JP2002151641A - Electronic component module device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component module device of a structure that a mounting of an external component on a module is enabled to utilize lead terminals led out from the sealing part of the module to the outside, the reliability of the connection parts of high-current components is ensured to enable to contrive the stabilization of the quality of the components without exerting any effect on the module, and furthermore, a miniaturization of the device is enabled to link the miniaturization to a reduction in the cost of the device. SOLUTION: An electronic component module device is formed in a constitution that mounting parts 23a, 23b, 24a, 24b, 25a and 25b of an external component are respectively provided on some of a plurality of lead terminals 22a to 22i led out from a sealing part 20 of a module 8 to the outside.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module in which a lead frame on which an electronic component is mounted is sealed in a sealing portion made of resin. The present invention relates to an electronic component module device to which components can be attached.

[0002]

2. Description of the Related Art Conventionally, in the implementation of circuits using high power, large current, and high voltage such as inverters and switch power supplies, as a general means, mounting using electric wires using screws and crimp terminals or printing has been performed. Mounting on a printed circuit board having a sufficient pattern width is widely used and widely used. In recent years, further miniaturization, reduction in man-hours, and cost reduction have been demanded, and IPM (Intelligent
For example, a module such as a power module, or a configuration that can be used as a molded substrate so that another electronic component is mounted on the upper surface has been considered.

[0003]

However, a chip such as a semiconductor can be buried in a modularized sealing portion. However, a large component such as a film capacitor must be provided as an external component in the sealing portion. However, there are many issues such as the problem of temperature rise and unexpectedly large volume, and it is practical to struggle with securing the junction temperature and the necessary insulation distance between components in modularized electronic components. Absent. In addition, even if a molded substrate is used, it is inevitable that the size will increase and a reduction in cost cannot be expected. Furthermore, when a normal printed circuit board is used, the reliability of the soldered connection of a large current component is ensured. Not only is it difficult to increase the size of the conductive pattern, but the size of the substrate is increased to increase the width of the conductive pattern.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to make it possible to mount external components by using lead terminals led out of a sealing portion of a module, thereby realizing an original module. Without affecting anything
In addition, the use of a molded or printed circuit board prevents size increase and cost increase, as well as secures the reliability of the connection of high-current components and stabilizes the quality. An object of the present invention is to provide an electronic component module device which leads to reduction.

[0005]

In order to achieve the above object, a module device for an electronic component according to the present invention includes a module sealed in a resin sealing portion together with an electronic component mounted on a lead frame. A plurality of lead terminals led out of the sealing portion of the module are provided with attachment portions for external components (the invention of claim 1).

According to such a configuration, external components can be mounted by effectively utilizing the lead terminals led out of the sealing portion without affecting the original modularization at all.
The connection of high-current components by soldering can be ensured, so that large currents do not flow as in the case of direct mounting on a printed circuit board, and there is no fear that a large conductor pattern is required to increase the size of the circuit board. Therefore, it can be advantageously provided in terms of cost, for example, it can be made compact and simple as a whole.

According to the first aspect of the present invention, a portion of the lead terminal having a mounting portion for an external component is bent to form a bent piece, and a printed circuit board is bonded to the bent piece and incorporated. (Invention of claim 2).

According to such a configuration, the bent pieces can be bonded and stably arranged on the printed board, and when the printed board is soldered to the module or the external component from this state, for example, the back side of the board is removed. By immersing in a solder bath, these can be soldered at the same time, and the work is easy by automatic soldering, and the connection is stable and reliable, and sufficient strength can be obtained.

According to a second aspect of the present invention, a heat radiating member is provided on the side surface of the sealing portion of the module opposite to the direction in which the lead terminals are bent (the invention of the third aspect).

According to such a configuration, a heat radiating member of a desired size can be provided, and the heat radiating effect of the heat-generating electronic components can be enhanced, and the insulation distance between the components and the junction temperature can be reduced. It can also be used advantageously.

According to the first aspect of the present invention, one of the lead terminals having a mounting portion for an external component is connected to a signal detection pattern formed on a printed circuit board. 4 invention).

According to such a configuration, it is possible to easily detect the voltage between the terminals of the external parts, and to ensure the characteristic check, thereby ensuring the reliability of the quality.

According to the first aspect of the present invention, an eyelet-shaped insertion opening is formed as a mounting portion for the lead terminal, and an external component is inserted into the insertion opening and then soldered. (The invention of claim 5).

According to such a configuration, the insertion opening is formed in an eyelet shape, which is effective for suppressing the inserted external component from falling down and holding the same, and also allows the solder to be sufficiently filled and the connection portion to be formed. Soldering that can improve strength and increase reliability can be performed.

According to a second aspect of the present invention, the ends of a plurality of lead terminals having attachment portions for external components among the lead terminals are integrally molded with resin (the invention of claim 6). .

According to such a configuration, the free ends of the lead terminals led out from the sealing portion can be bundled and organized neatly, so that the safety and handling at the time of assembling work into a device or at the time of transportation are improved. In addition, it can be formed simultaneously with the molding of the sealing portion, and can be efficiently molded.

Further, according to the second aspect of the present invention, in the bent piece having a mounting portion for an external component among the lead terminals, a gap is formed between the lead terminal and a printed board, and the printed board is formed in the gap. Wherein a component to be mounted is disposed on the second surface (the invention of claim 7).

According to such a configuration, the components can be mounted on the printed board on the lower surface side of the bent piece of the lead terminal, so that the area of the board can be effectively used, the size can be suppressed, and the cost can be reduced.

According to a seventh aspect of the present invention, an insulating member is attached to the bent piece of the corresponding lead terminal corresponding to a component mounted on the printed circuit board arranged in the gap. The invention of claim 8).

According to this configuration, in addition to having the same effect as the above-mentioned invention, it is possible to mount components that require reliable insulation measures without enlarging the gap portion, thereby increasing the size. Can be suppressed.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment in which the electronic component module device of the present invention is applied to a microwave oven will be described below with reference to FIGS. 1 is a perspective view showing the entire configuration of the module device 1, FIG. 2 is a side view showing the module device 1 partially cut away, and FIG. 3 shows a power supply circuit for inverter-controlling a microwave oven (not shown). First, the circuit configuration of the microwave oven will be briefly described with reference to FIG. 3. The microwave oven is a magnetron tube via an inverter power supply circuit 3 which is also an inverter unit surrounded by a two-dot chain line. 4 is configured to supply a high voltage.

A specific description will be given below.
Rectifiers 5a, 5b, 5c, and 5d as electronic components for converting AC power into DC through a choke coil 6, and a switching element for converting DC into high frequency, here, a semiconductor element IGBT (Insulated Bip)
ola Transistors) 5e and 5f, and flywheel diodes 5g and 5h, which are enclosed by a dashed line in FIG. Its operation is controlled.

The module 8 indicated by the dashed line
(Outside the module 8)
In addition to the choke coil 6 described above, a smoothing capacitor 9 composed of a film capacitor, a resonance capacitor 1
0, 11; a high-voltage transformer 12 for boosting; and high-voltage capacitors 13, 14 and high-voltage diodes 15, 16 on the secondary coil side of the transformer 12, and these two-dot chain lines including these external components are provided. The range indicated by is the inverter power supply circuit 3 constituting the inverter unit.

Therefore, such an inverter power supply circuit 3
When an AC power supply is applied from the AC input power supply 2, a high voltage is supplied to the magnetron 4 which is a microwave oscillation tube. Thus, in a microwave oven (not shown), when the magnetron 4 is energized and driven, microwaves are irradiated into the cooking chamber, and the food to be cooked is cooked by high-frequency heating.

On the other hand, in the configuration of the module device 1 shown in FIG. 1, the same parts as those of the circuit components in FIG. In this embodiment, which has a heat dissipating member 17 and is further applied to a microwave oven, the module 8
And a printed circuit board 19 on which external components including the choke coil 6, the inverter control circuit 7, and the like (both not shown) are mounted.

First, the configuration of the module 8 will be described. The module 8 is made up of a rectangular plate-shaped sealing portion 20 made of epoxy resin and formed inside by molding. 5a to 5d (FIG. 1)
, And semiconductor components such as IGBTs 5e and 5f and flywheel diodes 5g and 5h are mounted, and circuit components including a lead frame 22 connected at a plurality of locations by bonding wires 21 are embedded and so-called resin-sealed. It is in. The lead frame 22 is initially formed by stamping out a single copper plate by press working, is separated according to a circuit configuration having electronic components and the like after the above-described resin sealing, and is externally provided from the sealing portion 20 respectively. In this embodiment, the derived leads are nine lead terminals 2.
2a to 22i.

These lead terminals 22a to 22i are shown in FIG.
In the figure, the module 8 also serves as a connection terminal between the module 8 and the external components such as the choke coil 6 and the smoothing capacitor 9 and the printed circuit board 19 (indicated by a symbol "〇" in the figure). They are indicated by the same reference numerals as shown by the broken line frame. As shown in FIG. 3 and FIG. 1, one of the lead terminals 22a to 22i is led out from the sealing portion 20 in one lead terminal 22f in the present embodiment. Is separated from the internal lead frame 22 and the bonding wire 21, and is connected to the resonance capacitors 10, 11 and the like at the other end.

However, as apparent from FIGS. 3 and 1, among the lead terminals 22a to 22i, in the present embodiment, three lead terminals 22c, 22f, and 22h are used for mounting external parts. Is formed. That is, the resonance capacitors 10 and 11 described above as external components
The lead terminals 22c, 22f and 22h are bent in a direction substantially perpendicular to the direction derived from the sealing portion 20 as shown in FIG. 1 or FIG. 2 so that the smoothing capacitor 9 can be directly mounted. Thus, bent pieces 23, 24 and 25 are formed respectively.

FIG. 1 shows a mode in which the smoothing capacitor 9 is mounted, and the lead terminal 22c is shown in FIG.
Through hole 23a as a mounting portion to bend piece 23
And between the lead terminal 22h and the insertion opening 25a of the bent piece 25, and then soldered and fixed. Therefore, the other external components are mounted in the same configuration as described above.
Are the insertion opening 24b of the bent piece 24 and the insertion opening 25 of the bent piece 25
b, and the other resonance capacitor 11 has an insertion opening 23b for the bent piece 23 and an insertion opening 24a for the bent piece 24.
And soldered respectively. The above-described soldering of the module 8 and the external components is performed in a state where the module 8 and the external components are incorporated in the printed circuit board 19, and details thereof will be described later.

On the other hand, the lead terminals 22a, 22b, 22d, 22e, 22g and 22i on which the above-mentioned external components are not mounted are arranged downward in a state of being suspended from the sealing portion 20 as shown in FIGS. It is inserted into a mounting hole 19b of a circuit pattern (not shown) of the printed circuit board 19 to be provided, and is connected by soldering. The printed circuit board 19 includes a high-voltage transformer 12, high-voltage capacitors 13 and 14, and high-voltage diodes 15 and 1 (not shown).
6, the choke coil 6, the inverter control circuit 7, etc.
(Inverter unit).

In this embodiment, as shown in FIGS. 1 and 2, a desired lead terminal 22f is provided with a signal detecting end 26 by further extending the bent piece 24 thereof. The detection end 26 is soldered to the signal detection pattern 19a (see FIGS. 2 and 3) via the mounting hole 19c of the printed circuit board 19 and connected to the inverter control circuit 7.

The soldering of the printed circuit board 19 and the like will be described in detail with reference to FIG.
As for a, 22b, 22d, 22e, 22g, and 22i, the tips are inserted into the mounting holes 19b of the printed circuit board 19 while being suspended from the sealing portion 20 as described above. Then, lead terminals 22c and 2 for attaching external parts are provided.
2f, 22h, the bent pieces 23, 2
4 and 25 are arranged in a state of being joined to the plate surface of the printed circuit board 19, and each of the insertion ports 23a, 23b, 24a, 24b,
25a and 25b include a smoothing capacitor 8 as an external component,
Terminal portions of the resonance capacitors 10 and 11 are inserted facing through holes 19d of the printed circuit board 19 on the lower surface.

Further, in the lead terminal 22f, the extended signal detecting end 26 is inserted into the mounting hole 19c, and is temporarily held in this state. Therefore, while the module 8 and the printed circuit board 19 are held in the assembled state as described above, the lower surface is moved so as to be immersed in a not-shown jet-type solder bath, so that the solder is subjected to surface tension. Each mounting hole 19b, 19c of the printed circuit board 19
And also penetrates into the through hole 19d, so that soldering is performed as partially shown in FIG.

At both ends of the sealing portion 20, mounting insertion holes (not shown) are formed, and the heat radiating member 17 closely attached to one side surface of the sealing portion 20 is screwed. Has been attached. This is because, especially in an apparatus that converts power such as an inverter power supply, electronic components that generate heat are often used, and rectifiers 5a to 5d as resin-sealed electronic components are also used in this embodiment. IGBT5e, 5
f and the semiconductor components such as the flywheel diodes 5g and 5h all generate heat. In general, when such a semiconductor component is used, care is taken to keep its junction temperature at about 150 ° C. or lower, and components that generate heat are arranged as far apart as possible.

Further, as described above, the heat dissipating member 17 is usually provided with a large number of heat dissipating fins 1 in order to enhance the heat dissipating effect.
8, a material having a large surface area and having good thermal conductivity is adopted. Thus, the inverter unit 3 in which the module 8 to which such a heat radiating member 17 is attached and the printed circuit board 19 are incorporated.
Module device 1 equipped with (inverter power supply circuit)
Is installed inside the body of a microwave oven (not shown).

As described above, according to the present embodiment, in the module 8 sealed in the resin sealing portion 20 together with the electronic components such as the IGBTs 5e and 5f mounted on the lead frame 22, Some of the plurality of lead terminals 22a to 22i led out are used for attaching external components. In this embodiment, external components are attached to three lead terminals 22c, 22f, and 22h. Openings 23a, 23b, 24a, 24 serving as mounting portions for
b, 25a and 25b are provided respectively.

As a result, the smoothing capacitor 9, the resonance capacitors 10, 11 and the like can be effectively used by effectively using the lead terminals 22c, 22f, 22h led out of the sealing portion 20 without affecting the original module 8. External components can be mounted, and the connection by soldering of high-current components can be ensured. The external components, for example, the choke coil 6 are heat-generating components, whereas the smoothing capacitor 9 is usually a film capacitor having low heat resistance, but each of the lead terminals 22 has sufficient space.
Since it can be mounted on c, 22f, and 22h, thermal quality can be advantageously treated and used stably. In addition, since it is not mounted directly on the printed circuit board and a large current does not flow,
For example, there is no fear that the size of the substrate is increased due to the need for a wide conductive pattern.

Further, among the lead terminals 22a to 22i, the lead terminals 22a, 22a to be soldered to the printed circuit board 19 having the inverter control circuit 7, the high voltage transformer 12, and the like to constitute the inverter power supply circuit 3 shown in FIG.
b, 22d, 22e, 22g and 22i are drawn out of the sealing portion 20 of the module 8 in the hanging direction,
In contrast to the configuration in which the lead terminals 22c, 22f, and 22h for mounting external components such as the smoothing capacitor 9 are inserted into the mounting holes 19b of the printed circuit board 19, the lead terminals 22c, 22f, and 22h are drawn out of the sealing portion 20 in the direction in which they are drawn. To form bent pieces 23, 24, 25 bent substantially at right angles to the bent pieces 23, 24, 25.
24 and 25 were joined to the board surface of the printed circuit board 19 and incorporated.

Thus, the module 8 can be stably arranged on the printed circuit board 19 via the bent pieces 23, 24, 25, and the external components mounted on the upper surfaces of the bent pieces 23, 24, 25 are also sealed. Since the module device 1 is provided side by side, the module device 1 can be made compact as a whole without inadvertently projecting. When the module 8 and the printed board 19 are soldered, the back surface of the board 19 is immersed in a jet-type solder bath (not shown), and the soldering process is easy without disturbing the sealing portion 20. Can be.

Incidentally, in the case of the present embodiment, specifically, the lead terminals 22a, 22b, 22d, 2
2e, 22g, 22i and the printed circuit board 19, and the insertion ports 23a, 23b, 24a, 24b, 25 serving as attachment portions of the lead terminals 22c, 22f, 22h.
By moving the soldering of the smoothing capacitor 9 and the resonance capacitors 10 and 11, which are the external components having the terminals inserted into the terminals 25a and 25b, by immersing the lower surface of the printed circuit board 19 in the solder bath as shown in FIG. Can be soldered simultaneously and automatically.

For example, in FIG.
2a and the printed circuit board 19, and the lead terminal 22f (bent piece 24) and the resonance capacitor 11, and furthermore, the signal detecting end 26 and the signal detecting pattern of the printed circuit board 19 which are simultaneously soldered. The connection portion soldered to 19a is shown broken. As described above, the automatic soldering operation can be easily performed, and since it is assembled in a joined state with each of the bent pieces 23, 24, and 25, the stability is good, and the quality of these connection portions is improved and the reliability is improved. Can be further enhanced.

On the other hand, a large heat radiating member 17 can be attached to the side surface of the sealing portion 20 opposite to the bending direction of the lead terminals 22c, 22f, 22h for attaching the external components without any hindrance. Thereby, an effective heat radiation effect of the module 8 can be expected, and the arrangement of the heat-generating electronic components in the sealing portion 20 at a distance and at the junction temperature can be advantageously developed.

Further, as shown in FIGS. 2 and 3, in this embodiment, the lead terminal 22f on which the resonance capacitor 11 as an external component is mounted extends to extend the signal detection end portion 2.
6 to provide the signal detection pattern 1 on the printed circuit board 19.
9a. According to such a configuration,
The voltage between the terminals of the resonance capacitor 11, which is an external component, can be easily detected, and the reliability of the quality can be secured by ensuring the characteristic check. In the case of the present embodiment, the inverter control circuit 7 is used as needed. It is also easy to take measures for detection and display.

4 to 7 show the second to fifth embodiments of the present invention. In the following, the same parts as those of the first embodiment are denoted by the same reference numerals, and the different parts will be described. Will be described only.

(Second Embodiment) FIG. 4 shows a second embodiment of the present invention, in which the connection strength by soldering of external parts is further improved from that of the first embodiment. is there. That is, FIG. 4 shows a part of the connection portion of the lead terminal 22c in which the external component is mounted in a cutaway manner, and is substantially the same as FIG. 2 of the first embodiment (in this case, the lead terminal 22f). Is equivalent to More specifically, as shown in FIG.
A protruding eyelet-shaped insertion port 28 is provided at the
Are incorporated so as to penetrate through holes 19d of the printed circuit board 19. In this case, the lead terminals 22f and 22h for mounting other external components are also formed as eyelet-shaped mounting portions as described above, and the description thereof is omitted.

Therefore, according to such a configuration, the eyelet-shaped insertion port 28 is provided for the through-hole-shaped mounting portion which is simply perforated as in the first embodiment, so that external components such as the resonance capacitor 11 can be formed. The terminal portion can be formed into a long hole shape which is advantageous for insertion and holding and which is hard to fall down, and is more firmly connected by the solder filled in the insertion port 28, and high quality soldering excellent in the connection strength can be expected, The reliability can be further improved.

(Third Embodiment) Next, a third embodiment of the present invention will be described.
A description will be given based on FIG. 5 (corresponding to FIG. 4) showing the embodiment.
FIG. 5 also shows only the lead terminal 22c, but together with the lead terminals 22f and 22h having other external components, a resin molded portion 2 having its tip integrally molded with resin.
9 is formed.

According to such a configuration, the so-called free ends of the lead terminals 22c, 22f, and 22h led out of the sealing portion 20 can be bundled in an orderly manner. The operation can be prevented from being troublesome, such as being hooked on other parts or a mechanical part, and may be deformed as a result, and as a whole, safety and handling are improved. Note that such a resin mold portion 29 is
Can be formed at the same time as the mold forming, so that it can be formed efficiently, and the position of the resin mold portion 29 is not limited to the present embodiment. For example, substantially the same effect can be expected even at the end near the front end. it can.

(Fourth Embodiment) FIG. 6 (corresponding to FIG. 4) showing a fourth embodiment of the present invention is a printed circuit board 1.
9 is used effectively, and in the illustrated example, the lead terminal 2 is used.
2c is a part in which the portion covering the printed circuit board 19 is improved so that it can be used for attaching other components. That is,
A bent portion 23 of the lead terminal 22c is bent so as to partly separate from a portion joined to the plate surface of the printed circuit board 19 to form a hollow void portion 30. The gap 30 can be formed in the other lead terminals 22f and 22h in the same manner as necessary. For example, a resistor or a diode may be formed in the gap 30 as another relatively small electronic component 31. And the like can be mounted by soldering.

Therefore, according to such a configuration, in each of the above embodiments, the lead terminals 22c, 22f, 2
Although a part of the printed circuit board 19 covered by the bent pieces 23, 24, and 25 of 2h could not be effectively used for mounting components, according to the present embodiment, by appropriately providing the void portion 30, This contributes to the attachment of the other electronic components 31, which is effective for reducing the area of the printed circuit board 19, and is also advantageous for reducing the cost while suppressing the increase in size.

(Fifth Embodiment) Next, FIG. 7 (corresponding to FIG. 4) showing a fifth embodiment of the present invention will be described.
This embodiment corresponds to a further improvement of the embodiment. In the illustrated example, the insulating member 32 is attached to the lead terminal 22c (bent piece 23) in which the gap 30 is formed.

Therefore, according to such a configuration, it is possible to mount the electronic component 31 to the other electronic components 31 which need to be insulated from the lead terminal 22c without forming the gap 30 large. It is also easy to form 30. The insulating member 32 may have a configuration in which, for example, a tubular member is fitted. However, in this embodiment, the insulating member 32 is formed by resin molding at the same time as the molding of the sealing portion 20, so that it can be easily and reliably formed.

It should be noted that the present invention is not limited to the above and shown in the drawings. For example, as an example of a module, an embodiment applied to an inverter power supply circuit of a microwave oven has been described. The present invention is not limited to this, and may be applied to, for example, a control circuit for driving a motor of a washing machine. You can do it.

[0054]

As is apparent from the above description, the present invention has a structure in which an external component is mounted by using some of a plurality of lead terminals led out from the sealing portion of the module. . According to such a configuration, an external component can be mounted by effectively using the lead terminal led out of the sealing portion, and the connection by soldering of the high-current component can be ensured. Therefore, there is no need to flow a large current or form a wide conductor pattern as in the case of mounting directly on a printed circuit board, so that there is no fear of increasing the size of the board and, of course, without affecting the original modularization at all. Therefore, it is possible to provide a module device of an electronic component which is advantageous in terms of cost, for example, it can be formed compact and simple as a whole including the circuit configuration.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part showing a first embodiment of the present invention.

FIG. 2 is a side view partially broken away.

FIG. 3 is a circuit configuration diagram showing an electrical connection state in a microwave oven.

FIG. 4 is a partially cutaway side view showing a second embodiment of the present invention.

FIG. 5 is a view corresponding to FIG. 4, showing a third embodiment of the present invention.

FIG. 6 is a view corresponding to FIG. 4, showing a fourth embodiment of the present invention;

FIG. 7 is a view corresponding to FIG. 4, showing a fifth embodiment of the present invention;

[Explanation of symbols]

1 is a module device, 3 is an inverter power supply circuit (inverter unit), 4 is a magnetron, 5a to 5d are rectifiers (electronic components), 5e and 5f are IGBTs (electronic components),
5g and 5h are flywheel diodes (electronic parts),
6 is a choke coil (external component), 7 is an inverter control circuit, 8 is a module, 9 is a smoothing capacitor (external component), 10 and 11 are resonance capacitors (external component), 12
Is a high-voltage transformer (external component), 13 and 14 are high-voltage capacitors (external components), 15 and 16 are high-voltage diodes (external components), 17 is a heat dissipating member, 19 is a printed circuit board, 20 is a sealing portion, and 22 is a lead frame. , 22a to 22i are lead terminals, 23, 24, 25 are bent pieces, 23a, 23b,
Reference numerals 24a, 24b, 25a, 25b, 28 denote insertion openings (mounting portions), 29 denotes a resin mold portion, 30 denotes a void portion, 31 denotes another electronic component, and 32 denotes an insulating member.

Claims (8)

[Claims] 1. A module sealed in a resin-made sealing portion together with an electronic component mounted on a lead frame, wherein a plurality of lead terminals led out of the sealing portion of the module are provided with mounting portions for external components. A module device for electronic components, wherein the module device is provided. 2. A structure in which a portion of the lead terminal having a mounting portion for an external component is bent to form a bent piece, and a printed circuit board is bonded to the bent piece and incorporated. An electronic component module device as described in the above. 3. The electronic component module device according to claim 2, wherein a heat radiating member is provided on a side surface of the sealing portion of the module opposite to the bending direction of the lead terminal. 4. The electronic component module device according to claim 1, wherein one of the lead terminals having a mounting portion for an external component is connected to a signal detection pattern formed on a printed circuit board. 5. The electronic component according to claim 1, wherein an eyelet-shaped insertion opening is formed as a mounting portion of the lead terminal, and an external component is inserted into the insertion opening and then soldered. Module equipment. 6. The electronic component module device according to claim 2, wherein the end portions of the plurality of lead terminals having attachment portions for external components among the lead terminals are integrally molded with resin. 7. A bent piece having a mounting portion for an external component in a lead terminal, wherein a gap is formed between the lead terminal and a printed board, and a component to be mounted on the printed board is arranged in the gap. The electronic device module device according to claim 2, wherein: 8. The electronic component module device according to claim 7, wherein an insulating member is attached to a bent piece of the corresponding lead terminal corresponding to a component mounted on the printed circuit board disposed in the gap. .