JP2002117792A - Image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image display device capable of high quality display by solving a problem of non-uniformity of a screen caused by a resistance of wiring. SOLUTION: Plural pieces of wiring 20 in the direction of X and plural pieces of wiring 22 in the direction of Y provided so as to mutually cross them, and plural electron emitting elements 18 connected to the crossing part of the wiring in the direction of X and the wiring in the direction of Y are provided on a back board 12. A front board 10 having a phosphor screen is provided face to face with the back board, and the phosphor screen emits visible light by being excited by the emitting element. The wiring in the direction of Y is formed by a laminated structure having first wiring 22a and metallic foil-like second wiring 22b superimposed on the first wiring while being in continuity to the first wiring. The plural spacers 36 are directly formed on the second wiring, and these spacers are brought into pressure contact with the first wiring by pressing the second wiring.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image display device provided with an electron source substrate provided with a plurality of electron-emitting devices, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, two types of electron-emitting devices, such as a hot-cathode electron-emitting device and a cold-cathode electron-emitting device, have been known as electron-emitting devices used in image display devices and the like. Among these, as a cold cathode electron emitting element, a surface conduction type electron emitting element, a field emission type electron emitting element, a metal / insulating layer / metal type electron emitting element, and the like are known.

There are various types of field emission type electron-emitting devices. For example, there is a planar type field emission device disclosed in Japanese Patent Application Laid-Open No. 2-46636, which is mounted on a substrate. And the wires are connected to form an electron emission source.

Further, the surface conduction electron-emitting device utilizes a phenomenon in which electrons are emitted by passing a current through a small-area thin film formed on a substrate in parallel with the film surface. For example, Japanese Patent Application Laid-Open Nos. 64-031332 and 1-228374 disclose an example in which a large number of surface conduction emission devices are arranged and formed.
9. JP-A-2-257552 and the like disclose an electron source in which surface-conduction electron-emitting devices are arranged in parallel, and both ends of each device are connected by wiring, and a number of rows each connected to each other are arranged.

[0005]

However, when a large-area image display device is constructed using the above-described electron-emitting devices, there are the following problems. For example, in a process of manufacturing a surface conduction electron-emitting device, when an electrode or a wiring pattern is formed by a thin film, usually, a metal thin film of an electrode and a wiring material is formed on a substrate by vacuum evaporation or the like, and then the metal thin film is formed. Is patterned using photolithography and etching techniques to form electrodes and wiring patterns.

However, when such an electrode and a wiring pattern are manufactured on a large substrate having a diagonal dimension of 40 cm or more by a photolithography method or an etching technique, the wiring length becomes long and high-density wiring is performed. Therefore, it is necessary to make the wiring thin, and when a thin film having a thickness of about 1 to several μm is used, an increase in wiring resistance becomes a problem.

Further, a method of forming a wiring having a thick film of several μm to several tens μm by partially or entirely using a step of printing a conductor paste and an insulator paste on a substrate has been proposed. According to the method, compared to the photolithography method, the thickness of the wiring and the like can be easily increased, and the wiring resistance and the manufacturing cost can be reduced.

However, in an image display device having a larger screen and a higher density, for example, an image display device having a screen size of 40 inches and a pixel pitch of about 0.2 mm × 0.6 mm,
Since the wiring length becomes longer and the wiring width also decreases, the increase in resistance becomes a problem.

That is, when a constant power consumption occurs in each element section, a constant voltage drop occurs between adjacent elements. This voltage drop is integrated at the screen position, and even if the individual voltage drops are small and negligible, they appear as a drive voltage difference at a macro screen position, causing a problem that image uniformity is impaired. Therefore, a method of driving from both ends of the wiring can be considered, but it is not sufficient. Such a problem is a problem common to self-luminous display devices based on the XY matrix drive method, and in any of the display devices, it is desired to reduce the wiring resistance with the increase in the density of the large screen. ing.

In the step of forming the electron-emitting device, an aging process of applying a constant voltage or current to all the electron-emitting devices is performed in order to stabilize the characteristics. As a result, the supply voltage or supply current to each electron-emitting device becomes non-uniform. As a result, the electron emission efficiency of each of the processed elements becomes non-uniform.

Further, in the wiring baking process, there is a problem that the substrate is warped due to a difference between a thermal expansion coefficient of the substrate itself on which the wiring is formed and a thermal expansion coefficient of the conductive paste. This is more noticeable in a screen display device.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide an image display device which can solve the problem of screen non-uniformity caused by wiring resistance and can perform high-quality display. is there. Another object of the present invention is to provide a method of manufacturing an image display device capable of suppressing the occurrence of substrate distortion occurring during manufacturing and enabling uniform display.

[0013]

To achieve the above object, an image display apparatus according to the present invention comprises a plurality of X-direction wirings and a plurality of Y-direction wirings provided crossing each other.
A plurality of electron-emitting devices connected in the vicinity of intersections of the X-direction wiring and the Y-direction wiring, wherein at least one of the X-direction wiring and the Y-direction wiring is a first wiring; An electron source substrate having a foil-shaped second wiring laminated on the wiring and at least a part of which is electrically connected to the first wiring; and A counter substrate having a light-emitting surface that emits visible light when excited by an electron-emitting device, provided between the electron source substrate and the counter substrate, and providing a space between the electron source substrate and the counter substrate. The second wiring is pressed by the spacer material and the first wiring is pressed.
It is characterized by being pressed against the wiring.

According to another aspect of the present invention, there is provided an image display apparatus comprising: a plurality of X-direction wirings and a plurality of Y-direction wirings provided so as to intersect each other; A plurality of electron-emitting devices connected to the first wiring, at least one of the X-directional wiring and the Y-directional wiring is stacked on the first wiring, and at least a part is electrically connected to the first wiring. An electron source substrate having a foil-shaped second wiring, which is electrically connected, and a light emitting surface that is disposed at a predetermined distance from the electron source substrate and emits visible light when excited by the electron emission element A counter substrate having, provided between the electron source substrate and the counter substrate,
A spacer material that maintains a distance between the electron source substrate and the counter substrate, wherein the spacer material is formed directly on the second wiring, and presses the second wiring against the first wiring. It is characterized by having.

Further, another image display device according to the present invention includes a plurality of X-direction wirings and a plurality of Y-direction wirings provided so as to intersect with each other, and a vicinity of an intersection of each of the X-direction wirings and the Y-direction wirings. A plurality of electron-emitting devices connected to the first wiring, at least one of the X-directional wiring and the Y-directional wiring is stacked on the first wiring, and at least a part is electrically connected to the first wiring. An electron source substrate having a foil-shaped second wiring, which is electrically connected, and a light emitting surface that is disposed at a predetermined distance from the electron source substrate and emits visible light when excited by the electron emission element A counter substrate having, provided between the electron source substrate and the counter substrate,
A spacer material that holds a space between the electron source substrate and the counter substrate; and an electrode plate provided between the electron source substrate and the counter substrate, wherein the spacer material is provided on the electrode plate. And the second wiring is pressed against the first wiring.

According to the image display device configured as described above, by forming at least one of the X-direction wiring and the Y-direction wiring by laminating the first wiring and the second wiring, the combined resistance value can be reduced. The size can be reduced as compared with a single wiring structure. In addition, the second wiring is pressed against the first wiring by a spacer material for holding a gap between the electron source substrate and the opposing substrate and pressed against the first wiring, so that the first wiring and the second wiring are easily and reliably connected. Can be done. Then, by reducing the wiring resistance, the problem of non-uniformity of the screen caused by the wiring resistance can be solved, and an image display device capable of high-quality display can be obtained.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an image display device according to an embodiment of the present invention will be described in detail with reference to the drawings.

As shown in FIGS. 1 to 3, the image display device includes a rectangular transparent insulating substrate, for example, a front substrate 10 and a rear substrate 12 made of glass.
These substrates are opposed to each other with a predetermined gap. The front substrate 10 and the rear substrate 12 are joined to each other via a rectangular supporting frame 14 made of glass to form a flat rectangular vacuum envelope 15. The support frame 14 is sealed to the periphery of the back substrate 12 and the periphery of the front substrate 10 by, for example, frit glass made of low-melting glass.

On the inner surface of the front substrate 10 functioning as a counter substrate, a phosphor screen 16 as a phosphor screen is formed. The phosphor screen 16 is configured by arranging red, blue, and green phosphor layers and a black coloring layer.
These phosphor layers are formed in stripes or dots. A metal back 17 made of aluminum or the like is formed on the phosphor screen 16.

On the inner surface of the back substrate 12, a large number of electron-emitting devices 18 each emitting an electron beam are provided as electron emission sources for exciting the phosphor layer of the phosphor screen 16. These electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. A large number of X-directional wirings 20 and Y-directional wirings 22 for applying a voltage to and driving the electron-emitting devices 18 are provided on the rear substrate 12 in a matrix shape.
Near the intersection of the X-direction wiring and the Y-direction wiring, they are connected to these wirings. Thereby, the rear substrate 12 constitutes an electron source substrate.

One end or both ends of each X-direction wiring 20 is led out from the vacuum envelope 15 and
4a. Similarly, one end or both ends of each Y-direction wiring 22 is led out of the vacuum envelope 15 and connected to the drive circuit board 24b. Where X
The direction wiring 20 is a wiring for modulation, for example, and the Y-direction wiring 2
Reference numeral 2 denotes a scanning line.

As shown in FIG. 4, each electron-emitting device 18 is configured as a surface conduction electron-emitting device. That is, each electron-emitting device 18 includes a conductive thin film 25 and a pair of device electrodes 28 and 30 connected to the X-direction wiring 20 and the Y-direction wiring 22 to apply a voltage to the conductive thin film.
And At the center of the conductive thin film 25, an electron emitting portion 27 formed of a very small crack is formed.

The electrode spacing between the device electrodes 28 and 30 is several μm to several hundred μm, the film thickness is several hundred angstroms to several thousand angstroms. It is formed as appropriate by patterning or printing.

The thickness of the conductive thin film 25 is preferably set in the range of tens of angstroms to thousands of angstroms, and the conductive thin film is also patterned by photolithography, printing, or the like, and is individually separated. ing.

As shown in FIGS. 1 to 4, a large number of X
The direction wirings (lower wirings) 20 extend parallel to each other at a predetermined pitch. Also, many Y-direction wirings (upper wirings) 22
Are parallel to each other at a predetermined pitch, and
, And is provided on the X-direction wiring. At the intersection of each X-direction wiring 20 and each Y-direction wiring 22, an interlayer insulating layer 32 is provided between these wirings.

Here, each Y-directional wiring 22 is formed by laminating two layers of wiring. That is, each Y direction wiring 22
Is a first wiring 22a formed on the inner surface of the back substrate 12.
A second wiring 22b made of metal foil, placed on the first wiring in parallel with each other and electrically connected to the first wiring;
It is composed of The second wiring 22b is the first wiring 22a
It is formed to have a smaller electric resistance value. Also, the first
The wiring 22a has a plurality of disconnection portions 33 provided apart from each other in the longitudinal direction.

Each of the X-direction wiring 20, the first wiring 22a of the Y-direction wiring 22, and the interlayer insulating layer 32 is a thick film having a thickness of several μm to several tens μm. Formed by technology.

As shown in FIGS. 2 to 4, a large number of columnar spacers made of glass, ceramics or the like are provided between the front substrate 10 and the rear substrate 12 in order to maintain the distance between these substrates. 36 are arranged at a predetermined interval. These spacers 36 are formed directly on the second wirings 22b of the respective Y-directional wirings 22, and are arranged at predetermined intervals along the Y-direction. In particular, in the present embodiment, each spacer 36 is provided at a position overlapping with the intersection of the X-direction wiring 20 and the Y-direction wiring 22, and the upper end thereof is disposed via the metal back 17 on the phosphor screen 1.
6 abuts.

Then, the second wiring 22 of each Y-directional wiring 22
b is pressed by the plurality of spacers 36 and pressed against the first wiring 22a at a plurality of locations separated in the longitudinal direction, and is electrically connected to the first wiring at a plurality of locations. In this case, the electric resistance of the second wiring 22b between adjacent contact portions between the first wiring 22a and the second wiring 22b is equal to the first resistance between these contact portions.
It is set smaller than the electric resistance of the wiring 22a.

The spacer 36 is not limited to the intersection between the X-direction wiring 20 and the Y-direction wiring 22, and may be provided on the second wiring 22b at a position avoiding the intersection. Also, the first
Although the wiring 22a has a shape having the disconnection portions 33 at the element pitch, the intervals and positions of these disconnection portions can be arbitrarily selected. However, a plurality of columnar spacers 36
The first wiring 22a is formed such that a plurality of disconnection portions 33 do not exist between adjacent contact portions.

As shown in FIG. 1, in the present embodiment, the second wiring 22b of each Y-directional wiring 22 is
It extends outward from 0 and is connected to the drive circuit board 24b. The end of the second wiring 22b is fixed between the inner peripheral edge of the rear substrate 12 and the support frame 14 using an insulating adhesive such as frit glass. Further, the second wiring 2
The arrangement pitch of the ends of 2b is set substantially equal to the arrangement pitch of the connection terminals 37 provided on the drive circuit board 24b.

Each second wiring 22b is connected to the first wiring 22a.
The first wiring 22a may be formed to be shorter than the first wiring 22a, and the end of each first wiring 22a may be extended on the rear substrate 12 and connected to the drive circuit substrate 24b therefrom.

Next, a more detailed configuration of the above-described image display device will be described together with a method of manufacturing the same. First, a well-washed rear substrate 12 is prepared as a transparent insulating substrate. Examples of the back substrate 12 include quartz glass, glass having a reduced impurity content such as Na, blue plate glass, a glass plate obtained by laminating SiO ₂ on a blue plate glass by sputtering or the like, and ceramics such as alumina. Can be used.

As shown in FIG. 5A, a conductive film is formed on the rear substrate 12, and the conductive film is patterned by photolithography or the like to form a large number of pairs of device electrodes 28 and 30. . Examples of the material for the device electrodes 28 and 30 include conductive metals and alloys. The element electrode interval was 20 μm at the center and the electrode width was 300 μm.

Subsequently, as shown in FIG. 5B, a conductive paste is screen-printed on the rear substrate 12, and
By firing at about 80 ° C., the X-directional wiring 20 is formed. These X-direction wirings 20 are formed so as to be in contact with a part of each element electrode 28. Here, an X-direction wiring having a thickness of about 10 μm and a width of 100 μm was formed using Ag paste ink.

Next, as shown in FIG. 5C, after the insulating paste is screen-printed on the rear substrate 12, 48
Baking is performed at about 0 ° C., and an interlayer insulating layer 32 is formed at each intersection with the Y-direction wiring 22 to be formed later. As a material of the interlayer insulating layer 32, a general glass paste can be used. Each interlayer insulating layer 32 has a thickness of about 10 μm,
The width was 300 μm and the length was 400 μm.

Incidentally, the interlayer insulating layer 32 is
However, the present invention is not limited to this, and may be formed, for example, over the entire lower portion of the Y-directional wiring 22.

Subsequently, as shown in FIG. 5D, a conductive paste is screen-printed on the interlayer insulating layer 32, and then baked at about 480 ° C., so that the first wiring of the Y-directional wiring 22 is formed. 22a is formed. These first wirings 2
2 a is formed so as to be insulated from the X-direction wiring 20 by the interlayer insulating layer 32 and to be in contact with a part of each element electrode 30.
Here, using Ag paste ink, the thickness is about 10 μm.
The first wiring 22a having a width of 300 m and a width of 300 m was formed.

Further, a plurality of disconnections 33 can be formed by partially removing the Ag paste ink before baking the Ag paste ink forming the first wiring 22a. By providing such a disconnection portion 33, the back substrate 12 can be formed during firing of the Ag paste ink.
It is possible to suppress the occurrence of distortion such as warpage of the substrate or wiring due to the difference in the coefficient of thermal expansion between the paste and the paste ink.

In forming the first wiring 22a of the X-directional wiring 20 and the Y-directional wiring 22, in addition to Ag, Pd, Au, Ru
A printing paste composed of a metal or metal oxide such as O ₂ or Pd—Ag, frit glass, a polymer as a binder, and a suitable solvent can be used.

Next, as shown in FIG.
The second wiring 22b formed of a band-shaped metal foil is placed on the wiring 22a. The band-shaped metal foil has a thickness of, for example, 50 μm or more, preferably 0.1 mm to 0.15 mm.
mm, the width is 0.2 to 0.3 mm, and the length is equal to or longer than the first wiring 22a located thereunder. The second wiring 22b is formed of copper, a copper alloy containing Ti or Co, aluminum, or an aluminum alloy.

Further, by plating the second wiring 22b, a rustproof effect can be obtained. The generation of rust results in the rust becoming an insulating layer or a high resistance layer, resulting in an increase in the resistance of the wiring. As this plating, nickel plating is particularly preferable because it can improve the compatibility with the frit glass used for fixing.

Here, a method of forming the second wiring 22b will be described. First, one wiring member 40 made of tough pitch copper foil (TCuRI) having a thickness of 0.1 mm, a width of 600 mm, and a length of 900 mm is prepared, and after preprocessing this wiring member with dilute sulfuric acid, a dry film resist is applied to both surfaces. Laminated. Thereafter, a pattern was exposed on both surfaces of the wiring member 40 using a predetermined photomask. Further, after development with an aqueous solution of sodium carbonate, the film was etched from both sides with ferric chloride at 45 to 50 ° C., and finally, the dry film was removed using sodium hydroxide. Through the above steps, a combined body of the second wiring member, which has 760 slits each having a width of 0.3 mm and a length of 800 mm, and integrated by connecting both ends thereof, was produced.

Subsequently, a mold having an opening corresponding to the position of the spacer is preliminarily positioned and arranged on the second wiring member, and the opening of the mold is filled with a spacer forming material. By baking under the conditions described above, the spacer 36 is formed directly on the second wiring 22b.

As shown in FIG. 6A, the second wiring member 40 in which the spacers 36 are formed and integrated with each other is connected to the second wiring 22b by the first wiring 22a.
It is positioned on the back substrate 12 so as to overlap with the upper surface. At this time, the second wiring member 40 is fixed with a jig (not shown) or the like.
By holding the both end portions 40a and positioning them using an optical camera or the like, all the second wirings 22b can be collectively disposed on the first wirings 22a. At this time, it is desirable that the positioning is performed in a state where a tension is applied along the longitudinal direction of the second wiring so that each second wiring 22b is not bent.

Next, while holding the second wiring member 40 positioned as described above, the supporting frame 14 is fixed to the peripheral portion of the back substrate 12 using an insulating adhesive such as frit glass, and at the same time, Each second wiring 22b is sandwiched and fixed between the rear substrate 12 and the holding frame 14 by frit glass.
Subsequently, as shown in FIG. 6B, a thin film composed of fine particles is applied on the rear substrate 12 to form a conductive thin film of the electron-emitting device.

Thereafter, the front substrate 10 on which the phosphor screen 16 and the metal back 17 are formed in advance is placed on the support frame 1.
4 on top of each other. In this case, frit glass is applied to a joint between the support frame 14 and the front substrate 10 and fixed by a method such as baking, and an envelope having the front substrate 10, the support frame 14, the spacer 36, and the back substrate 12 is provided. 15.

As described above, the front substrate 10 and the rear substrate 1
By arranging the spacers 36 that keep the gap with the second wirings 22 on the Y-directional wirings 22, each of the second wirings 22a is pressed to conduct to the first wirings 22a.

The envelope 15 formed as described above is subjected to an energizing process or an aging process as required. When power is supplied to the Y-directional wiring 20, the power is supplied from both ends 40 a of the second wiring member 40, so that the individual Y-directional wiring 22
It is not necessary to make an electrical connection with the power supply, and it is possible to energize all or a plurality of wirings simultaneously.

After these processes are completed, the connecting end 40a of the second wiring member 40 protruding from the envelope 15 is cut off, and the plurality of second wirings 22b are formed as independent wirings. The connection end 40a is cut using, for example, shot blast, laser light, water pressure, a cutter, or the like.

Thereafter, the end of the X-direction wiring 20 and the Y
The ends of the second wiring 22b of the directional wiring 22 are connected to the drive circuit boards 24a and 24b, respectively. At this time, the second wiring 2
Since the arrangement pitch of the ends of 2b matches the arrangement pitch of the connection terminals of the drive circuit board 24b, they can be easily connected together.

According to the image display device configured as described above, at least one of the X-directional wiring 20 and the Y-directional wiring 22, that is, the Y-directional wiring 22 is connected to the first wiring 2.
2a and the second wiring 22b are connected in parallel. This is electrically equivalent to the first and second wirings 22a,
22b are connected in parallel, and the combined resistance value can be reduced as compared with the single wiring structure. When each resistance value of the X-direction wiring 20 and the first wiring 22a is R1, and the resistance value of the second wiring 22b is R2,
The combined resistance value of the Y-direction wiring 22 in which the first and second wirings are connected in parallel is approximated by R1 · R2 / (R1 + R2).

In the present embodiment, the first 800 mm long, 300 mm wide, 10 μm thick silver paste made of silver paste is used.
The resistance R1 of the wiring 22a is about 12Ω, while the copper foil is 800 mm long, 300 mm wide and 0.1 mm thick.
The resistance R2 of the second wiring 22b was about 0.7Ω. Therefore, the combined resistance value of the first and second wirings is about 0.66
Ω. As described above, the disconnection portion 33 is connected to the first wiring 22a.
, The resistance R1 takes a value from about 12 Ω to infinity, but the combined resistance value of the first and second wirings only changes between 0.66 Ω and 0.7 Ω. It can be seen that low resistance can be sufficiently achieved.

As described above, when a large number of electron-emitting devices 18 are operated on the same wiring due to a decrease in the resistance value of the wiring, a voltage drop due to a current flowing through each of the electron-emitting devices arranged in a large number of wirings is reduced. Reduce. This makes it possible to reduce the voltage drop between the electron-emitting devices and the voltage drop across the wiring, so that each electron-emitting device can operate in a state close to the same driving voltage. Therefore, it is possible to greatly reduce the variation of the operating voltage between the electron-emitting devices and the difference in light emission luminance between the horizontal line and the vertical line due to the voltage drop between the electron-emitting devices, so-called crosstalk, which has been a major problem in the past. . As a result, even in a large-screen image display device, high-quality image display without luminance unevenness or the like can be performed.

An electron acceleration voltage of 5 kV is applied to the metal back 17 of the image display device manufactured by the method shown in the present embodiment as an anode electrode, and the X and Y direction wirings 2 are applied.
0, 22 from the device electrodes 28, 30 to the electron emission portion 2
When a predetermined voltage was applied to No. 7, electrons were emitted, and a display with uniform brightness was obtained over the entire screen.

Conventionally, as a method of reducing the influence of wiring resistance, a method has been adopted in which the voltage applied to each element is made uniform by driving each electron-emitting device with a constant current. This causes problems such as generation of reactive power and complication of a circuit configuration. Further, conventionally, as a method of reducing the wiring resistance, a method of halving the voltage drop by providing a driving circuit at both ends of the wiring has been adopted, but in this case, the effect of neglecting the effect of the voltage drop was insufficient. .

On the other hand, according to the above-described embodiment, the operation by the voltage driving becomes possible, the reactive power can be reduced, the circuit configuration can be simplified, and the driving circuit can be reduced. An image display device with a price can be provided.

In addition, since the wiring resistance is reduced, even if a voltage is applied to each wiring at the same time in the aging process performed in the manufacturing process, the applied voltage to each element does not become non-uniform, and uniform characteristics are obtained. Electron-emitting device of
It is possible to provide an inexpensive image display device by improving the manufacturing efficiency and reducing the manufacturing cost.

The present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the present invention. For example, in the above-described embodiment, the X-direction wiring 2
0 is the lower wiring and the Y-directional wiring 22 is the upper wiring.
It is within the scope of the present invention whether the wiring in any direction is down or up. Further, each spacer 36 is not limited to a column shape having a circular cross section, but may be an elliptical shape, a rectangular shape, a cross shape, or a shape having a cross section composed of a combination thereof.

Further, although only the Y-directional wiring has a laminated structure of the first and second wirings, only the X-directional wiring, or both the X and Y-directional wirings may have a laminated structure. According to the image display device according to the second embodiment of the present invention shown in FIG. 8, each of the X-direction wiring 20 and the Y-direction wiring 22 has a stacked structure in which the first wiring and the second wiring are stacked. are doing. That is, on the inner surface of the back substrate 12, a large number of first wirings 20a of the X-directional wirings 20 are formed at a predetermined pitch in parallel with each other, and a large number of first wirings 22a of the large number of Y-directional wirings 22 are formed. Parallel to each other at a pitch of X
The direction wiring 20 is provided in a direction orthogonal to the first wiring 20a. At the intersection of each first wiring 20a and each first wiring 22a, an interlayer insulating layer 32 is provided between these wirings.

The second wiring 22b of the Y-directional wiring 22 is made of a metal foil and is placed on the first wiring 22a so as to overlap in parallel. The second wiring 22b is formed to have a smaller electric resistance value than the first wiring 22a. The second wiring 20b of the X-directional wiring 20 is placed in parallel on the first wiring 20a, and at the intersection with the Y-directional wiring 22, the Y-directional wiring 22 is provided via the interlayer insulating layer 40. Are provided on top of each other.

Each spacer 36 is connected to the X-direction wiring 20.
At the intersection between the X-direction wiring 20 and the Y-direction wiring 22.
Are formed directly on the second wiring 20b, and are arranged at predetermined intervals along the X direction. The upper end of each spacer 36 is in contact with the above-described phosphor screen via a metal back. Then, the second wiring 20 of each X-directional wiring 20
b is pressed by the plurality of spacers 36 and pressed against the first wiring 20a at a plurality of locations separated in the longitudinal direction, and is electrically connected to the first wiring at a plurality of locations. Similarly, the second wiring 22b of each Y-directional wiring 22 is pressed by the plurality of spacers 36, is pressed against the first wiring 22a at a plurality of locations separated in the longitudinal direction, and is electrically connected to the first wiring at a plurality of locations.

The other structure is the same as that of the above-described embodiment, and the same parts are denoted by the same reference numerals and detailed description thereof will be omitted. With the image display device according to the second embodiment configured as described above, the same operation and effect as those of the above-described embodiment can be obtained. Also, X
By forming both the directional wiring and the Y-directional wiring in a laminated structure, the wiring resistance can be further reduced.

On the other hand, according to the image display device according to the third embodiment of the present invention, the spacer is formed integrally on the electrode plate. That is, as shown in FIGS. 9 and 10, according to the third embodiment, the image display device has a spacer structure provided between the front substrate 10 and the rear substrate 12 and maintaining the distance between these substrates. The body 50 is provided.

This spacer structure 50 is
An electrode plate 52 is provided between the first substrate and the rear substrate 12 to prevent abnormal discharge between these substrates. This electrode plate 52
Is made of a 0.1 mm thick iron-nickel alloy, and its surface is oxidized.

The electrode plate 52 is formed with a plurality of rectangular windows 54 for transmitting the electron beams emitted from the surface conduction electron-emitting devices 18. ing. The electrode plate 52
Are formed with a plurality of circular openings 56 for connecting first and second spacers to be described later.

The electrode plate 52 has a first main surface facing the back substrate 12 and a second main surface facing the front substrate 10. A plurality of first spacers 36a are formed integrally with the electrode plate 52 on the first main surface side, and a plurality of second spacers 36b are formed integrally with the electrode plate 52 on the second main surface side. I have.

Each first spacer 36a is formed in a column shape tapering from the electrode substrate 42 toward the extending end, and similarly, each second spacer 36b is formed in a column shape tapering from the electrode substrate 42 toward the extending end. Is formed. Each of the first spacers 36a and the second spacers 36b are connected by a connecting portion 52 disposed in an opening 56 formed in the electrode plate 52. The opening 56 is formed to have a diameter smaller than the diameter of the end of the first and second spacers 36a and 36b on the electrode plate 52 side.

The spacer structure 40 thus configured
Is placed in the vacuum envelope 15 and the electrode plate 5
Numeral 2 faces the front substrate 10 and the rear substrate 12 in parallel and is connected to a predetermined potential to prevent abnormal discharge between the substrates. Further, each first spacer 36a is formed of an insulating film 60.
Through the second wiring 20b of the X-directional wiring 20. In the present embodiment, the first spacer 36a
Are arranged on the intersections between the X-directional wiring 20 and the Y-directional wiring 22. The second spacer 26b is in contact with the phosphor screen 16 via the metal back 17.

As a result, the first and second spacers 36
Reference numerals a and 36b support the front substrate 10 and the rear substrate 12 with respect to the atmospheric pressure. At the same time, the second wiring 20b of each X-direction wiring 20 is connected to the first and second spacers 36a, 3a.
6b, it is pressed against the first wiring 20a at a plurality of locations separated in the longitudinal direction and is electrically connected to the first wiring at a plurality of locations. Similarly, the second wiring 22b of each Y-directional wiring 22 is pressed by the first and second spacers 36a and 36b,
The first wiring 22a is pressed into contact with the first wiring 22a at a plurality of locations separated in the longitudinal direction, and is electrically connected to the first wiring at a plurality of locations.

The other structure is the same as that of the above-described embodiment, and the same portions are denoted by the same reference characters and detailed description thereof will not be repeated. With the image display device according to the third embodiment configured as described above, the same operation and effect as those of the above-described embodiment can be obtained. Also, X
By forming both the directional wiring and the Y-directional wiring in a laminated structure, the wiring resistance can be further reduced.

In the third embodiment, each of the first
The spacers 36a and 36b are not limited to pillars, but are circular,
The shape may be an elliptical shape, a rectangular shape, a cross shape, or a shape having a cross section composed of a combination thereof. Further, the first spacer 36a may have an elongated shape extending along the wiring, and may be configured to connect two or more second spacers to one first spacer.

In addition, in the above-described first to third embodiments, the second wiring is arranged so as to overlap the first wiring over the entire length. However, the present invention is not limited to this. It may be configured to overlap the first wiring. Although the first wiring is formed by printing and baking a conductive paste, the first wiring may be formed by patterning a conductive film formed on a rear substrate, or may be formed by plating or the like. Further, the first and second wirings may be formed of the same metal material. Further, in place of the second wiring, an end of the first wiring may be led out of the envelope and connected to the drive circuit board.

The present invention also provides a high-quality image by reducing the wiring resistance and makes the connected driving circuit inexpensive and easy. At least one of them includes a configuration in which the second wiring is arranged in a peripheral portion of the substrate where the electron-emitting device is not formed. in this case,
It is possible to reduce the voltage drop that occurs in the surrounding area,
Further, it is possible to achieve effects such as easy connection with the drive circuit.

In the present invention, the electron-emitting device is not limited to the surface conduction type, but may be a field emission type or MIM type electron emission device, or a semiconductor electron source.

[0076]

As described above in detail, according to the present invention, by reducing the wiring resistance, the problem of the non-uniformity of the screen caused by the wiring resistance is solved, and the image capable of high-quality display can be obtained. A display device and a method for manufacturing the display device can be provided. Further, according to the present invention, it is possible to obtain an inexpensive image display device capable of performing uniform display while suppressing generation of screen distortion, and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view showing an image display apparatus according to an embodiment of the present invention, with a part cut away;

FIG. 2 is a perspective view showing components of the image display device.

FIG. 3 is an exploded perspective view showing each component of the image display device.

FIG. 4 is an enlarged perspective view showing a portion A in FIG. 2;

FIG. 5 is a plan view showing a manufacturing configuration of an electron-emitting device and a wiring of the image display device.

FIG. 6 is a plan view showing a manufacturing configuration of an electron-emitting device and a wiring of the image display device.

FIG. 7 is a plan view showing a second wiring member used for manufacturing the wiring.

FIG. 8 is a perspective view showing a wiring structure of an image display device according to a second embodiment of the present invention.

FIG. 9 is a perspective view showing a spacer structure and a wiring structure of an image display device according to a third embodiment of the present invention.

FIG. 10 is a cross-sectional view of the image display device according to the third embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Front board 12 ... Back board 14 ... Support frame 15 ... Enclosure 16 ... Phosphor screen 17 ... Metal back 18 ... Electron emission element 20 ... X direction wiring 22 ... Y direction wiring 20a, 22a ... 1st wiring 20b 22b ... second wiring 24a, 24b ... drive circuit board 25 ... conductive thin film 27 ... electron emission portion 28, 30 ... device electrode 32 ... interlayer insulating layer 36 ... spacer 36a ... first spacer 36b ... second spacer 40 ... second Wiring member 52: Electrode plate

Continuing from the front page (72) Inventor Masaru Nikaido 1-9-9, Harara-cho, Fukaya-shi, Saitama Prefecture Inside the Toshiba Fukaya Plant (72) Inventor Kumio Fukuda 1-9-9, Harara-cho, Fukaya-shi, Saitama, Japan F-term in Toshiba Fukaya Plant (reference) 5C031 DD17 5C032 AA01 CC10 5C036 EG01 EG12 EH04 EH08

Claims (13)

[Claims] A plurality of X-direction wirings and a plurality of Y-direction wirings provided to intersect with each other; a plurality of electron-emitting devices respectively connected near intersections of the X-direction wirings and the Y-direction wirings; Wherein at least one of each of the X-direction wiring and the Y-direction wiring is a first wiring, and a foil-shaped second wiring which is stacked on the first wiring and at least partially connected to the first wiring An electron source substrate having a light-emitting surface that is arranged at a predetermined distance from the electron source substrate and emits visible light when excited by the electron-emitting device; and the electron source substrate. And a spacer material provided between the electron source substrate and the counter substrate, the spacer being provided between the electron source substrate and the counter substrate, wherein the second wiring is pressed by the spacer material and the first wiring Characterized by being pressed against Image display device. 2. A plurality of X-direction wirings and a plurality of Y-direction wirings provided so as to intersect with each other, and a plurality of electron-emitting devices respectively connected near intersections of the X-direction wirings and the Y-direction wirings. Wherein at least one of each of the X-direction wiring and the Y-direction wiring is a first wiring, and a foil-shaped second wiring which is stacked on the first wiring and at least partially connected to the first wiring An electron source substrate having a light-emitting surface that is arranged at a predetermined distance from the electron source substrate and emits visible light when excited by the electron-emitting device; and the electron source substrate. And a spacer material provided between the electron source substrate and the counter substrate, the spacer material being provided directly on the second wiring, and the spacer material being formed directly on the second wiring. 2 Wiring is pressed against the first wiring. An image display device comprising. 3. A plurality of X-direction wirings and a plurality of Y-direction wirings provided so as to intersect with each other, and a plurality of electron-emitting devices connected near the intersections of the X-direction wirings and the Y-direction wirings, respectively. Wherein at least one of each of the X-direction wiring and the Y-direction wiring is a first wiring, and a foil-shaped second wiring which is stacked on the first wiring and at least partially connected to the first wiring An electron source substrate having a light-emitting surface that is arranged at a predetermined distance from the electron source substrate and emits visible light when excited by the electron-emitting device; and the electron source substrate. And a spacer material provided between the counter substrate and the electron source substrate and the counter substrate, and an electrode plate provided between the electron source substrate and the counter substrate, And the spacer material is directly on the electrode plate. An image display device formed in contact with and pressing the second wiring against the first wiring. 4. The spacer material according to claim 1, wherein said spacer material is formed of glass or ceramics.
4. The image display device according to any one of claims 3 to 3. 5. The spacer material is circular, oval, rectangular,
The image display device according to any one of claims 1 to 4, wherein the image display device has a cross shape or a cross-sectional shape including a combination thereof. 6. The method according to claim 1, wherein the spacer material presses the second wiring at an intersection of the X-directional wiring and the Y-directional wiring. Image display device. 7. The device according to claim 1, wherein the spacer material presses the second wiring at a position avoiding an intersection between the X-directional wiring and the Y-directional wiring.
Item 10. The image display device according to Item 1. 8. The image display device according to claim 1, wherein said spacer material is formed in a long line shape. 9. The image display device according to claim 7, wherein said spacer material is provided at least partially over said X-direction wiring and Y-direction wiring. 10. The image display device according to claim 1, wherein said spacer material presses said second wiring via an insulating film. 11. The apparatus according to claim 1, wherein a plurality of said spacer materials are provided, and said second wiring is pressed against said first wiring by said spacer material at a plurality of locations along its extending direction. 11. The image display device according to any one of claims 10 to 10. 12. The spacer material is formed on a first main surface of the electrode plate and presses the second wiring, and a plurality of first spacers are formed on the second main surface of the electrode plate. A plurality of second spacers in contact with the counter substrate;
The image display device according to claim 3, further comprising: 13. The image display device according to claim 12, wherein each of said second spacers is connected to said first spacer by a connecting portion via an opening formed in said electrode plate.