JP2002134075A - Electrolyte contact preventive mechanism and battery unit, and resin film-forming method and resin film- forming unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide measures to restrain a larger size of a battery unit, to enhance maintainability and to reduce deterioration of a coating function caused by electrolyte. SOLUTION: At least a part of a circuit board 11 formed by material of a higher intermolecular force than that of the electrolyte 20 is covered by a film 12 of 100 μm or less in wall thickness which is formed by material of a lower intermolecular force than that of the electrolyte 20, and this film 12 is arranged in contact with a case 104 which is higher in intermolecular force than that of the electrolyte 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolyte contact preventing mechanism for preventing an electrolyte leaking from a battery from coming into contact with an electric circuit, a battery device having the function, and a device suitable for realizing the mechanism. The present invention relates to a resin film forming apparatus and a resin film forming method.

[0002]

2. Description of the Related Art In general, a battery is transmitted with a battery unit as a power generation source and power generated from the battery unit.
And an electric circuit section including a control circuit for controlling the output. The battery unit and the electric circuit unit are often arranged close to each other because of the size restriction of the whole battery. In this case, it is possible to prevent the electrolyte leaked from the battery unit from entering the electric circuit unit. We need to take action. this is,
This is to prevent the leaked electrolyte from entering the electric circuit portion and shortening or damaging the electric circuit. One specific measure is to cover the electric circuit portion with a resin.

[0003]

However, conventionally, a method of using a high-viscosity resin and covering the entire electric circuit portion with a thick film has been generally used.
There is a problem that the size of the battery cannot be reduced.

[0004] Further, when the entire electric circuit portion is covered with a thick film, there is a problem that the maintainability at the time of repairing the electric circuit portion is poor.

Further, when an electrolytic solution adheres to a film covering the electric circuit portion, the electrolytic solution corrodes the film, and there is a problem that the coating function is deteriorated.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has an electrolyte contact preventing mechanism capable of suppressing an increase in size, having high maintainability, and suppressing a decrease in a coating function due to an electrolyte. The purpose is to provide.

It is another object of the present invention to provide a battery device having a function of suppressing an increase in size, a high maintainability, and a function of suppressing a decrease in a coating function by an electrolytic solution. .

[0008]

In order to solve the above-mentioned problems, the present invention provides an electrolyte contact preventing mechanism for preventing an electrolyte leaking from a battery unit from coming into contact with an electric circuit unit. It is composed of a material with a large force,
An electrolytic method comprising: a circuit board constituting the electric circuit portion; and a coating made of a material having a smaller intermolecular force than the electrolytic solution and covering at least a part of the circuit board with a thickness of 100 μm or less. A liquid contact prevention mechanism is provided.

Here, an electric circuit is formed on the circuit board, and the coating is made of a material having a smaller intermolecular force than that of the circuit board. By being configured with the following thickness, increase in size is suppressed.

Further, in the battery device having a function of preventing the electrolyte leaked from the battery portion from coming into contact with the electric circuit portion, the battery device is made of a material having a larger intermolecular force than the electrolyte solution. A battery device is provided, comprising: a circuit board to be formed; and a coating made of a material having a smaller intermolecular force than the electrolytic solution and covering at least a part of the circuit board with a thickness of 100 μm or less.

Here, an electric circuit is formed on the circuit board, and the coating is made of a material having a smaller intermolecular force than the circuit board. By having a thickness of 100 μm or less, an increase in size is suppressed.

Further, the method for forming a resin film according to the present invention comprises:
A method for forming a resin film on a substrate, comprising:
Dipping the substrate in a resin solution in which the resin is dissolved in a solvent to apply the resin solution to the substrate; and, after the dipping step, pulling up the substrate from the resin solution and evaporating and drying the solvent of the resin solution applied to the substrate. A drying step and a cooling step of cooling and liquefying the solvent evaporated from the resin solution applied to the substrate by the cooling means and the solvent evaporated from the liquid surface of the resin solution after the drying step, and converting the liquefied solvent into a resin solution. By returning, the amount of solvent loss in the resin solution is controlled to control the concentration of the resin solution.

In the above-described method of forming a resin film, in the cooling step, the amount of the solvent of the resin solution going out is controlled to a predetermined ratio.

[0014] In the cooling step, the evaporated solvent is liquefied.
A small amount, not 0%, is emitted as steam to the outside of the main body. Therefore, in this resin film forming method,
Controls the amount of steam that escapes without liquefaction. The amount of resin reduced by being formed as a resin film on the substrate and being taken out of the resin solution is substantially constant depending on the substrate.

Therefore, in this resin film forming method,
By controlling the amount of solvent that goes out without liquefaction, that is, the amount of solvent loss, and keeping the ratio between the solvent loss ratio and the resin reduction ratio constant, the concentration of the resin solution is always constant. Will be retained.

Further, the resin film forming apparatus according to the present invention comprises:
A resin film forming apparatus for forming a resin film on a substrate,
A substrate moving means for moving the substrate, an immersion area for applying the resin solution to the substrate by immersing the substrate in a resin solution in which the resin is dissolved in a solvent, and a resin solution applied to the substrate disposed immediately above the immersion area. A drying area for evaporating and drying the solvent, and a cooling means arranged right above the drying area and cooling means for cooling the solvent evaporated from the resin solution applied to the substrate and the solvent evaporated from the liquid surface of the resin solution by the cooling means. A cooling region for liquefying the resin solution is provided, and the concentration of the resin solution is controlled by controlling the loss amount of the solvent in the resin solution by returning the liquefied solvent to the resin solution.

In the resin film forming apparatus configured as described above, the amount of the solvent of the resin solution flowing out of the resin film forming apparatus to the outside in the cooling region is controlled to a predetermined ratio.

In the cooling zone, the evaporated solvent is liquefied. The liquefaction ratio of the evaporated solvent in the cooling zone is 10%.
A small amount, not 0%, is emitted as steam to the outside of the main body. Therefore, in this resin film forming apparatus,
The amount of the vapor of the resin solution flowing out of the resin film forming apparatus is controlled. The amount of resin reduced by being formed as a resin film on the substrate and being taken out of the resin solution is substantially constant depending on the substrate.

Therefore, in this resin film forming apparatus,
By controlling the amount of solvent that goes out of the resin film forming apparatus, that is, the amount of solvent loss, and keeping the ratio between the solvent loss ratio and the resin reduction ratio constant, the concentration of the resin solution is always constant. It is kept constant.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

First, a first embodiment of the present invention will be described.

FIG. 1 shows a battery device 1 according to this embodiment.
FIG. 3 is a plan view showing the configuration of FIG. Although the upper surface of the actual battery device 1 is covered with a cover or the like, FIG. 1 omits a cover or the like for covering the upper surface for the sake of explanation.

The battery device 1 includes batteries 2a to 2d for generating power, connection electrodes 3a to 3h for transmitting power output from the batteries 2a to 2d, a case 4 for covering the bottom and side surfaces,
Circuit board 11 constituting electric circuit section, and circuit board 11
Is constituted by a coating 12 covering the. Here, the circuit board 11 and the coating 12 constitute the electrolyte contact prevention mechanism 10 and prevent the electrolyte leaked from the batteries 2a to 2d from coming into contact with the electric circuit portion.

The batteries 2a to 2d are, for example, lithium ion batteries or the like, and their output terminals are electrically connected to the connection electrodes 3a to 3h.

The connection electrodes 3a to 3h are conductors formed in a plate shape or the like, and are made of a material having high conductivity and hardly corroded by adhesion of moisture, an electrolytic solution, or the like, or subjected to such processing. Composed of

The case 4 is made of an insulating material, and has a box shape in which the upper surface is removed from a substantially rectangular parallelepiped having a hollow inside.

The circuit board 11 has a wiring pattern formed on the surface thereof, and an active circuit component such as a semiconductor and a passive component such as a capacitor mounted on the surface thereof to form an electric circuit portion. Here, as a material of the circuit board 11, a glass epoxy resin or the like can be used without any particular limitation as long as it has an insulating property and a certain mechanical strength. Also, as the material of the wiring pattern,
Copper, silver, zinc, etc. can be used without particular limitation as long as they have high conductivity and high film adhesion to the circuit board 11.

The coating 12 is, for example, a resin having a waterproof property and an insulating property, such as a fluororesin. Here, the coating 12,
The selection of the material forming the circuit board 11 and the case 4 is such that the intermolecular force of the electrolytic solution is larger than the intermolecular force of the material forming the coating 12, and the material forming the circuit board 11 and the case 4 are formed. It is performed so as to be smaller than the intermolecular force of the material. For example, when the intermolecular force of the electrolyte is 20 to 30 dyne
/ Cm, the material constituting the film 12 should have an intermolecular force of 15 dyne / cm or less, and the material constituting the circuit board 11 and the case 4 should have an intermolecular force of 100 dyne / cm.
Dyne / cm or more is used. More specifically,
The film 12 has an intermolecular force of 10 to 12 dyne / cm.
Fluororesin, and the circuit board 11 has an intermolecular force of 1
A glass epoxy resin of at least 00 dyne / cm is used. Further, the coating 12 may be made of a thermoplastic material. In this case, the coating 12 can be dissolved by heating the coating 12, and maintenance of the coating 12 becomes easy.

FIG. 2A is a sectional view taken along the line AA of the electrolyte contact preventing mechanism 10 in FIG. As shown in FIG. 2A, the electrolytic solution contact prevention mechanism 10 is configured by covering the outside of a circuit board 11 with a coating 12. The coating of the coating 12 on the circuit board 11 is performed by setting the viscosity of a resin such as a fluororesin constituting the coating 12 to 1 Pa · sec or less and applying the resin to the outside of the circuit board 11. By forming the coating 12 by applying such a low-viscosity resin, the thickness of the coating 12 can be reduced. Coating 12 constituted in this way
Is desirably 100 μm or less.

Inside the case 4, batteries 2a to 2d and an electrolyte contact preventing mechanism 10 are arranged, and the batteries 2a to 2d
Is connected to the electrolyte contact preventing mechanism 1 through the connection electrodes 3a to 3h.
0 is electrically connected to the circuit board 11. At this time, the coating 12 of the electrolytic solution contact prevention mechanism 10 is arranged with at least a part thereof in contact with the case 4.

FIG. 2B is a sectional view taken along the line A-B in FIG.
FIG. 3 is a cross-sectional view of A, showing a state where an electrolyte 20 leaked from batteries 2a to 2d adheres to a surface of an electrolyte contact prevention mechanism 10.

As described above, the intermolecular force of the electrolytic solution 20 is
It is larger than the intermolecular force of the material forming the coating 12 and smaller than the intermolecular force of the material forming the case 4. For this reason, the electrolyte 2 adhering to the surface of the electrolyte contact prevention mechanism 10
0 is attracted to the case 4 side having a large intermolecular force, and is separated from the coating 12 having a small intermolecular force. This prevents the electrolytic solution 20 from remaining on the surface of the coating 12, and the coating 12 is corroded by the remaining electrolytic solution 20,
This coating function can be prevented from being reduced.

As described above, in the present embodiment, the circuit board 11 constituting the electric circuit portion is covered with the thin film 12 having a thickness of 100 μm or less, so that an increase in size can be suppressed.

By reducing the thickness of the coating 12, maintenance such as correction of the position of the coating 12 can be easily performed.

Further, since the thickness of the coating 12 is reduced, it is possible to form a pattern of the coating 12 such as selectively disposing the coating 12 on a part of the circuit board 11. It is possible to improve the degree of freedom in design, for example, by providing the coating 12 only on the appropriate portions to reduce the overall size.

The circuit board 11 constituting the electric circuit section
Is covered with a film 12 made of a material having a smaller intermolecular force than the electrolytic solution 20, and is arranged in contact with the case 4 having a larger intermolecular force than the electrolytic solution 20. Can be prevented from remaining on the surface, and the coating solution 12 can be prevented from being corroded by the remaining electrolytic solution 20 and the coating function from being deteriorated.

Here, the volume resistivity and the surface resistivity of a fluororesin used as the film 12 in the present invention, a urethane resin generally used as an insulating film, and an acrylic resin were measured. The volume resistivity and the surface resistivity of the resin film were measured at a temperature of 85 ° C. and an 85% RH after a load of DC 10 V was applied for 500 hours. In addition, the measurement of the volume resistivity and the surface resistivity was performed by setting the thickness of the resin film to 200 μm.

[0038] As a result, a urethane resin, the volume resistivity of the acrylic resin, the surface ^{resistivity, 10 1 2 ~10 14 Ω ·} c
m, and the volume resistivity and the surface resistivity of the fluororesin exceeded about 10 ¹⁶ Ω · cm. That is,
It can be seen that the volume resistivity and the surface resistivity of the fluororesin are about 100 times higher than the volume resistivity and the surface resistivity of the urethane resin and the acrylic resin.

Therefore, the coating 12 made of fluororesin
Means that even if the coating thickness on the substrate 11 is as thin as 100 μm or less, more preferably about 6 μm,
It can be said that the insulator has sufficient insulating properties comparable to a urethane resin or acrylic resin film of about 0 μm.

Thus, according to the coating 12 to which the present invention is applied, that is, the coating 12 made of a fluororesin or the like, it is possible to prevent defects in the electric circuit and short circuit due to solder chips, solder balls, metal chips and the like. In addition, between adjacent electric circuit different poles, insulation resistance can be improved by preventing infiltration of moisture into the different poles with a coating having an insulating property.

Next, a second embodiment of the present invention will be described.

This embodiment is a modification of the first embodiment, and differs from the first embodiment in that only a part of the circuit board is covered with a coating. The other points are the same as those of the first embodiment. Hereinafter, the differences will be mainly described, and the description of the common points will be omitted.

FIG. 3A is a plan view showing the structure of the electrolyte contact preventing mechanism 30 in the present embodiment.

The electrolyte contact preventing mechanism 30 is also composed of a circuit board 31 and a coating 32 as in the case of the first embodiment. As described above, the difference from the first embodiment is that the coating 32 covers only a part of the circuit board 31, and the other points are the same as the first embodiment.

FIG. 3B is a cross-sectional view taken along the line CC of FIG. 3A.
The state when 0 is attached is shown.

As in the case of the first embodiment, the intermolecular force of the electrolytic solution 40 is larger than the intermolecular force of the material forming the film 32 and the intermolecular force of the material forming the circuit board 31. Is also small. Therefore, the electrolytic solution 40 attached to the surface of the electrolytic solution contact preventing mechanism 30 is attracted to the circuit board 31 having a large intermolecular force and separated from the coating 32 having a small intermolecular force. This prevents the electrolytic solution 40 from remaining on the surface of the coating 32 and suppresses the corrosion of the coating 32 due to the remaining electrolytic solution 40 and a decrease in its coating function.

As described above, in this embodiment, the circuit board 3 made of a material having a larger intermolecular force than the electrolytic solution 40 is used.
1 is covered with the coating 32 made of a material having a smaller intermolecular force than the electrolyte 40, so that the electrolyte 40 is prevented from remaining on the surface of the coating 32, and the remaining electrolyte 40 is prevented. As a result, the coating 32 is corroded,
It can suppress that the coating function falls.

By the way, as a conventional method of forming a suitable fluororesin film as the above-mentioned films 12 and 32,
An evaporation method such as spray coating and vacuum evaporation is exemplified.

However, in the case of spray coating, the loss rate of the fluororesin solution is as large as about 60%, and the amount of the fluororesin solution used is much larger than the amount of the fluororesin adhering to the substrate. There is a problem that efficiency is reduced and production cost is increased.

Further, in the case of the vapor deposition method, the apparatus is expensive and large-scale, so that the formation of the fluororesin film must be performed as a batch process in which a large number of processes are performed at once. As a result, there is a problem that it is difficult to inline the film formation of the fluororesin film, and there is a large in-process inventory of the substrate on which the fluororesin film is formed, resulting in an increase in production cost.

In order to measure the film thickness of the fluororesin film formed by these methods, it is necessary to perform optically direct measurement using, for example, a metal microscope. In such a case, there is a problem that the measuring device, the measuring technique, the measuring operation, and the like become complicated, and it is difficult to perform in-line operation.

Therefore, a fluororesin film suitable as the above-mentioned films 12 and 32 can be formed as follows by a fluororesin film forming apparatus and a film forming method to which the present invention is applied.

FIG. 4 schematically shows the structure of a fluorine resin film forming apparatus 101 to which the present invention is applied. The fluororesin film forming apparatus 101 includes a main body unit 102 for forming a resin film and a substrate control unit 103 for controlling a substrate.

The main body 102 includes a case 104, a fluororesin solution tank 105, which is an immersion area disposed below the case 104, and a drying area 106 disposed adjacent above the fluororesin solution 117 layer. And the dry area 10
6, a cooling area 107 disposed adjacently above the cooling area 107, and an automatic opening / closing shutter 10 disposed above the cooling area 107.
8, a separation tank 109, and a filter tank 110.

The case 104 is made of a material having appropriate strength and having corrosion resistance to the fluororesin solution 117, a solvent of the fluororesin solution 117, moisture, and the like. As such a material, for example, a non-corrosive metal such as stainless steel SUS304, SUS316, and aluminum, or a resin such as acryl, polyethylene, and polycarbonate can be suitably used.

The fluororesin solution tank 105 is a region where the fluororesin solution 117 is immersed in the substrate 111.
The fluororesin solution 117 adjusted to a predetermined concentration is filled. The fluororesin solution tank 105 is made of a material having mortgage strength and having corrosion resistance to the fluororesin solution 117 and the solvent and moisture of the fluororesin solution 117. Such materials include, for example,
Metals such as stainless steel SUS304, SUS316 and aluminum, tempered glass, and resins such as polyethylene and polycarbonate can be preferably used. The height of the fluororesin solution tank 105 is
1 has a predetermined height at which all can be immersed. In addition, a liquid level meter 125 that penetrates through the bottom of the fluororesin solution tank 105 on the side of the fluororesin solution tank 105 and indicates the position of the liquid surface 112 of the fluororesin solution 117 in the fluororesin solution tank 105. Provided. With the liquid level meter 125, the height of the liquid surface 112 of the fluororesin solution 117 in the fluororesin solution tank 105 can be confirmed,
The management of the fluororesin solution 117 can be performed easily.

At the upper end of the fluororesin solution tank 105 and at the boundary with the drying area 106, a pipe 113 for guiding the overflowed fluororesin solution 117 to the filter tank 110 when the fluororesin solution 117 overflows.
And the opposite end is provided with a filter tank 110.
It is connected to the. A pipe 115 for flowing the fluororesin solution 117 from the filter tank 110 into the fluororesin solution tank 105 via a circulating pump is also provided at the bottom of the fluororesin solution tank 105 and below the above-mentioned pipe 113. The other end is connected to the filter tank 110.

The fluororesin solution 117 is obtained by dissolving a fluororesin in a solvent at a predetermined concentration. Here, examples of the solvent include room temperature such as perfluoropolyether, perfluorocarbon, hydrofluoropolyether, hydrofluoroether, HCFC-225 (hydrochlorofluorocarbon), hydrofluorocarbon, perfluorodibutyl ether, xylene hexafluoride and the like. And volatile organic solvents that can be dried at room temperature, such as ethyl alcohol, isopropyl alcohol, acetone, butyl acetate, cyclohexane, and industrial gasoline.
In addition, if emulsified, water can be used as a solvent. Among them, perfluoropolyether has a low boiling point of 70 ° C. and evaporates at a low temperature, and thus can be suitably used. In addition, the above-described solvents may be used alone, or a mixture of a plurality of types may be used.

The drying area 106 is provided in the fluororesin solution tank 10.
5 is a region where the solvent in the fluororesin solution 117 applied to the substrate 111 by immersion is evaporated and dried, and a fluororesin film is formed on the substrate 111.

The atmosphere temperature in the drying area 106 may be maintained at about room temperature. Specifically, the fluororesin solution 1
Any temperature may be used as long as the temperature is such that the solvent used for preparing 17 can be surely dried.

Further, the atmosphere in the drying area 106 may be maintained at a predetermined temperature equal to or higher than the normal temperature by providing a heating facility and heating the drying area 106. Note that the drying area 106
Is heated to a temperature equal to or higher than room temperature, a solvent that can be dried at the ambient temperature at which the drying region 106 is heated can be used as the solvent of the above-described fluororesin solution 117.

The cooling region 107 includes the solvent evaporated from the surface of the substrate 111 in the drying region 106 and the fluororesin solution 11
7 is a region where the solvent evaporated from the liquid level 112 is liquefied and dewed by cooling. The drying region 106 also plays a role of liquefying, dew-condensing, and removing the moisture contained in the air inside the device and the moisture contained in the outside air flowing into the device from outside the device.

The solvent evaporated from the surface of the substrate 111 in the drying region 106 and the solvent evaporated from the liquid surface 112 of the fluororesin solution 117 are liquefied by being cooled, and condensed on the inner wall 118 of the cooling region 107. And the cooling area 1
The solvent condensed on the inner wall 118 of the cooling chamber 107 is accumulated in the drain groove 119 disposed at the lower end of the inner wall 118 of the cooling area 107 through the inner wall 118, and further connects the drain groove 119 to the separation tank 109. It is collected in the separation tank 109 by the arranged piping 116. This makes it possible to reduce and control the amount of solvent that goes out of the apparatus, that is, the amount of solvent loss.

The water contained in the air inside the apparatus and the water contained in the outside air flowing into the apparatus from outside the apparatus are also collected in the separation tank 109 in the same manner as the solvent.

The solvent recovered in the separation tank 109 is returned to the fluororesin solution tank 105 through the filter tank 110, so that the loss of the solvent in the fluororesin solution 117 can be greatly reduced, and the solvent can be reduced. Can be controlled.

Here, the cooling area 107 is provided with a cooling device 120 on its outer peripheral edge so as to surround the cooling area 107.
7 is cooled, the solvent and moisture are cooled and liquefied, and dew is formed on the inner wall 118 of the cooling area 107.

Here, the temperature of the atmosphere in the cooling area 107 when the cooling is performed by the cooling device 120 is controlled by the fluororesin solution 11.
No particular limitation is imposed on the type of the solvent used in 7 or the like, and it may be appropriately set according to other conditions.

The cooling device 120 is not particularly limited, and a conventionally known device such as a Peltier element or a cooling pipe can be used as long as the cooling region 107 can be cooled to a predetermined temperature. . Among them, the Peltier device itself is small and light, so the cooling device 1
20 can be reduced in size and weight, and the main body 102 can be reduced in size and weight, so that it can be suitably used.

The automatic opening / closing shutter 108 is
When the work of forming the fluororesin film is not performed, the automatic opening / closing shutter 108 is closed to prevent impurities and outside air from entering the main body 102. To prevent.

The separation tank 109 collects the solvent and water liquefied and collected in the cooling area 107, further discharges water to the outside, and sends only the solvent to the filter tank 110.

The filter tank 110 includes a separation tank 109.
The solvent sent from the tank is filtered through a filter 121 in the tank to remove impurities, and then the fluororesin solution tank 105 is removed again.
Return to Further, since the fluororesin solution 117 overflowed from the fluororesin solution tank 105 is returned to the filter tank 110 through the above-described pipe 113, the fluororesin solution 117 is also circulated after removing impurities through the filter 121. It is returned to the fluororesin solution tank 105 again by the pump.

The board 111 control unit 103 includes a board mounting attachment 122 and an attachment mounting rack 123 for holding the board mounting attachment 122.
And an automatic control elevator 124.

The board attachment 122 holds the board 111 and has a predetermined number, for example, four.
The shape and size are such that a plurality of substrates 111 can be attached and held. The number of substrates 111 that can be mounted on the substrate mounting attachment 122 is not particularly limited, and the size and shape of the substrate 111, the fluororesin solution tank 10
5 can be changed as appropriate in consideration of various conditions such as the size of 5.

The attachment mounting rack 123 holds the board mounting attachment 122.
The shape and the size are such that a predetermined number, for example, two board attachments 122 can be attached and held.
The number of the board mounting attachments 122 that can be mounted on the attachment mounting rack 123 is not particularly limited, and takes into consideration various conditions such as the size and shape of the board mounting attachment 122 and the size of the fluororesin solution tank 105. It can be changed as appropriate.

Then, the substrate attachment 12
2, a plurality of substrates 111 are attached, and a plurality of substrate attachment attachments 122 are attached to the attachment attachment rack 123 to form a fluororesin film, thereby greatly increasing the number of substrates processed per unit time. And production efficiency can be improved.

The board mounting attachment 122
By preparing a plurality of types of attachment mounting racks 123 according to the shape and size of the substrate 111, a fluororesin film can be simultaneously formed on different types of substrates 111. It will be excellent in property.

The automatic control elevator 124 moves the attachment mounting rack 123 in a vertical direction at a predetermined speed to cause the board 111 to enter the main body 102 and to lift it from the main body 102. Is a drive source and is controlled by an automatic control device (not shown). The automatic control device also controls the above-described automatic opening / closing shutter 108 in conjunction with the automatic control elevator 124.

Since the fluororesin film forming apparatus 101 having the above-described configuration is provided with the cooling region 107, the amount of the solvent of the fluororesin solution 117 flowing out from the inside of the main body 102 to the outside can be adjusted to a predetermined amount. The ratio can be controlled. Although the evaporated solvent is liquefied in the cooling region 107, the liquefaction ratio of the evaporated solvent in the cooling region 107 is not 100%, and a small amount is emitted as steam to the outside of the main body 102. Therefore, in the fluororesin film forming apparatus 101, the amount of the vapor that flows out of the main body 102 is controlled.

That is, in order to increase the amount of the solvent of the fluororesin solution 117 flowing from the inside of the main body to the outside, the temperature of the fluororesin solution 117 is increased and the fluororesin solution 11
The evaporation amount of the solvent from the seven surfaces 112 is increased. This makes it possible to increase the amount of the solvent vapor flowing out of the main body 102. In addition, by adjusting the setting of the cooling device 120 and increasing the temperature of the cooling region 107, the amount of the liquefied and dewed solvent can be reduced, and the amount of the vapor of the solvent that goes out of the main body 102 can be increased. it can.

In order to reduce the amount of the solvent in the fluororesin solution 117 flowing from the inside of the main body to the outside, the temperature of the fluororesin solution 117 is lowered,
The amount of evaporation of the solvent from the surface 112 is reduced. This makes it possible to reduce the amount of the vapor of the solvent going out. Further, the setting of the cooling device 120 is adjusted, and the cooling region 1 is adjusted.
By lowering the temperature of 07, the amount of the liquefied and dewed solvent can be increased, and the amount of the vapor of the solvent flowing out of the main body 102 can be reduced.

Then, the amount of reduction of the fluororesin due to being formed as a fluororesin film on the substrate 111 and being taken out of the fluororesin solution 117 is substantially constant by the substrate 111.

Accordingly, by controlling the amount of the solvent that goes out of the main body 102, that is, the loss amount of the solvent, and keeping the ratio between the loss ratio of the solvent and the reduction ratio of the fluororesin constant, The concentration of the fluororesin solution 117 in the solution tank 105 can always be kept constant. That is, in the fluororesin film forming apparatus 101, the concentration of the fluororesin solution 117 can be always kept constant by a simple operation without complicated operation.
This makes it possible to form a uniform, high-quality fluororesin coating which is always free from problems such as different concentrations of the fluororesin depending on the location of the fluororesin coating, different thicknesses at different locations, and the like.

Further, the fluororesin film forming apparatus 101
By providing the cooling region 107, it is possible to remove moisture contained in the air inside the apparatus and moisture contained in the outside air flowing into the apparatus from outside the apparatus.
As a result, it is possible to prevent water, which is an impurity, from being contained in the fluororesin solution 117, such as floating of water in the fluororesin solution 117, so that a uniform and high-quality fluororesin film is always formed. can do.

Further, the fluororesin film forming apparatus 101
By providing the filter tank 110, the solvent that is liquefied and dewed and returned to the fluororesin solution tank 105 or the impurities contained in the fluororesin solution 117 circulated by overflow can be effectively removed. Thereby, the fluororesin solution 117 in the fluororesin solution tank 105 can be always kept in a good state without impurities, so that a uniform and high-quality fluororesin coating can be always formed.

Further, the fluororesin film forming apparatus 101
Since the immersion method is used, the fluororesin solution 117 is used.
Means that only the amount necessary for forming the fluororesin film
And is taken out of the main body 102, so that the loss amount of the fluororesin solution 117 does not increase as in the case of spray coating, the coating efficiency is high, and the production cost can be kept low. it can.

Then, the fluororesin film forming apparatus 10
1 has a simple configuration, so that it can be reduced in size and cost, and can be inlined. By using the fluororesin film forming apparatus 101, only the necessary amount can be formed when necessary in accordance with another process line, so that there is no in-process inventory and production costs can be reduced. Can be suppressed.

Next, a method of forming a fluororesin film on the substrate 111 using the resin film forming apparatus configured as described above will be described. FIG. 5 shows a flowchart of a fluororesin film forming process using the resin film forming apparatus.

First, in step 1, a predetermined number of substrates 111 are mounted on the substrate mounting attachment 122. At this time, it is not necessary to attach all the same types of substrates 111, and a plurality of types of substrates 111 may be prepared by attaching different types of substrates 111 to the dedicated substrate attachment 122.

Next, in step 2, the board mounting attachment 122 is connected to the attachment mounting rack 12.
Attach to 3. Attachment mounting rack 1 at this time
The position 23, that is, the position of the substrate 111 is the initial position of the substrate 111 as shown in FIG.

Next, in step 3, the start button of the automatic control device is turned ON. Subsequent operations are automatically controlled by the automatic control device.

Next, in step 4, by the switching in step 3, the automatic opening / closing shutter 108 is opened under the control of the automatic control device.

Next, in step 5, the attachment mounting rack 123 is lowered at a predetermined speed by the automatic control elevator 124, and the board 111 enters the main body 102 as shown in FIG.

Next, in step 6, the attachment mounting rack 123 is further lowered in the main body 102 by the automatic control elevator 124 so that the cooling area 10
7. Passing through the drying area 106, the fluororesin solution tank 105
Of the fluorocarbon resin solution 117 to a predetermined position where the entire substrate 111 is immersed in the fluorocarbon resin solution 117.

Next, in step 7, the substrate 111 is immersed in the fluororesin solution 117 for a predetermined time. The immersion time of the substrate 111 is determined by the attachment mounting rack 12.
3, that is, it may be appropriately set according to various conditions such as the descending and rising speeds of the substrate 111 and the concentration of the fluororesin solution 117.

Next, in step 8, the attachment mounting rack 123, that is, the substrate 111 is raised at a predetermined speed by the automatic control elevator 124, and is lifted from the fluororesin solution 117 as shown in FIG. In this method of forming a fluororesin film, the substrate 111 is immersed in the fluororesin solution 117 to apply the fluororesin solution 117 to the substrate 111, and when the substrate 111 is pulled up from the fluororesin solution 117, the solvent of the fluororesin solution 117 is removed. Is evaporated and dried to form a fluororesin film on the substrate 111.

Here, the film thickness of the fluororesin film is
It can be controlled by the speed at which 11 is pulled up from the fluororesin solution 117. When Steps 6 to 9 are performed, that is, when the immersion of the substrate 111 to the drying of the solvent of the fluororesin solution 117 is performed to form the fluororesin coating, the speed of lifting the substrate 111 from the fluororesin solution 117 is reduced. The slower the film thickness, the thicker the fluororesin film can be formed.

That is, when it is desired to reduce the thickness of the fluororesin film, the pulling speed of the substrate 111 may be increased. In addition, when it is desired to increase the thickness of the fluororesin film, the pulling speed of the substrate 111 may be reduced. Therefore, by adjusting the pulling speed of the substrate 111 from the fluororesin solution 117, a fluororesin film having a desired film thickness can be formed.

The speed at which the substrate 111 is raised does not need to be the same as the speed at which the substrate 111 is lowered, and the thickness of the fluororesin film to be formed and the fluororesin solution 117 are not required.
May be set as appropriate in consideration of various conditions such as the concentration of.

Next, in step 9, the substrate 111 is further raised at a predetermined speed by the automatic control elevator 124, and the substrate 111 is passed through the drying area 106 at a predetermined speed, so that the substrate 111 is immersed in the fluororesin solution 117. The solvent of the fluororesin solution 117 applied to the substrate 111 is evaporated and dried. As a result, a fluororesin film is formed on the substrate 111.

Next, in step 10, the substrate 111 is further raised by the automatic control elevator 124, passed through the cooling region 107 at a predetermined speed, and returned to the initial position above the main body 102 and stopped. . As described above, the cooling region 107 is cooled to a predetermined temperature by the cooling device 120 disposed so as to surround the cooling region 107. As a result, the solvent evaporated from the surface of the substrate 111 in the drying area 106 and the solvent evaporated from the liquid surface 112 of the fluororesin solution 117 are cooled and liquefied, and dew is condensed on the inner wall 118 of the cooling area 107. The solvent condensed on the inner wall 118 of the cooling area 107 is
And is collected in a drain groove 119 disposed at a lower end portion of the inner wall 118 of the cooling area 107.
Is collected in the separation tank 109 by a pipe 116 connected to the separation tank 109.

Then, the solvent recovered in the separation tank 109 is returned to the fluororesin solution tank 105 via the filter tank 110, so that the loss of the solvent of the fluororesin solution 117 to the outside can be greatly reduced. In addition, it is possible to control the loss amount of the solvent. This allows
It is possible to reduce and control the amount of the solvent evaporated from the surface of the substrate 111 in the drying region 106 and the solvent evaporated from the liquid surface 112 of the fluororesin solution 117 out of the apparatus.

Further, the water contained in the air inside the apparatus and the water contained in the outside air flowing into the apparatus from outside the apparatus can be collected in the separation tank 109 and removed in the same manner as the solvent. .

Next, in step 11, the automatic opening / closing shutter 108 is closed under the control of the automatic control device. When the substrate 111 is not in the main body 102, the automatic opening / closing shutter 108 is closed so that the solvent of the fluororesin solution 117 evaporates, outside air enters the main body 102, and impurities enter the main body 102. Can be prevented from entering.

Next, in step 12, step 1
At about the same time as the step 1, the circulating pump operates under the control of the automatic controller to circulate the fluororesin solution 117. That is,
The circulating pump causes the fluororesin solution 117 in the filter tank 110 to flow into the fluororesin solution tank 105. Then, the fluororesin solution 117 in the fluororesin solution tank 105 overflows and overflows.
7 is a filter tank 11 through the pipe 113 described above.
Flows into zero. Thereby, the fluororesin solution 117 in the filter tank 110 and the fluororesin solution tank 105 can be circulated, and the concentration of the fluororesin solution 117 can be made uniform. Also, the fluororesin solution 11
When circulating 7, the fluororesin solution 117 is passed through the filter 121 in the filter tank 110, so that impurities mixed into the fluororesin solution 117 can be filtered. Thereby, the fluororesin solution 117
Can always be kept in a good state without impurities.

Next, at step 13, the board mounting attachment 122 is removed from the attachment mounting rack 123.

Finally, in step 14, by removing the substrate 111 from the substrate attachment 122, the formation of the fluororesin film is completed.

As described above, by performing steps 1 to 14, a fluororesin film can be formed on the substrate 111.

In the above-mentioned method of forming a fluororesin film, when a thin fluororesin film is desired to be formed,
Steps 1 to 14 may be performed in the order described above.

On the other hand, when it is desired to form a thick fluororesin film, when the above steps 1 to 9 are completed, the procedure returns to step 6 and steps 6 to 9 are repeatedly performed. That is, after drying the solvent of the fluororesin solution 117 in the drying area 106 to form a fluororesin coating, the substrate 111
Is dipped in a fluororesin solution 117, pulled up, and the solvent of the fluororesin solution 117 is dried in the drying region 106 to form a fluororesin coating. As a result, a thick fluororesin film can be formed.

That is, by controlling the number of repetitions of steps 6 to 9, a fluororesin film having a desired film thickness can be formed. Further, the number of executions of Steps 6 to 9, that is, the number of executions from immersion of the substrate 111 to drying of the solvent of the fluororesin solution 117 is not particularly limited.
It can be changed as appropriate according to various conditions such as the lifting speed of 1.

Further, the thickness of the fluororesin film can be controlled by adjusting the concentration of the fluororesin solution 117. When Steps 6 to 9 are performed, that is, when immersion of the substrate 111 to drying of the solvent of the fluororesin solution 117 is performed to form a fluororesin coating, the higher the concentration of the fluororesin solution 117 is, the more the film thickness becomes. A thick fluororesin film can be formed. That is, when forming a thin fluororesin film, the fluororesin solution 1
17 may be set low. When forming a thick fluororesin film, the fluororesin solution 11
7 may be set low.

Therefore, by adjusting the concentration of the fluororesin solution 117, a fluororesin film having a desired thickness can be formed.

However, care must be taken when the concentration of the fluororesin solution 117 is too high, since cracks are likely to occur in the fluororesin coating. When the fluororesin solution 117 is dried to form a fluororesin film, shrinkage stress acts on the fluororesin film. And the fluororesin coating is
Since it is hard but brittle, cracks occur due to this shrinkage stress.

However, if cracks occur in the fluororesin coating, the steps 6 to 9 are repeated, ie, immersion of the substrate 111 to drying of the solvent of the fluororesin solution 117 to laminate the fluororesin coating. As a result, a new fluororesin coating enters the cracks,
For filling, a good fluororesin coating without cracks can be formed. That is, by laminating a thin fluororesin film, a good fluororesin film without cracks can be formed.

Further, the thickness of the fluororesin film can be controlled by the pulling speed of the substrate 111 from the fluororesin solution 117 as described above. When Steps 6 to 9 are performed, that is, when the immersion of the substrate 111 to the drying of the solvent of the fluororesin solution 117 is performed to form the fluororesin coating, the speed of lifting the substrate 111 from the fluororesin solution 117 is reduced. The slower the film thickness, the thicker the fluororesin film can be formed. Therefore, when forming a thin fluororesin film, the pulling speed of the substrate 111 may be increased. In the case of forming a thick fluororesin film, the lifting speed of the substrate 111 may be reduced.

Therefore, by adjusting the pulling speed of the substrate 111 from the fluororesin solution 117, a fluororesin film having a desired thickness can be formed.

Further, there is a correlation between the concentration of the fluororesin solution 117, the lifting speed of the substrate 111 and the number of dipping times, and the thickness of the fluororesin film. For this reason, in the above-described method of forming the fluororesin film, by confirming these correlations in advance and inputting the conversion data to the automatic control device, it is not necessary to directly measure using a metal microscope or the like. Even
The film thickness of the fluororesin film can be confirmed by the film formation conditions. Therefore, according to this method, the thickness of the formed fluororesin film can be easily confirmed.

In the above description, the case where a fluororesin film is used as the films 12 and 32 has been described.
As the coatings 12 and 32, a silicon resin coating or the like can be used. In the above description, the case of forming a fluororesin film has been described. However, in addition to the fluororesin film, the resin film forming apparatus and the film forming method according to the present invention may be applied to a silicon resin, an acrylic resin, an epoxy resin, or the like. Can be applied to various resins.

In the above description, the fluorine resin film forming apparatus 101 and the film forming method have been described.
The present invention is not limited to the above description, and the resin film forming apparatus and the film forming method according to the present invention can be applied to various applications such as an anti-reflection film such as a liquid crystal screen and a glass substrate, so-called AR coating. The present invention can be applied to the formation of a resin film.

Therefore, the present invention is not limited to the above description, and can be appropriately modified without departing from the gist of the present invention.

[0121]

As described above, according to the present invention, at least a part of the circuit board constituting the electric circuit portion has a thickness of 100 μm.
Because it is covered with the following thin film, it is possible to suppress an increase in size and improve maintainability.

Further, at least a part of the circuit board made of a material having a larger intermolecular force than the electrolytic solution is covered with a film made of a material having a smaller intermolecular force than the electrolytic solution. Can be prevented from remaining on the surface of the film, and the remaining electrolyte solution can suppress the film from being corroded and the coating function from being deteriorated.

In the first and second embodiments, an electrolyte contact preventing mechanism is provided inside the battery device to prevent the electrolyte from flowing from the battery to the electric circuit. However, a configuration may be adopted in which an electric circuit portion of an electric appliance or the like is covered with a film to prevent the electrolyte leaked from a battery mounted on the electric appliance or the like from entering the electric circuit portion of the electric appliance or the like.

Further, as a waterproof measure, an electric circuit portion of an electric appliance or the like may be covered with a coating, thereby preventing the electric circuit portion from coming into contact with external water droplets or the like.

Furthermore, as an insulation measure, an electric circuit part of an electric appliance or the like is covered with a coating, thereby preventing the electric circuit part from coming into contact with a metal piece such as solder waste. It is good also as a structure which improves the insulation performance of this.

Further, the method for forming a resin film according to the present invention comprises:
A method for forming a resin film on a substrate, comprising:
A dipping step of applying the resin solution to the substrate by dipping the substrate in a resin solution in which the resin is dissolved in a solvent; and evaporating and drying the solvent of the resin solution applied to the substrate after lifting the substrate from the resin solution after the dipping step. A drying step and a cooling step of cooling and liquefying the solvent evaporated from the resin solution applied to the substrate by the cooling means and the solvent evaporated from the liquid surface of the resin solution after the drying step, and converting the liquefied solvent into a resin solution. By returning, the amount of solvent loss in the resin solution is controlled to control the concentration of the resin solution.

In the above-described method for forming a resin film, in the cooling step, the amount of the solvent of the resin solution going out is controlled to a predetermined ratio. The amount of resin reduced by being formed as a resin film on the substrate and being taken out of the resin solution is substantially constant depending on the substrate.

Therefore, in this method of forming a resin film,
By controlling the amount of solvent that goes out without liquefaction, that is, the amount of solvent loss, and keeping the ratio between the solvent loss ratio and the resin reduction ratio constant, the concentration of the resin solution is always constant. Can be held.

Further, since this resin film forming method uses an immersion method, the amount of loss of the resin solution is small and the method can be carried out with a simple configuration, so that it can be realized at low cost and can be in-line.

Thus, according to the method for forming a resin film according to the present invention, it is possible to realize uniform and good quality film formation of a resin film at low cost.

The resin film forming apparatus according to the present invention
A resin film forming apparatus for forming a resin film on a substrate,
A substrate moving means for moving the substrate, an immersion area for applying the resin solution to the substrate by immersing the substrate in a resin solution in which the resin is dissolved in a solvent, and a resin solution applied to the substrate disposed immediately above the immersion area. A drying area for evaporating and drying the solvent, and a cooling means arranged right above the drying area and cooling means for cooling the solvent evaporated from the resin solution applied to the substrate and the solvent evaporated from the liquid surface of the resin solution by the cooling means. A cooling region for liquefying the resin solution is provided, and the concentration of the resin solution is controlled by controlling the loss amount of the solvent in the resin solution by returning the liquefied solvent to the resin solution.

In the resin film forming apparatus configured as described above, the amount of the solvent of the resin solution flowing out of the resin film forming apparatus to the outside in the cooling region is controlled to a predetermined ratio. The amount of resin reduced by being formed as a resin film on the substrate and being taken out of the resin solution is substantially constant depending on the substrate.

Therefore, in this resin film forming apparatus,
By controlling the amount of solvent that goes out of the resin film forming apparatus, that is, the amount of solvent loss, and keeping the ratio between the solvent loss ratio and the resin reduction ratio constant, the concentration of the resin solution is constantly maintained. It can be kept constant.

Further, since this resin film forming apparatus employs a dipping method, it has a simple structure and can be realized at low cost, and can be inlined.

Thus, according to the apparatus for forming a resin film according to the present invention, it is possible to inexpensively form a uniform and high-quality resin film.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a battery device.

2A is a cross-sectional view taken along the line AA of the electrolyte contact preventing mechanism in FIG. 1, and FIG.
It is -A sectional drawing.

3A is a plan view showing a configuration of an electrolyte contact preventing mechanism, and FIG. 3B is a cross-sectional view taken along a line CC in FIG. 3A.

FIG. 4 is a fluororesin film forming apparatus 10 to which the present invention is applied.
FIG. 1 is a longitudinal sectional view showing one configuration example.

FIG. 5 is a flowchart of a fluororesin film forming process using the fluororesin film forming apparatus 101 shown in FIG.

6 is a view showing a flow of movement of a substrate 111 in the fluororesin film forming apparatus 101 shown in FIG.

[Explanation of symbols]

1 Battery device, 2a-2d battery, 3a-3h
Connection electrode, 4 Cases 104, 10, 30 Electrolyte contact prevention mechanism, 11, 31 Circuit board, 12, 32 coating, 2
0,40 electrolytic solution, 101 resin film forming apparatus, 102
Main unit, 103 board control unit, 104 case, 10
5 Fluororesin solution tank, 106 drying area, 107 cooling area, 108 automatic opening / closing shutter, 109 separation tank, 110 filter tank, 111 substrate, 112
Liquid surface, 113 piping, 114 circulation pump, 115 piping, 116 piping, 117 fluororesin solution, 118 inner wall, 119 drainage ditch, 120 cooling device, 121 filter, 122 substrate attachment, 12
3 Attachment mounting rack, 124 automatic control elevator, 125 liquid level gauge

Continuing on the front page (72) Inventor Koji Hamada 1 in Koda-cho, Nada-gun, Aichi Prefecture, Sakazaki, Suzuka-gairi 1 Inside Sony Koda Co., Ltd. Noda Screen F-term (reference) 5H040 AA01 AA34 AS12 AT04 AY04 AY05 JJ04 LL06 NN00 NN01

Claims (30)

[Claims] An electrolyte contact preventing mechanism for preventing an electrolyte leaking from a battery unit from coming into contact with an electric circuit unit, wherein the electric circuit unit is made of a material having a larger intermolecular force than the electrolyte solution. A circuit board made of a material having a smaller intermolecular force than the electrolyte, and covering at least a part of the circuit board with a thickness of 100 μm or less. 2. The electrolyte contact preventing mechanism according to claim 1, wherein the coating is formed by applying a resin having a viscosity of 1 Pa · sec or less. 3. The mechanism according to claim 1, wherein the coating is made of a thermoplastic material. 4. The intermolecular force of the coating is 15 dyne /
cm or less, and the intermolecular force of the circuit board is 100 d
The electrolyte contact preventing mechanism according to claim 1, wherein the mechanism is not less than yne / cm. 5. A battery device having a function of preventing an electrolytic solution leaking from a battery unit from coming into contact with an electric circuit unit, wherein the electric circuit unit is made of a material having a larger intermolecular force than the electrolytic solution. A battery device, comprising: a circuit board that is made of a material having a smaller intermolecular force than the electrolytic solution; and a coating that covers at least a part of the circuit board with a thickness of 100 μm or less. 6. The battery device according to claim 5, wherein the coating is formed by applying a resin having a viscosity of 1 Pa · sec or less. 7. The battery device according to claim 5, wherein the coating is made of a thermoplastic material. 8. An intermolecular force of the coating is 15 dyne /
cm or less, and the intermolecular force of the circuit board is 100 d
The battery device according to claim 5, wherein the value is yne / cm or less. 9. The battery device according to claim 5, further comprising a case which is in contact with at least a part of the outside of the coating and is made of a material having a larger intermolecular force than the electrolytic solution. 10. A method for forming a resin film on a substrate, comprising: immersing the substrate in a resin solution in which a resin is dissolved in a solvent, and applying the resin solution to the substrate. After the immersion step, the substrate is pulled up from the resin solution, and the solvent of the resin solution applied to the substrate is evaporated and dried. After the drying step, the substrate is coated on the substrate by cooling means. A cooling step of cooling and liquefying the solvent evaporated from the resin solution and the solvent evaporated from the liquid surface of the resin solution, by returning the liquefied solvent to the resin solution, A method for forming a resin film, comprising controlling the concentration of the resin solution by controlling the loss amount of the resin. 11. The method according to claim 10, wherein a fluororesin solution is used as the resin solution. 12. The method according to claim 10, wherein the concentration of the resin solution is kept uniform by circulating the resin solution. 13. The liquefaction amount is controlled by adjusting a cooling temperature of a solvent evaporated from the resin solution applied to the substrate by the cooling means and a solvent evaporated from a liquid surface of the resin solution. The method for forming a resin film according to claim 10, wherein: 14. The method according to claim 10, wherein a Peltier element is used as said cooling means. 15. The method according to claim 10, wherein in the cooling step, water in the air is cooled and liquefied. 16. The method according to claim 10, wherein the liquefied solvent is returned to the resin solution after being filtered. 17. The method according to claim 10, wherein the amount of evaporation of the solvent from the surface of the resin solution is controlled by adjusting the temperature of the resin solution. 18. The method according to claim 10, wherein the film thickness of the resin film is controlled by repeating the immersion step, the drying step, and the cooling step a plurality of times. 19. The method according to claim 10, wherein the thickness of the resin film is controlled by adjusting a speed at which the substrate is pulled up from the resin solution. 20. A resin film forming apparatus for forming a resin film on a substrate, comprising: substrate moving means for moving the substrate; and immersing the substrate in a resin solution in which a resin is dissolved in a solvent. A dipping region for applying the resin solution to the substrate; a drying region disposed directly above the dipping region for evaporating and drying the solvent of the resin solution applied to the substrate; and a drying region disposed directly above the drying region. And a cooling area for cooling and liquefying the solvent evaporated from the resin solution applied to the substrate by the cooling means and the solvent evaporated from the liquid surface of the resin solution. A resin film forming apparatus, wherein the concentration of the resin solution is controlled by controlling the loss amount of the solvent in the resin solution by returning to the resin solution. 21. An apparatus according to claim 20, wherein said resin film is a fluororesin film. 22. The resin film forming apparatus according to claim 20, wherein the solvent is a fluorinated solvent. 23. An apparatus according to claim 22, wherein said fluorine-based solvent is perfluoropolyether. 24. The resin film forming apparatus according to claim 20, wherein the solvent is a volatile organic solvent. 25. The resin film forming apparatus according to claim 20, wherein said resin film is a silicone resin. 26. The resin film forming apparatus according to claim 20, further comprising a cut-off means for cutting off from outside air on the cooling area. 27. An apparatus according to claim 20, further comprising means for circulating said resin solution. 28. The resin film forming apparatus according to claim 20, wherein said cooling means is a Peltier device. 29. The apparatus according to claim 20, further comprising means for filtering the liquefied solvent. 30. An apparatus according to claim 20, further comprising means for adjusting a temperature of said resin solution.