JP2002093789A - Plasma treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma treatment system, which prevents the inner surface of a treating chamber from being deteriorated due to a plasma and prevents the inner surface of the treating chamber from being turned into a heavy metal contamination source and also stabilizes the characteristics of a plasma treatment with age. SOLUTION: A plasma treatment apparatus consists of a plasma generator, a treating chamber 4 capable of being decompressed, a treatment gas feeding unit 13 for feeding gas to the chamber 4, a sample stand 10 for holding a sample 11 and a vacuum exhaust system 9. In this plasma treatment apparatus, the chamber 4 is provided with an outer cylinder 5 capable of withstanding a decompression and an inner cylinder 6 arranged on the inside of the cylinder 5 via a gap 14 and a heater 21 and a temperature control means 22 are provided on the cylinder 5. An inner cylinder consisting of a non-magnetic metallic material not containing heavy metals or a ceramic, carbon, silicon or quartz material is used as the cylinder 6. The cylinder 5 is heated by the heater 21 and the means 22 to control the temperature of the cylinder 6 at the desired value.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma processing apparatus and a plasma processing method, and more particularly to a plasma processing apparatus and a plasma processing method suitable for performing processing such as etching on a sample using high-density plasma.
The present invention relates to a plasma processing apparatus and a plasma processing method.

[0002]

2. Description of the Related Art As a conventional plasma processing apparatus, for example, a microwave plasma processing apparatus is used as described in a semiconductor plasma process technique (ed. By Takuo Sugano, published by Sangyo Tosho, (1980), p. 139). A plasma discharge chamber made of quartz is provided in a waveguide for transmitting plasma, and plasma is generated in the discharge chamber by the action of an external magnetic field and a microwave electric field generated by a coil disposed outside the discharge chamber. Then, the surface of the semiconductor wafer can be subjected to a process such as etching using the plasma.

In such a microwave etching apparatus, a non-magnetic and conductive material serving as a waveguide is required for the processing chamber in order to guide microwaves and introduce an external magnetic field into the processing chamber. is there. Therefore, generally, a metal such as aluminum (Al) or stainless steel (SUS) is used as a wall material of the processing chamber.

[0004] Incidentally, stainless steel and other metals constituting the wall surface of the processing chamber are shaved and scattered by the plasma and become a source of contamination together with the heavy metals contained therein.

On the other hand, Japanese Patent Application Laid-Open No. Hei 4-229419 discloses a method in which a conductive coating capable of protecting a metal surface from chemical corrosion by a reaction gas used in a processing chamber is formed on an inner metal surface. It is shown. this is,
When plasma etching is performed using a halogen gas such as chlorine as the processing gas, the metal wall of the processing chamber may be corroded. Therefore, a protective film is formed by coating on the metal inner wall surface of the processing chamber. It is. The metal of the processing chamber is aluminum, and the coating material is Ti
N, InSn, SiC, TiC, TaC and the like are mentioned. The thickness of the coating layer is from 0.2 μm to 1 μm
It is said to be over.

Japanese Unexamined Patent Application Publication No. 63-138737 discloses a dry etching apparatus having a counter electrode in a chamber, in which a contaminated chamber can be detachably attached to the chamber in order to clean the inner surface of the chamber. An insulating material is shown covering the inner surface of the chamber. As insulation,
Alumite, alumina spraying, Teflon (registered trademark), ceramics and the like are mentioned.

[0007]

Problems to be Solved by the Invention
In the prior art described in Japanese Patent No. 619, a metal surface can be protected from the viewpoint of chemical corrosion due to a reaction gas used in a processing chamber. However, as is clear from the column 5 of the above publication as typical plasma etching process conditions, the temperature during the plasma processing is limited to a relatively low temperature range of about 10 ° C. to about 70 ° C. Have been. This is because if the temperature of the aluminum constituting the processing chamber accompanying the plasma processing is, for example, 100 ° C.
It is considered that when the temperature rises above, cracks may occur in the coating film on the aluminum surface due to thermal expansion of the aluminum. In order to avoid the occurrence of cracks, the coating film must be thinned. However, when the film thickness is reduced, the coating film is corroded in a short time by the reaction gas accompanying the plasma etching, and does not serve as the coating film. For example, according to experiments by the inventors, in the case of SiC, about 0.0
There is data that it is cut by 5 μm. Therefore, 0.2
With a thickness of about 1 μm to 1 μm, the coating layer is destroyed and disappears in several hours, in other words, when several hundred samples are processed. As a result, the metal surface of the inner wall of the processing chamber is exposed to the plasma, and is shaved by the plasma or chemically reacted and deteriorated, thereby becoming a heavy metal contamination source or deteriorating the characteristics of the processing chamber.

On the other hand, the invention described in Japanese Patent Application Laid-Open No. 63-138737 discloses a method in which a contaminated insulating material is removed from a chamber, cleaned, and then mounted again in the chamber for use. When such components are mounted on the inner surface of the chamber, there is a problem that the temperature of the insulating material or the like mounted during the plasma processing fluctuates and the plasma processing characteristics fluctuate greatly.

An object of the present invention is to prevent the inside of a processing chamber from being deteriorated by plasma or to become a source of heavy metal contamination, and to maintain the temperature of the inside of the processing chamber at a desired temperature, thereby stabilizing the plasma processing characteristics over time. It is an object of the present invention to provide a plasma processing apparatus and a plasma processing method to be performed.

[0010]

According to the present invention, there is provided a plasma generating apparatus, a processing chamber capable of reducing pressure, a processing gas supply apparatus for supplying a gas to the processing chamber, a sample table for holding a sample, and a vacuum pumping apparatus. In a plasma processing apparatus comprising: a plasma generating apparatus; a processing chamber capable of reducing pressure; a processing gas supply apparatus for supplying gas to the processing chamber; a sample table for holding a sample; The processing chamber includes an outer cylinder that withstands pressure reduction, an inner cylinder disposed inside the outer cylinder with a gap, and a temperature control unit that maintains the temperature of the inner cylinder in a predetermined range. The temperature control means includes:
A first temperature control unit provided on the outer cylinder for adjusting the temperature of the outer cylinder from room temperature to 350 ° C .; and a second temperature for adjusting the temperature of the inner cylinder including the heat transfer gas introduced into the gap. And a control unit.

Another feature of the present invention is that, in the plasma processing apparatus, the temperature control means for maintaining the temperature of the inner cylinder within a predetermined range in the plasma processing apparatus has a temperature within ± 20 ° C. To keep.

Another feature of the present invention is that the first temperature control unit includes a heater attached to the outer cylinder, and the heater controls the temperature of the outer cylinder to be in a range from room temperature to 350 ° C. Is to be.

Another feature of the present invention is that the second temperature control section includes a heat transfer gas supply system for introducing a heat transfer gas into a gap between the outer cylinder and the inner cylinder. .

Since an inner cylinder made of a material containing no heavy metal such as ceramic is used for the inner wall of the processing chamber, a metal surface such as aluminum constituting the outer cylinder is not exposed at the time of processing a wafer, and therefore, the metal is formed by plasma. It is not scraped or deteriorated and does not become a heavy metal contamination source for the wafer. On the other hand, since the inner cylinder has a lower thermal conductivity than the outer cylinder, if no control is performed, the temperature of the inner cylinder during the etching process, in other words, the surface temperature of the processing chamber is 200 ° C. to 3 ° C.
It reaches 50 ° C or higher. In the present invention, since the temperature of the inner cylinder is controlled to a desired value, for example, a desired value between 100 ° C. and 350 ° C., the surface temperature of the processing chamber is also maintained at the desired value, so that the etching characteristics are stable. Becomes

Further, the process can be stabilized by controlling the inner cylinder surface temperature to a desired pattern.

Further, the inner surface of the material constituting the inner cylinder is
When using a material that is cut little by little by plasma, the inner surface of the inner cylinder is constantly updated to a new surface, so there is no risk of contamination due to deterioration of the inner surface, and there is almost no change over time in the characteristics of the processing chamber. Absent. Also, since the inner cylinder does not contain heavy metals, there is no concern that it will be a source of contamination even if it is shaved.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view of a part of a microwave plasma processing apparatus according to an embodiment of the present invention, which is longitudinally sectioned, and FIG. 2 is an enlarged view of a main part thereof. 1 is a magnetron as a microwave oscillation source, and 2 is a microwave waveguide. Reference numeral 3 denotes a quartz plate for vacuum-sealing the processing chamber 4 and supplying microwaves to the processing chamber 4. The processing chamber 4 includes an outer cylinder 5 made of, for example, high-purity aluminum (Al) and capable of withstanding decompression, and silicon carbide (Si) disposed inside the outer cylinder 5.
The inner cylinder 6 is made of ceramic such as C). Since the inner surface of the processing chamber 4 is made of an insulating material and the outside is made of a conductive material, the processing chamber 4 also functions as a waveguide. 7 is a first solenoid coil for supplying a magnetic field, 8 (8A, 8B)
Is a second solenoid coil that supplies a magnetic field. The processing chamber 4 is evacuated by a vacuum pump connected to a vacuum chamber 9. Reference numeral 10 denotes a sample table on which a wafer 11 to be subjected to processing such as etching is mounted, and a high-frequency power supply 12 is connected to the sample table. A processing gas supply system 13 supplies a processing gas for performing processing such as etching and film formation into the processing chamber 4.

Between the outer cylinder 5 and the inner cylinder 6, there is a gap G14 of about 0.1 to 2 mm, between which a heat transfer gas for temperature control is introduced via a gas supply system 15. Gas supply system 15
Comprises a gas source 16, a pressure control valve 17, a pressure detector 18, a pressure command instructing means 19, and a control circuit 20. The pressure detector 18 detects the pressure P in the gap 14, and sets the pressure P to a desired value. The opening of the pressure control valve 17 is controlled so as to maintain the pressure.

The inner cylinder 6 is supported by a support 32.
It is detachably supported with respect to the outer cylinder 5 in order to replace it with a new one when it has been consumed by a certain amount.

A heater 21 for heating the processing chamber 4 is disposed on the outer periphery of the outer cylinder 5, a temperature T of the inner cylinder 6 is detected by a temperature detector 23, and a temperature controller 22 controls the temperature of the outer cylinder 5. The temperature T0 is controlled. This heater 21
By maintaining the temperature T0 of the outer cylinder 5 and the pressure of the gap 14 at predetermined values, the temperature T of the inner cylinder 6 is maintained at a predetermined value.

In the plasma etching process, the pressure of the processing chamber 4 is reduced to a predetermined processing pressure by introducing a processing gas from the gas supply system 13 into the processing chamber 4 at a predetermined flow rate and evacuating the processing chamber 4 by a vacuum pump. Adjust. Further, the heater 21, the gas supply system 15, the temperature controller 2
2, the temperature T0 of the outer cylinder 5, the temperature T of the inner cylinder 6, and the pressure P of the gap 14 are controlled to predetermined values.

On the other hand, the wafer 11 to be processed is placed and held on the sample stage 10, the magnetron 1 and the first and second solenoid coils 7, 8 are turned on, and the microwave is guided to the processing chamber 4, The plasma 100 is generated in the processing chamber 4, and the wafer 11 is subjected to processing such as etching.

According to the present invention, when processing the wafer 11,
Since the metal surface such as aluminum is not exposed as the inner wall of the processing chamber 4, the metal is not shaved or deteriorated by the plasma 100 and does not become a heavy metal contamination source for the wafer 11.

On the other hand, the inner surface of the SiC constituting the inner cylinder 6 is slightly removed by the plasma 100. However, since it does not contain heavy metals, there is no worry that it will be a source of pollution even if it is scraped. Rather, since the inner surface of the inner cylinder 6 is constantly updated to a new surface by being scraped, there is no concern about contamination due to deterioration of the inner surface, and there is almost no change in the characteristics of the processing chamber 4 with time. The shaved SiC component is
The processing chamber 4 is evacuated by a vacuum pump.

During the etching process, the temperature of the inner cylinder increases due to heat generated in the processing chamber. If not controlled, the temperature T of the inner cylinder will be between 200 ° C and 350 ° C or higher. On the other hand, the etching characteristics in the plasma etching process are greatly affected by the temperature of the inner surface of the inner cylinder 6. That is, the reaction between the inner cylinder 6 and the etching gas changes due to the change in the surface temperature of the inner cylinder 6, and the atmosphere of the etching gas changes, so that the etching characteristics are not stable. For example, as the temperature of the cylinder 6 changes, the composition and amount of the deposited material on the wall fluctuates, or the reaction speed with the wall fluctuates, so that the composition in the plasma fluctuates. Not stable.

In the present invention, by controlling the temperature T0 of the outer cylinder 5 and the pressure P of the gap 14 by the heater 21, the surface temperature T of the inner cylinder is set to 100 to 350 ° C, preferably 150 to 300 ° C. Control to the desired value between ° C. According to the present invention, since the temperature T on the surface of the inner cylinder 6 is maintained at a predetermined value, the etching characteristics become stable. Also,
Since the temperature of the inner cylinder 6 is maintained at a predetermined value and the reaction speed of the plasma on the inner surface of the inner cylinder 6 is stabilized, the amount of the surface of the inner cylinder 6 that is etched away is also constant. Thereby, the characteristics of the processing chamber 4 are also stabilized.

FIG. 3 shows a temperature control function of the inner cylinder 6 by the temperature controller 22. As an example, it is shown that the temperature T of the inner cylinder 6 is brought close to T0 by maintaining the temperature of the outer cylinder 5 at T0.

In this case, as shown in FIG. 4, by increasing the pressure P in the gap 14, the difference between the temperatures T and T0 can be reduced. Specifically, the gap 14 is 1 mm, and the gap 14 is H
When e gas is supplied and the gas pressure is controlled to 10 Torr, when the heat input to the inner cylinder 6 is equivalent to 0 to 300 W, the outer cylinder 5
The temperature of the inner cylinder 6 to 150 ° C ± 150 ° C
It is possible to keep it at 20 ° C.

The optimum value of the desired temperature of the inner cylinder differs depending on the combination of the material of the cylinder, the quality of the film to be processed, the type of the processing gas, the discharge conditions and the like.

For example, when processing the oxide film sample with resist shown in FIG. 12 using a CF-based gas as the processing gas and using quartz for the cylinder, when the temperature of the inner cylinder is not controlled, as shown in FIG. As the number of processed samples increases, the inner cylinder receives heat from the plasma and gradually rises to a saturation temperature. At this time, although the change in the etching rate of the oxide film is small, the etching rate of the resist gradually decreases as the temperature of the inner cylinder increases, and the etching rate of the resist becomes stable when the temperature of the inner cylinder is saturated.

On the other hand, if the temperature of the inner cylinder is maintained at the saturation temperature in FIG. 13 in advance, a stable resist etching rate can be obtained from the beginning of the number of processed samples.

If the temperature of the inner cylinder is maintained at the initial temperature instead of the saturation temperature shown in FIG. 13, it is possible to obtain the initial etching rate of the number of processed samples.

It should be noted that the smaller the gap 14, the better the heat transfer property of the gas is, but the effect is obtained up to a gap of about 2 mm.

The material of the inner cylinder 6 in the embodiment is a non-magnetic material for microwave discharge using a magnetic field, and it is necessary that the material is not altered by plasma and does not contain heavy metals. Those satisfying this condition include carbon C, silicon (Si), quartz (SiO2), and alumina (Al2O).
Materials such as 3) are mentioned, but an aluminum material may be used depending on the content of the plasma treatment.

The inner cylinder 6 is required to have a mechanical strength and durability equal to or more than a predetermined value. That is, the thickness of SiC in the embodiment constituting the inner cylinder 6 has a mechanical strength that can withstand the external force acting during the plasma processing, and can withstand a large amount of wafer processing while being shaved by the plasma 100. It must be durable. Assuming that the thickness is about 0.05 μm per minute by etching, the thickness of SiC is only required to be 2 to 10 mm in order to practically endure the processing of tens of thousands of wafers.

In the embodiment shown in FIG. 1, the surface temperature of the quartz plate 3 is also determined by the same method as that for controlling the temperature of the inner cylinder 6.
It is preferable to control the temperature to be from 00 ° C to 350 ° C.

FIG. 5 is a longitudinal sectional view of a microwave plasma processing apparatus according to another embodiment of the present invention. The processing chamber 4 includes an outer cylinder 5 made of, for example, high-purity aluminum, and a ceramic inner cylinder 6 disposed inside the outer cylinder 5. The inner surface of the processing chamber 4 has an inverted tapered shape, and the inner cylinder 6 has a truncated cone shape. There is a gap 14 between the outer cylinder 5 and the inner cylinder 6. In the gap 14, as shown in FIG.
An aluminum corrugated plate 30 is arranged, and the corrugated plate 30 is in contact with the outer cylinder 5 and the inner cylinder 6 by a spring force. A heater 21 for heating is arranged on the outer periphery of the outer cylinder 5. The lower end of the inner cylinder 6 is held by a support portion 32 via a spring 31. A spring 33 is also provided at the upper end of the inner cylinder 6, and the corrugated plate 30, the outer cylinder 5, and the inner cylinder 6 are
The contact force is increased. The springs 31 and 33 are also provided with the outer cylinder 5.
It also has a function of absorbing a difference in thermal expansion between the inner cylinder 6 and the inner cylinder 6.

Also in this embodiment, the function of the inner cylinder 6 made of SiC is the same as that of the above-described embodiment. This embodiment is characterized in that the heat transfer between the outer cylinder 5 and the inner cylinder 6 is a combination of a contact heat conduction method using the corrugated plate 30 and a gas conduction method using the gas in the gap 14. According to this embodiment, the processing chamber surface, that is, the surface temperature T of the inner cylinder 6 is set.
Is maintained at a value having a small difference with respect to the temperature T0 of the outer cylinder 5, so that the etching characteristics become stable.

In the embodiment of FIGS. 1 to 5, the temperature of the inner cylinder 6 need not be directly detected (if it is indirectly detected). However, adding the temperature detector 23 to the inner cylinder 6 has the following effects.

(1) In order to more accurately control the temperature T of the inner cylinder 6, the pressure in the gap 14 can be varied or the temperature of the outer cylinder 5 can be finely adjusted. Is improved.

(2) The temperature of the inner cylinder 6 is monitored, and when the temperature of the inner cylinder 6 is out of the predetermined range, an alarm output such as not performing the plasma processing can be issued or the plasma processing can be stopped.

In the first to fifth embodiments, the heater is described as the temperature control function of the outer cylinder. However, by controlling the temperature of the outer cylinder by flowing a circulating fluid whose temperature is controlled, the temperature can be controlled from below room temperature to heating. Range can be widened,
The temperature controllability of the inner cylinder is further improved.

FIG. 7 shows another embodiment of the present invention applied to a parallel plate plasma etching apparatus. In this apparatus, the processing chamber 4 as a vacuum vessel is constituted by a substantially closed metal reaction comprising an outer chamber 40, an upper plate 41, a side wall 42, and a bottom plate 43. A pair of opposed parallel plate electrodes (an anode grounded on the inner wall of the outer chamber 40, and a cathode 47 mounted on the outer chamber 40 via an insulator 46) are provided in a vacuum vessel, and high-frequency energy is supplied to the cathode 47. There is a high frequency power supply 48. Further, there is a connection 44 to a vacuum pump for partially evacuating the processing chamber 4 and a reaction gas supply source for supplying a reaction gas to the processing chamber 4 through a valve-controlled conduit 45. The wafer 11 to be etched is
It is mounted on the cathode 47.

The inner cylinder 49 made of SiC is provided on the inner surface of the outer chamber 40, that is, the upper plate 41, the side wall 42, and the bottom plate 4
3 is formed on the inner surface. There is a gap 50 between the outer chamber 40 and the inner cylinder 49, between which a heat transfer gas for temperature control is introduced via a gas supply system. The gas supply system is provided with a gas source, a pressure control valve, a pressure detector, a pressure command indicating means, and a control circuit as in the embodiment of FIG.
It operates to maintain the pressure P of 0 at a predetermined value. Also,
A heater 51 for heating the processing chamber 4 is arranged on the outer periphery of the outer chamber 40, and the temperature controller controls the temperature T 0 of the heater 51 as described in the embodiment of FIG. Can be maintained at a predetermined value by the controller. A temperature detector 23 may be added to the inner cylinder 6.

With such a configuration, the temperature of the inner cylinder 49 is maintained at a predetermined value during the plasma etching of the wafer 11, so that the same operation as in the above-described embodiment can be performed.
The effect is obtained that the metal is not shaved or deteriorated by the plasma. Further, since the inner surface of the inner cylinder 49 is constantly updated to a new surface, there is no fear of contamination due to deterioration of the inner surface. Further, since the temperature of the inner cylinder 49 is maintained at a predetermined value, stable plasma processing can be performed. In the parallel plate type etching apparatus, the material of the inner cylinder does not need to be limited to a non-magnetic material.

The present invention can be applied to other apparatuses having different plasma generating mechanisms, and examples of the application are shown in FIGS.
Shown in

FIG. 8 shows an example in which the present invention is applied to a magnetron RIE device provided with a magnet 80. The processing chamber 4 as a vacuum vessel includes a side wall 42 and the sample stage 10 on which the wafer 11 is mounted, and has a high frequency power supply 48 for supplying high frequency energy to the electrodes of the sample stage 10. further,
The reaction gas is passed through a connection to a vacuum pump to partially evacuate the processing chamber 4 and a valve-controlled conduit 13.
And a reaction gas supply source to supply the reaction gas.

An inner cylinder 49 made of SiC is formed on the inner surface of the side wall 42. There is a gap between the side wall 42 and the inner cylinder 49, and a heat transfer gas for temperature control is introduced through the gas supply system 15 between the gap. The gas supply system includes a gas source, a pressure control valve, a pressure detector, a pressure command indicating means, and a control circuit, as described in the embodiment of FIG. 1, so as to maintain the pressure P in the gap at a predetermined value. Works. A heater 51 for heating the processing chamber 4 is provided on the outer periphery of the side wall 42.
The side wall 42 is provided by the temperature controller 22 via the heater 51 in the same manner as described in the embodiment of FIG.
Is controlled, and the temperature T of the inner cylinder 49 can be maintained at a predetermined value.

With this configuration, by maintaining the temperature of the inner cylinder 49 at a predetermined value during the plasma etching of the wafer 11, the same operation as in the above-described embodiment can be performed.
Stable plasma processing becomes possible. Further, there is obtained an effect that the metal is not shaved or deteriorated by the plasma. Further, since the inner surface of the inner cylinder 49 is constantly updated to a new surface, there is no fear of contamination due to deterioration of the inner surface.

FIG. 9 shows an example in which the present invention is applied to an inductively-coupled discharge system and a non-magnetic field type apparatus among external energy supply discharge systems. The processing chamber 4 includes a silicon plate 90 and a quartz chamber 92. Is surrounded by 91 is a heated antenna member, and 95 is an upper heater. Also in this embodiment, by maintaining the temperature of the quartz chamber 92 at the predetermined value T during the plasma etching of the wafer 11, stable plasma processing can be performed by the same operation as the above-described embodiment. Further, since the inner surface of the quartz chamber 92 is constantly updated with a new surface by the plasma, there is no fear of contamination due to deterioration of the inner surface.

FIG. 10 shows an example in which the present invention is applied to an inductively coupled discharge type magnetic field type device among external energy supply discharge types. 105 is Belzer, 1
Reference numeral 10 denotes an antenna. The processing chamber 4 as a vacuum vessel is
The apparatus includes an inner cylinder 112, an outer cylinder 114, and a sample stage 10 on which the wafer 11 is mounted. A high-frequency power supply 48 supplies high-frequency energy to the electrodes of the sample stage 10. Furthermore, there is a connection to a vacuum pump for partially evacuating the processing chamber 4 and a reaction gas supply for supplying the reaction gas to the processing chamber 4 through a valve-controlled conduit. Further, a heater 116 for heating and cooling the outer cylinder 114 to control the temperature and a cooling water passage 12 are provided.
0 is provided.

The inner cylinder 112 and the outer cylinder 11 made of SiC
4, there is a gap, and a heat transfer gas for temperature control is introduced through the gas supply system 15 between them. The gas supply system is
As described in the previous embodiment, a gas source, a pressure control valve, a pressure detector, a pressure command indicating means, and a control circuit are provided.
It operates to maintain the pressure P in the gap at a predetermined value. Further, the temperature T0 of the outer cylinder 114 is controlled by the temperature controller via the heater 116, and the temperature T of the inner cylinder 112 can be maintained at a predetermined value.

With such a configuration, by maintaining the temperature of the inner cylinder 112 at a predetermined value, a stable plasma processing can be performed by the same operation as the above-described embodiment.
Further, there is obtained an effect that the metal is not shaved or deteriorated by the plasma. In addition, since the inner surface of the inner cylinder is constantly updated with a new surface, there is no risk of contamination due to deterioration of the inner surface.

FIG. 11 shows an example in which the present invention is applied to an inductively coupled discharge type magnetic field type device among external energy supply discharge types. 120 is an electrode and 48 is a high frequency power supply. The processing chamber 4 serving as a vacuum vessel includes a ceramic plate 124, an inner cylinder 122, and a sample stage 10 on which the wafer 11 is placed. Further, a heater 166 for heating and cooling the ceramic plate 124 to perform temperature control.
And a gas passage 130 for supplying gas to the gap. As described in the previous embodiment, the gas supply system includes a gas source, a pressure control valve, a pressure detector, a pressure command indicating means, and a control circuit so as to maintain the pressure P in the gap at a predetermined value. Operate. In addition, heater 1
The temperature T0 of the ceramic plate 124 is controlled via 26, and the temperature T of the inner cylinder 122 can be maintained at a predetermined value.

By maintaining the temperature of the inner cylinder 122 at a predetermined value in such a configuration, stable plasma processing can be performed by the same operation as in the above-described embodiment. Further, there is obtained an effect that the metal is not shaved or deteriorated by the plasma. In addition, since the inner surface of the inner cylinder is constantly updated with a new surface, there is no risk of contamination due to deterioration of the inner surface.

In any of the embodiments described above with reference to FIGS. 8 to 11, the material of the inner cylinder is preferably a nonmagnetic nonmetallic material in order to reduce the influence on the magnetic field and the electric field.

The present invention can be applied not only to the above-described plasma etching processing but also to a CVD apparatus and a sputtering apparatus.

Further, the present invention is not limited to the case where the process is stabilized by maintaining the temperature of the inner cylinder at a predetermined value. The same applies to the case of correction.
That is, by improving the temperature controllability of the inner cylinder, the process can be stabilized.

The apparatus described with reference to FIGS. 1 to 11 is used as follows. For example, before starting the apparatus, it is checked whether the temperature of the inner cylinder can be controlled to a desired temperature. First, the inside of the processing chamber 4 is evacuated to a predetermined pressure by operating a vacuum pump. Thereafter, the heater is operated. The inner cylinder is heated by the heat generated by the heater. Before and after this, a heat transfer gas is supplied to the gap, and the gas pressure in the gap is adjusted to a predetermined pressure. That is, the heating of the inner cylinder is performed using the heat conduction of the heat transfer gas supplied to the gap. The temperature of the heated inner cylinder is directly or indirectly detected and controlled to a desired temperature. Thereby, it is confirmed that the temperature of the inner cylinder can be controlled to a desired temperature. still,
If the temperature of the inner cylinder cannot be controlled to the desired temperature, the operation of the heater and the supply of the heat transfer gas to the gap are stopped, and the inconvenient part is checked and restored.

On the other hand, in this case, one wafer is carried into the processing chamber by a transfer device not shown. The loaded wafer is transferred from the transfer device to the sample stage,
The surface opposite to the surface to be processed is mounted on the mounting surface corresponding to the sample mounting surface of the sample stage.

In the apparatus described with reference to FIGS. 1 to 11, the sample stage is provided with a temperature control means having a cooling function.
In a device such as a VD device or a sputtering device which needs to heat a wafer during processing, a temperature control means having a heating function is additionally provided. The wafer mounted on the sample mounting surface of the sample stage is held on the sample stage by a mechanical clamping device using a spring force or a load, an electrostatic suction device, a vacuum suction device, or the like.

Thereafter, a processing gas is supplied at a predetermined flow rate into the processing chamber. A part of the processing gas supplied into the processing chamber is exhausted out of the processing chamber by the operating vacuum pump, whereby the pressure in the processing chamber is adjusted to the processing pressure of the wafer.

In such a state, the processing gas in the processing chamber is turned into plasma by electric discharge. The processed surface of the wafer mounted on the sample mounting surface of the sample stage is processed by the plasma. During the processing, the temperature of the wafer is controlled to a predetermined temperature.

During the processing of the wafer, the temperature of the inner cylinder is monitored continuously or as needed. The monitor temperature is compared with a preset desired temperature, and the temperature of the inner cylinder is controlled to the desired temperature based on the comparison result. The temperature control of the inner cylinder is performed by adjusting the pressure of the heat transfer gas in the gap between the outer cylinder and the inner cylinder, or by adjusting the heat generated by the heater to adjust the temperature of the outer cylinder. In addition, the pressure adjustment of the heat transfer gas in the gap between the outer cylinder and the inner cylinder
This is performed by adjusting the supply amount or pressure of the heat transfer gas supplied to the gap.

Generally, a plurality of wafers are continuously processed one by one. In this case, the temperature of the inner cylinder is motorized during processing of one wafer until processing of a plurality of wafers is completed, and is controlled to a desired temperature. For example, when a problem occurs in the temperature monitoring of the inner cylinder or when the temperature of the inner cylinder cannot be controlled to a desired temperature, it is determined that the processing characteristics of the wafer cannot be stably maintained, and the processing of the wafer is interrupted. . Then, at the time of the interruption, a solution to the problem is implemented. Thereafter, the processing of the plurality of wafers is resumed.

The inconvenience of monitoring the temperature of the inner cylinder and the inability to control the temperature of the inner cylinder to a desired temperature are communicated to the operator by issuing some warning through the control device. As a result, the operator takes recovery measures and restarts the processing of the wafer. By monitoring the factors related to the temperature control of the inner cylinder, it is possible to check the history up to the interruption of the wafer processing, and to investigate the cause and take corrective measures promptly and early. it can.

The inside of the processing chamber is cleaned. The processing is performed by wiping the inner surface of the processing chamber such as the inner cylinder surface or the inner component surface disposed in the processing chamber such as the sample stage, or by using plasma of a cleaning gas. Also,
The processing is performed before processing the wafer, during the processing of a plurality of wafers, or after the processing of the wafer is completed.

When the cleaning process is performed by wiping, it is checked whether or not the temperature of the inner cylinder can be controlled to a desired temperature after the process is completed and before the processing of the wafer is started. Also,
In the case of performing the cleaning process using the plasma, it is checked whether or not the temperature of the inner cylinder can be controlled to a desired temperature during the process or after the process and before starting the processing of the wafer.

Further, a break-in discharge (seasoning) process is performed in the processing chamber. This processing is performed before the start of the wafer processing of the day or after the end of the cleaning processing and before the processing of the wafer. In this case, whether or not the temperature of the inner cylinder can be controlled to a desired temperature during the break-in discharge processing may be checked.

In order to stabilize the plasma processing characteristics over time, it is necessary to control the temperature of the inner cylinder to a temperature according to the processing conditions of the wafer. Here, the processing conditions for the wafer include the quality of the film to be processed, the type of processing gas, the discharge conditions, the discharge type, and the like.

Then, the processing conditions of the wafer are input to the control device of the processing device by the host control device or the operator. The temperature of the inner cylinder according to the wafer processing conditions is input to the control device in advance. In the control device, the temperature of the inner cylinder according to the input wafer processing conditions is selected and set as the control temperature. On the other hand, the detected and monitored temperature of the inner cylinder is input to the control device. The detection / monitor temperature is
The control temperature is compared with the control temperature, and the temperature of the inner cylinder is controlled to the control temperature based on the result.

Further, for example, when the wafer has a multilayer film structure, if the temperature of the inner cylinder is controlled to a temperature corresponding to the film quality of each film, the type of processing gas, the discharge conditions, etc., the plasma processing characteristics can be improved. The wood can be finely stabilized over time.

If the processing performance of the wafer changes during one rod processing after the break-in (seasoning) processing, the temperature of the inner cylinder is changed along a desired temperature pattern in order to stabilize the processing performance. And good.

The temperature control of the inner cylinder of the chamber has been described so far, but the present invention can be similarly applied to the temperature control of a sample stage cover installed around the sample stage.

FIG. 14 is a sectional view of an embodiment of a sample stage to which the present invention is applied. A temperature control liquid circulates through the sample stage 10, an insulator is applied to the surface of the sample stage maintained at a desired temperature, and a DC power supply for electrostatic chucking is performed in a state where discharge occurs in the processing chamber. With 54, the sample 11 is attracted to the sample stage 10 by electrostatic force. Sample 11 and sample stage 10
Between them, a heat transfer gas (for example, He
Gas, etc.). A sample stage cover (an insulator such as alumina or a resistor such as SiC) is provided around the upper portion of the sample stage 10 to prevent the release of metals that may cause a problem when the metal sample stage 10 is exposed to plasma. ing. By the way, the temperature rises because the ions and radicals in the plasma collide with the sample stage cover surface 50. When the temperature of the sample stage cover 50 around the sample fluctuates, the scientific and physical reactions around the sample change, and there is a disadvantage that the processing characteristics of the sample change. Therefore, a gas sealing means 51 (for example, an O-ring) is provided between the sample stage 10 and the sample stage cover 51, and a heat transfer gas is introduced therebetween. The pressure control and the like are the same as in the case of the inner cylinder. In FIG. 14, the heat transfer gas for cooling the sample and the heat transfer gas for cooling the sample stage cover are used in combination, but it goes without saying that they may be supplied separately.

[0077]

According to the present invention, it is possible to control the temperature of the inner cylinder which is in direct contact with the plasma, and it is possible to control the change over time in the characteristics of the plasma processing. In addition, the non-magnetic and conductive metal material forming the processing chamber is prevented from being scraped or deteriorated by plasma to become a source of heavy metal contamination, and the wall of the processing chamber is formed of a reactive gas used in the processing chamber. Accordingly, it is possible to provide a plasma processing apparatus and method having stable plasma processing characteristics in a state where there is no possibility of chemical corrosion.

[Brief description of the drawings]

FIG. 1 is a front view of a longitudinal section of a part of a microwave plasma processing apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a main part showing a temperature control unit of the inner cylinder of FIG. 1;

FIG. 3 is a diagram showing functions of a temperature controller of FIG. 1;

FIG. 4 is a diagram showing a relationship between a pressure P in a gap and a temperature difference in temperature control.

FIG. 5 is a longitudinal sectional view of a microwave plasma processing apparatus according to a second embodiment of the present invention.

FIG. 6 is a cross-sectional view of a main part of the plasma processing apparatus of FIG. 5;

FIG. 7 is a longitudinal sectional view of a parallel plate plasma etching apparatus according to a third embodiment of the present invention.

FIG. 8 is a longitudinal sectional view of an example in which the present invention is applied to a magnetron RIE device.

FIG. 9 is a longitudinal sectional view of an example in which the present invention is applied to an inductively-coupled discharge system and a non-magnetic field type device among external energy supply discharge systems.

FIG. 10 is a longitudinal sectional view of an example in which the present invention is applied to an apparatus of an inductively coupled discharge type and a magnetic field type among external energy supply discharge types.

FIG. 11 is a longitudinal sectional view of an example in which the present invention is applied to a device having an inductively coupled discharge method and a magnetic field type among external energy supply discharge methods.

FIG. 12 is a longitudinal sectional view of a resist-coated oxide film sample as an example of a sample processed by the apparatus of the present invention.

FIG. 13 is a diagram showing a relationship between the number of processed wafers and the temperature of the inner cylinder.

FIG. 14 is a sectional view of an embodiment of a sample stage cover of the processing apparatus to which the present invention is applied.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Magnetron, 2 ... Waveguide, 3 ... Quartz plate, 4 ... Processing chamber, 5 ... Outer cylinder, 6 ... Inner cylinder, 7 ... First solenoid coil, 8 ... Second solenoid coil, 9 ... Vacuum chamber , 10 ...
Sample stage, 11 wafer, 13 processing gas supply system, 14
Gap, 15: gas supply system, 17: pressure control valve, 18: pressure detector, 20: control circuit, 21: heater, 22: temperature controller 22

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Koichi Okamura 794, Higashi-Toyoi, Kazamatsu, Kudamatsu-shi, Yamaguchi Prefecture Inside the Kasado Plant of Hitachi, Ltd. (72) Inventor Tetsu Ito 794, Higashi-Toyoi, Kazamatsu City, Yamaguchi Prefecture F-term (Reference) 4G075 AA24 AA30 AA63 BC06 CA12 CA26 CA42 CA47 DA01 EB41 FB02 FB03 FB04 FB06 FC11 FC15 FC20 4K030 DA04 FA01 FA03 FA04 JA10 KA08 KA22 KA30 KA41 KA46 5F004 AA16 BA04 BA13 BA14 BA20 BB07 BB11 BB26 BB29 BB32 BD04 BD05 CA04

Claims (8)

[Claims] 1. A plasma processing apparatus comprising: a plasma generating apparatus; a processing chamber capable of reducing pressure; a processing gas supply apparatus for supplying a gas to the processing chamber; a sample stage for holding a sample; The chamber includes an outer cylinder that withstands pressure reduction, an inner cylinder disposed inside the outer cylinder via a gap, and temperature control means for maintaining the temperature of the inner cylinder in a predetermined range. The control means is provided on the outer cylinder and adjusts the temperature of the inner cylinder by including a first temperature control unit that adjusts the temperature of the outer cylinder to room temperature to 350 ° C. and includes a heat transfer gas introduced into the gap. A plasma processing apparatus, comprising: a second temperature control unit. 2. The plasma processing apparatus according to claim 1, wherein the temperature control means for maintaining the temperature of the inner cylinder within a predetermined range maintains the temperature of the inner cylinder within ± 20 ° C. Plasma processing equipment. 3. The plasma processing apparatus according to claim 1, wherein the inner cylinder is made of a non-magnetic material. 4. The first temperature control section includes a heater attached to the outer cylinder, and is configured to adjust the temperature of the outer cylinder to a normal temperature to 350 ° C. by the heater. The plasma processing apparatus according to claim 1, wherein: 5. The first temperature control section has a circulating liquid flow path provided in the outer cylinder, and circulates a temperature-controlled fluid through the flow path to reduce the temperature of the outer cylinder. 0 ° C-1
The plasma processing apparatus according to any one of claims 1 to 3, wherein the temperature is adjusted to 50 ° C. 6. A heat transfer gas supply system for introducing a heat transfer gas in a gap between the outer cylinder and the inner cylinder, wherein the second temperature control unit is provided. 4. The plasma processing apparatus according to claim 3, 7. The plasma processing apparatus according to claim 1, wherein said inner cylinder is detachably mounted on said outer cylinder. 8. The plasma processing apparatus according to claim 1, wherein said inner cylinder is made of ceramics, carbon, silicon, quartz, or metal.