JP2002124546A - Adhesive sheet for semiconductor device and semiconductor device using the sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tape for TAB that has a small amount of warpage and superior machining characteristics, and a semiconductor device using the tape. SOLUTION: This adhesive sheet for semiconductor deices has a laminate comprising at least one protection fm layer and an adhesive layer. In this case, the adhesive layer should contain a compound having an oxetane ring.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape automated bonding (T)
The present invention relates to an adhesive sheet for a semiconductor device (hereinafter, referred to as a TAB tape) used in the AB) method, a substrate for connecting a semiconductor integrated circuit, and a semiconductor device using the same.

[0002]

2. Description of the Related Art An ordinary TAB tape is obtained by laminating a non-cured adhesive layer and a polyester film having releasability as a protective film layer on a flexible organic insulating film such as a polyimide film. It has a three-layer structure.

[0003] TAB tapes include (1) perforation of sprocket and device holes, (2) thermal lamination with copper foil,
It is processed into a TAB tape (pattern tape) through processing steps such as (3) curing of the adhesive layer, (4) pattern formation (resist coating, etching, resist removal), and (5) tin or gold-plating. FIG. 1 shows the shape of the pattern tape. An adhesive 2 on an organic insulating film 1;
There is a conductor pattern 5, a sprocket hole 3 for feeding a film, and a device hole 4 for installing a device. FIG. 2 is a cross-sectional view of one embodiment of the semiconductor device of the present invention. The inner lead portion 6 of the pattern tape is thermocompression-bonded (inner lead bonding) to the gold bump 10 of the semiconductor integrated circuit 8 having the protective film 11, and the semiconductor integrated circuit is mounted.
Next, a semiconductor device is manufactured through a resin sealing step using a sealing resin 9. In addition, there is also adopted a method in which a conductor of a pattern tape and a gold bump of a semiconductor integrated circuit are connected by wire bonding without having an inner lead portion. Such a semiconductor device is called a tape carrier package (TCP) type semiconductor device. Finally, the TCP type semiconductor device is connected to a circuit board or the like on which other components are mounted via outer leads 7 (outer lead bonding).
Then, mounting on an electronic device is performed.

On the other hand, as electronic devices have become smaller and lighter in recent years, a semiconductor package has a QFP (quad flat flat) in which conventional connection terminals (outer leads) are arranged on the side of the package for the purpose of high-density mounting. Package), S
Instead of an OP (Small Outline Package), a BGA (Ball Grid Array) in which connection terminals are arranged on the back surface of the package, and a CSP (Chip Scale Package) have been used mainly for portable devices. BGA and CSP are the most structurally different from QFP and SOP in that the former requires a substrate called an interposer, while the latter requires a substrate by using a metal lead frame. And not. As the interposer referred to here, one obtained by bonding a copper foil to an organic insulating film such as a glass epoxy substrate or polyimide is generally used.

In any of the above package forms, since the adhesive layer of the adhesive tape for a semiconductor device ultimately remains in the package, it is necessary to satisfy various properties such as insulation, heat resistance and adhesiveness. Is done. As electronic devices have become smaller and higher in density, the pattern pitch (conductor width and conductor width) of semiconductor connection substrates has become extremely narrow, and the need for adhesives having high processing characteristics has become necessary. Is growing.

[0006]

On the other hand, when wire bonding is performed on a TAB tape, if the adhesive layer has a low elastic modulus, the adhesive layer is softened by heat generated by a bonder, and the wiring pattern is dented or the wire is dented. Connection failure between the wiring pattern. On the other hand, when the elastic modulus of the cured adhesive is increased, the dent of the wiring pattern and the bonding failure are improved, but the TAB tape is warped. In general, an adhesive has a property of contracting from an uncured state with curing. When the elasticity of the cured adhesive layer is small, the warpage is small, but as the elasticity of the cured adhesive layer increases, the warpage tends to increase.

If the TAB tape is warped, it is not easy to handle the TAB tape when transporting or assembling the TAB tape. Further, it is difficult to apply the resist to the warped TAB tape so as to have a uniform thickness, and the thickness of the obtained resist layer becomes uneven. When a mask is applied to such a resist layer, and exposure and development are performed, only inaccurate patterns can be obtained. As a result, inaccurate wiring patterns can be obtained. Therefore, there has been a need for an adhesive layer having a high elastic modulus after curing and a small warpage of the TAB tape.

The present invention has been made in view of the background of the prior art,
TA with low warpage of TAB tape and excellent processing characteristics
A tape for B and a semiconductor device using the same are provided.

[0009]

The present invention relates to an adhesive sheet for a semiconductor device having a laminate comprising at least one protective film layer and an adhesive layer, wherein the adhesive layer comprises a thermal polymerization initiator. An adhesive sheet for a semiconductor device, comprising a compound having an oxetane ring.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.

The present inventors have conducted intensive studies on the adhesive composition of TAB tapes in order to achieve the above object, and as a result, have found that compounds having an oxetane ring (oxetane compounds)
The present inventors have found that a TAB tape which solves the above problem can be obtained by using the above-mentioned method, and have reached the present invention.

The compound having an oxetane ring used in the present invention is characterized by extremely low curing shrinkage due to small distortion of the oxetane ring when heated. In addition, in the curing reaction in the presence of the oxetane compound and the thermal polymerization initiator, cationic ring-opening polymerization is performed, and all the cross-linking portions become ether bonds, so there is no highly hygroscopic ester bond or free hydroxyl group, It is characterized by low hygroscopicity and excellent electrical properties.

The compound having an oxetane ring used in the present invention is preferably a compound represented by the following general formulas (1) to (14).

[0014]

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In the general formula (2), Z represents an oxygen atom or a sulfur atom. R ₁ is a carbon atom such as an alkyl group having 1 to 6 carbon atoms such as a hydrogen atom, a fluorine atom, a methyl group, an ethyl group, a propyl group, and a butyl group, a trifluoromethyl group, a perfluoroethyl group, and a perfluoropropyl group. It is selected from an aryl group having 6 to 18 carbon atoms such as a fluoroalkyl group having 1 to 6 atoms, a phenyl group and a naphthyl group, a furyl group or a thienyl group. R ₂ is a hydrogen atom, a methyl group, an ethyl group, a propyl group, an alkyl group having 1 to 6 carbon atoms such as a butyl group, a 1-propenyl group, a 2-propenyl group, a 2-methyl-1-propenyl group, 2-methyl-
2-propenyl group, 1-butenyl group, 2-butenyl group,
An alkenyl group having 2 to 6 carbon atoms such as a 3-butenyl group, an aryl group having 6 to 18 carbon atoms such as a phenyl group, a naphthyl group, an antonyl group, a phenanthryl group, a benzyl group, a fluorobenzyl group, and a methoxybenzyl group Having other aromatic rings such as phenethyl group, styryl group, cinnamyl group, substituted or unsubstituted aralkyl group having 7 to 18 carbon atoms such as ethoxybenzyl group, aryloxyalkyl such as phenoxymethyl group, phenoxyethyl group. An alkoxycarbonyl group having 2 to 6 carbon atoms such as an alkylcarbonyl group having 2 to 6 carbon atoms, an ethoxycarbonyl group, a propoxycarbonyl group and a butoxycarbonyl group, such as a group, an ethylcarbonyl group, a propylcarbonyl group, and a butylcarbonyl group. Group, ethylcarbamoyl group, propylcarbamoyl group Butylcarbamoyl group, selected from N- alkylcarbamoyl group -C 2-6 such pentylcarbamoyl group.

[0016]

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In the general formula (3), R1 is as defined in the general formula (2). R ₃ is a linear or branched linear or branched alkylene group having 1 to 20 carbon atoms, such as an ethylene group, a propylene group or a butylene group, a poly (ethyleneoxy) group, or a poly (propyleneoxy) group. Alternatively, a linear or branched unsaturated hydrocarbon group such as a branched poly (alkyleneoxy) group having 1 to 12 carbon atoms, a propenylene group, a methylpropenylene group, a butenylene group, a carbonyl group, a carbonyl group It is selected from an alkylene group containing a group, an alkylene group containing a carboxyl group in the middle of a molecular chain, and an alkylene group containing a carbamoyl group in the middle of a molecular chain. R ₃ may have a polyvalent group selected from the groups represented by the following general formulas (4), (5) and (6).

[0018]

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In the general formula (4), R ₄ represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a methoxy group, an ethoxy group, a propoxy group, 1-4 carbon atoms such as butoxy group
Selected from an alkoxy group, a halogen atom such as a chlorine atom and a bromine atom, a nitro group, a cyano group, a mercapto group, a lower alkylcarboxyl group, a carboxyl group, or a carbamoyl group, and x is an integer of 1 to 4.

[0020]

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In the general formula (5), R ₅ is an oxygen atom, a sulfur atom, a methylene group, -NH-, -SO-, -S
It is selected from O ₂ —, —C (CF ₃ ) ₂ , — or —C (CH ₃ ) ₂ —.

[0022]

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In the general formula (6), R ₆ is a group having 1 carbon atom such as a methyl group, an ethyl group, a propyl group and a butyl group.
It is selected from C4 to C18 aryl groups such as .about.4 alkyl groups or phenyl groups and naphthyl groups. y is
It is an integer of 0 to 200. R ₇ is a methyl group, an ethyl group,
An alkyl group having 1 to 4 carbon atoms such as a propyl group and a butyl group, or a 6 to 6 carbon atom such as a phenyl group and a naphthyl group.
18 aryl groups, selected from groups represented by the following general formula (7).

[0024]

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In the general formula (7), R ₈ is a group having 1 carbon atom such as a methyl group, an ethyl group, a propyl group and a butyl group.
It is selected from C4 to C18 aryl groups such as .about.4 alkyl groups or phenyl groups and naphthyl groups. z is
It is an integer of 0 to 100.

In addition to the above, compounds represented by the following general formula (8) can be used.

[0027]

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In the general formula (8), R1 is as defined in the general formula (2). R ₉ represents a trivalent to divalent organic group, and is a branched or linear alkylene group having 1 to 30 carbon atoms, such as a group represented by the following formulas (9) to (11); A branched poly (alkyleneoxy) group such as a group represented by 12) or the following formula (13) or (1)
It is selected from the linear or branched polysiloxane-containing groups represented by 4). j shows the integer of 3-10 equal to the valence of R9.

[0029]

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In the general formula (9), R ₁₀ is a methyl group,
It is selected from an alkyl group having 1 to 6 carbon atoms such as an ethyl group and a propyl group.

[0031]

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In the general formula (12), L may be the same or different and is an integer of 1 to 10.

As the compound having an oxetane ring, other than the above, a polystyrene-equivalent number average molecular weight of 1
Compounds having a high molecular weight of about 000 to 5000 can also be used.

Preferred specific examples of the compound having an oxetane ring are listed below: carbonate bisoxetane, adipate bisoxetane, terephthalate bisoxetane, xylylene bisoxetane, MDI bisoxetane, bisoxetane cyclohexanedicarboxylate, (3
-Ethyl-3-oxetanylmethoxy) methylbenzene, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, 1,2-bis (3-ethyl-3-oxetanylmethoxy) ethane, trimethylol And propane tris (3-ethyl-3-oxetanylmethyl) ether, more preferably carbonate bisoxetane, adipate bisoxetane,
It is preferable to contain at least one of terephthalate bisoxetane, xylylene bisoxetane, MDI bisoxetane, and bisoxetane cyclohexanedicarboxylate from the viewpoint of curing shrinkage and compatibility with other components.

The content of the oxetane compound in the adhesive layer is preferably 0.1 to 80% by weight, more preferably 0.5 to 70% by weight. If it is less than 0.1% by weight, the adhesiveness tends to decrease, and if it is more than 80% by weight, the flexibility of the adhesive layer tends to be impaired.

In the adhesive layer of the present invention, an epoxy compound can be used in addition to the compound having an oxetane ring. Specific epoxy compounds include a phenol novolak type epoxy compound, a cresol novolak type epoxy compound, a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a bisphenol S type epoxy compound, a thiodiphenol, a phenol and a xylylene bond of naphthols. Aralkyl resin epoxy compound, phenol-dicyclopentadiene resin epoxy compound, cycloaliphatic epoxy compound,
Heterocyclic epoxy compounds, glycidyl ester-type epoxy compounds obtained by the reaction of polybasic acids such as phthalic acid and dimer acid with epichlorohydrin, polyamines such as diaminodiphenylmethane, diaminodiphenylsulfone and isocyanuric acid and epichlorohydrin Glycidylamine type epoxy compound, brominated epoxy compound, ε-caprolactone-modified 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, trimethylcaprolactone-modified 3,4-epoxycyclohexylmethyl-
Use of an epoxy compound having a cyclohexene oxide structure, such as 3 ′, 4′-epoxycyclohexanecarboxylate and β-methylδvalerolactone-modified 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate. Can be. Further, an organopolysiloxane having a glycidyl group or a silicon-modified epoxy compound obtained by reacting the above-described epoxy compound with a carboxyl-containing organosiloxane can be used, but the present invention is not limited thereto. Also, at least one of these epoxy compounds or silicon-modified epoxy compounds may be used in combination. Among these, a cycloaliphatic epoxy compound that performs a cation ring opening reaction is preferably used.

The mixing ratio of the oxetane compound and the epoxy compound in the adhesive layer of the present invention is preferably from 0.1 to 5 parts by weight of the epoxy compound to 100 parts by weight of the oxetane compound.
0 parts by weight. If the content of the epoxy compound is too small, it is not effective in increasing the speed of the initiation reaction, and if the content is too large, the warpage after curing tends to be large, and the storage stability is greatly reduced.

The adhesive layer of the present invention contains a thermal polymerization initiator, and among such thermal polymerization initiators,
A cationic thermal polymerization initiator that generates an acid upon heating is preferably used. Specific examples of the cationic thermal polymerization initiator include a metal chelate compound and a sulfonium salt compound.
Certain compounds are preferably used. As metal chelate compounds, aluminum trisacetylacetonate,
Examples of the sulfonium salt compound include dialkylbenzylsulfonium, benzyl-4-hydroxyphenylmethylsulfonium, hexafluoroantimonate, benzyl-4-hydroxyphenylmethylsulfonium, hexafluoroantimonate, benzyl-4-methoxyphenylmethylsulfonium, and hexafluoroantimony. Benzyl-2-methyl-4-hydroxyphenylmethylsulfonium, hexafluoroantimonate,
Benzyl-3-chloro-4-hydroxyphenylmethylsulfonium and the like can be used. Specific examples of commercially available cationic thermal polymerization initiators include “San Aid S”
I "series (manufactured by Sanshin Chemical Co., Ltd.) can be used. These cationic thermal polymerization initiators may be used alone or in combination of two or more.

The cationic thermal polymerization initiator is preferably used in an amount of 0.1 to 100 parts by weight of the compound having an oxetane ring.
10 to 10 parts by weight, more preferably 0.5 to 5 parts by weight. If the content of the cationic thermal polymerization initiator is too small, the cationic polymerization reaction rate (curing rate) decreases,
Sufficient cured product cannot be obtained or it takes time. If the content of the cationic thermal polymerization initiator is too large, the storage stability is reduced, and the electrical insulation of the adhesive layer is reduced.

In the present invention, a thermoplastic resin may be contained in addition to the thermal polymerization initiator and the oxetane compound, and the thermoplastic resin used in the present invention exhibits plasticity in a temperature range of 80 ° C. to 200 ° C. The resin is not particularly limited, and examples of such a resin include polyolefins such as polyethylene, polypropylene, and ethylene copolymer resin, polystyrene, and AB.
S-based resin such as S resin, polyvinyl chloride, vinylidene chloride, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyarylate resin, polyoxybenzoyl, polycarbonate,
Examples include polyacetal and polyphenylene ether.

Of these, polyamide resins are preferably used because of their good deterioration at high temperatures and good electrical properties. Various known polyamide resins can be used. In particular, it is preferable that the adhesive layer has flexibility and contains dicarboxylic acid (so-called dimer acid) having a low water absorption of 36 carbon atoms as an essential component. Polyamide resin containing dimer acid is obtained by polycondensation of dimer acid and diamine according to a conventional method.In this case, adipic acid other than dimer acid, azelaic acid, dicarboxylic acid such as sebacic acid is contained as a copolymer component. Is also good. Known diamines such as ethylenediamine, hexamethylenediamine, and piperazine can be used as the diamine, and two or more diamines may be mixed from the viewpoint of hygroscopicity and solubility.

The proportion of the thermoplastic resin contained in the adhesive layer is preferably in the range of 1 to 90% by weight. If it is less than 1% by weight, there is a problem in flexibility, and the adhesive layer may be cracked. On the other hand, if it is more than 90% by weight, the insulation property is deteriorated and the reliability is lowered. More preferably, the range is 20 to 70% by weight.

Further, the adhesive layer of the present invention may contain a curing agent, such as polyamines such as diethylenetriamine, triethylenetetramine, metaxylenediamine, and diaminodiphenylmethane; polyamides such as dimer acid polyamide; phthalic anhydride; Acid anhydrides such as methyl phthalic anhydride, hexahydrophthalic anhydride, trimellitic anhydride, and methyl nadic anhydride, 3-aminophenol, resorcinol, catechol, hydroquinone, pyrogallol, 3-hydroxybenzoic acid, 3-cyanophenol, , 3-diaminophenol, 2-amino-3-hydroxybenzoic acid, 3-hydroxyphenylacetamide, 3-hydroxyisophthalic acid, 3-hydroxyphenylacetic acid and 3-phenolsulfonic acid,
Phenolic resins such as resole, phenol novolak, phenol aralkyl, bisphenol A, bisphenol F, etc., tertiary amines such as polymercaptan, 2-ethyl-4-methylimidazole, tris (dimethylaminomethyl) phenol, etc., trifluoride Lewis acid complexes such as boron-ethylamine complex.

Among them, a phenol resin is preferably used as a curing agent. Phenol resin is a suitable blend material having good compatibility with polyamide and imparting appropriate heat resistance and breaking strength to polyamide by thermosetting. Such heat resistance and breaking strength are ultimately important for the balance between insulation and adhesion.

The amount of the curing agent added is preferably 0.1 to 80% by weight of the adhesive layer, and more preferably 20 to 70% by weight.
% By weight is good. If the amount is less than 0.1% by weight, the heat resistance decreases. If the amount exceeds 80% by weight, the flexibility of the adhesive layer is impaired, and the adhesive layer is cracked.

Further, addition of a curing accelerator to the adhesive layer of the present invention is not limited at all. For example, aromatic polyamines, amine complexes of boron trifluoride such as boron trifluoride triethylamine complex, imidazole derivatives such as 2-alkyl-4-methylimidazole and 2-phenyl-4-alkylimidazole, phthalic anhydride, trianhydride Organic acids such as melitic acid, dicyandiamide, and known compounds such as triphenylphosphine can be used. The amount of the curing accelerator added is preferably in the range of 10% by weight or less in the adhesive layer.

In addition to the above components, the addition of organic or inorganic components such as an antioxidant and an ion scavenger is not limited as long as the properties of the adhesive are not impaired.

In the present invention, if necessary, a flexible insulating film may be used in addition to the protective film and the adhesive layer, which may be made of polyimide, polyester, polyphenylene sulfide, polyether sulfone, polyether ether. A thickness of 25 to 125 μ made of a plastic such as ketone, aramid, polycarbonate, polyarylate or a composite material such as an epoxy resin impregnated glass cloth.
m, and a plurality of films selected from these may be laminated and used. If necessary, a surface treatment such as hydrolysis, corona discharge, low-temperature plasma, physical surface roughening, and easy adhesion coating treatment can be performed.

The protective film layer in the present invention is not particularly limited as long as it can be peeled from the adhesive surface without damaging the form of the TAB tape before heat laminating the copper foil.
For example, a polyester film or a polyolefin film coated with a silicone or fluorine compound, and a paper obtained by laminating the same.

Next, regarding the adhesive sheet of the present invention, TA
The method of manufacturing the tape with the adhesive for B will be described as an example. A paint in which the adhesive composition is dissolved in a solvent is applied to a flexible insulating film and dried. It is preferable to apply the adhesive layer so that the film thickness is 5 to 25 μm. Drying conditions are 100 to 200 ° C. for 1 to 5 minutes. The solvent is not particularly limited, but toluene, xylene,
Mixtures of aromatics such as chlorobenzene and alcohols such as methanol, ethanol and propanol are preferred. A protective film is laminated on the film thus obtained, and finally slit into a width of about 35 to 158 mm.

A substrate for semiconductor connection can be manufactured using the tape with an adhesive for a semiconductor device thus obtained. Further, a semiconductor device can be manufactured using the semiconductor connection substrate. The tape with an adhesive for TAB of the present invention can be used for the semiconductor devices such as BGA and CSP described above, and the obtained BGA and CSP are also included in the semiconductor device of the present invention.

[0052]

EXAMPLES The present invention will be described below with reference to examples.
The present invention is not limited to these examples. Before starting the description of the embodiments, an evaluation method will be described.

Evaluation method (1) Warp A tape sample with an adhesive for TAB having a width of 35 mm was 18
A μm electrolytic copper foil was laminated under the conditions of 140 ° C. and 0.1 MPa. Subsequently, in an air oven, heat treatment was sequentially performed at 80 ° C., 3 hours, 100 ° C., 5 hours, 150 ° C., and 5 hours to prepare a TAB tape with a copper foil. The obtained TAB tape with copper foil was cut into a size of 40 × 35 mm, and the entire copper foil was etched to obtain a warpage measurement sample. Warpage was measured with the adhesive layer facing up.
The average height (mm) of the corner was determined. (2) Elastic modulus measurement After laminating a film of only the adhesive layer using a laminator to a predetermined thickness, the film was heated at 80 ° C. for 3 hours, at 100 ° C. for 5 hours,
Heat treatment was sequentially performed at 50 ° C. for 5 hours to cure. Next, it was cut out into a predetermined shape and the elastic modulus was measured. The measurement was performed using a Seiko Instruments DMS6100.
The temperature was measured from room temperature to 260 ° C. at a vibration frequency of 1 Hz and a sample heating rate of 5 ° C./min. (3) Wire Bonding Property 100 wire bondings were performed with a bonder, and a bonding failure rate (%) due to a displacement, a dent due to sinking of the lead pattern into the adhesive layer, and the like were determined.

REFERENCE EXAMPLE 1 (Synthesis of polyamide resin) Dimer acid PRIPOL1009 (manufactured by Unichema) and adipic acid were used as the acid, and the acid / amine ratio was almost equal, and the acid / amine reactant, defoaming agent and 1% or less of a phosphoric acid catalyst was added to prepare a reactant. This reactant is
After stirring and heating at 140 ° C for 1 hour, the temperature was raised to 205 ° C, and the mixture was stirred for about 1.5 hours. It was kept under vacuum of about 2 kPa for 0.5 hour to lower the temperature. Finally, an antioxidant was added, and a polyamide resin having a weight average molecular weight of 20,000 and an acid value of 10 was taken out.

Examples 1 to 4 Preparation of Tape (Sheet) with Adhesive for Semiconductor The polyamide resin obtained in the reference example and the raw materials shown in Table 1 were used in Table 2
Were blended in the amounts shown in Table 1. Here, in the case of Example 1, 1 part by weight of the thermal polymerization initiator was added to 100 parts by weight of the oxetane compound. The blended raw material has a concentration of 20
The mixture was stirred and mixed at 30 ° C. with a mixed solvent of methanol / monochlorobenzene so as to obtain an adhesive solution at a concentration of 30% by weight. This adhesive was applied to a 25 μm-thick polyethylene terephthalate film (“Lumirror” manufactured by Toray Industries, Inc.) using a bar coater to a dry thickness of about 12 μm.
Drying was performed at 00 ° C. for 1 minute and at 160 ° C. for 2 minutes to prepare an adhesive sheet. Further, the obtained adhesive sheet is coated with a 75 μm-thick polyimide film (Ube Industries, Ltd.)
"UPILEX" 75S) at 120 ℃, 0.1MP
A tape with an adhesive for TAB was prepared by laminating under the conditions of a. Table 2 shows the results of the evaluation by the above-described evaluation method using the prepared tape.

Comparative Example 1 The procedure of Example 1 was repeated, except that the epoxy resin (V) shown in Table 1 was used instead of the oxetane compound of Example 1.

Comparative Example 2 The procedure of Example 1 was repeated, except that the epoxy resin (V) shown in Table 1 was used instead of the oxetane compound of Example 1, and the thermal polymerization initiator was removed.

Comparative Example 3 The procedure of Example 1 was repeated except that the oxetane compound was not used and the composition shown in Table 2 was used.

[0059]

[Table 1]

[0060]

[Table 2]

Table 2 shows that the examples using the oxetane compound of the present invention showed less warpage than the comparative examples not using them. Furthermore, in Comparative Example 3, the warpage was small, but the bonding failure rate in wire bonding was large.

[0062]

Industrial Applicability The present invention provides a novel TAB adhesive tape with excellent adhesiveness and a semiconductor device using the same industrially. The TAB tape has a small warpage and excellent processing characteristics. Provided is a TAB tape and a semiconductor device using the same.

[Brief description of the drawings]

FIG. 1 shows an embodiment of a pattern tape using an adhesive sheet for a semiconductor device of the present invention.

FIG. 2 illustrates one embodiment of a semiconductor device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Organic insulating film 2 Adhesive 3 Sprocket hole 4 Device hole 5 Conductor pattern 6 Inner lead part 7 Outer lead part 8 Semiconductor integrated circuit 9 Sealing resin 10 Gold bump 11 Protective film

Continued on the front page F term (reference) 4J004 AA11 AA17 AB05 CA04 CA06 CC02 CC03 CD05 CD06 FA05 4J005 AA07 BB02 4J040 EE031 HD43 JA09 JB02 KA12 MA02 MB03 NA20 PA23 PA30 5F044 MM11

Claims (6)

[Claims] An adhesive sheet for a semiconductor device having a laminate comprising at least one protective film layer and an adhesive layer, wherein the adhesive layer contains a thermal polymerization initiator and a compound having an oxetane ring. An adhesive sheet for a semiconductor device, comprising: 2. The compound having an oxetane ring is at least one selected from carbonate bisoxetane, adipate bisoxetane, terephthalate bisoxetane, xylylene bisoxetane, MDI bisoxetane and bisoxetane cyclohexanedicarboxylate. The adhesive sheet for a semiconductor device according to claim 1. 3. The adhesive sheet for a semiconductor device according to claim 1, wherein the thermal polymerization initiator contains a cationic thermal polymerization initiator. 4. The adhesive sheet for a semiconductor device according to claim 1, wherein the thermal polymerization initiator contains a metal chelate compound. 5. The adhesive sheet for a semiconductor device according to claim 1, wherein the thermal polymerization initiator is used in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the compound having an oxetane ring. 6. A semiconductor device using the adhesive sheet for a semiconductor device according to claim 1.