JP2002094299A - Component mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a component by obtaining required mounting data easily in a short time without requiring manual input of data of individual components. SOLUTION: From component text data B required for mounting a component and stored in a component electronic catalog 212 by the positional data A of the mounting position and angle of components together with the image data IM of components including a component to be mounted, component text data b is read out for each component to be mounted at each mounting position. Data containing the component text data b and the mounting positional data A is automatically processed conventionally to generate mounting data C required for a mounter 2 to mount each component at a specified mounting position. Operation of the mounter 2 is controlled based on the mounting data C to mount the components sequentially and automatically at specified positions on a substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for automatically mounting electronic components on a board by a mounting machine.

[0002]

2. Description of the Related Art In producing various electronic circuit boards, there are various kinds of electronic components mounted on the boards, and there are different types of parts which can be replaced. The number further increases if compatible third-party parts are included. In order to create an electronic circuit board by mounting various electronic components on a substrate, it is necessary to select an electronic component that meets various needs set in the design of the electronic circuit. Also, when mounting various electronic components on the board, it is necessary to take care that the characteristics and durability of the mounted electronic components and other electronic components are not affected, and that the mounting is properly and reliably achieved. is there.

[0003] Conditions to be considered are the types of nozzles and chucks that carry the electronic components, the moving speed of the mounting head having the nozzles and chucks, the nozzles and the like when the electronic components are removed from the component supply unit, or when they are mounted. The required lowering position of the chuck, that is, the height position when taking out the component, the height position when mounting the component, the moving speed of the board on which even one electronic component is mounted, especially the acceleration, and various allowable values is there.

Various electronic components are taped for automatic supply to a mounting machine, stored in a tray, or handled as a stick or a bulk component. Such a component supply mode and a component storage pitch in such a case are described. It is necessary to consider the so-called packing style, including the above, when creating mounting data.

[0005] On the other hand, in the mounting stage of the electronic component, the recognition of the suitability and orientation of the electronic component and the replacement of the erroneous component and the correction of the orientation based on the result are performed. For such inspections, inspection data is also created as mounting data from information on electronic components such as the shape and surface reflectance of electronic components, colors, colors, polarity marks, printed characters on components, and color codes. There is a need to.

Various electronic components are selected in accordance with circuit design needs, and mounting data and inspection data for properly mounting the selected electronic components are created. A component catalog book which has been recorded and edited with detailed and complicated component information for each component has been used. For some components, electronic components are actually measured with calipers or the like in order to obtain necessary data.

[0007] It is difficult to find an electronic component that meets the needs from such a parts catalog book, and the optimal selection of necessary parts depends on how detailed and carefully the parts catalog book used for selecting parts is used. Spend a lot of effort and time.
In particular, recently, the needs have been diversified, and the types of electronic components to be provided have become enormous, so that the amount of information has further increased, and it has become more difficult to select the electronic components optimally.

In order to solve this problem, a so-called component electronic catalog has been provided in which catalog information of electronic components is treated as image data for displaying on a screen, edited and stored according to a predetermined classification. The image data of the electronic components stored in the electronic catalog for components is read out according to a predetermined classification and search by a dedicated reading device or a personal computer and is displayed on a screen. Parts can be searched and selected in a reasonably short time. A storage medium such as a CD-ROM is used for this parts electronic catalog.
As shown in FIG. 41, image data for displaying various data of various parts on the screen are combined with character data such as numbers and characters, and figure data relating to pictures and figures.
Alternatively, an appropriately divided image data file IMF
As a parts electronic catalog EC.

The parts electronic catalog EC is an image capable of displaying various types of information such as the form, dimensions, surface condition, characteristics, and range of use of electronic parts on a screen in the form of photographs, drawings, tables, and graphs. It is data and naturally includes information for creating component mounting data.

A flowchart of FIG. 42 shows a procedure for creating conventional component mounting data using such a component electronic catalog EC. To explain this, a component electronic catalog is loaded into a reading device, and the electronic catalog is started to be read on a screen. Next, a command is input by a search key operation and a condition setting operation according to a predetermined classification and search procedure. As a result, the command analysis unit performs a search and repeats the input of a command until one electronic component is selected.

FIG. 43 designates a large class of transistors,
Bi-Polish Transistor (PNP) of small classification …… 2
It is a display screen obtained by searching for SA and 2SB. This screen is in a search state in which the cursor is positioned in the column of the first component among 62 corresponding components. The user can search for any of the 62 parts by positioning the cursor on the required part column. by this,
One electronic component is selected, and it is possible to determine which component of the image data is to be displayed on the screen. Various image data of the determined component is displayed on the screen in accordance with a predetermined procedure and in accordance with a user operation. Will be displayed.

For example, in the screen of FIG.
When the user searches for the part 22 and operates the key for explanation, FIG.
As shown in the figure, image data relating to the initial description of the component 2SA1022 is displayed on the screen.

When a search is selected on the screen shown in FIG.
A list of large category display items that can be selected on the screen 4 is displayed in a window as shown in FIG. When the user looks at the screen shown in FIG. 45 or selects an outline drawing directly from the screen shown in FIG. 44, image data relating to the outline as shown in FIG. 46 is displayed on the screen. When a land map is selected, image data relating to the land as shown in FIG. 47 is displayed on the screen. When the taping dimension is selected, image data relating to the taping dimension is displayed on the screen as shown in FIG. When the reel size is selected, image data relating to the reel size is displayed on the screen as shown in FIG.

FIG. 50 shows an initial explanation screen when an electronic component of a motor control circuit called AN6650 is searched.
This shows a state in which image data relating to the characteristic curve is displayed in a window according to the selection of the characteristic curve. FIG. 51 shows the initial explanation screen of FIG. 50 in which the application circuit example is preferentially selected and displayed in a window, and further, a block diagram is selected and displayed in a window.

The user can relatively easily select an electronic component that meets the needs of the circuit design while searching for the component information, and can select various electronic components necessary for creating mounting data for the selected electronic component to be mounted. Can be visually recognized by the search operation. In addition, it is possible to freely perform a data search corresponding to a component mounting method using a chuck or a suction nozzle, or the presence or absence of component recognition and a difference in method.

Further, as described above, in order to create component mounting data based on data obtained by visual recognition using the component electronic catalog, an automatic data processing device such as a dedicated or personal computer is used. By manually inputting the mounting data of the component obtained by visual recognition, data processing is performed in combination with the mounting position data of the component created in advance to create component mounting data, and this is used to control the operation of the mounting machine. Is used to mount components.

[0017]

In the above-mentioned conventional electronic catalog of parts, the electronic parts that meet the needs can be selected relatively easily by a programmed rational search system. In the creation of the electronic components, a large amount of data visually recognized on the screen for each selected electronic component is manually input to the automatic data processing device, and the components are mounted using the mounting data obtained. Each time a complicated circuit board is manufactured, a great deal of labor and time are required.

SUMMARY OF THE INVENTION An object of the present invention is to solve such a problem, and obtains data of each component from component text data and mounting position data set in advance for various electronic components and stored in a component electronic catalog. It is an object of the present invention to provide a component mounting apparatus capable of easily and quickly creating mounting data without input and mounting components.

[0019]

According to a first aspect of the present invention, there is provided a component mounting apparatus for mounting a component to be mounted at a mounting position on a substrate by receiving a component to be mounted. Data reading processing to read out the component text data corresponding to the mounting target component at each mounting position from the component electronic catalog that stores the image data of various components including the component and the component text data such as the shape and dimensions of various components Based on the means, the read component text data and the mounting position data including the mounting angle relating to the mounting position of the mounting target component, the mounting data for receiving the mounting target component and mounting the mounting target component at the mounting position is created. And a control means for controlling the operation of the mounting machine based on the generated mounting data. Characterized in that it implements.

According to a second aspect of the present invention, there is provided a component mounting apparatus for mounting a component to be mounted at a mounting position on a board by a mounting machine receiving a component to be mounted. Data reading processing means for reading component text data corresponding to the component to be mounted at each mounting position from the component electronic catalog in which component text data such as shape and dimensions are stored, and the read component text data and the mounting target Data mounting processing means for receiving mounting component mounting and generating mounting data for mounting the mounting target component at the mounting position based on mounting position data including a mounting angle relating to the mounting position of the component, and A control unit for controlling the operation of the mounting machine based on the mounting target component, and mounting the mounting target component at a mounting position of the board.

According to the first and second aspects of the present invention, data reading is performed by utilizing the fact that the component electronic catalog stores component text data such as shapes and dimensions of various components including the component to be mounted. The processing means reads out the component text data of each mounting target component, creates the mounting data using the component text data read out by the data creation processing means and the mounting position data, and controls based on the created mounting data. Means to control the mounting machine by means and mount the components on the board, so that there is no need for one person to input the component text data to create the mounting data for each mounting target component, and the labor required to create the mounting data Time can be greatly reduced, and parts can be mounted with high productivity. In addition, when a component electronic catalog in which image data is stored is used, it is possible to efficiently read out appropriate component text data using the image data.

According to a third aspect of the present invention, there is provided a component mounting apparatus in which image data of various components including a component to be mounted and component text data necessary for mounting the components such as shapes and dimensions of the various components are stored. Using the electronic catalog and the mounting position data relating to the mounting position including the mounting angle created for the mounting target component, a component mounting apparatus that receives the supply of the mounting target component and mounts the mounting target component at a predetermined mounting position. Data reading processing means for reading component text data relating to the mounting target component at each mounting position in the mounting position data from the component electronic catalog, and component text data and mounting for each mounting target component read for each mounting target component Mounting data creation processing means for creating mounting data based on position data, and based on the created mounting data And means for operation control of the mounting apparatus, characterized in that it implements a mounting object component on the mounting position of the substrate.

According to a fourth aspect of the present invention, there is provided a component mounting apparatus comprising: a component electronic catalog storing component text data necessary for mounting components such as shapes and dimensions of various components including the component to be mounted; A component mounting apparatus for receiving a component to be mounted and mounting the component to be mounted at a predetermined mounting position by using mounting position data relating to a mounting position including a mounting angle created for the component electronic catalog. Data reading processing means for reading the component text data relating to the mounting target component at each mounting position in the mounting position data from the mounting position data, and mounting data based on the component text data and mounting position data for each mounting target component read for each mounting target component. A mounting data creation processing unit to be created, and a unit that controls operation of the mounting machine based on the created mounting data. For example, wherein the implementing a mounting object component on the mounting position of the substrate.

According to the third and fourth aspects of the present invention, the component electronic catalog stores component text data such as the shape and dimensions of various components including the component to be mounted. The reading processing means reads the corresponding component text data from the component electronic catalog based on the information on the mounting target component at each mounting position in the mounting position data relating to the mounting position created for the mounting target component, and performs data creation processing. Mounting data is created using the component text data and the mounting position data read by the means, and the operation of the mounting machine is controlled by the control means based on the created mounting data to mount the components on the board. There is no need for humans to enter component text data for creating mounting data for each mounting target component, which significantly increases the labor and time required to create mounting data. Mitigation can, with good productivity can be carried out in the parts of the implementation. In addition, when a component electronic catalog storing image data is used, it is possible to efficiently read out appropriate component text data using the image data.

According to a fifth aspect of the present invention, a component mounting apparatus prepares and stores various components including a component to be mounted in advance by using a mounting machine and mounting position data relating to a mounting position including a mounting angle generated for the component to be mounted. Data reading processing means for reading, from the component text data necessary for mounting the component, such as the shape, dimensions, package, and color of the component stored in the means, corresponding to the mounting target component at each mounting position; From the mounting position data and the data including the component text data read by the data reading processing means for each mounting target component corresponding to the mounting position data, the mounting machine receives supply of each component and mounts them at a predetermined mounting position. A data creation processing means for creating mounting data for use, and a control means for controlling each operation of the mounting machine in response to the mounting data from the data creation processing means. And it said that there were pictures.

In the configuration of the component mounting apparatus according to the fifth aspect of the present invention, the component electronic catalog includes image data of various components including the mounted components, the shape of the component,
Utilizing the storage of component text data necessary for mounting components such as dimensions, packing styles, and colors, in addition to the conventional screen search as a component electronic catalog, the Based on the mounting target component information of the created mounting position data, a corresponding one of the component text data stored in the component electronic catalog is automatically read out, and a mounting target component at each mounting position is read out. 7. The conventional automatic data processing using the mounting position data and the data including the component text data for each mounting target component at each mounting position. The NC program relating to the mounting position of the component, the component library relating to the recognition of the component such as the shape, size, and color of the component, and the distribution in the component supply unit. A mounting library for supplying each component to a conventional mounting machine and mounting them at a predetermined mounting position, which is called a supply library relating to the supply status of the components, is created by automatic data processing. Various types of parts can be automatically mounted, and every time a new circuit board is manufactured, humans enter the various parts text data necessary to create mounting data for each mounting target component. It is not necessary to change the type in a very short time, and the productivity is improved.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects of the present invention, the mounting data is created in consideration of the characteristic data of the mounting machine. Since the mounting data is created in consideration of the above characteristics and the mounting operation is performed based on the data, the reliability and efficiency of the mounting operation can be improved.

According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the mounting data further includes a type of a nozzle or a chuck for carrying the component, a moving speed of a head provided with the chuck or the nozzle, and a mounting of the component. Including at least one data of the lowering position of the nozzle or chuck, the method of recognizing components such as the reflection method or transmission method, adjustment of the amount and type of illumination light in component recognition, the moving speed of the substrate, and acceleration. This makes it possible to perform a more appropriate mounting operation according to the state of the mounted components and the state of the board, and to mount the semiconductor device appropriately and efficiently.

According to a ninth aspect of the present invention, in any one of the first to eighth aspects of the present invention, mounting data is further created including inspection data of component mounting, and the mounting state of the component is inspected based on the inspection data. In this way, since the inspection data is created and the inspection is performed based on the inspection data, proper mounting can be guaranteed.

According to a tenth aspect of the present invention, in any one of the first to ninth aspects of the present invention, the mounting data is shared and used by a plurality of mounting machines via a recording and communication medium. By sharing with many mounting machines,
The man-hour for creating the mounting data can be reduced, and the mounting productivity can be improved.

According to an eleventh aspect of the present invention, in any one of the first to tenth aspects, the control means further includes substitute component data of a substitute component for the component to be mounted or a substitute component such as a compatible third-party component. If it has internal or external storage means and it is inappropriate to judge the suitability of parts,
Whether or not it is a corresponding substitute is determined based on the substitute part data. Even if a substitute part is used when a part runs out, it automatically responds to this and determines whether the mounted part is appropriate. Therefore, it is possible to prevent a trouble in which a substitute component is determined as an erroneous component by using the substitute component.

According to a twelfth aspect of the present invention, in any one of the first to eleventh aspects of the present invention, the mounting machine is further supplied with a component from a component supply cassette having storage component information which is detachably mounted. A reading means for reading the stored component information of the component supply cassette, and the control means judges whether or not the component supply such as the mounted components or the arrangement is appropriate based on the read information from the reading means. The storage part information held by each of the component supply cassettes mounted on the machine is automatically read by the reading means, and the component side conditions such as components and arrangement supplied by these component supply cassettes are set in the mounting data. The control means automatically determines whether the conditions match the conditions of the component. To prevent troubles, wasting time and mounting operation, or cause a production loss such as repairing or discarding a manufactured electronic circuit board due to failure. be able to.

According to a thirteenth aspect of the present invention, in any one of the first to twelfth aspects, the component text data further includes a temperature characteristic of each component, and the data creation processing means determines a temperature characteristic of each component to be mounted. It automatically creates a condition program to set the optimum temperature profile when reflow soldering the component to be mounted, and simply includes the temperature characteristics data of various components in the component text data for each component to be mounted. With the data processing function of the creation processing means, it is possible to automatically create a condition program that sets the optimal temperature profile when reflow soldering the component to be mounted, and if the component mounting involves reflow soldering, reflow soldering Eliminates the hassle and time of specially creating temperature profiles for soldering operations, and Created can also be avoided things like cause of the trouble by mistake or the like of the data input.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting method and an apparatus therefor according to an embodiment of the present invention will be described below with reference to the drawings.

(Embodiment 1) The first embodiment is different from the embodiment shown in FIG.
(A), when mounting data is created by using a data processing device 203 different from the mounting machine 2 and the electronic component is mounted by using this data for operation control of the mounting machine 2 Is shown. The data processing device 203 has data read processing means 201 and data creation processing means 202 as shown in FIG.
The data processing device 203 is preferably a personal computer, but is not limited thereto and may be a dedicated machine. In some cases, a control system for controlling the operation of the mounting machine 2 may be used.

The mounting machine 2 is equipped with a required number of component supply cassettes 14 on which taping components are mounted, receives necessary electronic components from these component supply cassettes 14 each time, and supplies electronic components each time a component is supplied. It is automatically mounted on the substrate 1. For this automatic mounting, a data processing device 208 is provided separately from the control means 102 for operation control. The data processing device 208 is connected to the display 20
9 and N, which is mounting position data for each mounting target component
By using a C program, a supply library relating to a component supply state such as an arrangement of components in a component supply unit, and a component library for accurately and reliably recognizing and mounting the supplied components at predetermined positions, actual component parts are provided. A program for supply and operation control for mounting the supplied component at a predetermined position is created, and control data N
And The control means 102 uses a microcomputer as shown in FIG. However, it is not limited to this.

The data read-out processing means 201 preliminarily prepares a component electronic catalog 212 together with image data for various components including the component to be mounted, based on the position data A as shown in FIG. 24 regarding the mounting position prepared for the component to be mounted. Shape, dimensions,
The component text data b for each component to be mounted at each mounting position is read out by automatic data processing from the component text data B as shown in FIG. 25 necessary for mounting components such as package and color. The data creation processing means 202 performs automatic data processing of the mounting position data A and data including the component text data b for each mounting target component at each mounting position read by the data reading processing means 201. Receives the supply of each component, generates mounting data C for mounting them at a predetermined mounting position on the board, controls the operation of the mounting machine 2 based on the generated mounting data C, and transfers the electronic component to the board 1. Automatically and sequentially implemented at predetermined positions.

The mounting data C is, for example, shown in FIGS.
9 includes an NC program, a component library, an array program as a supply library, and a component supply position library related to a condition of a component extraction position when components are supplied by a tray.

The mounting position data A is, for example, a CAD device 21
1 and may be input to the data processing device 203 each time the mounting position data is generated, or may be prepared by storing all of the mounting position data and transferred to the data processing device 203. Alternatively, a storage medium storing the mounting position data C may be loaded into the data processing device 203 and used. Here, the component text data B shown in FIG. The parts electronic catalog 212 is shown in FIG.
The image data IM of various parts including the parts to be mounted as shown in FIG. 1 and the part text data B required for mounting the parts, such as the shape, dimensions, packing style, and color of each part, are edited and stored according to a predetermined classification. It is a thing. Therefore, using the image data IM and the component text data B together, various types of information on various electronic components are displayed on a screen according to a predetermined procedure and search, and can be used as a conventional component electronic catalog. The interface for this may be the part electronic catalog 212 or the data processing device 2
03 may be held on either side. Further, it is possible to perform necessary screen display for various electronic components only by the image data IM.

The parts electronic catalog 212 is a CD-ROM,
There are a flexible disk, an optical disk, and the like, but any storage medium or storage device may be used. The storage medium may transmit the image data IM and the component text data B by communication.

As described above, according to the first embodiment, the component electronic catalog 212 is used for mounting the components such as the shape, dimensions, package, and color of the components together with the image data IM of various electronic components including the mounted components. Utilizing the fact that the necessary component text data B is also stored, in addition to the conventional screen search as a component electronic catalog, the mounting target component information of the mounting position data A created in advance for each mounting target component Of the component text data B stored together with the image data IM in the component electronic catalog 212, and automatically reads out the corresponding component text data b for each component to be mounted at each mounting position. And using the mounting position data A and data including the component text data b for each mounting target component at each mounting position. In the automatic data processing as described above, for example, a conventional NC program relating to the mounting position of a component required by the mounting machine 2, a component library relating to recognition of electronic components such as component shapes, dimensions and colors, and a component supply unit The necessary mounting data C, such as a supply library relating to the supply state of the components, such as the component arrangement, can be created, and each component is supplied to the conventional mounting machine 2 and mounted at a predetermined mounting position. The mounting data C for the mounting is created by automatic data processing and used for the operation control of the mounting machine 2, and various electronic components can be automatically mounted. Each time a new circuit board is manufactured, the Since it is not necessary for a person to input various component data necessary for creating the mounting data C, the type can be changed in a very short time and the productivity is improved.

However, depending on the model of the mounting machine 2 and the control level, the mounting data C corresponding to the model and the control level is created. Also, when the mounting data C is created in consideration of the characteristic data of the mounting machine 2, the mounting data C matching the characteristics of the mounting machine 2 can be created, and the component mounting tact becomes the shortest. It is possible to mount components more appropriately than it is to say that there is no difficulty or failure. The mounting data C can include inspection data for accurate component mounting. This is to determine whether the components held by the nozzles and chucks and the orientation of the components are appropriate, and if they are incorrect, replace them and perform proper mounting. Inspection data for performing the above is generated by component text data b for each component. Inspection data appropriate for the component to be mounted is also automatically obtained. Appropriate inspection can be performed, and accurate component mounting can be guaranteed.

As shown in FIG. 1A and FIG. 2, the mounting machine 2 according to the first embodiment has an orthogonal XY2 for mounting electronic components on necessary portions of the electronic circuit board 1 at the front. The substrate 1 is received on the XY table 3 which moves in the direction, and the mounting position of the electronic component is sequentially moved to the component mounting position so that the electronic component is mounted.

A loading mechanism 4 for loading the board 1 before mounting electronic components into the XY table 3 and unloading the board 1 after mounting the electronic components on the XY table 3 on both left and right sides of the XY table 3, and An unloading mechanism 5 is provided.

A component mounting head 6 for mounting electronic components on the substrate 1 is provided behind the XY table 3.
As an example, the component mounting head 6 is equipped with a plurality of suction nozzles 7 and chucks on a turntable (not shown), and electronic components supplied by a component supply unit 8 provided further behind the component mounting head 6 are picked up by the suction nozzles 7. Holding by suction,
It is set to N on the substrate 1 on the XY table 3 located at the front.
It is mounted at a predetermined position according to the C program.

In the case of the first embodiment, the component supply units 8 are provided at two places on the left and right sides, and when one is in the component supply operation state, the other can be in the standby state.
Each component supply unit 8 has a transport stand 9 having a rectangular planar shape as shown in FIGS. 3 to 5 and a hollow servomotor 11 fixed to the transport stand 9. By rotating the screwed hollow motor shaft 13, the transfer stand 9 is moved to the ball screw shaft 12.
To the left and right along. The servo motor 11 of the operation-side component supply unit 8 operates to supply the components, and the servo motor 11 of the non-operation-side component supply unit 8 keeps the servo motor in a standby state.

The transfer stand 9 uses a transfer table 15 as shown in FIGS. 1 and 7 to 11 to supply the electronic components to the mounting machine 2 and sends the electronic components one by one to this. A known number of various component supply cassettes 14 (FIG. 9) are provided so that a required number thereof can be positioned and detached. The transfer table 15 is provided with a structure of a Z stage which the conventional component supply unit has, that is, a structure for supporting a large number of component supply cassettes 14 in a width direction so that they can be individually positioned and detached.

In the first embodiment, the transfer table 15 has a box-shaped main body frame 16 as shown in FIGS. 7 to 11, corresponding to the use of the component supply cassette 14 for taping components. Above the front part of the main body frame 16, two parts before and after the component feeding portion 14a of the component feeding cassette 14 are received at the proper height by receiving rails 18a and 18b. The positioning relationship between the front, rear, left and right is regulated by the engagement of the positioning holes 20a with the positioning pins 20b of the component supply cassette 14. In addition, two portions before and after the reel mounting portion 14b at the rear of the component supply cassette 14 are received by the concave and convex guides 19a and 19b, so that the lateral vibration is prevented.

Such a positioning and supporting state can be securely held by operating the fixing lever 17a of the clamp mechanism 17 shown in FIG. 9 to engage the clamp hook 17b with the receiving rail 18b, and release the engagement. By doing so, the positioning and holding of the component supply cassettes 14 are released, and the component supply cassettes 14 can be individually removed.
Therefore, each component supply cassette 14 can be replaced on the transfer table 15.

In the first embodiment, for example, 60 component supply cassettes 14 required for supplying components to the mounting machine 2 as a target working machine in one component supply unit 8 are positioned and detached. Equipped to be able to.

The transport stand 9 is provided with a component supply cassette 14.
The transfer table 15 equipped so as to be individually positioned and detachable is mounted so as to be positioned and detached as a whole, and the electronic components can be selectively supplied to the mounting machine 2 from each component supply cassette 14. It has become. In order to selectively supply the electronic components, the transport stand 9 of the component supply unit 8 which is brought into the operating state is moved right and left by the servomotor 11, and the component supply cassette 14 capable of supplying necessary electronic components is moved to the component mounting head. 6 is moved to the component supply position.

The component mounting head 6 is driven by the drive lever 1 of the component supply cassette 14 from its own side, as already known.
Each time the 4c is pushed, one electronic component is supplied by operating the component supply cassette 14, and the electronic component is sucked and held by the corresponding suction nozzle 7 or chuck and mounted on the substrate 1.

The component supply cassettes 14 individually positioned and held on the transfer table 15 must be properly positioned at the component supply position at any time by moving the transfer stand 9 right and left. Accurate positioning of the mounting table 15 on the transport stand 9 is also required. Therefore, the first positioning means 22 which works in the loading / unloading direction and the first positioning means 22 which works in the loading / unloading path 21 in which the transfer table 15 of the transport stand 9 is taken in and out in the directions of arrows shown in FIGS. A second positioning means 23 is provided. In addition to the positioning means 22 and 23, a plurality of guides for guiding the transfer table 15 from the left and right sides so that the transfer table 15 can be smoothly taken in and out without being twisted or caught. Roller 24a,
24b.

Further, there is provided a rail member 25 made of a material which is dimensioned and positioned with high precision so that the support height of the transfer table 15 is accurate and which is excellent in wear resistance. As shown in (1), a rail member 26 similarly provided on the transfer table 15 side is received and supported and guided. The transfer table 15 is also guided by a rail member 26 with guide rollers 24a,
The guide 24b is received from the side so that it can be smoothly put in and out.

As shown in FIGS. 4, 5, 10, and 11, the first positioning means 22 receives the positioning roller 31 at the leading end of the transfer table 15 at a predetermined receiving position. A pressing block 3 which presses the transfer table 15 from the rear side via a positioning roller 34 provided at the rear of the stopper block 32 and the receiving block 32 to pinch the transfer table 15 in the insertion / removal direction.
3.

The pressing block 33 is supported by a composite lever mechanism 37, and when the pressing block 33 is advanced and retracted by an air cylinder 38, the pressing block 33 projects into the access path 21 as shown in FIG. As shown by the imaginary lines in FIGS. 9 and 10, the positioning is released below the loading / unloading path 21, and the state is changed to a position where the loading / unloading operation of the transfer table 15 in the loading / unloading path 21 is not hindered.

As shown in FIGS. 4 to 6, the second positioning means 23 includes a one-side receiving block 35 for receiving the transfer table 15 at a predetermined position from the side of the insertion / removal path 21, and a one-side receiving block 35. The transfer table 15 is constituted by a roller type eccentric shaft 36 which presses the transfer table 15 from the other side to pinch the transfer table 15 therebetween and positions the transfer table 15 in a direction perpendicular to the insertion / removal direction. The eccentric shafts 36 are provided at two positions in the front and rear at substantially the center of the loading / unloading path 21, and are respectively driven to rotate by levers 40 by dedicated air cylinders 41, and are provided on the lower surface of the bottom of the transfer table 15. The positioning is performed or the positioning is released by pressing the block 42 or releasing the pressing.

The guide rollers 24a and 24b guide the transfer table 15 to be taken in and out with a little play from the left and right. The one on the side of the one-side receiving block 35 is located slightly outside. Therefore, the positioning of the transfer table 15 by the second positioning means 23 using the one-side receiving block 35 is not prevented.

Although the eccentric shaft 36 faces the access path 21, at the time of the access operation in the access path 21,
The lower surface of the bottom of the transfer table 15 may have a structure that does not interfere with this, and the positioning block 42 is accurately positioned and has excellent wear resistance so that the positioning is accurately achieved. ing.

Further, when the transfer table 15 is moved in and out while the rail member 25 of the transfer stand 9 is in contact with the rail member 26 of the transfer table 15, the frictional resistance of both works to operate the transfer table 15. The rail members 25 and 26 may be worn out at an early stage. In order to avoid these problems, in the present embodiment, FIGS.
As shown in FIG. 6, a free flow conveyor 44 parallel to the rail member 25 is provided inside the rail member 25.

On the upper surface of the free flow conveyor 44, a number of guide protrusions 44b which come and go by air operation are arranged in the front-rear direction. When the guide protrusions 44b protrude upward, the rail members 26 of the transfer table 15 are pushed up. Rail member 25
And a large number of guide protrusions 44b.
By receiving the air cushion with a light contact by the upper end, it can be moved in and out lightly and quietly with little frictional resistance.

The transfer stand 9 is further provided with an air cushion cylinder 46 which comes into contact with a block 45 fixed to the transfer table 15 immediately before the transfer table 15 is sent to a predetermined position and abuts on the receiving block 32 to be received. Are provided (FIGS. 4, 5, 6, and 9), and the impact when the transfer table 15 is fed is reduced by the actuator 46a. At the rear of the transfer table 15, a handle 47 for pushing and pulling the transfer table 15 in and out is mounted.

In order to exchange the transfer table 15 equipped with a large number of component supply cassettes 14 with the transfer stand 9 of the component supply section 8, a carriage 61 as shown in FIGS.
Is used. The carriage 61 has a frame-shaped main body 63 having running wheels 62, and a transfer table support portion 65 whose height is adjusted by a toggle mechanism 64 is provided on the main body 63. The height of the transfer table 15 is adjusted while holding the transfer table 15, and the level of the transfer table 15 is adjusted with the transfer stand 9 so that the transfer table 15 can be transferred without difficulty without being caught.

The transfer table support portion 65 is provided with guide rods 66 provided at two front and rear positions, and guide cylinders 6 provided at the front and rear of the main body 63.
The support guide 7 is provided so as to be able to move up and down. A toggle mechanism 64 is provided between the main body 63 and the transfer table support section 65. The toggle mechanism 64 is operated by rotating the screw shaft 167 by the handle 68 to bend and extend, and the transfer table support section 65 is moved up and down. Therefore, the height of the transfer table 15 can be adjusted by bending and extending the toggle mechanism 64 with the handle 68.

As shown in FIGS. 7 to 9, the transfer table supporting portion 65 is of a frame type, and guide rollers 71 which receive the transfer table 15 on both sides of the frame 69 from below at the rail members 26 thereof.
Are provided to make it easier to put the transfer table 15 in and out.
However, the buckle 72 of the holder 72 is
a is held by being connected to the latch 80 of the transfer table 15 so that the transfer table 15 does not fall off. Thereby, the transfer table 15 can be freely moved by placing the transfer table 15 on the carriage 61. Further, the transfer table support portion 65 has a side guide 70 made of a material such as synthetic resin having good slippage for guiding the transfer table 15 received on the transfer table 15 from the left and right. The backlash of the table 15 can be sufficiently prevented.

Further, in order to exchange the transfer table 15 with the transfer stand 9 of the component supply section 8, it is required that the transfer table 15 be stable at a predetermined position. To satisfy this, the main body 63
A stand stopper 73 is provided in a part of the main body 63, and the stand stopper 73 is moved up and down by a foot pedal 74. When the stand stopper 73 is lowered, the stand stopper 73 comes into contact with the floor surface and stretches between the main body 63 and the floor surface. Is prevented from moving on the running wheel 62, and the tension between the main body 63 and the floor surface is released by raising the stand stopper 73 so that the main body 63 can be freely moved by the running wheel 62. To The carriage 61 is provided with a handle 90 for movement.

When the truck 61 has a predetermined positional relationship with the transport stand 9 of the component supply unit 8, a connecting bracket 75 for connecting the two is connected to the truck 61, and a connecting rod 76 is connected to the component supply unit 8. Provided respectively, connecting rod 7
6 is moved forward and backward by the air cylinder 77 and
This connection is released.

The transfer height of the transfer table 15 between the transfer table support portion 65 and the transfer stand 9 in the component supply section 8 is determined based on whether the support height of the transfer table 15 is the same. It is important to affect whether it can be performed easily and smoothly without being caught or twisted. Therefore, in the present embodiment, the height of the transfer table supported by the transfer table support portion 65 of the carriage 61 between the carriage 61 and the component supply section 8 is equal to the transfer table 1 by the transfer stand 9.
A height detecting means 78 is provided for determining whether the height is equal to, or higher than, or lower than the supporting height of No. 5. Thereby, the height adjustment of the transfer table support portion 65 by the toggle mechanism 64 can be properly achieved in a short time.

As shown in FIGS. 8 to 10, the height detecting means 78 is provided with a slit plate 78 a provided on the transfer table support 65.
And photocouplers 78b to 78 that detect the height of the slit plate 78a or the set height.
d.

Hereinafter, an example of a procedure for performing batch replacement of the component supply cassettes 14 in the component supply unit 8 will be described.

First, in parallel with the supply of components by the component supply unit 8 of the mounting machine 2 shown in FIGS. 1 and 2, the transfer unit 15 is mounted on a carriage 61 as shown in FIG. The necessary number of component supply cassettes 14 are provided so that they can be individually positioned and detached, and preparations are made for the next component replacement.
Therefore, in order to replenish out-of-stock parts, the parts supply cassette 8 is equipped with the parts supply cassette 14 accommodating the same parts as the parts currently supplied by the parts supply unit 8. Will be equipped with a component supply cassette 14 containing new components.

In this embodiment, one of the two component supply units 8 supplies a component and the other is in a standby state. Therefore, the components on the transfer table 15 mounted on the component supply unit 8 When the supply cassette 14 is out of stock or when the parts to be supplied at the time of the next parts supply need to be switched, the parts supply unit 8 that is in the standby state It detects whether replenishment or replacement is needed,
In response to the display, the component supply unit 8 in the standby state
Take out the transfer table 15 of the
Is exchanged with the transfer table 15 equipped with, and the components are replaced collectively. The batch exchange of the components to the component supply unit 8 by the transfer table 15 can be detected by the microswitch 101 shown in FIGS. 3, 4 to 6, and 11 provided in the transport stand 9, and based on this detection. The suitability of the parts after the batch replacement is automatically determined. However, this determination can also be applied to the components that are initially mounted collectively by the transfer table 15.

When the transfer table 15 is sent to the transfer stand 9 and enters the mounted state, the micro switch 101 is pushed and turned on to detect the mounting of the transfer table 15, and the transfer table 15 can be detected. When the microswitch 1 is pulled out of the transport stand 9 and escapes, the pushing by the transfer table 15 is released and the transfer table 15 is turned off.
01 can be determined by the change of the transfer table 15 from the non-detection state to the detection state.
The detection state of the transfer table 15 changes from the detection state to the non-detection state, and then to the detection state again, so that it is possible to determine that the components have been replaced collectively by the transfer table 15.

Such a determination is made, for example, by the control means 102 shown in FIGS. 1A and 1B for controlling the operations of the mounting machine 2 and the component supply section 8. Therefore, the control unit 102 has an operation panel 103 dedicated to the component supply unit 8.
From the switch 101 together with an operation signal from the controller 101, a detection signal from each of the photocouplers 78b to 78d of the height detecting means 78, and various detection signals of an operation state.
An off signal is also input. In some cases, the operation panel 103
Can be shared with the operation panel of the mounting machine 2.

In order to determine whether or not a replacement part is appropriate, FIG.
As shown in FIGS. 3 to 21, a memory 104 is provided on the transfer table 15, and information on each component stored in each component supply cassette 14 mounted on the transfer table 15 is stored. This storage is preferably performed each time the component supply cassettes 14 are mounted on the transfer table 15 as shown in FIG. However, it is not limited to this,
The time may be another time when the necessary component supply cassette 14 has been installed.

As the memory 104, a readable / writable memory is adopted, and the parts supply unit 8 corresponding to the memory 104 shown in FIGS.
As shown in (1), a read / write means 105 for reading / writing component information from / to the memory 104 is provided, and this is also connected to an input / output port of the control means 102. The component information is the number of components contained in each component supply cassette 14 in addition to the type of component, and the number of components records the number of used components and the number of remaining components as the components are supplied, and determines whether the component has run out. The same applies to other uses.

However, the memory 104 may be dedicated to reading, and in this case, reading means may be employed instead of the reading / writing means 105, and the configuration and control are simple.

On the output side of the control means 102, the mounting machine 2, the component supply unit 8, and a display lamp 10 indicating whether or not various operation states are appropriate
0, and a warning means 106 comprising a character display, a buzzer, a display lamp, or an appropriate combination thereof on the operation panel 103 for issuing a warning when the discrimination result of the part is inappropriate, the air cylinder 77, the first , Second
Positioning means 22, 23, free flow conveyor 44
Are connected and the operation is controlled. The indicator lamp 100 can be shared with the alarm means 106.

The control means 102 manages the remaining number of components in each of the component supply cassettes 14 mounted on the component supply unit 8, and when a component is exhausted, displays it by the display lamp 100 or the operation panel 103, and displays the necessary information. A warning sound is issued to notify the worker in accordance with.

FIG. 13 shows an initial operation of a procedure for pulling out the transfer table 15 equipped with the out-of-stock component supply cassette 14 from the component supply unit 8 in the standby state. As shown in FIG. 13A, the empty truck 61 is opposed to the component supply unit 8 in the standby state, and has a correct positional relationship. In this state, the air cylinder 77 is operated by operating the bogie lock key on the operation panel 103, and the connecting rod 76 is engaged with the connecting bracket 75 as shown in FIG. Make it fixed. In this state, the stand stopper 73 is operated to prevent the main body 63 from moving at the connection position.

After that, the height of the transfer table support section 65 and the component supply section 8 on the carriage 61 is adjusted by the toggle mechanism 64. The height adjustment is performed so that the display lamp 100 associated with the detection by the height detection means 78 lights green indicating properness as shown in FIG. 14B.

When the height adjustment is completed, the first and second positioning means 22 and 23 are automatically moved to the positioning release state by operating a positioning key on the operation panel 103, and then the operation panel is operated. The free flow conveyor 44 is moved upward by operating a free flow key on the 103, etc., and is brought into a ready state.

Upon completion of the preparation, as shown in FIG. 15, the transfer table 15 on the component supply section 8 is transferred to and from the carriage 61 and pulled out onto the transfer table support section 65 of the carriage 61. The detachment of the transfer table 15 from the transport stand 9 at this time is detected by the microswitch 101. When the transfer table 15 gets on the predetermined position of the cart 61, FIG.
The buckle 72a of the holder 72 is held on the carriage 61 by engaging the buckle 72a of the holder 80 with the procedure shown in FIG.

Then, by re-operating the bogie lock key, the connection between the bogie 61 and the component supply unit 8 shown in FIG. 16 by the connecting bracket 75 and the connecting rod 76 is released, and the stand stopper 73 is lifted up. The movement inhibition state due to is released.

Thereafter, the carriage 61 is moved to a predetermined working position as shown in FIG. The movement of the carriage 61 from the component supply unit 8 is performed by the photocouplers 7 of the height detecting means 78.
8b to 78d are in the non-blocking state.
And the display lamp 100 is turned off. The work position is a place for performing work such as re-accommodating a new component in the empty component supply cassette 14 or exchanging the component supply cassette 14 with the next necessary component.

After the carriage 61 has been moved, the component supply unit 8 is provided with a transfer table 15 equipped with each of the component supply cassettes 14 prepared in advance or newly prepared and storing a required number of necessary components. The trolley 61 is moved from the work position as shown in FIG. When the predetermined positional relationship is established, the bogie 61 is connected to the component supply unit 8 by operating the bogie lock key. FIG.
As described above, the stand stopper 73 is actuated to prevent the movement of the carriage 61 and adjust the height of the transfer table 15 as described above.

When this is completed, as shown in FIG. 20, the transfer table 15 on the carriage 61 is transferred to and from the parts supply section 8, and is sent from the carriage 61 to the parts supply section 8 for batch replacement. I do. Next, after lowering the free flow conveyor 44 by re-operation of the free flow key on the operation panel 103, the first and second automatic operations are performed by operation of the positioning key and the like.
Of the transport stand 9 by operating the respective positioning means 22 and 23 of FIG.
The upper transfer table 15 is positioned.

The empty trolley 61 can be moved again to the working position as shown in FIG. 21 to be ready for the next preparation.

The control means 102 performs component discrimination processing control in accordance with the flow chart shown in FIG. 22 for the batch-replaced components. The microswitch 101 determines that the transfer table 15 has been attached or detached in step # 1. Only when it is determined based on the ON / OFF history, the component discriminating control of step # 2 and subsequent steps is executed. At step # 2, the operation panel 1
The selection of the operation mode by the mode selection key on 03 is accepted. The operation mode to be selected is, for example, an operation mode in which a determination is not made as to whether or not the part is appropriate, all the points are performed, and only necessary ones are performed. Parts to be specified as those that need to be identified include, for example,
This relates to a component or the like that has been switched due to a change in the type of product, and may be input by an operation on the operation panel 103 or may be automatically specified by the control means 102.

It is also possible to always determine the suitability of components for all the component supply cassettes 14 without setting the operation mode as described above.

At step # 3, the selected operation mode is determined, and the routine proceeds to a component determination subroutine at step # 4. As shown in FIG. 23, the part determination subroutine of step # 4 performs the control of step # 12 and subsequent steps only when there is no part determination in step # 11. In step # 12, the transport stand 9 of the component supply cassette 14
By controlling the position of the transfer table 15 positioned above, the memory 104 on the transfer table 15 is positioned with respect to the read / write means 105 on the component supply unit 8 side, and the process proceeds to step # 13.

In step # 13, the component information is read from the memory 104 as to the component to be determined according to the selected operation mode, that is, the component relating to the component supply cassette 14 at all points or the component relating to the specified component supply cassette 14. . Next, at step # 14, the read component information is compared with a preset list of necessary components,
It is determined whether the target component after the batch replacement is proper or inappropriate.

The mounting machine 2 of the first embodiment has a component inspection means 222 in which an illumination device and a recognition camera are combined in order to determine whether or not the electronic components held by the nozzle 7 and the chuck and the orientation are appropriate. Data for this inspection is generated from the component text data B by the data processing device 203 and included in the mounting data C. Thereby, the control means 102 receives this via the data processing device 208,
The suitability of a component can be inspected as a reference for component determination by the inspection means 222. Therefore, appropriate inspection data is automatically obtained for the component to be mounted, and the required labor and time are the same, more appropriate inspection of the mounted component can be performed, and accurate component mounting can be guaranteed.

Since a predetermined number of component supply cassettes 14 can be collectively handled and exchanged on the transfer table 15, it is convenient for replacement and replenishment of parts, and the stored component information of each component supply cassette 14 is stored in the transfer table. 15 are collectively provided in the memory 104 and the like, and can be read at one place by the reading / writing means 105, so that reading does not take much time and productivity is improved. Since the memory 104 is readable and writable, the mounting status of the mounting machine 2 can be written and used as a component management data suitable for the mounting status, which is convenient.

A microswitch 101 is provided as detecting means for detecting the attachment / detachment of the component supply cassette 14. When the control means 102 determines that the component has been replaced based on the detection of the attachment / detachment of the component supply cassette 14, the component supply cassette 14
The component information is read to determine the suitability of the component, so that it is possible to prevent the mounting machine from operating and causing trouble or wasting time and mounting operation while the component is replaced incorrectly. it can.

In particular, if the reading of the stored component information is performed for all of the component supply cassettes 14 of the batch replacement unit in which the replacement has been performed, it is possible to determine all the component supply cassettes that have been batch replaced without discriminating which one has been replaced. In this case, it can be easily handled.

It is preferable that the control means 102 have an internal or external storage means for storing substitute component data of a substitute component such as a component to be mounted or a component that can be substituted such as a compatible component of another company. In this way, if the determination of the suitability of the part is inappropriate, it can be determined whether or not the part is a corresponding substitute based on the substitute part data. Since it is possible to automatically determine whether the mounted component is appropriate or not by automatically responding to this, it is possible to prevent a trouble in which a substitute component is determined to be an erroneous component.

Parts electronic catalog 212 of the first embodiment
Stores both the component text data B and the image data IM corresponding to various components, and can be used as a component electronic catalog for displaying information of various components on a screen in accordance with a predetermined search procedure as in the related art. ing. For this reason, the data reading processing means 201 reads both the image data IM and the component text data B for each component stored in the component electronic catalog 212 for each same component according to a predetermined search operation, and outputs the video signal IM. D is given to the display 213 of the data processing device 203 so that it can be displayed on the same screen. At the same time, component text data b corresponding to each electronic component can be output to another by an output operation.

Therefore, in the search operation, the same part of the image data IM and the part text data b of each part stored in the parts electronic catalog 212 is displayed on the same screen of the display 213 for each part, and various types of parts are displayed. It can be used for searching for and selecting a certain part, and the part text data b can be output to another part as needed, so that it can be used for various data processing.

Also, as described above, the component text data B
Is stored outside the device, such as the parts electronic catalog 212, the input of various data can be performed independently of the data processing device 203, which is a mounting data creation device. In addition, data can be easily changed or added. Moreover, it can be shared by various mounting machines 2.

Note that the component electronic catalog 212 storing the component text data B may transmit information by communication, and communication may be performed by wire, wireless, telephone line, or the like.
There is no particular question on the communication system called optical communication. According to the communication, there is an advantage that one storage unit can be shared by a large number of mounting machines 2 without limitation on the installation place of the mounting machine, and it is convenient for creating, managing, changing, and adding component text data B.

Further, the data processing program executed by the data processing device 203 executes the data processing on a CD as shown in FIG.
-It can be stored in an external storage medium 215 such as a ROM and used. This program, as mentioned above,
Based on the mounting position data A relating to the mounting position including the mounting angle created for the mounting target component, a component electronic catalog 2 prepared in advance for various components including the mounting target component
Data reading for reading out component text data b corresponding to the component to be mounted at each mounting position from the component text data B necessary for mounting the component, such as the shape, dimensions, package, and color of the component stored in the storage unit 12 From the processing program 215a and the mounting position data A and the data including the component text data b for each component read by the data reading processing means 201 for each mounting target component corresponding thereto,
Is a data creation processing program 215b for creating mounting data C for receiving components and mounting them at predetermined mounting positions.

In this way, the input of various programs can be performed independently of the data processing device 203, which is the mounting data creation device, and the programs can be easily changed or added. Moreover, it can be shared by the same type of mounting machines 2.

The creation of the mounting data C will be described more specifically. The NC program indicating the component mounting position, the component library for recognizing various electronic components, and the supply of the various electronic components, which have been mentioned as typical examples, are described. In addition to the supply library relating to the status, a component supply unit 8 that operates to supply a selected component to the mounting machine 2 while moving a plurality of component supply cassettes and moving in the feed axis direction.
Instruction data of the mounting position of the component supply cassette 14 in the above, and in the case of using a tray for component supply, data for setting the initial extraction position of the stored electronic components, or other necessary data Will be created. FIG. 32 shows an operation screen of the display 213 in a mode for generating a component library. A search for an electronic component corresponding to each component mounting position in the component position data A is performed using a start key 216 and a cancel key 217, and another start key 218 and a cancel key 219 are used.
The part library 220 and the like corresponding to the part library generation model set by the above are based on the part text data b read from the part text data B corresponding to each of the searched electronic components and the part position data A. Automatically generated.

Other items to be considered for component mounting include the types of nozzles and chucks that carry electronic components, the moving speed of a mounting head having nozzles and chucks, and the like.
The required lowering position of the nozzle or chuck when mounting the electronic component, that is, the mounting height on the substrate, the moving speed of the substrate on which the electronic component is mounted, particularly the acceleration, and various allowable values. In addition, these various electronic components are taped for automatic supply to a mounting machine, or are accommodated in a tray and handled. In such a case, the so-called load including the component supply form and the component storage pitch in that case is also included. It is also necessary to consider appearance conditions. With the component text data of such a component, the mounting data C including the mounting position instruction data and the initial take-out position instruction data can be automatically created.

Further, in order to more appropriately perform the pass / fail inspection at the mounting stage of the electronic component, the shape, surface reflectance, color, color, polarity mark of the electronic component, printed characters on the component, and color code are required. Component text data B for electronic components
Inspection data required by such component text data B can also be automatically created as mounting data C.

In some cases, the inspection data of the product circuit board after the mounting of the electronic components is automatically generated, and can be used by the mounting machine 2 itself or the inspection machine attached to the mounting machine 2. .

If the component text data B includes data such as code such as material, surface roughness, and surface shape of the package of the electronic component, data such as the component shape and size, and the weight of the component, the electronic component is sucked by the nozzle. Mounting data C that is optimal or gripping by the chuck, the moving speed of the component mounting head equipped with the nozzle and the chuck, the suction force, the moving speed of the substrate after the electronic components are mounted, In particular, mounting data C such as acceleration and various allowable values, and tape and tray supply form, such as tape and tray packaging, especially with and without cover and push-up pin, tape and tray component storage pitch, and tray If the mounting data C further includes the number of stored rows and the pitch between rows, the presence or absence of the cover peeling operation, the presence of the push-up pin operation, Out one difference by 1 pitch feed, it is possible to set the mounting condition say once strike two pitch feed.

An example of the component text data B used in the first embodiment will be described below. The component electronic catalog 21 of the component text data B relating to various electronic components will be described.
As shown in FIG. 30, the recording in the component master file B ₁ , the component shape file B _{2, the} component special shape file B ₃ , the component characteristic master file B ₄ , and the packaging file B
_5, polarity file B ₆ of the parts, reel information file B ₇
And so on. However, such a classification format can be set freely. In the part master file, the part name, maker name code, part classification code, part type code, shape code, and packing code are the top-level data, these master data are called and displayed on the screen, and according to the user's selection operation Display the contents of the selected item on the screen.

As for the data of the component type, individual component type codes are manually input to various electronic component types. As for the shape data, a code for each shape defined for managing the component by the shape is manually input.

Some of these embodiments are as follows.

The data contents of the part shape file include the shape code, the part type code, the presence or absence of the lead, and the body outline L
R, body edge shape DU, body thickness, special body thickness, component height, allowable shape and dimension, electrode width LDRU, electrode length LDRU, electrode height LDRU, and the like.

The data contents of the part special shape file include the shape code, target side number (LDRU), special electrode arrangement, special electrode existing position, special electrode width, special electrode length, special electrode height, and special root. Electrode width, special lead thickness, etc.

The data contents of the component characteristic master file include a component name, a package color code, a package material code, and the like.

[0115] The data contents of the packing file include packing code, packing type code, X-direction tray pitch, Y-direction tray pitch, number of X-direction parts, number of Y-direction parts, number of storage parts, tape width, tape. Feed pitch, taping direction / supply direction, etc.

The data contents of the component polarity file include component name, presence / absence of polarity, polarity mark classification, polarity mark shape size 1, polarity mark shape size 2, polarity mark X coordinate, polarity mark Y coordinate, polarity mark angle, left / right symmetry / Asymmetric parts,
And so on.

The data contents of the reel information file include a part name, a packaging quantity, and the like.

Next, several examples of setting of the part type code corresponding to each part type will be described below.

In the following, a chip component is a name for an electronic component for surface mounting, and includes a square chip resistor and the like. The axial component is a component having a lead and a type in which a lead is inserted into a hole of a substrate. The radial component is a component with a lead in which a lead is inserted into a hole of a substrate, and is a name of a component to be inserted in a state where the component is oriented vertically, and there is an aluminum electrolytic capacitor.

For chip components, Isolator: ATC Dielectric filter: BPP Aluminum electric field capacitor: CAPALR Cylindrical chip capacitor: CAPYL Film capacitor: CAPPULM CC: CC Connector: CNT Mini diode: DIMINI New mini power diode: DINMIHIPWS S mini diode: DISMINI Duplexer: EZFA Reception filter: EZFS filter: FLT Noise filter: FLN Oscillation filter: FSA Mini power IC: ICMINIPW Mini IC: ICMINI IF module: IF LC filter: LCFLT NL filter: NLFLT Crystal filter: QFT, etc.

For the axial / radial jumper parts, see R Bead core: R BCR Capacitor: R CAP R Three-terminal capacitor: R CAP3 A Bead core: A BC jumper wire: J Jamper and the like.

Some examples of setting the shape code corresponding to each component type are as follows.

In the following, the unit of the component size of the code is set for each component by taking two digits of the actual size. For example, 3mm long 1.5mm wide
If the height is 1.5 mm, it is 301515, and the height is 20 m.
If m is 13.5 mm wide and 3.5 mm high, 201
303.

For chip components, isolator: ATCB57 (ATC + shape code 1 + height 2) Dielectric filter: BPPB45 (BPP + shape type 1+
Height 2) Aluminum electrolytic capacitor: ALCB57 (ALC + Shape code 1 + Height 2) Cylindrical chip capacitor: 2125C (Diameter 2 + Length 2 +
C) Film capacitor: 4833FC13 (vertical 2 + horizontal 2+
FC + height 2) CC: CC014B101008 (CC + 3 pins + B
+ Vertical 2 + horizontal 2 + height 2) New mini power diode: NMINIPWDIL3
15 (shape type 5 + component type 2 + L + number of leads 1 + height 2).

Regarding the axial / radial jumper wire, bead core: 2545RBC28 (vertical 2 + horizontal 2 + RBC
+ Height 2) Capacitor: 4532 CAP32 (Vertical 2 + Horizontal 2 + CAP)
+ Height 2) Three-terminal capacitor: 1207CAPCN15 (vertical 2 + horizontal 2 + CAPCN + height 2) and the like.

The packing code is as follows.

Paper tape (paper, paper adhesive): P0804
0 (the first digit P is the paper type code, N for paper sticky)
Becomes The next two digits 08 indicate a tape width of 8 mm, and the next two digits 04 indicate a tape feed pitch of 4 mm. Further, the next two digits XX enter the system reservation. The last digit 0 indicates that the angle is 0 °. The angle code is 0 for 0 °, 1 for 90 °, and 2,360 for 180 °.
Is set to 3.

Embossed tape: E0804081 (The first digit E is a type code. The next two digits 08 indicate a tape width of 8 mm, the next two digits 04 indicate a tape feed pitch of 4 mm, and the next two digits 08 indicates the emboss depth, and the last digit 1 indicates 90 ° in the above-mentioned angle code.) Matrix tray: T1020 OO1 (the first digit T is the type code. The digit 10 is the number of columns in the Y direction, the next two digits 10 are the number of columns in the X direction, and the next two digits XX are sequential numbers under operator control in order from 00 when the tray pitch is different. The last digit 1 is an angle code.) Stick: S08 Ｓ ○ 2 (the first one digit S is a type code. The next four digits ○ ○ are used to input a system reservation. The last digit 2 is the angle code Bulk: B08 ○ ３ 3 (The first digit B is the type code. The next 4 digits ○ ○ enter the system reservation.)
The last digit 3 is an angle code. Next, the cut lead is a name of a part with a lead and a lead is cut, and this code is used to selectively register a cut lead code for the corresponding part. This code is not particularly defined in the first embodiment. , 20 characters or less. However, CUT0000 is set for a component having the number of cuts of zero.

Next, regarding the electrode shape classification, since the number of information is small, only the integral type: 1 gull wing: 2 J lead: 3 flat lead: 4 separation type: 5 insertion type: 6 butt lead: 7 volume: 8 did.

Note that these electrode shape names are registered by key input. This input can be made in Chinese characters.

A part electronic catalog 2 containing such part text data B and image data IM will be described below.
An example will be described in which the reference numeral 12 is used as a conventional component electronic catalog as described above.

As in the conventional case, when one electronic component that meets the needs can be selected in accordance with a predetermined classification and search procedure, the external view of the selected electronic component, for example, the rectifier diode MA337 is changed. When requested by a command, a screen display as shown in FIG. 33 is performed. On this screen, the outline drawing E including the dimension line of the electronic component and the component text data F which is the dimension corresponding to each dimension line are synthesized and displayed on the screen at the same time. When the size output is selected on this display screen, the component text data B can be output to another.

In response to a request for a land map, a screen display as shown in FIG. 34 is performed. On this screen, the outline drawing G including the dimension lines of the lands and the component text data M which is the dimension corresponding to each dimension line are simultaneously displayed on the screen by synthesizing the image data and the component text data. When the size output is selected on this display screen, the component text data H is input to another.

FIG. 35 shows the requirements for taping dimensions.
The screen display as shown in is performed. On this screen, the form diagram I with the dimension line of taping and the part text data J of the dimension corresponding to the dimension line are simultaneously displayed on the screen by synthesizing the image data and the part text data.

In response to a request for reel dimensions, a screen display as shown in FIG. 36 is performed. Reel drawing K on this screen
And the part text data L corresponding to the dimension line are simultaneously displayed on the screen by synthesizing the image data and the part text data.

When the component text data B of the component includes component text data of component shape, electric capacity, characteristics, mounting machine characteristics, plane gram, alternative component, other company compatible component, and component cost, mounting data C is created. In order to determine the necessary minimum insulation distance, automatically determine whether there is interference between components when arranging electronic components on a board and determine the required insulation distance based on component shape data, electrical capacitance, and characteristics. It is possible to set a minimum arrangement interval and automatically set an optimum recommended land shape for the electronic component.

Further, by handling the data of the mounting machine characteristics and the plane graph, a grouping process for determining the mounting order and arrangement can be performed so that various electronic components to be mounted can be mounted more quickly.

Further, by including the data of the replacement part, the parts compatible with other companies, and the cost, the data processing can be performed so that the component having the lowest cost is selected and mounted. At the same time, if a replacement component or another company's compatible component has a different shape or color from the original electronic component, it will be recognized as an erroneous component at the stage of component mounting and error processing will be performed, so an inspection program will be created along with the mounting data creation In this case, the process of rewriting the inspection data can be automatically performed.

Further, if the component text data B includes a code indicating a shape characteristic such as a protruding state of a connection bump on the lower surface of the component, a folding data for mounting the component on the board by the mounting data creation program. The processing for determining the mounting height, the pushing amount, or the pushing pressure can be automatically performed.

Further, as the part text data B of the part, the shape and size, color and color, reflectance,
Presence and condition of lead and cut lead, polarity mark,
Including printed characters such as 1005CR and 10Ω on the component, color code, surface roughness, and surface material, depending on the shape and size of the component, the component recognition method used when mounting the component is either the reflection type or the transmission type. Can be automatically determined. Specifically, a large component is clearly visible even in the transmission method, so that it is easy to recognize correctly. However, a small component is not suitable for the transmission method since the shadow of the nozzle is reflected and only the outer shape can be recognized. Also, small components can be recognized not only by their external shape but also by the leads on the bottom surface when they are recognized by the reflection method, and even if they are mounted using a nozzle with a large diameter, they do not hinder the recognition. is there. Therefore, a large electronic component is determined to be a transmission type, and a small electronic component is determined to be a reflection type, so that there is no erroneous inspection.

Further, a process of changing the amount and type of illumination light for recognizing components can be automatically performed according to the color, the color and the reflectance, the surface roughness, and the surface material. Specifically, since the mirror surface has high luminance, reflected light cannot be recognized tightly when illuminated with strong light, and cannot be recognized with weak light when the surface is dark. Depending on each surface condition,
Change the optimal light type and light intensity.

Further, processing for confirming and correcting the mounting direction of the component is performed based on the presence / absence and state of the lead and lead cut, and the polarity mark. Further, a process for confirming a mounted component from printed characters and a color code on the component and preventing mounting of an erroneous component can be automatically performed.

When the component text data B includes a plurality of package data that can be adopted for the same type of component,
In the operation of mounting data creation, the form and capacity of the component supply mechanism are determined by the packing form data that can be adopted for the same kind of components, for example, a plurality of data such as taping, tray, and stock, and the characteristic data of the mounting machine 2. Depending on
It is possible to automatically perform a process of determining to adopt a supply format that can be adopted or a supply format that further minimizes the mounting tact time.

Further, the fact that each component supply cassette for each component mounted on the mounting machine 2 has a memory for managing the cassette and components is used, and the memory is newly provided with the dimensions and colors of the components. And a supply code such as a shape code such as polarity and a packing style, a feed pitch, and a supply direction are written, and it is determined whether or not the part and the cassette match when the part is set in the cassette. To prevent incorrect setting. At the same time, the control unit 102 of the mounting machine 2 equipped with the component supply cassette reads all the information on the various electronic components stored in the memory 104 of each component supply cassette 14, and In addition to being capable of recognizing the arrangement of components, an array library including all of the components read in accordance with the mounting data creation program given to the control means 102,
A component library and a supply library can be generated, and components can be mounted using the library. However, the control unit 102 can also transmit the read component text data B and the like to the data processing device 203 in the first embodiment to provide the mounting data C.

In this case, no special data processing device or data file is required.

When the component text data B includes shape data such as the height, width, and height of the component, the volume or weight of the component is calculated from these data, and the obtained volume or weight data is used to calculate the volume or weight of the component. Selection of nozzles and chucks that handle, the moving speed of the head with these nozzles and chucks, the table moving speed,
In particular, processing for setting the acceleration and various allowable values can be automatically performed.

The component text data B includes a package color code, a component shape, a recommended land shape of the component,
Include the surface material of the part, the reflectance of the surface (if the reflectance is different for each part such as both ends and the center of the part, the reflectance for each part), polar marks, printed characters and color codes on the part surface In addition, an inspection program for inspecting various components after mounting can be automatically generated corresponding to the components of the mounting data.

Therefore, as in the case of creating mounting data,
There is no need to select and configure electronic components that meet your needs.
Inspection data for each type of component and each type can be obtained by simulating component mounting data.

When the component text data B includes a component shape, particularly a vertical, horizontal, and height size, and lead information, the read data in the visual inspection is automatically set in the inspection program based on these. be able to.

If the component text data B includes the temperature characteristics of all the electronic components mounted on the same board, the component mounting data creation program sets the temperature conditions when mounting the electronic components mounted on the board. Processing can be performed automatically. Specifically, when electronic components are mounted on both sides of the board, the electronic component having higher heat resistance than the second surface to be mounted later is set on the first surface to be mounted first.

As a result, the electronic component having a high heat resistance mounted on the first surface of the substrate 1 is bonded using reflow solder having a high melting point, and the electronic component having a low heat resistance mounted on the second surface has a low melting point. When boarding is performed using reflow solder, the electronic component mounted first on the first surface is melted when the electronic component is mounted on the second surface and reflow soldered, and the mounted electronic component falls, It is possible to prevent the electronic component having low heat resistance from being damaged during reflow soldering when mounting the electronic component on the second surface. A condition program for setting an optimum temperature profile of the reflow soldering apparatus can be automatically created by the data creation processing means 202 using these temperature characteristic data, and is specially created on the side of the reflow soldering apparatus. This eliminates the need for labor and can avoid the occurrence of errors due to the creation of separate data.

As part text data of a part,
When the data on the necessity of burning or refrigeration based on whether or not the component is a moisture-absorbing component is included, the process of generating the handling condition of the component when mounting the component together with the mounting data can be automatically performed.

Further, in order to write various kinds of information in the memory 104 or the like by using the read / write means 105 or to update the written contents, the control means 102 uses the number of used components, the remaining amount, Manages various types of mounted component information on mounted components, such as component quality, and component mounting information on component mounting, such as the percentage of components held by chucks and suction nozzles relative to the total number of components supplied, and the percentage of components mounted on a board. Then, at the time of removing the component supply cassette 14 at a time, the read / write means 105 is operated prior to the removal to write the mounted component information and the component mounting information in the storage means or to update the written content. Can also.

As described above, the control means 102 performs various kinds of mounted component information on mounted components, such as the number of used components, the remaining amount, and the quality of the components mounted on the mounting machine, and the chuck and the like for the total number of supplied components. Component mounting information relating to component mounting, such as a component holding ratio by a suction nozzle and a component mounting ratio on a substrate, is managed, and when the component supply cassette 14 is collectively removed, the read / write means 105 is read prior to the removal.
To write the mounted component information or component mounting information in the storage means or update the written content, the number of used components, the remaining number, and various components related to the component to be mounted, such as pass / fail. The component supply cassette to be removed can have information and various information relating to component mounting, such as the component retention rate by the chuck and the suction nozzle with respect to the total number of supplied components, and the mounting rate on the board. As a reference when mounting, the catalog data of the parts and the judgment of the difference between the actual dimensions of the parts can be used, so that more appropriate parts can be supplied, or the mounting conditions can be corrected or changed. This is convenient for comprehensive management of components to be mounted and their mounting states, such as proper mounting, and various measures based on this.

In the case of such data management, if the component supply cassettes 14 are individually attached and detached, a memory 104 can be provided for each of the component supply cassettes 14 and managed individually.

(Embodiment 2) In Embodiment 2, the transfer table 15 shown in Embodiment 1 is electrically connected to the transfer table 15 as shown in FIG. Optical or other suitable read / write memory 2
21 shows a case in which a component supply cassette 14 fixedly mounted is used.

FIG. 37 (b) shows a flowchart of the component determination in such a case.

The only difference is that the positioning of the memory 221 of the target component supply cassette 14 in step # 12a is different from the positioning of the memory of the transfer table 15 in step # 12 of the first embodiment.

The second embodiment has the advantage that the conventional component supply cassette 14 with memory can be used as it is,
To utilize this, batch replacement of parts by the transfer table 15 and
Since the collective setting of each memory 221 accompanying this is achieved, it is more convenient than using the conventional component supply cassettes 14 with memory separately attached and detached. However, it is needless to say that the present invention may be applied to a mounting machine in which the component supply cassettes 14 are individually attached and detached.

(Embodiment 3) Embodiment 3 is different from FIG.
Storage component information 231 that can be attached and detached as shown in FIG.
Can be mounted on the component supply cassette 14 for use. In this way, every time an electronic component is stored in the component supply cassette 14, the storage component information 231 corresponding to the electronic component is mounted on the component supply cassette 14 so that the component information can be read by a mounting machine or the like. Can be. In addition, in the case of such a detachable type, it is only necessary to carry one type of storage component information in one storage component information, so that a simple component information display format can be adopted and the cost can be reduced. In the third embodiment, the bar code 231 is used.
a is a storage component carrier 231b made of a bifurcated spring member
And the storage part information 231 is formed. The display of the barcode 231a may be printed directly, or a printed sheet may be attached. The stored component information 231 is attached so that the forked portion of the carrier 231b sandwiches the upper side of the component feeding unit 14a of the component feeding cassette 14. How to attach and detach is free.

FIG. 38B shows stored component information 231 displaying a bar code 231a using a resin case 231c which is detachably mounted on the fixed lever 17a of the component supply cassette 14 as a carrier. In addition to exhibiting the same function and effect as that shown in a), there is an advantage that a special carrier for the storage component information 231 is not required.

(Embodiment 4) Embodiment 4 is different from FIG.
As shown in FIG. 9, the storage medium carrying the stored component information of each component supply cassette 14 is an optical memory 241 that can be read by infrared communication, and the optical memory 241 of each component supply cassette 14 mounted on the mounting machine has Since the stored contents can be sequentially read out by the infrared communication means 242 located at one location, either the infrared communication means 242 or each of the component supply cassettes 14 can be used to read the stored component information held by each of the component supply cassettes 14. Since it is not necessary to move, the reading can be performed in a short time, and the production efficiency is improved.

(Embodiment 5) Embodiment 5 is different from FIG.
0 shows an example of component management in the case where electronic components are stored in the tray 251 and supplied to the mounting machine as shown in (a) and (b) of FIG. 40A shows the tray rack 25.
A tray plate 253 that individually holds the two trays 251 so that the trays 251 can be put in and taken out of the tray 253 is stored in a tray plate 253.
Alternatively, a memory 254 which is read / written by an optical read / write means 255 or the like is provided. As a result, in order to select the tray 251 for supplying components to the mounting machine, the information stored in the memory 254 is read from the read / write unit 2.
55 can be used to determine whether the tray 251 needs to be read. Further, in a state where the tray rack 252 is mounted on the component supply unit of the mounting machine for component supply, the mounting history of the components stored in each tray 251 is stored in the memory as described in the first embodiment. 254 may be stored and used for various types of management. 40B is provided with a memory 261 for storing information of each electronic component contained in each tray 251 contained in the tray rack 252 so that the information can be read and written collectively. Each tray 251
The management of the storage parts can be performed collectively.

However, the memory 254 provided on each tray 251 and the memory 261 provided on the tray rack 252 can be used together. This can be similarly applied to the relationship between the component supply cassette 14 and the transfer table 15 described in the first embodiment.

[0165]

According to the component mounting apparatus of the first and second aspects of the present invention, the component electronic catalog stores component text data such as shapes and dimensions of various components including the component to be mounted. The component text data of each component to be mounted is read out by the data readout means using the data, and the mounting data is created and created using the component text data and the mounting position data read out by the data creation processing means. The components are mounted on the board by controlling the operation of the mounting machine by the control means based on the mounting data.Therefore, there is no need for one person to input component text data to create mounting data for each mounting target component. The labor and time required for data creation can be greatly reduced, and parts can be mounted with high productivity. In addition, when a component electronic catalog in which image data is stored is used, it is possible to efficiently read out appropriate component text data using the image data.

According to the component mounting apparatus of the third and fourth aspects of the present invention, it is utilized that the component electronic catalog stores component text data such as shapes and dimensions of various components including the component to be mounted. The data reading means reads the corresponding component text data from the component electronic catalog based on the information on the mounting target component at each mounting position in the mounting position data relating to the mounting position created for the mounting target component, and reads the data. Since the mounting data is created using the component text data and the mounting position data read by the creation processing unit, and the operation of the mounting machine is controlled by the control unit based on the created mounting data, the component is mounted on the board. This eliminates the need for one person to enter component text data for creating mounting data for each component to be mounted, which increases the labor and time required to create mounting data. Can be reduced to, good productivity can be carried out in the parts of the implementation. In addition, when a component electronic catalog storing image data is used, it is possible to efficiently read out appropriate component text data using the image data.

According to the component mounting apparatus of the fifth aspect, for example, the NC program relating to the mounting position of the component and the component library relating to recognition of the component such as the shape, size, and color of the component as in the sixth aspect of the present invention. And automatic supply of mounting data for supplying each component to a conventional mounting machine and mounting them at a predetermined mounting position, such as a supply library relating to a component supply state such as an arrangement in a component supply unit. Created by processing and used for operation control of the mounting machine,
Various parts can be automatically mounted, and every time a new circuit board is manufactured, there is no need to manually input various parts text data necessary for creating mounting data for each mounting target component, Product change is possible in a very short time, and productivity is improved.

According to the seventh aspect of the present invention, in any one of the first to sixth aspects of the present invention, mounting data is further created in consideration of characteristics peculiar to the mounting machine, and the mounting operation is performed based on the data. Operational reliability and efficiency can be improved.

According to an eighth aspect of the present invention, in any one of the first to seventh aspects of the present invention, the mounting data further includes a type of a nozzle or a chuck for carrying a component, a moving speed of a head having a chuck or a nozzle, and a component. At least one data of the lowering position of the nozzle or chuck, the method of recognizing components such as the reflection method and the transmission method, the adjustment of the amount and type of illumination light in the component recognition, the moving speed of the board, and the acceleration Since it is created in such a manner, it is possible to perform a more appropriate mounting operation according to the state of the mounted components and the state of the substrate, and to mount the semiconductor device appropriately and efficiently.

According to the ninth aspect of the present invention, in any one of the first to eighth aspects of the present invention, the mounting data is created including the inspection data of the component mounting, and the inspection of the component mounting state is performed based on the inspection data. , Proper implementation can be guaranteed.

According to the tenth aspect, the first to ninth aspects are described.
In any one of the inventions described above, the mounting data is shared and used by a number of mounting machines via a recording medium and a communication medium, so that the number of steps for creating the mounting data can be reduced and the productivity can be improved.

According to the eleventh aspect, claims 1 to 1 are provided.
In the invention of any one of the above aspects, even if a substitute component is used when the component is exhausted, the appropriateness of the mounted component can be appropriately determined in response to the use of the substitute component. It is possible to prevent a trouble that is determined.

According to the twelfth aspect, the first to the first aspects are described.
In any one of the inventions, furthermore, the storage component information held by each of the component supply cassettes mounted on the mounting machine is automatically read by a reading means, and components such as components and arrangement supplied by these component supply cassettes. The control means automatically determines whether the conditions on the side match the conditions of the components set in the mounting data. It is possible to prevent the occurrence of such a problem, waste of time and mounting operation, or occurrence of a production loss such that the manufactured electronic circuit board becomes defective and is repaired or disposed of.

According to the thirteenth aspect, the first to the first aspects
In any one of the inventions, the component text data for each component to be mounted is simply included with the data of the temperature characteristics of various components, and the data processing function of the data creation processing means reflow solders the component to be mounted. A condition program for setting the optimum temperature profile can be automatically created, eliminating the time and effort required to create a special temperature profile for reflow soldering when component mounting involves reflow soldering. In addition, it is possible to prevent such a separate creation from causing a trouble due to an error in data input or the like.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a schematic configuration of a mounting machine in the apparatus of FIG.

FIG. 3 is a perspective view showing a transport stand unit that selectively supplies components of two component supply units provided in the mounting machine of FIG. 1;

FIG. 4 is a detailed perspective view of the transport stand unit of FIG. 3;

FIG. 5 is a detailed plan view of the transport stand of FIG. 3;

FIG. 6 is a cross-sectional view showing an operation sequence of positioning and releasing the transfer table on the transport stand of FIG. 2;

FIG. 7 is a perspective view of the carriage of FIG. 2 and a transfer table supported on the carriage.

FIG. 8 is a rear view of the carriage and the transfer table of FIG. 7;

9 is a cross-sectional view showing a state where the transfer table of FIG. 8 is supported by a cart.

FIG. 10 is a cross-sectional view showing a state where the transfer table of the cart of FIG. 8 is supported.

FIG. 11 is a rear view showing a state where the transfer table is mounted on the component supply unit and positioned.

FIG. 12 is a side view showing an operation stage of mounting a component supply cassette on an empty transfer table.

FIG. 13 is a side view showing an operation stage of preparing an empty cart for taking out a cassette when the out-of-stock component supply cassette of the component supply unit is replaced.

14A and 14B are a side view and an explanatory view showing a work stage of adjusting the height of the transfer table support portion with the carriage aligned from the state of FIG. 13 and a detection state of the height detection means at this stage.

15 is a side view of an operation stage of taking out an empty component supply cassette of the component supply unit by the cart after the height adjustment in FIG. 14;

FIG. 16 is a side view showing a state of a position holding operation showing an operation stage of holding an empty component supply cassette when it is taken out to a predetermined position;

FIG. 17 is a side view showing a work stage in which the transfer table is carried by a trolley with the position held.

FIG. 18 is a side view showing an operation stage of carrying and positioning a transfer table equipped with a new component supply cassette to a component supply unit by a cart.

FIG. 19 is a side view showing the operation stage of adjusting the height of the transfer table equipped with the new component supply cassette on the carriage with respect to the component supply unit.

FIG. 20 is a side view of a work stage in which the transfer table after the height adjustment is sent from the top of the cart onto the component supply unit.

FIG. 21 is a side view showing an operation stage of moving the carriage to a predetermined position after the transfer table has been sent to the component supply unit.

FIG. 22 is a main flow of component determination.

FIG. 23 is a flowchart of a part suitability determination subroutine of FIG. 22.

FIG. 24 is a diagram showing an example of component mounting position data.

FIG. 25 is a diagram illustrating an example of component text data.

FIG. 26 is a diagram illustrating an example of an NC program that is a part of component mounting data.

FIG. 27 is a diagram illustrating an example of a component library that is a part of component mounting data.

FIG. 28 is a diagram showing an example of an array program which is a part of a supply library which is a part of the component mounting data.

FIG. 29 is a diagram showing an example of a supply position library which is a part of a supply library which is a part of the component mounting data.

FIG. 30 is a schematic diagram showing an example of stored contents of a component electronic catalog.

FIG. 31 is a schematic diagram showing an example of storage contents of a storage medium storing a program for creating component mounting data using a component electronic catalog.

FIG. 32 is a diagram illustrating an example of an operation screen related to automatic generation of a component library.

FIG. 33 is a diagram showing a display screen of an outline drawing when a storage medium storing component text data and component image data is used as an electronic component catalog.

FIG. 34 is a diagram showing a land map display screen when a storage medium storing component text data and component image data is used as an electronic component catalog.

FIG. 35 is a diagram showing a display screen of a taping dimension when a storage medium storing component text data and component image data is used as an electronic component catalog.

FIG. 36 is a diagram showing a display screen of reel dimensions when a storage medium storing component text data and component image data is used as an electronic component catalog.

FIG. 37 is a side view of a component supply cassette with storage component information memory according to the second embodiment of the present invention, and a flowchart of a component suitability determination subroutine using storage component information.

FIG. 38 is a side view of a component supply cassette having detachable storage component information according to the third embodiment of the present invention.

FIG. 39 is a rear view schematically showing a component supply cassette with an optical memory and infrared reading means according to the fourth embodiment of the present invention.

FIG. 40 is a perspective view illustrating two management states of components when components are supplied by trays stored in a tray rack according to Embodiment 5 of the present invention.

FIG. 41 is a schematic diagram showing an example of stored contents of a conventional parts electronic catalog.

FIG. 42 is a flowchart showing a conventional method of creating mounting data.

43 is a diagram showing a screen in the middle of searching for electronic components that meet needs according to the major classification and the minor classification according to the flowchart of FIG. 42.

44 is a diagram showing an initial description screen of one transistor selected on the screen of FIG. 43.

45 is a diagram showing a window display screen of a list of large classification display items that can be selected on the screen of FIG. 43 for the transistors displayed in FIG. 43.

46 is a diagram showing a display screen relating to the outer shape of the transistor selected on the screen of FIG. 43.

FIG. 47 is a view showing a display screen relating to a land of a transistor selected on the screen of FIG. 43;

FIG. 48 is a view showing a display screen regarding a taping dimension of a transistor selected on the screen of FIG. 43;

FIG. 49 is a view showing a display screen relating to the reel dimensions of the transistor selected on the screen of FIG. 43;

FIG. 50 is a diagram illustrating a display screen on which data relating to a characteristic curve is displayed in a window in accordance with selection of a characteristic curve in an initial description screen when a motor control circuit as another electronic component is searched.

FIG. 51 is a diagram showing a display screen in which an application circuit example is preferentially selected and displayed in a window on the initial explanation screen in FIG. 32, and further, a block diagram is selected and displayed in a window.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Mounting machine 7 Suction nozzle 8 Component supply part 201 Data reading processing means 202 Data creation processing means 203 Data processing device 208 Data processing device 211 CAD device 212 Component electronic catalog 213 Display A Mounting position data B Component text data b Individual Component text data C mounting data

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroyoshi Nishida 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Nobuyuki Nakamura 1006 Odaka Kadoma Kadoma City, Osaka Matsushita Electric Industrial F Terms (reference) 5E313 AA01 AA11 CC04 DD32 EE02 EE03 EE05 FG06 FG10

Claims (13)

[Claims] 1. A component mounting apparatus in which a mounter receives a component to be mounted and mounts the component at a mounting position on a substrate, wherein image data of various components including the component to be mounted, and shapes and dimensions of various components are provided. Data reading processing means for reading component text data corresponding to the mounting target component at each mounting position from the component electronic catalog storing the component text data described above, and the mounting position of the read component text data and the mounting target component A data creation processing means for receiving mounting component parts and generating mounting data for mounting the mounting target components at the mounting positions based on mounting position data including mounting angles related to the mounting position, and a mounting machine based on the generated mounting data. A component mounting apparatus having control means for controlling the operation of the component, and mounting the component to be mounted at a mounting position on a substrate. 2. A component mounting apparatus in which a mounting machine receives a component to be mounted and mounts the component at a mounting position on a substrate, wherein component text data such as shapes and dimensions of various components including the component to be mounted are provided. Data reading processing means for reading component text data corresponding to the mounting target component at each mounting position from the stored component electronic catalog, and mounting including the mounting angle of the read component text data and the mounting position of the mounting target component Data creation processing means for receiving the supply of the mounting target component based on the position data and generating mounting data for mounting the mounting target component at the mounting position, and control means for controlling the operation of the mounting machine based on the generated mounting data And a component mounting apparatus for mounting a component to be mounted at a mounting position on a substrate. 3. A component electronic catalog storing image data of various components including the component to be mounted and component text data necessary for mounting the component, such as the shape and dimensions of the various components, and a component electronic catalog created. Using the mounting position data on the mounting position including the mounting angle,
A component mounting apparatus that receives a supply of a mounting target component and mounts the mounting target component at a predetermined mounting position, and reads component text data relating to the mounting target component at each mounting position in the mounting position data from a component electronic catalog. A data reading processing means, a mounting data creation processing means for creating mounting data based on component text data and mounting position data for each mounting target component read for each mounting target component, and a mounting machine based on the created mounting data. Means for controlling operation, and a component mounting apparatus for mounting a component to be mounted at a mounting position on a substrate. 4. A component electronic catalog storing component text data necessary for mounting components such as shapes and dimensions of various components including the component to be mounted, and a mounting position including a mounting angle created for the component to be mounted. A component mounting device that receives a component to be mounted and mounts the component to be mounted at a predetermined mounting position using the mounting position data related to the mounting position data. Data reading processing means for reading component text data relating to the target component; mounting data creation processing means for generating mounting data based on component text data and mounting position data for each mounting component read for each mounting target component; Means for controlling the operation of the mounting machine based on the mounted mounting data. A component mounting device for mounting components. 5. A shape and a size of a component prepared in advance and stored in storage means for various components including a component to be mounted, based on a mounting machine and mounting position data relating to a mounting position including a mounting angle generated for the component to be mounted. From the part text data necessary for mounting parts such as
Data reading processing means for reading a component corresponding to a mounting target component at each mounting position; and data including component text data read by the data reading processing means for mounting position data and the corresponding mounting target component. A data creation processing means for the mounting machine to receive mounting components and generate mounting data for mounting them at a predetermined mounting position, and each operation of the mounting machine receiving the mounting data from the data generation processing means. And a control unit for controlling the component mounting apparatus. 6. The mounting data includes an NC program relating to a mounting position of a component, a component library relating to recognition of a component such as a shape and a dimension of each component to be mounted, and a component supply state such as an array in a component supply unit. The component mounting apparatus according to any one of claims 1 to 5, further comprising a supply library for the component. 7. The component mounting apparatus according to claim 1, wherein the mounting data is created in consideration of characteristic data of the mounting machine. 8. The mounting data includes a type of a nozzle or a chuck for carrying the component, a moving speed of a head having the chuck or the nozzle, a lowering position of the nozzle or the chuck when mounting the component, and a component such as a reflection type or a transmission type. The component according to any one of claims 1 to 7, wherein the component is created by including at least one data of a recognition method, adjustment of a light amount and a type of illumination light in component recognition, a moving speed of a substrate, and acceleration. Mounting equipment. 9. The component mounting apparatus according to claim 1, wherein the mounting data is created including inspection data of component mounting, and the mounting state of the component is inspected based on the inspection data. . 10. The mounting data is shared by a plurality of mounting machines through recording and communication media.
A component mounting apparatus according to any one of claims 1 to 4. 11. The control means has internal or external storage means for storing substitute component data of a substitute component for a component to be mounted or a substitute component such as a compatible third-party component, and it is inappropriate to judge whether or not the component is appropriate. The component mounting apparatus according to any one of claims 1 to 10, wherein it is determined whether the corresponding component is a substitute product based on the substitute component data. 12. The mounting machine receives a component from a component supply cassette having storage component information that is detachably mounted, and has reading means for reading storage component information of the component supply cassette. 2. The apparatus according to claim 1, wherein the determination as to whether or not the component supply, such as a mounted component or an array of components, is appropriate.
12. The component mounting apparatus according to any one of claims 11 to 11. 13. The component text data includes a temperature characteristic of each component, and the data creation processing means sets a condition for setting an optimum temperature profile when reflow soldering the component to be mounted, from the temperature characteristic of each component to be mounted. 13. The component mounting apparatus according to claim 1, wherein the program is automatically created.