JP2002151931A - Built-in antenna for mobile phone - Google Patents

Built-in antenna for mobile phone

Info

Publication number
JP2002151931A
JP2002151931A JP2000347453A JP2000347453A JP2002151931A JP 2002151931 A JP2002151931 A JP 2002151931A JP 2000347453 A JP2000347453 A JP 2000347453A JP 2000347453 A JP2000347453 A JP 2000347453A JP 2002151931 A JP2002151931 A JP 2002151931A
Authority
JP
Japan
Prior art keywords
resin
antenna
built
mobile phone
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000347453A
Other languages
Japanese (ja)
Inventor
Shinichi Takaba
進一 高場
Hisafumi Tate
尚史 楯
Shinichiro Suzuki
伸一郎 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP2000347453A priority Critical patent/JP2002151931A/en
Publication of JP2002151931A publication Critical patent/JP2002151931A/en
Withdrawn legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a built-in antenna for mobile phones, which can easily be mass-produced, realize a desired shape of a curved face and attain high reliability in the electric connection to a printed circuit board. SOLUTION: The built-in antenna for mobile phones is characterized in that resin onto which metallic plating is hardly formed (hardly platable resin) and resin onto which metallic plating is easily formed (easily platable resin) are injection molded in two stages to obtain a composite mold, the composite mold has a radiation element part formed by the easily platable resin and a contact part that electrically interconnects the radiation element part and other conductive members in the mobile phone, and a conductive metallic layer is formed on the surface of the radiation element part and the contact part by electroless plating.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、射出成形によって
製造される携帯電話用内蔵アンテナに関し、特に、プリ
ント基板等との電気的接続が高い信頼度をもって達成さ
れる携帯電話用アンテナに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a built-in antenna for a mobile phone manufactured by injection molding, and more particularly to an antenna for a mobile phone capable of achieving highly reliable electrical connection with a printed circuit board or the like. .

【0002】[0002]

【従来の技術】従来、携帯電話用内蔵アンテナは、一般
的に、銅板を所定形状に打ち抜いたアンテナプレートを
プラスチック成形品に張り合わせた構造のものが採用さ
れてきている。携帯電話市場が増加する一方で、銅板の
打ち抜きによるアンテナプレートを採用することは、プ
ラスチック成形品に打ち抜きアンテナプレートを固定す
るための曲げ加工等の工程が必要であり、製造能率の点
で問題がある。また、携帯電話に求められるデザイン性
や三次元性への設計の自由度が制限され、更に、携帯電
話内の他の配線との電気的接続においても接続接点を合
わせ込むのに時間を要するという問題がある。
2. Description of the Related Art Conventionally, as a built-in antenna for a portable telephone, an antenna having a structure in which an antenna plate obtained by punching a copper plate into a predetermined shape is bonded to a plastic molded product has been generally employed. While the mobile phone market is increasing, adopting an antenna plate by punching a copper plate requires a process such as bending to fix the antenna plate to a plastic molded product, which poses a problem in terms of manufacturing efficiency. is there. In addition, the degree of freedom in design and three-dimensional design required for mobile phones is limited, and it takes time to match the connection contacts in electrical connection with other wiring in the mobile phone. There's a problem.

【0003】銅板打ち抜きアンテナプレートを採用した
携帯用内蔵アンテナが有する問題点を解決するために、
図4(断面説明図)及び図5(平面説明図)に示すよう
な構造のものが提案されている。10は複合成形品であ
り、金属めっきが形成され難い樹脂(難めっき性樹脂)
を射出成形した第一の成形品11と、金属めっきが形成
され易い樹脂(易めっき性樹脂)を射出成形した第二の
成形品12からなると共に、スルーホール13が設けら
れている。この複合成形品10に無電解めっきを施すこ
とにより、第二の成形品12の表面及びスルーホール1
3にそれぞれ導電金属層14及び15が形成される。導
電金属層14は、放射素子として作用するもので、この
放射素子は導電金属層15を介してプリント基板16と
電気的に接続されるようになっている。
In order to solve the problems of a portable built-in antenna employing a copper plate punched antenna plate,
A structure as shown in FIG. 4 (explanatory view in section) and FIG. 5 (explanatory view in plan) has been proposed. Reference numeral 10 denotes a composite molded product, a resin on which metal plating is difficult to be formed (resin-resistant resin).
And a second molded product 12 obtained by injection-molding a resin (easy plating resin) on which metal plating is easily formed, and a through hole 13 is provided. By subjecting the composite molded article 10 to electroless plating, the surface of the second molded article 12 and the through hole 1 are formed.
3 are formed with conductive metal layers 14 and 15, respectively. The conductive metal layer 14 functions as a radiating element, and the radiating element is electrically connected to a printed board 16 via the conductive metal layer 15.

【0004】[0004]

【発明が解決しようとする課題】このような二段階射出
成形によるアンテナは、製造能率に優れ、また、曲面型
等の三次元形状を容易に実現できる反面、アンテナ全体
がプラスチック成形品により構成されるため、長期間の
使用により、スルーホールを介してのプリント基板との
電気的接続の信頼性が懸念される。
Such an antenna formed by two-stage injection molding is excellent in manufacturing efficiency and can easily realize a three-dimensional shape such as a curved surface type, but the entire antenna is formed of a plastic molded product. Therefore, there is a concern about the reliability of the electrical connection with the printed circuit board via the through-holes due to long-term use.

【0005】そこで、本発明の目的は、大量生産が容易
で、所望の曲面形状を実現でき、しかもプリント基板へ
の電気的接続において高い信頼性を達成できる携帯電話
用内蔵アンテナの提供を目的とするものである。
SUMMARY OF THE INVENTION An object of the present invention is to provide a built-in antenna for a portable telephone which can be easily mass-produced, can realize a desired curved shape, and can achieve high reliability in electrical connection to a printed circuit board. Is what you do.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に本発明は、金属めっきが形成され難い樹脂(難めっき
性樹脂)と、金属めっきが形成され易い樹脂(易めっき
性樹脂)を二段階射出成形して複合成形品を得、当該複
合成形品は、易めっき性樹脂でもって成形された放射素
子部分及び放射素子部分と携帯電話内の他の導電部材と
を電気的に接続するコンタクト部分を有しており、これ
ら放射素子部分及びコンタクト部分の表面には無電解め
っきにより導電金属層が形成されている携帯電話用内蔵
アンテナを提供する。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention relates to a resin that is difficult to form metal plating (resin-hard resin) and a resin that is easy to form metal plating (easy-to-plate resin). A step injection molding is performed to obtain a composite molded product, and the composite molded product is a radiating element portion molded with an easily-plated resin, and a contact for electrically connecting the radiating element portion to another conductive member in the mobile phone. The present invention provides a built-in antenna for a mobile phone, comprising a conductive metal layer formed by electroless plating on the surfaces of the radiating element portion and the contact portion.

【0007】[0007]

【発明の実施の形態】本発明において、難めっき性樹脂
としては、液晶ポリエステル、ポリフェニレンサルファ
イド、ポリエーテルエーテルケトン、ポリエーテルイミ
ド、ポリスルホン、ポリエーテルスルホン、シンジオク
タチックポリスチレンから選ばれる樹脂が挙げられる。
携帯電話用内蔵アンテナ用途には、低誘電率、低誘電正
接で、優れた機械的特性を有し、且つ軽量であるシンジ
オクタチックポリスチレンが最適である。
BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, examples of difficult-to-plate resins include resins selected from liquid crystal polyester, polyphenylene sulfide, polyetheretherketone, polyetherimide, polysulfone, polyethersulfone, and syndioctatic polystyrene. .
For use in a built-in antenna for a mobile phone, syndioctatic polystyrene, which has a low dielectric constant, a low dielectric loss tangent, excellent mechanical properties, and is lightweight, is most suitable.

【0008】易めっき性樹脂としては、上記難めっき性
樹脂と同様の樹脂に無電解めっき用触媒を充填したもの
が挙げられる。無電解めっき用触媒の代表例としては、
粉末珪酸アルミニウムにパラジウムを吸着させたものを
挙げることができる。
[0008] Examples of the easily-platable resin include those obtained by filling a resin similar to the above-mentioned hard-to-plate resin with a catalyst for electroless plating. Representative examples of electroless plating catalysts include:
One obtained by adsorbing palladium on powdered aluminum silicate can be used.

【0009】二段階射出成形により複合成形品を得る場
合においては、難めっき性樹脂と易めっき性樹脂のどち
らを一次成形品としても良いが、一次成形品を金型上に
保持し、二次成形用樹脂を射出成形する。
When a composite molded product is obtained by two-stage injection molding, either the hard-to-plate resin or the easily-plated resin may be used as the primary molded product. However, the primary molded product is held on a mold and The molding resin is injection molded.

【0010】本発明においては、電気的接触の長期安定
性の観点からコンタクト部分は弾力性が大きくバネ性に
富んだものであることが好ましい。樹脂中に補強材とし
てのガラスファイバを含ませると弾力性が低下するた
め、易めっき性樹脂はガラスファイバを含有しない樹脂
であることが好ましい。ガラスファイバを含有しなくと
も十分な機械的強度を実現できる樹脂としては、シンジ
オクタチックポリスチレン、液晶ポリエステル、ポリエ
ーテルスルホンといったものを挙げることができる。
In the present invention, from the viewpoint of long-term stability of electrical contact, it is preferable that the contact portion has a high elasticity and a high spring property. If glass fiber as a reinforcing material is included in the resin, the elasticity is reduced. Therefore, the easily-platable resin is preferably a resin containing no glass fiber. Examples of resins that can achieve sufficient mechanical strength without containing glass fibers include syndiotactic polystyrene, liquid crystal polyester, and polyether sulfone.

【0011】図1乃至図3を参照して本発明の一実施の
形態を説明する。図1は、上側から見た斜視説明図、図
2は下側から見た斜視説明図、図3は図1のA−B線断
面説明図である。1は複合成形品で、難めっき性樹脂を
射出成形した第一の成形品2と、易めっき性樹脂を射出
成形した第二の成形品3からなっている。第二の成形品
3は、放射素子部分4とコンタクト部分5を有してお
り、放射素子部分4の表面には無電解めっきにより導電
金属層6が形成され、コンタクト部分5の表面には無電
解めっきにより導電金属層7が形成されている。導電金
属層7は、先端に折り曲げ部8が形成されることにより
プリント基板Pとの面接触が確保されている。9は、一
次成形品2により形成された枠体であり、放射素子部分
9の周縁に設けられることにより、アンテナ全体の機械
的強度を維持している。コンタクト部分5は、枠体9の
切欠き部分に枠体9と並行して形成されている。
An embodiment of the present invention will be described with reference to FIGS. 1 is an explanatory perspective view seen from above, FIG. 2 is an explanatory perspective view seen from below, and FIG. 3 is an explanatory sectional view taken along line AB in FIG. Reference numeral 1 denotes a composite molded product, which is composed of a first molded product 2 obtained by injection-molding a hard-to-plate resin, and a second molded product 3 obtained by injection-molding an easily-plateable resin. The second molded article 3 has a radiating element part 4 and a contact part 5, a conductive metal layer 6 is formed on the surface of the radiating element part 4 by electroless plating, and a non-conductive metal layer 6 is formed on the surface of the contact part 5. The conductive metal layer 7 is formed by electrolytic plating. The conductive metal layer 7 has a bent portion 8 formed at the tip to ensure surface contact with the printed circuit board P. Reference numeral 9 denotes a frame formed by the primary molded product 2, which is provided on the periphery of the radiating element portion 9 to maintain the mechanical strength of the entire antenna. The contact portion 5 is formed in a cutout portion of the frame 9 in parallel with the frame 9.

【0012】このように、アンテナの放射素子となる導
電金属層6は、コンタクト部分5の導電金属層7を介し
てプリント基板Pと電気的に接続されることで、長期間
にわたって安定した電気的接触が達成される。
As described above, the conductive metal layer 6 serving as the radiating element of the antenna is electrically connected to the printed circuit board P via the conductive metal layer 7 of the contact portion 5, thereby providing a stable electrical connection for a long period of time. Contact is achieved.

【0013】[0013]

【発明の効果】以上説明してきた通り、本発明によれ
ば、大量生産が容易で、所望の曲面形状を実現でき、し
かもプリント基板への電気的接続において高い信頼性を
達成できる携帯電話用内蔵アンテナが実現される。
As described above, according to the present invention, a built-in portable telephone which can be easily mass-produced, can realize a desired curved surface shape, and can achieve high reliability in electrical connection to a printed circuit board. An antenna is realized.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の携帯電話用内蔵アンテナの一実施の形
態の上側から見た斜視説明図である。
FIG. 1 is a perspective explanatory view of an embodiment of a built-in antenna for a mobile phone according to the present invention as viewed from above.

【図2】本発明の携帯電話用内蔵アンテナの一実施の形
態の下側から見た斜視説明図である。
FIG. 2 is an explanatory perspective view seen from below of the embodiment of the mobile phone built-in antenna of the present invention.

【図3】図1のA−B線断面説明図である。FIG. 3 is an explanatory sectional view taken along line AB in FIG. 1;

【図4】従来の携帯電話用内蔵アンテナの断面説明図で
ある。
FIG. 4 is a sectional explanatory view of a conventional built-in antenna for a mobile phone.

【図5】従来の携帯電話用内蔵アンテナの平面説明図で
ある。
FIG. 5 is an explanatory plan view of a conventional built-in antenna for a mobile phone.

【符号の説明】[Explanation of symbols]

1 複合成形品 2 第一の成形品 3 第二の成形品 4 放射素子部分 5 コンタクト部分 6、7 導電金属層 8 折り曲げ部 9 枠体 P プリント基板 REFERENCE SIGNS LIST 1 composite molded product 2 first molded product 3 second molded product 4 radiating element portion 5 contact portion 6, 7 conductive metal layer 8 bent portion 9 frame P printed circuit board

───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 伸一郎 茨城県日立市日高町5丁目1番1号 日立 電線株式会社日高工場内 Fターム(参考) 5J046 AA05 AA09 AA19 AB13 PA07 5J047 AA05 AA09 AA19 AB13 FD01 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Shinichiro Suzuki 5-1-1, Hidaka-cho, Hitachi City, Ibaraki Prefecture F-term in the Hidaka Plant of Hitachi Cable, Ltd. (reference) 5J046 AA05 AA09 AA19 AB13 PA07 5J047 AA05 AA09 AA19 AB13 FD01

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】金属めっきが形成され難い樹脂(難めっき
性樹脂)と、金属めっきが形成され易い樹脂(易めっき
性樹脂)を二段階射出成形して複合成形品を得、当該複
合成形品は、易めっき性樹脂でもって成形された放射素
子部分及び放射素子部分と携帯電話内の他の導電部材と
を電気的に接続するコンタクト部分を有しており、これ
ら放射素子部分及びコンタクト部分の表面には無電解め
っきにより導電金属層が形成されていることを特徴とす
る携帯電話用内蔵アンテナ。
1. A composite molded product is obtained by two-stage injection molding of a resin on which metal plating is not easily formed (hard-plating resin) and a resin on which metal plating is easily formed (easy-plating resin). Has a radiating element portion molded with an easily-plated resin, and a contact portion for electrically connecting the radiating element portion to another conductive member in the mobile phone. A built-in antenna for a mobile phone, wherein a conductive metal layer is formed on the surface by electroless plating.
【請求項2】前記コンタクト部を形成する易めっき性樹
脂からなる成形品は、前記金属パターンを形成する易め
っき性樹脂からなる成形品と一体成形されている請求項
1記載の携帯電話用内蔵アンテナ。
2. The built-in cell phone according to claim 1, wherein the molded product made of the easily-plated resin forming the contact portion is integrally formed with the molded product made of the easily-plated resin forming the metal pattern. antenna.
【請求項3】前記難めっき性樹脂及び前記易めっき性樹
脂は共にシンジオクタチックポリスチレンを主体とした
組成物である請求項1記載の携帯電話用内蔵アンテナ。
3. The built-in antenna for a mobile phone according to claim 1, wherein said hard-to-plate resin and said easy-to-plate resin are both compositions mainly composed of syndioctatic polystyrene.
【請求項4】前記易めっき性樹脂はガラスファイバを含
有していない組成物である請求項1記載の携帯電話用内
蔵アンテナ。
4. The built-in antenna for a mobile phone according to claim 1, wherein said easily-platable resin is a composition containing no glass fiber.
【請求項5】前記複合成形品は前記難めっき性樹脂でも
って枠体が形成され、前記枠体の切欠き部分に前記コン
ンタクト部分が形成されている請求項1記載の携帯電話
用内蔵アンテナ。
5. The built-in antenna for a cellular phone according to claim 1, wherein said composite molded article has a frame formed of said hard-to-plate resin, and said contact portion is formed in a cutout portion of said frame.
JP2000347453A 2000-11-09 2000-11-09 Built-in antenna for mobile phone Withdrawn JP2002151931A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000347453A JP2002151931A (en) 2000-11-09 2000-11-09 Built-in antenna for mobile phone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000347453A JP2002151931A (en) 2000-11-09 2000-11-09 Built-in antenna for mobile phone

Publications (1)

Publication Number Publication Date
JP2002151931A true JP2002151931A (en) 2002-05-24

Family

ID=18821178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000347453A Withdrawn JP2002151931A (en) 2000-11-09 2000-11-09 Built-in antenna for mobile phone

Country Status (1)

Country Link
JP (1) JP2002151931A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101131572B1 (en) * 2009-04-17 2012-03-30 주식회사 이랜텍 A plating method for pattern of antenna
WO2014148102A1 (en) * 2013-03-21 2014-09-25 シャープ株式会社 Structural body and wireless communication apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101131572B1 (en) * 2009-04-17 2012-03-30 주식회사 이랜텍 A plating method for pattern of antenna
WO2014148102A1 (en) * 2013-03-21 2014-09-25 シャープ株式会社 Structural body and wireless communication apparatus
JP2014187433A (en) * 2013-03-21 2014-10-02 Sharp Corp Structure and radio communication device

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20080205