JP2002100534A - Method of manufacturing solid electrolyte capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a solid electrolyte capacitor which can be made in a smaller size with larger capacitance and is readily manufactured and whose characteristic can be improved. SOLUTION: A first lead frame 12 is disposed between an anode terminal 16 and a lead wire 1 for an anode. The frame 12 is provided with an auxiliary anode terminal 14 having a thickness almost the same as the distance from a peripheral surface of a capacitor element 10 to a peripheral surface of the lead wire 1 for an anode. A second lead frame 13 is provided with the anode terminal 16 and a cathode terminal 17 laminated and integrated to form a lead frame 11 while the auxiliary anode terminal 14 is aligned to the anode terminal 16. The lead wire 1 for an anode and a cathode layer are connected to the auxiliary anode terminal 14 and the cathode terminal 17, respectively, to connect the capacitor element 10 to the lead frame 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a molded chip type solid electrolytic capacitor.

[0002]

2. Description of the Related Art A solid electrolytic capacitor such as a molded chip type tantalum solid electrolytic capacitor is manufactured by the following method, for example. That is, one end of an anode lead wire made of a valve metal such as tantalum is buried in advance to form a sintered body made of fine powder of a valve metal such as tantalum, aluminum, or niobium. Next, this sintered body is anodized to form an anodized film. Further, a solid electrolyte layer made of a conductive polymer such as manganese dioxide or polyaniline and a cathode layer made of carbon or silver are sequentially laminated on the surface of the anodic oxide film to form a capacitor element. Then, a plurality of the capacitor elements are connected to the lead frame at the positions of the anode lead wire and the cathode layer. Thereafter, the capacitor element is covered with an insulating resin by a resin molding method to form an exterior. After forming the exterior, the lead frame is cut to leave unnecessary portions as anode terminals and cathode terminals, and unnecessary portions are removed. Then, the anode terminal and the cathode terminal are bent along the side surface and the bottom surface of the exterior to manufacture a chip-type solid electrolytic capacitor 30 as shown in FIG.

However, in the solid electrolytic capacitor 30, the anode terminal 31 and the cathode terminal 32 are drawn out from the side surface of the exterior 33 and are arranged along the side surface. A phenomenon may occur, leading to a failure to rise. In the exterior 33, the anode terminal 31 is connected to the anode lead wire 34.
And the cathode terminal 3
2 is extended in the longitudinal direction of the capacitor element 35.
The extended anode terminal 31 and cathode terminal 32 are drawn out from the side surface of the exterior 33. For this reason, the solid electrolytic capacitor 30 is particularly difficult to reduce the length between the side surfaces 36 from which the anode terminal 31 and the cathode terminal 32 are drawn out, and it is also difficult to reduce the overall size. Further, when the dimensions are constant, it is difficult to increase the size of the capacitor element 35 and increase the capacity.

In order to improve this drawback, a solid electrolytic capacitor 40 as shown in FIG. In the solid electrolytic capacitor 40, the anode terminal 41 and the cathode terminal 42 are exposed only from the bottom 44 of the exterior 43, and the exterior 4
Since the structure is not exposed from the side surface of the device 3, the occurrence of the Manhattan phenomenon at the time of connection to a printed circuit board or the like can be prevented, and the size and capacity can be reduced.

[0005]

The solid electrolytic capacitor 40 uses a lead frame for forming an anode terminal 41 and a cathode terminal 42, and an anode lead drawn from a capacitor element 45. Line 4
In order to connect 6 to the anode terminal 41, a part of the lead frame is cut and raised to stand up. However, the rising portion 47 is, for example, on the order of 1/10 mm in height, and is difficult to manufacture, and tends to cause dimensional errors. Therefore, when welding the anode lead wire 46 to the rising portion, the anode lead wire 46 must be bent up or down in accordance with the dimensional error of the rising portion. For this reason, bending stress is also transmitted to the portion of the anode lead wire 46 embedded in the sintered body 48, and the contact between the embedded portion and the sintered body 48 is deteriorated, and the solid electrolytic capacitor 40. Has the disadvantage of deteriorating the characteristics.

[0006] The present invention improves the above disadvantages, reduces the size,
It is an object of the present invention to provide a method of manufacturing a solid electrolytic capacitor which can have a large capacity, is easy to manufacture, and has improved characteristics.

[0007]

According to the first aspect of the present invention, a sintered body is formed by burying one end of an anode lead wire and sintering a valve metal powder to sinter the powder. A step of forming a capacitor element by sequentially providing an anodic oxide film, a solid electrolyte layer, and a cathode layer on the sintered body; a step of connecting the capacitor element to a lead frame; Forming a package by exposing the terminal and the cathode terminal only from the bottom portion, and separating the capacitor element after the package is formed from the lead frame. A first auxiliary anode terminal disposed between the anode lead wire and an auxiliary anode terminal having a thickness substantially equal to the distance from the peripheral surface of the capacitor element to the peripheral surface of the anode lead wire; A lead frame and a second lead frame provided with an anode terminal and a cathode terminal are laminated and integrated with the auxiliary anode terminal in accordance with the anode terminal to form the lead frame. The capacitor element is connected to the lead frame by connecting the anode element and the cathode layer to the cathode terminal, respectively.

That is, according to the present invention, since the anode terminal and the cathode terminal are exposed only from the bottom of the exterior and not from the side of the exterior, the solid electrolytic capacitor can be easily reduced in size and capacity. The Manhattan phenomenon can be prevented. Also, placed between the anode terminal and the anode lead wire,
A first lead frame provided with an auxiliary anode terminal having a thickness substantially equal to a distance from a peripheral surface of a capacitor element to a peripheral surface of an anode lead wire, and a second lead frame provided with an anode terminal and a cathode terminal The auxiliary anode terminal and the anode terminal are laminated and integrated to form a lead frame, the anode lead wire of the capacitor element is connected to the auxiliary anode terminal, and the cathode layer is connected to the cathode terminal to connect the capacitor element. Because it is connected to the lead frame, the anode lead wire
It can be connected to the anode terminal via the auxiliary anode terminal with almost no upward or downward bending. Therefore, manufacture becomes easy, and deterioration of characteristics can be reduced.

In order to achieve the above object, the invention according to claim 2 is particularly arranged between the anode terminal and the anode lead wire, from the peripheral surface of the capacitor element to the drawing of the anode lead wire. A first lead frame in which one or more groups of juxtaposed auxiliary anode terminals having a thickness substantially equal to the distance are arranged, and a first lead frame in which one or more groups of juxtaposed groups of anode terminals and cathode terminals are arranged. 2 and the auxiliary anode terminal are laminated and integrated together with the auxiliary anode terminal to the anode terminal to form a lead frame, and the anode lead wire is connected to the auxiliary anode terminal and the cathode layer is connected to the cathode terminal. The capacitor element is connected to the lead frame, and then the capacitor elements are integrated into groups and covered with a resin.

Therefore, according to the second aspect of the invention, similarly to the first aspect of the invention, the solid electrolytic capacitor can be easily manufactured, and can be reduced in size and capacity, the Manhattan phenomenon can be prevented, and the characteristics are deteriorated. Can be reduced. Conventionally, in order to form an exterior by a molding method, an upper mold and a lower mold are used, one capacitor element is housed in each cavity, and resin is injected into the cavity to form the capacitor element. It is coated with resin to form an exterior. Then, the upper mold and the lower mold may be displaced from each other at a predetermined position, and in this case, the exterior may be partially thinned or the capacitor element may be seen, resulting in poor insulation or poor appearance. is there. However, according to the present invention, a plurality of capacitor elements are grouped and integrally coated with resin, and then the lead frame and the resin coating are cut and separated into individual capacitors. Even if the mold deviates, only the capacitor element at the end can be seen, and defective insulation and poor appearance can be reduced. Furthermore, the capacitor elements can be grouped into groups and coated with a resin, and then the resin coating can be separated into individual solid electrolytic capacitors by cutting the entire lead frame, so that the number of solid electrolytic capacitors obtained by one lead frame can be reduced. Can be many,
Mass productivity can be improved. Then, if the capacitor element is covered with a resin by molding and the resin is cured, the lead frame is easily warped. However, in accordance with the present invention, the lead frame comprises a first lead frame and a second lead frame.
Since the two lead frames are laminated and integrated, they are hardly warped. Therefore, it is easy to cut the lead frame and the resin exterior at a predetermined position, and it is possible to prevent poor insulation and poor appearance.

Further, according to a third aspect of the present invention, in the method for manufacturing a solid electrolytic capacitor according to the first or second aspect, the outer dimensions of the first lead frame and the second lead frame are substantially the same. . Therefore, according to the third aspect of the present invention, when the first lead frame and the second lead frame are laminated, the alignment can be easily performed, the lead frame can be easily formed, and the manufacturing can be facilitated.

According to a fourth aspect of the present invention, in the method for manufacturing a solid electrolytic capacitor according to any one of the first to third aspects, a recess is provided at at least one end of the anode terminal and the cathode terminal. That is, according to the invention of claim 4, by providing a recess at the end of the anode terminal or the cathode terminal, when the solid electrolytic capacitor is soldered to the printed wiring board, the solder accumulates in the recess. Reliability is improved. Further, when a dent is provided at only one end of the anode terminal or the cathode terminal, or when the shape or size of the dent is changed, it can be used as a polarity display.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. First, a binder in which camphor, an acrylic resin, or the like is dissolved in an organic solvent is added to fine powder of a valve action metal such as tantalum and mixed. After mixing, the mixture is heated to volatilize and remove the organic solvent. Next, as shown in FIG. 1A, the fine powder of the valve action metal is compression-molded by a press or the like into a rectangular or cylindrical shape with the anode lead wire 1 pulled out. After compression molding, 10 ^-4 to 10 ^-5
In an atmosphere such as a vacuum of about Torr, 1400
The sintered body 2 is formed by heating at a high temperature of about 2200 ° C. for about 15 to 60 minutes and sintering. During the sintering, impurities (Cu, Fe, etc.) in the powder are evaporated.

After sintering, a disk-shaped insulating plate 3 made of Teflon (registered trademark) or the like is disposed at the root of the anode lead wire 1. Then, as shown in FIG. 1 (b), the tip of the anode lead wire 1 is welded to a metal plate 4 such as aluminum or stainless steel. A plurality of sintered bodies 2 are attached to the metal plate 4 to improve the efficiency of the operation. Then, in this state, the sintered body 2 is immersed in a chemical conversion solution such as nitric acid or phosphoric acid to a predetermined level visually or the like, and a DC voltage corresponding to a rated voltage is applied thereto to perform a chemical conversion treatment. Approximately 16Å /
An anodic oxide film 5 is formed at a rate of about V as shown in FIG.

After forming the anodic oxide film 5, a solid electrolyte layer 6 is formed on the surface as shown in FIG. In order to form the solid electrolyte layer 6, the sintered body 2 after the formation of the anodic oxide film 5 is immersed in, for example, a manganese nitrate solution and impregnated with the liquid. Thereafter, the sintered body 2 is taken out and
It is heated at a temperature of 0 to 300 ° C. to thermally decompose, and further subjected to re-chemical treatment. The process from the impregnation to the re-chemical conversion treatment is repeated several times to several tens of times while changing the concentration of the manganese nitrate solution from low to high to form a manganese dioxide layer having a predetermined thickness. Further, a conductive polymer such as conductive polyaniline or polypyrrole is attached to the surface of the anodic oxide film 5 by electrolytic oxidation polymerization or chemical oxidation polymerization.

After the formation of the solid electrolyte layer 6, a graphite solution is applied to the surface thereof to form a graphite layer 7, as shown in FIG. After the formation of the graphite layer 7, as shown in FIG. 1F, a silver paste is applied to the surface to form a silver layer 8, and combined with the graphite layer 7 to form a cathode layer 9, thereby forming a capacitor element 10.

The lead frame 11 is formed by laminating a first lead frame 12 and a second lead frame 13 as shown in FIG.
That is, the first lead frame 12 and the second lead frame 13 are manufactured by punching a metal plate such as stainless steel. Then, the first lead frame 12 corresponds to FIG.
As shown in (b), the shape is such that one or more square groups 15 in which a plurality of tongue-shaped auxiliary anode terminals 14 are arranged are provided. In addition, the first lead frame 12
At least, the thickness of the auxiliary anode terminal 14 is substantially equal to the distance 1 from the peripheral surface of the capacitor element 10 to the peripheral surface of the anode lead wire 1. Further, as shown in FIG. 2B, the second lead frame 13 has a square group 18 in which a plurality of sets of tongue-shaped anode terminals 16 and cathode terminals 17 having substantially the same length are arranged. 1 lead frame 12
One or more groups are provided so as to face the group 15 provided in the group. The outer dimensions of the first lead frame 12 and the second lead frame 13 are substantially the same, so that the alignment becomes easier when they are stacked. That is, the auxiliary anode terminal 14 is aligned with the anode terminal 16 so that the first
Is laminated on the second lead frame 13 and integrated by welding or the like. At this time, since the outer dimensions of the first lead frame 12 and the second lead frame 13 are substantially the same and the groups 15 and 18 are provided to face each other, the auxiliary anode terminal 14 and the anode terminal 16 are provided.
Can be easily aligned.

The auxiliary anode terminals 14 arranged on the first lead frame 12 need not be grouped, and a plurality of auxiliary anode terminals 14 may be arranged in parallel in the longitudinal direction. Similarly, the group of the anode terminal 16 and the cathode terminal 17 arranged on the second lead frame 13 does not need to be grouped, and the auxiliary anode terminal 14 arranged on the first lead frame 12 is arranged in parallel in the longitudinal direction. They may be arranged in parallel in the longitudinal direction at the same interval facing each other.

Then, as shown in FIG. 3A, the capacitor elements 10 are connected to the lead frame 11 formed by integrating the first lead frame 12 and the second lead frame 13 to form a group. To connect the capacitor element 10 to the lead frame 11, the anode lead wire 10 of the capacitor element 10 is connected to the auxiliary anode terminal 14 by resistance welding or laser welding, and the cathode layer 9 of the capacitor element 10 is connected to the cathode. Conductive paste 19 on terminal 17
And so on. In the capacitor element 10, the end of the lead wire 1 for the anode in the drawing direction contacts the anode terminal 16. Therefore, an insulating resin 20 such as an epoxy resin is previously applied to the anode terminal 16 on the contact surface side of the capacitor element 10 by screen printing or the like. Note that the shape of the capacitor element 10 and the length of the anode terminal 16 may be changed so that the capacitor element 10 does not contact the anode terminal 16. In this case, the insulating resin is not applied to the anode terminal 16. In addition, the manufacturing becomes easy and the insulating property is improved. The thickness of the auxiliary terminal 14 is the distance l from the peripheral surface of the capacitor element 10 to the peripheral surface of the anode lead wire 1.
And the anode terminal 16 and the cathode terminal 1
7 are arranged on the same plane without bending, when connecting the anode lead wire 1 to the auxiliary anode terminal 14, the anode lead wire 1 is not bent particularly, Connection processing can be performed in the state of being pulled out. Therefore, the connection process can be facilitated, and the deterioration of the characteristics of the capacitor element 10 can be reduced.

The capacitor element 10 is connected to the lead frame 11
After that, the capacitor elements 10 are positioned for each group in the cavity of the mold for molding, and the lead frame 11 is arranged in the mold. Then, a resin such as an epoxy resin is melted and injected into the cavity, and the capacitor elements 10 are covered with the resin for each group and integrated. Thereafter, the resin is cured by heat, and as shown in FIG.
Form one. In addition, since the lead frame 11 is a two-layered structure of the first lead frame 12 and the second lead frame 13, even if the resin is heat-cured, it is hard to be warped.

After thermosetting the resin, as shown in FIG.
The rotating body 22 provided with a blade in the drawing is run while rotating along the bottom-side ends of the anode terminal 16 and the cathode terminal 17 of the lead frame 11, and cut to form dents 23 and 24 at the ends. Form. These depressions 23 and 24
In the depth direction, for example, the thickness is approximately の of the thickness of the anode terminal 16 and the cathode terminal 17, but is １ ／ or ／.
And other dimensions. Thus, when the solid electrolytic capacitor is soldered to the printed wiring board, the solder accumulates in the depressions 24 and 25. The deeper the solder, the larger the amount of accumulation, and the more reliable the connection. When the lead frame 11 is cut by the rotating body 22, since the lead frame 11 is hardly warped, the accuracy of the cut dimension can be increased, and the reliability of the cutting process can be improved.

After cutting the ends of the anode terminal 16 and the cathode terminal 17, the anode terminal 16 and the cathode terminal 17 are plated with solder.

After the solder plating, indications such as ratings and polarities are formed on the surface of the resin coating 21 by offset printing or the like.

After the display is formed, as shown in FIG. 4B, a rotating body 25 having a blade smaller in width than the rotating body 22 and provided with blades is provided along a middle vertical and horizontal boundary between the capacitor elements 10 in the group. By traveling while rotating, the resin coating 21 and the lead frame 11 are cut, and the solid electrolytic capacitors 26 are individually separated from the lead frame 11. That is, even if the upper mold and the lower mold are displaced during the resin molding process, the capacitor element 10 at the end in the group is visible from the outside, or the thickness of the resin coating 21 is thin, resulting in insulation failure. Thus, a predetermined resin coating 21 is formed on the other capacitor elements 10. Therefore, poor insulation and poor appearance can be reduced. The lead frame 1 is rotated by the rotating body 25.
The dimensions of the dents 23 and 25 formed in the anode terminal 16 and the cathode terminal 17 on the capacitor element 10 side when cutting 1 or the like are made the same as, for example, the depth direction. However, the dimension in the direction of the capacitor element 10 may be made longer so that the amount of solder accumulated in the depressions 23 and 24 can be increased.

After the solid electrolytic capacitor 26 is separated, an aging process is performed to remove initial defective products. This aging treatment is performed in a high temperature (for example, 85 ° C. or higher) atmosphere by applying a voltage 1.5 to 2.0 times the rated voltage. The temperature during the aging treatment is preferably from 85 to 125 ° C, and particularly preferably from 85 to 105 ° C.

After the aging process, characteristics such as capacity and tan δ are checked to remove defective products.

[0027]

Next, the product dimensions of the solid electrolytic capacitor manufactured by the method of the embodiment of the present invention were measured together with the conventional example. The solid electrolytic capacitor manufactured by the method of the embodiment has a structure as shown in FIG. 4B, is a chip type rated at 6.3 V and 10 μF, and has a size of 1.6 mm × 0.
The size is 8 mm x 0.8 mm square. Further, the solid electrolytic capacitor manufactured by the method of the conventional example has a structure as shown in FIG. 5A, and is a chip type having the same rating using a capacitor element having the same size as that of the embodiment.
The size is 0 mm x 1.2 mm x 1.2 mm square. Therefore,
The solid electrolytic capacitor manufactured by the method of the embodiment has a volume ratio of about 36% as compared with the conventional example, and is approximately 1%.
The size is reduced to ／.

Table 1 shows the number of chip type solid electrolytic capacitors manufactured by one lead frame according to the present invention in comparison with the conventional example. The lead frame used in the manufacturing method of the embodiment is shown in FIG.
And 1 to 5 groups are provided. This lead frame is obtained by laminating a first lead frame having a thickness of 0.15 mm and a second lead frame having a thickness of 0.30 mm, and has a thickness of 0.45 mm. The lead frame 50 used in the conventional manufacturing method has a structure as shown in FIG. 5C, and has a tongue-shaped flat anode terminal 51 and a tongue-shaped cathode terminal 52 having a bent tip. Are arranged in parallel with each other, and one capacitor element is connected to each set. The connected capacitor elements are individually placed in individual cavities of the mold, and are separated and coated with resin.

[0029]

[Table 1]

As is clear from Table 1, Examples 1 to
According to the manufacturing method of the third embodiment, the number of solid electrolytic capacitors obtained per unit area of one lead frame is:
0.08 / mm ² , 0.12 / mm ² , 0.228
A month / mm ^2. On the other hand, in the conventional example, it is about 0.02 / mm ² . Therefore, in the first to third embodiments, compared to the conventional example, about 4-1 to 1
One times as many solid electrolytic capacitors are obtained.

[0031]

As described above, according to the first aspect of the present invention,
A step of burying one end of the anode lead wire and sintering the valve action metal powder to form a sintered body, and sequentially providing an anodic oxide film, a solid electrolyte layer, and a cathode layer on the sintered body to form a capacitor element A step of connecting the capacitor element to a lead frame, a step of coating the capacitor element with a resin and exposing an anode terminal and a cathode terminal only from the bottom to form an exterior, and leading the capacitor element after the exterior formation. And a step of sequentially separating the frame from the frame, wherein the solid electrolytic capacitor is disposed between the anode terminal and the anode lead wire, and is substantially equal to the distance from the peripheral surface of the capacitor element to the peripheral surface of the anode lead wire. A first lead frame provided with an auxiliary anode terminal having a thickness and a second lead frame provided with an anode terminal and a cathode terminal are formed by using the auxiliary anode terminal as an anode terminal. The capacitor element is connected to the lead frame by connecting the anode lead wire to the auxiliary anode terminal and the cathode layer to the cathode terminal to connect the capacitor element to the lead frame. A solid electrolytic capacitor capable of increasing the capacity and preventing the Manhattan phenomenon can be easily manufactured, and the characteristics of the capacitor element can be prevented from deteriorating during manufacturing.

According to the second aspect of the invention, in particular, it has a thickness substantially equal to the distance from the peripheral surface of the capacitor element to the peripheral surface of the anode lead wire, and is provided between the anode terminal and the anode lead wire. A first lead frame in which one or more groups in which a plurality of auxiliary anode terminals are arranged side by side are arranged; and a second lead frame in which one or more groups in which a plurality of sets of anode terminals and cathode terminals are juxtaposed are arranged. Since the auxiliary anode terminal is laminated and integrated with the anode terminal to form a lead frame and a capacitor element is connected to the lead frame, the same effect as the invention of claim 1 is obtained, and Poor insulation and poor appearance of electrolytic capacitors can be reduced, and mass production is easy.

Further, according to the third aspect of the present invention, since the outer dimensions of the first lead frame and the second lead frame are made substantially the same, manufacturing becomes easy.

According to the fourth aspect of the present invention, since at least one end of the anode terminal or the cathode terminal is provided with a recess, a solid electrolytic capacitor having high connection reliability with a printed wiring board or the like is manufactured. it can.

[Brief description of the drawings]

FIG. 1 shows a process for manufacturing a capacitor element used in an embodiment of the present invention.

FIG. 2 is a lead frame used in the embodiment of the present invention;
FIG. 3 shows a plan view of a first lead frame and a second lead frame.

FIG. 3 shows a plan view of a state where a capacitor element is connected to a lead frame used in the embodiment of the present invention and a perspective view of a state where a resin coating is formed.

FIGS. 4A and 4B are cross-sectional views illustrating a state where an end of a lead frame is cut according to the embodiment of the present invention and a state where a solid electrolytic capacitor is separated.

FIG. 5 shows a cross-sectional view of a conventional solid electrolytic capacitor and a plan view of a lead frame.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Lead wire for anodes, 2 ... Sintered body, 5 ... Anodized film, 6 ... Solid electrolyte layer, 9 ... Cathode layer, 10 ... Capacitor element, 11 ... Lead frame, 12 ... First lead frame, 13 ... Second lead frame, 14: auxiliary anode terminal, 15, 18, group, 16: anode terminal, 17: cathode terminal, 21: resin coating, 23, 24 ...
Depression, 26 ... Solid electrolytic capacitor. Reference number P2557

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H01G 9/24 C (72) Inventor Kazunari Iizuka Kazuya Miharucho, Tamura-gun, Fukushima Prefecture Miharu factory

Claims (4)

[Claims] 1. A step of burying one end of an anode lead wire and sintering a valve metal powder to form a sintered body, and sequentially forming an anodic oxide film, a solid electrolyte layer and a cathode layer on the sintered body. Forming a capacitor element, providing the capacitor element to a lead frame, coating the capacitor element with a resin, and forming an exterior by exposing the anode terminal and the cathode terminal only from the bottom, And a step of sequentially separating the capacitor element after forming the exterior from the lead frame, the method comprising: disposing the capacitor element between the anode terminal and the anode lead wire; A first lead frame provided with an auxiliary anode terminal having a thickness substantially equal to a distance to a peripheral surface of a lead wire; and a second lead frame provided with an anode terminal and a cathode terminal. And the auxiliary anode terminal is laminated to and integrated with the anode terminal to form the lead frame, the anode lead wire to the auxiliary anode terminal, and the cathode layer to the cathode terminal. And connecting the capacitor element to the lead frame. 2. A step of burying one end of an anode lead wire and sintering a valve metal powder to form a sintered body, and sequentially forming an anodic oxide film, a solid electrolyte layer and a cathode layer on the sintered body. Providing a capacitor element, providing the capacitor element to a lead frame, coating the capacitor element with a resin and exposing the anode terminal and the cathode terminal only from the bottom to form an exterior; and And a step of separating the formed capacitor element from the lead frame.
A group in which a plurality of auxiliary anode terminals having a thickness substantially equal to the distance from the peripheral surface of the capacitor element to the peripheral surface of the anode lead wire is arranged between the anode terminal and the anode lead wire. A first lead frame having at least one anode terminal and a second lead frame having at least one group having a plurality of sets of anode terminals and cathode terminals arranged side by side are laminated with the auxiliary anode terminal aligned with the anode terminal. Integrally forming the lead frame, connecting the anode lead wire to the auxiliary anode terminal and connecting the cathode layer to the cathode terminal to connect the capacitor element to the lead frame; A method for manufacturing a solid electrolytic capacitor, wherein elements are integrated for each group and covered with a resin. 3. The method for manufacturing a solid electrolytic capacitor according to claim 1, wherein the outer dimensions of the first lead frame and the second lead frame are substantially the same. 4. The method for manufacturing a solid electrolytic capacitor according to claim 1, wherein a recess is provided at at least one end of the anode terminal and the cathode terminal.