JPH0922843A - Method of forming outer electrode of chip component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To apply outer electrodes to chip components efficiently by a method wherein the chip components are inserted into the component holding holes of a belt, the chip components are held by the belt while both the sides of the respective chip components protrude from both the sides of the strip and electrode paste is applied to the protruding parts of the chip components while the chip components are held by the strip. SOLUTION: A strip 4 by which chip components C are held is made to advance intermittently to pass between coating rollers 5 and rollers 5, 6 and 7 are made to rotate synchronously with the advance of the strip 4. Both the end parts of the chip components C held by the strips 4 are brought into contact with the circumferences of the respective coating rollers 5 simultaneously when the chip components C pass between the coating rollers 5. As electrode paste P is supplied onto the circumferences of the respective coating rollers 5 with uniform thicknesses, the electrode paste is applied to both the end parts of the chip components C with thicknesses corresponding to the supplied thicknesses. After the electrode paste P is applied, the chip components C are made to advance with the belt 4 intermittently, so that the electrode paste P is applied continuously.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming an external electrode of an electronic component, which method forms an external electrode on a chip component.

[0002]

2. Description of the Related Art As a method of forming external electrodes on a chip component, a plate having a large number of component storage holes formed in an elastic body is used, and the chip component is elastically held in each component storage hole of the plate. One end of the chip component protruding from the plate, and one end of the chip component protruding from the plate is collectively pressed to the paste attaching base to attach the electrode paste to dry it, and then the chip component is moved in the storage hole. There is known a method in which the other end portion is projected from the plate, and the other end portion of the chip component protruding from the plate is collectively pressed against the paste attachment base to attach the electrode paste and dry the electrode paste.

[0003]

In the above-mentioned conventional external electrode forming method, it is necessary to project each end of the chip component from the plate before the paste is attached.
There is a problem that extra time and labor are spent for the operation, and there is still room for improvement in terms of efficiency.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for forming an external electrode of an electronic component, which can efficiently form an external electrode on a chip component.

[0005]

In order to achieve the above object, the invention of claim 1 is an external electrode forming method for an electronic component, wherein an electrode paste is attached to a predetermined portion of a chip component to form an external electrode. A band having a thickness smaller than the size and having a component holding hole capable of elastically holding the chip component is used, and the chip component is inserted into the component holding hole of the band, and the chip component has both sides on both sides. It is characterized in that it is held in a state of protruding from the chip component, and the electrode paste is attached to the protruding portion of the chip component while holding the chip component with the band.

According to a second aspect of the present invention, in the electrode forming method according to the first aspect, the paste supply surfaces of a pair of coating rollers opposed to each other with the strip interposed therebetween are simultaneously brought into contact with both side protruding portions of the chip component. The feature is that the paste is attached to the chip parts.

[0007]

According to the first aspect of the present invention, since the chip component is held in the component holding hole of the strip with both sides thereof protruding from both sides of the strip, the initial holding state of the chip component in the strip is maintained. The electrode paste can be attached to the chip component as it is.

According to the second aspect of the present invention, the paste is adhered to the chip component by simultaneously contacting the paste supply surfaces of the pair of coating rollers opposed to each other with the strip interposed therebetween to the projecting portions on both sides of the chip component. It Other functions are similar to those of the invention of claim 1.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows a step of inserting and holding a chip component in a component holding hole of a band, in which C is a chip component, 1 is a hopper, 2 is a guide plate, 3 is a push pin, and 4 is a push pin. Is a band.

The hopper 1 has a large number of prismatic chip parts C.
Are stored in a disassembled state, and the storage components are taken into the supply port 1a at the lower end in a vertically oriented posture by using vibration and the like, and are drawn out in the same posture.

The guide plate 2 includes a hopper 1 and a strip body 4.
It is arranged horizontally between and. The guide plate 2 is formed with a tapered through hole 2a for receiving and temporarily holding the chip component C drawn out from the hopper 1.

The push-in pin 3 is arranged so as to be movable up and down corresponding to the position of the component holding hole when the band is stopped. The push-in pin 3 has a cross-sectional shape that is the same as or smaller than the end surface shape of the chip component C, and serves to transfer the chip component C temporarily held by the guide plate 2 to the strip body 4 side.

The strip 4 is an elastic belt made of synthetic rubber or the like and having a constant width, and has a thickness smaller than the longitudinal dimension of the chip component C. Further, as shown in FIG. 2A, four component holding holes 4a capable of elastically holding the chip component C are arranged at equal intervals in the width direction, and the width direction rows are arranged at equal intervals in the length direction. It has a continuous array. By the way, as shown in FIG. 2 (b), as the strip, an elastic body 4 b ′ having similar component holding holes 4 a ′ in the width direction is provided in the length direction on a non-elastic belt of a constant width made of metal or the like. One embedded at equal intervals (4 ') can be used instead.

The number and arrangement of the through holes 2a of the hopper 1 and the guide plate 2 and the push-in pins 3 are as follows.
Corresponding to the row in the width direction of the component holding holes 4a provided in the above, the chip components C are simultaneously inserted into the four component holding holes 4a in the width direction.

Insertion and holding of the chip component C in the strip 4 are
First, the guide plate 2 is moved to the right in the drawing so that the through hole 2a faces the supply port 1a of the hopper 1, and the hopper 1
The chip component C derived from is received in the through hole 2a and temporarily held, then the guide plate 2 is moved to the left in the drawing so that the through hole 2a faces the push pin 3 and the push pin 3 is lowered. Then, the temporarily held chip component C is moved downward, and the chip component C is inserted into the component holding hole 4a of the band 4.

The chip component C is inserted until both ends of the chip component C project from both sides of the strip with the same size.
In order to accurately define this protruding dimension, it is advisable to arrange a pedestal or the like that supports the lower surface of the band and the lower surface of the chip component to be inserted.

After the component is inserted, the band 4 advances by the pitch in the length direction of the component holding hole 4a, and the chip component C is similarly inserted into the subsequent component holding hole 4a. The chip component C inserted and held in the component holding hole 4a is intermittently advanced together with the band 4.

FIG. 3 shows a process of attaching electrode paste to both ends of the chip component. In FIG. 3, 5 is a coating roller, 6 and 7 are supply rollers, 8 is a weir, and P is an electrode paste.

The coating roller 5 has a width corresponding to the four chip parts C in the width direction held by the strip 4, and is arranged to face each other with the strip 2 interposed therebetween. A pair of application rollers 5
Is adjusted in advance in accordance with the longitudinal dimension of the chip component C, and both ends of the chip component C held by the strip 4 simultaneously contact the peripheral surfaces of the coating roller 5 when passing between the rollers. . The electrode paste P stored in the weir 8 is supplied to the peripheral surface of each coating roller 5 through the two supply rollers 6 and 7 with a constant thickness.

When the paste is attached to both ends of the chip component C, the strip 4 holding the chip component C is intermittently advanced to pass between the coating rollers 5, and the rollers 5, 6 and 7 are rotated accordingly. It is carried out. .

Both ends of the chip component C held by the strip 4 simultaneously contact the peripheral surface of each coating roller 5 when passing between the rollers. Since the electrode paste P is supplied to the peripheral surface of each coating roller 5 with a constant thickness, the electrode paste P is attached to both ends of the chip component C in a size according to the supply thickness by the above contact. The chip component C after the paste is adhered advances together with the strip 4 and the electrode paste P is similarly adhered to the subsequent chip component C.

FIG. 4 shows a step of drying the electrode paste attached to both ends of the chip component. In FIG. 4, 9 is a heating furnace and 10 is an electric heater.

The heating furnace 9 has an inlet 9a and an outlet 9b on both sides in the longitudinal direction, and the chip component C after the paste is adhered to is passed through the inside of the heating furnace 9 while being held by the strip 4. It is heated by the heater heat.

The electrode paste P attached to both ends of the chip component C is dried by intermittently advancing the strip 4 holding the chip component C after the paste attachment into the heating furnace 9. It

The inside of the heating furnace 9 is maintained at a temperature suitable for drying the paste, and the electrode paste P attached to both ends of the chip component C is dried in the process of passing through the heating furnace 9.
The chip component C after the paste drying advances intermittently together with the strip 4, and the attached paste P of the subsequent chip component C is similarly dried.

FIG. 5 shows a step of taking out the chip part after the paste is dried, and in the figure, 11 is an extrusion pin. The push-out pin 11 is arranged so as to be movable up and down corresponding to the position of the component holding hole when the strip is stopped. The push-out pin 11 has a cross-sectional shape that is the same as or smaller than the end surface shape of the chip component C, and has a function of pushing out the chip component C held in the component holding hole 4a of the band 4 from the component holding hole 4a. Fulfill. The number and arrangement form of the push-out pins 11 correspond to the width direction rows of the component holding holes 4a provided in the strip 4, and the chip components C held in the four component holding holes 4a in the width direction. Are extruded at the same time.

The chip component C is taken out of the strip 4 by
It is carried out by lowering the push-out pin 11 to move the chip component C held by the strip 4 downward and pushing it out from the component holding hole 4a. In order to accurately push out the components, it is advisable to dispose a pedestal or the like on the lower surface of the band except the component holding holes 4a.

The chip component extruded from the strip 4, that is, the chip component C having the external electrodes Ca formed on both ends thereof is housed in a container or the like. After removing the component, the band 4 returns to the step of inserting / holding the chip component C (FIG. 1).

When the electrode paste P that requires a baking process at a temperature higher than the drying temperature is used, the baking process is performed after the paste drying process, or the parts are taken out, or the parts are dried after the paste is dried. After taking out, the baking process is performed.

As described above, according to the above-described external electrode forming method, the chip component C is held in the component holding hole 4a of the strip 4 with both ends thereof protruding from both sides of the strip. The electrode paste P can be attached to both ends of the chip component C while maintaining the initial holding state of the chip component C in the body 4, and the attached paste P can be dried in the same state. That is, since each process required for forming the external electrode can be continuously performed in the moving process of the strip 4, it is possible to efficiently perform the external electrode formation in a series of flows and contribute to the cost reduction.

Further, by simultaneously contacting the paste supply surfaces of the pair of coating rollers 5 which are arranged opposite to each other with the strip 4 in between, to both ends of the chip part C, both ends of the chip part projecting from both sides of the strip are contacted. The electrode paste P can be attached at the same time. That is, the time required for the paste attaching step can be shortened, and the component position at the time of attaching the paste can be regulated by the pair of coating rollers 5 to stabilize the paste attaching size.

In the above embodiment, the regular square columnar chip component is exemplified as the target for forming the external electrode, but the shape of the component holding hole is changed for the flat rectangular columnar chip component and the columnar chip component. The same external electrodes can be formed simply by It is also possible to form external electrodes on the other surface of the chip component by changing the component holding direction of the strip.

[0034]

As described above in detail, according to the invention of claim 1, the steps required for forming the external electrodes can be continuously performed in the process of moving the strip. It can contribute to cost reduction by efficiently forming external electrodes.

According to the second aspect of the present invention, the time required for the paste adhering step can be shortened, and the paste adhering dimension can be stabilized by defining the component position at the time of adhering the paste by the pair of application rollers. Other effects are the same as those of the first aspect.

[Brief description of drawings]

FIG. 1 is a diagram showing a process of inserting and holding a chip component in a component holding hole of a band.

FIG. 2 is a partial perspective view of a strip and a modification thereof.

FIG. 3 is a diagram showing a process of attaching electrode paste to both ends of a chip component.

FIG. 4 is a diagram showing a process of drying the electrode paste attached to both ends of the chip component.

FIG. 5 is a diagram showing a process of taking out the chip component after drying the paste from the strip.

[Explanation of symbols]

C ... Chip parts, 1 ... Hopper, 2 ... Guide plate,
3 ... Push-in pin, 4 ... Band, 4a ... Component holding hole, 5 ... Application roller, 6, 7 ... Supply roller, 8 ... Weir, P ... Electrode paste, 9 ... Heating furnace, 10 ... Electric heater, Ca ... External electrode, 11 ... Extrusion pin.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location H01C 17/28 H01C 17/28

Claims (2)

[Claims] 1. A method of forming an external electrode of an electronic component, wherein an electrode paste is attached to a predetermined portion of a chip component to form an external electrode, the component being thinner than the component size and capable of elastically holding the chip component. A band having a holding hole is used, a chip part is inserted into the part holding hole of the band, and the chip part is held with both sides thereof protruding from both sides of the band, and the chip part is held with the band. An external electrode forming method for an electronic component, characterized in that an electrode paste is attached to a protruding portion of a chip component. 2. The paste is adhered to the chip component by simultaneously contacting the paste supply surfaces of a pair of coating rollers, which are opposed to each other with the band member in between, with the protruding portions on both sides of the chip component. Item 2. A method of forming an external electrode of an electronic component according to Item 1.