JP2002128954A - Apparatus for treating electronic part-mounted printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an economical apparatus for treating a waste electronic part-mounted printed circuit board which prevents the generation of harmful components and the deterioration of useful materials and simply separates and recovers the useful materials for reproducing resources. SOLUTION: An electronic part-mounted printed circuit board is thermally decomposed together with a thermally decomposed liquid in an autoclave 1 to make the printed circuit board into a thermally decomposed liquid, and separated electronic parts and the like are recovered. The generated thermally decomposed liquid gas is separated into a thermally decomposed liquid and a harmful gas present therein in a condenser 9, and the thermally decomposed liquid is reutilized and the harmful gas is subjected to the treatment of decomposing the harmful components in an inclusive apparatus 14 for treating a harmful gas. Thus, by the chemical harmony having an effect of capable of economically making useful materials into resources without polluting the environment, the apparatus for treating an electronic part-mounted printed board can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for thermally decomposing a printed circuit board mounted on an electronic component, which is a composite material of a metal of a used home appliance and a synthetic resin molded article, in a short period of time (hereinafter referred to as "chemical fusion"). The present invention also relates to an electronic component-mounted printed board processing apparatus for separating harmful components, decomposing the components into recyclable components, and collecting the components.

[0002]

2. Description of the Related Art Conventionally, most processing apparatuses for processing a composite material of a metal and a resin molded article such as a printed board of this type use shredder dust. Japanese Patent Application Laid-Open No. 9-187751 discloses a method in which a resin is swollen to facilitate separation and collection of metals.
There is a patent publication that mixes iron and steel with the crushed printed circuit board, melts and separates the solder by heating and vibration, thermally decomposes the resin of the board into gas, and separates and recovers metals and non-metals. This is disclosed in Japanese Unexamined Patent Publication No. 9-262573.

[0003]

In such a conventional method of processing a printed circuit board, since it is ground and buried, it becomes a source of environmental pollution, and as a method of separating and recovering useful materials, the method of immersion in an aqueous solution is used together with solder to form a conductive material. Separation and separation of conductive metal foil requires time to penetrate, and those that separate and decompose solder and metals separately require a large amount of used household electrical appliances in the future due to complicated equipment processes and large equipment and operating costs. There is a problem in the processing of printed circuit boards that occur in Japan, which places a heavy burden on society and makes it difficult to recycle resources in line with environmental protection, so that useful materials can be reused without emitting harmful substances. There is a need to recover and match the recovered useful materials with the processing costs.

[0004] The present invention solves the above-mentioned conventional problems by reducing the volume of the processed material while preventing generation of harmful components and deterioration of useful materials, and facilitates separation and recovery for recycling. It is an object of the present invention to provide an apparatus and method for processing printed circuit boards mounted with electronic components by economical chemical fusion.

[0005]

According to the present invention, there is provided an apparatus for processing a printed circuit board on which electronic parts are mounted, wherein
A solution pump supplies a pyrolysis solution from a solution tank to a pressure cooker having a heating device so as to thermally decompose the electronic component-mounted printed circuit board, and stores the dissolved solution of the electronic component-mounted printed circuit board that is thermally decomposed in the pressure cooker. A waste liquid tank, a condenser for liquefying a pyrolysis solution gas generated during thermal decomposition, and a recovery tank for the pyrolysis solution communicating with the condenser are connected by piping.

According to the present invention, processing of printed circuit boards mounted with electronic components by chemical fusion that reduces the volume of the processed substrate by reducing the volume of the processed substrate while preventing the deterioration of useful materials, thereby facilitating the separate collection for recycling. The device is obtained.

Another means is to provide a separation device utilizing an evaporation temperature difference and a pressure difference for separating a pyrolysis solution gas into a pyrolysis solution and impurities, and a gas not condensed by a condenser is supplied through an air supply pump. And a harmful gas treatment device communicating with the recovery tank.

[0008] As still another means, it is possible to very easily oxidize and burn carbonized products, which are generated during thermal decomposition and which are attached to the periphery of a printed circuit board after thermal decomposition treatment and around a pressure cooker, and are gasified. Equipped with air intake.

According to the present invention, there is provided a processing apparatus for a printed circuit board mounted with electronic components by chemical fusion, which prevents the harmful components from dissipating into the environment and facilitates the separation and recovery of useful materials.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a heat pump for heating and decomposing a printed circuit board on which electronic components are mounted. A pyrolysis solution is supplied from a solution tank to a pressure cooker by a solution pump. The dissolved liquid of the mounted printed circuit board is stored in a waste liquid tank provided below the pressure cooker, and the pyrolysis solution gas generated at the time of thermal decomposition passes through the separation device, is introduced into the condenser and cooled, and the liquefied product is transferred to the condenser. The solution is sent to the communicating pyrolysis liquid recovery tank. Then, the pyrolysis liquid collected in the recovery tank can be returned to the solution tank and continuously supplied while mixing with the new solution. One that does not connect the tank can be made.

In addition, a separator provided with a decompression device utilizing an evaporation temperature difference for separating a pyrolysis solution gas into a pyrolysis solution and a harmful component gas is provided in front of the condenser, one of which is not condensed by the condenser. And a harmful gas treatment device that communicates with the collection tank via an air supply pump, and harmful gases other than the hot solvent liquid can be removed by adsorption or combustion.

[0012] Further, an air intake is provided for oxidizing and burning carbon products, which are attached to the printed circuit board residue after heat decomposition treatment and the periphery of the pressure cooker, generated during thermal decomposition, and very easily. At a high temperature after the heat treatment, air is sent to oxidize and burn the carbon product so that the residue can be reduced and the pressure cooker can be easily maintained.

Further, a mesh-shaped storage basket for enclosing electronic components separated from a printed circuit board which becomes a solution by the thermal decomposition of the pressure cooker is mounted on the pressure cooker. It can be removed from the pressure cooker.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0015]

(Embodiment 1) As shown in FIG. 1, a pressure cooker 1 for heating and disassembling a printed circuit board on which electronic components are mounted has an electric heater 2 as a heating device, and a lid 3 which is fully open at the top. The lid 3 has a solution tank 4 for supplying a pyrolysis solution, a solution pump 6, a closing valve 7 a, a check valve 8, which are arranged downstream in the order of a pipe 5 a.
A pipe 5b for communicating the pyrolysis solution gas of the pyrolysis solution heated in the pressure cooker 1 is provided with a closing valve 7b.
A release valve 10, an air inlet valve 17, and an air discharge valve 18 are provided at the top. The condenser 9 is provided with a temperature control device (not shown) for controlling the heat exchange temperature. A pipe 5g hangs down from the bottom of the separator and communicates with the waste liquid tank 11 via a closing valve 7h. A pipe 5c hangs down from the bottom of the pressure cooker 1 and communicates with the waste liquid tank 11 through a closing valve 7d. From the upper part of the waste liquid tank 11, a pipe 5d is connected to a pipe downstream of the condenser 9 through a closing valve 7e. They are joining. The downstream side of the condenser 9 communicates with an upper part of a recovery tank 12 for liquefied pyrolysis solution gas. In addition, from the upper part of the recovery tank 12, a pipe 5e communicates with the harmful gas processing device 14 via a closing valve 7f and an air supply pump 13 in order in a downstream direction. A processing process is configured by connecting a pipe 5f from the lower part of the recovery tank 12 to the solution tank 4 via a closing valve 7g. Further, the solution tank 4 is connected to a supply tank 18 for supplying a new pyrolysis solution. In the pressure cooker 1, a storage basket 15 for mounting a printed circuit board as a processing object is mounted.

A series of processes are completed by turning on a closing valve, which is disposed at various points in the process, and sequentially operating a solution pump, an electric heater, an air supply pump, and the like by a pressure gauge, a temperature sensor, and a timer. be able to.

In the above configuration, a waste electronic component mounting printed board is loaded into a mesh-like storage basket 15 mounted on the pressure cooker 1, and the lid 3 is closed and sealed. The closing valves of the pipes 5 are all closed. First, the closing valve 7a is opened, and then the solution pump 6 is opened.
Is driven to fill a predetermined amount of the pyrolysis solution in the solution tank 4 into the pressure cooker 1 and heated by the electric heater 2 at a predetermined temperature for a predetermined time. The pyrolysis solution turns into a gas at high temperature and high pressure and dissolves the resin component contained in the printed circuit board. At this time, if there is an abnormality in the internal pressure, the release valve 10 is opened. After a lapse of a predetermined time, the closing valve 7b of the pipe 5b is opened, the pyrolysis solution gas flows into the condenser 9, the closing valve 7b is closed, and then the closing valve 7d of the pipe 5c at the bottom of the pressure cooker 1 is opened, and The resin constituting the printed circuit board is dropped into the waste liquid tank 11 and closed. Further, the closing valve 17 of the air intake port and the closing valve 18 of the exhaust port are opened, air is supplied to oxidize the carbide inside the pressure cooker, and the exhaust gas is discharged from the exhaust port through the exhaust gas treatment device. Close. Then, the lid 3 is opened, the storage basket 15 containing the electronic components separated from the printed circuit board is lifted from the pressure cooker 1, and various large and small conductive metal components are collectively collected. And mounted on the pressure cooker 1. During this time, the energization of the electric heater 2 is continued, and the next process is started immediately without lowering the temperature. Since the pyrolysis solution gas generated when melting is also evaporated from the dissolved liquid of the printed circuit board stored in the waste liquid tank 11, the closing valve 7 of the pipe 5d is
e is opened and sent to the collection tank 12. Separation device 1
Numeral 6 has an appropriate volume, and a throttle section is provided on the inlet side of the separation device so as to reduce the pressure of the pyrolysis solution gas.
If the gas temperature is lowered by the pressure drop but the temperature is not lowered to the evaporation temperature of the pyrolysis solution, impurities having a high evaporation temperature among the impurities mixed with the pyrolysis solution are liquefied and accumulated at the bottom of the separation device. The impurities accumulated at the bottom are dropped into the waste liquid tank by opening the closing valve 7h at a predetermined processing amount. In the condenser 9, when the pyrolysis solution gas is cooled and liquefied by the temperature control device, only the pyrolysis solution gas is liquefied, and the harmful gas component is temporarily stored as a gas in the recovery tank 12, and the pyrolysis solution is closed by a closing valve of the pipe 5f. 7 g is opened and returned to the solution tank 4, and the harmful gas filled in the upper part of the recovery tank 12 is opened by closing the closing valve 7 f of the pipe 5 e, sent to the harmful gas treatment device 14 by the air supply pump 13 and made harmless and discharged. This makes the printed circuit board brittle and harmless.

(Embodiment 2) As shown in FIG. 2, a pressure cooker 1 for heating and disassembling a printed circuit board on which electronic components are mounted uses an electric heater 2 as a heating device, and has a lid 3 which is fully open at the top. The lid 3 is connected to a solution tank 4 for supplying a pyrolysis solution through a pipe 5a in a downstream order through a solution pump 6, a closing valve 7a, and a check valve 8, and the pyrolysis heated in the pressure cooker 1. The pipe 5b for sending out the pyrolysis solution gas of the solution is a closing valve 7
A release valve 10, an air inlet valve 17, and an air discharge valve 18 are provided at the top, communicating with the separator 16 and the condenser 9 via b. The condenser 9 is provided with a temperature control device (not shown) for controlling the heat exchange temperature. A pipe 5g hangs down from the bottom of the separator and communicates with the waste liquid tank 11 via a closing valve 7h. Piping 5c from the bottom of pressure cooker 1
Hangs down and communicates with the waste liquid tank 11 through the closing valve 7d,
From the upper part of the waste liquid tank 11, a pipe 5d joins a pipe downstream of the condenser 9 via a closing valve 7e. The downstream side of the condenser 9 communicates with an upper part of a recovery tank 12 for liquefied pyrolysis solution gas. In addition, from the upper part of the recovery tank 12, a pipe 5e communicates with the harmful gas processing device 14 via a closing valve 7f and an air supply pump 13 in order in a downstream direction. The pyrolysis solution recovered in the recovery tank 12 is used by regenerating it in another process.

A series of processes are completed by turning on a solution pump, an electric heater, an air supply pump, and the like sequentially with a pressure gauge, a temperature sensor, and a timer, by electrically operating a closing valve disposed at various places in the process. be able to.

As in the case of the first embodiment, in the above configuration, a waste electronic component-mounted printed circuit board is loaded into a mesh-like storage basket 15 mounted on the pressure cooker 1, and the lid 3 is closed and sealed.
The closing valves of the pipe 5 are all closed. First, the closing valve 7a is opened, and then the solution pump 6 is driven to fill the pressure vessel 1 with the pyrolysis solution in the solution tank 4 in a predetermined amount. Heat for a predetermined time. The pyrolysis solution turns into a gas at high temperature and high pressure and dissolves the resin component contained in the printed circuit board.
At this time, if there is an abnormality in the internal pressure, the release valve 10 is opened. After a lapse of a predetermined time, the closing valve 7b of the pipe 5b is opened, the pyrolysis solution gas flows into the condenser 9, the closing valve 7b is closed, and then the closing valve 7d of the pipe 5c at the bottom of the pressure cooker 1 is opened, and Waste resin in the waste liquid tank 1
Drop into 1 and close. Further, the closing valve 17 of the air intake port and the closing valve 18 of the exhaust port are opened, air is supplied to oxidize the carbide inside the pressure cooker, and the exhaust gas is discharged from the exhaust port through the exhaust gas treatment device. Close. Then, the lid 3 is opened, the storage basket 15 containing the electronic components separated from the printed circuit board is lifted from the pressure cooker 1, and various large and small conductive metal components are collectively collected. And mounted on the pressure cooker 1. During this time, the energization of the electric heater 2 is continued, and the next process is started immediately without lowering the temperature. Since the pyrolysis solution gas generated when melting is also evaporated from the dissolved liquid of the printed circuit board stored in the waste liquid tank 11, the closing valve 7e of the pipe 5d is opened and sent to the collection tank 12.
The separation device 16 has an appropriate volume and has a throttle at the inlet side of the separation device so as to reduce the pressure of the pyrolysis solution gas. If the gas temperature is lowered by the pressure drop but the temperature is not lowered to the evaporation temperature of the pyrolysis solution, impurities having a high evaporation temperature among the impurities mixed with the pyrolysis solution are liquefied and accumulated at the bottom of the separation device. The impurities accumulated at the bottom are dropped into the waste liquid tank by opening the closing valve 7h at a predetermined processing amount. In the condenser 9, when the pyrolysis solution gas is cooled and liquefied by the temperature controller, only the pyrolysis solution gas is liquefied,
The harmful gas component is temporarily stored as a gas in the recovery tank 12, the pyrolysis solution is returned to the solution tank 4 by opening the closing valve 7g of the pipe 5f, and the harmful gas filled in the upper part of the recovery tank 12 is closed by the pipe 5e. The printed circuit board is embrittled and rendered harmless by opening the valve 7f and sending it to the harmful gas treatment device 14 by the air supply pump 13 to make it harmless and discharge it.

The solution used as the thermal decomposition solution in Example 1 or Example 2 uses an aromatic organic solvent or the like and raises the temperature to 300 ° C. or more in a pressure cooker to promote chemical fusion.

[0022]

As apparent from the above embodiments, according to the present invention, the printed circuit board mounted with electronic components thermally decomposed in the pressure cooker is separated into a residue and a pyrolysis solution gas, and some harmful gases are removed. Is detoxified after being detoxified through a harmful gas adsorption device, most of the pyrolysis solution gas is regenerated into a solution through a condenser or the like, and the residue is used as a reducing agent or the like. Also, there is a need to provide a processing apparatus capable of processing printed circuit boards mounted with electronic components without polluting the environment, for example, by recovering electronic parts and metal parts detached when the printed circuit boards are thermally decomposed and recycling them to useful materials. it can.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a first embodiment of the present invention.

FIG. 2 is a configuration diagram of a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pressure cooker 2 Electric heater 3 Lid 4 Solution tank 5f Piping 6 Solution pump 9 Condenser 11 Waste liquid tank 12 Recovery tank 13 Air supply pump 14 Harmful gas treatment device 15 Storage basket 16 Separation device 19 Supply tank

Continued on the front page (72) Inventor Kazuhiro Muraoka 6-2-61 Imafukunishi, Joto-ku, Osaka-shi, Osaka F-term in Matsushita Seiko Co., Ltd. 4D004 AA24 AC05 BA03 BA05 CA24 CA36 CA41 CA47 CB04 CB05 CB32 CB42 CB43 CB50 DA02 DA06 DA07 4F301 CA09 CA23 CA26 CA41 CA53 CA61 CA62 CA63 CA65 CA67 CA72 CA73

Claims (6)

[Claims] 1. A pressure cooker having a heating device for thermally decomposing a printed circuit board on which electronic components are mounted, a solution tank for supplying a pyrolysis solution to the pressure cooker by a solution pump, and thermal decomposition generated during the heat decomposition in the pressure cooker. A condenser for liquefying the solution gas and a pyrolysis solution recovery tank communicating with the condenser connected by a pipe, and furthermore, the recovery tank and the solution tank are connected by a pipe; Processing equipment. 2. A pressure cooker having a heating device for heating and decomposing a printed circuit board on which electronic components are mounted, a solution tank for supplying a pyrolysis solution to the pressure cooker with a solution pump, and thermal decomposition generated during the heat decomposition in the pressure cooker. An electronic component-mounted printed circuit board processing apparatus, wherein a condenser for liquefying a solution gas and a recovery tank for a pyrolysis solution communicating with the condenser are connected by a pipe. 3. A separating device is provided between the pressure cooker and the condenser and separates the pyrolysis solution gas discharged from the pressure cooker into a pyrolysis solution and other impurities by a difference in evaporation temperature and pressure. The processing device for a printed circuit board mounted with electronic components according to claim 1. 4. An air supply pump for sending a gas stored in a collection tank without being condensed by a condenser out of a pyrolysis solution gas discharged from a pressure cooker to a harmful gas treatment device communicating with the collection tank. 3. The processing apparatus for printed circuit boards with electronic components according to claim 1, wherein the processing can be performed quickly. 5. A method for oxidizing and burning the residual carbon content and the carbon content attached to the inner wall of the pressure cooker into a residue after the printed circuit board is thermally decomposed by the pressure cooker, and gasifying the residue by introducing air into the pressure cooker. 3. The apparatus for processing an electronic component-mounted printed circuit board according to claim 1, further comprising a pressure cooker capable of introducing air. 6. An electronic component-mounted printed board processing apparatus according to claim 1, wherein a storage basket for accommodating an electronic component separated from the printed circuit board which becomes a solution by thermal decomposition in the pressure cooker is mounted on the pressure cooker. .