JP2002105674A - Chemical polishing treatment solution for gold and gold alloy - Google Patents
Chemical polishing treatment solution for gold and gold alloyInfo
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- JP2002105674A JP2002105674A JP2000295980A JP2000295980A JP2002105674A JP 2002105674 A JP2002105674 A JP 2002105674A JP 2000295980 A JP2000295980 A JP 2000295980A JP 2000295980 A JP2000295980 A JP 2000295980A JP 2002105674 A JP2002105674 A JP 2002105674A
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- Prior art keywords
- gold
- acid
- salt
- chemical polishing
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、金及び金−銀系、
金−銅系、金−銀−銅系等の金合金表面の酸化膜を除去
し、均一で且つ光輝な光沢面に仕上げる為の金及び金合
金用化学研磨処理液に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gold and gold-silver system,
The present invention relates to a chemical polishing treatment solution for gold and a gold alloy for removing an oxide film on the surface of a gold alloy such as a gold-copper system or a gold-silver-copper system to obtain a uniform and bright glossy surface.
【０００２】[0002]
【従来の技術】従来、純金や２０金、１８金、１４金、
１２金、９金、ホワイトゴールド等の光輝処理には、電
解研磨処理が使用されている。電解研磨液にはシアン含
有液や特開昭５４−７７２３９、特開昭５７−３９２０
０、特開昭６０−７７９９７、特開昭６２−２４７１０
０等のシアンフリー液が提案されているが、凹凸の大き
い複雑な形状物では電解研磨の特性上、凹部の低電流部
が曇り、均一に光沢化されない問題がある。更に、人手
による治具付けを必要とし、一度に大量処理できないこ
とから、コスト的に負担になる問題がある。2. Description of the Related Art Conventionally, pure gold, 20 gold, 18 gold, 14 gold,
Electrolytic polishing is used for the luster treatment of 12 gold, 9 gold, white gold and the like. Examples of the electropolishing liquid include a cyan-containing liquid and JP-A-54-77239 and JP-A-57-3920.
0, JP-A-60-77997, JP-A-62-24710
Although a cyan-free liquid such as 0 has been proposed, there is a problem that, in a complicated shape having large irregularities, the low current portion of the concave portion becomes cloudy due to the characteristics of the electrolytic polishing, and the gloss is not uniformly formed. Furthermore, there is a problem in that it requires a manual jig and cannot be processed in a large amount at a time, so that it is costly.
【０００３】一方、化学的溶解方法による酸化膜除去と
して王水（硝酸−塩酸混合液）やシアン含有液が従来か
ら知られているが、これらの技術では金及び金合金を溶
解することができても表面の平滑化、更には光沢化、い
わゆる化学研磨は困難であった。On the other hand, aqua regia (mixed solution of nitric acid and hydrochloric acid) and a liquid containing cyan have been conventionally known as oxide film removal by a chemical dissolution method. However, these techniques can dissolve gold and a gold alloy. However, it has been difficult to smooth the surface and further to increase the gloss, so-called chemical polishing.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、電解研磨に
優る光輝面が得られ、凹凸の大きい複雑な形状物でも均
一に光沢化でき且つ大量処理ができ、更に有害なシアン
化合物を含有しない公害性を改善しうる金及び金合金用
化学研磨処理液を提供することを目的とする。SUMMARY OF THE INVENTION According to the present invention, a brilliant surface which is superior to electrolytic polishing can be obtained, and even a complicated shape having large irregularities can be uniformly glossed, can be processed in a large amount, and contains no harmful cyanide. An object of the present invention is to provide a chemical polishing treatment liquid for gold and a gold alloy that can improve pollution.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、課題解決
のために鋭意研究の結果、金及び金合金の表面を均一に
光輝研磨ができ、且つ大量処理が可能で、更にはシアン
の様な毒物を含まない化学研磨液を発明するに至った。
更に詳しく述べると、本発明により、燐酸及び／又はそ
の塩と、硝酸及び／又はその塩と、塩酸及び／又はその
塩を組み合わせた液に金又は金合金を浸漬することによ
り、表面光沢が得られ、更にふっ酸及び／又はその塩を
加えることで光沢が向上し、更にまた、有機酸及び（又
は）アミン化合物を加えることで研磨時に表面に残留し
易い金属スマットの発生を防止でき、清浄な光沢のある
化学研磨が可能になった。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the problems, and as a result, the surface of gold and a gold alloy can be uniformly polished brightly, and a large amount of processing can be performed. The inventors have invented a chemical polishing liquid that does not contain such poisons.
More specifically, according to the present invention, a surface gloss can be obtained by immersing gold or a gold alloy in a liquid obtained by combining phosphoric acid and / or a salt thereof, nitric acid and / or a salt thereof, and hydrochloric acid and / or a salt thereof. The addition of hydrofluoric acid and / or a salt thereof improves gloss, and the addition of an organic acid and / or an amine compound can prevent the generation of metal smut which tends to remain on the surface during polishing, and Chemical polishing with high gloss is now possible.
【０００６】従って、本発明の主題は、燐酸及び／又は
その塩と、硝酸及び／又はその塩と、塩酸及び／又はそ
の塩を含有することを特徴とする金及び金合金用化学研
磨処理液である。好ましい態様によれば、本発明は、ふ
っ酸及び／又はその塩をさらに含有することを特徴とす
る上記の金及び金合金用化学研磨処理液である。さらに
好ましい態様によれば、本発明は、有機酸及び（又は）
アミン化合物をさらに含有することを特徴とする上記の
金及び金合金用化学研磨処理液である。Accordingly, an object of the present invention is to provide a chemical polishing treatment solution for gold and gold alloys, characterized by containing phosphoric acid and / or a salt thereof, nitric acid and / or a salt thereof, and hydrochloric acid and / or a salt thereof. It is. According to a preferred embodiment, the present invention is the above chemical polishing treatment solution for gold and gold alloy, further comprising hydrofluoric acid and / or a salt thereof. According to a further preferred embodiment, the present invention provides an organic acid and / or
The above chemical polishing treatment liquid for gold and gold alloys, further comprising an amine compound.
【０００７】[0007]
【発明の実施の形態】以下に、本発明の金及び金合金用
化学研磨処理液に関し詳細に説明する。本発明に係わる
金及び金合金は、純金、２２金、２０金、１８金、１５
金、１４金、１２金、９金、８金等の金−銀系合金、金
−銀−銅系合金及びこれらにパラジウム、ニッケル、亜
鉛等が含有したホワイトゴールド、ピンクゴールドを対
象とするが、純銀、銀−銅系、銀−パラジウム系、銀−
ニッケル系、銀−炭素系、銀−タングステン系、銀−モ
リブデン系等の銀合金にも適用できる。BEST MODE FOR CARRYING OUT THE INVENTION The chemical polishing treatment solution for gold and gold alloy of the present invention will be described in detail below. The gold and gold alloy according to the present invention are pure gold, 22 gold, 20 gold, 18 gold, and 15 gold.
Gold-silver alloys such as gold, 14 gold, 12 gold, 9 gold, and 8 gold, gold-silver-copper alloys, and white gold and pink gold containing palladium, nickel, zinc, etc. , Pure silver, silver-copper, silver-palladium, silver-
It can also be applied to silver alloys such as nickel-based, silver-carbon-based, silver-tungsten-based, and silver-molybdenum-based.
【０００８】本発明に使用する燐酸及び／又はその塩は
高濃度であるのが好ましく、化学研磨処理液中に５０〜
８００ｇ／Ｌの濃度が実用範囲であり、３００〜６００
ｇ／Ｌが好ましい。硝酸及び／又はその塩も同様に１０
０〜５００ｇ／Ｌが実用範囲であり、２００〜４００ｇ
／Ｌが好ましい。また、塩酸及び／又はその塩は１〜１
００ｇ／Ｌの濃度が実用範囲であり、１０〜８０ｇ／Ｌ
が好ましい。これらの鉱酸の塩としては、可溶性のも
の、特にアルカリ金属塩、例えばリチウム、カリウム、
ナトリウム塩、及びアンモニウム塩が挙げられる。[0008] The phosphoric acid and / or its salt used in the present invention is preferably in a high concentration, and is contained in the chemical polishing treatment solution in an amount of 50 to 50%.
A concentration of 800 g / L is in the practical range, and 300 to 600
g / L is preferred. Nitric acid and / or its salts are likewise 10
The practical range is 0 to 500 g / L, and 200 to 400 g.
/ L is preferred. In addition, hydrochloric acid and / or a salt thereof is 1 to 1
A concentration of 00 g / L is within a practical range, and is 10 to 80 g / L.
Is preferred. Salts of these mineral acids include soluble ones, especially alkali metal salts such as lithium, potassium,
And the sodium and ammonium salts.
【０００９】これらの鉱酸又はその塩の作用は必ずしも
明らかではないが、硝酸と塩酸により金及び金合金の溶
解が起こり、この素材と化学研磨処理液との界面に溶出
した金属イオンと燐酸から成る高粘性層が形成され、素
材表面の凸部を優先的に溶解させることにより、平滑化
され、更には光沢化されるものと考える。Although the action of these mineral acids or salts thereof is not always clear, gold and gold alloys are dissolved by nitric acid and hydrochloric acid, and metal ions and phosphoric acid eluted at the interface between this material and the chemical polishing solution are used. It is considered that a high-viscosity layer is formed, and the convexities on the surface of the material are preferentially dissolved, thereby smoothing and further glossing.
【００１０】本発明に使用するふっ酸及び／又その塩
は、特に金合金中の金、銀、銅等の合金成分を均一に溶
解させ、光沢性を向上させる作用があり、１〜２００ｇ
／Ｌの濃度が実用範囲であり、５０〜１５０ｇ／Ｌが好
ましい。その塩としては、可溶性のもの、特にアルカリ
金属塩、例えばリチウム、カリウム、ナトリウム塩、及
びアンモニウム塩が挙げられる。The hydrofluoric acid and / or a salt thereof used in the present invention has an effect of uniformly dissolving alloy components such as gold, silver, and copper in a gold alloy to improve glossiness, and 1 to 200 g.
/ L is within the practical range, and preferably 50 to 150 g / L. The salts include those that are soluble, especially alkali metal salts, such as lithium, potassium, sodium and ammonium salts.
【００１１】本発明で使用する有機酸及び／又その塩
は、金合金の化学研磨処理後にその素材表面に付着残留
する銀、銅等の金属スマットを除去する作用があり、素
材表面を清浄面に仕上げる。使用できる有機酸及び／又
その塩としては、脂肪族及び芳香族のモノ又はポリカル
ボン酸、オキシカルボン酸、アミノ酸、更には脂肪族及
び芳香族のモノ又はポリスルホン酸等、これらの酸類の
可溶性塩類、特にアルカリ金属塩が包含される。有効な
有機酸及び／又その塩としては、例えば、蟻酸、酢酸、
プロピオン酸、グルコン酸、酪酸、シュウ酸、マロン
酸、コハク酸、グルタル酸、アジピン酸、マレイン酸、
フマル酸、安息香酸、フタル酸、酒石酸、グリコール
酸、乳酸、エチレンジアミン四酢酸、グリシン、ジグリ
コール酸、クエン酸、リンゴ酸、グリセリン酸、ニトリ
ロ三酢酸等のカルボン酸及び／又そのアルカリ金属塩、
又メタンスルホン酸、エタンスルホン酸、ベンゼンスル
ホン酸、トルエンスルホン酸等のスルホン酸及び／又そ
のアルカリ金属塩が挙げられる。その濃度は１〜１００
ｇ／Ｌが実用範囲であり、１０〜５０ｇ／Ｌが好まし
い。The organic acid and / or salt thereof used in the present invention has an effect of removing metal smut such as silver and copper remaining on the material surface after the chemical polishing treatment of the gold alloy, and cleans the material surface. To finish. The organic acids and / or salts thereof that can be used include aliphatic and aromatic mono- or polycarboxylic acids, oxycarboxylic acids, amino acids, and soluble salts of these acids such as aliphatic and aromatic mono- or polysulfonic acids. And especially alkali metal salts. Effective organic acids and / or salts thereof include, for example, formic acid, acetic acid,
Propionic acid, gluconic acid, butyric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, maleic acid,
Carboxylic acids such as fumaric acid, benzoic acid, phthalic acid, tartaric acid, glycolic acid, lactic acid, ethylenediaminetetraacetic acid, glycine, diglycolic acid, citric acid, malic acid, glyceric acid, nitrilotriacetic acid and / or alkali metal salts thereof;
And sulfonic acids such as methanesulfonic acid, ethanesulfonic acid, benzenesulfonic acid, and toluenesulfonic acid, and / or alkali metal salts thereof. Its concentration is 1-100
g / L is a practical range, and 10 to 50 g / L is preferable.
【００１２】本発明で使用するアミン化合物は上記の有
機酸及び／又その塩と同様な作用があり、特に銅スマッ
トの除去には有効的である。これらのアミン化合物は少
なくとも１個のアミノ基を含有する脂肪族及び芳香族の
モノ又はポリアミン、それらのアンモニウム塩類、（ポ
リ）アルキレンポリアミン、アルカノールアミン等を包
含し得る。最適なアミン化合物としては、メチルアミ
ン、エチルアミン、プロピレンアミン、イソプロピルア
ミン、ブチルアミン、イソブチルアミン、ペンチルアミ
ン、イソペンチルアミン、ヘキシルアミン、ジメチルア
ミン、ジエチルアミン、ジプロピルアミン、ジイソプロ
ピルアミン、Ｎ−メチルエチルアミン、Ｎ−エチルイソ
プロピルアミン、トリメチルアミン、Ｎ，Ｎ−ジメチル
プロピルアミン、Ｎ−エチル−Ｎ−メチルブチルアミン
等の第一、第二及び第三アミン、塩化テトラメチルアン
モニウム、臭化テトラメチルアンモニウム、沃化テトラ
メチルアンモニウム、水酸化テトラメチルアンモニウ
ム、塩化テトラエチルアンモニウム、水酸化テトラエチ
ルアンモニウム等のアンモニウム塩、エチレンジアミ
ン、プロピレンジアミン、トリメチレンジアミン、テト
ラメチレンジアミン、ペンタメチレンジアミン、ヘキサ
メチレンジアミン、ジエチレントリアミン、トリエチレ
ンテトラミン、テトラエチレンペンタミン等の（ポリ）
アルキレンポリアミン、エタノールアミン、２−アミノ
−１−ブタノール、２−アミノ−２−メチル−１−プロ
パノール、２−アミノ−２−メチル−１，３−プロパン
ジオール、エチルモノエタノールアミン、ジエタノール
アミン、ジメチルエタノールアミン、ジエチルエタノー
ルアミン、ブチルジエタノールアミン、３−ジエチルア
ミン−１，２−プロパンジオール、トリエタノールアミ
ン、トリス（２−ヒドロキシプロピル）アミン等のアル
カノールアミン、コリン、アニリン、トルイジン、メチ
ルアニリン、ジフェニルアミン、フェニレンジアミン等
の芳香族アミンが挙げられる。これらは１〜１００ｇ／
Ｌが実用範囲であり、１０〜５０ｇ／Ｌで使用するのが
好ましい。The amine compound used in the present invention has the same action as the above-mentioned organic acids and / or salts thereof, and is particularly effective for removing copper smut. These amine compounds may include aliphatic and aromatic mono- or polyamines containing at least one amino group, their ammonium salts, (poly) alkylene polyamines, alkanolamines and the like. Suitable amine compounds include methylamine, ethylamine, propyleneamine, isopropylamine, butylamine, isobutylamine, pentylamine, isopentylamine, hexylamine, dimethylamine, diethylamine, dipropylamine, diisopropylamine, N-methylethylamine, Primary, secondary and tertiary amines such as N-ethylisopropylamine, trimethylamine, N, N-dimethylpropylamine, N-ethyl-N-methylbutylamine, tetramethylammonium chloride, tetramethylammonium bromide, tetraiodide Ammonium salts such as methylammonium, tetramethylammonium hydroxide, tetraethylammonium chloride, tetraethylammonium hydroxide, ethylenediamine, propylenediamine, trimethyi Njiamin, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, etc. (poly)
Alkylene polyamine, ethanolamine, 2-amino-1-butanol, 2-amino-2-methyl-1-propanol, 2-amino-2-methyl-1,3-propanediol, ethyl monoethanolamine, diethanolamine, dimethylethanol Amines, alkanolamines such as diethylethanolamine, butyldiethanolamine, 3-diethylamine-1,2-propanediol, triethanolamine, tris (2-hydroxypropyl) amine, choline, aniline, toluidine, methylaniline, diphenylamine, phenylenediamine And the like. These are 1 to 100 g /
L is a practical range, and it is preferable to use 10 to 50 g / L.
【００１３】本発明の化学研磨処理液は上記の成分を水
に所定の濃度で混合することにより容易に製造すること
ができる。また、本発明の化学研磨処理液は、上記の成
分に加えて、その他の無機酸及び有機酸、界面活性剤を
必要に応じ併用することができる。化学研磨方法として
は、被処理物の材質や酸化膜の生成状態が異なるため、
処理温度を２０℃〜沸点の範囲より適宜選択して、更に
処理時間を適宜選択することにより酸化膜を除去し、良
好な光輝面に仕上げることができる。The chemical polishing solution of the present invention can be easily produced by mixing the above components with water at a predetermined concentration. In addition, the chemical polishing treatment liquid of the present invention may use other inorganic acids, organic acids, and surfactants as needed in addition to the above components. As the chemical polishing method, the material of the object to be processed and the state of formation of the oxide film are different,
By properly selecting the processing temperature from the range of 20 ° C. to the boiling point, and further selecting the processing time as appropriate, the oxide film can be removed and a good glittering surface can be obtained.
【００１４】[0014]
【実施例】以下に、本発明の効果を実施例により説明す
るが、本発明は限定されるものではなく、適宜変更して
実施することが可能なものである。EXAMPLES Hereinafter, the effects of the present invention will be described with reference to examples, but the present invention is not limited thereto, and can be implemented with appropriate modifications.
【００１５】（実施例１〜２２）下記の表１及び表２に
示す燐酸又はその塩、硝酸又はその塩、塩酸又はその
塩、ふっ酸又はその塩、有機酸、アミン化合物を水に溶
解して実施例の各化学研磨液を調製した。純金及び１８
金（Ａｕ７５％、Ａｇ１７％、Ｃｕ８％）の指輪を試験
片に用い、上記で調製した各化学研磨液に６０℃、２分
の条件で浸漬し、水洗後乾燥した。この際の素材表面の
光沢度、均一性、スマット有無を評価する。尚、光沢度
の評価はＪＩＳ Ｚ ８７４１に従い、表面光沢度計を
用いて６０度の角度で光を入射させ、その反射率を基に
測定した。得られた結果を表３に示す。Examples 1-22 Phosphoric acid or a salt thereof, nitric acid or a salt thereof, hydrochloric acid or a salt thereof, hydrofluoric acid or a salt thereof, hydrofluoric acid or a salt thereof, an organic acid or an amine compound shown in Tables 1 and 2 below are dissolved in water. Thus, each chemical polishing liquid of the example was prepared. Pure gold and 18
A gold (Au 75%, Ag 17%, Cu 8%) ring was used as a test piece, immersed in each of the above prepared chemical polishing solutions at 60 ° C. for 2 minutes, washed with water and dried. At this time, the gloss, uniformity, and the presence or absence of smut of the material surface are evaluated. The gloss was evaluated according to JIS Z8741 by using a surface gloss meter to make light incident at an angle of 60 degrees and measuring the reflectance based on the incident light. Table 3 shows the obtained results.
【００１６】（比較例１〜５）下記の表２に示す硝酸、
塩酸を所定の濃度で水に溶解させて各化学研磨液を調製
した。上記の実施例と同様の試験片を用い、９２℃、１
分の条件で浸漬し、水洗後乾燥した。この際の素材表面
状態を上記の実施例と同様に評価した。得られた結果を
表３に示す。 （比較例６）下記の表２に示すシアン化カリウム、過硫
酸ナトリウムを所定の濃度で水に溶解させて化学研磨液
を調製した。上記の実施例と同様の試験片を用い、２５
℃、５分の条件で浸漬し、水洗後乾燥した。この際の素
材表面状態を上記の実施例と同様に評価した。得られた
結果を表３に示す。(Comparative Examples 1 to 5) Nitric acid shown in Table 2 below,
Hydrochloric acid was dissolved in water at a predetermined concentration to prepare each chemical polishing liquid. Using the same test piece as in the above example, 92 ° C, 1
For 2 minutes, washed with water and dried. The surface condition of the material at this time was evaluated in the same manner as in the above example. Table 3 shows the obtained results. (Comparative Example 6) Potassium cyanide and sodium persulfate shown in Table 2 below were dissolved in water at predetermined concentrations to prepare a chemical polishing liquid. Using the same test piece as in the above example, 25
It was immersed at 5 ° C. for 5 minutes, washed with water and dried. The surface condition of the material at this time was evaluated in the same manner as in the above example. Table 3 shows the obtained results.
【００１７】（比較例７〜８）下記の表２に示すスルフ
ァミン酸、チオ尿素、硫酸、酒石酸を所定濃度で水に溶
解させた電解研磨液に、上記実施例と同様な試験片を用
い、７０℃、２分、３Ａ／ｄｍ2条件で浸潰し、水洗後
乾燥した。また、同様に、シアン化カリウム、塩化金、
炭酸カリウムを所定の濃度で水に溶解させた電解研磨液
で２５℃、３Ａ／ｄｍ2の条件で３分処理した。この際
の素材表面状態を上記の実施例と同様に評価した。得ら
れた結果を表３に示す。(Comparative Examples 7 and 8) The same test pieces as in the above example were used in an electropolishing solution in which sulfamic acid, thiourea, sulfuric acid, and tartaric acid shown in Table 2 below were dissolved in water at a predetermined concentration. It was immersed at 70 ° C. for 2 minutes at 3 A / dm 2 , washed with water and dried. Similarly, potassium cyanide, gold chloride,
The substrate was treated with an electropolishing solution in which potassium carbonate was dissolved in water at a predetermined concentration at 25 ° C. and 3 A / dm 2 for 3 minutes. The surface condition of the material at this time was evaluated in the same manner as in the above example. Table 3 shows the obtained results.
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【表２】 [Table 2]
【００２０】[0020]
【表３】 [Table 3]
【００２１】[0021]
【発明の効果】本発明に係わる金及び金合金用化学研磨
処理液は、従来技術に比べ格段に優れた研磨効果を示
し、高光沢度の光輝面が得られ、また、形状の複雑な物
でも均一に仕上がり、更に一度に大量処理ができるため
生産性向上やコスト削減に有効で、公害面を改善しうる
もので、工業的に極めて有効である。The chemical polishing solution for gold and gold alloys according to the present invention exhibits a remarkably superior polishing effect as compared with the prior art, provides a shiny surface with high gloss and has a complicated shape. However, it can be finished uniformly and can be processed in large quantities at one time, which is effective for improving productivity and reducing costs, and can improve pollution, and is extremely effective industrially.
Claims (6)
はその塩と、塩酸及び／又はその塩を含有することを特
徴とする金及び金合金用化学研磨処理液。1. A chemical polishing treatment solution for gold and gold alloys, comprising phosphoric acid and / or a salt thereof, nitric acid and / or a salt thereof, and hydrochloric acid and / or a salt thereof.
／Ｌ、硝酸及び／又はその塩を１００〜５００ｇ／Ｌ、
塩酸及び／又はその塩を１〜１００ｇ／Ｌの濃度で含有
することを特徴とする請求項１記載の金及び金合金用化
学研磨処理液。2. 50 to 800 g of phosphoric acid and / or a salt thereof.
/ L, 100 to 500 g / L of nitric acid and / or a salt thereof,
The chemical polishing treatment liquid for gold and gold alloys according to claim 1, wherein hydrochloric acid and / or a salt thereof is contained at a concentration of 1 to 100 g / L.
ることを特徴とする請求項１及び２記載の金及び金合金
用化学研磨処理液。3. The chemical polishing treatment liquid for gold and gold alloys according to claim 1, further comprising hydrofluoric acid and / or a salt thereof.
／Ｌの濃度で含有することを特徴とする請求項３に記載
の金及び金合金用化学研磨処理液。4. 1 to 200 g of hydrofluoric acid and / or a salt thereof
The chemical polishing treatment liquid for gold and gold alloy according to claim 3, wherein the chemical polishing treatment liquid is contained at a concentration of / L.
に含有することを特徴とする請求項１〜４のいずれかに
記載の金及び金合金用化学研磨処理液。5. The chemical polishing treatment liquid for gold and gold alloy according to claim 1, further comprising an organic acid and / or an amine compound.
Ｌ、アミン化合物を１〜１００ｇ／Ｌの濃度で含有する
ことを特徴とする請求項５に記載の金及び金合金用化学
研磨処理液。6. An organic acid and / or a salt thereof in an amount of 1 to 100 g /
6. The chemical polishing treatment liquid for gold and gold alloy according to claim 5, wherein L and an amine compound are contained at a concentration of 1 to 100 g / L.
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|---|---|---|---|
| JP2000295980A JP4578661B2 (en) | 2000-09-28 | 2000-09-28 | Chemical polishing solution for gold and gold alloy |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000295980A JP4578661B2 (en) | 2000-09-28 | 2000-09-28 | Chemical polishing solution for gold and gold alloy |
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| Publication Number | Publication Date |
|---|---|
| JP2002105674A true JP2002105674A (en) | 2002-04-10 |
| JP4578661B2 JP4578661B2 (en) | 2010-11-10 |
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ID=18778323
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|---|---|---|---|
| JP2000295980A Expired - Fee Related JP4578661B2 (en) | 2000-09-28 | 2000-09-28 | Chemical polishing solution for gold and gold alloy |
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| JP (1) | JP4578661B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007191779A (en) * | 2006-01-23 | 2007-08-02 | Nippon Hyomen Kagaku Kk | Method for producing glossed metallic member and composition liquid for producing the same |
| CN102660748A (en) * | 2012-05-03 | 2012-09-12 | 莆田市金伯爵珠宝首饰有限公司 | Processing process for gold products |
| CN102987664A (en) * | 2011-09-19 | 2013-03-27 | 翟飞恒 | Process for taking K gold jewelry from bottom water |
| DE102014213923A1 (en) | 2013-08-29 | 2015-03-05 | Biotronik Ag | Process for electropolishing gold or platinum containing surfaces |
| CN107400889A (en) * | 2017-07-26 | 2017-11-28 | 江苏盐城环保科技城重金属防治研究中心 | A kind of surface treatment method for being molded proof gold product blanks |
| CN107460484A (en) * | 2017-07-13 | 2017-12-12 | 飞而康快速制造科技有限责任公司 | For polishing polishing reagent, the method and system of nickel-base alloy workpiece inner flow passage |
| CN114457340A (en) * | 2022-01-25 | 2022-05-10 | 深圳市金安盛首饰有限公司 | Cleaning agent for removing impurities on surface of gold ornament and preparation method and application thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1004452A3 (en) * | 1990-06-19 | 1992-11-24 | Solvay | Baths and method for chemically polishing stainless steel surfaces. |
-
2000
- 2000-09-28 JP JP2000295980A patent/JP4578661B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007191779A (en) * | 2006-01-23 | 2007-08-02 | Nippon Hyomen Kagaku Kk | Method for producing glossed metallic member and composition liquid for producing the same |
| CN102987664A (en) * | 2011-09-19 | 2013-03-27 | 翟飞恒 | Process for taking K gold jewelry from bottom water |
| CN102660748A (en) * | 2012-05-03 | 2012-09-12 | 莆田市金伯爵珠宝首饰有限公司 | Processing process for gold products |
| DE102014213923A1 (en) | 2013-08-29 | 2015-03-05 | Biotronik Ag | Process for electropolishing gold or platinum containing surfaces |
| CN107460484A (en) * | 2017-07-13 | 2017-12-12 | 飞而康快速制造科技有限责任公司 | For polishing polishing reagent, the method and system of nickel-base alloy workpiece inner flow passage |
| CN107460484B (en) * | 2017-07-13 | 2019-10-11 | 飞而康快速制造科技有限责任公司 | For polishing polishing reagent, the method and system of nickel-base alloy workpiece inner flow passage |
| CN107400889A (en) * | 2017-07-26 | 2017-11-28 | 江苏盐城环保科技城重金属防治研究中心 | A kind of surface treatment method for being molded proof gold product blanks |
| CN114457340A (en) * | 2022-01-25 | 2022-05-10 | 深圳市金安盛首饰有限公司 | Cleaning agent for removing impurities on surface of gold ornament and preparation method and application thereof |
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| Publication number | Publication date |
|---|---|
| JP4578661B2 (en) | 2010-11-10 |
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