JP2002100854A - Electronic circuit block - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit block for which the circuit characteristic of a printed circuit board on which an electronic component is loaded can be corrected easily. SOLUTION: The electronic circuit block has a mold block part 3, in which part of the printed circuit board 2 on which the electronic component 1 is loaded is partially applied and formed with the electronic component 1 and which is formed of polyamide resin. The mold block part corrects the voltage characteristic of a circuit by electrostatic capacity specific to polyamide resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic circuit block mainly composed of a printed circuit board on which electronic components are mounted.

[0002]

2. Description of the Related Art Conventionally, in order to ensure insulation and moisture-proof properties of a circuit of a printed circuit board and electronic components mounted thereon, the printed circuit board has been subjected to potting, molding and the like to be covered with a resin. Have been done. In this case, generally, a resin film layer is coated and formed on substantially the entire printed circuit board, and the whole of the printed circuit board as a main body is formed as an electronic circuit block having a predetermined shape.

In this case, the resin film layer is formed as thin as possible and has a constant thickness so as not to affect the circuit characteristics (in particular, the voltage characteristics) of the printed circuit board on which the electronic components are mounted. Therefore, when the resin film layer is formed by coating, the filling amount of the resin is fixed, and the formed electronic circuit block is obtained not in an arbitrary shape but in a predetermined shape.

[0004]

However, according to the above-mentioned prior art, when it is desired to correct the circuit characteristics of the printed circuit board itself, substantially the entirety thereof is covered with a resin film layer and formed into a predetermined shape. Since it is a circuit block, it is difficult to change the thickness of the resin film layer and adjust it by the inherent capacitance of the resin, and it can only be handled by changing and adjusting the circuit itself of the printed circuit board. .

In addition, correcting the circuit characteristics only at a portion corresponding to a specific electronic component mounted on a printed circuit board requires reducing the resin filling amount when coating and molding the resin film layer. Since it cannot be changed, it is extremely difficult to adjust the capacitance based on the inherent capacitance of the resin, and this can also be handled only by changing the electronic component itself.

SUMMARY OF THE INVENTION The present invention has been made in order to solve all the problems in the prior art described above, and an object thereof is to provide an electronic device capable of easily correcting circuit characteristics of a printed circuit board on which electronic components are mounted. It is to provide a circuit block.

[0007]

An electronic circuit block according to a first aspect of the present invention is a mold block made of a polyamide resin in which a part of a printed circuit board on which an electronic component is mounted is partially covered and formed together with the electronic component. The mold block corrects the voltage characteristics of the circuit by the capacitance inherent in the polyamide resin.

Therefore, in this case, since the mold block portion made of the polyamide resin is formed by partially covering the printed circuit board together with the electronic components,
The filling amount of the polyamide resin to be coated can be changed, the entire electronic circuit block can be obtained in an arbitrary shape, and the capacitance specific to the polyamide resin is changed and adjusted to obtain the voltage characteristics (circuit characteristics) of the circuit. Can be easily corrected.

According to a second aspect of the present invention, there is provided an electronic circuit block according to the first aspect, wherein a voltage characteristic is changed by changing a coating thickness of a mold block portion at a portion corresponding to a specific electronic component. It is characterized by being corrected.

Therefore, in this case, in particular, by changing the coating thickness of the mold block at a portion corresponding to a specific electronic component, local voltage characteristics at the portion can be easily corrected.

According to a third aspect of the present invention, in the electronic circuit block according to the first aspect of the present invention, the voltage characteristic is corrected by providing an insulator covering a specific electronic component in the mold block. It is characterized by the following.

Therefore, in this case, in particular, by providing an insulator for covering a specific electronic component in the mold block, local voltage characteristics in the electronic component can be easily corrected.

According to a fourth aspect of the present invention, there is provided an electronic circuit block according to the first aspect, wherein an electrode plate made of a conductor is inserted into a mold block at a portion corresponding to a specific electronic component. The voltage characteristic is corrected by molding.

Therefore, in this case, in particular, the local voltage characteristics at the specific portion can be easily corrected by insert-molding an electrode plate made of a conductor in the mold block at the portion corresponding to the specific electronic component. can do.

According to a fifth aspect of the present invention, in the electronic circuit block according to the first aspect, a voltage characteristic is corrected by forming a hollow space in which a specific electronic component is accommodated in the mold block. It is characterized in that it is performed.

Therefore, in this case, in particular, by forming a hollow space in which a specific electronic component is accommodated in the mold block, it is possible to easily correct local voltage characteristics in the portion of the electronic component.

According to a sixth aspect of the present invention, there is provided the electronic circuit block according to any one of the first to fifth aspects, wherein a mounting piece having a through hole in the mold block portion is integrally protruded. It is characterized by having been formed.

Therefore, in this case, in particular, the electronic circuit block can be fastened and fixed by using the projecting through-hole of the mounting piece, and the mounting piece is easily formed integrally with the mold block by simultaneous molding. You.

An electronic circuit block according to a seventh aspect of the present invention is the electronic circuit block according to any one of the first to fifth aspects, wherein the mold block is fitted to the fitting holding portion of the support base. It is characterized in that the protruding step is integrally formed to protrude.

Therefore, in this case, in particular, the protruding projecting step can be fitted to the fitting holding section of the support base, and the electronic circuit block can be easily positioned and held with respect to the support base. The part is easily formed by simultaneous molding with the mold block part.

[0021]

1 and 2 show an embodiment corresponding to claim 1 of the present invention. An electronic circuit block according to this embodiment has a printed circuit board on which an electronic component 1 is mounted (mounted). 2 has a mold block portion 3 made of a polyamide resin formed by partially covering and molding the electronic component 1 together with the electronic component 1. The mold block portion 3 has a voltage characteristic (circuit characteristic) of a circuit due to an inherent capacitance of the polyamide resin. ) Is corrected.

In this case, a circuit pattern (not shown) is formed on the printed circuit board 2, and a plurality of electronic components 1 are mounted and fixed at appropriate places of the circuit pattern by soldering or the like. . The printed circuit board 2 has a rectangular shape, and a mold block 3 is formed and integrated on the surface of substantially half of one side in the longitudinal direction. The mold block 3 allows the circuit of the printed circuit board 2 to be mounted on the circuit. The insulating property and the moisture-proof property of the electronic component 1 to be obtained are secured if necessary. The mold block 3 is made of a polyamide resin and is formed by molding.

For example, as shown in FIG. 3, a mold 12 surrounding a predetermined range is placed on the surface of the printed circuit board 2, and the molten resin is injected and filled in the mold 12, and the resin is cooled. After curing, the mold 12 is removed, and the mold block 3 is formed and integrated on the surface of the printed circuit board 2. Here, a transfer mold system in which a resin melted by heating and melting is injected to perform resin sealing is adopted.
Can be formed by coating.

Then, as shown in FIG. 4, an equivalent circuit is formed in the mold block 3 made of a polyamide resin. Here, when the polyamide resin is injected and filled, the voltage characteristics of the circuit are corrected by changing the filling amount. That is, as shown in FIG. 5A, when the filling amount of the polyamide resin is increased, the capacitance is increased, and when the capacitance is increased, as shown in FIG. Characteristic) is reduced.

As described above, it is possible to correct the circuit characteristics by increasing the filling amount of the polyamide resin to lower the circuit output characteristics, or conversely, by decreasing the filling amount to increase the circuit output characteristics. it can. Here, since the thickness of the entire mold block portion 3 changes according to the filling amount, the capacitance inherent in the polyamide resin to be the mold block portion 3 is changed and adjusted.

Therefore, in the electronic circuit block of this embodiment, since the mold block portion 3 made of a polyamide resin is formed by partially coating the printed circuit board 2 with the electronic component 1, the coating molding is performed. The amount of the filled polyamide resin can be changed, the entire electronic circuit block can be obtained in any shape, and the voltage characteristic (circuit characteristics) of the circuit can be externally adjusted by changing the capacitance inherent in the polyamide resin. It can be easily corrected.

FIG. 6 shows another embodiment corresponding to the first and second aspects of the present invention. In the electronic circuit block of this embodiment, a specific electronic component 1a (one of the electronic components 1a and 1b is used). The voltage characteristic is corrected by changing the coating thickness d of the mold block portion 3 at a portion corresponding to the component 1a).

In this case, a recess 13 is formed on the surface of the mold block 3 at a portion corresponding to the electronic component 1a,
The thickness dimension (coating thickness d) of the mold block 3 at the bottom of the recess 13 is smaller than that of other portions. Thus, the mold block 3 made of polyamide resin
As shown in FIG. 7, the circuit output characteristics become higher, and the circuit output characteristics at the portion corresponding to the specific electronic component 1a are higher than those at the other portions, as shown in FIG.

Therefore, in the electronic circuit block of this embodiment, by changing the coating thickness d of the mold block portion 3 at a portion corresponding to the specific electronic component 1a, the static electricity of the polyamide resin occupied by the electronic component 1a is changed. The capacitance is changed and adjusted. In other words, when the coating thickness d is increased, the capacitance increases, and conversely, when the coating thickness d is reduced, the capacitance decreases. By adjusting the change in this way, it is possible to respond to the specific electronic component 1a. It is possible to easily correct a local voltage characteristic at a site.

In this case, the voltage characteristic can also be corrected by changing the coating thickness d of the mold block portion 3 for each portion corresponding to the plurality of electronic components 1.
In a portion corresponding to the specific electronic component 1a, a convex portion is formed on the surface of the mold block portion 3, and the thickness of the mold block portion 3 in the portion of the convex portion is made thicker than other portions. The correction can be made so that the circuit output characteristic at a part is lower than at other parts. Except for this, the configuration is the same as that of the embodiment shown in FIGS.

FIG. 8 shows still another embodiment corresponding to the first and third aspects of the present invention. In the electronic circuit block of this embodiment, a specific electronic component 1a (one of the electronic components 1a and 1b) is used. The insulator 4 covering the electronic component 1a) is inserted into the mold block 3
The voltage characteristics are corrected by being provided in the inside.

In this case, an insulator 4 made of an insulating tube is provided so as to be attached to the outside of the specific electronic component 1a.
The capacitance of the polyamide resin occupied by the electronic component 1a is changed and adjusted, and the circuit output characteristics are corrected. That is,
When the electronic component 1a is covered with the insulator 4, the circuit output characteristics in this portion are enhanced, and further, by increasing the thickness of the insulator 4, the circuit output characteristics are further enhanced. The output characteristics of the circuit can be corrected so as to be reduced by reducing the thickness of the insulator 4.

Therefore, in the electronic circuit block of this embodiment, by providing the insulator 4 covering the specific electronic component 1a in the mold block 3, the thickness dimension of the insulator 4 is further adjusted. This makes it possible to easily correct local voltage characteristics in the portion of the electronic component 1a covered with the insulator 4. Except for this, the configuration is the same as that of the embodiment shown in FIG.

FIG. 9 shows still another embodiment corresponding to claims 1 and 3 of the present invention. In the electronic circuit block of this embodiment, a mold block 3 is formed outside a specific electronic component 1a. By applying a molding material (coating material) having insulation performance different from that of the polyamide resin to be formed, an insulator 4 made of the molding material is provided. Except for this, the configuration is the same as that of the embodiment shown in FIG. 8, and the same operation and effect as in the above-described embodiment are exerted.

FIG. 10 shows still another embodiment corresponding to claims 1 and 4 of the present invention. In the electronic circuit block of this embodiment, a specific electronic component 1a (one of the electronic components 1a and 1b) is used. The voltage characteristics are corrected by insert-molding an electrode plate 5 made of a conductor in the mold block 3 at a position corresponding to the electronic component 1a).

In this case, the electrode plate 5 is formed in a substantially central position of the specific electronic component 1a to a depth from the surface of the mold block 3 to the vicinity of the electronic component 1a. It is insert molded at the same time. Then, as shown in FIG. 11, an equivalent circuit is formed in the mold block portion 3 made of a polyamide resin, and a specific electronic component is formed.
Capacitance of polyamide resin occupied by 1a C = C1 · C
2 / (C1 + C2), the capacitance C is changed and adjusted, and the circuit output characteristic is corrected.

That is, when the electrode plate 5 is insert-molded, the capacitance C of the polyamide resin occupied by the specific electronic component 1a is changed and adjusted, and the circuit output characteristics in this portion are enhanced. By increasing the insert depth of the electrode plate 5, the output characteristics of the circuit are further enhanced, and conversely, by decreasing the insert depth of the electrode plate 5, the output characteristics of the circuit can be corrected to decrease. it can.

Therefore, in the electronic circuit block of the present embodiment, the electrode plate 5 made of a conductor is insert-molded into the mold block 3 at a position corresponding to the specific electronic component 1a, thereby forming a local portion at the same position. Voltage characteristics can be easily corrected. Except for this, the configuration is the same as that of the embodiment shown in FIG. 6, and the same operation and effect as in the above-described embodiment are exerted.

FIG. 12 shows still another embodiment corresponding to claims 1 and 5 of the present invention. In the electronic circuit block of this embodiment, a specific electronic component 1a (one of the electronic components 1a and 1b) is used. By forming a hollow space 6 in which the electronic component 1a) is housed in the mold block 3, the voltage characteristics are corrected.

In this case, the specific electronic component 1a is covered with an air layer in the hollow space 6, and the coating thickness of the molding 3 formed on the outside of the air layer is changed.
The voltage characteristics are corrected. That is, the molding unit 3
By forming the hollow space 6, the capacitance of the polyamide resin occupied by the specific electronic component 1a is changed and adjusted, the circuit output characteristics in this portion are enhanced, and the hollow space 6 By increasing the thickness of the air layer, the output characteristics of the circuit can be further enhanced. Conversely, by reducing the thickness of the air layer in the hollow space 6, the output characteristics of the circuit can be corrected so as to decrease.

Therefore, in the electronic circuit block of this embodiment, the hollow space 6 for accommodating the specific electronic component 1a is formed in the mold block portion 3,
Further, by changing and adjusting the thickness of the air layer in the hollow space 6, local voltage characteristics in a portion of the electronic component 1a housed in the hollow space 6 can be easily corrected. Except for this, the configuration is the same as that of the embodiment shown in FIG.

FIG. 13 shows still another embodiment corresponding to claims 1 and 6 of the present invention. In the electronic circuit block of this embodiment, a mounting piece 8 having a through hole 7 in a mold block portion 3 is provided. They are integrally formed to protrude. In this case, FIG.
As shown in the figure, a half of one side in the longitudinal direction of the printed circuit board 2 is accommodated and installed in a mold 12 opened upward, and in this state, a polyamide resin is injected and filled into the mold 12, and the polyamide resin is filled. By removing the mold block 3 from the mold 12 after curing, the mold block 3 can be molded and integrated on the surface of the printed circuit board 2.

At this time, the mounting piece 8 is formed integrally with the mold block 3 so as to protrude. That is, a concave portion 14 having a shape corresponding to the mounting piece 8 is provided in the inner bottom portion of the mold 12, and the mounting piece 8 is formed so as to project from the polyamide resin injected and filled in the concave portion 14. You.
The mounting piece 8 is provided with a through hole 7 by post-processing.

Therefore, in the electronic circuit block of the present embodiment, the electronic circuit block can be fastened and fixed using the projecting through-hole 7 of the mounting piece 8.
The same electronic circuit block can be easily fastened and fixed externally to other electronic circuit blocks or finished products with screws or the like, and the mounting piece 8 is integrated with the mold block 3 as described above. It is easily formed by simultaneous molding.

Except for this, the configuration is the same as that of the embodiment shown in FIG. 1, and the same operation and effect as in the above-described embodiment are exerted. In the electronic circuit block of this embodiment, by adopting the same configuration as each of the embodiments shown in FIGS. 6 to 12, the same operation and effect as those of each of the above embodiments can be obtained. It is also possible.

FIG. 15 shows still another embodiment corresponding to claims 1 and 6 of the present invention. In the electronic circuit block of this embodiment, a mounting piece 8 protruding from a mold block portion 3 is provided. A part of the printed circuit board 2 is extended and interposed. In this case, as shown in FIG. 16, a portion where the printed circuit board 2 is extended is accommodated in a concave portion 14 provided in the inner bottom portion of the mold 12, and in this state,
A polyamide resin is injected and filled into the mold 12, and the mold block 3 is integrally formed on the front and back surfaces of the printed circuit board 2. The mounting piece 8 is provided with a through-hole 7 through a part of the printed circuit board 2 extending therethrough by post-processing.

Therefore, in the electronic circuit block of this embodiment, the protruding mounting piece 8 is reinforced by the printed circuit board 2 extending and interposed therein.
The electronic circuit block can be firmly fastened and fixed by using the through hole 7 of the mounting piece 8. Except for the above, the configuration is the same as that of the embodiment shown in FIG. 6 to 12 in the electronic circuit block of this embodiment.
By adopting the same configuration as in each of the above-described embodiments, it is sufficiently possible to achieve the same operation and effect as in each of the above-described embodiments.

Further, in the electronic circuit block of this embodiment, as shown in FIG. 17, a conductive pin 15 such as a pressure terminal is inserted and fixed in the mounting hole 8 by soldering 16 or the like.
15 and the circuit of the printed circuit board 2 can also be electrically connected and fastened. In this case, the external electrical connection portion 18 provided at the tip of the electrical cord 17 or the like can be electrically connected to the circuit of the printed circuit board 2 via the conductive pin 15, and the same as the mechanical fastening. The function of electrical fastening is also added.

FIG. 18 shows still another embodiment corresponding to claims 1 and 7 of the present invention. In the electronic circuit block of this embodiment, the fitting and holding section 10 of the support base 9 is attached to the mold block 3. The protruding step portion 11 to be fitted is integrally formed so as to protrude.
In this case, the fitting holding portion 10 of the support base 9 has an opening shape, and the outer shape of the projecting step portion 11 is formed so as to substantially match the opening shape, and the projecting dimension of the projecting step portion 11 is the same as the opening shape. It is formed so as to substantially match the depth dimension.

Therefore, in the electronic circuit block of this embodiment, the protruding step 11 is fitted to the fitting holding portion 10 of the support base 9 in the next step of the mold cover molding, and the electronic circuit block is assembled in the same manner. It can be easily positioned and held with respect to the support base 9. In addition, since there is a degree of freedom in designing the shape of the mold block 3 to be molded and molded, the projecting step 11 can be easily formed integrally with the mold block 3 by simultaneous molding with the mold.

Except for this, the configuration is the same as that of the embodiment shown in FIG. 1, and the same operation and effect as those of the above-described embodiment are exerted. In the electronic circuit block of this embodiment, by adopting the same configuration as each of the embodiments shown in FIGS. 6 to 12, the same operation and effect as those of each of the above embodiments can be obtained. It is also possible.

FIG. 19 shows still another embodiment corresponding to claim 1 of the present invention. In the electronic circuit block of this embodiment, the characteristics of the electronic circuit are corrected when the mold block 3 is formed by coating. The molding block 3 is molded with a polyamide resin, except for a compensating component 19 such as a volume resistor provided to perform the molding. Therefore, in the electronic circuit block of the embodiment, even after the end of the molding for imparting insulation and moisture resistance,
The characteristics of the electronic circuit can be easily corrected by the exposed correction component 19.

Except for this, the configuration is the same as that of the embodiment shown in FIG. 1, and the same operation and effect as those of the above-described embodiment are exerted. In the electronic circuit block of this embodiment, by adopting the same configuration as each of the embodiments shown in FIGS. 6 to 12, the same operation and effect as those of each of the above embodiments can be obtained. It is also possible.

FIGS. 20 and 21 show still another embodiment corresponding to claim 1 of the present invention. In the electronic circuit block of this embodiment, a display member 20 such as a liquid crystal is formed on a printed circuit board 2.
The display member 20 is easily held and fixed at a predetermined position of the printed circuit board 2 with an adhesive 22 made of a polyamide resin. In this case, the mold block portion 3 and the adhesive 22 can be molded at the same time using the same polyamide resin, so that assembly and processing conventionally performed for holding and fixing the display member 20 can be performed.・ Work such as mounting can be omitted.

Except for this, the configuration is the same as that of the embodiment shown in FIG. 1, and the same operation and effect as in the above-described embodiment are exerted. In the electronic circuit block of this embodiment, by adopting the same configuration as each of the embodiments shown in FIGS. 6 to 12, the same operation and effect as those of each of the above embodiments can be obtained. It is also possible.

[0056]

As described above, in the electronic circuit block according to the first aspect of the present invention, the mold block portion made of a polyamide resin is partially covered and molded. By changing and adjusting the capacitance, the voltage characteristics of the circuit can be easily corrected.

In the electronic circuit block according to the second aspect of the present invention, in particular, by changing the coating thickness of the mold block, local voltage characteristics at a portion corresponding to a specific electronic component can be easily achieved. Can be corrected.

In the electronic circuit block according to the third aspect of the present invention, in particular, by providing an insulator in the mold block portion, local voltage characteristics at a portion of the electronic component covered with the insulator can be easily improved. Can be corrected.

Further, in the electronic circuit block according to the fourth aspect of the present invention, in particular, by localizing the electrode plate in the mold block portion, local voltage characteristics at a portion corresponding to a specific electronic component can be easily achieved. Can be corrected.

Further, in the electronic circuit block according to the fifth aspect of the present invention, in particular, by forming a hollow space in the mold block portion, a local voltage characteristic in a portion of the electronic component housed in the hollow space. Can be easily corrected.

In the electronic circuit block according to the sixth aspect of the present invention, in particular, by using the through hole of the mounting piece which is easily formed by simultaneous molding with the mold block portion,
The electronic circuit block can be fastened and fixed.

In the electronic circuit block according to the seventh aspect of the present invention, in particular, the projecting step formed simply by simultaneous molding with the mold block portion is fitted to the fitting holding portion of the support base. Thus, the electronic circuit block can be easily positioned and held.

[Brief description of the drawings]

FIG. 1 is an essential part cross-sectional view showing an electronic circuit block according to an embodiment of the present invention.

FIG. 2 is an exemplary perspective view showing the electronic circuit block;

FIG. 3 is a schematic perspective view showing a coating molding state in the electronic circuit block.

FIG. 4 is a schematic explanatory view showing a distribution state of capacitance in the electronic circuit block.

5A is a graph showing a relationship between a filling amount and a capacitance, and FIG. 5B is a graph showing a relationship between a capacitance and a circuit output characteristic in the electronic circuit block.

FIG. 6 is an essential part cross-sectional view showing an electronic circuit block according to another embodiment;

FIG. 7 is a graph showing a relationship between a coating thickness (d) and a circuit output characteristic in the electronic circuit block.

FIG. 8 is an essential part cross-sectional view showing an electronic circuit block according to yet another embodiment.

FIG. 9 is an essential part cross-sectional view showing an electronic circuit block according to yet another embodiment.

FIG. 10 is an essential part cross-sectional view showing an electronic circuit block according to yet another embodiment.

FIG. 11 is a schematic explanatory view showing a distribution state of capacitance in the electronic circuit block.

FIG. 12 is an essential part cross-sectional view showing an electronic circuit block according to yet another embodiment.

FIG. 13 is a perspective view showing an electronic circuit block according to still another embodiment.

FIG. 14 is a schematic cross-sectional view showing a coating molding state in the electronic circuit block.

FIG. 15 is a perspective view showing an electronic circuit block according to still another embodiment.

FIG. 16 is a schematic cross-sectional view showing a coating molding state in the electronic circuit block.

FIG. 17 is an exemplary perspective view showing one use state of the electronic circuit block;

FIG. 18 is a schematic sectional view showing a use state of an electronic circuit block according to still another embodiment.

FIG. 19 is a perspective view showing an electronic circuit block according to still another embodiment.

FIG. 20 is a perspective view showing a manufacturing state of an electronic circuit block according to still another embodiment.

FIG. 21 is an exemplary perspective view showing the state of use of the electronic circuit block;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 1a Electronic component 1b Electronic component 2 Printed circuit board 3 Mold block part 4 Insulator 5 Electrode plate 6 Hollow space 7 Through hole 8 Mounting piece 9 Support base 10 Fitting holding part 11 Convex step

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M109 AA01 BA04 CA01 CA21 EA08 EC07 EE07 GA02 5E314 AA36 BB06 CC17 FF01 FF21 GG26

Claims (7)

[Claims] An electronic component has a mold block portion made of a polyamide resin in which a part of a printed circuit board on which an electronic component is mounted is partially covered and formed together with the electronic component, and the mold block portion has a capacitance inherent to the polyamide resin. An electronic circuit block that corrects the voltage characteristics of the circuit. 2. The voltage characteristic is corrected by changing a coating thickness of a mold block portion at a portion corresponding to a specific electronic component.
Electronic circuit block as described. 3. The electronic circuit block according to claim 1, wherein the voltage characteristic is corrected by providing an insulator covering a specific electronic component in the mold block portion. 4. The voltage characteristic is corrected by insert-molding an electrode plate made of a conductor in a mold block portion at a portion corresponding to a specific electronic component. Electronic circuit block as described. 5. The electronic circuit block according to claim 1, wherein a voltage characteristic is corrected by forming a hollow space in which a specific electronic component is accommodated in the mold block. 6. The mounting block according to claim 1, wherein a mounting piece having a through hole is integrally formed in the mold block.
6. The electronic circuit block according to any one of items 1 to 5, 7. The electronic circuit block according to claim 1, wherein a convex step portion that fits with the fitting holding portion of the support base is formed integrally with the mold block portion so as to protrude. .