JP2002148424A - Method for manufacturing color filter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent withdrawing of dust or breaking in TFTs in a COA(color filter on array) or HA(high aperture) method by suppressing the charge amount in a laminated body. SOLUTION: The method for manufacturing a color filter includes a process of forming a laminated body to tightly adhering a photosensitive transfer material having at least a photosensitive resin layer on a temporary supporting body to the surface of a substrate with the substrate surface in contact with the photosensitive resin layer so as to obtain a laminated body, a peeling process to peel the temporary supporting body from the laminated body, and an exposure and development process to form a color filter on the substrate surface by exposing and developing the photosensitive resin layer. In the peeling process, the temporary supporting body is peeled while the substrate side of the laminated body is held by a spot-like or linear substrate holding means and while the peeling part and its surrounding region between the photosensitive resin layer and the temporary supporting body are subjected to static eliminating treatment by a discharging apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a color filter used in a liquid crystal display device, and more particularly to a method for manufacturing a color filter by a transfer method using a photosensitive transfer material.

[0002]

2. Description of the Related Art Generally, a liquid crystal display device for displaying a color image has a structure in which a color filter is provided on one surface of two transparent substrates provided in the liquid crystal display device. The color filter has a configuration in which a layer made up of a large number of colored pixels arranged in an orderly manner in both the vertical and horizontal directions via a minute gap is provided on a transparent substrate. A large number of colored pixels are usually colored in any one of three colors of R (red), G (green), and B (blue), and each of the RGB colored pixels is combined with a certain pattern to form a colored pixel. Is composed.

As a method for manufacturing such a color filter, various methods such as a method of applying a colored resist with a spinner or a roll coater, exposing and developing to form a pixel, an electrodeposition method, and a transfer method are known. A transfer method using a photosensitive resin sheet (photosensitive transfer material) has attracted attention because a highly accurate color filter can be easily manufactured. For example, in a transfer method using a photosensitive resin sheet in a method for manufacturing a color filter, first, a photosensitive colored resin layer (photosensitive resin layer) composed of a colored material (pigment or dye) of a predetermined color and a photosensitive resin is used. ) Is prepared on a flexible support sheet (temporary support) to produce a predetermined number of photosensitive resin sheets (normally, three sheets of R, G, and B). Next, one photosensitive resin sheet is
With the photosensitive colored resin layer facing downward, the photosensitive colored resin layer is laminated on a transparent substrate (a glass plate or the like) while heating using a heating roll, and then the support sheet is peeled off to form a photosensitive colored resin layer on the transparent substrate. Transcribe.

[0004] Then, in this state, the surface of the photosensitive colored resin layer is irradiated with light through a sheet-shaped photomask having a pixel pattern portion opened to expose the photosensitive colored resin layer in a pattern. Thereafter, development processing is performed to form a colored pixel pattern of one color on the transparent substrate. Furthermore, by using a photosensitive resin sheet having a photosensitive colored resin layer of another color on the substrate surface on which the colored pixel pattern is formed, the transfer, exposure and development are sequentially performed in the same manner, so that the multicolor colored pixel pattern is formed. Can be formed. Note that R
Recently, in order to improve color separation between multicolored pixels such as GB, a gap is provided between each pixel and a photosensitive black resin is embedded (a so-called black matrix is formed).

When a color filter is manufactured by the above-described transfer method, conventionally, the substrate is bonded to the surface of a substrate while holding the substrate on a metal table or a resin table in which holes and grooves for vacuum suction are formed. The end of the support sheet of the photosensitive resin sheet, which is in close contact with the photosensitive resin sheet, is grasped, and the support sheet is peeled from the substrate surface by moving the grasped chuck and / or table.
However, the substrate may be charged by static electricity generated when the support sheet is peeled off or when the substrate after peeling the support sheet is transferred to the next step. Dust existing around the substrate is attracted to and adheres to the charged substrate surface, and if exposed or developed as it is, the dust adhering at the time of exposure will block light, so the resist pattern formed This causes various problems such as the occurrence of defects such as pinholes.

As a method for solving this problem, Japanese Patent Laid-Open No.
No. 35200 discloses that the surface electrical resistance of the temporary support is 1
It is disclosed that it is suppressed to 0 ¹³ Ω / cm ² or less. By suppressing the surface electric resistance of the temporary support, the charge of the photosensitive colored resin layer is reduced, and in most cases, the trouble caused by the charge can be eliminated. However, when a combination of a substrate and a photosensitive resin sheet that generates a larger charge is selected, the means described in the above document does not sufficiently reduce the charge amount, and may not be able to solve the problem caused by the charge. is there.

Further, US Pat. No. 5,641,974 discloses a method of forming an insulating transparent resin structure on a TFT array substrate in order to realize a high aperture (HA) liquid crystal display. I have. Further, US Pat. No. 5,994,721 discloses a color filter which realizes aperture efficiency by forming an insulating color filter on the TFT array substrate side.
An array (COA) type liquid crystal display is disclosed. After the photosensitive resin sheet is bonded to the surface of the TFT array substrate and pressed and laminated (laminated), the discharge of the charge when the support sheet of the photosensitive resin sheet is peeled off may cause a discharge breakdown of the TFT array. There is also.

[0008] Since these problems due to the charged charges cause a reduction in the production yield of the color filter, it is desired to suppress the charge between the support sheet and the photosensitive resin layer during peeling as low as possible.

[0009]

SUMMARY OF THE INVENTION Accordingly, the present invention relates to a method for producing a color filter by a transfer method using a photosensitive resin sheet (photosensitive transfer material). From the laminate
A color filter capable of significantly reducing static electricity generated when the support sheet (temporary support) of the photosensitive resin sheet is peeled off and when the laminate after peeling the support sheet is transferred to the next step. It is an object of the present invention to provide a method for producing the same.

[0010]

The above object is achieved by the present invention described below. That is, the present invention provides a laminate in which a photosensitive transfer material having at least a photosensitive resin layer provided on a temporary support is brought into close contact with the surface of a substrate such that the surface of the substrate and the photosensitive resin layer are in contact with each other. Obtaining a laminate forming step, a peeling step of peeling the temporary support from the laminate, and an exposing and developing step of forming a color filter on the surface of the substrate by exposing and developing the photosensitive resin layer. And a method for manufacturing a color filter, comprising: in the peeling step, holding the substrate side of the laminate by a dot-shaped or linear substrate holding means, and further comprising the photosensitive resin layer by a static eliminator. A method for manufacturing a color filter, wherein the temporary support is peeled off while performing a static elimination treatment on a peel portion with the temporary support or a peripheral portion thereof.

According to the present invention, when the temporary support of the photosensitive transfer material is peeled off from the laminate, the substrate side of the laminate is held by a dot-like or linear substrate holding means. Further, by performing a static elimination treatment by a static eliminator on a peel portion or a peripheral portion of the photosensitive resin layer and the temporary support, charging at the time of peeling the temporary support from the laminate,
In addition, it is possible to effectively suppress electrification when transferring the laminate from the substrate holding means.

Preferably, the substrate holding means is insulative. By making the substrate holding means insulative, it is possible to suppress the occurrence of a counter charge corresponding to the charge generated on the surface of the laminate.

Further, it is preferable that the static eliminator performs a static elimination process by applying an ion wind to the peel portion or a peripheral portion thereof. By performing the charge removal treatment using the ion wind, the effect of reducing the charge amount can be further improved.

Further, it is preferable that a gap between the peeling portion to be exposed to the ion wind or a peripheral portion thereof and the static eliminator is kept substantially constant. By keeping the gap between the peel portion or its peripheral portion and the static eliminator substantially constant, the effect of reducing the charge amount can be kept uniform.

Further, the configuration of the present invention is particularly suitable when the substrate is a TFT array substrate.

Further, when the temporary support is peeled off, it is preferable to perform a static elimination treatment not only on the peeled portion or its peripheral portion, but also on the surface of the laminate on the substrate side, thereby further improving the effect of reducing the charge amount. Can be.

Further, in order to sufficiently hold the laminate when the temporary support is peeled off, it is preferable that the substrate holding means has a vacuum suction means.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described first with respect to the photosensitive transfer material and the substrate, and further, a method of manufacturing a color filter will be described in detail with reference to the drawings.

[Photosensitive Transfer Material] The photosensitive transfer material of the present invention will be described. In the present invention, the photosensitive transfer material is one in which at least a photosensitive resin layer is provided on a temporary support, and if necessary, a thermoplastic resin layer, an oxygen barrier layer, or the like, on the surface of the temporary support. And a photosensitive resin layer are laminated in this order. Further, a protective layer may be formed on the photosensitive resin layer for the purpose of protecting the photosensitive resin layer during storage.

<Temporary support> The temporary support is made of a substance that is flexible, has good releasability from a photosensitive resin layer or the like, and is chemically and thermally stable. Is preferred. Specifically, a film of Teflon (registered trademark), polyethylene terephthalate, polycarbonate, polyethylene, polypropylene, or the like, or a laminate thereof is preferable. The thickness of the temporary support is 5 to 300 μm.
m is appropriate, and particularly preferably 20 to 150 μm. When the thickness of the temporary support is smaller than the above range, wrinkles are likely to occur when the photosensitive transfer material is bonded to the substrate to be transferred, and when the thickness is larger than the above range, sheet cutting of the photosensitive transfer material is performed. It is easy to generate garbage at times.

In order to further improve the effect of the present invention, the surface electrical resistance of the temporary support is preferably 10 ¹³ Ω / c.
m ² or less, more preferably 10 ¹² Ω / cm ² or less. Surface electric resistance value is 10 ¹³ Ω /
cm ² or less, a temporary support formed of a synthetic resin containing a conductive material, a temporary support containing a conductive material only in a portion near the surface, 10 A temporary support in which a conductive layer (conductive layer) is laminated on at least one surface of a temporary support body having a surface electric resistance value of greater than ¹³ Ω / cm ² ; Any form such as a support may be used.

As the synthetic resin for forming the temporary support, a chemically and thermally stable synthetic resin conventionally used as a temporary support material for a photosensitive transfer material, preferably a thermoplastic resin, is used. Particularly preferred are polyethylene terephthalate, polycarbonate and the like.

The conductive material to be contained in the temporary support is not particularly limited and may be a material known per se. Particularly preferred are fine particles of a conductive metal oxide and an antistatic agent. The conductive metal oxide fine particles and the antistatic agent may each be a single component or a mixture. Also, fine particles of conductive metal oxide and an antistatic agent may be used in combination.

Preferred examples of the conductive metal oxide include at least one selected from zinc oxide, titanium oxide, tin oxide, aluminum oxide, indium oxide, silicon oxide, magnesium oxide, barium oxide, molybdenum oxide and the like. And / or fine particles mainly composed of a composite oxide thereof. The fine particles of the conductive metal oxide preferably have a volume resistivity of 10 ⁷ Ω · cm or less, particularly 10 ⁵ Ω · cm or less.
It is preferably 0.7 μm, particularly preferably 0.02 to 0.5 μm.

The method for producing the fine particles of the conductive metal oxide is described in detail, for example, in JP-A-56-143430. Briefly, first, a metal oxide fine particle is produced by firing, and a heat treatment is performed in the presence of a heteroatom for improving conductivity. There is a method of coexisting different kinds of atoms for improvement, and a third method of introducing oxygen defects by lowering the oxygen concentration in the atmosphere when producing fine metal particles by firing.

Examples of the heteroatoms contained in the conductive metal oxide include, for example, Al, In, etc.
Nb, Ta, etc. for iO ₂ , S for SnO ₂
b, Nb, a halogen element and the like. The addition amount of the hetero atom is preferably in the range of 0.01 to 30 mol%,
A range of from 10 to 10 mol% is particularly preferred.

Preferred examples of the antistatic agent include alkyl phosphates (for example, Electrostripper A of Kao Corporation, Eleanon No19 of Daiichi Kogyo Seiyaku Co., Ltd.) as anionic surfactants, and amphoteric surfactants. Betaine-based agents (for example, Amogen K of Daiichi Kogyo Seiyaku Co., Ltd.) and polyoxyethylene fatty acid ester-based agents (for example, Nitsan Nonion L of Nippon Oil & Fats Co., Ltd.) Oxyethylene alkyl ethers (for example, Emulgens 106 and 12 of Kao Corporation)
0, 147, 420, 220, 905, 910, Nitsan Nonion E, manufactured by NOF Corporation, etc.). In addition, surfactants such as polyoxyethylene alkylphenol ethers, polyhydric alcohol fatty acid esters, polyoxyethylene sorbitan fatty acid esters, and polyoxyethylene alkylamines are also useful as nonionic surfactants.

Further, from the viewpoint of releasability, the temporary support may be subjected to various known release treatments. Further, in order to improve the slipperiness, or to prevent the photosensitive resin layer from inadvertently adhering to the backside of the temporary support, the backside of the temporary support contains a known fine particle-containing slip composition or a silicone compound. It is also useful to apply a releasing agent composition or the like to be applied.

Further, as described above, in order to further improve the effect of the present invention, a temporary support provided with a conductive layer may be used. In this case, it is not necessary to particularly consider the surface electric resistance value of the temporary support body (a member excluding the conductive layer of the temporary support), and it does not matter whether it is 10 ¹³ Ω / cm ² or less. Good. The conductive layer is a layer containing a conductive material and a binder or a polymer.
The conductive material is not particularly limited, but fine particles of a conductive metal oxide which can be contained in the temporary support are particularly preferable.

The content of the conductive metal oxide fine particles in the conductive layer is preferably such that the surface electrical resistance of the temporary support containing the conductive layer is 10 ¹³ Ω / cm ² or less. It depends on the conductive metal oxide, the binder or the polymer, the electric resistance value of the temporary support body, the thickness of the conductive layer and the temporary support body, etc., but generally 0.05 g.
/ M ^{2 to 20} g / m ² , preferably 0.1 g / m ²
It is particularly preferably m ^{2 to} 10 g / m ² .

Examples of the binder contained in the conductive layer include cellulose esters such as gelatin, cellulose nitrate, cellulose triacetate, cellulose diacetate, cellulose acetate butyrate, and cellulose acetate propionate; vinylidene chloride, vinyl chloride , Styrene, acrylonitrile, vinyl acetate, homopolymers or copolymers of monomers including alkyl (preferably an alkyl group having 1 to 4 carbon atoms) acrylate, vinylpyrrolidone, and the like; soluble polyesters, polycarbonates, soluble polyamides, and the like.

As the polymer to be contained in the conductive layer,
A polymer arbitrarily selected from a thermoplastic resin, a binder described above, and other thermoplastic resins that can be used as a material of the temporary support body can be used. The formation of the conductive layer, for example, a conductive layer forming coating solution in which conductive fine particles are dispersed in a binder as necessary, for example, on the surface of the temporary support body, roller coating, air knife coating, A method of applying a gravure coat, a bar coat, a curtain coat, or the like, followed by drying;
A method in which an undercoat layer as described below is provided on the surface of the temporary support body and conductive fine particles are adhered thereon; a composition of the conductive fine particles and the polymer is co-extruded when the temporary support body is extruded. By providing a conductive layer on the temporary support main body. In particular, the method of providing the conductive layer by co-extrusion is preferable because a conductive layer having excellent adhesion and scratch resistance can be formed, and it is not necessary to provide a hydrophobic polymer layer as described later.

In dispersing the conductive particles in a binder for preparing a coating solution for forming a conductive layer, a dispersant such as a titanium-based dispersant or a silane-based dispersant may be added to the coating solution. Good. Further, a binder crosslinking agent or the like may be added as necessary. Examples of titanium-based dispersants include U.S. Pat. Nos. 4,069,192 and 4,084.
And titanate-based coupling agents and Plenact (trade name: manufactured by Ajinomoto Co., Inc.) described in Japanese Patent No. 0,353 and the like. Examples of the silane-based dispersant include vinyltrichlorosilane, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-glycidoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, and the like. As the "silane coupling agent", those commercially available from Shin-Etsu Chemical Co., Ltd. and the like can also be used. Examples of the binder crosslinking agent include an epoxy-based crosslinking agent, an isocyanate-based crosslinking agent, an aziridine-based crosslinking agent, and an epoxy-based crosslinking agent.

When the conductive layer is provided on the surface opposite to the surface on which the thermoplastic resin layer or the like is provided,
In order to improve the scratch resistance, it is preferable to further provide a hydrophobic polymer layer on the conductive layer. In this case, the hydrophobic polymer layer can be formed by applying and drying an organic solvent solution or an aqueous latex of the hydrophobic polymer. The coating amount of the hydrophobic polymer is preferably about 0.05 g / m ² to ¹ g / m ^{2 in} terms of dry weight.

Examples of the hydrophobic polymer include vinyl polymers produced from monomers including cellulose esters (eg, nitrocellulose, cellulose acetate), vinyl chloride, vinylidene chloride, vinyl acrylate, etc .; organic solvent-soluble polyamides, polyesters, etc. Polymers may be mentioned. In the hydrophobic polymer layer, a slip agent for imparting a slip property, for example, JP-A-55-79435
It does not matter if an organic carboxylic acid amide or the like as described in JP-A No. 9-264 is added, and there is no problem in adding a matting agent or the like. Even if such a hydrophobic polymer layer is provided, the effect of the conductive layer is not substantially affected.

The photosensitive transfer material of the present invention is disclosed in JP-A-56-82504 and JP-A-56-82504.
JP-A-143443, JP-A-57-104931, JP-A-57-118242, and JP-A-58-6
No. 2,647, JP-A-60-258541, etc., a temporary support provided with a conductive layer can also be used as appropriate.

When the temporary support is composed of the temporary support body and the conductive layer, the thickness of the conductive layer is 0.01 to 10 μm.
Is preferable. The conductive layer may be provided on the surface of the temporary support on the side where the thermoplastic resin layer or the like is provided, or may be provided on both surfaces of the temporary support body.

<Photosensitive resin layer> The photosensitive resin layer is prepared by coating a coating solution containing at least a photosensitive resin composition and a coloring agent (a coating solution for a photosensitive resin layer) by a known coating method. It is formed by coating on top. The photosensitive resin layer,
It is a colored layer containing a photosensitive resin composition and a colorant, and is preferably a resin layer that is softened or fluidized by heat or pressure. Specifically, it is preferable to have a transferability exhibiting thermoplasticity having softness or tackiness at a temperature of at least 150 ° C. or less, and is cured when irradiated with light, while an unirradiated portion is easily exposed to an alkaline solution. It is preferable to be soluble and have resist properties. Most layers of known photopolymerizable compositions have this property. Further, these layers can be further modified by adding a thermoplastic resin or a compatible plasticizer.

As the photosensitive resin composition, for example, all those described in JP-A-3-282404 can be used. For example, a photosensitive resin composition comprising a negative-type diazo resin and a binder, a photosensitive resin composition, Examples thereof include a polymerizable composition, a photosensitive resin composition comprising an azide compound and a binder, and a cinnamic acid-type photosensitive resin composition. Above all, a photosensitive resin composition containing an alkali-soluble binder polymer, a monomer having an ethylenically unsaturated double bond that undergoes addition polymerization upon irradiation with light, and a photopolymerization initiator is preferable, and in the present invention, the photosensitive resin A photosensitive resin layer containing a composition and a colorant is particularly preferred.

As the alkali-soluble binder polymer, a polymer having a carboxylic acid group in a side chain, for example, JP-A-59-44615, JP-B-54-34.
JP-A-327, JP-B-58-12577, JP-B-54-25957, JP-A-59-53836, and JP-A-59-71048, methacrylic acid copolymers and acrylic acid Copolymer, itaconic acid copolymer, crotonic acid copolymer, maleic acid copolymer,
A partially esterified maleic acid copolymer may be used. Further, a cellulose derivative having a carboxylic acid group in a side chain can also be mentioned.

In addition to the above, those obtained by adding a cyclic acid anhydride to a polymer having a hydroxyl group are also suitable. Particularly, a copolymer of benzyl (meth) acrylate and (meth) acrylic acid or a multi-component copolymer of benzyl (meth) acrylate and (meth) acrylic acid and other monomers described in US Pat. No. 4,139,391. Can be mentioned.

When the above alkali-soluble binder polymer is used, 50 to 300 mg KOH /
It is preferable to select and use those having an acid value in the range of g and a mass average molecular weight in the range of 1,000 to 300,000.

In addition to the above-described alkali-soluble binder polymer, an alkali-insoluble polymer can be added for the purpose of improving various performances, for example, the strength of the cured film, as long as it does not adversely affect the developability and the like. Such polymers include alcohol-soluble nylon or epoxy resins.

The total content of the alkali-soluble polymer and, if necessary, the alkali-insoluble polymer with respect to the total solid content of the photosensitive resin composition is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass. . If the content is less than 10% by mass, the adhesiveness of the photosensitive resin layer may be too high. If the content is more than 95% by mass, the formed image is inferior in strength and light sensitivity. There is.

The monomer having an ethylenically unsaturated double bond that undergoes addition polymerization upon irradiation with light has at least one addition-polymerizable ethylenically unsaturated group in the molecule and has a boiling point of 100 at normal pressure. Compounds at a temperature of at least ° C. For example, monofunctional acrylates and monofunctional methacrylates such as polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, and phenoxyethyl (meth) acrylate;

Polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, trimethylolethane triacrylate, trimethylolpropane triacrylate, trimethylolpropane diacrylate, neopentyl glycol di (meth) acrylate, pentaerythritol tetra ( (Meth) acrylate, pentaerythritol tri (meth)
Acrylate, dipentaerythritol hexa (meth)
Acrylate, dipentaerythritol penta (meth)
Acrylate, hexanediol di (meth) acrylate, trimethylolpropane tri (acryloyloxypropyl) ether, tri (acryloyloxyethyl) isocyanurate, tri (acryloyloxyethyl) cyanurate, glycerin tri (meth) acrylate; trimethylolpropane and glycerin And polyfunctional acrylates and polyfunctional methacrylates, such as those obtained by adding propylene oxide to ethylene oxide to a polyfunctional alcohol such as (meth) acrylated.

Further, Japanese Patent Publication No. 48-41708, Japanese Patent Publication No. 50-6034, and Japanese Patent Application Laid-Open No. 51-3719.
Urethane acrylates described in JP-A No. 3;
Polyester acrylates described in JP-A-64183, JP-B-49-43191 and JP-B-52-30490; polyfunctional acrylates such as epoxy acrylates which are reaction products of an epoxy resin and (meth) acrylic acid; Methacrylates are also included. Among them, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and dipentaerythritol penta (meth) acrylate are preferable.

The monomer having an ethylenically unsaturated double bond which undergoes addition polymerization upon irradiation with light may be used alone or as a mixture of two or more. Further, the content of the monomer with respect to the total solid content of the photosensitive resin composition is 5
The content is generally from 50 to 50% by mass, and particularly preferably from 10 to 40% by mass. If the content is less than 5% by mass, the photosensitivity and the strength of the image may be reduced. If the content is more than 50% by mass, the adhesiveness of the photosensitive resin layer may be excessive, which is not preferable.

As the above-mentioned photopolymerization initiator, US Pat.
U.S. Pat. No. 2,672,512, a vicinal polyketaldonyl compound described in US Pat. No. 3,676,660, an acyloin ether compound described in U.S. Pat.
Patent No. 3,049,127 and No. 2,951,758, polynuclear quinone compounds described in U.S. Pat. Nos. 3,046,127 and 2,951,758, and U.S. Pat. No. 3,549,367. A combination of a triarylimidazole dimer and a p-aminoketone, a benzothiazole compound and a trihalomethyl-s-triazine compound described in JP-B-51-48516, and a trihalomethyl compound described in U.S. Pat. No. 4,239,850. -S-triazine compounds, U.S. Pat. No. 421
No. 2976, for example, a trihalomethyloxadiazole compound.

Of these, trihalomethyl-s-triazine, trihalomethyloxadiazole and triarylimidazole dimer are particularly preferred. The content of the photopolymerization initiator based on the total solid content of the photosensitive resin composition is generally 0.5 to 20% by mass, and particularly preferably 1 to 15% by mass.
% By mass is preferred. If the content is less than 0.5% by mass, the light sensitivity and the strength of the image may be lowered, and even if added in excess of 20% by mass, no effect on the performance improvement is recognized.

As the coloring agent (coloring material), pigments of red, green and blue, which are colors constituting a color filter, are generally used. Preferred examples thereof include carmine 6B (CI. 12490), phthalocyanine green (CI. 74260), phthalocyanine blue (CI. 74160) and the like.

The specific content of the coloring agent in the photosensitive resin layer depends on the target chromaticity and the like, but is preferably 2 to 50% by mass of the solid content of the photosensitive resin layer.
45 mass% is more preferable.

The photosensitive resin layer may contain the following other components in addition to the above components. It is particularly preferable that the photosensitive resin layer contains a thermal polymerization inhibitor. Examples of the thermal polymerization inhibitor include hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol, t-butylcatechol, benzoquinone, and 4,4′-.
Thiobis (3-methyl-6-t-butylphenol),
2,2'-methylenebis (4-methyl-6-t-butylphenol), 2-mercaptobenzimidazole, phenothiazine and the like. Further, in the photosensitive resin layer, as a known additive, for example, a plasticizer, a surfactant,
A solvent or the like can be added.

The photosensitive resin layer is prepared by dissolving or dispersing the photosensitive resin composition and a colorant in a solvent on a temporary support, or by preparing a solution or dispersion (a coating solution for a photosensitive resin layer). After application, it can be formed by drying. The thickness of the photosensitive resin layer is generally preferably from 0.5 to 3 μm, and usually about 2 μm.

Further, when a thermoplastic resin layer or an intermediate layer (such as an oxygen blocking layer) is provided, first, a coating liquid (a coating liquid for a thermoplastic resin layer) formed by dissolving a thermoplastic resin in an organic solvent is temporarily supported. Coating and drying on the body to form a thermoplastic resin layer, then preparing a coating solution (a coating solution for an intermediate layer) using a solvent that does not dissolve the thermoplastic resin layer, and coating and drying the intermediate layer Are laminated. Next, a coating solution for a photosensitive resin layer is prepared using an organic solvent that does not dissolve the intermediate layer, and is further coated and dried on the intermediate layer to form a photosensitive resin layer. On the surface of the photosensitive resin layer, a protective layer such as a film made of polypropylene or the like may be further provided. The protective layer is peeled off before the photosensitive transfer material is laminated on the substrate.

<Thermoplastic resin layer> The above-mentioned thermoplastic resin layer is provided for the purpose of preventing air bubbles from being mixed at the time of transfer, and mainly contains an alkali-soluble thermoplastic resin. May be included. As the thermoplastic resin, those having a substantial softening point of 80 ° C. or less are preferable. Examples of the alkali-soluble thermoplastic resin having a softening point of 80 ° C. or lower include a saponified product of ethylene and an acrylate copolymer, a saponified product of styrene and a (meth) acrylate copolymer, and vinyltoluene and ) A saponified product with an acrylate copolymer, a poly (meth) acrylate, and a saponified product of butyl (meth) acrylate with a (meth) acrylate copolymer such as vinyl acetate. The thermoplastic resins may be used alone or in combination of two or more.

Further, organic materials having a softening point of about 80 ° C. or less described in “Plastic Performance Handbook” (edited by the Japan Plastics Industry Federation, All Japan Plastics Molding Federation, published by the Industrial Research Council, issued on October 25, 1968). Among the polymers, those soluble in an alkaline aqueous solution can be used.

Further, even if the organic polymer substance has a softening point of 80 ° C. or higher, various plasticizers compatible with the organic polymer substance are added to the organic polymer substance to substantially reduce the organic polymer substance. The softening point can be lowered to 80 ° C. or lower.
In the organic polymer material, for the purpose of adjusting the adhesive force with the temporary support, various polymers and supercooled substances, an adhesion improver, a surfactant, within a range where the substantial softening point does not exceed 80 ° C.
A release agent or the like can be added.

Preferred examples of the plasticizer include polypropylene glycol, polyethylene glycol, dioctyl phthalate, diheptyl phthalate, dibutyl phthalate, tricresyl phosphate, cresyl diphenyl phosphate, biphenyl diphenyl phosphate and the like. .

The thermoplastic resin layer is prepared by dissolving a thermoplastic resin and, if necessary, other components in an organic solvent to prepare a coating liquid (a coating liquid for a thermoplastic resin layer), and temporarily supporting the coating liquid by a known coating method. It can be formed by coating or the like on the body.
Examples of the organic solvent include methyl ethyl ketone and 1-methoxy-2-propanol.

The thickness of the thermoplastic resin layer is 6 μm.
m or more is preferable. When the layer thickness is less than 6 μm, 1 μm
In some cases, it may be difficult to completely absorb the irregularities of the underlayer of m or more. The upper limit is generally about 100 μm or less from the viewpoint of developability and manufacturing suitability, and is about 50 μm or less.
The following is preferred.

<Intermediate Layer> As the above-mentioned intermediate layer, it is preferable to provide an oxygen barrier layer or the like. The oxygen barrier layer, the purpose of preventing the diffusion of oxygen from the air that inhibits the photo-curing reaction in the photosensitive resin layer during pattern exposure, and the layer when the thermoplastic resin layer is provided It is provided for the purpose of preventing the photosensitive resin layer from mixing with each other.

The oxygen barrier layer is mainly composed of a resin component which can be dispersed and dissolved in water or an aqueous alkali solution.
If necessary, other components such as a surfactant may be included. The resin component constituting the oxygen barrier layer can be appropriately selected from known ones.
No. 2121 and JP-B-56-40824, polyvinyl ether / maleic anhydride polymer, water-soluble salts of carboxyalkyl cellulose, water-soluble cellulose ethers, water-soluble salts of carboxyalkyl starch, polyvinyl alcohol, polyvinyl pyrrolidone, Water-soluble salts of the group consisting of various polyacrylamides, various water-soluble polyamides, water-soluble salts of polyacrylic acid, gelatin, ethylene oxide polymers, various starches and the like, styrene / maleic acid copolymers, maleates Resins and those obtained by combining two or more of them are exemplified.

Among them, a combination of polyvinyl alcohol and polyvinyl pyrrolidone is particularly preferred. Further, the polyvinyl alcohol has a saponification rate of 80.
% Or more is preferable. The content of the polyvinyl pyrrolidone is 1 to 75% of the solid volume of the intermediate layer.
Is preferable, more preferably 1 to 60%, and most preferably 10 to 50%. If the solid volume is less than 1%, sufficient adhesion to the curable resin layer may not be obtained, and if it exceeds 75%,
Oxygen barrier ability may decrease.

When the oxygen-blocking ability of the oxygen-blocking layer is lowered, the polymerization sensitivity of the curable resin layer is lowered, so that it is necessary to increase the amount of light at the time of exposure or to lengthen the exposure time, as well as to increase the resolution. Therefore, the oxygen permeability is preferably small.

The oxygen barrier layer is formed by dissolving and dispersing a resin component and the like in an aqueous solvent to prepare a coating solution (coating solution for an oxygen barrier layer), and applying the solution on a temporary support by a known coating method. can do. Examples of the aqueous solvent include a solvent containing water such as distilled water as a main component, and a solvent or a salt having an affinity for water such as an alcohol, if desired, as long as the effects of the present invention are not impaired.

The thickness of the oxygen barrier layer is about 0.1
To 5 μm, more preferably 0.5 to 2 μm.
When the layer thickness is less than about 0.1 μm, the oxygen permeability is too high, and the polymerization sensitivity of the curable resin layer may be reduced. It may be necessary.

<Protective Layer> It is preferable to provide a protective layer on the photosensitive resin layer for protecting the photosensitive resin layer from contamination and damage when storing the photosensitive transfer material. The protective layer may be made of the same or similar material as the synthetic resin constituting the temporary support, but it is necessary that the protective layer can be easily separated from the photosensitive resin layer. Suitable protective layers are, for example, silicone-coated paper, polyolefin or polytetrafluoroethylene sheets or films. The thickness of the protective layer is preferably about 5 to 100 μm. Particularly preferably, the protective layer is a polyethylene film or a polypropylene film having a thickness of 10 to 30 μm. In the photosensitive transfer material of the present invention, a protective layer may be omitted, but handling, transportation,
It is preferably provided for safety during storage.

[Substrate] In the present invention, as the substrate on which the color filter is formed, for example, a transparent substrate is used, and a soda glass plate having a silicon oxide film on the surface is used.
Known glass plates such as low expansion glass, non-alkali glass, and quartz glass plate, and plastic films can be used.

Further, according to the structure of the present invention, in particular, the substrate
It is suitable for a TFT array substrate. In a TFT array, a discharge with a relatively small charge amount may cause a discharge breakdown. Therefore, it is extremely effective to suppress the charge amount by applying the configuration of the present invention.

As a TFT array substrate applied to the present invention, a conventionally known TFT array substrate can be mentioned.
Above all, in order to realize an HA type liquid crystal display described in US Pat. No. 5,641,974, TF is used.
A TFT array substrate in which an insulating transparent resin structure is further formed on a T array substrate, or a TFT array substrate used in a COA type liquid crystal display realizing a high aperture ratio described in US Pat. No. 5,994,721. It is particularly effective to apply the present invention.

[Production Method of Color Filter] The production method of the color filter of the present invention includes a laminate forming step, a peeling step, and an exposure / development step. If necessary, the protective layer is peeled off before the laminate forming step. A process is performed. Hereinafter, the method for producing the color filter of the present invention will be described for each step.

<Laminate Forming Step> First, when a photosensitive transfer material provided with a protective layer is used, the protective layer is removed in advance, and the photosensitive resin layer is heated, and if necessary, pressurized together. Then, the photosensitive resin layer is attached to and adhered to the surface of the substrate to be transferred so that the surface of the substrate and the photosensitive resin layer are in contact with each other to form a laminate. A conventionally known laminating apparatus or vacuum laminating apparatus can be used for lamination. In addition, it is also possible to use an auto cut laminator device to further increase the productivity.

<Peeling Step> Next, the temporary support is peeled from the laminate obtained in the laminate forming step. In the present invention, in the peeling step, the laminate is placed on a substrate side (hereinafter, referred to as a “substrate holding unit”) of the laminate using a point-like or linear substrate holding means (hereinafter sometimes simply referred to as “substrate holding means”). The temporary support may be peeled off while applying a static elimination process to a peel portion between the photosensitive resin layer and the temporary support or a peripheral portion thereof by using a static eliminator. It is characterized by. The static elimination process can be performed by appropriately selecting a known static eliminator. However, it is preferable that the ion elimination process described below is applied from the static eliminator to the peel portion and its peripheral portion to perform the static elimination process.

The peeling step will be described with reference to the drawings. FIG. 1 is a perspective view showing a state where a temporary support is peeled from the laminate, and FIG. 2 is a schematic sectional view thereof.
First, the photosensitive transfer material 10 having the photosensitive resin layer 12 provided on the surface of the temporary support 11 is placed on the surface of the substrate 13 by the substrate 13.
The laminate 17 obtained by bringing the photosensitive resin layer 12 into close contact with the surface of the substrate is placed on the substrate holding member 20 such that the substrate 13 is in contact with the substrate holding member 20.
The substrate holding member 20 is a point-like or linear substrate holding means, which will be described later in detail.

The temporary support 11 from one side of the laminate 17
Are peeled off so as to be turned in the direction of arrow C.
Although illustration of the peeling means is omitted, the back surface of the temporary support 11 (the surface opposite to the side on which the photosensitive resin layer 12 is provided) may be captured by a suction cup or the like, and may be turned. The sheet may be wound around a peeling roll. Then, the temporary support 11 is sequentially peeled off from the photosensitive resin layer 12,
The peel portion (peeling portion) 21 between the photosensitive resin layer 12 and the temporary support 11 advances in the direction of arrow A.

FIGS. 1 and 2 show the photosensitive transfer material 10 in a state where the thermoplastic resin layer and the intermediate layer such as the oxygen oblique layer are not provided. It may be something. Even when a thermoplastic resin layer or an intermediate layer is provided, these layers remain on the photosensitive resin layer side, and only the temporary support is peeled off. Therefore, in the peeling step in the present invention, the "photosensitive resin layer"
In such a case, the interpretation should include the thermoplastic resin layer and the intermediate layer.

In the present invention, the peel portion 21 between the photosensitive resin layer 12 and the temporary support 11 or its peripheral portions 22 and 23
The point is that the temporary support 11 is peeled off while applying the ion wind 16 by the neutralizer 14. Peel part 21
By applying the ion wind 16 to the peripheral portions 22 and 23 by the static eliminator 14, the charge can be effectively reduced, and the trouble caused by the charge can be eliminated.

In the present invention, “ion wind” refers to air containing positively or negatively charged ions (not limited to air,
(Including various gases). The static eliminator that can be used in the present invention is preferably a static eliminator that can generate ion wind, and mainly includes a corona discharge type and a soft X-ray type. In particular, a soft X-ray type has a large static elimination effect and is preferably used in the present invention. The static eliminator generally includes a bar type having a plurality of discharge ports 15 arranged in parallel on a rod-shaped main body as shown in FIG. 1 and a nozzle type having only one discharge port (not shown). However, in the present invention, any of them can be used without any problem. When a nozzle type static eliminator is used, it is preferable that the discharge ports are arranged in parallel so that the same ion wind as in the bar type is discharged.

As a specific example of such a static eliminator, for example,
Static Bar SI manufactured by Simco Japan Co., Ltd.
B, AC ionizer APZ manufactured by Shisido Electrostatic Co., Ltd.
II, Multi-type additional static eliminator S manufactured by KEYENCE CORPORATION
J-B, Super Clean Ionizer TSCI-SN (Corona discharge type) manufactured by Takasago Thermal Engineering Co., Ltd.
Super clean ionizer manufactured by Takasago Thermal Engineering Co., Ltd.
Examples include IRISSYS-SX (soft X-ray type), but the present invention is not limited to these.

The performance required of the static eliminator 14 is determined according to the desired static elimination effect, and is not particularly limited. However, in case of corona discharge type static eliminator,
As the wind speed of the ion wind 16 at the discharge port 15, 0.5
m / sec or more, more preferably 1 to 3 m / sec.

The discharge port 15 of the static eliminator 14 is directed to the peel portion 21 between the photosensitive resin layer 12 and the temporary support 11, and the ion wind 16 discharged from the discharge port 15 causes the peel portion 21 to its peripheral portion 22. , 23. Here, the “peel portion” is a point (point 21 in FIG. 2) immediately before the photosensitive resin layer 12 and the temporary support 11 are separated from each other in the process of peeling the temporary support from the laminate. Good thing,
The “peripheral portion of the peel portion” refers to a surface of the photosensitive resin layer 12 and the temporary support 11 that are opposed to each other immediately after being separated (FIG. 2).
22 and 23). As described above, the discharge port 15 of the static eliminator 14 is
Ion wind 1 discharged from discharge port 15
6 spreads as it progresses, and thus hits the peel portion 21 or its peripheral portions 22 and 23. In addition, as long as the ionic wind 16 hits the peel portion 21 or its peripheral portions 22 and 23, the discharge port 15 of the static eliminator 14 is connected to the peel portion 2
It does not have to be pointed exactly at 1.

The distance between the peeling portion 21 and the discharge port 15 of the static eliminator 14 is increased as the ion wind 16 spreads as described above. 21 to the peripheral portions 22 and 23 thereof. Although it depends on the performance of the static eliminator 14, the distance between the peel portion 21 and the discharge port 15 of the static eliminator 14 is desirably maintained between about 10 to 200 mm.

The peel part 21 moves in the direction of arrow A as the peeling progresses. That is, with the static eliminator 14 and the laminated body 17 fixed, the ion wind 16 is
In addition, if it is applied to the peripheral portions 22 and 23, the distance between the peel portion 21 and the discharge port 15 of the static eliminator 14 will be gradually increased. Therefore, by moving the static eliminator 14 relatively in the direction of the arrow B with respect to the laminate 17,
It is desirable that the gap between the moving peel portion 21 and the static eliminator 14 (that is, the discharge port 15 of the static eliminator 14) be kept as constant as possible and as good as possible. Moving peel part 2
In order to keep the gap between 1 and the static eliminator 14 substantially constant, during peeling, the traveling speed of the peel portion 21 in the direction of arrow A and the traveling speed of the static eliminator 14 in the direction of arrow B are made substantially constant. Just keep it.

In order to move the static eliminator 14 relative to the laminate 17, the substrate holding member 20 on which the laminate 17 is mounted is fixed, and the static eliminator 14 is moved by a movable member (not shown). This can be realized by moving with the holding member, but the static eliminator 14 is fixed and the substrate holding member 20 is moved.
Can also be realized by moving.

In the above-mentioned peeling step, it is preferable to perform a static elimination treatment also on the back surface of the laminate at the time of peeling the temporary support. The above-described static eliminator can be used for the static elimination processing.

As described above, by performing the operation of the peeling step peculiar to the present invention, for example, even if the peeling portion at the time of peeling the temporary support has a charge amount of 30 kV or more, the ion wind from the neutralizer is removed. And the charge amount can be set to 1 kV or less (the numerical values show an example of the effect of the present invention,
It does not limit the invention. ).

(Substrate Holding Means) Next, the substrate holding means shown as the substrate holding member 20 in FIG. 3 will be described. The manufacturing method of the present invention is characterized in that the temporary support is peeled off while holding the substrate side of the laminate using a point-like or linear substrate holding means. Conventionally, when the temporary support is peeled from the laminate, the back surface of the laminate is held on a metal table or a resin table (suction table) in which holes and grooves for vacuum suction are formed to temporarily support the support. The temporary support was peeled off by grasping the end of the body and moving the grasped chuck and / or table. However, if an adsorption table or the like is used, even if the neutralization of the laminate surface is neutralized by blowing ion wind with a neutralizer such as an ionizer as described above to neutralize the electric charge on the surface of the laminate, the laminate is removed after the temporary support is peeled off. Must be peeled off from the suction table in order to transfer it to the next step, and the static electricity generated at that time has again charged the laminate. On the other hand, in the present invention, the temporary support is peeled off while holding the back surface of the laminate by the point-like or linear substrate holding means, so that the contact between the laminate and the support portion at the time of the temporary support peeling is obtained. Since the surface can be made smaller, it is possible to suppress electrification of the laminate that occurs when the temporary support (laminate) is peeled off. Further, it is also preferable in that the back surface of the substrate can be neutralized by an ionizer or the like. In addition, when the temporary support is peeled off on a conductor such as a metal table, a counter charge corresponding to the charge generated on the surface of the laminate is generated on the back surface even if the charge is removed by the charge remover, so that apparent charge is prevented. However, when the laminated body after the temporary support is separated is taken out from the conductive base, charging occurs. Therefore, in order to further enhance the static elimination effect of the present invention, it is preferable that the substrate holding means is insulating.

The substrate holding means according to the present invention is shown in FIGS.
This will be described with reference to FIG. FIG. 3 is a perspective view showing an example of the point-like substrate holding means. In FIG. 3, the point-like substrate holding member 30 includes a protruding portion 31, a vacuum suction tube 32, and a support plate 33. In addition, a hole for vacuum suction (suction hole) is provided at the tip of the protruding portion 31.

The protruding portion 31 has the tip of the laminate 1
Hold 7. The shape of the tip of the protruding portion 31 is
Although the one having a contact surface with 7 as small as possible can be appropriately selected, a suction cup-shaped, hemispherical, or substantially triangular pyramid-shaped one is particularly preferable so that the laminated body 17 can be easily held when the temporary support is peeled off. 3 to 5, the point-like substrate holding member 30
Exemplifies a configuration in which the stacked body 17 is held by the four protrusions 31, but the number of the protrusions 31 is not limited to this. The number of the protrusions 31 can be appropriately selected within a range in which the laminate 17 can be held when the temporary support is peeled off.

The area of the contact surface between the projecting portion 31 and the laminate 17 varies depending on the number of the projecting portions 31 and whether or not the vacuum suction means is provided. -20 cm ² is preferred, and 0.2-10 cm ² is more preferred. Further, the arrangement of the protruding portions 31 varies depending on the number of the protruding portions 31. For example, when the number of protruding portions 31 is four, as shown in FIGS. It is preferable to provide it so that it is located.
The height of the protruding portion 31 can be appropriately selected.
In the case where the static elimination process is performed from the back surface of 7, the width is preferably determined in consideration of the width between the static eliminator and the support plate. For example, 3 to 50
cm, more preferably 5 to 30 cm. The number of the protrusions 31, the area with the contact surface, and the arrangement are not limited as long as the contact area with the stacked body 17 can be made as small as possible.

Further, it is preferable that the protruding portion 31 be insulative so as to ensure the effect of the static elimination process when the temporary support is peeled off. That is, when the laminate 17 is placed on a conductive base, a counter charge for the charge generated on the surface of the laminate 17 is generated on the back surface, so that apparent charging is prevented. Since the laminate 17 is charged when the laminate 17 is taken out of the conductive base, there is a possibility that the static elimination effect according to the present invention cannot be sufficiently utilized.

The material of the protruding portion 31 is not particularly limited, and any material such as a conductive material such as a metal and an insulating material such as a silicone rubber can be used. In order to further improve the value, those having an insulating property are particularly preferable. Even if the protrusion 31 itself is conductive, the insulation of the protrusion 31 can be ensured by providing an insulating coating on the surface. As the material of the insulating protruding portion 31 itself, and the material of the insulating coating, any conventionally known plastic materials can be used. In addition, silicone rubber, neoprene rubber, butyl rubber, nitrile rubber, Teflon, nylon,
Polyurethane and the like.

It is important that the substrate holding means holds the laminate 17 when the temporary support is peeled off. Examples of a method of holding the laminate include a method of holding down the end of the laminate 17 by a member when the temporary support is peeled off, a method of giving the above-mentioned protrusions suction properties, and the like. A method using an adsorption means is particularly preferred. As the vacuum suction means, as shown in FIG. 3, a vacuum suction pipe 32 connected to a suction pump (not shown) is connected to a protruding portion 31 provided with a suction hole at the tip, and the laminate 17 is vacuum-evacuated. There is a vacuum suction structure for holding by suction.

The support plate 33 is provided with a protrusion 31. As a material of the support plate 33, a member having a certain degree of strength can be appropriately selected, but it is preferable that the support plate 33 be insulative. As a specific insulating member, the same member as the member used for the protruding portion 31 can be used. In addition, the support plate 33 may be provided with an opening at a portion where the protruding portion 31 is not provided so that the back surface of the stacked body 17 can be easily subjected to a charge removal process by a charge remover.

The point-like substrate holding member 30 is
The structure without the support plate 33 may be used as long as the support 1 alone can hold the laminate 17 when the support is peeled off.

FIG. 6 is a perspective view showing an example of a linear and insulating substrate holding means. In FIG. 6, the linear substrate holding member 60 includes a holding portion 61, a vacuum suction tube 62, and a support plate 63. The laminated body 1 of the holding portion 61
On the surface in contact with 7, holes for vacuum suction (suction holes) are provided in parallel.

The holding portion 61 is a line-shaped member, and holds the laminated body 17 at its convex portion. The cross-sectional shape of the holding portion 61 can be appropriately selected.
It is preferable to select a trapezoidal shape or an approximately triangular shape with a rounded tip so that the contact angle is maintained and the contact surface is small. 6 and 7, the linear substrate holding member 60
Exemplifies a structure in which the laminated body 17 is held by the four-line holding portions 61, but the number of the holding portions 61 is not limited to this. The number of the holding portions 61 can be appropriately selected within a range where the laminated body 17 can be held when the temporary support is peeled off.

It is preferable that the area of the contact surface between the holding portion 61 and the laminate 17 is as small as possible within a range where the laminate 17 can be retained. The arrangement of the holding portions 61 varies depending on the number of the holding portions 61. For example, when the number of the holding portions 61 is four, as shown in FIG. It is preferable to provide it so that it is located. Further, the height of the holding portion 61 can be appropriately selected. However, in the case where static elimination processing is performed from the back surface of the stacked body 17, it is preferable to determine the height in consideration of the width between the static eliminator and the support plate. For example, 3 ~
It is preferably 50 cm, more preferably 5 to 30 cm.
The number of the holding portions 61, the area with the contact surface, and the arrangement are as follows.
There is no limitation as long as the contact area with the laminate 17 can be made as small as possible.

It is preferable that the holding portion 61 is insulative so as to ensure the effect of the static elimination process when the temporary support is peeled off. The material of the holding portion 61 is not particularly limited, and any material such as a conductive material such as a metal or an insulating material such as a silicone rubber can be used, but the effect of the present invention is further improved. In order to achieve this, an insulating material is particularly preferable. Even if the holding portion 61 itself is conductive, the insulating property of the holding portion 61 can be ensured by providing an insulating coating on the surface. As the material of the insulating holding portion 61 itself and the material of the insulating coating, the same materials as those of the above-mentioned protruding portion 31 can be used.

It is preferable that the holding portion 61 is a member having a vacuum suction structure like the above-mentioned protruding portion 31. As such a structure, as shown in FIG. 6, a vacuum suction tube 62 connected to a suction pump (not shown) is connected to a holding portion 61 provided with a suction hole at a tip thereof, and a laminated body 17 is formed.
Vacuum suction structure for vacuum suction and holding. In this case, a vacuum suction port is provided on the contact surface of the holding unit 61 with the laminate 17 to vacuum-suction the laminate 17. In order to provide a vacuum suction port on the contact surface of the holding unit 61 with the stacked body 17, several circular holes may be provided in parallel in the long side direction of the holding unit 61 so as to sufficiently hold the stacked body 17, A groove may be provided in parallel with the long side direction of the holding portion 61.

The support plate 63 is provided with a holding section 61. As the material of the support plate 63, a member having a certain strength can be appropriately selected, but it is preferable that the support plate 63 be insulative. As a specific insulating member, the same member as the member used for the holding portion 61 can be used. In addition, the support plate 63 may be provided with an opening at a portion where the holding portion 61 is not installed so that the back surface of the stacked body 17 can be easily subjected to a charge removal process by a charge remover. Note that the linear substrate holding member 60 may have a structure without the support plate 63 as long as the holding portion 61 alone can hold the laminate 17 at the time of peeling the support.

<Exposure / Development Step> In the laminate from which the temporary support has been peeled off in the peeling step, the photosensitive resin layer is exposed (exposure step) and developed (development step). Then, a color filter is formed on the surface of the substrate.

In the exposure step, the photosensitive resin layer on the substrate surface is irradiated with light via a predetermined photomask. Thereby, the exposed portion of the photosensitive resin layer is cured. The light source used in the exposure step is selected according to the photosensitivity of the photosensitive resin layer. For example, a known light source such as an ultra-high pressure mercury lamp, a xenon lamp, a carbon arc lamp, and an argon laser can be used. As described in JP-A-6-59119, an optical filter having a light transmittance of 2% or less at a wavelength of 400 nm or more may be used in combination.

When transferring the photosensitive resin material of the second and subsequent colors, a rectangular opening of the pixel pattern portion is chamfered as a photomask in order to prevent air from remaining in the gap between adjacent pixels. May be used.
The position and shape of the chamfer are described in Japanese Patent Application No. 9-44644 filed by the present applicant.

Subsequently, in a developing step, the photosensitive resin layer on the transparent substrate is developed. As a result, the unexposed portion (uncured portion) of the photosensitive resin layer is removed, and a layer including a large number of minute colored pixels can be formed. As a developing solution for the photosensitive resin layer, a dilute aqueous solution of an alkaline substance is used, but a developer to which a small amount of a water-miscible organic solvent is further added may be used. Suitable alkaline substances include alkali metal hydroxides (eg, sodium hydroxide,
Potassium hydroxide), alkali metal carbonates (eg, sodium carbonate, potassium carbonate), alkali metal bicarbonates (eg, sodium hydrogen carbonate, potassium hydrogen carbonate), alkali metal silicates (eg, sodium silicate, silicic acid) Potassium), alkali metal metasilicates (eg, sodium metasilicate, potassium metasilicate), triethanolamine, diethanolamine, monoethanolamine,
Examples include morpholine, tetraalkylammonium hydroxides (eg, tetramethylammonium hydroxide), and trisodium phosphate. The concentration of the alkaline substance is 0.01 to 30% by mass, and the pH is 8
To 14 are preferred.

In the case of a normal photosensitive resin layer other than the light-shielding photosensitive black resin layer, for example, by using a developer having a relatively low pH, development by film-like detachment can be suitably performed. .

Suitable organic solvents miscible with water include methanol, ethanol, 2-propanol, 1-
Propanol, butanol, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n
-Butyl ether, benzyl alcohol, acetone, methyl ethyl ketone, cyclohexanone, ε-caprolactone, γ-butyrolactone, dimethylformamide, dimethylacetamide, hexamethylphosphoramide, ethyl lactate, methyl lactate, ε-caprolactam and N-
Methyl pyrrolidone can be mentioned. The concentration of the organic solvent miscible with water is generally 0.1 to 30% by mass.
A known surfactant can be further added to the developer. The concentration of the surfactant is preferably from 0.01 to 10% by mass.

The developer can be used as a bath liquid or a spray liquid. In order to remove the uncured portion of the photosensitive resin layer in a solid form (preferably in a film form), a method such as rubbing with a rotating brush or a wet sponge in a developing solution, or a spray pressure when the developing solution is sprayed is used. Is preferred. The temperature of the developer is usually from around room temperature to 40
C. is preferred. A water washing step may be added after the development processing.

Further, after the development step, it is preferable to perform a heat treatment to sufficiently cure the colored pixel layer and to enhance the chemical resistance. The heat treatment is performed by heating the substrate having the colored pixel layer in an electric furnace, a drier, or the like, or by irradiating the colored pixel layer with an infrared lamp to heat the substrate. The heating temperature and time depend on the composition of the photosensitive resin and the thickness of the colored pixel layer, but in general, a temperature of about 120 ° C. to 250 ° C. and about 10 ° C. to obtain sufficient solvent resistance and alkali resistance. 300 minutes.

In this way, a color filter having a single color pixel layer (color pixel pattern) is obtained. Further, by repeating the above-described steps by a necessary number of colors using a photosensitive resin material of another color, a multicolor color filter can be obtained. The color filter may be of only one color (all of the same color) or may be composed of two or more colors. Also, for example, red, green,
When arranging the pixels of three colors of blue, any arrangement such as a stripe type, a mosaic type, a triangle type, and a four-pixel arrangement type may be used.

Further, using a photosensitive black resin material having a photosensitive black resin layer (a sheet for forming a black matrix), the photosensitive resin material is applied in the same manner as described above, and then the surface of the colored pixel layer of the color filter is applied. After transfer, the color filter is exposed (backside exposure) from the lower surface (the surface not having a pixel layer) side of the substrate, developed, and heat-treated to provide a black resin layer so as to fill gaps between pixels. Alternatively, a black matrix (light-shielding image) may be formed. Thereby, a color filter with a black matrix is obtained.

The back exposure is generally performed by irradiation of ultraviolet rays (UV), and the type of light is appropriately selected according to the photosensitivity of the photosensitive black resin layer. Further, the thickness of the formed black resin layer is preferably 0.5 to 3 μm. In order for the obtained color filter to exhibit good flatness without forming a projection in the light-shielding image portion, it is desirable that the black resin layer has the same thickness as the colored pixel layer or less.

[0114]

EXAMPLES Example 1 (1) Production of Transfer Film A coating solution having the following formulation A was applied on a polyethylene terephthalate film support (temporary support) having a thickness of 75 μm, and dried to obtain a dry film thickness of 15 μm. Was provided. This layer has a function of preventing the incorporation of bubbles due to the presence of pre-formed pixels when sequentially forming pixels of a plurality of colors by lamination.

[Formulation A of Thermoplastic Resin Layer] Methyl methacrylate / 2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer 4.5 parts by mass [copolymer composition ratio (molar ratio) = 55 / 11.7 / 4.5 / 28.8 weight average molecular weight = 80000] ・ Styrene / acrylic acid copolymer 10.5 parts by mass [copolymer composition ratio (mass ratio) = 7/3 weight average molecular weight = 8000] ・ BPE-500 (Manufactured by Shin-Nakamura Chemical Co., Ltd.) 7 parts by mass ・ F177P (manufactured by Dainippon Ink and Company, surfactant) 0.26 parts by mass ・ Methyl ethyl ketone 18.6 parts by mass ・ Methanol 30.6 parts by mass ・ 1-methoxy-2-propanol 9.3 parts by mass

Next, a coating solution having the following formulation B was applied on the thermoplastic resin layer and dried to obtain a dry film thickness of 1.6.
A μm intermediate layer was provided. This layer functions as a barrier layer for preventing the colored photosensitive resin layer and the thermoplastic resin layer from being mixed. This layer also has a function as an oxygen barrier film.

[Intermediate layer formulation B]-13 parts by mass of polyvinyl alcohol (PVA205 manufactured by Kuraray)-6 parts by mass of polyvinylpyrrolidone (PVP-K30 manufactured by Gokyo Sangyo)-173 parts by mass of methanol-211.4 parts by mass of water

On the intermediate layer, a red photosensitive solution having the formulation shown in Table 1 below was applied and dried to form a red colored photosensitive resin layer having a dry film thickness of 2 μm. Further, a polypropylene film having a thickness of 12 μm was attached as a cover film (protective layer) on the surface of the red colored photosensitive resin layer.

[0119]

[Table 1]

(2) Laminate Forming Step The above transfer film was laminated by the following method. First, the cleaned thickness 0.7mm, 400mm × 30
0 mm transparent glass plate (Corning # 1737)
With silane coupling agent (KBM-60 manufactured by Shin-Etsu Chemical Co., Ltd.)
3) After immersion in a 0.3% aqueous solution for 30 seconds, rinsing with pure water for 30 seconds and drying with an air knife. This step enhances the adhesion between the colored photosensitive resin layer and the glass.
Next, while peeling off the cover film of the red transfer film, the colored photosensitive resin surface is directed to the transparent glass substrate, and a laminator (auto cut laminator ASL manufactured by Somalu Co., Ltd.)
-24), pressurizing (2 MPa), heating (130
° C) to obtain a laminate.

(3) Peeling Step After the temperature of the substrate reached room temperature, the temporary support was peeled by the following method. The back side of the laminate is 4
It was supported by the pin (projection) at the location. The pins were set so as to correspond to positions slightly from the four corners of the laminate to the center. The upper surface of the pin was a suction cup made of silicone rubber, and the stack was vacuum-sucked by evacuation of a vacuum pump.

When the temporary support was peeled off, both the peeling interface and the back of the laminate were neutralized simultaneously with a neutralizer using ion wind. The static eliminator used was SK-4TM manufactured by Simco. The static eliminator was used while being moved in accordance with the separation of the temporary support. In addition, the amount of charge before and after peeling of the temporary support, and
The charge amount when the laminate was lifted from the pin after the temporary support was peeled off was measured using a surface potential meter SK030 / 200 manufactured by Keyence Corporation. Table 2 shows the results.

When the vacuum of the suction cup was released and the substrate was lifted from the pins after the temporary support was peeled off, there was almost no change in the surface potential due to this.

[Example 2] The temporary support was peeled off in the same manner as in Example 1 except that the back surface of the substrate was not neutralized. Table 2 shows the measurement results of the charge amount before and after the temporary support was peeled off and when the laminate was lifted after the temporary support was peeled off.

Example 3 (1) Laminate Forming Step The transfer film of Example 1 was laminated by the following method. With the colored photosensitive resin surface facing the TFT array substrate while peeling the cover film of the red transfer film, pressure (2 MPa) and heat (1 MPa) were applied using a laminator (Auto cut laminator ASL-24 manufactured by Somal).
(30 ° C.) to obtain a laminate.

(2) Peeling Step After the temperature of the TFT array substrate becomes room temperature, first, the sticking surface is set to the upper side, and the back surface of the laminated body is set to four pins (projections).
Supported by. At this time, the pins were set so as to correspond to positions slightly from the four corners of the laminate to the center. The upper surface of the pin was a suction cup made of silicone rubber, and the stack was vacuum-sucked by evacuation of a vacuum pump.

Then, the temporary support was peeled off while simultaneously removing electricity from the peeling interface (peeled part or its peripheral part) and the back surface of the laminated body with a static eliminator using ion wind. The static eliminator was used while being moved in accordance with the separation of the temporary support. After the temporary support was peeled off, the vacuum of the suction cup was released, the substrate was lifted from the pins, and the process shifted to the exposure and development steps.

(Exposure / Development Step) Next, exposure was performed through a predetermined photomask (light source: ultra-high pressure mercury lamp, exposure condition: 100 mJ / cm ² ), and a transer developer TCD-1 (Fuji Electric Co., Ltd.) at a liquid temperature of 33 ° C. 5 in 20% solution
The resist was immersed for a minute to remove insoluble portions, and a resist pattern was formed on the surface of the TFT array substrate. When the operation of the obtained TFT array with a color filter was confirmed, the operation was good, and it was confirmed that the TFT array was not damaged by discharge. No defects such as pinholes were found in the resist pattern formed on the surface of the TFT array substrate.

Comparative Example 1 A transfer film was laminated on a transparent glass substrate in the same manner as in Example 1. Then, the laminated substrate was placed on a grounded stainless steel support base, and the temporary support was peeled off while removing electricity from the peeling interface in the same manner as in Example 1. Before and after peeling of the temporary support,
Table 2 shows the measurement results of the charge amount when the laminate was lifted after the temporary support was peeled off.

[Comparative Example 2] The temporary support was peeled off in the same manner as in Example 1 except that the charge removal treatment was not performed in the peeling step. Table 2 shows the measurement results of the charge amount before and after the temporary support was peeled off and when the laminate was lifted after the temporary support was peeled off.
Shown in

Comparative Example 3 A transfer film was laminated on a transparent glass substrate in the same manner as in Example 1. Then, the substrate after lamination was placed on a support having a surface made of a melamine resin, and the temporary support was peeled off while removing electricity in the same manner as in Comparative Example 1. Before and after peeling of the temporary support, and
Table 2 shows the measurement results of the charge amount when the laminate was lifted after the temporary support was peeled off.

Comparative Example 4 The procedure of Example 3 was repeated except that the substrate after lamination was placed on a grounded stainless steel support, and the temporary support was peeled off while removing electricity from the peeling interface in the same manner as in Example 3. In the same manner as in Example 3, a TFT array with a color filter was obtained. When the operation of the obtained TFT array with a color filter was confirmed, there was a portion of the TFT array that had been destroyed by discharge. Further, pinholes have been formed in the resist pattern formed on the surface of the TFT array substrate.

[0133]

[Table 2]

In Example 1, since the charging due to the peeling of the temporary support was very small, it was found that the reduction in yield due to the attraction of dust and the destruction of the TFT could be prevented. In Example 2, the charge amount of the substrate was suppressed as compared with Comparative Examples 1 to 3, but was larger than that in Example 1. On the other hand, since the entire back surface of the substrate according to Comparative Example 1 is in contact with the conductive support, a counter charge corresponding to the charge amount due to the separation of the temporary support is generated on the back surface, and the apparent charge However, the charge amount exceeding 30 kV was detected as soon as the substrate was lifted from the support. This is because if the entire back surface of the substrate is grounded, the charge is apparently low due to the effect of the counter charge, so the effect of the static eliminator cannot be sufficiently obtained, and the effect of the peeling charge when the substrate is lifted is also added. It is thought that it was done. Therefore, in the substrate according to Comparative Example 1, there was a high possibility that the yield would be reduced due to the attraction of dust and the TFT would be destroyed in the case of COA or HA. In Comparative Example 3, the effect of static elimination at the time of peeling the temporary support was sufficient, but the peeling charge when the substrate was lifted after peeling was large. In the third embodiment,
Using an actual TFT array substrate, a transfer film was laminated in the same manner as in Example 1, the temporary support was peeled off, and then exposed and developed to form a pattern.
It was confirmed that destruction and adhesion of dust can be prevented. In Comparative Example 4, the method of Comparative Example 1 was applied to a TFT array substrate. However, the TFT was destroyed by the influence of static electricity, and pinholes were generated by suction of dust.

[0135]

According to the method for manufacturing a color filter of the present invention, the substrate side of the laminate is held by a dot-shaped or linear substrate holding means, and the photosensitive resin layer and the temporary support are peeled by a static eliminator. Since the temporary support is peeled off while performing static elimination treatment on the portion and its peripheral portion, the charge amount of the laminate can be suppressed to a low level. As a result, dust is attracted and CO
It is possible to prevent TFT destruction in the A and HA systems. In addition, the yield rate at the time of manufacturing the color filter can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state where a temporary support is peeled from a laminate in a peeling step in the present invention.

FIG. 2 is a schematic cross-sectional view showing a state where a temporary support is peeled from a laminate in a peeling step in the present invention.

FIG. 3 is a perspective view showing one example of a point-like substrate holding means in the present invention.

FIG. 4 is a schematic view showing a relationship between a laminate and a point-like substrate holding means in the present invention.

FIG. 5 is a plan view showing the relationship between the laminate and the point-like substrate holding means in the present invention.

FIG. 6 is a perspective view showing an example of a point-like substrate holding means according to the present invention.

FIG. 7 is a plan view showing the relationship between the laminate and the linear substrate holding means in the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Photosensitive transfer material 11 Temporary support 12 Photosensitive resin layer 13 Substrate 14 Static eliminator 15 Discharge port 16 Ion wind 17 Stacked body 20 Substrate holding member 21 Peel portion 22, 23 Peripheral portion of peel portion 30 Point-shaped base material holding member DESCRIPTION OF SYMBOLS 31 Projection part 32,62 Vacuum suction tube 33,63 Support plate 60 Linear substrate holding member 61 Holding part

Continued on the front page F-term (reference) 2H025 AA00 AB11 AB13 AC01 AD01 BC14 BC32 BC42 CA14 CA28 CB13 CB14 CB52 DA19 DA20 DA38 FA03 FA15 2H048 BA43 BA45 BA48 BA60 BA66 BB02 BB37 BB42 2H091 FA02Y FC01 LA12 LA15 2K009 CC03 CC03 CC03 CC03 CC09

Claims (7)

[Claims] 1. A laminate in which a photosensitive transfer material having at least a photosensitive resin layer provided on a temporary support is brought into close contact with the surface of a substrate such that the surface of the substrate and the photosensitive resin layer are in contact with each other. Obtaining a laminate forming step, a peeling step of peeling the temporary support from the laminate, and an exposing and developing step of forming a color filter on the surface of the substrate by exposing and developing the photosensitive resin layer. And a method for manufacturing a color filter, comprising: in the peeling step, the substrate side of the laminate is held by a dot-shaped or linear substrate holding means, and the photosensitive resin layer is further removed by a static eliminator. A method for manufacturing a color filter, wherein the temporary support is peeled off while performing a static elimination treatment on a peel portion between the temporary support and a peripheral portion thereof. 2. The method according to claim 1, wherein said substrate holding means is insulative. 3. The method for manufacturing a color filter according to claim 1, wherein the static eliminator performs ion elimination treatment on the peel portion and its peripheral portion by applying ion wind. 4. In the peeling step, a peel portion that peels off and moves the temporary support from the laminate,
The method for producing a color filter according to any one of claims 1 to 3, wherein a gap with the static eliminator is kept substantially constant. 5. The method for manufacturing a color filter according to claim 1, wherein said substrate is a TFT array substrate. 6. The collar according to claim 1, wherein, in the peeling step, the temporary support is peeled off while performing a static elimination treatment on the surface of the laminate on the substrate side. Manufacturing method of filter. 7. The method for manufacturing a color filter according to claim 1, wherein said substrate holding means has a vacuum suction means.