JP2002124431A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which is excellent in characteristics and producibility, and serves cost reduction by examining a filling structure of a space part of a case where at least one electronic component element is stored. SOLUTION: At least one electronic component element, where both leg parts of a U-shaped resin reinforcement body are positioned on both side surfaces of an electronic component and a lead wire is extracted out of a through hole provided to an arbitrary place of a connection part connecting both leg parts and disposed inside the U-shaped resin reinforcement body, is stored so that the connection part of the U-shaped resin reinforcement body is positioned in an opening part direction of the case inside a resin or metallic case. Resin filled in a case space part is set and a resin layer is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having an improved exterior structure such as a film capacitor, a ceramic varistor, or a coil in which an electronic component element is housed in a case and a resin is filled in a cavity of the case.

[0002]

2. Description of the Related Art As electronic component elements mounted on an electronic circuit board, there are, for example, a film capacitor, a ceramic varistor or a coil. These electronic components are designed to cope with an external environment such as vibration, humidity or corrosive atmosphere. The exterior has a specially examined structure. As shown in FIG. 6, the structure of these electronic components is, for example, a plastic film capacitor element 23 in which a metallikon electrode 21 is formed on both end faces, and a lead wire 22 as a lead wire is attached to the metallikon electrode 21. Is stored in a desired position of a case 24 made of resin or metal having one end opened, and a liquid resin is injected into a gap in the case 24, and the liquid resin is cured to form a resin exterior layer 25. It is.

According to the electronic component having such a configuration,
Since the metallikon electrode 21 is porous, a large number of pores in this portion and air and the like existing in the attachment portion of the lead wire 22 to the metallikon electrode 21 are pushed upward during the liquid resin injection process. Before the liquid resin is cured, the liquid resin penetrates uniformly into the pores or existing portions of the air, and there is no problem if the liquid resin can be cured after completely extruding these pores and air to the outside, but as a result, Since the pores and air are released during the curing of the liquid resin, a penetrating pinhole is generated in that portion, and the capacitor element 23 comes into contact with the outside air via this pinhole, and the moisture contained in the outside air is reduced. In addition, there is a disadvantage that the electrical characteristics are deteriorated by the influence of the corrosive gas.

[0004] However, such a drawback is that when the element structure has a very small unevenness on the surface or when a plurality or a combination of other electronic component elements has many air layers, pinholes are generated. The degree is also remarkable.

For this reason, as shown in FIG. 7, a liquid resin is injected into the space of the resin case 27 containing the electronic component element 26 until the electronic component element 26 is embedded, and the injected liquid resin is semi-cured. Then, the pinholes are crushed to bleed air to form the first resin layer 28, and then the lead wire 29 is withdrawn at the correct position, and again the same liquid resin as the first injected is flush with the opening of the case 27. The second resin layer 30 is formed by injecting until the liquid resin is hardened to form a second resin layer 30 so as to solve the above-mentioned drawbacks.

[0006]

However, since the resin has a two-layer structure, it is necessary to cure the liquid resin twice, which requires a long time for the resin filling operation, has a problem in workability, and reduces cost. There was a problem that could be an obstacle, and improvement was desired.

[0007] The present invention solves the above-mentioned problems, and by changing the filling configuration of the void portion of the case accommodating at least one electronic component element, it is possible to improve the characteristics and reduce the cost with excellent productivity. The purpose is to provide electronic components that contribute.

[0008]

SUMMARY OF THE INVENTION According to the present invention, two legs of a U-shaped resin reinforcing member are positioned on both side surfaces of an electronic component element, and a lead wire provided at an arbitrary position of a connecting portion connecting the two legs is provided. A connecting line of the U-shaped resin reinforcing member extends in a direction of the case opening into a case made of resin or metal by extracting a lead line from the hole and disposing at least one electronic component element disposed in the U-shaped resin reinforcing member in a case made of resin or metal. And a resin layer formed by curing the filling resin in the case voids.

An electronic component characterized by having a U-shaped resin reinforcement structure in which a plurality of through holes are provided at arbitrary positions of both legs and a connecting portion, instead of the structure of the U-shaped resin reinforcement body. It is.

[0010] Further, instead of the structure of the U-shaped resin reinforcing member, a U-shaped resin reinforcing member structure in which a plurality of cutout grooves are provided at arbitrary positions of both legs and a connecting portion is provided. Parts.

[0011] Further, instead of the structure of the U-shaped resin reinforcement, a U-shaped resin reinforcement structure in which the inner surface or both inner and outer surfaces of both legs are vertically or horizontally formed in an arbitrary uneven shape is characterized. Electronic components.

As described above, the structure in which the side surfaces of the electronic component element and the surface located in the direction of the case opening are surrounded by the U-shaped resin reinforcing member allows the liquid resin forming the resin layer to be cured. Because the pores and air escape through
Even if a penetrating pinhole occurs in that part, the pinhole does not lead to the outside air due to the presence of the U-shaped resin reinforcement, and even if the capacitor element deteriorates and the internal pressure rises, Since the leg of the U-shaped resin reinforcement body is present on the side of the electronic component that is likely to swell, this leg serves as a reinforcing material against internal pressure, it can be prevented from breaking from the side, and it is installed around It is possible to prevent the destruction of the device and to obtain an electronic component having good characteristics without impairing the workability unlike the resin two-layer structure.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION
The two legs of the U-shaped resin reinforcement body are positioned on both sides of the electronic component element, and a lead wire is drawn out from a lead wire through hole provided at an arbitrary position of a connecting portion connecting the two legs, thereby reinforcing the U-shaped resin reinforcement. At least one electronic component element disposed inside the body is housed in a case made of resin or metal such that the connection portion of the U-shaped resin reinforcement is positioned in the direction of the case opening, and is filled in the case gap. An electronic component in which a resin is cured to form a resin layer.

In this case, as the electronic component element,
It is not limited to a capacitor but includes a ceramic varistor or a coil. According to the present invention, even if pinholes are generated during the resin curing process for forming the resin layer, the presence of the U-shaped resin reinforcement does not lead to the outside air and eliminates the characteristic deterioration factor. Further, the presence of the U-shaped resin reinforcing body can effectively prevent the additional equipment from being broken.

According to a second aspect of the present invention, there is provided a U-shaped resin reinforcing member having a plurality of through holes provided at arbitrary positions of both legs and a connecting portion, instead of the U-shaped resin reinforcing member according to the first aspect. An electronic component characterized by the fact that, in addition to the effect of the first aspect of the present invention, the resin is also filled in the through-hole, so that the resin and the U-shaped resin reinforcement are more firmly fixed. Become.

According to a third aspect of the present invention, there is provided a U-shaped resin reinforcing member having a plurality of cutout grooves at arbitrary positions of both legs and a connecting portion, instead of the U-shaped resin reinforcing member according to the first aspect. In addition to the effects of the first aspect of the present invention, since the resin is filled in the notch groove, the state of fixation between the resin and the U-shaped resin reinforcing member is defined by the claims. 2
It becomes more robust like the electronic components described.

According to a fourth aspect of the present invention, in place of the U-shaped resin reinforcing body of the first aspect, a U-shaped resin in which the inner surfaces or both the inner and outer surfaces of both legs are vertically or horizontally shaped as desired. An electronic component characterized in that it is a reinforcing body. In addition to the effects of the invention according to claim 1, the presence of the unevenness allows the resin and the U-shaped resin reinforcing body to adhere to each other. As in the case of the electronic component described in No. 3, it is more robust.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic component according to the present invention will be described with reference to the drawings. That is, as shown in FIG. 1, for example, the lead wire 2 of a plastic film capacitor element 3 in which a metallikon electrode 1 is formed on both end faces and a lead wire 2 as a lead wire is attached to the metallikon electrode 1 is shown in FIG. As shown in FIG. 5, the connector has leg portions 4 and 5 on two sides, and a connecting portion 6 for connecting the leg portions 4 and 5, and a pair of lead wire insertion holes 7 is provided at an arbitrary position of the connecting portion. The capacitor element 3 is penetrated through the lead wire insertion hole 7 of the provided U-shaped resin reinforcement 8, and the capacitor element 3 is surrounded by the legs 4, 5 and the connecting portion 6 of the U-shaped resin reinforcement 8. Then, the lead wire 2 led out from the lead wire insertion hole 7 provided in the connecting portion 6 is housed in a bottomed rectangular case 9 made of resin or metal in a state of facing the opening, and a gap in the bottomed rectangular case 9 is provided. Inject liquid resin into the part, cure this liquid resin, In scan 9 void portion is made by forming a resin layer 10. In this structure, it is desirable that the lengths a and b of the U-shaped resin reinforcing member 8 as shown in FIG. 2 be set slightly smaller than the inner diameter of the case. If the height h of the U-shaped resin reinforcing member 8 is set to a half of the inner diameter of the case to be slightly smaller than the inner diameter of the case, even if the capacitor element deteriorates and the internal pressure rises, it is most likely to expand under the internal pressure. Since the leg of the U-shaped resin reinforcing member is present on the side surface of the electronic component, the leg portion serves as a reinforcing material against internal pressure, and can be prevented from breaking from the side surface.

(Other Embodiment 1) Instead of the U-shaped resin reinforcing member 8 shown in the above embodiment, as shown in FIG.
A U-shaped resin reinforcing member 15 having a plurality of through holes 14 having an arbitrary shape at arbitrary positions of the connection portions 13 and 12 is used so that a part of the resin layer fills the through holes 14. It becomes a finished product.

(Other Embodiment 2) Instead of the U-shaped resin reinforcing member 8 shown in the above embodiment, as shown in FIG.
Using a U-shaped resin reinforcing body 19 provided with a plurality of notch grooves 18 having an arbitrary shape at arbitrary positions 6 and 17, the resin layer is completed so that a part of the resin layer fills the notch grooves 18. It becomes something.

(Other Embodiment 3) Instead of the U-shaped resin reinforcing body 8 shown in the above embodiment, as shown in FIG. By using the U-shaped resin reinforcing body 21 as described above, the resin layer also fills the 20 portions of the concavo-convex shape so as to be a completed product.

According to the electronic component configured as described above, the lead wire 2 of the capacitor element 3 is connected to the U-shaped resin reinforcing member provided with a pair of lead wire insertion holes 7 at an arbitrary position of the connecting portion 6. 8 is provided in the connecting portion 6 in a state where the capacitor element 3 is surrounded by the legs 4 and 5 and the connecting portion 6 of the U-shaped resin reinforcing member 8. The lead wire 2 led out from the lead wire insertion hole 7 is housed in a bottomed rectangular case 9 made of resin or metal in a state facing the opening portion, and a resin layer 10 is formed in a void portion of the case 9. Capacitor elements 3 do not directly communicate with the outside air due to bubbles generated during the curing process of the liquid resin constituting the resin layer and penetrating pinholes generated by air escaping, and the factor of characteristic deterioration is eliminated. In addition, by making the U-shaped resin reinforcement structure as in each of the other embodiments described above, the U-shaped resin reinforcement members 15, 19, and 21 can be further firmly fixed to the resin layer. It becomes possible and the danger of the pinhole being exposed to the outside air is largely eliminated. Further, since the leg of the U-shaped resin reinforcement is present on the side surface of the electronic component element which is most likely to swell when the internal pressure rises due to deterioration of the capacitor element, the leg becomes a reinforcing material against internal pressure and breaks from the side surface. It is possible to prevent the destruction of the peripheral devices arranged in the vicinity, and to obtain an electronic component having good characteristics without impairing the workability unlike the resin two-layer structure.

[0023]

As described above, according to the present invention, it is possible to obtain an electronic component in which the process time can be shortened, the productivity can be improved, and the cause of the deterioration of the electric characteristics can be eliminated.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a U-shaped resin reinforcement constituting the electronic component shown in FIG. 1;

FIG. 3 is a perspective view showing a U-shaped resin reinforcement according to another embodiment of the present invention.

FIG. 4 is a perspective view showing a U-shaped resin reinforcement according to another embodiment of the present invention.

FIG. 5 is a perspective view showing a U-shaped resin reinforcement according to another embodiment of the present invention.

FIG. 6 is a sectional view showing an electronic component according to a conventional example.

FIG. 7 is a cross-sectional view showing an electronic component according to another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metallicon electrode 2 Lead wire 3 Capacitor element 4,5,11,12,16,17 Leg part 6,13 Connection part 7 Lead wire insertion hole 8,15,19,21 U-shaped resin reinforcement 9 Case 10 Resin layer 14 Through hole 18 Notch groove 20 Uneven shape

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01F 30/00 H01F 31/00 G J H01G 4/24 301K

Claims (4)

[Claims] 1. A method according to claim 1, wherein both leg portions of the U-shaped resin reinforcing member are positioned on both side surfaces of the electronic component element, and a lead wire is drawn out from a lead wire through hole provided at an arbitrary position of a connecting portion connecting the two leg portions. At least one electronic component element disposed in the U-shaped resin reinforcement body is housed in a case made of resin or metal such that the connection portion of the U-shaped resin reinforcement body is located in the case opening direction, An electronic component, wherein a resin layer is formed by curing a filling resin in a case gap. 2. The electronic component according to claim 1, wherein a plurality of through-holes are provided at arbitrary positions of both legs and the connecting portion of the U-shaped resin reinforcement. 3. The electronic component according to claim 1, wherein a plurality of notches are provided at arbitrary positions on both legs and the connecting portion of the U-shaped resin reinforcement. 4. The electronic component according to claim 1, wherein the inner surface or both the inner and outer surfaces of both legs of the U-shaped resin reinforcement have an arbitrary vertical or horizontal uneven shape.