JP2002151254A - Manufacturing method of organic el element - Google Patents
Manufacturing method of organic el elementInfo
- Publication number
- JP2002151254A JP2002151254A JP2000342116A JP2000342116A JP2002151254A JP 2002151254 A JP2002151254 A JP 2002151254A JP 2000342116 A JP2000342116 A JP 2000342116A JP 2000342116 A JP2000342116 A JP 2000342116A JP 2002151254 A JP2002151254 A JP 2002151254A
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- organic
- electrode connection
- laminate
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 230000001681 protective effect Effects 0.000 claims abstract description 118
- 238000000034 method Methods 0.000 claims abstract description 83
- 239000012044 organic layer Substances 0.000 claims abstract description 27
- 238000012986 modification Methods 0.000 claims abstract description 7
- 230000004048 modification Effects 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 148
- 239000000463 material Substances 0.000 claims description 57
- 239000010410 layer Substances 0.000 claims description 28
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 21
- 239000010409 thin film Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 16
- 238000003877 atomic layer epitaxy Methods 0.000 claims description 13
- 230000000873 masking effect Effects 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims description 8
- 239000011368 organic material Substances 0.000 claims description 8
- 238000001259 photo etching Methods 0.000 claims description 8
- 239000005871 repellent Substances 0.000 claims description 5
- 230000036571 hydration Effects 0.000 claims 1
- 238000006703 hydration reaction Methods 0.000 claims 1
- 230000002940 repellent Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 21
- 239000002184 metal Substances 0.000 abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000010729 system oil Substances 0.000 abstract 1
- 239000004642 Polyimide Substances 0.000 description 12
- 229920001721 polyimide Polymers 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000000227 grinding Methods 0.000 description 5
- 229920002545 silicone oil Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 125000006617 triphenylamine group Chemical group 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- -1 or the like Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 101100321669 Fagopyrum esculentum FA02 gene Proteins 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Landscapes
- Electroluminescent Light Sources (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板上に、陽極、
有機層、陰極を積層してなる積層体を形成した後、この
積層体上に保護膜を成膜し、陽極及び陰極のうち外部と
の接続を行う電極接続部において保護膜を除去し、電極
接続部を表出させるようにした有機ＥＬ（エレクトロル
ミネッセンス）素子の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anode,
After forming a laminate formed by laminating an organic layer and a cathode, a protective film is formed on the laminate, and the protective film is removed at an electrode connecting portion of the anode and the cathode for connection to the outside, and the electrode is removed. The present invention relates to a method for manufacturing an organic EL (electroluminescence) element in which a connection portion is exposed.
【０００２】[0002]
【従来の技術】この種の有機ＥＬ素子は、ガラス等の基
板上に、スパッタ等によりＩＴＯ（インジウムチンオキ
サイド）等の透明材料よりなる陽極を成膜し、その上に
蒸着等により正孔輸送性または電子輸送性の有機材料に
蛍光色素を含有してなる発光層を含む有機層を成膜し、
その上に蒸着等によりアルミ等の金属よりなる陰極を成
膜することに形成される。2. Description of the Related Art In an organic EL device of this kind, an anode made of a transparent material such as ITO (indium tin oxide) is formed on a substrate such as glass by sputtering or the like, and holes are transported on the anode by vapor deposition or the like. Forming an organic layer including a light-emitting layer containing a fluorescent dye in an organic material having an electron transporting property,
A cathode made of metal such as aluminum is formed thereon by vapor deposition or the like.
【０００３】そして、これら陽極、有機層、陰極よりな
る積層体を、外部環境から保護するために、無機材料や
有機材料等よりなる保護膜で被覆することが必要とな
る。また、陽極や陰極には、外部との電気的な接続を行
うために外部配線部材等と接続される電極接続部が形成
される。[0003] In order to protect the laminate comprising the anode, the organic layer, and the cathode from the external environment, it is necessary to cover the laminate with a protective film made of an inorganic material, an organic material, or the like. Further, the anode and the cathode are formed with an electrode connection portion which is connected to an external wiring member or the like in order to make an electrical connection with the outside.
【０００４】[0004]
【発明が解決しようとする課題】この電極接続部の形成
方法としては、メタルマスクを用いて電極接続部上には
保護膜を成膜しないようにする方法や、ウェット系リフ
トオフ方法が考えられる。しかしながら、本発明者等の
検討によれば、これら両方法とも、有機ＥＬ素子への適
用には適していないと考えられる。As a method of forming the electrode connecting portion, a method in which a protective film is not formed on the electrode connecting portion by using a metal mask, or a wet lift-off method can be considered. However, according to the study of the present inventors, it is considered that both of these methods are not suitable for application to an organic EL device.
【０００５】まず、上記したメタルマスクによる方法に
よる問題点について述べる。保護膜として要求される膜
質としては、成膜面上の凹凸部のステップカバレッジが
極めて良好であることが必要である。こうした膜質の保
護膜を実現するためには、プラズマＣＶＤ、光ＣＶＤと
いった成膜方法が採用される。First, the problems caused by the above-described method using a metal mask will be described. As the film quality required for the protective film, it is necessary that the step coverage of the concavo-convex portion on the film formation surface is extremely good. In order to realize such a protective film having a film quality, a film forming method such as plasma CVD or optical CVD is adopted.
【０００６】しかし、これら成膜方法では、ステップカ
バレッジが良すぎるが故に、電極接続部直上に配置され
たメタルマスクと基板との間の僅かな隙間にも成膜原料
ガスが回り込んで、本来メタルマスクで覆われている電
極接続部上にまで保護膜が形成されてしまう、という問
題が生じる。However, in these film forming methods, since the step coverage is too good, the film forming raw material gas flows into a slight gap between the metal mask disposed just above the electrode connecting portion and the substrate, and originally, There is a problem that the protective film is formed even on the electrode connection portion covered with the metal mask.
【０００７】一方、上記したウェット系リフトオフ方法
は、電極接続部上に予めレジスト材料を塗布しておき、
保護膜成膜後にレジスト材料上の保護膜も一緒に剥離す
る方法であるが、この剥離には、剥離液を用いるためウ
ェットプロセスが必須になり、有機ＥＬ素子にとっては
特性劣化の要因となる水や有機溶媒を用いざるを得な
い、という問題が生じる。On the other hand, in the above wet lift-off method, a resist material is applied in advance on an electrode connection portion,
This is a method in which the protective film on the resist material is also peeled off after the formation of the protective film. However, in this peeling, a wet process is indispensable because a peeling solution is used, and water, which is a factor of characteristic deterioration for the organic EL device, Or an organic solvent must be used.
【０００８】そこで、比較的実現可能に近い方法として
考えられる例としては、特公平６−７９５１２号公報に
記載されている機械的研削手法がある。この手法のうち
液体ホーニングという方法では、研削において研削粒を
混合した水や有機溶媒を用いるので、ウェット系リフト
オフ方法と同様に有機ＥＬ素子には適していない。A mechanical grinding method described in Japanese Examined Patent Publication No. 6-79512 is an example that can be considered as a relatively practical method. Of these methods, the liquid honing method is not suitable for an organic EL device as in the wet lift-off method because water or an organic solvent mixed with abrasive grains is used in grinding.
【０００９】そこで、機械的研削手法のうち乾式の方法
が考えられるが、別途、研削工程で生じた保護膜の研磨
くずを水洗浄で取り除く必要が生じる。そのため、この
方法でも、水を使うという点から有機ＥＬ素子には適し
ていないと考えられる。In view of the above, a dry method is considered as a mechanical grinding method. However, it is necessary to separately remove polishing debris of the protective film generated in the grinding step by washing with water. Therefore, it is considered that this method is not suitable for an organic EL element in terms of using water.
【００１０】つまり、有機ＥＬ素子において、陽極及び
陰極のうち外部との接続を行う電極接続部において保護
膜を除去し、電極接続部を表出させるにあたっては、メ
タルマスクによる保護膜成膜、及び、水や有機溶媒を用
いるウェットプロセスを用いることが無いようにしなけ
ればならない。That is, in the organic EL element, the protective film is removed at the electrode connection portion of the anode and the cathode for connection to the outside, and when the electrode connection portion is exposed, a protective film is formed by using a metal mask; In addition, it is necessary to avoid using a wet process using water or an organic solvent.
【００１１】本発明は、上記問題に鑑み、電極及び有機
層を保護膜で被覆し、当該保護膜から電極接続部を表出
させるようにした有機ＥＬ素子の製造方法において、メ
タルマスクによる保護膜成膜やウェットプロセスを用い
ることなく、電極接続部を適切に表出させることができ
るようにすることを目的とする。In view of the above problems, the present invention relates to a method of manufacturing an organic EL device in which an electrode and an organic layer are covered with a protective film and an electrode connection portion is exposed from the protective film. An object is to allow an electrode connecting portion to be appropriately exposed without using a film formation or a wet process.
【００１２】[0012]
【課題を解決するための手段】上記目的を達成するた
め、請求項１に記載の発明では、基板上に、陽極（２
０）、発光層を含む有機発光材料よりなる有機層（３
０）、陰極（４０）を積層してなる積層体（２０〜４
０）を形成した後、この積層体を被覆して保護する保護
膜（５０）を成膜し、陽極及び陰極のうち外部との接続
を行う電極接続部（２１）において保護膜を除去して、
当該電極接続部を表出させるようにした有機ＥＬ素子の
製造方法において、積層体を形成した後、保護膜を成膜
する前に、電極接続部を、保護膜が成膜されないように
表面改質することを特徴としている。According to the first aspect of the present invention, an anode (2) is provided on a substrate.
0), an organic layer (3) made of an organic light emitting material including a light emitting layer.
0) and a laminate (20 to 4) obtained by laminating a cathode (40).
After the formation of (0), a protective film (50) for covering and protecting this laminate is formed, and the protective film is removed at the electrode connection part (21) for connection to the outside of the anode and the cathode. ,
In the method for manufacturing an organic EL device in which the electrode connection portion is exposed, after the laminate is formed and before the protective film is formed, the electrode connection portion is resurfaced so that the protection film is not formed. It is characterized by quality.
【００１３】それによれば、保護膜を成膜する前に、陽
極及び陰極のうち電極接続部を、保護膜が成膜されない
ように表面改質するため、保護膜は電極接続部では成膜
されず、結果的に、メタルマスクによる保護膜成膜やウ
ェットプロセスを用いることなく、電極接続部を適切に
表出させることができる。According to this method, before forming the protective film, the electrode connecting portion of the anode and the cathode is surface-modified so that the protective film is not formed, so that the protective film is formed at the electrode connecting portion. As a result, the electrode connection portion can be appropriately exposed without using a protective film formed by a metal mask or a wet process.
【００１４】また、請求項２に記載の発明では、保護膜
（５０）は、成膜材料としてＨ2Ｏを用いたＡＬＥ（ア
トミック・レイヤー・エピタキシー）法により形成され
るものであり、表面改質として非極性化または撥水化を
行うことを特徴としている。According to the second aspect of the present invention, the protective film (50) is formed by an ALE (atomic layer epitaxy) method using H 2 O as a film forming material. It is characterized in that it is made non-polar or water-repellent.
【００１５】保護膜が、成膜材料としてＨ2Ｏを用いた
ＡＬＥ法により形成されるものである場合、電極接続部
に施される表面改質として非極性化または撥水化を行う
ようにすれば、電極接続部における保護膜の成膜を適切
に防止することができる。When the protective film is formed by the ALE method using H 2 O as a film-forming material, the surface is modified to be non-polar or water-repellent as a surface modification applied to the electrode connection portion. Then, the formation of the protective film at the electrode connection portion can be appropriately prevented.
【００１６】また、請求項３に記載の発明では、保護膜
（５０）を成膜した後、電極接続部（２１）の表面に紫
外線照射を施し、極性化または親水化させることを特徴
としている。Further, the invention according to claim 3 is characterized in that, after forming the protective film (50), the surface of the electrode connecting portion (21) is irradiated with ultraviolet rays to make it polar or hydrophilic. .
【００１７】電極接続部に非極性化または撥水化といっ
た表面改質を施した場合、外部配線部材との接続を行う
ために用いられる導電性接着剤やはんだ等が、電極接続
部に密着しやすくする必要がある。その点、本発明によ
れば、電極接続部の表面に紫外線照射を施し、表出して
いる当該表面を極性化または親水化させることによっ
て、上記導電性接着剤等との密着性を良好にすることが
でき、好ましい。When the electrode connection is subjected to surface modification such as non-polarization or water repellency, a conductive adhesive or solder used for connection with an external wiring member adheres to the electrode connection. It needs to be easier. In that regard, according to the present invention, the surface of the electrode connection portion is irradiated with ultraviolet rays to polarize or hydrophilize the exposed surface, thereby improving the adhesion with the conductive adhesive or the like. Can be preferred.
【００１８】また、請求項４に記載の発明では、基板上
に、陽極（２０）、発光層を含む有機発光材料よりなる
有機層（３０）、陰極（４０）を積層してなる積層体
（２０〜４０）を形成した後、この積層体を被覆して保
護する保護膜（５０）を成膜し、陽極及び陰極のうち外
部との接続を行う電極接続部（２１）において保護膜を
除去して、当該電極接続部を表出させるようにした有機
ＥＬ素子の製造方法において、積層体を形成した後、保
護膜を成膜する前に、電極接続部にマスキングテープ
（２３）を貼り付け、保護膜を成膜した後、マスキング
テープとともに保護膜を除去することを特徴としてい
る。According to the fourth aspect of the present invention, a laminate is formed by laminating an anode (20), an organic layer (30) made of an organic light emitting material including a light emitting layer, and a cathode (40) on a substrate. 20 to 40), a protective film (50) for covering and protecting this laminate is formed, and the protective film is removed at the electrode connection part (21) of the anode and the cathode for connection to the outside. Then, in the method for manufacturing an organic EL element in which the electrode connection portion is exposed, a masking tape (23) is attached to the electrode connection portion after forming the laminate and before forming the protective film. After forming the protective film, the protective film is removed together with the masking tape.
【００１９】それによれば、電極接続部をマスキングテ
ープで被覆した状態で保護膜の成膜を行い、その後、当
該テープを剥がしてテープ上の保護膜を一緒に除去する
ことができるため、メタルマスクによる保護膜成膜やウ
ェットプロセスを用いることなく、電極接続部を適切に
表出させることができる。According to this method, a protective film is formed while the electrode connection portion is covered with the masking tape, and then the tape can be peeled off and the protective film on the tape can be removed together. The electrode connecting portion can be appropriately exposed without using a protective film or a wet process.
【００２０】また、請求項５に記載の発明では、基板上
に、陽極（２０）、発光層を含む有機発光材料よりなる
有機層（３０）、陰極（４０）を積層してなる積層体
（２０〜４０）を形成した後、この積層体を被覆して保
護する保護膜（５０）を成膜し、陽極及び陰極のうち外
部との接続を行う電極接続部（２１）において保護膜を
除去して、当該電極接続部を表出させるようにした有機
ＥＬ素子の製造方法において、積層体を形成した後、保
護膜を成膜する前に、電極接続部を、有機層を構成する
薄膜材料もしくは陽極のエッジ部を被覆する材料と同一
の材料で被覆し、保護膜を成膜した後、電極接続部上の
被覆材料（２４）を保護膜とともに除去することを特徴
としている。According to the fifth aspect of the present invention, a laminate is formed by laminating an anode (20), an organic layer (30) made of an organic light emitting material including a light emitting layer, and a cathode (40) on a substrate. 20 to 40), a protective film (50) for covering and protecting this laminate is formed, and the protective film is removed at the electrode connection part (21) of the anode and the cathode for connection to the outside. Then, in the method for manufacturing an organic EL element in which the electrode connection portion is exposed, after the laminate is formed and before the protective film is formed, the electrode connection portion is formed of a thin film material forming the organic layer. Alternatively, it is characterized in that after coating with the same material as the material for coating the edge portion of the anode, a protective film is formed, and then the coating material (24) on the electrode connection portion is removed together with the protective film.
【００２１】保護膜を成膜する前に電極接続部を被覆す
る被覆材料、すなわち、有機層を構成する薄膜材料は、
正孔輸送性有機材料や電子輸送性有機材料等であり、ま
た、陽極のエッジ部を被覆する材料はポリイミド等の樹
脂材料等であり、フォトエッチング等にて除去可能なも
のである。そして、本発明によっても、メタルマスクに
よる保護膜成膜やウェットプロセスを用いることなく、
電極接続部を適切に表出させることができる。The coating material for coating the electrode connection portion before forming the protective film, that is, the thin film material constituting the organic layer is
A hole transporting organic material, an electron transporting organic material, or the like, and a material covering the edge portion of the anode is a resin material such as polyimide, which can be removed by photoetching or the like. And also according to the present invention, without using a protective film deposition by a metal mask or a wet process,
The electrode connection can be appropriately exposed.
【００２２】また、本発明のような被覆材料を用いれ
ば、特に、有機ＥＬ素子に必要な成膜材料を用いて、電
極接続部を被覆することができるため、別途、電極接続
部を被覆するための材料を用意して電極接続部を被覆す
る工程を行う必要が無く、工程数の増加が無く効率的で
ある。In addition, when the coating material as in the present invention is used, the electrode connection portion can be coated particularly by using a film forming material necessary for the organic EL element. Therefore, the electrode connection portion is separately coated. It is not necessary to perform a step of preparing a material for covering the electrode connection part, and the number of steps is not increased, which is efficient.
【００２３】また、請求項６に記載の発明では、電極接
続部（２１）上の被覆材料（２４）を、保護膜（５０）
と共に除去する方法が、紫外線を用いたフォトエッチン
グであることを特徴としている。In the invention according to the sixth aspect, the coating material (24) on the electrode connecting portion (21) is applied to the protective film (50).
The method is characterized in that the method of removing with photo-etching is photo-etching using ultraviolet rays.
【００２４】電極接続部上の被覆材料が、陽極のエッジ
部を被覆する材料即ちポリイミド等の樹脂材料等である
場合には、本製造方法のように紫外線を用いたフォトエ
ッチングを行うことにより、当該被覆材料を、保護膜と
共に適切に除去することができる。When the coating material on the electrode connection portion is a material for coating the edge portion of the anode, that is, a resin material such as polyimide, the photo-etching using ultraviolet light is performed as in the present manufacturing method. The coating material can be appropriately removed together with the protective film.
【００２５】また、請求項７に記載の発明では、基板上
に、陽極（２０）、発光層を含む有機発光材料よりなる
有機層（３０）、陰極（４０）を積層してなる積層体
（２０〜４０）を形成した後、この積層体を被覆して保
護する保護膜（５０）を成膜し、陽極及び陰極のうち外
部との接続を行う電極接続部（２１）において保護膜を
除去して、当該電極接続部を表出させるようにした有機
ＥＬ素子の製造方法において、積層体を形成した後、保
護膜を成膜する前に、電極接続部の表面を、電極接続部
と密着力の小さい薄膜層（２７）にて被覆しておき、保
護膜を成膜した後、電極接続部上の薄膜層を保護膜と共
に剥離させることを特徴としている。[0025] In the invention according to claim 7, the anode (20), the organic layer (30) made of an organic light emitting material including the light emitting layer, and the cathode (40) are laminated on the substrate ( 20 to 40), a protective film (50) for covering and protecting this laminate is formed, and the protective film is removed at the electrode connection part (21) of the anode and the cathode for connection to the outside. Then, in the method for manufacturing an organic EL element in which the electrode connection portion is exposed, after forming the laminate, before forming the protective film, the surface of the electrode connection portion is brought into close contact with the electrode connection portion. The method is characterized in that the thin film layer on the electrode connecting portion is peeled off together with the protective film after coating with a thin film layer (27) having a small force and forming a protective film.
【００２６】それによれば、メタルマスクによる保護膜
成膜やウェットプロセスを用いることなく、電極接続部
を適切に表出させることができる。According to this, the electrode connection portion can be appropriately exposed without using a protective film formed by a metal mask or a wet process.
【００２７】なお、上記各手段の括弧内の符号は、後述
する実施形態に記載の具体的手段との対応関係を示す一
例である。Note that the reference numerals in parentheses of the above means are examples showing the correspondence with specific means described in the embodiments described later.
【００２８】[0028]
【発明の実施の形態】（第１実施形態）以下、本発明を
図に示す実施形態について説明する。本第１実施形態
は、保護膜を成膜する前に電極接続部を保護膜が成膜さ
れないように表面改質することを特徴とするものであ
る。図１は、本実施形態に係る有機ＥＬ素子の製造方法
を断面的に示す工程図であり、以下、本製造方法につい
て図１に示される製造工程順に説明していく。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) An embodiment of the present invention shown in the drawings will be described below. The first embodiment is characterized in that before forming the protective film, the surface of the electrode connection portion is modified so that the protective film is not formed. FIG. 1 is a cross-sectional process diagram illustrating a method for manufacturing an organic EL device according to the present embodiment. Hereinafter, the present manufacturing method will be described in the order of the manufacturing steps illustrated in FIG.
【００２９】まず、図１（ａ）に示す様に、透明なガラ
ス基板１０の上に、スパッタ法、フォトリソグラフ法等
を用いて、ＩＴＯ等の透明導電膜よりなる陽極２０を形
成する。本例では、一方向（図中の左右方向）へ延びる
ストライプ状にパターニングされている。First, as shown in FIG. 1A, an anode 20 made of a transparent conductive film such as ITO is formed on a transparent glass substrate 10 by using a sputtering method, a photolithographic method or the like. In the present example, it is patterned in a stripe shape extending in one direction (the left-right direction in the figure).
【００３０】この上に、有機層３０を蒸着法により、成
膜する。この有機層３０は、例えば、陽極２０側から正
孔注入層、正孔輸送層、発光層、電子輸送層、電子注入
層等が順次成膜されたものであり、発光層には蛍光色素
が含有され、発光層にて電子と正孔が再結合する際のエ
ネルギーによって発光が行われるものである。An organic layer 30 is formed thereon by a vapor deposition method. The organic layer 30 is formed, for example, by sequentially forming a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and the like from the anode 20 side. It is contained and emits light by the energy when electrons and holes are recombined in the light emitting layer.
【００３１】次に、有機層３０の上に、蒸着法やレーザ
を用いたパターニング法等を用いて、アルミ等の金属よ
りなる陰極４０を成膜する。本例では、陰極４０は、陽
極２０とは直交する方向（図中の紙面垂直方向）に延び
るストライプ状にパターニングされている。Next, a cathode 40 made of a metal such as aluminum is formed on the organic layer 30 by using a vapor deposition method, a patterning method using a laser, or the like. In this example, the cathode 40 is patterned in a stripe shape extending in a direction perpendicular to the anode 20 (a direction perpendicular to the paper surface of the drawing).
【００３２】これら、陽極２０、有機層３０及び陰極４
０が積層されたものが、有機ＥＬ素子における積層体２
０〜４０として構成されている。そして、両電極２０、
４０が重なり合う部分が、画素として構成される。つま
り、本例では、マトリクス状の画素が形成される。The anode 20, the organic layer 30, and the cathode 4
0 are laminated to form a laminate 2 in the organic EL device.
It is configured as 0-40. And both electrodes 20,
The portion where 40 overlaps is configured as a pixel. That is, in the present example, matrix pixels are formed.
【００３３】また、ガラス基板１０の周辺部に位置する
各電極２０、４０には、陽極２０及び陰極４０と外部と
の電気的な接続を行うために外部配線部材等と接続され
る電極接続部（図示例では陽極２０の電極接続部のみ示
してある）２１が形成されている。Each of the electrodes 20 and 40 located at the peripheral portion of the glass substrate 10 has an electrode connection portion connected to an external wiring member or the like in order to electrically connect the anode 20 and the cathode 40 to the outside. (Only the electrode connection portion of the anode 20 is shown in the illustrated example) 21 is formed.
【００３４】この電極接続部２１は、外部に表出してお
り、上記した外部接続部材等と導電性接着剤や半田等の
導電性接続部材を介して接続され、外部回路に電気的に
接続されるものである。そして、当該外部回路からは、
これら電極接続部２１を介して、両電極２０、４０間に
所定の直流電界を印加することにより、上記画素におい
て有機層３０中の発光層にて発光が行われるようになっ
ている。The electrode connection portion 21 is exposed to the outside, is connected to the above-mentioned external connection member and the like via a conductive connection member such as a conductive adhesive or solder, and is electrically connected to an external circuit. Things. And from the external circuit,
By applying a predetermined DC electric field between the electrodes 20 and 40 via the electrode connection portions 21, light is emitted from the light emitting layer in the organic layer 30 in the pixel.
【００３５】次に、上記した積層体２０〜４０の上を被
覆して保護する保護膜５０（図１（ｃ）参照）を形成す
る。ここで、電極接続部２１を表面改質して、保護膜材
料が電極接続部２１において膜成長しないようにするこ
とが目的であるが、表面改質の手段は選択する保護膜材
料に依存する。Next, a protective film 50 (see FIG. 1C) that covers and protects the above-mentioned laminated bodies 20 to 40 is formed. Here, the purpose is to modify the surface of the electrode connection portion 21 so that the protective film material does not grow on the electrode connection portion 21. The means for surface modification depends on the selected protection film material. .
【００３６】本実施形態では、保護膜５０は、成膜材料
としてＨ2Ｏを用いたＡＬＥ（アトミック・レイヤー・
エピタキシー）法により形成する。本例では、原材料と
して、Ｈ2ＯとＴＭＡ（テトラメチルアルミニウム）を
用い、Ａｌ2Ｏ3よりなる保護膜５０を成膜する。この方
法は、Ｈ2ＯとＴＭＡとを交互に成膜室内に供給して両
者の反応によりＡｌ2Ｏ3を成長させる方法である。In this embodiment, the protective film 50 is made of ALE (atomic layer film) using H 2 O as a film forming material.
It is formed by an epitaxy method. In this example, a protective film 50 made of Al 2 O 3 is formed using H 2 O and TMA (tetramethyl aluminum) as raw materials. In this method, H 2 O and TMA are alternately supplied into a film forming chamber, and Al 2 O 3 is grown by a reaction between the two .
【００３７】よって、ＡＬＥ成長をさせたくない電極接
続部２１にＨ2Ｏが基板表面に吸着しないようにすれ
ば、この反応は起こらず、保護膜５０は電極接続部２１
上に成膜されない。すなわち、電極接続部２１の表面を
無極性化（非極性化）、極論すれば撥水化処理しておく
ことにより、ＡＬＥ成長をさせないことが可能となる。Therefore, if H 2 O is prevented from adsorbing to the substrate surface at the electrode connection portion 21 where ALE growth is not desired, this reaction does not occur, and the protective film 50 is formed at the electrode connection portion 21.
No film is formed on it. That is, it is possible to prevent ALE growth by making the surface of the electrode connecting portion 21 non-polar (non-polarizing) and, in the extreme, water-repellent.
【００３８】本例では、図１（ｂ）に示す様に、電極接
続部２１上にシリコーン系オイル２２を塗布する。その
後、Ａｌ2Ｏ3よりなる保護膜５０を成膜する。このとき
の成膜条件は、例えば、成膜温度１００℃とし、ＴＭＡ
を１秒導入→Ｎ2パージ→Ｈ2Ｏを１秒導入→Ｎ2パージ
を１サイクルとして、これを５０００サイクル繰り返し
た。このようなＡＬＥ成膜を実施することにより、厚さ
２５０ｎｍのＡｌ2Ｏ3よりなる保護膜５０を成膜した。In this embodiment, as shown in FIG. 1B, a silicone oil 22 is applied on the electrode connecting portion 21. Thereafter, a protective film 50 made of Al 2 O 3 is formed. The film forming conditions at this time are, for example, a film forming temperature of 100 ° C. and a TMA
Was introduced for 1 second → N 2 purge → H 2 O was introduced for 1 second → N 2 purge was defined as one cycle, and this was repeated 5000 cycles. By performing such ALE film formation, a protective film 50 made of Al 2 O 3 having a thickness of 250 nm was formed.
【００３９】これにより、図１（ｃ）に示す様に、保護
膜５０を形成したい発光部領域上にはＡｌ2Ｏ3が形成さ
れ、保護膜５０を形成したくない電極接続部２１上に
は、Ａｌ2Ｏ3が成膜されない。しかし、後工程にて電極
接続部２１を上記外部回路と接続させるためには、導電
性接着剤や半田等の接続部材との密着性を改善するため
に、シリコーンオイル２２の皮膜を除去し、電極接続部
２１の表面を極性化または親水化させる必要がある。As a result, as shown in FIG. 1C, Al 2 O 3 is formed on the light emitting portion region where the protection film 50 is to be formed, and is formed on the electrode connection portion 21 where the protection film 50 is not desired to be formed. Does not form Al 2 O 3 . However, in order to connect the electrode connection portion 21 to the external circuit in a later step, the film of the silicone oil 22 is removed in order to improve the adhesion with a connection member such as a conductive adhesive or solder. It is necessary to polarize or hydrophilize the surface of the electrode connecting portion 21.
【００４０】そこで、次に、図１（ｄ）に示す様に、Ｕ
Ｖランプ２２ａを用いて、シリコーン系オイル２２上を
紫外線照射することでオゾン（Ｏ3）処理（ＵＶオゾン
処理）を行い、シリコーン系オイル２２を分解して除去
する。これにより、図１（ｅ）に示す様に、電極接続部
２１を表出させることができ、本実施形態の有機ＥＬ素
子が完成する。Therefore, next, as shown in FIG.
Ozone (O 3 ) treatment (UV ozone treatment) is performed by irradiating the silicone oil 22 with ultraviolet rays using a V lamp 22a, and the silicone oil 22 is decomposed and removed. Thereby, as shown in FIG. 1E, the electrode connection portion 21 can be exposed, and the organic EL device of the present embodiment is completed.
【００４１】なお、本実施形態において表面改質を行う
ための皮膜（油膜）は、シリコーン系オイル２２に限定
されるものではなく、電極接続部２１に対して防水スプ
レー等によりに防水剤（例えばフッ素樹脂系のコーティ
ング剤）を吹き付けることや、フッ素系のシートを擦り
つけること等により、当該皮膜を形成するようにしても
良い。In the present embodiment, the film (oil film) for performing the surface modification is not limited to the silicone oil 22, but a waterproof agent (for example, a waterproof spray) is applied to the electrode connecting portion 21 by a waterproof spray or the like. The film may be formed by spraying a fluororesin-based coating agent) or rubbing a fluorine-based sheet.
【００４２】以上、本実施形態によれば、保護膜５０を
成膜する前に、電極接続部２１を、保護膜５０が成膜さ
れないように表面改質するため、保護膜５０は電極接続
部２１では成膜されず、結果的に、従来のメタルマスク
による保護膜成膜やウェットプロセスを用いることな
く、電極接続部２１を適切に表出させることができる。As described above, according to the present embodiment, before the protective film 50 is formed, the surface of the electrode connecting portion 21 is modified so that the protective film 50 is not formed. As a result, the electrode connecting portion 21 can be appropriately exposed without using a conventional process of forming a protective film using a metal mask or a wet process.
【００４３】また、保護膜５０が、成膜材料としてＨ2
Ｏを用いたＡＬＥ法により形成されるものである場合、
電極接続部２１に施される表面改質として非極性化また
は撥水化を行うようにすれば、電極接続部２１における
保護膜５０の成膜を適切に防止することができる。The protective film 50 is made of H 2 as a film forming material.
When formed by the ALE method using O,
If non-polarization or water repellency is performed as a surface modification to be performed on the electrode connecting portion 21, the formation of the protective film 50 on the electrode connecting portion 21 can be appropriately prevented.
【００４４】また、本実施形態によれば、保護膜５０を
成膜した後、いったん非極性化または撥水化された電極
接続部２１の表面に紫外線照射を施し、極性化または親
水化させるようにしているため、外部配線部材との接続
を行うために用いられる導電性接着剤やはんだ等が、電
極接続部２１に密着しやすくすることができ、好まし
い。According to the present embodiment, after the protective film 50 is formed, the surface of the electrode connection portion 21 which has been made non-polar or water-repellent is irradiated with ultraviolet rays to make it polar or hydrophilic. Therefore, a conductive adhesive, solder, or the like used for connection with an external wiring member can easily adhere to the electrode connection portion 21, which is preferable.
【００４５】（第２実施形態）本第２実施形態は、積層
体を形成した後、保護膜を成膜する前に、電極接続部に
マスキングテープを貼り付け、保護膜を成膜した後、マ
スキングテープとともに保護膜を除去することを特徴と
するものである。図２は、本実施形態に係る有機ＥＬ素
子の製造方法を断面的に示す工程図であり、以下、上記
第１実施形態との相違点を中心に説明していく。(Second Embodiment) In the second embodiment, a masking tape is attached to an electrode connecting portion after a laminate is formed and before a protective film is formed, and a protective film is formed. The protective film is removed together with the masking tape. FIG. 2 is a sectional view illustrating a method for manufacturing the organic EL device according to the present embodiment in a cross-sectional manner. Hereinafter, the description will focus on differences from the first embodiment.
【００４６】まず、図２（ａ）に示す様に、ガラス基板
１０上に積層体２０〜４０をする。次に、図２（ｂ）に
示す様に、電極接続部２１上に耐熱性のマスキングテー
プ２３を貼り付け、このテープ２３により電極接続部２
１を被覆する。First, as shown in FIG. 2A, laminated bodies 20 to 40 are formed on a glass substrate 10. Next, as shown in FIG. 2B, a heat-resistant masking tape 23 is adhered on the electrode connecting portion 21, and the tape 23
Cover 1
【００４７】この上に、図２（ｃ）に示す様に、例えば
上記第１実施形態で述べたのと同様の成膜条件にて、Ａ
ＬＥ法により保護膜５０を成膜する。その後、マスキン
グテープ２３とともに保護膜５０を除去する。これによ
り、図２（ｄ）に示す様に、電極接続部２１を表出させ
ることができ、本実施形態の有機ＥＬ素子が完成する。Further, as shown in FIG. 2C, for example, under the same film forming conditions as described in the first embodiment, the A
The protective film 50 is formed by the LE method. After that, the protective film 50 is removed together with the masking tape 23. Thereby, as shown in FIG. 2D, the electrode connection portion 21 can be exposed, and the organic EL device of the present embodiment is completed.
【００４８】このように、本実施形態によれば、電極接
続部２１をマスキングテープ２３で被覆した状態で保護
膜５０の成膜を行い、その後、当該テープ２３を剥がし
てテープ２３上の保護膜５０を一緒に除去することがで
きるため、従来のメタルマスクによる保護膜成膜やウェ
ットプロセスを用いることなく、電極接続部２１を適切
に表出させることができる。As described above, according to the present embodiment, the protective film 50 is formed with the electrode connecting portion 21 covered with the masking tape 23, and then the tape 23 is peeled off to form the protective film on the tape 23. Since 50 can be removed at the same time, the electrode connection portion 21 can be appropriately exposed without using a conventional protective film deposition or wet process using a metal mask.
【００４９】（第３実施形態）本第３実施形態は、積層
体を形成した後、保護膜を成膜する前に、電極接続部
を、有機層を構成する薄膜材料もしくは陽極のエッジ部
を被覆する材料と同一の材料で被覆し、保護膜を成膜し
た後、電極接続部上の被覆材料を保護膜とともに除去す
ることを特徴とするものである。図３は、本実施形態に
係る有機ＥＬ素子の製造方法を断面的に示す工程図であ
り、以下、上記第１実施形態との相違点を中心に説明し
ていく。(Third Embodiment) In the third embodiment, after forming the laminated body and before forming the protective film, the electrode connection portion is formed by the thin film material constituting the organic layer or the edge portion of the anode. After coating with the same material as the material to be coated and forming a protective film, the coating material on the electrode connection portion is removed together with the protective film. FIG. 3 is a sectional view illustrating a method for manufacturing the organic EL device according to the present embodiment in a cross-sectional manner. Hereinafter, the description will focus on differences from the first embodiment.
【００５０】まず、図３（ａ）に示す様に、ガラス基板
１０上に積層体２０〜４０をする。ただし、本実施形態
においては、陽極２０を形成した後、陽極２０上をポリ
イミド等の樹脂材料（本例ではポリイミド）で被覆して
いる。このことは、陽極２０のエッジ部を保護する目的
で通常行われていることである。First, as shown in FIG. 3A, laminated bodies 20 to 40 are formed on a glass substrate 10. However, in the present embodiment, after the anode 20 is formed, the anode 20 is covered with a resin material such as polyimide (polyimide in this example). This is usually done to protect the edge of the anode 20.
【００５１】そして、このポリイミドをパターニングす
る工程において、通常のポリイミドによる被覆領域（発
光部領域）に加えて電極接続部２１をも被覆する。図３
（ａ）には、電極接続部２１を被覆するポリイミド（本
発明でいう電極接続部上の被覆材料）２４のみが示され
ている。従って、従来のパターニング工程に比べて、電
極接続部２１を被覆する工程は別途行う必要はなく、工
数は増えない。Then, in the step of patterning the polyimide, the electrode connection portion 21 is covered in addition to the usual polyimide-covered region (light-emitting portion region). FIG.
(A) shows only the polyimide (coating material on the electrode connection part in the present invention) 24 that covers the electrode connection part 21. Therefore, as compared with the conventional patterning process, there is no need to separately perform the process of covering the electrode connecting portion 21, and the number of steps is not increased.
【００５２】そして、その後、有機層３０、陰極４０を
形成し、続いて、図３（ｂ）に示す様に、例えば上記第
１実施形態で述べたのと同様の成膜条件にて、ＡＬＥ法
により保護膜５０を成膜する。その後、次のようにし
て、電極接続部２１上のポリイミド（被覆材料）２４を
保護膜５０とともに除去する。Then, an organic layer 30 and a cathode 40 are formed, and then, as shown in FIG. 3B, for example, ALE is performed under the same film forming conditions as described in the first embodiment. A protective film 50 is formed by a method. Thereafter, the polyimide (coating material) 24 on the electrode connecting portion 21 is removed together with the protective film 50 as follows.
【００５３】まず、図３（ｃ）に示す様に、有機ＥＬ素
子における発光部領域を遮蔽し、電極接続部２１上が開
口部となっているメタルマスク２５を、保護膜５０上に
重ねて配置する。次に、電極接続部２１上のポリイミド
２４を紫外線を用いたフォトエッチングにより除去す
る。First, as shown in FIG. 3C, a metal mask 25 having an opening on the electrode connection part 21 is placed on the protective film 50 so as to shield the light emitting part region of the organic EL element. Deploy. Next, the polyimide 24 on the electrode connection part 21 is removed by photoetching using ultraviolet rays.
【００５４】このフォトエッチングの条件は、例えば、
厚さ１μｍ以内のポリイミド２４であれば、１２ｍＷ／
ｃｍ2のＸｅエキシマランプ（波長１２６ｎｍ〜１７２
ｎｍ）２６を用い、エッチングレート１０ｎｍ／ｍｉｎ
で２時間照射するものである。The conditions for this photoetching are, for example,
If the thickness of the polyimide 24 is 1 μm or less, 12 mW /
cm 2 Xe excimer lamp (wavelength 126 nm to 172)
nm) 26 and an etching rate of 10 nm / min.
For 2 hours.
【００５５】なお、メタルマスク２５を用いるのは上記
エキシマランプ２６の照射により、発光部領域が高温に
さらされるのを避けるためであるが、冷却風を送風する
等により、この高温の問題を回避することができるなら
ば、必ずしも、メタルマスク２６を用いる必要はない。The purpose of using the metal mask 25 is to avoid exposing the light emitting area to a high temperature due to the irradiation of the excimer lamp 26. However, this high temperature problem is avoided by blowing cooling air or the like. If it is possible, it is not always necessary to use the metal mask 26.
【００５６】以上、本実施形態によれば、保護膜５０を
成膜する前に電極接続部２１を被覆する被覆材料２４と
して、陽極のエッジ部を被覆するポリイミド等の樹脂材
料を用いており、紫外線照射してフォトエッチングする
ことにより保護膜５０と共に剥がすことが可能である。As described above, according to the present embodiment, the resin material such as polyimide for covering the edge of the anode is used as the covering material 24 for covering the electrode connecting portion 21 before the protective film 50 is formed. It can be peeled off together with the protective film 50 by photo-etching by irradiating ultraviolet rays.
【００５７】また、本実施形態において、保護膜５０を
成膜する前に電極接続部２１を被覆する被覆材料２４
は、陽極２０のエッジ部を被覆する材料（本例ではポリ
イミド）でなくとも良く、有機層を構成する薄膜材料、
即ち、正孔輸送性有機材料や電子輸送性有機材料等であ
っても良い。In the present embodiment, the coating material 24 for covering the electrode connecting portion 21 before forming the protective film 50 is formed.
May not be a material (polyimide in this example) that covers the edge of the anode 20, but may be a thin film material constituting an organic layer,
That is, a hole transporting organic material, an electron transporting organic material, or the like may be used.
【００５８】従って、本実施形態によれば、電極接続部
２１を被覆するこれら被覆材料２４上に保護膜が成膜さ
れても、メタルマスクによる保護膜成膜やウェットプロ
セスを用いることなく、電極接続部を適切に表出させる
ことができる。Therefore, according to the present embodiment, even if a protective film is formed on the coating material 24 covering the electrode connecting portion 21, the electrode can be formed without using a metal mask to form the protective film or a wet process. The connecting portion can be appropriately exposed.
【００５９】また、上記したような被覆材料２４を用い
れば、特に、有機ＥＬ素子に必要な成膜材料を用いて、
電極接続部２１を被覆することができるため、別途、電
極接続部２１を被覆するための材料を用意して電極接続
部２１を被覆する工程を行う必要が無く、工程数の増加
が無く効率的である。Further, if the coating material 24 as described above is used, in particular, using a film forming material necessary for an organic EL element,
Since the electrode connection portion 21 can be covered, there is no need to separately prepare a material for covering the electrode connection portion 21 and perform the step of covering the electrode connection portion 21, and there is no increase in the number of steps, and the process is efficient. It is.
【００６０】（第４実施形態）本第４実施形態は、積層
体を形成した後、保護膜を成膜する前に、電極接続部の
表面を、電極接続部と密着力の小さい薄膜層にて被覆し
ておき、保護膜を成膜した後、電極接続部上の薄膜層を
保護膜と共に剥離させることを特徴とするものである。
図４は、本実施形態に係る有機ＥＬ素子の製造方法を断
面的に示す工程図であり、以下、上記第１実施形態との
相違点を中心に説明していく。(Fourth Embodiment) In the fourth embodiment, the surface of the electrode connecting portion is formed into a thin film layer having a small adhesive force with the electrode connecting portion before forming the protective film after forming the laminate. After forming a protective film, the thin film layer on the electrode connection portion is peeled off together with the protective film.
FIG. 4 is a sectional view illustrating a method for manufacturing the organic EL element according to the present embodiment in a cross-sectional manner. Hereinafter, the description will focus on differences from the first embodiment.
【００６１】まず、図４（ａ）に示す様に、ガラス基板
１０上に積層体２０〜４０をする。ただし、本実施形態
においては、有機層３０には、ホール輸送性有機材料で
あるトリフェニルアミン誘導体が含まれており、有機層
３０においてトリフェニルアミン誘導体を蒸着する際
に、発光部領域以外にも、電極接続部２１の上にも成膜
する。First, as shown in FIG. 4A, laminated bodies 20 to 40 are formed on a glass substrate 10. However, in the present embodiment, the organic layer 30 contains a triphenylamine derivative that is a hole-transporting organic material. Is also formed on the electrode connection part 21.
【００６２】それにより、図４（ａ）に示す様に、積層
体２０〜４０までが形成されたものにおいて、電極接続
部２１の表面は、トリフェニルアミン誘導体よりなる薄
膜層２７により被覆される。As a result, as shown in FIG. 4 (a), in the case where the laminates 20 to 40 are formed, the surface of the electrode connecting portion 21 is covered with the thin film layer 27 made of a triphenylamine derivative. .
【００６３】このよりなる薄膜層２７は、従来の保護膜
に比べて電極接続部２１と密着力の小さいものであり
（例えば、後述する粘着テープ２８により保護膜５０と
ともに剥離可能な程度）、本実施形態では、有機層３０
を構成する薄膜材料（本例ではトリフェニルアミン誘導
体）から選択しているが、有機ＥＬ素子に用いられてい
ない材料から選択しても良い。This thin film layer 27 has a smaller adhesive strength to the electrode connection portion 21 than the conventional protective film (for example, it can be peeled off together with the protective film 50 by an adhesive tape 28 described later). In the embodiment, the organic layer 30
Is selected from the thin film material (triphenylamine derivative in this example), but may be selected from materials not used in the organic EL element.
【００６４】この上に、図４（ｂ）に示す様に、例えば
上記第１実施形態で述べたのと同様の成膜条件にて、Ａ
ＬＥ法により保護膜５０を成膜する。その後、図４
（ｃ）に示す様に、粘着テープ２８により保護膜５０と
ともにトリフェニルアミン誘導体よりなる薄膜層２７を
除去する。これにより、電極接続部２１を表出させるこ
とができ、本実施形態の有機ＥＬ素子が完成する。Further, as shown in FIG. 4B, under the same film forming conditions as described in the first embodiment, for example,
The protective film 50 is formed by the LE method. Then, FIG.
As shown in (c), the thin film layer 27 made of the triphenylamine derivative is removed together with the protective film 50 by the adhesive tape 28. As a result, the electrode connection portion 21 can be exposed, and the organic EL device of the present embodiment is completed.
【００６５】このように、本実施形態によれば、電極接
続部２１と密着性の悪い薄膜層２７を用いることによ
り、容易に粘着テープ２８等を用いて保護膜５０を除去
することができるため、従来のメタルマスクによる保護
膜成膜やウェットプロセスを用いることなく、電極接続
部２１を適切に表出させることができる。As described above, according to the present embodiment, the protective film 50 can be easily removed by using the adhesive tape 28 or the like by using the thin film layer 27 having poor adhesion to the electrode connection portion 21. In addition, the electrode connecting portion 21 can be appropriately exposed without using a conventional protective film deposition using a metal mask or a wet process.
【００６６】ちなみに、本発明者等の検討によれば、従
来の電極接続部の表出方法、即ち、メタルマスクによる
保護膜成膜、ウェット系リフトオフ方法、機械的研削の
いずれにおいても、適切に電極接続部２１を表出させる
ことができなかった。具体的には、狙いの長さが７ｍｍ
である電極接続部２１のうち、従来のメタルマスクを用
いたＡＬＥ成膜方法では、３ｍｍがＡＬＥ成膜されてし
まい、後工程の導電性接着剤（ＡＣＦ）接続では接着強
度の不足が生じた。By the way, according to the study of the present inventors, it has been found that the conventional method of exposing the electrode connection portion, that is, the protective film formation using a metal mask, the wet lift-off method, and the mechanical grinding, can be appropriately performed. The electrode connection part 21 could not be exposed. Specifically, the target length is 7mm
In the ALE film forming method using a conventional metal mask, 3 mm of the ALE film forming method using the conventional metal mask was performed, and an insufficient bonding strength was caused in the conductive adhesive (ACF) connection in a later process. .
【００６７】また、機械的研削では水洗浄において、ウ
ェット系リフトオフ方法ではリフトオフにおいて、それ
ぞて有機ＥＬ素子が犯され、ダークスポット（表示領域
が光らない黒点）が生じる結果となった。In addition, the organic EL elements were violated in mechanical cleaning in water washing and in wet lift-off method in lift-off, respectively, resulting in dark spots (black spots where the display area does not shine).
【００６８】これに対し、上記各実施形態を採用するこ
とにより、電極接続部２１の接続長さを所望の長さに確
保することができると共に、ダークスポットの発生もな
く、電極接続部２１を適切に表出させ取り出すことがで
きた。On the other hand, by adopting each of the above-described embodiments, the connection length of the electrode connection portion 21 can be secured to a desired length, and the electrode connection portion 21 can be connected without any dark spots. It was properly exposed and taken out.
【図１】本発明の第１実施形態に係る有機ＥＬ素子の製
造方法を示す工程図である。FIG. 1 is a process chart showing a method for manufacturing an organic EL device according to a first embodiment of the present invention.
【図２】本発明の第２実施形態に係る有機ＥＬ素子の製
造方法を示す工程図である。FIG. 2 is a process chart showing a method for manufacturing an organic EL device according to a second embodiment of the present invention.
【図３】本発明の第３実施形態に係る有機ＥＬ素子の製
造方法を示す工程図である。FIG. 3 is a process chart showing a method for manufacturing an organic EL device according to a third embodiment of the present invention.
【図４】本発明の第４実施形態に係る有機ＥＬ素子の製
造方法を示す工程図である。FIG. 4 is a process chart showing a method for manufacturing an organic EL device according to a fourth embodiment of the present invention.
２０…陽極、２１…電極接続部、２３…マスキングテー
プ、２４…ポリイミド（被覆材料）、２７…薄膜層、３
０…有機層、４０…陰極、５０…保護膜。Reference numeral 20: anode, 21: electrode connection part, 23: masking tape, 24: polyimide (coating material), 27: thin film layer, 3
0: organic layer, 40: cathode, 50: protective film.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 晴視 愛知県刈谷市昭和町１丁目１番地 株式会 社デンソー内 (72)発明者 伊藤 俊樹 愛知県刈谷市昭和町１丁目１番地 株式会 社デンソー内 Ｆターム(参考） 3K007 AB11 AB18 BA06 CA01 CB01 CC05 DA01 DB03 EA01 EB00 FA01 FA02 4K030 AA11 AA24 BA43 CA06 FA10 HA04 LA18 ────────────────────────────────────────────────── ─── Continued on the front page (72) Harumi Suzuki 1-1-1, Showa-cho, Kariya-shi, Aichi Prefecture Inside DENSO Corporation (72) Inventor Toshiki Ito 1-1-1, Showa-cho, Kariya-shi, Aichi Co., Ltd. F term in DENSO (reference) 3K007 AB11 AB18 BA06 CA01 CB01 CC05 DA01 DB03 EA01 EB00 FA01 FA02 4K030 AA11 AA24 BA43 CA06 FA10 HA04 LA18
Claims (7)
有機発光材料よりなる有機層（３０）、陰極（４０）を
積層してなる積層体（２０〜４０）を形成した後、この
積層体を被覆して保護する保護膜（５０）を成膜し、前
記陽極及び前記陰極のうち外部との接続を行う電極接続
部（２１）において前記保護膜を除去して、当該電極接
続部を表出させるようにした有機ＥＬ素子の製造方法に
おいて、 前記積層体を形成した後、前記保護膜を成膜する前に、
前記電極接続部を、前記保護膜が成膜されないように表
面改質することを特徴とする有機ＥＬ素子の製造方法。1. A laminate (20 to 40) formed by laminating an anode (20), an organic layer (30) made of an organic light emitting material including a light emitting layer, and a cathode (40) on a substrate, A protective film (50) for covering and protecting the laminate is formed, and the protective film is removed at an electrode connection part (21) for connection to the outside of the anode and the cathode, and the electrode connection is performed. In the method for manufacturing an organic EL element in which a portion is exposed, after forming the laminate, before forming the protective film,
A method for manufacturing an organic EL device, wherein a surface of the electrode connecting portion is modified so that the protective film is not formed.
Ｈ2Ｏを用いたＡＬＥ（アトミック・レイヤー・エピタ
キシー）法により形成されるものであり、 前記表面改質として非極性化または撥水化を行うことを
特徴とする請求項１に記載の有機ＥＬ素子の製造方法。2. The protective film (50) is formed by an ALE (atomic layer epitaxy) method using H 2 O as a film forming material, and is made nonpolar or repellent as the surface modification. The method for producing an organic EL device according to claim 1, wherein hydration is performed.
電極接続部（２１）の表面に紫外線照射を施し、極性化
または親水化させることを特徴とする請求項２に記載の
有機ＥＬ素子の製造方法。3. The organic material according to claim 2, wherein, after forming the protective film, the surface of the electrode connection portion is irradiated with ultraviolet rays to be polarized or hydrophilic. Manufacturing method of EL element.
有機発光材料よりなる有機層（３０）、陰極（４０）を
積層してなる積層体（２０〜４０）を形成した後、この
積層体を被覆して保護する保護膜（５０）を成膜し、前
記陽極及び前記陰極のうち外部との接続を行う電極接続
部（２１）において前記保護膜を除去して、当該電極接
続部を表出させるようにした有機ＥＬ素子の製造方法に
おいて、 前記積層体を形成した後、前記保護膜を成膜する前に、
前記電極接続部にマスキングテープ（２３）を貼り付
け、前記保護膜を成膜した後、前記マスキングテープと
ともに前記保護膜を除去することを特徴とする有機ＥＬ
素子の製造方法。4. A laminate (20 to 40) formed by laminating an anode (20), an organic layer (30) made of an organic light emitting material including a light emitting layer, and a cathode (40) on a substrate, A protective film (50) for covering and protecting the laminate is formed, and the protective film is removed at an electrode connection part (21) for connection to the outside of the anode and the cathode, and the electrode connection is performed. In the method for manufacturing an organic EL element in which a portion is exposed, after forming the laminate, before forming the protective film,
An organic EL device comprising: attaching a masking tape (23) to the electrode connection portion; forming the protective film; and removing the protective film together with the masking tape.
Device manufacturing method.
有機発光材料よりなる有機層（３０）、陰極（４０）を
積層してなる積層体（２０〜４０）を形成した後、この
積層体を被覆して保護する保護膜（５０）を成膜し、前
記陽極及び前記陰極のうち外部との接続を行う電極接続
部（２１）において前記保護膜を除去して、当該電極接
続部を表出させるようにした有機ＥＬ素子の製造方法に
おいて、 前記積層体を形成した後、前記保護膜を成膜する前に、
前記電極接続部を、前記有機層を構成する薄膜材料もし
くは前記陽極のエッジ部を被覆する材料と同一の材料で
被覆し、前記保護膜を成膜した後、前記電極接続部上の
被覆材料（２４）を前記保護膜とともに除去することを
特徴とする有機ＥＬ素子の製造方法。5. A laminate (20 to 40) formed by laminating an anode (20), an organic layer (30) made of an organic light emitting material including a light emitting layer, and a cathode (40) on a substrate, A protective film (50) for covering and protecting the laminate is formed, and the protective film is removed at an electrode connection part (21) for connection to the outside of the anode and the cathode, and the electrode connection is performed. In the method for manufacturing an organic EL element in which a portion is exposed, after forming the laminate, before forming the protective film,
After covering the electrode connection portion with the same material as the thin film material constituting the organic layer or the material covering the edge portion of the anode, and forming the protective film, a coating material on the electrode connection portion ( 24). A method for manufacturing an organic EL device, comprising removing step 24) together with the protective film.
（２４）を、前記保護膜（５０）と共に除去する方法
が、紫外線を用いたフォトエッチングであることを特徴
とする請求項５に記載の有機ＥＬ素子の製造方法。6. The method according to claim 5, wherein the method of removing the coating material on the electrode connection portion together with the protective film is photo-etching using ultraviolet rays. The method for producing the organic EL device according to the above.
有機発光材料よりなる有機層（３０）、陰極（４０）を
積層してなる積層体（２０〜４０）を形成した後、この
積層体を被覆して保護する保護膜（５０）を成膜し、前
記陽極及び前記陰極のうち外部との接続を行う電極接続
部（２１）において前記保護膜を除去して、当該電極接
続部を表出させるようにした有機ＥＬ素子の製造方法に
おいて、 前記積層体を形成した後、前記保護膜を成膜する前に、
前記電極接続部の表面を、前記電極接続部と密着力の小
さい薄膜層（２７）にて被覆しておき、前記保護膜を成
膜した後、前記電極接続部上の前記薄膜層を前記保護膜
と共に剥離させることを特徴とする有機ＥＬ素子の製造
方法。7. A laminate (20 to 40) formed by laminating an anode (20), an organic layer (30) made of an organic light emitting material including a light emitting layer, and a cathode (40) on a substrate, A protective film (50) for covering and protecting the laminate is formed, and the protective film is removed at an electrode connection part (21) for connection to the outside of the anode and the cathode, and the electrode connection is performed. In the method for manufacturing an organic EL element in which a portion is exposed, after forming the laminate, before forming the protective film,
After the surface of the electrode connection portion is covered with a thin film layer (27) having a small adhesion to the electrode connection portion, the protective film is formed, and then the thin film layer on the electrode connection portion is protected. A method for manufacturing an organic EL device, comprising peeling off an organic EL element together with a film.
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