured by Sakurai Co., Ltd.)
50 cylinders at a printing speed of 8000 sheets per minute
00 sheets were printed.

Comparative Example 1 Acrylic rubber latex AE945 (JS
A pressure-sensitive adhesive layer was formed using the same materials and the same method as in Example 1 except that R (produced by R Company) was used.

Comparative Example 2 The same as Example 1 except that there was no adhesive layer.

Table 1 shows the physical properties of the pressure-sensitive adhesive layers of the above Examples and Comparative Examples and the printing characteristics using the same. The embodiment of the evaluation items in the present embodiment is as follows.

<Static friction coefficient> The static friction coefficient was measured according to the friction coefficient test method of JIS K7125. The coefficient of static friction as used herein refers to the pressure-sensitive adhesive material of the present invention as a test piece and E as a mating material.
The test results were obtained by using a LP-IIX (manufactured by Fuji Photo Film Co., Ltd.), a square having a side of 60 mm and a load of 1 kg at a sliding speed of 300 mm / min.

<180 ° Peeling Strength> JIS K6854
In accordance with the 180 ° peel strength test method. The specimen is
50 μm polyethylene terephthalate (manufactured by Fuji Photo Film Co., Ltd.) as the pressure-sensitive adhesive material and the flexure material of the present invention
After sticking the adhesive material and the flexible material together, applying a load of 25 kgf to a press machine (manufactured by Marukyo Giken Co., Ltd.), and measuring the tensile test machine Tensilon (manufactured by Toyo Baldwin Co., Ltd.) with a width of 20 mm. Peeling speed 100m using
Measured immediately at room temperature at m / min.

<Adhesive Strength> The adhesive strength was measured in accordance with the tensile shear adhesion test method of JIS K6850. The test piece was 5 kgf of the adhesive material of the present invention and 150 μm polyethylene terephthalate (produced by Marukyo Giken Co., Ltd.) as a mating material.
, And immediately measured at room temperature using a tensile tester Tensilon (manufactured by Toyo Baldwin).

<Print Dimensional Stability> Printing 50
Evaluation was made by the displacement between the registration marks (printing marks 300 mm in the printing direction) of the printed matter after 00 sheets. The smaller the displacement, the better the printing dimensional stability.

<Printing workability> The printing plate position correcting property is whether the printing plate can be easily shifted when only the printing plate is shifted vertically and horizontally after the printing plate is mounted on the printing press.
The printing plate was evaluated for obstruction, that is, wrinkles and tears.
The plate discharging property is to check whether the printing plate can be easily peeled off after 5,000 sheets of printing are completed.
Furthermore, evaluation was made based on the time until plate discharge. If the printing plate is torn or takes a long time to discharge the plate, the printing workability is poor.

[0090]

[Table 1]

When the dimensional stability and printing workability of the plate material were evaluated using the above-mentioned pressure-sensitive adhesive layer, only the printing press having the pressure-sensitive adhesive layer of the present invention showed good printing characteristics and printing workability. Was.

Examples 2 to 4 An adhesive layer was prepared in the same manner as in Example 1 except that the adhesive layer material was changed as shown in Table 2. The physical properties of the adhesive layer were measured in the same manner as in Example 1. Table 3 shows the results.

[0093]

[Table 2]

[0094]

[Table 3]

The adhesive layer thus obtained was used in Example 1
When evaluated by the same method as described above, all the dimensional stability and printing workability were good.

Example 5 Sebian M of latex containing acrylic resin as a main component
Y7910 (manufactured by Daicel Corporation) having a solid content of 35 wt.
% After adding water to obtain an average particle size of 0.2 μm.
m of zinc oxide particles (manufactured by Sakai Chemical Co., Ltd.) so that the resin component / inorganic particle ratio becomes 85/15 (wt%), and put it together with glass beads into a paint shaker (manufactured by Toyo Seiki Co., Ltd.). After dispersion for 10 minutes, the glass beads were separated by filtration to obtain a dispersion. As a lithographic printing plate, thickness 1
Using a silver-diffusible photosensitive material having a support of 00 μm polyethylene terephthalate (PET) as a support, Super Master Plus (130 μm in total thickness) manufactured by Agfage Palte Co., Ltd.
The coating solution was applied to the back side of the plate material by spraying so as to be 1.5 g / m ² , and dried with a lamp heater (100 ° C.) for 3 minutes to provide a target adhesive layer. The physical properties of the adhesive layer were measured in the same manner as in Example 1. Table 5 shows the results. next,
The above-mentioned plate material was mounted on the plate cylinder of a lithographic printing press Oliver 52 (manufactured by Sakurai Co., Ltd.), and the printing speed was 8,000 sheets per minute.
000 sheets were printed.

Examples 6 to 8 An adhesive layer was prepared and evaluated in the same manner as in Example 5, except that the inorganic particles shown in Table 4 below were used. The physical properties of these adhesive layers are shown in Table 5 below.

[0098]

[Table 4]

Example 9 Nippol SX of latex containing NBR resin as a main component
After adding water to 1503 (manufactured by Zeon Corporation) so that the solid content becomes 20 wt%, the water-dispersed adhesive resin liquid is applied to an ink jet drawing system Union Corporation 4
200 (manufactured by Union Corporation), ELP-IIX (manufactured by Fuji Photo Film Co., Ltd.), a paper having a support laminated with polyethylene as a lithographic printing plate. On the back side, 3 mm / dot, a film thickness of 1 μm and a coating of 50% of the plate cylinder surface area were applied so as to be evenly arranged, and dried with a lamp heater (100 ° C.) for 3 minutes to provide a target adhesive layer. The physical properties of the adhesive layer were measured in the same manner as in Example 1. Table 5 shows the results.

Next, a lithographic printing machine, HAMADA 611X
The plate material was automatically supplied by LA-II (manufactured by Hamada Printing Machine Co., Ltd.), and 5,000 sheets were printed at a printing speed of 7000 sheets per minute.

Example 10 Nippol SX of latex containing NBR resin as a main component
After water was added to -1503 (manufactured by Zeon Corporation) so that the solid content became 20 wt%, planographic printing was performed using a gravure printing machine having a hemispherical recess with a radius of 1.0 mm on a 5 mm thick silicon rubber plate. As a plate, ELP-IIX (manufactured by Fuji Photo Film Co., Ltd.), which is a paper laminated with polyethylene as a plate, was made insensitive by making a plate using an ELP415VX plate making machine, and the above-mentioned adhesive was applied to the back surface of the plate material on the back side. Printing was performed so that 3 mm / dot and a film thickness of 1.2 μm were uniformly arranged at 50%, and dried with a lamp heater (100 ° C.) for 3 minutes to provide a target adhesive layer. Example 1 of the physical properties of the adhesive layer
It measured similarly to. Table 5 shows the results.

Next, a lithographic printing press HAMADA 61
The above-mentioned plate material is automatically fed by 1XLA-II (manufactured by Hamada Printing Machine Co., Ltd.) and the printing speed is 500 at a printing speed of 7000 sheets per minute.
0 sheets were printed.

[0103]

[Table 5]

When the pressure-sensitive adhesive layers obtained in Examples 5 to 10 were evaluated in the same manner as in Example 1, the dimensional stability and the printing workability were all good.

[0105]

As described above, according to the present invention, the dimensional stability and printing workability of a plate material in a lithographic printing press can be improved.

 ────────────────────────────────────────────────── ─── Continued on the front page F term (reference) 2H025 AA12 AA14 AB03 AB20 AD01 AD03 BJ10 DA20 DA35 DA40 FA39 2H096 AA06 AA30 CA20 LA30

Claims (1)

[Claims] 1. A lithographic printing plate precursor comprising at least an image-receiving layer provided on a water-resistant support, wherein the back side of the lithographic printing plate has a static friction coefficient of 0.2 or more and an adhesive force of 2-1.
50 kgf / cm ² and 180 ° peel force of 40 gf / cm ²
A lithographic printing plate precursor, comprising an adhesive layer having a thickness of less than 1 cm, wherein the adhesive layer is in close contact with a plate cylinder of a lithographic printing machine during printing.