JP2002124442A - Device and method for forming electrode of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrode formation device that can satisfactorily and stably form an electrode in a chip. SOLUTION: Three working processes 1, 2, and 3 are carried out. In the working process 1, a movable carrier tape 1 and a fixing base plate 2 are used, the carrier plate 1 is moved on the base plate 2, and at the same time the chip C1 is thrown into a hole 1a of the carrier tape 1. In this case, the number of holes 1a for receiving the chip C1 in a specific posture are formed in the movable carrier tape 1, and the lower-surface side of the carrier tape 1 is covered for blocking the lower-end opening of the hole 1a, and the lower end of the chip C1 thrown into the hole 1a of the carrier tape 1 is supported while the lower end can be slid by the fixing type base plate 2. In the working process 2, conductive paste CP is applied to the projection of the chip 1 that exists in the hole 1a of the carrier tape 1, and at the same time is supported by the base plate 2. In the working process 3, the applied paste CP is dried.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for forming electrodes on the surface of an electronic component chip.

[0002]

2. Description of the Related Art Electronic components having electrodes on the surface, for example,
In order to obtain an electronic component EC such as a capacitor array or an inductor array having side electrodes EE as shown in FIG. 1, an apparatus for forming electrodes on the surface of an electronic component chip is used.

As shown in US Pat. No. 5,863,331, this device generally has a carrier tape having holding holes capable of elastically holding chips for electronic components at regular intervals in a tape length direction. A means for inserting a chip accommodated in a bulk state into a holding hole of a carrier tape in a predetermined posture, a means for applying a conductor paste for an electrode to the chip held by the carrier tape, and a chip Means for drying the conductive paste applied to the substrate.

[0004]

In the method of elastically holding the chip by the holding hole of the carrier tape, the resistance at the time of inserting the chip into the holding hole is affected by the tolerance of the plus side of the chip and the surface roughness. When the chip height is increased, the chip contact portion of the holding hole may be turned over to the chip projecting side when the chip is inserted into the holding hole. When such a curl occurs, the conductive paste may adhere to the curled portion when the conductive paste is applied to the chip. In addition, if the insertion of the chip into the holding hole becomes insufficient due to the influence of the push-back due to the restoration of the turning-up, etc., the intended amount of protrusion of the chip inserted into the holding hole may not be obtained. When the shortage of the protrusion occurs, there is a possibility that the conductive paste adheres to the periphery of the holding hole when the conductive paste is applied to the chip.

[0005] If the conductive paste adheres to the turned-up portion or the periphery of the holding hole, the shape of the electrode becomes distorted, or the adjacent electrodes are short-circuited. The yield of manufacturing electronic components is reduced. The above-mentioned inconveniences are more likely to occur as the chip size becomes smaller, and in particular, in view of the recent demand for smaller electronic components in the market, measures to solve the above inconveniences Is essential.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electrode forming apparatus and an electrode forming method for an electronic component capable of forming electrodes on a chip satisfactorily and stably. .

[0007]

In order to achieve the above-mentioned object, a first electrode forming apparatus is provided for applying a conductive paste for an electrode to a predetermined portion of a chip for an electronic component and drying the applied paste. An electrode forming apparatus, comprising: a movable carrier tape having a plurality of holes formed therein for receiving chips in a predetermined posture; a lower end opening of the hole being covered by covering a lower surface side of the carrier tape; A fixed base plate slidably supporting the lower end of the inserted chip, chip supply means for inserting the chip into a hole of the carrier tape in a state where the lower end opening is closed from the upper end opening side in a predetermined posture, and a carrier tape In the hole of
A first paste applying unit for applying a conductive paste for an electrode to the projecting portion of the chip supported by the base plate; a first drying unit for drying the conductive paste applied to the projecting portion of the chip; Front and back reversing means for reversing the front and back of the carrier tape after paste drying,
A chip moving means for moving the chip existing in the hole of the carrier tape after turning over inside the hole and projecting a portion of the chip opposite to the projecting portion from the upper end opening of the hole, and presenting the chip in the hole of the carrier tape, In addition, there are provided second paste applying means for applying a conductive paste for an electrode to the projecting portion of the chip supported by the base plate, and second drying means for drying the conductive paste applied to the projecting portion of the chip. That is its characteristic.

An electrode forming method according to this electrode forming apparatus is a method for forming an electrode of an electronic component, in which a conductive paste for an electrode is applied to a predetermined portion of a chip for an electronic component, and the applied paste is dried. A movable carrier tape with a large number of holes for receiving in a posture, and a lower end opening of the hole covering the lower surface side of the carrier tape, and a lower end of the chip inserted into the hole of the carrier tape can be slid. Using a fixed base plate to support, while moving the carrier plate on the base plate,
To insert a chip into the hole of the carrier tape, to apply a conductive paste to the projecting portion of the chip which is present in the hole of the carrier tape and supported by the base plate, and to dry the applied paste. Is its feature.

According to the first electrode forming apparatus and the first electrode forming method, the operation of putting the chip into the hole of the carrier tape while moving the carrier plate on the base plate, the operation of placing the chip in the hole of the carrier tape, Since the operation of applying the conductive paste to the projecting portion of the chip supported by the base plate and the operation of drying the applied paste can be performed, the holding hole of the chip is elastically held by the holding hole of the carrier tape as in the conventional method. It is possible to improve the accuracy of the position and the shape of the electrode that can be formed, without causing a defect at the time of applying the paste due to the turn-up or the insufficient amount of protrusion of the chip.

Further, the second electrode forming apparatus applies a conductive paste for an electrode to a predetermined portion of a chip for an electronic component,
An electrode forming apparatus for an electronic component for drying a coating paste, comprising: a pair of movable wires capable of sandwiching a chip in a predetermined posture; and a fixed base plate slidably supporting a lower end of the chip sandwiched between the wires. Chip supply means for pushing the chip in a predetermined position between the wires, first paste application means for applying a conductor paste for an electrode to the end of the chip sandwiched between the wires, and an upper end of the chip First drying means for drying the conductive paste applied to the wire, front and back reversing means for reversing the front and back of the wire after the coating paste is dried, and an end opposite to the end of the chip sandwiched between the wires Second paste applying means for applying a conductor paste for an electrode to the second, and second drying for drying the conductor paste applied to the end of the chip In that it comprises a stage and its features.

An electrode forming method according to this electrode forming apparatus is a method for forming an electrode of an electronic component in which a conductive paste for an electrode is applied to a predetermined portion of a chip for an electronic component and the applied paste is dried. Using a pair of movable wires that can be sandwiched in a posture and a fixed base plate that slidably supports the lower end of the tip sandwiched between the wires, push the tip between the wires while moving the wire on the base plate. It is characterized by performing an operation, an operation of applying a conductive paste for an electrode to an end portion of a chip sandwiched between wires, and an operation of drying an applied paste.

According to the second electrode forming apparatus and the second electrode forming method, the operation of pushing the chip between the wires while moving the wire on the base plate, and the method of forming the electrode for the electrode between the ends of the chip sandwiched between the wires. Since the work of applying the conductive paste and the work of drying the applied paste can be performed, the conventional method of holding the chip elastically by the holding hole of the carrier tape causes the holding hole to be turned over and the chip to be protruded insufficiently. It is possible to improve the accuracy of the position and shape of the electrode that can be formed without causing a defect when applying the paste.

Further, a third electrode forming apparatus is an electronic part electrode forming apparatus for applying a conductive paste for an electrode to a predetermined portion of a chip for an electronic part and drying the applied paste. A movable rosary that is constructed by passing through wires so that small spacers are alternately connected, a fixed base plate that slidably supports the lower end of the rosary tip, and an end of the rosary tip First paste applying means for applying a conductor paste for an electrode to the portion, first drying means for drying the conductor paste applied to the upper end portion of the chip, and inverting the rosary after the application paste is dried Front and back reversing means, second paste applying means for applying a conductive paste for an electrode to an end of the bead-shaped chip opposite to the end, and a conductive paste applied to the end of the chip Further comprising a second drying means for drying the strike and its features.

An electrode forming method according to this electrode forming apparatus is an electrode forming method for an electronic component, in which a conductive paste for an electrode is applied to a predetermined portion of a chip for an electronic component, and the applied paste is dried. Using a movable rosary that is constructed through wires so that smaller spacers are alternately connected, and a fixed base plate that slidably supports the lower end of the rosary tip, the rosary is used. Applying conductor paste for electrodes to the end of the beaded chip while moving it on the base plate,
It is characterized by performing an operation of drying the application paste.

According to the third electrode forming apparatus and the electrode forming method, the operation of applying the conductor paste for the electrode to the end of the chip of the bead while moving the bead on the base plate; Since the work to dry the paste can be performed, unlike the conventional method of holding the chip elastically by the holding hole of the carrier tape, there is no failure at the time of paste application due to the turning of the holding hole and the insufficient amount of protrusion of the chip, The accuracy of the position and shape of the electrode that can be formed can be improved.

Further, a fourth electrode forming apparatus is an electrode forming apparatus for an electronic component, which applies a conductive paste for an electrode to a predetermined portion of the chip for the electronic component and dries the applied paste. At least two positioning plates formed with a large number of holes for receiving in a posture, a base plate covering a lower surface side of a lowermost positioning plate and closing a lower end opening of the hole, and a hole matching the positioning plate. A tip supply means for feeding chips into a hole of the positioning plate in a state where the lower end opening of the hole of the lowermost positioning plate is closed by the base plate from the upper end opening side in a predetermined posture; and at least one positioning plate In the hole of the positioning plate and supported by the base plate. Positioning means for positioning the tape, a first adhesive plate that holds the aligned chip on the base plate by the adhesive force of the adhesive layer and takes it out of the base plate, and a chip held by the first adhesive plate A first paste transfer plate for applying a conductive paste for an electrode to an end of the chip, first drying means for drying the conductive paste applied to the end of the chip, and a first adhesive plate. Tip 1
A second adhesive plate held by the adhesive force of the adhesive layer having an adhesive force greater than that of the adhesive plate and taken out of the first adhesive plate; and an end of the chip held by the second adhesive plate. It is characterized by comprising a second paste transfer plate for applying a conductor paste for electrodes and a second drying means for drying the conductor paste applied to the end of the chip.

An electrode forming method according to this electrode forming apparatus is an electrode forming method for an electronic component in which a conductive paste for an electrode is applied to a predetermined portion of a chip for an electronic component and the applied paste is dried. At least two positioning plates formed with a large number of holes for receiving in a posture are arranged such that the holes match each other and the lower end opening of the hole of the lowermost positioning plate is closed by the base plate. The chip is inserted into the hole of the positioning plate from the upper end opening side in a predetermined posture, and
The positioning of the chips located in the holes of the positioning plate and supported by the base plate is performed by moving the two positioning plates in a plane, and the aligned chip existing on the base plate is placed on the first adhesive plate. A conductive paste for an electrode is applied to the end of the chip held by the first adhesive plate by using a first paste transfer plate, and is held by the adhesive force of the adhesive layer, and the chip is held at the end of the chip. Drying the conductor paste applied to the first drying means,
Removing the chip held by the first adhesive plate from the first adhesive plate while holding the chip by the adhesive force of the adhesive layer of the second adhesive plate having a greater adhesive force than the adhesive force of the first adhesive plate; A conductor paste for an electrode is applied to the end of the chip held by the second adhesive plate using a second paste transfer plate, and the conductor paste applied to the end of the chip is dried by a second drying unit. It is characterized by making it.

According to the fourth electrode forming apparatus and the electrode forming method, the chip is inserted into the hole of the positioning plate from the upper end opening side in a predetermined posture, and at least one positioning plate is moved in a plane. After aligning the chip located in the hole of the positioning plate and supported by the base plate, applying an electrode conductive paste to the end of the chip and drying the applied paste Since the work can be performed, unlike the conventional method of holding the chip elastically by the holding hole of the carrier tape, the electrode which can be formed without causing a defect at the time of applying the paste due to the turning of the holding hole and the insufficient amount of protrusion of the chip. Can improve the accuracy of the position and the shape.

The above and other objects, structural features, and operational effects of the present invention will be apparent from the following description and the accompanying drawings.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIGS. 2 to 8 show a first embodiment of the present invention. In the drawings, reference numeral C1 denotes a chip, 1 denotes a carrier tape, 2 denotes a base plate, and 3 denotes a base plate. A pair of guide pulleys, 4 is a chip feeder, 5 is a paste applicator, 6 is a cover, 7 is a collection box, and 8 is a drying furnace.

The chip C1 is a chip for obtaining an electronic component EC having side electrodes EE as shown in FIG.
As shown in FIG. 3, there is a dimensional relationship of length>width> height.

The carrier tape 1 is formed in a thin shape from a metal material such as stainless steel, and has rectangular holes 1a at regular intervals in the tape length direction as shown in FIG. Each hole 1
a extends long in the direction orthogonal to the tape length direction, and has a width interval slightly larger than the height dimension of the chip C1 and a length interval slightly larger than the length dimension of the chip C1. . By the way, the thickness of the carrier tape 1 (hole 1a)
Is set to about の of the width of the chip C1. Further, on both sides of the carrier tape 1, pilot holes 1b capable of engaging with pilot pins (not shown) of the guide pulley 3 are formed at regular intervals in the tape length direction. This carrier tape 1 is endless and is wound around a pair of guide pulleys 3 with a predetermined tension, and an upper linear moving portion that can move rightward in FIG. 2 and a lower linear moving portion that can move leftward in FIG. It has a linear moving part.

The base plate 2 is formed from a metal such as stainless steel with a thickness sufficient to obtain rigidity. As shown in FIGS. 2 and 3, the lower surface of the linearly moving portion on the upper side of the carrier tape 1 is not contacted or contacted. It is arranged so as to cover the carrier tape 1 in a non-contact or contact state while covering the lower surface of the linearly moving portion on the lower side of the carrier tape 1. This base plate 2 has holes 1 in carrier tape 1.
In order to slidably support the lower end of the chip C1 inserted into the a, the surface is smoothed.

The pair of guide pulleys 3 has a pilot pin (not shown) which can be engaged with the pilot hole 1b of the carrier tape 1 on the outer peripheral surface. One pair of guide pulleys 3 is used as a driving side and the other as a driven side. The carrier pulley 3 is rotated clockwise or intermittently in FIG.
Make a move. In the illustrated example, the right guide pulley 3 in FIG. 2 functions as a means for turning the carrier tape 1 upside down.

The chip feeder 4 includes a well-known or well-known parts feeder (not shown) and a chute 4a communicating with a supply end of the parts feeder as shown in FIGS. 4A and 4B.
And The chip C1 before the electrode is formed is sent to the chute 4a by the parts feeder while being aligned in a predetermined direction.

The paste applicator 5 is shown in FIGS.
As shown in FIG. 5, the application roller 5a and the conductive paste CP
5b for storing the conductive paste CP and a blade 5c for scraping excess conductive paste CP from the outer peripheral surface of the application roller 5a
And a pair of disks 5 for holding the protrusion of the chip C1 existing in the hole 1a of the carrier tape 1 from left and right.
d. The application roller 5a includes a roller body 5a1 formed of a rigid material and a transfer unit 5 made of an elastic material such as silicon rubber that covers the outer peripheral surface of the roller body 5a1.
a2. A chip C1 is provided on the outer peripheral surface of the transfer portion 5a2.
The grooves 5a3 corresponding to the number and positions of the electrodes to be formed are formed in a direction parallel to the tape moving direction, and the coating roller 5a is filled with the conductive paste CP so that only the grooves 5a3 are filled with the conductive paste CP. CP is continuously supplied. The paste applicator 5 sandwiches and holds the protrusion of the chip C1 from the left and right when the chip C1 existing in the hole 1a of the carrier tape 1 passes along with the movement of the carrier tape 1, and holds the protrusion of the chip C1. A conductor paste CP for an electrode can be applied to the substrate.

As shown in FIG. 6, the cover 6 is arranged so as to cover the outside of the right guide pulley 3 in FIG. This prevents the chip C1 in 1a from falling off. Further, at the end of the cover 6 in the tape moving direction, the chip C1 existing in the hole 1a is gradually moved upward in the hole 1a so that the end on which the conductive paste CP has not yet been applied projects from the upper end opening of the hole 1a. It has an inclined portion 6a for making it work.

As shown in FIG. 8, the collection box 7 is disposed below the end of the linearly moving portion below the carrier tape 1, and collects the chip C1 after the paste application and drying are completed. I do. Incidentally, there is a portion which is not covered by the base plate 2 in the lower linear moving portion of the carrier tape 1, and the chip existing in the hole 1a of the carrier tape 1 falls by its own weight from the hole 1a when the cover by the base plate 2 is removed. And is collected in a collection box 7 arranged below the same.

The drying furnace 8 is for drying the conductive paste CP applied to the chip C1 and includes a heat source (not shown) such as an infrared heater, and the inside of the furnace is maintained at a temperature suitable for drying the paste. . In the illustrated example, both the upper linearly moving portion and the lower linearly moving portion of the carrier tape 1 are configured to pass through one drying oven 8.

Hereinafter, a method for forming an electrode on the chip C1 by the above-described apparatus will be described.

In forming the electrodes, the carrier tape 1 is continuously or intermittently moved in the direction of the arrow in FIG. 2 using a pair of guide pulleys 3. As shown in FIG. 4A, when the hole 1a of the carrier tape 1 comes directly below the chute 4a of the chip feeder 4, the chip C in the chute 4a
1 falls by its own weight and is thrown into the hole 1a. The posture of the chip C1 inserted into the hole 1a is as shown in FIG. When the carrier tape 1 moves after the chip C1 is inserted into the hole 1a, the lowermost chip C1 in the chute 4a falls by its own weight to the surface of the carrier tape 1 as shown in FIG. The same state is maintained until it is thrown into 1a. The operation of putting the chips C1 into the holes 1a of the carrier tape 1 is sequentially performed according to the movement of the carrier tape 1.

The chip C 1 inserted into the hole 1 a of the carrier tape 1 is slid on the base plate 1 according to the movement of the carrier tape 1, and is sent to the paste applicator 5. As shown in FIGS. 5A to 5C, the hole 1
When the chip C1 inserted into the position a reaches the application position, the protrusion is sandwiched and held by the pair of disks 5d, and the protrusion is pressed against the transfer portion 5a2 of the application roller 5a. Then, the conductive paste CP filling each groove 5a3 of the transfer portion 5a2 is applied to the protrusion of the chip C1. Since the chip C1 is pressed slightly into the elastically deformable transfer portion 5a2, the conductive paste CP filled in each groove 5a3 is pressed.
Is applied to one surface in the width direction of the chip C1 and at the same time to both ends in the height direction adjacent to the same surface.

The chip C1 that has passed through the paste applicator 5 is subsequently sent to the drying furnace 8 according to the movement of the carrier tape 1 as shown in FIG. 2, and the coating paste CP is dried while passing through the drying furnace 8. Will be

The chip C1 that has passed through the drying furnace 8 is sent to the right guide pulley 3 according to the movement of the carrier tape 1 as shown in FIG. 6, and the carrier tape 1 is turned upside down while passing through the guide pulley 3. Let me do. Since the cover 6 is provided outside the guide pulley 3, the chip C1 existing in the hole 1a does not fall off during the process of turning the carrier tape 1 upside down.
After the carrier tape 1 is turned over, the chip C1 existing in the hole 1a is gradually pushed up by the inclined portion 6a, and the end where the conductive paste CP is not yet applied protrudes from the upper end opening of the hole 1a.

Thereafter, the chip C1 slides on the base plate 2 in accordance with the movement of the carrier tape 1 in the same manner as described above, and is sent to the paste applicator 5. As shown in FIG. 7, the chip C1 inserted into the hole 1a
At the application position, the protruding portion is sandwiched and held by the pair of disks 5d, and the protruding portion is pressed against the transfer portion 5a2 of the application roller 5a, whereby the grooves 5a3 of the transfer portion 5a2 are formed. Is applied to the protruding portion of the chip C1. Since the chip C1 is pressed slightly into the elastically deformable transfer portion 5a2, the conductive paste CP filled in each groove 5a3 is applied to one surface in the width direction of the chip C1 and is adjacent to the same surface. It is also applied to both ends in the height direction.

The chip C1 that has passed through the paste applicator 5 is subsequently sent to the drying furnace 8 according to the movement of the carrier tape 1 as shown in FIG. 2, and the coating paste CP is dried while passing through the drying furnace 8. Will be

The chip C1 after paste drying after passing through the drying furnace 8 has the base plate 2 arranged on the lower linearly moving portion in accordance with the movement of the carrier tape 1 as shown in FIG.
At the end of the base plate 2 and when the cover with the base plate 2 is removed, it is dropped by its own weight from the hole 1a and discharged, and is collected in the collection box 7 disposed below the hole 1a. A movable carrier tape 1 having a large number of holes 1a formed therein for receiving C1 in a predetermined position, and a lower end opening of the hole 1a covering the lower surface of the carrier tape 1 and closing the hole 1a of the carrier tape 1.
a fixed base plate 2 slidably supporting the lower end of the chip C1 inserted into the carrier plate 1;
To move the chip C1 into the hole 1a of the carrier tape 1 while moving the chip C1 on the base plate 2, and to insert a conductor into the hole 1a of the carrier tape 1 and projecting from the chip C1 supported by the base plate 2. An operation of applying the paste CP and an operation of drying the applied paste CP are performed.

That is, unlike the conventional method in which the chip is elastically held by the holding hole of the carrier tape, the electrode which can be formed without causing a defect at the time of applying the paste due to the turning of the holding hole or the shortage of the projecting amount of the chip. The precision of the position and the shape of the electrode can be improved, and the electrode formation on the chip can be performed extremely well and stably.

In the first embodiment, the chip C1
Although the apparatus and method for forming a plurality of side electrodes at both ends in the width direction have been illustrated, the number and positions of the side electrodes formed can be arbitrarily selected by changing the paste application form. Also, by changing the receiving posture of the chip by changing the hole shape of the carrier tape or the like, it is possible to form electrodes at both ends in the length direction and both ends in the height direction of the chip. Further, even when a chip having a dimensional relationship other than length>width> height is used as a chip, the same electrode formation as described above can be performed.

[Second Embodiment] FIGS. 9 to 14 show a second embodiment of the present invention.
11 is a wire, 12 is a base plate, 13 is a pair of guide pulleys, 14 is a chip feeder, 15 is a paste applicator, 16 is a cover, 17 is a collection box, and 18 is a drying furnace.

The chip C2 is a chip for obtaining an electronic component EC having side electrodes EE as shown in FIG.
As shown in FIG. 3, there is a dimensional relationship of length>width> height.
The center of both end surfaces in the longitudinal direction of the chip C2 is shown in FIG.
As shown in FIG. 5, a groove C2a with which the wire 11 can be engaged is formed.

As the wire 11, a pair formed of a metal material such as stainless steel in a linear shape is prepared. The pair of wires 11 is endless, and has an interval such that it can engage with the grooves C2a formed on both ends in the longitudinal direction of the chip C2 and sandwich the chip C2 as shown in FIGS. As shown in FIG. 9, the pair of guide pulleys 3 is wound around the guide pulley 3 with a predetermined tension, and has an upper linear moving portion that can move rightward and a lower linear moving portion that can move leftward in FIG. are doing.

The base plate 2 is formed from a metal such as stainless steel with a thickness sufficient to obtain rigidity. As shown in FIG. 9 and FIG. In addition, it is arranged in a non-contact state below the linearly moving portion below the wire 11. Since the base plate 12 also serves to slidably support the lower end of the chip C2 sandwiched between the wires 11, the surface is smoothed.

The pair of guide pulleys 13 have projections (not shown) for supporting a portion of each wire 11 where the tip C2 is not sandwiched, at equal angular intervals on the outer peripheral surface, and the tip C2 sandwiched between the wires 11 is formed. (Not shown) between the projections on the outer peripheral surface. One pair of guide pulleys 13 is used as a driving side and the other as a driven side. The wire 1 is rotated clockwise or intermittently in FIG.
Move 1. In the illustrated example, the right guide pulley 13 in FIG. 9 functions as a means for turning the wire 11 upside down.

The chip feeder 14 includes a well-known or well-known parts feeder (not shown), a chute 14a communicating with a supply end of the parts feeder as shown in FIGS. 11A to 11C, and a chute 14a. Slide plate 14 having hole 14b1 for receiving chip C2 in a predetermined posture
b and a pin 14c for pushing the chip C2 inserted in the hole 14b1 between the wires 11a. The chips C2 before the electrodes are formed are sent to the chute 14a by the parts feeder while being aligned in a predetermined direction. Incidentally, two pairs of pulleys 12a are provided at the front and rear positions on the base plate 12 where the chip C2 is pushed in, in order to regulate the interval between the wires 11 at the pushed position.

The paste applicator 15 is shown in FIGS.
As shown in (C), the application roller 15a, the container 15b containing the conductive paste CP, and the application roller 15a
And a pair of disks 15d for holding an end of the chip C2 sandwiched between the wires 11 from right and left and holding the blade 15c. The application roller 15a is
The roller body 15a1 is made of a rigid material, and the transfer portion 15a2 is made of an elastic material such as silicone rubber and covers the outer peripheral surface of the roller body 15a1. Transfer unit 15a2
On the outer peripheral surface, grooves 15a3 corresponding to the number and positions of the electrodes to be formed on the chip C2 are formed in a direction parallel to the tape moving direction, and each groove 15a is formed on the coating roller 15a.
The conductive paste CP is continuously supplied so that only the inside 3 is filled with the conductive paste CP. This paste applicator 15
When the chip C2 sandwiched between the wires 11 passes as the wire 11 moves, the chip C2
Is sandwiched between the left and right sides of the chip C2, and the conductive paste CP for an electrode can be applied to the held end of the chip C2.

The cover 16 is disposed so as to cover the outside of the right guide pulley 13 in FIG. 9 in a non-contact manner.
When the wire 11 passes through the guide pulley 13, the tip C2 sandwiched between the wires 11 is prevented from falling off.

As shown in FIG. 14, the collection box 17 is disposed below the end of the linearly moving portion below the wire 11, and collects the chip C2 after the application and drying of the paste are completed. . By the way, a discharge hole 12c is formed at the end of the base plate 12 corresponding to the lower linearly moving portion of the wire 11, and two pairs of pulleys 12a are provided at front and rear positions of the discharge hole 12c in order to define an interval between the wires 11. Is provided between the two pairs of pulleys 12a, and a pair of pulleys 12b is provided to widen the distance between the wires 11. The chip C2 sandwiched between the wires 11 is released when the interval between the wires 11 is widened, is dropped by its own weight through the discharge hole 12c, is discharged, and is recovered in the recovery box 17 disposed thereunder. .

The drying furnace 18 is for drying the conductive paste CP applied to the chip C2, is provided with a heat source (not shown) such as an infrared heater, and the inside of the furnace is maintained at a temperature suitable for drying the paste. . In the illustrated example, both the upper linear moving portion and the lower linear moving portion of the wire 11 are configured to pass through one drying furnace 18.

Hereinafter, a method for forming an electrode on the chip C2 by the above-described apparatus will be described.

When the electrodes are formed, the wire 11 is moved continuously or intermittently in the direction of the arrow in FIG. 9 using a pair of guide pulleys 13. As shown in FIG. 11A, the hole 1 in the slide plate 14b of the chip feeder 14 is formed.
When the tip 4b1 is located directly below the chute 14a, the chip C2 in the chute 14a falls by its own weight and falls into the hole 14b1.
Has been inserted. When supplying chips, refer to FIG.
As shown in (B) and (C), the slide plate 14b
Moves rightward in the drawing, where the pin 14c descends and the chip C2 in the hole 14b1 is pushed between the wires 11. The posture of the chip C2 pushed between the wires 11 is as shown in FIG. Since the interval between the wires 11 at the pushed position is defined by the two pairs of pulleys 12a, the tip C2 can be pushed between the wires 11 without any inconvenience. After the tip is pushed in, pin 14
Then, the slide plate 14b moves upward and returns, and the slide plate 14b moves leftward in the figure and returns to the state shown in FIG. The operation of pushing the chip C2 between the wires 11 is sequentially performed every time the wire 11 moves a predetermined distance.

The C 2 pushed between the wires 11 slides on the base plate 12 according to the movement of the wires 11 and is sent to the paste applicator 15.
As shown in FIGS. 12A to 12C, when the tip C2 pushed between the wires 11 reaches the application position, its end is sandwiched and held by a pair of disks 15d. The end portion is pressed against the transfer portion 15a2 of the application roller 15a, whereby the transfer portion 15a2
The conductive paste CP filling each groove 15a3 is applied to the end of the chip C2. Since the chip C2 is pressed slightly into the elastically deformable transfer portion 15a2, the conductive paste CP filled in each groove 15a3 is applied to one surface in the width direction of the chip C2 and is adjacent to the same surface at the same time. It is also applied to both ends in the height direction.

Chip C2 passed through paste applicator 15
As shown in FIG. 9, the coating paste CP is subsequently sent to the drying furnace 18 in accordance with the movement of the wire 11, and is dried while passing through the drying furnace 18.

The chips C2 that have passed through the drying furnace 18 are sent to the right guide pulley 13 according to the movement of the wire 11 as shown in FIG. 9, and the wire 11 is turned upside down while passing through the guide pulley 13. . Since the cover 16 is provided outside the guide pulley 13, the chip C <b> 2 sandwiched between the wires 11 does not fall out during the process of reversing the wires 11.

Thereafter, the chip C2 is slid on the base plate 12 in accordance with the movement of the wire 11 in the same manner as described above, and is sent to the paste applicator 15. As shown in FIG. 13, when the tip C2 pushed between the wires 11 reaches the application position, its end is set to 1
While being sandwiched and held by the pair of disks 15d, the end is pressed against the transfer portion 15a2 of the application roller 15a, whereby the respective grooves 15a3 of the transfer portion 15a2 are pressed.
Is applied to the opposite end of the chip C2. Since the chip C2 is pressed slightly into the elastically deformable transfer portion 15a2, the conductive paste CP filled in each groove 15a3 is pressed.
Is applied to one surface in the width direction of the chip C2 and at the same time to both ends in both height directions adjacent to the same surface.

Chip C2 passed through paste applicator 15
As shown in FIG. 9, the coating paste CP is subsequently sent to the drying furnace 18 in accordance with the movement of the wire 11, and is dried while passing through the drying furnace 18.

As shown in FIG. 14, the paste C2 after drying the paste passed through the drying furnace 18 is moved to the base plate 12 corresponding to the lower linearly moving portion in accordance with the movement of the wire 11.
Pass through the pulley 12a on the front side provided at the front side. The wire 11 is connected to the pulley 12 after the pulley 12a on the near side.
In order to widen the gap by b, the tip C2 sandwiched between the wires 11 is released when the gap is widened, is dropped by its own weight through the discharge hole 12c, is discharged, and is disposed thereunder. Collected in the collection box 17.

As described above, in the above-described apparatus and method, the pair of movable wires 11 that can sandwich the chip C2 in a predetermined posture, and the tip C that is sandwiched between the wires 11
Fixed base plate 1 that slidably supports the lower end of 2
2 and the operation of pushing the chip C2 between the wires 11 while moving the wire 11 on the base plate 12, and the operation of the chip C2 sandwiched between the wires 11.
Applying a conductive paste CP for an electrode to the end of the
An operation of drying the application paste CP is performed.

That is, unlike the conventional method in which the chip is elastically held by the holding hole of the carrier tape, the electrode which can be formed without causing a defect at the time of applying the paste due to the turning of the holding hole and the insufficient amount of protrusion of the chip. The precision of the position and the shape of the electrode can be improved, and the electrode formation on the chip can be performed extremely well and stably.

In the above-described second embodiment, the chip C2 having the groove C2a in which the wire 11 can be engaged is used at the center of both end surfaces in the length direction. If it is used, even if the chip does not have the groove C2a, the same electrode can be formed by sandwiching and moving the chip between the wires.

In the second embodiment, the chip C
Although the apparatus and method for forming a plurality of side electrodes at both ends in the width direction are illustrated above, the number and positions of the side electrodes can be arbitrarily selected by changing the paste application form. Also, by using a chip with a different groove position or a chip without a groove, and by changing the position of the chip inserted between the wires, electrodes can be formed at both ends in the length direction and both ends in the height direction of the chip. It is. Further, even when a chip having a dimensional relationship other than length>width> height is used as a chip, the same electrode formation as described above can be performed.

[Third Embodiment] FIGS. 15 and 18 show a third embodiment of the present invention.
21 is a wire, 22 is a base plate, 23 is a pair of guide pulleys, 24 is a paste applicator, and 25 is a drying furnace.

The chip C3 is a chip for obtaining an electronic component EC having the side electrodes EE as shown in FIG.
As shown in FIG. 16A, there is a dimensional relationship of length>width> height. Also, on both sides in the height direction of the chip C3, FIG.
As shown in (A), a hole C through which the wire 21 can penetrate.
Two 3a are formed. Although not shown, the spacer SP shown in FIGS. 16B and 16C is also formed with two similar holes.

A pair of wires 21 prepared in a linear shape from a metal material such as stainless steel is prepared. The pair of wires 21 is endless, and as shown in FIGS. 16B and 16C, the chip C3 and the spacer SP smaller than the chip C3.
Penetrate both holes so that they are alternately connected. In other words, a large number of chips C3 are provided on the two wires 21 in a rosary with the spacer SP interposed therebetween. The rosary BA is wound around a pair of guide pulleys 23 with a predetermined tension, and is an upper linear moving portion that can move rightward and a lower linear moving portion that can move leftward in FIG. have.

The base plate 22 is formed from a metal such as stainless steel with a thickness sufficient to obtain rigidity.
As shown in FIG. 5, the chip C3 is arranged below the linear moving portion above the rosary BA so as to come into contact with the chip C3, and the chip C3 is formed below the linear moving portion below the rosary BA. It is arranged so that it may contact with. Since the base plate 22 also serves to slidably support the lower end of the chip C3 of the rosary BA, the surface thereof is smoothed.

A pair of guide pulleys 23
A surface or a concave portion (not shown) for supporting the lower end of the chip C3 of A is provided at the center of the outer peripheral surface. The pair of guide pulleys 23 are used as one drive side and the other as a driven side, and are rotated clockwise in FIG. 15 at a constant speed or intermittently by a rotary drive source such as a motor to move the beads BA. I do. In the illustrated example, the guide pulley 23 on the right side in FIG. 9 functions as a means for inverting the beads BA.

The paste applicator 24 is shown in FIGS.
As shown in (C), the application roller 24a, the container 24b containing the conductor paste CP, and the application roller 24a
And a pair of disks 24d for sandwiching and holding the end of the chip C3 of the rosary BA from left and right. The application roller 24a includes a roller main body 24a1 formed of a rigid material, and a transfer unit 24a2 made of an elastic material such as silicon rubber that covers the outer peripheral surface of the roller main body 24a1. Grooves 24 corresponding to the number and positions of the electrodes to be formed on chip C3 are formed on the outer peripheral surface of transfer portion 24a2.
a3 is formed in a direction parallel to the tape moving direction,
The conductive paste CP is continuously supplied to the application roller 24a so that only the inside of each groove 24a3 is filled with the conductive paste CP. The paste applicator 24 sandwiches and holds the end of the chip C3 from the left and right when the rosary object BA passes as it moves, and applies the conductor paste CP for an electrode to the held end of the chip C3. can do.

The drying furnace 25 is for drying the conductive paste CP applied to the chip C3, is provided with a heat source (not shown) such as an infrared heater, and the inside of the furnace is maintained at a temperature suitable for drying the paste. . In the illustrated example, both the upper linearly moving portion and the lower linearly moving portion of the rosary BA are configured to pass through one drying furnace 25.

Hereinafter, a method for forming an electrode on the chip C3 by the above-described apparatus will be described.

When forming electrodes, the beads BA are continuously or intermittently moved in the direction of the arrow in FIG. 15 using a pair of guide pulleys 23.

The beaded material BA is slid on the base plate 22 according to the movement, and is sent to the paste applicator 24. As shown in FIGS. 17 (A) to 17 (C), the tip C3 of the rosary-shaped material BA is sandwiched and held by a pair of disks 24d when the chip C3 reaches the application position, and the tip of the tip C3 is formed. The transfer unit 24a is pressed against the transfer unit 24a2 of the application roller 24a,
The conductive paste CP filled in each of the grooves 24a3 is applied to the end of the chip C3. Since the chip C3 is pressed slightly into the elastically deformable transfer portion 24a2, the conductive paste CP filled in each groove 24a3 is applied to one surface in the width direction of the chip C3 and is adjacent to the same surface at the same time. It is also applied to both ends in the height direction.

Chip C3 passed through paste applicator 24
As shown in FIG. 15, following the movement of the rosary material BA, it is subsequently sent to the drying furnace 25, and the coating paste CP is dried while passing through the drying furnace 25.

The chip C3 passed through the drying furnace 25 is shown in FIG.
As shown in the figure, the beads are fed into the right guide pulley 23 according to the movement of the beads BA, and the beads BA are turned upside down while passing through the guide pulleys 23.

Thereafter, the chip C3 is slid on the base plate 22 in accordance with the movement of the beads BA in the same manner as described above, and is sent to the paste applicator 24. As shown in FIG. 18, when the tip C3 of the rosary-shaped material BA reaches the application position, its end is sandwiched and held by a pair of disks 24d, and the end is the transfer part 24a2 of the application roller 24a. Thus, the conductive paste CP filling each groove 24a3 of the transfer portion 24a2 is applied to the end on the opposite side of the chip C3. Since the chip C3 is pressed slightly into the elastically deformable transfer portion 24a2, the conductive paste CP filled in each groove 24a3 is applied to one surface in the width direction of the chip C3 and is adjacent to the same surface at the same time. It is also applied to both ends in the height direction.

Chip C3 passed through paste applicator 24
As shown in FIG. 15, following the movement of the rosary material BA, it is subsequently sent to the drying furnace 25, and the coating paste CP is dried while passing through the drying furnace 25.

After the application and drying of the conductive paste CP to both ends of the bead BA in the width direction of the chip C3, the bead BA is removed from the pair of guide pulleys 23, and a new bead before paste application is obtained. The beads are wound around a pair of guide pulleys 23 to perform the same operation as described above.

As described above, according to the above-described apparatus and method, the movable beaded BA constituted by penetrating the wire 21 so that the chips C3 and the spacers SP smaller than the chip C3 are alternately connected, and the beaded beads A conductor paste for an electrode is attached to the end of the chip C3 of the rosary object BA while moving the rosary object BA on the base plate 22 using a fixed base plate 22 that slidably supports the lower end of the chip C3 of the objects BA. An operation of applying the CP and an operation of drying the application paste CP are performed.

That is, unlike the conventional method in which the chip is elastically held by the holding hole of the carrier tape, the electrode which can be formed without causing a defect at the time of applying the paste due to the turning of the holding hole or the insufficient amount of protrusion of the chip. The precision of the position and the shape of the electrode can be improved, and the electrode formation on the chip can be performed extremely well and stably.

In the third embodiment, the chip C3 has two holes C3a formed on both sides in the height direction so that the wire 21 can pass therethrough. However, one hole C3a is formed in the chip C3. Even if a rosary is formed through a wire, the same electrode formation as described above can be performed by restricting the tip posture during movement by the base plate.

In the third embodiment, the chip C
Although the apparatus and method for forming a plurality of side electrodes at both ends in the width direction are illustrated above, the number and positions of the side electrodes can be arbitrarily selected by changing the form of paste application. In addition, if the tip posture at the time of moving the rosary is changed by 90 degrees, electrodes can be formed at both ends in the longitudinal direction of the tip. Further, a chip having a through hole in the width direction or a chip having a through hole in the length direction may be used. If such a chip is used, electrodes can be formed at both ends in the chip height direction. is there. further,
Even when a chip having a dimensional relationship other than length>width> height is used as a chip, the same electrode formation as described above can be performed.

[Fourth Embodiment] FIGS. 19 to 25 show a third embodiment of the present invention. In the drawings, reference numeral C1 denotes a chip similar to that of the first embodiment, reference numerals 31 and 32 denote positioning plates, and reference numeral 33 denotes a positioning plate. Is a base plate, 34 is a first adhesive plate, 35 is a paste transfer plate, 36 is a table supporting the transfer plate 35, and 37 is a second adhesive plate.

The chip C1 is a chip for obtaining an electronic component EC having the side electrodes EE as shown in FIG.
As in the case shown in FIG. 3, there is a dimensional relationship of length>width> height.

The two positioning plates 31 and 32 are formed of a thin metal material such as stainless steel and have a large number of rectangular holes 31a and 32a in a matrix as shown in FIG. Each of the holes 31a and 32a has a width interval slightly larger than the height dimension of the chip C1 and the width of the chip C1.
Has a length spacing that is slightly larger than the length dimension.
Incidentally, the thickness of each positioning plate 31, 32 (3 for each)
1a, 32a) is about 1 / the width of the chip C1.
It is set to 2.

The base plate 33 is formed from a metal such as stainless steel with a thickness sufficient to obtain rigidity, and its surface is smoothed to support a large number of chips C1 without tilting or the like.

The first adhesive plate 34 is formed from a metal such as stainless steel with a thickness sufficient to obtain rigidity.
An adhesive layer 34 capable of holding the chip C1 by adhesive force is provided on the lower surface thereof.

The paste transfer plate 35 is made of an elastic material such as silicon rubber, and has grooves 35a corresponding to the number and positions of the electrodes formed on the upper surface thereof in accordance with the position of each chip C1. The paste transfer plate 35 is supported by a rigid table 36. Each of the grooves 35a of the paste transfer plate 35 has a conductive paste C
P is pre-filled.

The second adhesive plate 37 is formed from a metal such as stainless steel with a thickness sufficient to obtain rigidity.
On its lower surface, an adhesive layer 37a capable of holding the chip C1 by adhesive force is provided. Incidentally, the adhesive force (chip holding force) of the adhesive layer 37a of the second adhesive plate 37.
Is the adhesive force (chip holding force) of the first adhesive plate 34
It is set larger than.

In the drawing, a chip feeder for feeding chips C1 into holes 31a and 32a of positioning plates 31 and 32 and a drying furnace for drying conductor paste CP applied to chips C1 are omitted. However, the same chip feeder and drying furnace as those in the first embodiment are used.

Hereinafter, a method for forming an electrode on the chip C1 using the above-described apparatus will be described.

When forming the electrodes, as shown in FIG. 19, the two positioning plates 31 and 32 are
1a and 32a are aligned with each other, and the lower end opening of the hole 32a of the lower positioning plate 32 is arranged to be closed by the base plate 33, and the upper end opening is formed in the holes 31a and 32a of both positioning plates 31 and 32. The chip C1 is inserted from the side in a posture aligned with the holes 31a and 32a.

Next, as shown in FIG. 21, the lower positioning plate 32 or the upper positioning plate 31 is moved in a plane, specifically, in the width direction and the length direction of the hole 31a or the hole 32a. The holes 31a, 32a of both positioning plates 31, 32 are moved in order using the holes that are not moved.
And the position of the chip C1 supported by the base plate 33 on a plane is adjusted. After the alignment, as shown in FIG. 22, the positioning plates 31, 32 are removed so that the holes 31a, 32a of the positioning plates 31, 32 do not touch the chip C1.
If there is a possibility that the position of the chip C1 may be disturbed when removing the positioning plates 31 and 32, an adhesive layer having an adhesive force (chip holding force) capable of allowing the displacement of the chip C1 is provided on the surface of the base plate 33. 33 is preferably provided on the surface.

Next, as shown in FIG. 23, the pressure-sensitive adhesive layer 34a of the first pressure-sensitive adhesive plate 34 is lifted from the pressed chip C1 on the base plate 33, and the chip C1 on the base plate 33 is adhered. Layer 34a
And is taken out of the base plate 33 and transferred to the first adhesive plate. .

Next, as shown in FIG. 24, the end of the chip C 1 held on the first adhesive plate 34 is pressed against the paste transfer plate 35. Since each chip C1 is pressed slightly into the elastically deformable paste transfer plate 35, the conductive paste CP filled in each groove 35a is applied to one surface in the width direction of each chip C1 and simultaneously. It is also applied to both ends in the height direction adjacent to the surface.

Next, the pressing of each chip C1 against the paste transfer plate 35 is released, and the first adhesive plate 34 holding the chip C1 after application of the paste is placed in a drying furnace to dry the applied paste. .

Next, the first adhesive plate 34 is inverted, and the adhesive layer 37a of the second adhesive plate 37 is pressed against the chip C1 held on the first adhesive plate 34 as shown in FIG. Then, the chip C1 on the first adhesive plate 34 is held by the adhesive force of the adhesive layer 37a, removed from the base plate 33, and transferred to the second adhesive plate 37.

Next, the end of the chip C1 held on the second adhesive plate 37 is pressed against the same paste transfer plate as described above. Since each chip C1 is pressed slightly into the elastically deformable paste transfer plate, the conductive paste CP filled in each groove is pressed.
Is applied to the other surface in the width direction of each chip C1, and at the same time, to both ends in the height direction adjacent to the same surface.

Next, the pressing of each chip C1 against the paste transfer plate is released, and the second adhesive plate 37 holding the chip C1 after application of the paste is placed in a drying furnace to dry the applied paste.

Next, the chip C1 held on the second adhesive plate 37 is removed from the second adhesive plate 37.

As described above, in the above-described apparatus and method, the holes 31a and 32 for receiving the chip C1 in a predetermined posture are provided.
a two positioning plates 31, 3 on which a large number of
2 are arranged such that the holes 31a and 32a of the two positioning plates 31 and 32a coincide with each other and the lower end opening of the hole 32a of the lower positioning plate 32 is closed by the base plate 33. The chip C1 is thrown into the hole 32a from the upper end opening side in a predetermined posture, and one of the positioning plates is moved in a plane so that the chip C1 exists in the holes 31a and 32a of the positioning plates 31 and 32 and is supported by the base plate 33. After the alignment of the chip C1 is performed, an operation of applying a conductor paste CP for an electrode to an end of the chip C1 is performed;
An operation of drying the application paste CP is performed.

That is, unlike the conventional method in which the chip is elastically held by the holding hole of the carrier tape, the electrode which can be formed without causing a defect at the time of applying the paste due to the turning of the holding hole and the insufficient amount of protrusion of the chip. The precision of the position and the shape of the electrode can be improved, and the electrode formation on the chip can be performed extremely well and stably.

Further, since the inversion of the chip C1 is performed by using the two adhesive plates 34 and 37 having different adhesive strengths, there is an advantage that the inversion of the chip C1 can be efficiently performed at once.

In the fourth embodiment, the chip C1
Although the apparatus and method for forming a plurality of side electrodes at both ends in the width direction have been illustrated, the number and positions of the side electrodes formed can be arbitrarily selected by changing the paste application form. In addition, if the receiving posture of the chip is changed by changing the hole shape of the positioning plate or the like, electrodes can be formed at both ends in the length direction and both ends in the height direction of the chip. Further, even when a chip having a dimensional relationship other than length>width> height is used as a chip, the same electrode formation as described above can be performed.

[0103]

As described in detail above, defects occur during paste application due to the curling of the holding holes and the insufficient amount of protrusion of the chips as in the conventional method of elastically holding the chips by the holding holes of the carrier tape. In addition, the precision of the position and shape of the electrode that can be formed can be improved, and the electrode can be formed on the chip extremely well and stably.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an electronic component.

FIG. 2 is an overall schematic diagram of an electrode forming apparatus showing a first embodiment of the present invention.

3 is a partial perspective view of a carrier tape and a base plate shown in FIG. 2 and a perspective view of a chip.

FIG. 4 is a partial detailed view of the chip supply device shown in FIG. 2 and an operation explanatory diagram thereof.

FIG. 5 is a detailed view of the paste applicator shown in FIG. 2 and its operation explanatory view.

FIG. 6 is a detailed view of the cover shown in FIG. 3 and an explanatory diagram of its operation.

7 is a detailed view of the paste applicator shown in FIG. 2 and an explanatory diagram of its operation.

FIG. 8 is a detailed view of a collection box shown in FIG. 2 and an explanatory view of a chip discharging operation.

FIG. 9 is an overall schematic view of an electrode forming apparatus showing a second embodiment of the present invention.

10 is a partial perspective view of a wire and a base plate shown in FIG. 9 and a perspective view of a chip.

11 is a partial detailed view of the chip supply device shown in FIG. 9 and an operation explanatory diagram thereof.

12 is a detailed view of the paste applicator shown in FIG. 9 and its operation explanatory view.

FIG. 13 is a detailed view of the paste applicator in the latter stage shown in FIG. 9 and an explanatory diagram of its operation.

14 is a detailed view of a collection box shown in FIG. 9, a detailed view of a chip discharging mechanism, and an operation explanatory view thereof.

FIG. 15 is an overall schematic view of an electrode forming apparatus showing a third embodiment of the present invention.

16 is a detailed view of the bead shown in FIG. 15 and a perspective view of a chip.

17 is a detailed view of the paste applicator shown in FIG. 15 and an explanatory diagram of its operation.

FIG. 18 is a detailed view of the paste applicator in the latter stage shown in FIG. 15 and an explanatory diagram of its operation.

FIG. 19 is a diagram illustrating an electrode forming method according to a fourth embodiment of the present invention.

FIG. 20 is a perspective view of the positioning plate shown in FIG. 19;

FIG. 21 is an explanatory view of an electrode forming method according to a fourth embodiment.

FIG. 22 is an illustration of an electrode forming method according to a fourth embodiment.

FIG. 23 is an illustration of an electrode forming method according to a fourth embodiment.

FIG. 24 is an illustration of an electrode forming method according to a fourth embodiment.

FIG. 25 is an explanatory diagram of the electrode forming method according to the fourth embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Carrier tape, 1a ... Hole, C1 ... Chip, 2 ... Base plate, 3 ... Guide pulley, 4 ... Chip feeder, 5 ... Paste applicator, CP ... Conductor paste, 6 ... Cover, 6a ... Inclined part, 7 ... Collection box, 8 Drying furnace, 11 Wire, C2 Chip, 12 Base plate, 13 Guide pulley, 14 Chip feeder, 1
5: paste applicator, 16: cover, 17: collection box, 18: drying furnace, 21: wire, C3: chip, S
P: spacer, BA: bead, 22: base plate, 23: guide pulley, 24: paste applicator, 2
5: drying oven, 31, 32: positioning plate, 33: base plate, 34: first adhesive plate, 35: paste transfer plate, 36: table, 37: second adhesive plate.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01C 17/28 H01C 17/28 H01F 27/29 H01F 15/10 CF term (Reference) 5E032 BB01 BB13 CA01 CC01 CC09 CC11 5E070 AA01 AB02 EA01 5E082 AA01 BC38 CC02 GG10 GG28 LL35 MM11 MM13 MM15 MM17 MM24

Claims (13)

[Claims] An electrode forming apparatus for an electronic component, wherein a conductive paste for an electrode is applied to a predetermined portion of a chip for an electronic component, and the applied paste is dried, wherein a plurality of holes for receiving the chip in a predetermined posture are provided. A formed movable carrier tape, a fixed base plate that covers the lower surface of the carrier tape, closes a lower end opening of the hole, and slidably supports a lower end of the chip inserted into the hole of the carrier tape; Chip supply means for feeding chips into the hole of the carrier tape in a closed state from the upper end opening side in a predetermined posture, and the chip protruding portion which exists in the hole of the carrier tape and is supported by the base plate. First paste applying means for applying a conductive paste for an electrode, and a first drying means for drying the conductive paste applied to the projecting portion of the chip And, a front and back reversing means for reversing the front and back of the carrier tape after the coating paste is dried, and moving the chip present in the hole of the carrier tape after the front and back reversal in the hole, so that the portion of the chip opposite to the protruding portion is the hole. Chip moving means for projecting from the upper end opening; second paste applying means for applying a conductor paste for an electrode to a projecting portion of the chip which is present in the hole of the carrier tape and supported by the base plate; And a second drying unit for drying the conductive paste applied to the portion. 2. The carrier tape has two linear moving portions which are endless and can move in opposite directions while being wound around at least one pair of guide pulleys, wherein the first drying means and the second drying means The drying means is constituted by one drying means arranged so as to include two linearly moving parts. In one of the linearly moving parts, the chip is inserted into the hole of the carrier tape, and the chip is inserted into the projecting part of the chip. The application of the conductive paste and the drying of the applied paste are performed, and in the other straight portion, the movement of the chip in the hole, the application of the conductive paste to the projecting portion of the chip, and the drying of the applied paste are performed. The apparatus for forming an electrode of an electronic component according to claim 1, wherein: 3. The other linearly moving portion of the carrier tape has a portion that is not covered by the base plate, and the chip existing in the hole of the carrier tape is dropped by its own weight and discharged from the hole when the cover by the base plate is removed. The electrode forming apparatus for an electronic component according to claim 2, wherein: 4. A method for forming an electrode of an electronic component, comprising applying a conductive paste for an electrode to a predetermined portion of a chip for an electronic component, and drying the applied paste, wherein a plurality of holes for receiving the chip in a predetermined posture are provided. Using a formed movable carrier tape and a fixed base plate that covers the lower surface side of the carrier tape, closes the lower end opening of the hole, and slidably supports the lower end of the chip inserted into the hole of the carrier tape, The work of putting chips into the holes of the carrier tape while moving the carrier plate on the base plate, and the work of applying conductive paste to the projecting portions of the chips that are present in the holes of the carrier tape and supported by the base plate. Performing an operation of drying the applied paste. An electrode forming method for an electronic component, comprising: 5. An electrode forming apparatus for an electronic component, wherein a conductive paste for an electrode is applied to a predetermined portion of a chip for an electronic component, and the applied paste is dried, wherein a movable pair capable of sandwiching the chip in a predetermined posture is provided. A fixed base plate that slidably supports the lower end of the chip sandwiched between the wires, chip supply means that pushes the chip in a predetermined posture from above the wire between the wires, and a chip that is sandwiched between the wires. First paste applying means for applying a conductive paste for an electrode to an end; first drying means for drying a conductive paste applied to an upper end of a chip; front and back for inverting the wire after drying the applied paste; A second means for applying a conductor paste for an electrode to an end opposite to the end of the chip sandwiched between the wires; A paste application means, and a second drying means for drying the conductive paste applied to the end portion of the tip, the electrode forming apparatus of an electronic component, characterized in that. 6. The first drying unit and the second drying unit, wherein the wire has two linearly moving portions that are endless and can move in opposite directions while being wound around at least one pair of guide pulleys. The means is constituted by one drying means arranged so as to encompass two linearly moving parts. In one of the linearly moving parts, the chip is pushed between the wires and the conductive paste is applied to the end of the chip. Application and
6. The electronic component according to claim 5, wherein drying of the application paste is performed, and application of the conductor paste to an end of the chip and drying of the application paste are performed in the other linear portion. Electrode forming device. 7. A portion of the wire that is not covered by the base plate is present in the other linearly moving portion of the wire, and a means for widening the wire interval is disposed in the portion, and the chip sandwiched between the wires is a wire. The electrode forming apparatus for an electronic component according to claim 6, wherein when the space is widened and the cover with the base plate is removed, the wire is dropped by its own weight from between the wires and discharged. 8. A method for forming an electrode of an electronic component, comprising applying a conductive paste for an electrode to a predetermined portion of a chip for an electronic component and drying the applied paste, the movable pair being capable of sandwiching the chip in a predetermined posture. Using a wire and a fixed base plate that slidably supports the lower end of the tip inserted between the wires, pushing the tip between the wires while moving the wire on the base plate, A method of applying a conductive paste for an electrode to an end of a chip and an operation of drying the applied paste. 9. An electrode forming apparatus for an electronic component, in which a conductive paste for an electrode is applied to a predetermined portion of a chip for an electronic component and the applied paste is dried, wherein the chip and spacers smaller than the chip are alternately connected. A movable bead formed through a wire like this, a fixed base plate that slidably supports the lower end of the bead chip, and a conductive paste for electrodes on the end of the bead chip First paste applying means for applying; first drying means for drying the conductive paste applied to the upper end portion of the chip; front and back inverting means for inverting the front and back of the bead after drying the applied paste; A second paste applying means for applying a conductor paste for an electrode to an end of the chip opposite to the end, and a second means for drying the conductor paste applied to the end of the chip. And a 燥 means, electrode forming apparatus of an electronic component, characterized in that. 10. The bead is endless and has at least one shape.
It has two linear moving parts that can move in opposite directions while being wound around a pair of guide pulleys, and the first drying unit and the second drying unit are arranged to include the two linear moving units. In one linear moving part, the application of the conductive paste to the end of the chip and the drying of the applied paste are performed, and in the other linear part, the end of the chip is dried. The electrode forming apparatus for an electronic component according to claim 9, wherein the application of the conductor paste and the drying of the application paste are performed. 11. An electrode forming method for an electronic component, comprising applying a conductive paste for an electrode to a predetermined portion of a chip for an electronic component and drying the applied paste, wherein the chip and spacers smaller than the chip are alternately connected. Using a movable rosary that is constructed by penetrating the wire and a fixed base plate that slidably supports the lower end of the rosary tip, the rosary is moved on the base plate, An electrode forming method for an electronic component, comprising: performing an operation of applying a conductive paste for an electrode to an end of a chip of an object; and an operation of drying the applied paste. 12. An electrode forming apparatus for an electronic component, wherein a conductor paste for an electrode is applied to a predetermined portion of a chip for an electronic component, and the applied paste is dried, wherein a plurality of holes for receiving the chip in a predetermined posture are provided. At least two formed positioning plates, a base plate that covers the lower surface of the lowermost positioning plate and closes the lower end opening of the hole, and that the positioning plates match each other and that the lowermost positioning plate A chip supply means for inserting a chip into the hole of the positioning plate in a state where the lower end opening of the hole is closed by the base plate from the upper end opening side thereof in a predetermined posture; An alignment for aligning the chip that is in the hole of the plate and that is supported by the base plate A first adhesive plate that holds the aligned chip on the base plate by the adhesive force of the adhesive layer and removes the chip from the base plate; and an electrode for the electrode held on the end of the chip held by the first adhesive plate. A first paste transfer plate for applying a conductive paste, a first drying unit for drying the conductive paste applied to an end of the chip, and a chip held on the first adhesive plate in a first adhesive plate A second adhesive plate held by the adhesive layer having an adhesive force greater than that of the first adhesive plate and taken out of the first adhesive plate; and an end portion of the chip held by the second adhesive plate, A second paste transfer plate for applying the conductive paste; and a second drying unit for drying the conductive paste applied to the end of the chip. Electrode forming apparatus of an electronic component characterized by. 13. A method for forming an electrode of an electronic component, comprising applying a conductive paste for an electrode to a predetermined portion of a chip for an electronic component, and drying the applied paste, wherein a plurality of holes for receiving the chip in a predetermined posture are provided. The at least two positioning plates formed are arranged so that the holes of the positioning plates coincide with each other and the lower end openings of the holes of the lowermost positioning plate are closed by the base plate, and the upper ends of the holes are positioned in the holes of the positioning plate. A chip is inserted from a side in a predetermined posture, and at least one positioning plate is moved in a plane to align a chip existing in a hole of the positioning plate and supported by the base plate. Existing chip after alignment
Holding the chip by the adhesive force of the adhesive layer of the adhesive plate and taking it out of the base plate; applying a conductor paste for an electrode to the end of the chip held by the first adhesive plate using a first paste transfer plate; The conductive paste applied to the end of the first adhesive plate is dried by the first drying means, and the chip held on the first adhesive plate is subjected to the second adhesive having an adhesive force greater than the adhesive force of the first adhesive plate. A conductive paste for an electrode is applied to the end of the chip held by the second adhesive plate by using a second paste transfer plate, while being held by the adhesive force of the adhesive layer of the plate and taken out of the first adhesive plate. An electrode forming method for an electronic component, comprising: drying a conductive paste applied to an end of a chip by a second drying unit.